Datasheet PDF
Datasheet PDF
Datasheet PDF
Solutions
for Today’s Electronics
• EMI Shielding Tapes
• EMI Grounding Adhesives and Gaskets
• EMI Absorbers
• Flux Field Directional Materials
• NFC, Wireless Power, Magnetic Shielding Materials
Easy-to-use shielding, absorbing, grounding
and bonding technology for today’s electronics
The continuing trend toward designing electronic devices with smaller 3M can help you meet that challenge, with a variety of advanced shielding
enclosures, denser circuits and higher speeds has made managing and grounding solutions designed to help you speed assembly time…
electromagnetic/radio frequency interference (EMI/RFI) and electrostatic reduce weight…save space…control costs…and give you more design
discharge (ESD) a growing challenge for electronics manufacturers. flexibility. Let 3M help you get connected!
3M™ EMI Absorbers
AB5050/AB6005/AB7050
to reduce EMI Noise level within
device or on Flex/Connector
3M™ Electrically Conductive
Adhesive Transfer Tape
9707/9709S/9720S/9750
for Flex/PCB grounding and
attachment, grounded parts assembly
versus screws and clips. Lower device
bias, reduce flex EMI interference.
Silver-coated polyester 4.3 Lightweight, conformable, oxidation resistant and high strength for
AG-0927 Acrylic Conductive
fabric (0.110) EMI shielding and grounding. Easily die cut.
Hard Coating Layer
Gold-coated polyester 4.3 Lightweight, conformable, oxidation resistant and high strength for
AU-2190 Acrylic Conductive ITO Layer
fabric (0.110) EMI shielding and grounding. Easily die cut.
LCD Glass
Typically used to bond two surfaces, both physically and electrically.
Copper-plated polyester Acrylic Conductive 4.3 Driver LC
X-7001 Also can provide EMI shielding, static charge draining, grounding.
ripstop fabric Coated on Both Sides (0.110) Lightweight, conformable and easily die cut. AL39UL
4.7 Bonding and grounding two surfaces. EMI shielding, static discharge
CEF-3** Cu/Ni plated fabric Acrylic Conductive (0.12) draining. Flexible and conformable design.
Acrylic Conductive 3.0 Bonding and grounding two surfaces. EMI shielding, static discharge
CEF-8** Cu/Ni plated fabric coated on both sides (0.075) draining. Flexible and conformable design.
2.4 (0.06)
CEF-3T** Grey Bonding and grounding two surfaces. EMI shielding, static discharge
Cu/Ni plated fabric Acrylic Conductive
CEF-3B** 2.4 (0.06) draining. Flexible and conformable design.
Black
**Products are special order in the USA. Please contact your 3M sales support for details.
11
3M EMI/EMC Solutions
Foil and Fabric Tapes
Total
Product Backing Adhesive Thickness Features
mils (mm)
3M™ Aluminum Foil
Economical EMI shielding aluminum foil tape. Excellent adhesion and environmental
These solutions include an innovative 300PL 1.9 mil aluminum foil* Acrylic Non-Conductive 3.0 (0.078) resistance.
line of 3M™ Electromagnetic Compatible
Acrylic For EMI shielding, static charge draining, grounding. Good for cable wrap. Easily
Products that can control electromagnetic 1120 2 mil aluminum foil Conductive
4.0 (0.102)
die cut.
interference from internal sources, limit EMI
Acrylic
susceptibility from external sources and 1170 2 mil aluminum foil Conductive
3.2 (0.081) For EMI shielding, static charge draining, grounding. Easily die cut.
help manufacturers meet high certification 1178** 1.8 mil aluminum foil Acrylic Conductive 3.3 (0.084) EMI shielding, static discharge draining and grounding.
standards around the world.
• Provide electromagnetic compatibility AL-25BT** 1 mil aluminum foil Acrylic Conductive 2.4 (0.061) For EMI shielding, static charge draining, grounding. Easily die cut.
