Ec6702-Optical Communication and Networks Question Bank: Unit I - Introduction Part A
Ec6702-Optical Communication and Networks Question Bank: Unit I - Introduction Part A
QUESTION BANK
UNIT I – INTRODUCTION
PART A
PART B
1. Explain with neat diagram the elements of an optical fiber transmission link (10)
2. Discuss the evolution of fiber optic communication system (6)
3. The relative refractive index difference between the core and the cladding of a graded
index fiber is 0.7% when the refractive index at the core axis is 1.45.Estimate values for the
numerical aperture of the fiber along the axis when the index profile is assumed to be
triangular
4. Derive an expression for numerical aperture of a step index fiber (10)
5. The relative refractive index difference between the core and the cladding of a graded index
fiber is 0.7% when the refractive index at the core axis is 1.45.Estimate values for the
numerical aperture of the fiber along the axis when the index profile is assumed to be
triangular
6. Discuss the mode theory of circular waveguides.(8)
7. Discuss briefly about linearly polarized modes.(6)
8. Draw the structures of single and multimode step index fibers and graded index fiber with
their typical dimensions (6)
9. Mention the advantages of optical fiber communication systems. (4)
10. Derive an expression to determine the modes propagating in step index fiber (11)
11. Calculate the numerical aperture, cut-off parameter and number of modes supported by
a fiber having µ1(core) = 1.54, µ2(cladding) = 1.5, core radius 25µm and operating
wavelength 1300nm. (5)
12. Explain the phenomenon of total internal reflection using Snell’s law with figures
and calculations.(12)
13. Distinguish step index from graded index fibers.(4)
14. Calculate NA of silica fiber with its core refractive index (n1) of 1.48 and cladding
refractive index of 1.46. What should be the new value of ‘n’ in order to change the NA to
0.23?(4)
15. Draw and explain the acceptance angle and numerical aperture of an optical fiber and
derive expressions for both.(8)
16. A fiber has a core radius of 25mm, core refractive index of 1.48 and relative refractive index
difference is 0.01. If the operating wavelength is 0.84mm, find the value of normalized
frequency and the number of guided modes. Determine the number of guided modes if D is
reduced to 0.03.(8)
17. What is the numerical aperture of an optical fiber? Deduce an expression for the same.
18.What are the various features of graded index fiber? Explain the refractive index profile and
ray transmission in a multimode graded index fiber (16)
19.Draw and explain ray theory transmission in an optical communication.
20. With diagram, explain acceptance angle, numerical aperture and total internal reflection.
21. With diagram, explain electromagnetic mode theory of optical propagation.
22. Explain the ray theory of a fiber with special mention about TIR, acceptance angle and NA.
23. Describe single mode fibers and their mode- field diameter. What are the propagation
modes in them? (8)
24. Derive the mode equations for a circular fiber using Maxwell’s equations. (8)
25. With the help of a block diagram explain the different components of a optical fiber link.
(12)
26. Compare the optical fiber link with a satellite link. ( 4)
27. Explain the differences between meridonal and skew rays. (4)
28. Bring out the differences between phase and group velocities. (6)
29. Deduce an expression for NA of a fiber with the help of a neat figure showing all
the details.(6)
UNIT 2
TRANSMISSION CHARACTERISTICS OF OPTICAL FIBERS
PART A
PART B
1. What is the mean optical power launched into an 8km length fiber is 120MW,
the mean optical power at the fiber output is 3µW. Determine
(1)Overall signal attenuation in dB/km and
(2)The overall signal attenuation for a 10km optical link using the same fiber With splices at
1km intervals, each giving an attenuation of 1dB.(6)
2. Explain with suitable diagrams the different mechanisms that contribute to attenuation
in optical fibers.(10)
3. Discuss in detail the intermodal dispersion with relevant expressions and diagrams. (10)
4. Write a brief note on design optimization of single mode fibers (6)
5. With aid of diagrams discuss the various losses occurring in optical fibers.(16)
6.A 6km optical link consists of multimode step index fiber with a core refractive index of 1.5
and a relative refractive index of 1%. Estimate the delay difference between the slowest and
fastest modes at the fiber output and the rms pulse broadening due to intermodal dispersion on
the link. Also derive the expression involved in it. (8)
7. Explain the scattering and bending losses that occur in an optical fiber with relevant diagrams
and expressions. (8)
8. Discuss polarization mode dispersion and its limitations.(8)
9.Discuss material and waveguide dispersion mechanisms with necessary mathematical
expressions. (8)
10.Write a brief note on pulse broadening in graded index fibers.(8)
14. What do you mean by pulse broadening? Explain its effect on information carrying capacity
of a fiber .(12)
15. An LED operating at 850 nm has a spectral width of 45 nm, what is the pulse spreading in
ns/km due to material dispersion? What is the pulse spreading when a laser diode having a 2nm
spectral width is used? The material dispersion is 90ps/nm.km.(4) (N/ D 11)
16.What is meant by ‘fiber splicing’? Explain fusion splicing of optical fibers.
