Basic Electricity Basic Electricity Basic Electricity Basic Electricity
Basic Electricity Basic Electricity Basic Electricity Basic Electricity
1 Initials
22 July 2002
Basic Electricity
2 Initials
22 July 2002
Basic Electricity
3 Initials
22 July 2002
Soldadura
4 Initials
22 July 2002
Soldadura
5 Initials
22 July 2002
Soldadura
6 Initials
22 July 2002
Soldadura
7 Initials
22 July 2002
Basic Electricity
CONCLUTION.
SOLDERING TECHNIQUE BASIC STEP
8 Initials
22 July 2002
Handling Electronic Assemblies
9 Initials
22 July 2002
Electrical Overstress (EOS) and Electrostatic
Discharge (ESD) Damage prevention
! The Electrical overstress damage is caused by
unwanted electrical energy, such spike occurring
while soldering irons, solder extractors, testing
instrument and other electrically operated equipment
has been used to handle it.
! Some electronic devices are most sensitive to EOS
damage than others.
! Damage from (EOS) is often impossible to distinguish
from that done by (EDS)
10 Initials
22 July 2002
Electrical Overstress (EOS) and Electrostatic
Discharge (ESD) Damage prevention
11 Initials
22 July 2002
Approximate EOS / ESD Damage
Range for Some Components
Device Type Range of Minimun
EOS / ESD
Susceptibility Volts
VMOS 30 to 1800
MOSFET 100 to 200
GaAsFET 100 to 300
EPROM 100 to PLUS
JFET 140 to 7000
SAW 150 to 500
OP AMP 190 to 2500
CMOS 250 to 3000
Schottcky Diodes 300 to 2500
Film Resistors (Thick, Thin) 300 to 3000
Bipolar Transistors 380 to 7800
ECL (PDC Board Level) 500 to 1500
SCR 680 to 1000
Schottcky TTL 100 to 2500
12 Initials
22 July 2002
Electrical Overstress (EOS) and Electrostatic
Discharge (ESD) Damage prevention
13 Initials
22 July 2002
Antistatics Materials
14 Initials
22 July 2002
Antistatic Work Station
15 Initials
22 July 2002
Antistatic Work Station
16 Initials
22 July 2002
Antistatic Work station
1M ohm 10%
EOS Protectives tray Shunts
1M ohm 10%
1M ohm 10%
EOS protective floor Mat.
17 Initials
22 July 2002
Acceptable EOS/ESD Workstation
19 Initials
22 July 2002