AL-36NC
1 mil aluminum foil + Acrylic Non-Conductive 2.2 (0.055) Foil backing laminated with polyester film. Good resistance to oxidation, solvents
polyester film and oils. Easily die cut.
1 mil aluminum foil + Foil backing laminated with polyester film. Matte surface finish. Good electrical
AL-37BLK** black matte Acrylic Conductive 2.8 (0.071)
insulation, resistance to oxidation, solvents and oils. Easily die cut.
polyester film
CEAP-1**
2.0 Aluminum Foil + Acrylic Non-Conductive 3.2 (0.080) EMI shielding, assembly aide tape.
PET film
CEAP-6B**
1.0-1.4 total Aluminum Acrylic Conductive 2.6 (0.065) EMI shielding, static discharge draining, grounding.
Foil + Black PET film
3245
Reverse embossed Acrylic Conductive 5.9 (0.150)
For EMI shielding, static charge draining, grounding.
copper foil Solderable, easily die cut.
*For information on the copper foil version of 300PL, contact your 3M representative.
**Products are special order in the USA. Please contact your 3M sales support for details.
10
3M™ Flux Field Directional Materials for NFC/RFID and Wireless Power Applications
140
3M FFDM Antenna
Antenna Metal/Battery 120 AB5016RF
100
80
60
3M FFDM
40
Metal/
20
Battery
0
10M 100M
Frequency (Hz)
Antenna on polyimide Antenna near metal or battery surface. Antenna with 3M FFDM between the antenna Side view of antenna with
carrier. EM field along EM field significantly reduced due to eddy current and metal/battery parts. EM field strength 3M FFDM between antenna
Y-Axis in free space losses of EM field into the battery/metal parts. increased significantly with 3M FFDM use. and metal/battery surface.
Improve NFC/RFID Antenna Read Range with Improve Power Transfer Efficiency and Range
3M Flux Field Directional Materials (FFDM) with 3M Flux Field Directional Materials (FFDM)
Magnetic Flux Antenna tag
3M FFDM
Metal
Eddy current
generation
(Magnetic flux Antenna tag
attenuation)
3M FFDM
Metal
3M Flux Field
Directional Receiving Antenna Coil
Materials
B
3M™ Flux Field Directional Materials (FFDM) for Magnetic Shielding Applications
H-Field of Device H-Field of Device 3M FFDMs can be used to provide magnetic shielding of stray field
No Magnetic Shielding FFDM Magnetic Shielding generating devices or materials that impact neighbor device or
component performance (i.e. inductor, wireless power, etc.).
Strong 3M FFDM Type EM80KM
Mag. Field Strong Weak 0.02 mm Soft Magnetic Layer Thickness
Mag. Field Mag. Field KEC Magnetic Field Test Method
80 mm x 80 mm sample/40 mm plate s hole size
25
Component
Component near Weak Vertical to Mag Field
near Strong
Shielding Effectiveness (dB)
3M FFDM 10
Sheet
Material
5
0.1 1 10 100
Frequency (MHz)
3
Mobile Handheld & Tablet EMI/EMC Solutions
Problem Solution
Higher frequencies require optimized Inherent bond line thickness
grounding and Faraday Cage design EMI Shielding using 3M™ Electrically Conductive Adhesive Transfer Tape (ECATT)
Poor “through tape” EMI Shielding leads to Standard electrically conductive tape leads to 3M ECATT 9709SL
lower EMI SE at High Frequencies. EMI leakage through bond line tape thickness.
Grounding Surface
Grounding
(R OK)Surface (R OK) Grounding Surface
Grounding
(LowerSurface
Contact(Lower
R) Contact R)
3M ECATT with inherent EMI shielding at the bond line provides significantly reduced crosstalk,
stray EMI, noise in circuit, antennae effects, FPC susceptibility and spurious emissions.