17. Explain expanded beam fiber connector with a neat schematic. (8)
18. Explain the following with necessary diagram and expressio ns
(i) Non linear scattering loss and fiber bend loss.
(ii) Material dispersion in optical fiber. (16)
19.Explain mechanical splices with neat diagrams.(8)
20. Write a brief note on fiber alignment and joint loss.
21. What are the losses on signal attenuation mechanisms in a fiber? Explain in detail (16)
22. Derive expressions for material dispersion and waveguide dispersion and explain them.
23.Describe the various types of fiber connectors and couplers. (8)
24. Explain fiber alignment and joint losses. (6)
25. Describe various fiber splicing techniques with their diagrams. (10)
26. Discuss the attenuation encountered in optical fiber communication due to
Bending, Scattering and Absorption. (12)
27. Clearly bring out the differences between intra and inter modal dispersion. (12)
28. Find the maximum bit rate for the fiber link of 5 Kms. The numerical aperture is 0.25and
the refractive index is 1.48. (4)
29. Explain the attenuation and losses in fiber
30. With diagram, explain intra and inter modal dispersion. (M / J 14)
UNIT -3
SOURCES AND DETECTORS
PART A
PART B
1. Draw and explain the LED structures based Double Hetrostucture configuration.(8)
2. Discuss the principle of operation of LASER diodes. What are the effects of temperature on
the performance of a LASER diode? (8)
3. Explain the different lensing scheme available to improve the power coupling efficiency.(8)
4. Explain the fiber splicing techniques with necessary diagrams.(8)
5. Explain briefly the three key processes involved in the laser action .Describe for a fabry perot
resonator laser diode, modes and threshold conditions. Obtain its rate equations for steady
state output.(16)
6.What type of materials are used for optical sources. What are the advantages of double Hetro
structure. Compare surface emitting and edge emitting LED structures (8)
7. Derive an expression for the internal optical power level generated in LEDs.(8)
8. Draw and explain the different structures used to achieve carrier and optical confinement in
laser diodes. (8)
9. Discuss the effects of temperature on the performance of a laser diode. (4)
10. Give a brief account of the modulation of an LED. (4)
11. Derive expressions for the power coupled from a surface emitting LED into step index and
graded index fibers.(10)
12. Explain the mechanical misalignments that can occur between two joined fibers with
necessary diagrams. (6)
13. Explain the step involved in splicing the fiber. Discuss the various splicing techniques
employed between two fibers. (8)
14. Explain the lensing schemes used to improve optical source - to- fiber coupling efficiency
15. Explain the basic LED configurations used as optical source. Derive the expression for
quantum efficiency and optical power generated in LED’s.(10)
16. Explain the modulation process involved in LED and discuss its frequency response (6)
17. Compare LED with a LASER diode.
18. With the help of a neat diagram explain the construction and working of a surface emitting
LED?
19.A silicon p- i-n photodiode incorporated into an optical receiver has a quantum efficiency of
60% when operating at a wavelength of 0.9mm. The dark current is 3 nA and the load
resistance is 4 KΩ. The incident optical power is 200 nW and the post detection bandwidth of
the receiver is 5 MHZ. Calculate the root mean square (rms) shot noise and thermal noise
currents generated.
