TLC548C, TLC548I, TLC549C, TLC549I

8-BIT ANALOG-TO-DIGITAL CONVERTERS

WITH SERIAL CONTROL
SLAS067C – NOVEMBER 1983 – REVISED SEPTEMBER 1996

D Microprocessor Peripheral or Standalone D OR P PACKAGE

Operation (TOP VIEW)

D 8-Bit Resolution A/D Converter REF + 1 8 VCC

D Differential Reference Input Voltages ANALOG IN 2 7 I/O CLOCK
D Conversion Time . . . 17 µs Max REF – 3 6 DATA OUT
D Total Access and Conversion Cycles Per GND 4 5 CS
Second
– TLC548 . . . up to 45 500
– TLC549 . . . up to 40 000
D On-Chip Software-Controllable
Sample-and-Hold Function
D Total Unadjusted Error . . . ± 0.5 LSB Max
D 4-MHz Typical Internal System Clock
D Wide Supply Range . . . 3 V to 6 V
D Low Power Consumption . . . 15 mW Max
D Ideal for Cost-Effective, High-Performance
Applications including Battery-Operated
Portable Instrumentation
D Pinout and Control Signals Compatible
With the TLC540 and TLC545 8-Bit A/D
Converters and with the TLC1540 10-Bit
A/D Converter
D CMOS Technology

description
The TLC548 and TLC549 are CMOS analog-to-digital converter (ADC) integrated circuits built around an 8-bit
switched-capacitor successive-approximation ADC. These devices are designed for serial interface with a
microprocessor or peripheral through a 3-state data output and an analog input. The TLC548 and TLC549 use
only the input/output clock (I/O CLOCK) input along with the chip select (CS) input for data control. The
maximum I/O CLOCK input frequency of the TLC548 is 2.048 MHz, and the I/O CLOCK input frequency of the
TLC549 is specified up to 1.1 MHz.

AVAILABLE OPTIONS
PACKAGE
TA SMALL OUTLINE PLASTIC DIP
(D) (P)
TLC548CD TLC548CP
0°C to 70°C
TLC549CD TLC549CP
TLC548ID TLC548IP
– 40°C to 85°C
TLC549ID TLC549IP

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date. Copyright  1996, Texas Instruments Incorporated
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1

TLC548C, TLC548I, TLC549C, TLC549I
8-BIT ANALOG-TO-DIGITAL CONVERTERS
WITH SERIAL CONTROL
SLAS067C – NOVEMBER 1983 – REVISED SEPTEMBER 1996

description (continued)
Operation of the TLC548 and the TLC549 is very similar to that of the more complex TLC540 and TLC541
devices; however, the TLC548 and TLC549 provide an on-chip system clock that operates typically at 4 MHz
and requires no external components. The on-chip system clock allows internal device operation to proceed
independently of serial input/output data timing and permits manipulation of the TLC548 and TLC549 as desired
for a wide range of software and hardware requirements. The I/O CLOCK together with the internal system clock
allow high-speed data transfer and conversion rates of 45 500 conversions per second for the TLC548, and
40 000 conversions per second for the TLC549.
Additional TLC548 and TLC549 features include versatile control logic, an on-chip sample-and-hold circuit that
can operate automatically or under microprocessor control, and a high-speed converter with differential
high-impedance reference voltage inputs that ease ratiometric conversion, scaling, and circuit isolation from
logic and supply noises. Design of the totally switched-capacitor successive-approximation converter circuit
allows conversion with a maximum total error of ± 0.5 least significant bit (LSB) in less than 17 µs.
The TLC548C and TLC549C are characterized for operation from 0°C to 70°C. The TLC548I and TLC549I are
characterized for operation from – 40°C to 85°C.

functional block diagram

1
REF +
3 8-Bit
REF –
Analog-to
Digital 8
Sample
2 Converter 8
ANALOG IN and Output
Hold (Switched- 8-to-1 Data
Data 4 6 DATA
Capacitors) Selector
Regiser
and OUT
Driver