35 µm
3M Electrically Conductive Adhesive Transfer Tape
9709SL used for FPC grounding and EMI Shielding
10Hz 0.1mHz 50mHz 1000mHZ 10000mHZ
(1GHz) (10GHz) Flex Printed Circuit
At High Frequencies, the effect of “through the tape thickness” Flex
EMI gaps or EMI slits is to allow EMI leakage. If the effective 3M ECATT 9709SL
EMI gap/slit does not = “0”, EMI energy at high frequency can Grounding Surface
pass through a “standard conductive adhesive tape material” via
the gap related to the adhesive thickness. The “Tape Bond Line Substrate Layer
Gap/Slit leakage effect” leads to poor EMI Shielding, cross-talk, 3M ECATT 9707, 9709S
degraded Signal-to-Noise ratio, etc.
4
These long-lasting adhesive transfer tapes can eliminate the need for screws and mechanical
fasteners – while allowing the use of lighter, more compact fabric and layered foil shielding materials.
And, unlike other electrically conductive adhesives that can be messy and difficult to handle, 3M delivers
advanced adhesive and conductive properties in an easy-to-use, pressure-sensitive tape that can be hand
or machine applied and die cut to virtually any shape!
potential on SS. Contact R can Contact R between based on acrylic resistance and
in Peel Strength
vary with SS type tested as the a Flex and a PCB adhesive type Thermal Conductivity vs a
Bond Line
oxide layer thickness on a SS & conductive generic Z-Axis only PSA.
“Gap/Slit”
type affects the final R results. filler type.
See note 1.
3M™ Electrically Conductive
Adhesive Transfer Tape (ECATT)
9703 Best Good Good Better Good Selection Process
Selection of Grounding, EMI Shielding
9704 Best Good Best Good Good
and attachment ECATTs consists
of determining several application
9705 Best Good Good Better Good requirements: For example, an ECATT
general selection process could take
9706 Best Good Best Good Good into consideration items such as, but
not limited to:
9707 Best Best Best Best Good Best 1 Determine contact R target
2 Define contact surface type
9709 Good Best Best Good Better Best 3 Adhesion level desired - from High-
Medium-Standard Adhesion, and
9709S Best Best Best Good Better Best High/Low adhesion sided ECATTs
4 Bond line thickness
9709SL Best Best Best Good Better Best 5 Z or XYZ conductive type ECATT
6 Operating temperature range and
7805 Good Better Good Best Better Better environmental conditions
7 EMI Shielding in bond line “Gap/Slit”
7850 Good Good Good Best Good Best for high frequencies
8 Determine contact area for ECATT
7772 Better Good Good Good Good Good used for R and adhesion of surfaces
9 Assembly Pressure, temperature
9712 Good Good Good Better Good Good and time limits
10 After assembly bond line
9713 Better Good Good Good Good Good stresses and need for added
mechanical support
9719 Good Good Good Better Good Good
9
3M EMI/EMC Solutions
3M Electrically Conductive Adhesive Transfer Tapes
™
3M™ Electrically Conductive Adhesive Transfer Tapes are designed to help you save time in a variety of
specialized electronics assembly operations – from attaching EMI shields and gaskets to grounding and bonding
flexible circuits and PCBs – while improving the performance and reliability of your finished products.
3M Test Method)
Thickness (µm)
a Copper Foil using the
PCB gold test pad.
(Based on
3M ECATT / 3M 2-point
Product
Note 1: T est & performance results will vary High Adhesion Higher thermal conductivity
7850 150 XYZ Carbon < 1.0 < 10.0
based on items such as, but are not Acrylic ECATT & Thicker ECATT for gap filling
limited to: Contact area; Assembly
method; Testing conditions; Normal Nickle & Medium Adhesion
7772 66 XYZ Double coated aluminum foil < 0.5 < 2.0
variations in product performance Alum DC Acrylic D/C
from one mfg. lot to a different mfg.
lot of material – along with the normal Standard Acrylic Non-woven conductive scrim
9712 125 XYZ Carbon < 1.5 < 15.0
variations found in a material within ECATT & Standard acrylic adhesive
a mfg. lot (i.e., thickness, available
conductive material in an actual sample Standard Lower R non-woven conductive scrim vs.
