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Basic Electricity Basic Electricity Basic Electricity Basic Electricity

The document discusses basic electricity, soldering technique, handling electronic assemblies safely, and preventing electrical overstress and electrostatic discharge damage. It explains the need to take precautions such as using antistatic materials and protective workstations grounded to earth when handling electrostatic discharge sensitive components. Damage can occur from static discharges too small to feel but that exceed components' minimum susceptibility voltages.

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yao nestor
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0% found this document useful (0 votes)
83 views19 pages

Basic Electricity Basic Electricity Basic Electricity Basic Electricity

The document discusses basic electricity, soldering technique, handling electronic assemblies safely, and preventing electrical overstress and electrostatic discharge damage. It explains the need to take precautions such as using antistatic materials and protective workstations grounded to earth when handling electrostatic discharge sensitive components. Damage can occur from static discharges too small to feel but that exceed components' minimum susceptibility voltages.

Uploaded by

yao nestor
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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Basic Electricity

1 Initials
22 July 2002
Basic Electricity

2 Initials
22 July 2002
Basic Electricity

3 Initials
22 July 2002
Soldadura

4 Initials
22 July 2002
Soldadura

5 Initials
22 July 2002
Soldadura

6 Initials
22 July 2002
Soldadura

7 Initials
22 July 2002
Basic Electricity
CONCLUTION.
SOLDERING TECHNIQUE BASIC STEP

• Clean the tip (use damp wiping pad)


• Place the tip at the point the component lead or wire meets the
terminal or circuit board foil.
• As all parts of the connection become hot enough to solder, feed the
solder at point away from the tip.
• As solder onto the work.
• Remove the solder first.
• Remove the iron.
• Process should take 2 - 5 sec.
• Look for a smooth and shiny connection.
• Grainy and dull connections should be reworked.

8 Initials
22 July 2002
Handling Electronic Assemblies

Electrostatic discharge (ESD) is the rapid discharge


of a voltage into an electronic assembly.
Electrostatic discharge sensitive (ESDS) component
found on the assembly and the amount of intensity of
current generated by the discharge will determine if
electrostatic overstress (EOS) or the component
failure take place

9 Initials
22 July 2002
Electrical Overstress (EOS) and Electrostatic
Discharge (ESD) Damage prevention
! The Electrical overstress damage is caused by
unwanted electrical energy, such spike occurring
while soldering irons, solder extractors, testing
instrument and other electrically operated equipment
has been used to handle it.
! Some electronic devices are most sensitive to EOS
damage than others.
! Damage from (EOS) is often impossible to distinguish
from that done by (EDS)
10 Initials
22 July 2002
Electrical Overstress (EOS) and Electrostatic
Discharge (ESD) Damage prevention

! Before handling ESDS component, equipment should be carefully te


tested
sted to
ensure that it does not generate damage causing spike. Current research
indicates that spike level less than 0.5 volt is acceptable.

! Static Charges are created when non-


non-conductive material are separated,
(when plastic bags are picked up or opened, when someone wearing
plastic or soled shoes is walking on carpeting, etc), when frict
friction
ion occurs
between articles of synthetic clothing, or when plastic solder is
i s removed.
Even the air molecules from an air nozzle striking one another are
are capable
of developing a static charge under the proper conditions.
conditions

11 Initials
22 July 2002
Approximate EOS / ESD Damage
Range for Some Components
Device Type Range of Minimun
EOS / ESD
Susceptibility Volts
VMOS 30 to 1800
MOSFET 100 to 200
GaAsFET 100 to 300
EPROM 100 to PLUS
JFET 140 to 7000
SAW 150 to 500
OP AMP 190 to 2500
CMOS 250 to 3000
Schottcky Diodes 300 to 2500
Film Resistors (Thick, Thin) 300 to 3000
Bipolar Transistors 380 to 7800
ECL (PDC Board Level) 500 to 1500
SCR 680 to 1000
Schottcky TTL 100 to 2500
12 Initials
22 July 2002
Electrical Overstress (EOS) and Electrostatic
Discharge (ESD) Damage prevention

! Destructive statics charges are often induced on nearby


conductors, such as human skin, and discharged as sparks
passing between conductors, this can happen when a printed
board assembly is touched by a person having a static charge
potential. The electronic assembly can be damaged as the
discharge passes through the conductive pattern to a static
sensitive component. Static discharges may be too low to be felt
by humans (less than 3500 Volts) and still damage ESDS
components

13 Initials
22 July 2002
Antistatics Materials

! Sensitive components and assemblies must be


enclosed in conductive static-shielding bags, boxes
or wraps when not worked on unless protected.

! ESD sensitive components must be removed from


protective enclosure only when a static dissipative or
antistatic work stations.

14 Initials
22 July 2002
Antistatic Work Station

! EOS/ESD Save Work Station prevent damage to


sensitive components from spikes and static
discharges. Save work station should include EOS
damage prevention by avoiding spike generated
repair. Equipment must not generate false detrimental
energy. Soldering iron, solder extractors and testing
instruments can generate spike with enough energy to
destroy extremely sensitive components and seriously
degrade others with protective internal circuit.

15 Initials
22 July 2002
Antistatic Work Station

! For ESD Safety, a Path to ground must be provided for


static charges that would otherwise be discharged on
the ESD component generate serious damage or
destroy it.
! ESD Safely work station have a static dissipative or
antistatic work surfaces connected to ground,
example of the static dissipative or antistatic work
station are shown in the next table.

16 Initials
22 July 2002
Antistatic Work station

1M ohm 10%
EOS Protectives tray Shunts

Personal EOS protective table top


Wrist Strap

1M ohm 10%

1M ohm 10%
EOS protective floor Mat.

17 Initials
22 July 2002
Acceptable EOS/ESD Workstation

! With regular time must be check and clean


connections between the ground cable, because
grown contact could be generated from humidity and
dust.
! Particular care must be taken with the three ground
contacts between the workstation and ground
because floating point could generate 80 - 100 volt.
This voltage is enough to make injury personnel or
burn all the components on the board.
18 Initials
22 July 2002
Acceptable EOS/ESD Workstation

! The use of break switch between the workstation and


the ground point is widely recommended.
! Physical Damage: Improper handing can cause
damage to the components, connectors and PCB.
! Contamination:
Contamination Contamination by handling without
some form of protection causes soldering and coating
problem for example: body salt, oils and unauthorized
hand creams are typical contaminants.

19 Initials
22 July 2002

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