Internal
System
Clock
Control
5
CS Logic and
7 Output Counter
I/O CLOCK

typical equivalent inputs

INPUT CIRCUIT IMPEDANCE DURING SAMPLING MODE INPUT CIRCUIT IMPEDANCE DURING HOLD MODE

1 kΩ TYP
ANALOG IN ANALOG IN
Ci = 60 pF TYP
(equivalent input 5 MΩ TYP
capacitance)

2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

 TLC548C, TLC548I, TLC549C, TLC549I
8-BIT ANALOG-TO-DIGITAL CONVERTERS
WITH SERIAL CONTROL
SLAS067C – NOVEMBER 1983 – REVISED SEPTEMBER 1996

operating sequence

1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8
I/O Don’t Care
CLOCK Access
Access tconv Sample
Cycle B Sample Cycle C Cycle C
tsu(CS) Cycle B (see Note A)
tsu(CS)

CS

twH(CS)
Hi-Z State
Hi-Z State
DATA A7 A6 A5 A4 A3 A2 A1 A0 B7 B6 B5 B4 B3 B2 B1 B0
OUT
A7 B7
Previous Conversion Data A Conversion Data B
MSB LSB MSB MSB LSB MSB
(see Note B) ten
ten

NOTES: A. The conversion cycle, which requires 36 internal system clock periods (17 µs maximum), is initiated with the eighth I/O clock pulse
trailing edge after CS goes low for the channel whose address exists in memory at the time.
B. The most significant bit (A7) is automatically placed on the DATA OUT bus after CS is brought low. The remaining seven bits (A6–A0)
are clocked out on the first seven I/O clock falling edges. B7–B0 follows in the same manner.

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.5 V
Input voltage range at any input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.3 V to VCC + 0.3 V
Output voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.3 V to VCC + 0.3 V
Peak input current range (any input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 10 mA
Peak total input current range (all inputs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 30 mA
Operating free-air temperature range, TA (see Note 2): TLC548C, TLC549C . . . . . . . . . . . . . 0°C to 70°C
TLC548I, TLC549I . . . . . . . . . . . . – 40°C to 85°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
NOTES: 1. All voltage values are with respect to the network ground terminal with the REF– and GND terminals connected together, unless
otherwise noted.
2. The D package is not recommended below – 40°C.

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3

TLC548C, TLC548I, TLC549C, TLC549I
8-BIT ANALOG-TO-DIGITAL CONVERTERS
WITH SERIAL CONTROL
SLAS067C – NOVEMBER 1983 – REVISED SEPTEMBER 1996

recommended operating conditions

TLC548 TLC549
UNIT
MIN NOM MAX MIN NOM MAX
Supply voltage, VCC 3 5 6 3 5 6 V
Positive reference voltage, Vref+ (see Note 3) 2.5 VCC VCC+0.1 2.5 VCC VCC+0.1 V
Negative reference voltage, Vref – (see Note 3) – 0.1 0 2.5 –0.1 0 2.5 V
Differential reference voltage, Vref+, Vref – (see Note 3) 1 VCC VCC+0.2 1 VCC VCC+0.2 V
Analog input voltage (see Note 3) 0 VCC 0 VCC V
High-level control input voltage, VIH (for VCC = 4.75 V to 5.5 V) 2 2 V
Low-level control input voltage, VIL (for VCC = 4.75 V to 5.5 V) 0.8 0.8 V
Input/output clock frequency, fclock(I/O) (for VCC = 4.75 V to 5.5 V) 0 2.048 0 1.1 MHz
Input/output clock high, twH(I/O) (for VCC = 4.75 V to 5.5 V) 200 404 ns
Input/output clock low, twL(I/O) (for VCC = 4.75 V to 5.5 V) 200 404 ns
Input/output clock transition time, tt(I/O)
100 100 ns
(for VCC = 4.75 V to 5.5 V) (see Note 4 and Operating Sequence)
Duration of CS input high state during conversion, twH(CS)
17 17 µs
(for VCC = 4.75 V to 5.5 V) (see Operating Sequence)
Setup time, CS low before first I/O CLOCK, tsu(CS)
1.4 1.4 µs
(for VCC = 4.75 V to 5.5 V) (see Note 5)
TLC548C, TLC549C 0 70 0 70
°C
TLC548I, TLC549I – 40 85 – 40 85
NOTES: 3. Analog input voltages greater than that applied to REF+ convert to all ones (11111111), while input voltages less than that applied
to REF– convert to all zeros (00000000). For proper operation, the positive reference voltage Vref+, must be at least 1 V greater than
the negative reference voltage, Vref–. In addition, unadjusted errors may increase as the differential reference voltage, Vref+ – Vref– ,
falls below 4.75 V.
4. This is the time required for the I/O CLOCK input signal to fall from VIH min to VIL max or to rise from VIL max to VIH min. In the vicinity
of normal room temperature, the devices function with input clock transition time as slow as 2 µs for remote data acquisition
applications in which the sensor and the ADC are placed several feet away from the controlling microprocessor.
5. To minimize errors caused by noise at the CS input, the internal circuitry waits for two rising edges and one falling edge of internal
system clock after CS↓ before responding to control input signals. This CS setup time is given by the ten and tsu(CS) specifications.