9713 89 XYZ Nickel/C < 0.4 < 7.5
tested, variations in conductive filler Acrylic ECATT 9712 & Standard acrylic adhesive
materials and uniformity of conductive Low surface energy silicone adhesive, Higher
materials dispersed within a lot of 9719 100 XYZ Nickel/C Silicone ECATT temperature resistance, Lower R non-woven < 1.0 < 20.0
material, variations in adhesives, etc.); conductive scrim vs. 9712
Test methods; Environmental aging; Exact Lower R non-woven conductive scrim vs. 9713,
High Adhesion
test surface material type utilized, etc. 9720S 30 XYZ Nickel/Cu Thinner scrim design < 0.2 < 0.5
Acrylic ECATT
The “Copper to Copper” & “Gold Flex to & Medium adhesion
PCB” testing also should be noted for the High Adhesion Lower R non-woven conductive scrim vs.
differences related to the “Contact area” 9723 60 XYZ Nickel/Cu < 0.2 < 0.4
Acrylic ECATT 9713, Thinner scrim design & High adhesion
difference in the Test Methods (645 mm2
vs. 6 mm2) as this does impact the test High Adhesion Lower R non-woven conductive scrim
results. Testing of ECATT materials and 9750 50 XYZ Nickel/Cu < 0.2 < 0.5
Acrylic ECATT vs. 9713 & High adhesion
the noted test substrates does not imply
that the ECATT is suitable for an end use Medium Adhesion Lower R non-woven conductive scrim vs. 9713,
9732 100 XYZ Nickel/Cu < 0.2 < 2.5
application of similar materials. End user Acrylic ECATT Thicker scrim design & High adhesion
is responsible to determine if an ECATT
High / Low Adhesion Easier rework as greater Face Side to Back Side
and substrate combination is fit for use in 9760 50 XYZ Nickel/Cu Double sided reworkable adhesion delta. Easier rework version < 0.2 < 0.8
their intended end use application. Acrylic ECATT of 9725. High and Low adhesion sides.
Note 2: M
ore ECATT options are available. Chart High / Low Adhesion Easier rework as greater Face Side to Back Side
references typical type options. Contact 9764 150 XYZ Nickel/Cu Double sided reworkable adhesion delta. Easier rework and thicker version < 0.5 < 5.0
your 3M Technical Service Representative Acrylic ECATT of 9732. High and Low adhesion sides.
for more details. High / Low Adhesion Easier rework as greater Face Side to Back Side
9780 200 XYZ Nickel/Cu Double sided reworkable adhesion delta. Easier rework and thicker version < 0.5 < 5.0
Acrylic ECATT of 9732. High and Low adhesion sides.
8
Hard Coating Layer
ITO Layer
LCD Glass
Driver LC
AL39UL
3M™ EMI Absorbers AB5100/AB6005/AB7050
to reduce EMI noise level on flex/connector.
3M™ EMI Custom Foil Tape
AL39UL/3006ALB
Internal
Internal Device
Device BiasBias No Device
No Device BiasBias
B +2.0+2.0
V V +0.0+0.0
V V
Assembly
Assembly
Antenna Grounding Antenna optimized
optimized for for
Antenna Grounding Antenna
grounding
z not not
effective
effective
grounding
using
using
3M ECATT
3M ECATT
+0.0 V Ground
+0.0 V Ground
Signal +0.0+0.0 V Ground
V Ground Signal
Signal DataData
Flex Flex
Signal DataData
Flex Flex
If device is not well grounded, the Device is well grounded so the “bias” voltage
“bias” voltage in the device acts as in the device is “baseline” and no “RF signal”
a “transmitter” of a signal that the is emitted. Optimized Antenna and data flex
3M™ Flux Field Directional 3M Flux Field Directional Material signal line flex, antenna flex, etc. pick S/N performance.
