An integrated circuit is a miniature electronic circuit fabricated on a single crystal silicon wafer. It contains both active components like transistors and diodes and passive components like resistors and capacitors. The fabrication of ICs involves several processes like wafer preparation, oxidation, photolithography, diffusion, metallization, and testing. Photolithography is used to transfer circuit patterns onto each layer of the IC using a photomask, photoresist, exposure to light, and etching. The basic steps are repeated for each layer to build up the complete IC through patterning of doped regions, insulators, polysilicon, and metal layers. Major Indian fabrication facilities include Bharat Electronics Limited, SITAR, and Semiconductor
An integrated circuit is a miniature electronic circuit fabricated on a single crystal silicon wafer. It contains both active components like transistors and diodes and passive components like resistors and capacitors. The fabrication of ICs involves several processes like wafer preparation, oxidation, photolithography, diffusion, metallization, and testing. Photolithography is used to transfer circuit patterns onto each layer of the IC using a photomask, photoresist, exposure to light, and etching. The basic steps are repeated for each layer to build up the complete IC through patterning of doped regions, insulators, polysilicon, and metal layers. Major Indian fabrication facilities include Bharat Electronics Limited, SITAR, and Semiconductor
An integrated circuit is a miniature electronic circuit fabricated on a single crystal silicon wafer. It contains both active components like transistors and diodes and passive components like resistors and capacitors. The fabrication of ICs involves several processes like wafer preparation, oxidation, photolithography, diffusion, metallization, and testing. Photolithography is used to transfer circuit patterns onto each layer of the IC using a photomask, photoresist, exposure to light, and etching. The basic steps are repeated for each layer to build up the complete IC through patterning of doped regions, insulators, polysilicon, and metal layers. Major Indian fabrication facilities include Bharat Electronics Limited, SITAR, and Semiconductor
An integrated circuit is a miniature electronic circuit fabricated on a single crystal silicon wafer. It contains both active components like transistors and diodes and passive components like resistors and capacitors. The fabrication of ICs involves several processes like wafer preparation, oxidation, photolithography, diffusion, metallization, and testing. Photolithography is used to transfer circuit patterns onto each layer of the IC using a photomask, photoresist, exposure to light, and etching. The basic steps are repeated for each layer to build up the complete IC through patterning of doped regions, insulators, polysilicon, and metal layers. Major Indian fabrication facilities include Bharat Electronics Limited, SITAR, and Semiconductor
cost electronic circuit consisting of active and passive components fabricated together on a single crystal of silicon. The active components are transistors and diodes and passive components are resistors and capacitors.
2 Advantages of integrated circuits 1. Miniaturization and hence increased equipment density. 2. Cost reduction due to batch processing. 3. Increased system reliability due to the elimination of soldered joints. 4. Improved functional performance. 5. Matched devices. 6. Increased operating speeds. 7. Reduction in power consumption
14 What is silicon processing? Process of growing, depositing & patterning layers of different materials
15 Different layers comprising an IC
• Doped regions: Concentration and
type ( P/N) Source, Drain, Collector, Base, Emitter, Contacts • Insulators: SiO2, Si3N4 – Gate oxide, Passivation • Polysilicon: Gate • Metal: Al, Au, Silicides: Contacts, Interconnects 16 17 18 19 Lithography Lithography: process used to transfer patterns to each layer of the IC Lithography sequence steps: • Designer: – Drawing the “layer” patterns on a layout editor • Silicon Foundry: – Masks generation from the layer patterns in the design data base – Printing: transfer the mask pattern to the wafer surface – Process the wafer to physically pattern each layer of the IC 20 Lithography • The surface to be patterned is: 1. Photoresist coating Photoresist
– spin-coated with photoresist
– the photoresist is dehydrated in an SiO2 Substrate oven (photo resist: light-sensitive organic polymer) 2. Exposure Opaque Ultra violet light • The photoresist is exposed to ultra violet light: Mask
– For a positive photoresist exposed Unexposed Exposed
areas become soluble and non exposed areas remain hard • The soluble photoresist is Substrate
chemically removed 3. Development
(development). – The patterned photoresist will now serve as an etching mask for the Substrate SiO2 21 • The SiO2 is etched away 4. Etching leaving the substrate exposed: – the patterned resist is used as the etching mask Substrate • Ion Implantation: – the substrate is subjected to 5. Ion implant
highly energized donor or
acceptor atoms – The atoms impinge on the surface and travel below it – The patterned silicon SiO2 Substrate serves as an implantation mask 6. After doping • The doping is further driven into the bulk by a thermal cycle diffusion Substrate
22 •The lithographic sequence is repeated for each physical layer used to construct the IC. The sequence is always the same: –Photoresist application –Printing (exposure) –Development –Etching
23 Patterning a layer above the silicon surface 1. Polysilicon deposition 4. Photoresist development Polysilicon
Substrate Substrate 3. Exposure UV light 6. Final polysilicon pattern
Substrate Substrate
24 • Etching: – Process of removing unprotected material – Etching occurs in all directions – Horizontal etching causes an under cut – “preferential” etching can be used to minimize the undercut • Etching techniques: – Wet etching: uses chemicals to remove the unprotected materials – Dry or plasma etching: uses ionized gases rendered chemically active by an rf-generated 25 plasma 26 27 28 29 30 31 32 33 34 35 Fabs in our country
