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Figure 1 Schematic of A Hair Dryer

The document contains 8 homework problems related to heat transfer. Problem 1 involves calculating the volumetric flow rate and discharge velocity of a hair dryer given information about its power consumption and operating temperatures. Problem 2 examines the thermal treatment of silicon wafers and whether the temperature difference across the wafer thickness meets a specified condition.

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401 views2 pages

Figure 1 Schematic of A Hair Dryer

The document contains 8 homework problems related to heat transfer. Problem 1 involves calculating the volumetric flow rate and discharge velocity of a hair dryer given information about its power consumption and operating temperatures. Problem 2 examines the thermal treatment of silicon wafers and whether the temperature difference across the wafer thickness meets a specified condition.

Uploaded by

Icy45
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
You are on page 1/ 2

EMCH 354, Spring 2016, HW03 Due on: 03/17/2016 U of S Carolina

Draw a figure if necessary and show essential steps!!

Problem 1: In a hair dryer, air flow pumped


by a small fan is heated by a coiled electric
resistance wire in a circular duct as shown in
Fig. 1.

(a) If a dryer is designed to operate with an


electric power consumption of Pelec = 500 W
and to heat air from an ambient temperature of
Ti = 20 °C to a discharge temperature of To =
Figure 1 schematic of a hair dryer.
45 °C, at what volumetric flow rate should the
fan operate? Heat loss from the casing to the
ambient air and the surroundings may be neglected. If the duct has a diameter of D = 70
mm, what is the discharge velocity Vo of the air? The density and specific heat of the air
may be approximated as ρ = 1.10 kg/m3 and cp = 1007 J/kg∙K, respectively.
(b) Consider a dryer duct length of L = 150 mm and a surface emissivity of ε = 0.8. If the
coefficient associated with heat transfer by natural convection from the casing to the
ambient air is h = 4 W/m2∙K and the temperature of the air and the surroundings is T∞= Tsur
= 20 °C, confirm that the heat loss from the casing is, in fact, negligible. The casing may
be assumed to have an average surface temperature of Ts = 40 °C.

Problem 2: In the semiconductor industry, the thermal treatment of materials such as


annealing can be achieved by heating a silicon wafer according to a temperature-time
recipe and then maintaining a fixed elevated temperature for a prescribed period of time.
For the process tool arrangement shown as in Fig. 2, the wafer is in an evacuated chamber
whose walls are maintained at 27 °C and
within which heating lamps maintain a
radiant flux at its upper surface. The wafer
is 0.78 mm thick, has a thermal
conductivity of 30 W/m∙K, and an
emissivity that equals its absorptivity to
the radiant flux (ε = α = 0.65). For 𝑞𝑠" = 3.0
×105 W/m2, the temperature on its lower
surface is measured by a radiation Figure 2 annealing process in semiconductor industry
thermometer and found to have a value of
Tw,l = 997 °C.

To avoid warping the wafer and inducing slip planes in the crystal structure, the
temperature difference across the thickness of the wafer must be less than 2 °C. Is this
condition being met? If this condition cannot be met, how to improve the material thermal
treatment?

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Problem 4: A small sphere of reference-grade iron with a specific heat of 447 J/kg∙K and
a mass of 0.515 kg is suddenly immersed in a water–ice mixture. Fine thermocouple wires
suspend the sphere, and the temperature is observed to change from 15 to 14 °C in 6.35 s.
The experiment is repeated with a metallic sphere of the same diameter, but of unknown
composition with a mass of 1.263 kg. If the same observed temperature change occurs in
4.59 s, what is the specific heat of the unknown material?

Problem 5: An aluminum pin fin has a diameter of 4 mm and a length of 20 mm. Calculate the
heat dissipated when the base temperature is 600 K, the fluid temperature is 400 K, and the heat
transfer coefficient is 100 W/(m2K). Take k = 180 W/(m K).

Problem 6: Two air flows are separated by a 2 mm thick plastic wall. A 20.2 cm long, 1 cm
diameter aluminum rod transfers heat from one flow to the other as shown in Figure 3. The hot air
flow is at 70 ˚C, and the convective heat transfer coefficient to the rod is 48 W/(m2K); the cold air
flow is at 20 ˚C and is at a lower velocity, giving a heat transfer coefficient only 24 W/(m2K).
Determine the rate of heat transfer Q and the temperature of the midsection of the rod. Take k al =
190 W/(m K).

Figure 3

Problem 7: Consider a composite wall that includes


an 8-mm-thick hardwood siding, 40-mm by 130-mm
hardwood studs on 0.65-m centers with glass fiber
insulation (paper faced, 28 kg/m3), and a 12-mm
layer of gypsum (vermiculite) wall board.

What is the thermal resistance associated with a wall that is 2.5 m high by 6.5 m wide
(having 10 studs, each 2.5 m high)? Assume surfaces normal to the x-direction are
isothermal. PROPERTIES: Table A-3 (T ≈ 300K): Hardwood siding, kA = 0.094
W/m⋅K; Hardwood, kB = 0.16 W/m⋅K; Gypsum, kC = 0.17 W/m⋅K; Insulation (glass fiber
3
paper faced, 28 kg/m ), kD = 0.038 W/m⋅K.

Problem 8: At a given instant of time, the temperature distribution within an infinite


homogeneous body is given by the function
T(x, y, z)= x2- 2y2+z2-xy+2yz
Assuming constant properties and no internal heat generation, determine the regions
where the temperature changes with time.

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