20.Draw and explain surface and edge emitting LEDs.
21.Explain any two injection laser structures with neat diagrams.
22.Draw the structures of SLED and ELED and explain their principle of operation.(8)
23.Draw the injection laser diode structure and explain lasing in it. ( 8)
24.Draw the structures of PIN and APD photo detectors and explain their operations.(8)
25.Derive the expressions for the SNS of both PIN and APD by incorporating all noise sources.
26. Draw and compare the construction and characteristics of PIN and avalanche photo diode.
UNIT -4
FIBER OPTIC RECEIVER AND MEASUREMENTS
PART A
PART B
1. A silicon p- i-n photodiode incorporated into an optical receiver has aquantum
efficiency of 60% at a wavelength of 0.9 µm.The dark current is 3 nA and load resistance is
4 KΩ. The incident optical power is 200nw and the receiver bandwidth is 5Mhz. Determine
(1) mean square quantum noise current,
(2) mean square dark current and
(3) mean square thermal noise current at a temperature of 20◦C. (8)
2.Draw and explain the operation of APD (8)
3. Derive an expression for the bit error rate of an optical digital receiver (10)
4. Discuss the different noise sources and disturbances in the optical
pulse detection mechanism (6)
5. Explain the operation of avalanche photodiode (10)
6. The quantum efficiency of a particular silicion RAPD is 80% for the detection of radiation at a
wavelength of 0.9 µm, when the incident optical power is 0.5 µW.The output current from the
device(after avalanche gain) is 11µA.Determine the multiplication factor of the photodiode under
these conditions. (6)
7 .Draw the circuit diagram of high impedance pre-amplifier and explain its operation.
8. Discuss the sources of errors in optical receivers (8)
9. Discuss with necessary expressions that different types of noise that affect the performance
of a photo detector (10)
11
10. When 3 ×10 photons each with a wavelength of 0.85µm is incident on the photodiode,
11
on the average 1.2×10 electrons are collected at the terminals of the device. Determine the
quantum efficiency and responsivity of the photodiode at 0.85µm.(6) ( N/ D 08)
11.Explain the operation of pre-amplifier built using a FET.
12. Discuss the noise and disturbances affecting the optical detection Systems.
13. Draw and explain the operation of high impedance FET and BJT pre- amplifiers. (M/J
14.Explain the following measurements.
I.Attenuation measurement using cut back techniques.
II. With suitable diagram, explain optical receiver operation and its performance.
15.Describe the dispersion and numerical measurements of fiber.
UNIT – 5
OPTICAL NETWORKS
PART A
PART B
1.Explain the significance of link power budget and rise time budget with one
illustration for each. (16)
2.Give a brief account of the principles of SONET (6)
3.Explain the principle of operation of Erbium doped fiber amplifiers (10)
4.Explain the principles of WDM .(8)
5. Explain the salient features of solitons using relevant expressions
and diagrams(16)
6. Discuss the concept of WDM with neat diagram (6)
7. Draw and explain the basic format of an STS-N SONET frame
8. Explain the amplification mechanism in EDFA. Discuss the possible configurations of EDFA
with neat diagram. (10)
9. Derive the expression for EDFA conversion efficiency and amplifier gain (6)
10. Explain the basic frame format structure and network architecture of SONET. (8)
11.Explain the operation of WDM components (8)
12. Explain the layers of SONET with neat sketches. (8)
13. Describe the operation of unidirectional and bidirectional WDM. (8)
14. Draw and explain the principle of operations of an EDFA. Describe the approaches
to achieve flatness in its gain.(8)
15. What are the key system requirements and characteristics required in analyzing a point- point
link? (6)
16.Write short notes on (A/M
(i) WDM (8)
(ii) SONET/SDH network.
17.Explain the architecture of SONET and discuss non- linear effects on
network Performance
18.Write short notes on
(a) Wavelength routed networks.