Material AB5016RF/RFIC15 for RFIC/EM16TF/EM80KM for up, leading to poor S/N performance
improved NFC & RFID performance. improved Wireless Power Efficiency.
3M ECATT 9707, 9709S, 9720S and 9750
and higher error rates.
5
3M EMI/EMC Solutions
Electrically Conductive Cushioning Gasket Selections
3M™ Electrically Conductive 3M™ Electrically Conductive Gaskets solutions encompass three distinct product types:
Cushioning Gasket
ECG-7033, ECG-7053, • 3 M Electrically Conductive Gaskets (ECG): Single coated and double coated conductive foam products
ECG-7073, Single Coat (less than 1mm thickness)
• 3M Metal Shielding Gaskets (MSG): Very soft single coated conductive foam products with a metal carrier
(greater than 1 mm thickness).
• 3M Electrically Conductive Acrylic Pads (eCAP): Solid core single coated acrylic conductive gaskets with a
conductive fabric carrier (less than 1 mm thickness).
Conductive PSA The 3M ECG series has two versions. The single coated version ECG-70xx and the double coated version
ECG-80xx. The 3M MSG products are available in greater than 1mm thickness with a metal carrier layer that
is either a metal foil or a magnetic foil type. The eCAP product 7830N is an acrylic conductive ECATT with a
3M™ Electrically Conductive
conductive fabric carrier layer to make a single sided eCAP gasket product.
Cushioning Gasket
ECG-8035, ECG-8055, Total
ECG-8075, Double Coat Conductive Conductive Conductive
Product Thickness Features
Carrier Type Adhesive / Fillers Core
(mm)
Acrylic adhesive with Acrylic adhesive XYZ electrical conductivity, single sided, provides
Conductive 0.2, 0.3,
eCAP 7830N Ni coated graphite filler / with Ni coated EMI Shielding and Grounding, Good adhesion to
Fabric 0.4, 0.5
1 side, single coated graphite filler many substrates.
Acrylic adhesive Metal plated open 0.33, 0.53, 0.73 XYZ electrical conductivity, Conformable-Soft, single
ECG-70xx Conductive with Ni filler / cell urethane sided, provides EMI Shielding and Grounding, Good
(ex: ECG-7033) Fabric (0.xx)
1 side, single coated foam adhesion to many substrates, single sided adhesive.
Conductive PSA
Acrylic adhesive Metal plated open 0.35, 0.55, 0.75 XYZ electrical conductivity, Conformable-Soft,
ECG-80xx Conductive with Ni filler / cell urethane provides EMI Shielding and Grounding, Good
(ex: ECG-8035) Fabric (0.xx)
2 sided, double coated foam adhesion to many substrates, dual sided adhesive.
Communication
Signal Disrupted
by IC EMI
3M EMI Absorbers
6
3M Wide Frequency EMI Absorbers (AB) and 3M Flux Field Directional Materials
(FFDM) – Specific Target Application Frequency Range
3M EMI Absorbers (AB) for wide frequency applications:
• 3M EMI Absorbers are used to reduce EMI and RF noise in electronic systems. 3M EMI Absorbers can be
applied to noisy traces, ICs and reflective surfaces in an enclosure.
3M Flux Field Directional Materials (FFDM): Wireless Power, NFC, Magnetic Shielding Digitizer, and HAC
• 3M FFDM products are useful for RFID and NFC applications to de-couple the NFC or RFID antenna from metal
surfaces by directing the antenna flux fields away from the metal object or surface. 3M FFDM products can also be
beneficial in Wireless Power systems to enhance power transfer efficiency between primary sending and receiving
antenna coils. FFDMs such as EM80KM also are useful as magnetic field shielding materials in a thin format.
