Power Electronic
Power Electronic
Symbol
Definition (MOSFET Controlled Thyristor) A special type of SCR that has the function of a GTO
with its gate driven from a FET.
In general, the MOSFET works as a switch, the MOSFET controls the voltage and
current flow between the source and drain. The working of the MOSFET depends
on the MOS capacitor, which is the semiconductor surface below the oxide layers
between the source and drain terminal
Working In general, the MOSFET works as a switch, the MOSFET controls the voltage and current flow
Principle between the source and drain. The working of the MOSFET depends on the MOS capacitor,
which is the semiconductor surface below the oxide layers between the source and drain
terminal. It can be inverted from p-type to n-type, simply by applying positive or negative gate
voltage respectively. The below image shows the block diagram of the MOSFET.
When a drain-source voltage (VDS) is connected between the drain and source, a positive
voltage is applied to the Drain, and the negative voltage is applied to the Source. Here the PN
junction at the drain is reverse biased and the PN junction at the Source is forward biased. At
this stage, there will not be any current flow between the drain and the source.
If we apply a positive voltage (VGG) to the gate terminal, due to electrostatic attraction the
minority charge carriers (electrons) in the P substrate will start to accumulate on the gate
contact which forms a conductive bridge between the two n+ regions. The number of free
electrons accumulated at the gate contact depends on the strength of positive voltage applied.
The higher the applied voltage greater the width of the n-channel formed due to electron
accumulation, this eventually increases the conductivity and the drain current (ID) will start
to flow between the Source and Drain.
When there is no voltage applied to the gate terminal, there will not be any current flow apart
from a small amount of current due to minority charge carriers. The minimum voltage at which
the MOSFET starts conducting is called the threshold voltage.
Operation of MOSFET in Depletion Mode:
The depletion-mode MOSFETs are usually called the “Switched ON” devices as they are
generally in the closed state when there is no bias voltage at the gate terminal. When we
increase the applied voltage to the gate in positive the channel width will be increased in
depletion mode. This will increase the drain current ID through the channel. If the applied gate
voltage is highly negative, then the channel width will be less and the MOSFET might enter
into the cut off region.
Curve
Freq./Am Year made Rated Rated Rated Rated Forward
p voltage current frequency power voltage
Volt 1976 500V 50 A 1MHz 100kW 3-4V
Applica. Used in inverters rated >100 kW
Advantage MOSFETs provide greater efficiency while operating at lower
voltages.
Absence of gate current results in high input impedance producing
high switching speed.
They operate at lower power and draws no current.
Disadva. The thin oxide layer make the MOSFETs vulnerable to permanent
damage when evoked by electrostatic charges.
Overload voltages makes it unstable.
IGBT
Symbol
Definition The IGBT combines the simple gate-drive characteristics of power MOSFETs
with the high-current and low-saturation-voltage capability of bipolar transistors.
The IGBT combines an isolated-gate FET for the control input and a bipolar power
transistor as a switch in a single device.
Working The working principle of IGBT is based on the biasing of Gate to Emitter terminals
Principle and Collector to Emitter terminals. When collector is made positive with respect
to emitter, IGBT gets forward biased. With no voltage between Gate and Emitter,
two junctions between n- region & p region i.e. junction J2 are reversed biased.
Therefore, no current flows from collector to emitter. You may refer figure-1 for
better understanding.
When Gate is made positive with respect to Emitter by some voltage VG (this
voltage should be more than the threshold voltage VGET of IGBT), an n-channel is
formed in the upper part of the p-region just beneath the Gate. This n-channel is
called the inversion layer. This n-channel short circuits the n- region with n+
emitter region. Electrons from n+ emitter begins to flow to n- drift region through
n-channel.
As IGBT is forward biased with collector positive and emitter negative, p+
collector region injects holes into n- drift region. Thus, n- drift region is flooded
with electrons from p-body region and holes from p+ collector region. With this,
the injection carrier density in n- drift region increases considerably and
subsequently, conductivity of n- region enhances. Therefore, IGBT gets turned
ON and begins to conduct forward current IC.
Current IC or IE comprises of two current components:
Hole current Ih due to injection of holes from collector p+, p+n–p transistor
Q1, p-body region resistance Rby and emitter.