(b) Optical CDMA.
19.Explain the principle of solitons and discuss the soliton parameters with
necessary expressions and diagrams.
20. Write short notes with necessary diagrams on
(i) Optical CDMA.
(ii) WDM and EDFA system performance.
21. Explain the SA/ SA protocol and modified SA/SA protocol of broadcast and
select networks.(8)
22. What are the non- linear effects on network performance? Explain them briefly.(8)
23. Explain the layered architecture of SONET/SDH with neat diagra m. (8)
24. Write a detailed notes on optical CDMA and its applications. (8)
25. What is a ‘four-fiber BLSR ring in a SONET? Explain the reconfiguration of the same
during node or fiber failure. ( 8)
26. What is broadcast- and select multihop network? Explain. (8)
27. Write notes on solitons. (8)
28. Explain the following requirements for the design of an optically amplified WDM link:
i) Link Bandwidth
ii) Optical power requirements for a specific BER. (8)
Assignment Questions
1. An LED operating at 1550 nm has a spectral width of 5 mm. What is the pulse spreading in ns/km
due to material dispersion?. What is the pulse spreading when a laser diode having at 2 nm spectral
width is used?
2. How pulse broadening is occurring? Discuss pulse broadening in Graded Index Fibers.
3. Explain briefly the three key processes involved in the laser action .Describe for a fabry perot
Resonator laser diode, modes and threshold conditions. Obtain its rate equations for steady State
output.
4. The quantum efficiency of a particular silicon RAPD is 80% for the detection of radiation at a
wavelength of 0.9μm, when the incident optical power is 0.5μW.The output current from the device
(after avalanche gain) is 11μA.Determine the multiplication factor of the photodiode under these
conditions.
5. What is a ‘four-fiber BLSR ring in a SONET? Explain the reconfiguration of the same during node
or fiber failure.
UNIT 2
Instruction Level Parallelism
UNIT 3
Data-Level Parallelism
1. What is a vector processor?
2. Define vector mask registers
3. What is a stride?
4. What is a roofline model?
5. What are the primary components of VIMPS?
6. List the factors that depend on execution of vector operations
7. What is strip mining?
8. What is the limitation of VLIW processors?
9.Define a thread.
10. Define CUDA thread and thread block
11. What is loop carry dependency?
12. What is GPU?
13. Differentiate GPU and CPU.
14. What is SIMD?
15. What is scalar and vector register?
16. What is arithmetic intensity?
17. What is purpose multiple lane?
18. What is a VLIW processor and its advantages?
19.What is the function of Vector Mask Register?
UNIT 4
Thread Level Parallelism
PART –B Questions
UNIT I
1. State the Amdahlslaw,define speedup and derive the speedup equation
2. Explain in detail about the trends in technology
3. Explain in detail about the trends in power energy
4. Explain in detail about the trends in cost
5. Discuss about the Multicore era in detail
6. Describe the major factors that influence the cost of computer and how these factor are
changing over time
7. Discuss about the CPU performance parameters.
8. Discuss the classes of parallelism
9. Explain in detail about fundamentals of computer.
10. Explain the following term
a. Module reliability
b. Module availability
UNIT II
1. Explain how dynamic scheduling helps in overcoming data hazards caused by instruction level
parallelism.
2. Write a detailed note on Hardware-based speculation in instruction level parallelism
3. Discuss about the benefits and limitations of static and dynamic branch prediction
4. Briefly explain how to overcome data hazards with dynamic scheduling using Tomasulas
approach.
5. Discuss about any two compiler techniques for exposing ILP in detail
6. Explain how ILP is achieved using dynamic scheduling.
7. Explain the static and dynamic branch prediction schemes in detail.
8. Explain the Tomasulo’s Approach used in dynamic scheduling for overcoming data hazards
9. Describe how the compiler technology can be used to improve the performance of instruction
level parallelism.
10. What is instruction level parallelism? Explain in detail about the various dependences caused in
ILP
11. Briefly compare hardware and software speculation mechanisms
UNIT III
1. Discuss in detail the vector architecture, vector operations and enhancement of the
performance.
