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Types of IC Packages

There are two main types of IC packages: through hole and surface mount technology (SMT). Through hole packages use leads mounted into holes on the PCB, while SMT packages are mounted directly onto the PCB. Common SMT package leads include gull-wing, J-lead, and solder balls used in ball grid arrays (BGAs). Popular IC package styles include dual in-line packages (DIPs), small outline packages (SOPs), quad flat packages (QFPs), ball grid arrays (BGAs), and pin grid arrays (PGAs). Each package type has advantages and disadvantages related to pin count, surface area usage, ease of manufacturing and repair.

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Sudha K
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1K views11 pages

Types of IC Packages

There are two main types of IC packages: through hole and surface mount technology (SMT). Through hole packages use leads mounted into holes on the PCB, while SMT packages are mounted directly onto the PCB. Common SMT package leads include gull-wing, J-lead, and solder balls used in ball grid arrays (BGAs). Popular IC package styles include dual in-line packages (DIPs), small outline packages (SOPs), quad flat packages (QFPs), ball grid arrays (BGAs), and pin grid arrays (PGAs). Each package type has advantages and disadvantages related to pin count, surface area usage, ease of manufacturing and repair.

Uploaded by

Sudha K
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© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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IC PACKAGES

-by Sudha

[DATE]
[COMPANY NAME]
[Company address]
Types of IC Packages

Types of IC packages are broadly classified based on Package to Board connections as


Through hole and Surface mount Technology.
Through Hole:
-classical approach
-uses leads mounded into holes on PCB.
-provides strong mechanical bonds
Surface Mount Technology (SMT):
-Components are mounted directly on PCB
Advantages:
-in Surface Mount better use of board area
-components can be placed on both side of circuit board
Disadvantages:
-Manufacturing process is much sophisticated
-can’t directly used with breadboards
-solder connections may damage easily when temperature increases

Different Types of SMT leads:


1. Gull-wing SMT package lead
-Drawback in soldering issues
2. J-Lead SMT package lead
-Less Board spacing than Gull-wing

3. Solder Balls
-used in Ball Grid Array (BGA)
-more robust
-convenient for IC with large number of pins
Various IC packages are described below:
1. DIP-Dual In-Line Packages:

-with two rows of leads on two sides of the package


-Each of the pins on a DIP IC are spaced by 100 mils (3.9mm)
-Pin counts can be 4 to 64
-can be Plastic or ceramic
-through - hole mounted
-usually referred to as a DIPn, where n is the total number of pins
Advantages:
-Lowest implementation cost
-highly reliable
Disadvantages:
-less pin count (only 64)
-not surface mountable
2. ZIP – Zig-Zag In-Line Package:
-not commonly used
3. SOP – Small Outline Package:
-Surface mounted
-occupies less area than DIP

-SOP includes a large family of packages:


1. SOIC – Small Outline Integrated Circuit
-2 different standards are JEDEC and EIAJ
-EIAJ is approximately 5.3 mm (0.21 in) wide
-JEDEC is approximately 3.8 mm (0.15 in) wide
2. SSOP – Shrink Small Outline Package
-have Gull-wing leads
-Applications in pagers, portable audio/video, disc drives, radio, RF devices and
telecom
3. QSOP – Quarter‐size Small Outline Package
4. TSOP-Thin Small Outline package
-Surface mounted
-used for RAM and Flash IC due to high pin count and small volume
5. TSSOP – Thin Shrink Small Outline Package
- suited for memory modules, Comparators and gate drivers
a) Type I TSSOP has legs protruding from the width portion of the package
b) Type II TSSOP has the legs protruding from the length portion of the package
6. MSOP – Mini Small Outline Package
4. SOJ – Small Outline J-lead:
- term Small Outline refers to the width of the component body
-‘J’ leads on both sides
-surface mounted

5. SIP-SINGLE IN-LINE PACKAGES:

-used for packaging RAM chips and multiple resistor with a common pin
-24 I/O counts
6. QUIP-Quad Inline Package:

-Packages with staggered leads


-reduces pitch wiring
7. FP-Flat Package :
- is a rectangular or square package
-with leads parallel to base plane attached on two opposing sides
-used in early military and Space Applications
-pitch is 50 mils
Advantages:
-low Material cost
-solder joints visible
Disadvantages:
-pin count limitations
-handling during soldering and rework is difficult
8. QFP-Quad Flat Package :
-has gull-wing leads
- 2.0 to 3.8 mm thick
-they have Expose pad, an extra pad above or below the QFP acts as a heat sink or
ground connection
-common in modern electronics

a) TQFP-Thin Quad Flat Package :


-typical thickness is 1.0mm and 2.0mm lead footprint
-package material is plastic
-reduces board density

b) BQFPH - Bumpered Quad Flat Pack with Heat spreader:


-uses pin protectors at corners
- has heat spreaders to enable larger levels of power to be dissipated
c) CQFP - Ceramic Quad Flat Pack:
-high quality version
d) HQFP - Heat sinked Quad Flat Pack:
- Thin pins in the center of opposing sides are replaced with a thicker pin which is
soldered to a large pad on the PCB with a large area of copper connected to it. This will remove
a significant amount of heat.
e) LQFP - Low profile Quad Flat Pack:
- Thinner with a thickness or height of 1.4mm
- 2.0mm lead footprint
- Lead counts ranges from 32-256
- Body sizes range from 5 x 5mm to 28 x 28mm

f) PQFP - Plastic Quad Flat Pack:


- Thickness from 2mm up-to 3.8mm
9. PLCC – Plastic Leaded Chip Carrier:
-Also called QFJ-Quad Flat J lead
- A reduced cost evolution of the ceramic leadless chip carrier (CLCC)
-used in ROMs and controllers
10. LCC- Leadless Chip Carrier:
-no leads
-has round pins at edges of ceramic or plastic packages

11. PGA-Pin Grid Arrays:


- is a rectangular or square package
-with terminals attached perpendicular to a major surface in a grid matrix
-available with heatsinks to remove heat generated in package
-400+ pins connections are possible
12. BGA – Ball Grid Arrays:
-high Volume and high pin count
-200-500 I/O s is common
-Good heat conduction into PCB board
-Difficult to Solder and replace

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