4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

 TLC548C, TLC548I, TLC549C, TLC549I
8-BIT ANALOG-TO-DIGITAL CONVERTERS
WITH SERIAL CONTROL
SLAS067C – NOVEMBER 1983 – REVISED SEPTEMBER 1996

electrical characteristics over recommended operating free-air temperature range,

VCC = Vref+ = 4.75 V to 5.5 V, fclock(I/O) = 2.048 MHz for TLC548 or 1.1 MHz for TLC549
(unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP† MAX UNIT
VOH High-level output voltage VCC = 4.75 V, IOH = – 360 µA 2.4 V
VOL Low-level output voltage VCC = 4.75 V, IOL = 3.2 mA 0.4 V
VO = VCC, CS at VCC 10
IOZ High impedance off
High-impedance off-state
state output current µA
VO = 0, CS at VCC – 10
IIH High-level input current, control inputs VI = VCC 0.005 2.5 µA
IIL Low-level input current, control inputs VI = 0 – 0.005 – 2.5 µA
Analogg channel on-state input current during
g sample Analog input at VCC 0.4 1
II(
I(on)) µA
cycle Analog input at 0 V – 0.4 –1
ICC Operating supply current CS at 0 V 1.8 2.5 mA
ICC + Iref Supply and reference current Vref+ = VCC 1.9 3 mA
Analog inputs 7 55
Ci Input capacitance pF
Control inputs 5 15

operating characteristics over recommended operating free-air temperature range,

VCC = Vref+ = 4.75 V to 5.5 V, fclock(I/O) = 2.048 MHz for TLC548 or 1.1 MHz for TLC549
(unless otherwise noted)
TLC548 TLC549
PARAMETER TEST CONDITIONS UNIT
MIN TYP† MAX MIN TYP† MAX
EL Linearity error See Note 6 ±0.5 ±0.5 LSB
EZS Zero-scale error See Note 7 ±0.5 ±0.5 LSB
EFS Full-scale error See Note 7 ±0.5 ±0.5 LSB
Total unadjusted error See Note 8 ±0.5 ±0.5 LSB
tconv Conversion time See Operating Sequence 8 17 12 17 µs
Total access and conversion time See Operating Sequence 12 22 19 25 µs
I/O
ta Channel acquisition time (sample cycle) See Operating Sequence 4 4 clock
cycles
Time output data remains
tv 10 10 ns
valid after I/O CLOCK↓
td Delay time to data output valid I/O CLOCK↓ 200 400 ns
ten Output enable time 1.4 1.4 µs
tdis Output disable time 150 150 ns
tr(bus) Data bus rise time See Figure 1 300 300 ns
tf(bus) Data bus fall time 300 300 ns
† All typicals are at VCC = 5 V, TA = 25°C.
NOTES: 6. Linearity error is the deviation from the best straight line through the A/D transfer characteristics.
7. Zero-scale error is the difference between 00000000 and the converted output for zero input voltage; full-scale error is the difference
between 11111111 and the converted output for full-scale input voltage.
8. Total unadjusted error is the sum of linearity, zero-scale, and full-scale errors.

