Data Sheet: BYM56 Series
Data Sheet: BYM56 Series
Data Sheet: BYM56 Series
DATA SHEET
handbook, 2 columns
M3D118
BYM56 series
Controlled avalanche rectifiers
Product specification 1996 May 24
Supersedes data of April 1992
Philips Semiconductors Product specification
,
and fatigue free as coefficients of
• Glass passivated Rugged glass package, using a high
expansion of all used parts are
• High maximum operating temperature alloyed construction.
matched.
temperature
• Low leakage current
• Excellent stability
2/3 page k(Datasheet) a
• Guaranteed avalanche energy
absorption capability
MAM104
• Available in ammo-pack
• Also available with preformed leads Fig.1 Simplified outline (SOD64) and symbol.
for easy insertion.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VRRM repetitive peak reverse voltage
BYM56A − 200 V
BYM56B − 400 V
BYM56C − 600 V
BYM56D − 800 V
BYM56E − 1000 V
VRWM crest working reverse voltage
BYM56A − 200 V
BYM56B − 400 V
BYM56C − 600 V
BYM56D − 800 V
BYM56E − 1000 V
VR continuous reverse voltage
BYM56A − 200 V
BYM56B − 400 V
BYM56C − 600 V
BYM56D − 800 V
BYM56E − 1000 V
IF(AV) average forward current Ttp = 60 °C; − 3.5 A
lead length = 10 mm;
averaged over any 20 ms
period; see Figs 2 and 4
Tamb = 65 °C; PCB mounting − 1.4 A
(see Fig.9); averaged over any
20 ms period; see Figs 3 and 4
IFSM non-repetitive peak forward current t = 10 ms half sinewave; − 80 A
Tj = Tj max prior to surge;
VR = VRRMmax
1996 May 24 2
Philips Semiconductors Product specification
ELECTRICAL CHARACTERISTICS
Tj = 25 °C; unless otherwise specified.
THERMAL CHARACTERISTICS
Note
1. Device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper ≥40 µm, see Fig.9.
For more information please refer to the “General Part of associated Handbook”.
1996 May 24 3
Philips Semiconductors Product specification
GRAPHICAL DATA
MBG037 MBG058
5.0 2.0
handbook, halfpage handbook, halfpage
IF(AV) IF(AV)
(A) (A)
4.0 1.6
3.0 1.2
2.0 0.8
1.0 0.4
0 0
0 40 80 120 160 200 0 40 80 120 160 200
Ttp (oC) Tamb (oC)
Fig.2 Maximum permissible average forward Fig.3 Maximum permissible average forward
current as a function of tie-point temperature current as a function of ambient temperature
(including losses due to reverse leakage). (including losses due to reverse leakage).
MGC746 MSA873
5 200
handbook, halfpage handbook, halfpage
P a=3 2.5 2 1.57
(W) Tj
1.42
4 (°C)
100
2
A B C D E
1
0
0 1 2 3 4 0
IF(AV) (A) 0 400 800 1200
VR (V)
1996 May 24 4
Philips Semiconductors Product specification
MBG046 MGC734
16 3
10halfpage
handbook, halfpage handbook,
IF
(A) IR
(µA)
12 2
10
max
8 10
4 1
0 10 −1
0 1 2 0 40 80 120 160 200
VF (V)
Tj (oC)
Fig.6 Forward current as a function of forward Fig.7 Reverse current as a function of junction
voltage; maximum values. temperature; maximum values.
MBG027
10 2
handbook, halfpage
50
handbook, halfpage
25
Cd
(pF)
10 50
3
1
3
1 10 102 VR (V) 10
MGA200
f = 1 MHz; Tj = 25 °C.
Dimensions in mm.
Fig.8 Diode capacitance as a function of reverse
voltage; typical values. Fig.9 Device mounted on a printed-circuit board.
1996 May 24 5
Philips Semiconductors Product specification
1Ω
50 Ω 0
t
0.25
0.5
IR
(A)
MAM057
1.0
Fig.10 Test circuit and reverse recovery time waveform and definition.
1996 May 24 6
Philips Semiconductors Product specification
,
PACKAGE OUTLINE
4.5 MBC049
max 28 min 5.0 max 28 min
Dimensions in mm.
Fig.11 SOD64.
DEFINITIONS
1996 May 24 7