Mech Sep 03

IOP Conference Series: Earth and Environmental Science
PAPER • OPEN ACCESS
The effect of e-waste particle on mechanical behavior of particulate

reinforced epoxy matrix composite
To cite this article: R Venkatakrishnan et al 2020 IOP Conf. Ser.: Earth Environ. Sci. 573 012013
View the article online for updates and enhancements.
This content was downloaded from IP address 157.50.77.25 on 14/10/2020 at 12:19

SESBT 2020 IOP Publishing
IOP Conf. Series: Earth and Environmental Science 573 (2020) 012013 doi:10.1088/1755-1315/573/1/012013
The effect of e-waste particle on mechanical behavior of

particulate reinforced epoxy matrix composite
R Venkatakrishnan1,2, R Pabhakaran1,2, N NarmadaDevi1,2

1
Assistant Professor, Department of Mechanical Engineering,
2
IFET College of Engineering, Villupuram, Tamil Nadu, India.
[email protected]
Abstract. The effect of E-Waste particle on mechanical behavior of particulate reinforced

epoxy resin composite has been studied. E-wastes are recycled by crushing and make it as filler
particles. The E waste filler materials are added to thermosetting polymers of epoxy resins. The
fabricated composites were composed of reinforcement as glass fiber (woven and chopped
type), matrix materials as epoxy resin and E waste as filler materials. The samples are prepared
along the basics of filler material of electronic waste added with liquid polymer as percentage
ratios of 5%, 10%, 15% and 20 % of resin. The composite samples are fabricated by
conventional method of hand layup process. The dispersion of electronic waste particles
content efficiency was observed through the diagnosis of their microstructure through SEM
images. Hence laminate composite with 15% filler content can be optimizes when compared to
other three laminated composite samples.
Keywords: E-waste filler, Epoxy Resin, laminated composite, Mechanical Test, SEM.
1. INTRODUCTION
Electronic waste is most staggering waste surges within natural impact on the environments. The
subsistence of treasured metals inside the e-waste stream movement presents a major economic asset
for reprocessing industries but due to the presence of precarious chemicals substances, an authentic
recycling procedure is needed previous to the scrapping of the e-waste. Typically the engenderment of
E-waste is more which cause pollution because of discarding and burning. Electronic wastes are
famous, unofficial name of electronic gadgets components quit the end of their effective life.
Electronic wastes are considered risky, as certain piece of electronic components which contains
hazardous and non biodegradables. Only 35% of Electronic waste components only reprocessing and
remaining parts are left off. The reprocessing of electronic wastes is classifying the material along
reuse and non-reusable materials. The reuse material is PCB board, outer covering of plastics, etc.
these material are crushed into fine powders and make it as filler materials with chemical treatment of
particles. In this composite E waste particles are produced from filler content in PCBs. Supplied that a
suitable treatment and restoration process is applied, waste PCBs may serve as a secondary metallic
resources.
Polymer composites are the substances consisting of a matrix of polymer (resin) coalesced with a step
of dispersed fibrous reinforcement. It’s filled with high strength fibers such as, E-glass, natural fiber,
carbon and has developed preferential applications in building, aerospace, sport, leisure and
automotive sectors. Glass fiber is a material that is commonly used for plastics reinforcement due to
better strength properties and low cost. Inorganic fiber composites which combine E glass fibers with a
polymer binder. The inorganic fiber materials can be glass, aramid, nylon, carbon, boron, polyester,
polyethylene and polypropylene. The advantages of inorganic fiber composite include light weight,
inexpensive and resistance to heat. The use of E-waste particle with the inorganic fiber composite
reduces weight. Composite system consisting of both glass fiber and e-waste particle as filler material
and thermoset based epoxy resin has been relatively used.
Content from this work may be used under the terms of the Creative Commons Attribution 3.0 licence. Any further distribution
of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.
Published under licence by IOP Publishing Ltd 1
2. MATERIALS
2.1 Source of Materials
E-glass fibers both woven and chopped are used in this work. Both E-glass fibers and epoxy resin were
purchased from Kamatchi Polymer, Pondicherry. For epoxy resin, catalyst (methyl ethyl ketone
peroxide) was used. E-waste was purchased from electronic waste shop, Pondicherry.
2.2 Scanning electron microscope images

The uniform dispersion of electronic waste crushed particles in epoxy resin can be evaluated by sem
images. And also surface binding of glass fiber with e-waste particle also viewed.
2.3 Prefabrication procedures

Mould was fabricated with a mallet sheet of 50×50 cm size and rubber block piece was pasted on the
dimensions of 300 mm × 300 mm on four sides. The fabrication of polymer composites was processed
by wet layup processes. Before lay-up process the mould has been applied with the releasing wax
because after curing of composites, its easily removed from the mould. The top and bottom plates are
covered for smooth surface finish of composites. First Epoxy and catalyst were mixed with ratio of
10:1. E-waste particle are added for each 100g of resin with proper weight ratio carefully.
2.4 Fabrication of composites

Mould were prepared in its dimensions of 50×50 cm was first manufactured for composite fabrication.
The composite samples are prepared by different compositions by varying the ratio of e-waste particle
such as (0, 5, 10 and 15g) in these composite materials. First Epoxy resin and MEKP Catalyst was
mixed in the ratio of 10:1. Thus the e-waste particles are added as per the ratio for 100g of resin
mixture and apply on the mould. A mould release wax spray is used to release the composite materials
from the mould after polymer curing processes. Then place a films sheet over the resin and glass fiber
(woven). Then place the chopped glass fiber mat on the applied resin. Laminas of glass fiber are
placed one by one alternatively and resins with e-waste particle are pouring in between the layers of
lamina. To form laminated composites with six laminas of woven and five laminas of chopped mat.
The air bubbles are removed by sliding roller. After curing processes, the composite are separated
from the mould surface. Samples are placed in dry place for improving solid gel strength of the
samples. Again repeat the same procedure for all samples preparation.
2.5 Mechanical Test