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5

TLC548C, TLC548I, TLC549C, TLC549I
8-BIT ANALOG-TO-DIGITAL CONVERTERS
WITH SERIAL CONTROL
SLAS067C – NOVEMBER 1983 – REVISED SEPTEMBER 1996

PARAMETER MEASUREMENT INFORMATION

1.4 V VCC

3 kΩ 3 kΩ
Output Test
Under Test Point Output Test
Output Test Under Test Point
Under Test Point 3 kΩ
CL CL
CL (see Note A) (see Note A)
(see Note A)
See Note B
See Note B
LOAD CIRCUIT FOR LOAD CIRCUIT FOR
td, tr, AND tf tPZH AND tPHZ LOAD CIRCUIT FOR
tPZL AND tPLZ

VCC
CS 50% 50%
0V
tPZL
tPLZ
VCC
Output Waveform 1
50%
(see Note C) 10%
0V
tPZH
tPHZ

VOH
Output Waveform 2 90%
50%
(see Note C)
See Note B 0V

VOLTAGE WAVEFORMS FOR ENABLE AND DISABLE TIMES

I/O CLOCK
0.8 V 2.4 V
Output
td 0.4 V

tr(bus) tf(bus)
2.4 V
DATA OUT
0.8 V
VOLTAGE WAVEFORMS FOR RISE AND FALL TIMES

VOLTAGE WAVEFORMS FOR DELAY TIME

NOTES: A. CL = 50 pF for TLC548 and 100 pF for TLC549; CL includes jig capacitance.
B. ten = tPZH or tPZL, tdis = tPHZ or tPLZ.
C. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.

Figure 1. Load Circuits and Voltage Waveforms

6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

 TLC548C, TLC548I, TLC549C, TLC549I
8-BIT ANALOG-TO-DIGITAL CONVERTERS
WITH SERIAL CONTROL
SLAS067C – NOVEMBER 1983 – REVISED SEPTEMBER 1996

APPLICATIONS INFORMATION

simplified analog input analysis

Using the equivalent circuit in Figure 2, the time required to charge the analog input capacitance from 0 to VS
within 1/2 LSB can be derived as follows:
The capacitance charging voltage is given by
– tc /RtCi
(
VC = VS 1– e ) (1)

where
Rt = Rs + ri
The final voltage to 1/2 LSB is given by
VC (1/2 LSB) = VS – (VS /512) (2)

Equating equation 1 to equation 2 and solving for time tc gives

– tc /RtCi
(
VS – (VS/512) = VS 1– e ) (3)

and
tc (1/2 LSB) = Rt × Ci × ln(512) (4)
Therefore, with the values given the time for the analog input signal to settle is
tc (1/2 LSB) = (Rs + 1 kΩ) × 60 pF × ln(512) (5)
This time must be less than the converter sample time shown in the timing diagrams.

Driving Source† TLC548/9

Rs VI ri
VS VC
1 kΩ MAX
Ci
55 pF MAX

VI = Input Voltage at ANALOG IN

VS = External Driving Source Voltage
Rs = Source Resistance
ri = Input Resistance
Ci = Input Capacitance

† Driving source requirements:

• Noise and distortion for the source must be equivalent to the
resolution of the converter.
• Rs must be real at the input frequency.

Figure 2. Equivalent Input Circuit Including the Driving Source

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7

TLC548C, TLC548I, TLC549C, TLC549I
8-BIT ANALOG-TO-DIGITAL CONVERTERS
WITH SERIAL CONTROL
SLAS067C – NOVEMBER 1983 – REVISED SEPTEMBER 1996