3M Wide Frequency EMI Absorbers (Ab)
3M Flux Field Directional Materials (FFDM) - Specific Target Application Frequency Range
Carrier Binder Adhesive Magnetic
Product Polymer and Permeability Features
Type @
Filler 13.56 MHz
AB-5000R series FFDM materials are designed for RFID and NFC applications to de-couple the Note: Reference EM # # Letter-Letter
Flexible
AB-5000R NFC or RFID antenna from metal surfaces by directing the antenna flux fields away from the metal (i.e., EM80KM)
polyethylene Acrylic
Series 45 - 50 object or surface. Products can also be evaluated for Wireless Power systems to enhance power - EM = Electro-Magnetic
resin with PSA
(EM45EP) transfer efficiency between primary sending and pick-up antenna coils. - # # = Permeability Peak
magnetic fillers
Products include: AB-5010R @ 0.15 mm/AB-5020R @ 0.2 mm. - 1st Letter: K=x1000, H=x100, T=x10, E=x1
EM16TF series FFDM materials are designed for RFID and NFC applications to de-couple the NFC - 2nd Letter = EM Material Type: M= Magnetic foil,
Sintered ferrite F = Ferrite, P = Polymer composite
or RFID antenna from metal surfaces by directing the antenna flux fields away from the metal
sheet between Acrylic with magnetic fillers.
EM16TF 160 object or surface. Products can also be evaluated for Wireless Power systems to enhance power
carrier films with PSA
transfer efficiency between primary sending and pick-up antenna coils.
optional PSA After EM##LL, the product is identified by
Products include: EM16TF @ different overall thicknesses (see TDS).
AB-5000RF series FFDM materials are designed for RFID and NFC applications to de-couple the overall thickness in mm (ttt) and one- or
Sintered ferrite two-sided adhesive (A).
AB-5000RF NFC or RFID antenna from metal surfaces by directing the antenna flux fields away from the metal
sheet between Acrylic
Series 105 object or surface. Products can also be evaluated for Wireless Power systems to enhance power
carrier films with PSA Example: EM45EP @ 0.15 mm thickness with
(EM10TF) transfer efficiency between primary sending and pick-up antenna coils. Products include: AB-
optional PSA PSA on one side = EM45EP-ttt-A = EM45EP-015-1
5016RF@0.16 mm /AB-5026RF@0.26 mm. Thinner options are available.
RFIC series FFDM materials are designed for RFID and NFC applications to de-couple the NFC or Note that Ferrite Type always has a film on the
Flexible
RFID antenna from metal surfaces by directing the antenna flux fields away from the metal object
RFIC Series polyethylene Acrylic non-PSA side.
42 or surface. Products can also be evaluated for Wireless Power systems to enhance power transfer
(EM42EP) resin with PSA
efficiency between primary sending and pick-up antenna coils. Products include: RFIC-XX @
magnetic fillers
0.13 mm - 0.33 mm @ multiple thicknesses. See TDS for details.
EMxxTF series FFDM materials are designed to be evaluated for Wireless Power systems to
Sintered ferrite
enhance power transfer efficiency between primary sending and pick-up antenna coils. Optional
sheet between Acrylic
EM13TF 130 uses include RFID and NFC applications to de-couple the NFC or RFID antenna from metal
carrier films with PSA
surfaces by directing the antenna flux fields away from the metal object or surface.
optional PSA
Products include: EM13TF @ different overall thicknesses (see TDS).
EM80KM series FFDM materials are designed for DC and low frequency magnetic field shielding
High permeability
Acrylic to be evaluated for Wireless Power systems to enhance power transfer efficiency between primary
EM80KM magnetic foil with 80,000 max
PSA sending and pick-up antenna coils. Products include: EM80KM @ 0.12 mm (Thinner versions
cover film & PSA
and optional multi-layer designs are available for optimized thickness and flux field interaction).
7
Information or Sales Assistance
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Technical Information: The technical information, recommendations and other statements contained in this document are based upon tests or experience that 3M believes are reliable, but
the accuracy or completeness of such information is not guaranteed.
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and suitable for user’s method of application.
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