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Socket AM2+: Stvep-Cbc TVE Specialization Lesson 9b Noveline C. Tacata

The reactance offered by a capacitor to alternating current of frequency 50 Hz is 10Ω. If frequency is increased to 100 Hz reactance becomes—ohm. (a) 20

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42 views4 pages

Socket AM2+: Stvep-Cbc TVE Specialization Lesson 9b Noveline C. Tacata

The reactance offered by a capacitor to alternating current of frequency 50 Hz is 10Ω. If frequency is increased to 100 Hz reactance becomes—ohm. (a) 20

Uploaded by

ryekeaan
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Download as DOC, PDF, TXT or read online on Scribd
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Socket AM2+

Type : PGA – ZIF


Contacts : 940
FSB : 200 Mhz System clock up to 2.6 Ghz
Processors : Athlon 64
Athlon 64 X2
Opteron
Phenom series :
Phenom II X4
Phenom X4
Phenom X3
Phenom X2

Socket AM2+ is a CPU socket, which is the immediate successor to Socket AM2 that is
used by several AMD processors such as Athlon 64 X2. Socket AM2+ is a mid-migration from
Socket AM2 to Socket AM3 and is fully compatible with Socket AM2, so that processors designed
for Socket AM2 work on Socket AM2+ motherboards and vice versa.

Technical Specifications

The main differences in Socket AM2+ are utilized by AM2+ processors, i.e.

 HyperTransport 3.0 operating at up to 2.6 GHz


 Split power planes: one for the CPU cores, and the other for the Integrated Memory
controller (IMC). This will improve power savings, especially with integrated graphics, if the
CPU cores are in sleep mode but the IMC is still active.

AMD confirmed that AM2 processors will work on AM2+ motherboards and AM2+
processors will work on AM2 motherboards. However, the operation of AM2+ processors on AM2
motherboards will be limited to the specifications of Socket AM2 (1 GHz HyperTransport 2.0, and

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one power plane for both cores and the IMC). AM2 processors do not benefit from the faster
HyperTransport 3.0 and separate power planes on AM2+ motherboards.

AMD confirmed that there is an upgrade path from Socket AM2+ to AM3:

 AM3 processors work on AM2+ motherboards


 AM2+ processors do not work on AM3 motherboards

Socket AM3

Type : PGA – ZIF


Contacts : 941
FSB : 200 Mhz System clock up to 3.2 Ghz
Processors : Phenom II (excluding 940 and 920)
Phenom X4
Phenom X3
Phenom X2

Socket AM3 is a CPU socket for AMD processors. It follows directly from Socket AM2+. AM3
was launched on February 9th, 2009, alongside the initial grouping of Phenom II processors
designed for it. The sole principal change from AM2+ to AM3 is support for the AM3 processors'
integrated memory controller, which now supports DDR3 in addition to DDR2.

Compatibility

Socket AM3 breaks compatibility with AM2/AM2+ processors due to a subtle change in key
placement. The socket has 941 pin contacts while current AM3 processors have only 938 pins.

However, AM3 processors are backwards-compatible with Socket AM2+, contingent upon a
BIOS update for the motherboard. Manufacturers including Asus, Gigabyte, and others have
labeled existing AM2/AM2+ boards as being "AM3 Ready" or similar, indicating that BIOS support is
provided for the specified boards. This allows existing AM2/AM2+ systems to upgrade the CPU
without having to upgrade any other components.

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LGA 1366 (Socket B)

Type : LGA
Contacts : 1366
FSB : 200 Mhz System clock up to 2.6 Ghz
Processors : Intel Core i7 (2.66 - 3.33 GHz), Intel Xeon (5500 series)

LGA 1366, also known as Socket B, is an Intel CPU Socket. This socket supersedes Intel's
Socket T (commonly referred as LGA 775) in the high-end and performance desktop segments. It
also replaces the server-oriented Socket J (LGA 771) in the entry level. LGA stands for Land Grid
Array. Like its predecessor, this socket has no holes. Instead, pins on the LGA touch contact points
on the underside of the CPU. The word "socket" is a misnomer, because an LGA 775 motherboard
has no socket holes; instead, it has 775 protruding pins which touch contact points on the
underside of the processor (CPU).

In November 2008, Intel Released Core i7 which was the first processor requiring this
socket.

Technical Specifications

The increase in the number of contact points is proportionally similar to the leap between
LGA 775 and its predecessor PGA 478, thus an increase in the CPU size of about 20% despite pins
being thinner and closer to each other. As in the previous leap, most old heatsinks are incompatible
with the new boards.

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Intel designed Socket B with a more solid structure, featuring a metal plate in the backside
of the mainboard, tightly fastening the CPU socket with four metal screws, so that large and heavy
cooling solutions will not strain, bend or damage both socket and the board.

This new socket, measuring 60x82mm, also features a new loading mechanism to render
the CPU assembly easier.

Socket B mechanical load limits

Socket B processors (Core i7) have a mechanical maximum load limits which should not be
exceeded during heatsink assembly, shipping conditions, or standard use. Load above those limits
will crack the processor die and make it unusable.

Location Dynamic Static

IHS Surface 890 newtons (200 lbf) 266 newtons (60 lbf)

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