PRINCIPLES OF OPERATION

The TLC548 and TLC549 are each complete data acquisition systems on a single chip. Each contains an internal
system clock, sample-and-hold function, 8-bit A/D converter, data register, and control logic circuitry. For flexibility
and access speed, there are two control inputs: I/O CLOCK and chip select (CS). These control inputs and a
TTL-compatible 3-state output facilitate serial communications with a microprocessor or minicomputer. A conversion
can be completed in 17 µs or less, while complete input-conversion-output cycles can be repeated in 22 µs for the
TLC548 and in 25 µs for the TLC549.
The internal system clock and I/O CLOCK are used independently and do not require any special speed or phase
relationships between them. This independence simplifies the hardware and software control tasks for the device.
Due to this independence and the internal generation of the system clock, the control hardware and software need
only be concerned with reading the previous conversion result and starting the conversion by using the I/O clock. In
this manner, the internal system clock drives the “conversion crunching” circuitry so that the control hardware and
software need not be concerned with this task.
When CS is high, DATA OUT is in a high-impedance condition and I/O CLOCK is disabled. This CS control function
allows I/O CLOCK to share the same control logic point with its counterpart terminal when additional TLC548 and
TLC549 devices are used. This also serves to minimize the required control logic terminals when using multiple
TLC548 and TLC549 devices.
The control sequence has been designed to minimize the time and effort required to initiate conversion and obtain
the conversion result. A normal control sequence is:
1. CS is brought low. To minimize errors caused by noise at CS, the internal circuitry waits for two rising edges
and then a falling edge of the internal system clock after a CS↓ before the transition is recognized. However,
upon a CS rising edge, DATA OUT goes to a high-impedance state within the specified tdis even though the
rest of the integrated circuitry does not recognize the transition until the specified tsu(CS) has elapsed. This
technique protects the device against noise when used in a noisy environment. The most significant bit (MSB)
of the previous conversion result initially appears on DATA OUT when CS goes low.
2. The falling edges of the first four I/O CLOCK cycles shift out the second, third, fourth, and fifth most significant
bits of the previous conversion result. The on-chip sample-and-hold function begins sampling the analog
input after the fourth high-to-low transition of I/O CLOCK. The sampling operation basically involves the
charging of internal capacitors to the level of the analog input voltage.
3. Three more I/O CLOCK cycles are then applied to the I/O CLOCK terminal and the sixth, seventh, and eighth
conversion bits are shifted out on the falling edges of these clock cycles.
4. The final (the eighth) clock cycle is applied to I/O CLOCK. The on-chip sample-and-hold function begins the
hold operation upon the high-to-low transition of this clock cycle. The hold function continues for the next four
internal system clock cycles, after which the holding function terminates and the conversion is performed
during the next 32 system clock cycles, giving a total of 36 cycles. After the eighth I/O CLOCK cycle, CS must
go high or the I/O clock must remain low for at least 36 internal system clock cycles to allow for the completion
of the hold and conversion functions. CS can be kept low during periods of multiple conversion. When
keeping CS low during periods of multiple conversion, special care must be exercised to prevent noise
glitches on the I/O CLOCK line. If glitches occur on I/O CLOCK, the I/O sequence between the
microprocessor/controller and the device loses synchronization. When CS is taken high, it must remain high
until the end of conversion. Otherwise, a valid high-to-low transition of CS causes a reset condition, which
aborts the conversion in progress.
A new conversion may be started and the ongoing conversion simultaneously aborted by performing steps 1 through
4 before the 36 internal system clock cycles occur. Such action yields the conversion result of the previous conversion
and not the ongoing conversion.

8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

 TLC548C, TLC548I, TLC549C, TLC549I
8-BIT ANALOG-TO-DIGITAL CONVERTERS
WITH SERIAL CONTROL
SLAS067C – NOVEMBER 1983 – REVISED SEPTEMBER 1996

PRINCIPLES OF OPERATION

For certain applications, such as strobing applications, it is necessary to start conversion at a specific point in time.
This device accommodates these applications. Although the on-chip sample-and-hold function begins sampling
upon the high-to-low transition of the fourth I/O CLOCK cycle, the hold function does not begin until the high-to-low
transition of the eighth I/O CLOCK cycle, which should occur at the moment when the analog signal must be
converted. The TLC548 and TLC549 continue sampling the analog input until the high-to-low transition of the eighth
I/O CLOCK pulse. The control circuitry or software then immediately lowers I/O CLOCK and starts the holding function
to hold the analog signal at the desired point in time and starts the conversion.