2. Discuss in detail the vector instruction set.
3. Explain in detail about execution time of vector architecture.
4. Explain in detail about GPU
5. Discuss about vector architecture in detail
6. Explain Vector Architecture (VMIPS),vector execution time, Vector Multiple Lanes, Vector
Mask Register, Memory Banks in detail.
7. Explain Roofline Visual Performance model
8. Explain NVIDIA GPU Computational Structures, GPU Instruction Set Architecture,
Conditional branching n detail.
9. Discuss about FERMI Architecture in detail and compare Vector Architecture and GPU’s
,Multimedia SIMD and GPU’s
10. How to enhance Loop Level parallelism? Discuss in detail.
11. How to achieve Synchronization and locks for achieving Coherence in detail.
UNIT-IV
1. Explain the distributed memory architecture with different message passing mechanisms.
2. With neat block diagram explain the centralized shared memory multiprocessor architecture.
3. Discuss the Performance of symmetric shared memory multiprocessor and their effects with
example
4. Discuss the importance of various models of memory consistency.
5. Explain the Directory –based cache coherence protocol in distributed shared memory
architecture.
6. Explain the basic architecture of a distributed memory multiprocessor system.
7. Explain various memory consistency models in detail
8. Describe the basic structure of a centralized shared-memory multiprocessor in detail
9. What are the advantages and disadvantages of distributed-memory Multiprocessors? Describe
the basic structure of a distributed memory multiprocessor in detail
10. Discuss about the synchronization techniques used in multiprocessor systems.
11. Discuss the various cache-coherence protocols used in symmetric shared memory architecture
UNIT V
EC-6016 O PT O E L E C T R O N I C D E V I C E S
UNIT-I
Part-A:
1. Define optoelectronics.
2. Define optoelectronic devices.
3. What do you meant by corpuscular theory?
4. Give the expression for wave nature of light.
5. Define Snell’s law.
6. What do you meant by the term interference?
7. What is meant by diffraction?
8. What do you meant by the term wavefront?
9. What are light sources and name the different types of light sources?
10. What are blackbody sources?
11. What are line sources?
12. What do you understand by the quantum mechanical concepts of light?
13. What do you meant by semiconductors and name the different types of semiconductors?.
14. What are intrinsic semiconductors?
15. What are extrinsic semiconductors?
16. List out the major differences between intrinsic and extrinsic semiconductors.
17. Define radiative recombination and non-radiative recombination process.
18. Name the two ways in which recombination can occur?
Part-B:
1. Derive and explain in detail the Schrödinger’s wave equation.
2. Derive the electron energy in one electron atom using wave equation.
3. Describe in detail the position of Fermi level in semiconductor at equilibrium.
4. Explain in detail about Hall Effect
5. Explain the various parameters and characteristics of
semiconductor Hetero junction materials.
UNIT-II
Part-A:
Part-B :
1. Explain Emission, Absorption, and Radiation of Laser
2. Explain the construction and working of various Display devices.
3. Explain the following terms.
(i).Photo luminescence.
(ii).Cathode luminescence.
(iii).Electro luminescence.
(iv).Injection luminescence.
4. Describe about the Mode locking of semiconductor laser.
5. Explain in detail the application of laser.
6. Discuss about the various Classification of laser.
UNIT-III
PART-A
1. Explain thermal detectors.
2. What is the internal quantum efficiency of photodetector?
3. Explain photoconductors.
4. What do you mean by Kerr effect?
5. Name the different types of thermal detectors?
6. Define photodetectors.
7. What are the different types of photodetectors?
8. What are the two types of photoconductors?
9. What are the factors that limit the response time of photodiodes?
10. Define responsivity.
11. Define noise equivalent power.
12. Discuss briefly about pin photodiode.
13. How Schottky photodiodes are made?
14. Define Pockels effect.
15. What is a bolometer?
16. What is the working principle of thermal detectors?
17.Define signal to noise ratio in photoconductors.
18. How is a photodiode designed and why it is
designed?