Electronic current Ie due to injected electrons flowing from collector,
injection layer p+, drift region n-, n-channel resistance Rch, n+ and emitter.
Therefore, the collector, or load current
IC = Emitter Current
= IE
= Ih + Ie
Major current of collector current is electronic current Ie i.e. main current path for
collector, or load, current is through p+, n-, drift resistance Rd and n-channel
resistance Rch. This is shown in exact equivalent circuit.
The voltage drops in an IGBT during its ON condition consists of voltage drop in
n-channel, voltage drop across drift n- region, voltage drop across forward biased
p+n- junction J1. The voltage drop across junction J1 is very small of the order of
0.7 to 1V. The ON state voltage drop of IGBT is very small and hence ON state
losses are also low.
Curve
Disadva.
TRANSISTO
R
Symbol
Definition A transistor consists of two PN diodes connected back to back. It has three
terminals namely emitter, base and collector. The basic idea behind a transistor
is that it lets you control the flow of current through one channel by varying
the intensity of a much smaller current that's flowing through a second channel
Working The element named silicon is generally preferred for transistor construction.
Principle The silicon is less sensitive to the temperature. It has the capability of handling
the high values of voltages and the greater ranges of currents.
As it is known that the emitter base junction must be in forward bias and the
collector base junction remain in reverse bias. Because of the forward bias
condition at the emitter base junction there is the majority of the carriers
entered in to the base.
This is the reason for the constitution of the base current that tends to flow
through the region of base. This current tends to flow towards the collector and
in response the electron movement is observed in the collector region from
base.
The base current is also responsible for creation of vacancy at the collector.
But it has small magnitude. As we already know that the base present in the
transistor has always lightly doped.
This is the reason there will be the lesser amount of charge carriers like
electrons are less in amount in comparison with that of the emitter. These few
amounts of electrons get interacted with respect to the holes at the base whereas
the left over amount of electrons can be seen moving towards the collector.
This paved the way for the generation of collector current. Hence the variations
at the base can constitute large amount of current at the collector.
Curve
Case-i:
When a voltage VDS is applied between drain and source terminals
and voltage on the gate is zero as shown in fig.3(i), the two pn
junctions at the sides of the bar establish depletion layers.
Fig.3 (i)
The size of the depletion layers determines the width of the channel
and hence current conduction through the bar.
Case-ii:
When a reverse voltage VGS is applied between gate and source
terminals, as shown in fig.3(ii), the width of depletion layer is
increased.
Fig.3 (ii)
On the other hand, when the reverse bias on the gate is decreased,
the width of the depletion layer also decreases.
This increases the width of the conducting channel and hence source
to drain current.
Working
Principle A Thyristor acts like a diode. It has two layers of semiconductors
namely p-type and n-type sandwiched together to form a
junction. The anode is connected to the outer p-layer, cathode to
the outer n-layer and gate to the internal p-layer. It has 3
junctions namely J1, J2, J3 as shown in the Figure 2 below.
When the anode is at positive potential with respect to cathode,
no voltage is applied to the gate. The junctions J1, J3 is forward
biased and J2 is reverse biased. So no conduction takes place
here.
The gate trigger current varies inversely with the gate voltage
and a minimum gate charge is required to trigger it. Thus the
switching of Thyristors can be controlled through its gate pulse.
Curve
Freq./Amp Year made Rated Rated Rated Rated Forward
Volt voltage current current power voltage
1957 6 kV 3.5 kA 500 Hz 100’sMW 2.5V
Application Widely used for controlled rectifiers. The SCR is found almost exclusively in power
electronics applications, and is the most common member of the thyristor family.
Advantage Low cost.
Can be protected with the help of fuse.
Can handle large voltage/ current.
Able to control AC power.
Very easy to control.
Easy to turn on.
GTO or Gate Turnoff Thyristor has high efficiency.
Takes less time to operate
Disadva. The disadvantages of Thyristor includes:
Cannot be used for higher frequencies.
In AC circuit, Thyristor needs to be turned on each cycle.
SCR takes time to turn on and off. ...
It can stop the motor when connected, but cannot hold it stationary.
The response rate of Thyristor is very low