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 9

 PACKAGE OPTION ADDENDUM
www.ti.com 6-Nov-2006

PACKAGING INFORMATION

Orderable Device Status (1) Package Package Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Type Drawing Qty
TLC548CD ACTIVE SOIC D 8 75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TLC548CDG4 ACTIVE SOIC D 8 75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TLC548CDR ACTIVE SOIC D 8 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TLC548CDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TLC548CP ACTIVE PDIP P 8 50 Pb-Free CU NIPDAU N / A for Pkg Type
(RoHS)
TLC548CPE4 ACTIVE PDIP P 8 50 Pb-Free CU NIPDAU N / A for Pkg Type
(RoHS)
TLC548ID ACTIVE SOIC D 8 75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TLC548IDG4 ACTIVE SOIC D 8 75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TLC548IDR ACTIVE SOIC D 8 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TLC548IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TLC548IP ACTIVE PDIP P 8 50 Pb-Free CU NIPDAU N / A for Pkg Type
(RoHS)
TLC548IPE4 ACTIVE PDIP P 8 50 Pb-Free CU NIPDAU N / A for Pkg Type
(RoHS)
TLC549CD ACTIVE SOIC D 8 75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TLC549CDG4 ACTIVE SOIC D 8 75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TLC549CDR ACTIVE SOIC D 8 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TLC549CDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TLC549CP ACTIVE PDIP P 8 50 Pb-Free CU NIPDAU N / A for Pkg Type
(RoHS)
TLC549CPE4 ACTIVE PDIP P 8 50 Pb-Free CU NIPDAU N / A for Pkg Type
(RoHS)
TLC549ID ACTIVE SOIC D 8 75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TLC549IDG4 ACTIVE SOIC D 8 75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TLC549IDR ACTIVE SOIC D 8 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TLC549IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TLC549IP ACTIVE PDIP P 8 50 Pb-Free CU NIPDAU N / A for Pkg Type
(RoHS)
TLC549IPE4 ACTIVE PDIP P 8 50 Pb-Free CU NIPDAU N / A for Pkg Type
(RoHS)
TLC549IPS ACTIVE SO PS 8 80 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)

Addendum-Page 1
 PACKAGE OPTION ADDENDUM
www.ti.com 6-Nov-2006

Orderable Device Status (1) Package Package Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Type Drawing Qty
TLC549IPSG4 ACTIVE SO PS 8 80 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TLC549IPSR ACTIVE SO PS 8 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TLC549IPSRG4 ACTIVE SO PS 8 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TLC549MP OBSOLETE PDIP P 8 TBD Call TI Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.

Addendum-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 28-Jul-2010

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TLC548CDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TLC548IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TLC548IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TLC549CDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TLC549IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TLC549IPSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 28-Jul-2010

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TLC548CDR SOIC D 8 2500 340.5 338.1 20.6
TLC548IDR SOIC D 8 2500 346.0 346.0 29.0
TLC548IDR SOIC D 8 2500 340.5 338.1 20.6
TLC549CDR SOIC D 8 2500 340.5 338.1 20.6
TLC549IDR SOIC D 8 2500 340.5 338.1 20.6
TLC549IPSR SO PS 8 2000 346.0 346.0 33.0

Pack Materials-Page 2
 IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audio
Data Converters dataconverter.ti.com Automotive www.ti.com/automotive
DLP® Products www.dlp.com Communications and www.ti.com/communications
Telecom
DSP dsp.ti.com Computers and www.ti.com/computers
Peripherals
Clocks and Timers www.ti.com/clocks Consumer Electronics www.ti.com/consumer-apps
Interface interface.ti.com Energy www.ti.com/energy
Logic logic.ti.com Industrial www.ti.com/industrial
Power Mgmt power.ti.com Medical www.ti.com/medical
Microcontrollers microcontroller.ti.com Security www.ti.com/security
RFID www.ti-rfid.com Space, Avionics & www.ti.com/space-avionics-defense
Defense
RF/IF and ZigBee® Solutions www.ti.com/lprf Video and Imaging www.ti.com/video
Wireless www.ti.com/wireless-apps

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2010, Texas Instruments Incorporated