19. What are the various processing steps taking place inside a photo detector?
PART-B
1. Discuss in detail about the construction and working of photoconductors, Also explain its
classification.
2. Compare the noise performance of Photoconductor and PIN photodiode.
3. Discuss in detail about the construction and working of PIN photodiode.
4. Explain in detail about Hetero junction diode.
5. Explain in detail about avalanche photodiode.
UNIT IV
PART-A
PART-B
UNIT-IV
1. How guided waves can be formed?
2. What are optoelectronic integrated circuits?
3. What are active guided wave devices and give examples?
4. Distinguish between hybrid and monolithic integration.
5. Mention the applications of optoelectronic integrated circuits
6. List out the advantages of optoelectronic integrated circuits.
7. Mention the types of integrated transmitters.
8. Mention the types of integrated receivers.
9. Define waveguide.
10. Explain briefly about directional coupler.
11. What do you meant by front-end photo receivers?
12. What do you meant by MODFET?
13. Write briefly about hybrid integration.
14. Write briefly about monolithic integration.
PART-B :
ASSIGNMENT QUESTIONS
Constant is given in μm. Find (a) the amplitude,(b) the wavelength,(c) the angular frequency, and (d)
The displacement at time t=0 and z=4μm.
2. Consider an LED having a minority carrier lifetime of 5ns.Find the 3-dB optical bandwidth and
the 3-dB electrical bandwidth.
3. Consider a quantum-noise-limited analog optical fiber system that uses a PIN diode with a
responsivity of 0.85 A/W at 1310nm.Assume the system uses a modulation index of 0.6 and operates
in a 40-MHZ bandwidth.If we neglect detector dark current, what is the signal-to-noise ratio when the
incident optical power at the receiver is-15dBm?
4. Compare the system margins for 40-km and 80-km long haul OC-48 links at 1550 nm for the
minimum and maximum source output ranges.Assume there is a 1.5-dB coupling loss at each end of
the link?
5. (a) Calculate how many 64-kb/s voice channels and can be carried by an STS-3,STS-48, and
STS-192 system? (b) How many 20-Mb/s digitized video channels can be transported over these
systems?
1. Define Image?
2. What is Dynamic Range?
3. Define Brightness?
4. Define Tapered Quantization?
5. What do you meant by Gray level?
6. What do you meant by Color model?
7. List the hardware oriented color models?
8. What is Hue of saturation?
9. List the applications of color models?
10. What is Chromatic Adoption?
11. Define Resolutions?
12. What is meant by pixel?
13. Define Digital image?
14. What are the steps involved in DIP?
15. What is recognition and Interpretation?
16. Specify the elements of DIP system?
17. Explain the categories of digital storage?
18. What are the types of light receptors?
19. Differentiate photopic and scotopic vision?
20. How cones and rods are distributed in retina?
21. Define subjective brightness and brightness adaptation?
22. Define weber ratio
23. What is meant by machband effect?
24. What is simultaneous contrast?
25. What is meant by illumination and reflectance?
26. Define sampling and quantization
27. Find the number of bits required to store a 256 X 256 image with 32 gray levels?
28. Write the expression to find the number of bits to store a digital image?
30. What do you meant by Zooming of digital images?
31. What do you meant by shrinking of digital images?
32. Write short notes on neighbors of a pixel.
33. Explain the types of connectivity.
34. What is meant by path?
35. Give the formula for calculating D4 and D8 distance.
1. Explain the types of gray level transformation used for image enhancement.
2. What is histogram? Explain histogram equalization.
3. Discuss the image smoothing filter with its model in the spatial domain.
4. What are image sharpening filters? Explain the various types of it.
5. Explain spatial filtering in image enhancement.
6. Explain image enhancement in the frequency domain.
7. Explain the procedure involved in enhancing the image using histogram specification.
8. Explain the various spatial domain filter approaches for image enhancement.
9. Explain the various frequency domain filter approaches for image enhancement.
ASSIGNMENT QUESTIONS
TWO MARKS
UNIT-1
EMBEDDED COMPUTING
12.What are the points to be considered while connecting power supply rails with embedded system?