Tensile, impact and hardness test results which can be obtained by Computer aided UTM machines.
All specimens are prepared along dimensions of required ASTM standards.
3. RESULTS AND DISCUSSION

3.1 Dispersion of Electronic waste particles and epoxy resin
The uniform dispersion of electronic waste particles in polymer of epoxy materials were obtained by
SEM images. And also bonding between glass fiber and polymer epoxy materials. The bonding of
polymers in glass fiber is important to improve properties of the composites. Mechanical load is
applied to composite materials; its stresses are uniformly distributed by higher bonding strength of
polymers. When percentage of e waste filler materials increases bonding strength of polymers are
decreases due to poor wetting of fibers and uncommon distribution of filler materials. The SEM image
shows breaking surface of matrix and lamina of glass fibers in polymer composite shown in figure 1.
The fibers are breakdown due to poor wetting of epoxy and bonding between them. If increasing the
electronic waste weight percentage in polymer matrix, it leads to improper bonding of fibers. The
content of filler materials above 15% which decrease the strength of the composites shown in figure 2.
2
Figure 1. Picture shows bonding between Figure 2. Picture shows dispersion of E-waste in
fiber and polymer. 10% filler material composites.
3.2 Tensile Test

Figure 3 shows the tensile strength regarding different percentage of filler content of electronic
waste in glass fiber laminated composite. The graph contains E waste particle as x-axis and tensile
strength as y-axis. Filler material improves tensile strength when compared to zero percent of filler
content composite materials. The tensile withstand loads are increase upto 15% and slightly values
drops in 20% filler content composite materials.
Figure 3. Variation of tensile strength for different e-waste particle %
3.3 Flexural Test

Figure 4 shows the flexural strength regarding different percentage of filler content of
electronic waste in glass fiber laminated composite. The samples are prepared along ASTM standard.
The graph contains E waste particle as x-axis in terms percentage and flexural strength as y-axis in
terms of kN. Filler material improves flexural strength when compared to zero percent of filler content
composite materials. The flexural withstand loads are increase upto 15% and slightly values drops in
20% filler content composite materials.
3
Figure 4. Variation of tensile strength for different e-waste particle %
3.4 Impact Test
Figure 5 shows the impact strength regarding different percentage of filler content of
electronic waste in glass fiber laminated composite. The samples are prepared along ASTM standard.
The impact strength results are obtained by izod test. The graph contains E waste particle as x-axis and
impact strength as y-axis. Filler material improves impact strength when compared to zero percent of
filler content composite materials. The samples withstand loads are increase upto 15% and slightly
values drops in 20% filler content composite materials.
Figure 5. Variation of Impact Strength for different e-waste particle percentage.
3.5 Hardness Test
Figure 6 shows the hardness strength to different percentage of filler content of electronic
waste in glass fiber laminated composite. The samples are prepared along ASTM standard. The
hardness strength results are obtained by Brinell hardness test. The graph contains E waste particle as
x-axis and impact strength as y-axis. Filler material improves impact strength when compared to zero
percent of filler content composite materials. The hardness of samples which increase upto 15% and
slightly values drops in 20% filler content composite materials.
4
Figure 6. Variation of Hardness Strength for different e-waste particle percentage.
4. CONCLUSION
The electronic waste filler material reinforced epoxy matrix composites have been investigated
in this experimental work. The strength of e-waste particulate reinforced composites is much higher
when compared to other E waste filler content percentage of laminated composite. Fine powder
particle size of e-waste which leads to increase the uniform dispersion phase in epoxy resins materials.
The results of various testing show that greater strengths were obtained at 15% filler content of e-
waste particle content when compared others samples. The drawbacks of 20% filler materials of
composite have lower strength because of poor bonding due to improper wetting of polymers to glass
fibers. Hence the conclusion of E waste filler material of 15% content has higher strength compared to
other percentage of samples of E waste content.
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IOP Conference Series: Earth and Environmental Science

PAPER • OPEN ACCESS

The effect of e-waste particle on mechanical behavior of particulate

View the article online for updates and enhancements.

This content was downloaded from IP address 157.50.77.25 on 14/10/2020 at 12:19

The effect of e-waste particle on mechanical behavior of

R Venkatakrishnan1,2, R Pabhakaran1,2, N NarmadaDevi1,2

Abstract. The effect of E-Waste particle on mechanical behavior of particulate reinforced

2.2 Scanning electron microscope images

2.3 Prefabrication procedures

2.4 Fabrication of composites

2.5 Mechanical Test

3. RESULTS AND DISCUSSION

3.2 Tensile Test

Figure 3. Variation of tensile strength for different e-waste particle %

3.3 Flexural Test

Figure 4. Variation of tensile strength for different e-waste particle %

3.4 Impact Test

Figure 5. Variation of Impact Strength for different e-waste particle percentage.

3.5 Hardness Test

Figure 6. Variation of Hardness Strength for different e-waste particle percentage.

[1] M. Ramesh, K. Palanikumar, K. Hemachandra Reddy, Mechanical property evaluation of

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