17.Define microprocessor.
26.What are the various models used in the design of an embedded system?
25.Define CPCI?
30.What is I2C?
3.Define scheduling.
6.What is schedulability?
UNIT 1V
2.Define process.
7.What is a thread?
10.Define Semaphore.
11.Define Mutex.
20.What is RTOS?
26. What are the three methods by which an RTOS responds to a hardware source call on interrupt?
32. What are the real time system level functions in UC/OS II? State some?
UNIT V
CASE STUDY
1. What is a PIC?
5. Define pseudo-code.
ASSIGNMENT QUESTIONS
16 mark Questions:
1. Explain in detail about low frequency parameters.
2. Discuss about high frequency parameters.
3. How microwave junction can be described by scattering matrix. Derive the scattering matrix
relation between the input and output of an nxn junction?
4. Discuss about various losses available in microwave?
5. Explain the symmetry property in a reciprocal network.
6. Explain the unitary property in a lossless junction.
7. Explain the transmission matrix for 2-port networks.
8. State and explain the properties of S-parameters.
9. Discuss about behavior of wire at RF with neat diagrams.
10. Write in detail about resistors and its types.
11. Give a detailed note on Inductors.
12. Explain in detail about capacitors.
UNIT-2
RF AMPLIFIERS AND MATCHING NETWORKS
1) Write the function of matching networks?
2) What is function of input and output matching networks?
3) What are the parameters used to evaluate the performance of an amplifier?
4) Define transducer power gain.
5) Define unilateral power gain.
6) What is available Power Gain (GA)at Load?
7) Define Operating Power Gain.
8) Write a short note on feedback of RF circuit.
9) Define unconditional stability.
10) Define noise figure.
16 mark Questions:
1. Discuss various aspects of amplifier-power relations for RF transistor amplifier design.
2. Explain stability considerations for RF transistor amplifier design.
3. Explain various stabilization methods.
4. Discuss gain considerations for RF amplifier.
5. Explain in detail about unconditional stability.
UNIT-3
PASSIVE AND ACTIVE MICROWAVE DEVICES
1) Define microwave.
2) What are the major bands available in microwave frequencies?
3) Enumerate the basic advantage of microwaves.
4) Write the applications of microwaves.
6) Define a microwave junction.
7) Why is magic tee referred to as E-H tee?
8) Define scattering matrix.
9) What are scattering coefficients?
10) What is waveguide?
11) Why, the S- parameters are used in microwaves?
12) Write the properties of [S] matrix.
13) Write the unitary property for a lossless junction.
14) What is H-plane Tee?
15) What is E-plane Tee?
16) Define tee junction.
17) Name some uses of waveguide tees.
18) What are the types of waveguide tees?
19) Define difference arm.
20) What is sum arm?
21) Write the applications of magic tee.
22) What is hybrid ring?
23) What do you meant by hybrid junction?
24) Why bends are used?
25) Name some uses of waveguide twists.
26) Define gradual twists.
27) Give a note on directional couplers.
28) Define coupling factor(C).
24) Define directivity of directional coupler.
25) What do you meant by isolation? i b
16 mark Questions:
1. Discuss about microwave frequency bands.
2. Write the advantage and applications of microwave.
3. Explain a basic microwave system with neat diagram.
4. How microwave junction can be described by scattering matrix. Derive the scattering matrix relation
between the input and output of a n x n junction?
5. What are waveguide tees? What are its applications? State different types.
6. Explain the operation of H-plane tee and derive the scattering matrix for it.
7. Explain the operation of E-plane tee and derive the scattering matrix for it.
8. Explain the operation of magic tee and derive the scattering matrix for it.
9. Write about the relation between [S] [Z] and [Y] matrix.
10. Describe in detail the operation of a 2-hole directional coupler.
11. With a neat sketch explain the following:
i. Corners ii. Bends iii. Twists
12. Explain about hybrid circuit. State its applications.
13. Explain directional coupler construction, principle of working and applications.
14. Drive the [S] matrix for directional coupler.
15. With neat diagrams explain different types of directional coupler.
16. What are performance parameters of directional coupler?
17. Explain S-matrix for 2-port networks.
18. State and explain the properties of S-parameters.
19. What are ferrite devices? What are its compositions and application?
20. Explain the construction and working of four port circulator with reference to Faraday rotation
principle.
21. Explain the construction working and application of isolator based on Faraday rotation.
22. Explain the operation of gyrator with neat diagram.
UNIT-4
MICROWAVE GENERATION
16 mark Questions:
1. Explain the constructional details and principle of
operation of GaAs MESFET with neat diagrams and
characteristic curves.
2. Give the physical structure and equivalent diagram of
microwave field effect transistors.
3. Explain the operation of microwave bipolar transistor
with neat diagrams.
4. Explain the operation of HEMT with neat diagrams and
characteristic curves.
5. Explain the operation of MOSFET with neat diagrams
and characteristic curves.
6. Explain the construction and working of tunnel diode.
7. Write advantages and applications of tunnel diode.
8. Explain the construction and working of varactor diode
with neat diagram.
9. What are the applications of varactor diode?
10. Explain the field equations of circular waveguide
resonator.
11. Explain in detail about Gunn diode with neat diagram?
12. Explain Ridley Watkins Hilsun (RHW) theory with
the help of two valley modal.
13. Explain in detail about high field domain.
14. Describe the operating principles of LSA diode?
15. Describe the modes of operation for Gunn diode?
16. Explain the construction and operation of Read diode.
17. What are avalanche transit time device? Explain the
operation, construction and applications of the following
devices.
(1) IMPATT
(2) TRAPATT
18. Explain the theory of a resistance amplifier?
19. What are parametric devices? Explain the working of a
parametric up converter and a down converter?
20. Derive the Manley Rowe power relations. What are
the conditions for parametric up converter and down
converter?
21. Describe the applications of the parametric amplifiers
22. Explain (1) Degenerate paramp (2) Non
degenerate paramp.
23. Explain the fabrication techniques of a monolithic
microwave integrated circuit.
24. List out the basic materials required for the
manufactured of MMIC.
25. Discuss the discrete, integrated and monolithic
microwave integrated circuits?
26. List the basic characteristics required for an ideal
substrate material.
27. List the basic properties provided by ideal conductor,
dielectric and resistive materials used in MMICs.
28. Describe the MMIC techniques.
UNIT-5
MICROWAVE MEASUREMENTS
16 Mark questions:
1. What is velocity modulation? Explain how velocity
modulation is utilized in klystron.
2. Derive an expression for the efficiency of a two cavity
klystron amplifier.
3. What are the characteristics and applications of klystron
amplifier?
4. What is klystron? Describe its operation and obtain an
expression for its power output.
5. Derive the power output for two cavity klystron
amplifier.
6. Derive the expression for optimum distance of klystron
in bunching process.
7. Draw and explain the operation of klystron oscillator.
8. Derive the expression for velocity modulation in
klystron oscillator.
9. What are the assumptions made when analysis a two-
cavity klystron.
10. Explain the working of a TWT amplifier with neat
sketch.
11. Write the advantages and applications of TWT.
12. Derive Hull cutoff condition with respect to
magnetron.
13. Explain the working of a magnetron with p - mode
oscillation.
14. Explain the construction and working of cylindrical
magnetron.
15. Derive the expression for cyclotron angular frequency
of cylindrical magnetron.
16. Derive the expression for power output and efficiency
of cylindrical magnetron.
17. Write short notes on
a. Low VSWR b. High VSWR
18. Explain the attenuation loss measurement with neat
diagram?
19. Explain about power meter using double bridge?
20. Explain high power measurements by calorimetric
method?
21. Explain the method of measuring impedance of a given
load, with suitable diagram?
22. Explain frequency and wavelength measurements with
neat diagrams?
23. Write short notes on
a. Average power
b. Bolometer sensor
c. Schottky Barrier Diode sensor
d. Thermocouple sensor
Assignment Questions