250 Ma Low Quiescent Current LDO Regulator: Features: Description
250 Ma Low Quiescent Current LDO Regulator: Features: Description
250 Ma Low Quiescent Current LDO Regulator: Features: Description
MCP1702
VIN VOUT
Error Amplifier
+VIN
Voltage
-
Reference
+
Overcurrent
Overtemperature
GND
MCP1702
VOUT
3.3V
VOUT
VIN IOUT
VIN COUT 50 mA
9V + 1 µF Ceramic
CIN GND
Battery 1 µF Ceramic
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise specified, all limits are established for VIN = VOUT(MAX) + VDROPOUT(MAX), Note 1,
ILOAD = 100 µA, COUT = 1 µF (X7R), CIN = 1 µF (X7R), TA = +25°C.
Boldface type applies for junction temperatures, TJ of -40°C to +125°C. (Note 7)
Parameters Sym Min Typ Max Units Conditions
Input / Output Characteristics
Input Operating Voltage VIN 2.7 — 13.2 V Note 1
Input Quiescent Current Iq — 2.0 5 µA IL = 0 mA
Maximum Output Current IOUT_mA 250 — — mA For VR 2.5V
50 100 — mA For VR < 2.5V, VIN 2.7V
100 130 — mA For VR < 2.5V, VIN 2.95V
150 200 — mA For VR < 2.5V, VIN 3.2V
200 250 — mA For VR < 2.5V, VIN 3.45V
Output Short Circuit Current IOUT_SC — 400 — mA VIN = VIN(MIN) (Note 1), VOUT = GND,
Current (average current) measured
10 ms after short is applied.
Output Voltage Regulation VOUT VR-3.0% VR±0.4% VR+3.0% V Note 2
VR-2.0% VR±0.4% VR+2.0% V
VR-1.0% VR±0.4% VR+1.0% V 1% Custom
VOUT Temperature TCVOUT — 50 — ppm/°C Note 3
Coefficient
Line Regulation VOUT/ -0.3 ±0.1 +0.3 %/V (VOUT(MAX) + VDROPOUT(MAX))
(VOUTXVIN) VIN 13.2V, (Note 1)
Load Regulation VOUT/VOUT -2.5 ±1.0 +2.5 % IL = 1.0 mA to 250 mA for VR 2.5V
IL = 1.0 mA to 200 mA for VR 2.5V,
VIN = 3.45V (Note 4)
Note 1: The minimum VIN must meet two conditions: VIN2.7V and VIN VOUT(MAX) + VDROPOUT(MAX).
2: VR is the nominal regulator output voltage. For example: VR = 1.2V, 1.5V, 1.8V, 2.5V, 2.8V, 3.0V, 3.3V, 4.0V, or 5.0V. The
input voltage VIN = VOUT(MAX) + VDROPOUT(MAX) or VIN = 2.7V (whichever is greater); IOUT = 100 µA.
3: TCVOUT = (VOUT-HIGH - VOUT-LOW) *106 / (VR * Temperature), VOUT-HIGH = highest voltage measured over the
temperature range. VOUT-LOW = lowest voltage measured over the temperature range.
4: Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output
voltage due to heating effects are determined using thermal regulation specification TCVOUT.
5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its measured
value with an applied input voltage of VOUT(MAX) + VDROPOUT(MAX) or 2.7V, whichever is greater.
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power
dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained
junction temperatures above 150°C can impact the device reliability.
7: The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the
desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the
ambient temperature is not significant.
Note: Unless otherwise indicated: VR = 2.8V, COUT = 1 µF Ceramic (X7R), CIN = 1 µF Ceramic (X7R), IL = 100 µA,
TA = +25°C, VIN = VOUT(MAX) + VDROPOUT(MAX).
Note: Junction Temperature (TJ) is approximated by soaking the device under test to an ambient temperature equal to the desired junction
temperature. The test time is small enough such that the rise in Junction temperature over the Ambient temperature is not significant.
5.00 120.00
VOUT = 1.2V Temperature = +25°C
Quiescent Current (µA)
4.00 100.00
0.00 0.00
2 4 6 8 10 12 14 0 40 80 120 160 200
Input Voltage (V) Load Current (mA)
FIGURE 2-1: Quiescent Current vs. Input FIGURE 2-4: Ground Current vs. Load
Voltage. Current.
5.00 120.00
VOUT = 2.8V Temperature = +25°C
Quiescent Current (µA)
4.00 100.00
VOUT = 5.0V
GND Current (µA)
+130°C
VIN = 6.0V
80.00
3.00 +90°C
+25°C
60.00
2.00
0°C 40.00 VOUT = 2.8V
VIN = 3.8V
1.00 -45°C 20.00
0.00 0.00
3 5 7 9 11 13 0 50 100 150 200 250
Input Voltage (V) Load Current (mA)
FIGURE 2-2: Quiescent Current vs.Input FIGURE 2-5: Ground Current vs. Load
Voltage. Current.
5.00 3.00
VOUT = 5.0V VOUT = 2.8V IOUT = 0 mA
VOUT = 5.0V
Quiescent Current (µA)
Quiescent Current (µA)
3.00 1.50
VOUT = 1.2V
+90°C VIN = 2.7V
1.00
2.00 0°C
+25°C
0.50
-45°C
1.00 0.00
6 7 8 9 10 11 12 13 14 -45 -20 5 30 55 80 105 130
FIGURE 2-3: Quiescent Current vs.Input FIGURE 2-6: Quiescent Current vs.
Voltage. Junction Temperature.
1.24 1.23
VOUT = 1.2V VOUT = 1.2V
1.23 ILOAD = 0.1 mA 0°C
1.22
Output Voltage (V)
1.18 1.18
2 4 6 8 10 12 14 0 20 40 60 80 100
Input Voltage (V) Load Current (mA)
FIGURE 2-7: Output Voltage vs. Input FIGURE 2-10: Output Voltage vs. Load
Voltage. Current.
2.85 2.83
VOUT = 2.8V VOUT = 2.8V
2.84 ILOAD = 0.1 mA 2.82 +130°C
Output Voltage (V)
FIGURE 2-8: Output Voltage vs. Input FIGURE 2-11: Output Voltage vs. Load
Voltage. Current.
5.04
VOUT = 5.0V VOUT = 5.0V
5.06 5.03
ILOAD = 0.1 mA
+130°C
Output Voltage (V)
4.96 4.96
6 7 8 9 10 11 12 13 14 0 50 100 150 200 250
Input Voltage (V) Load Current (mA)
FIGURE 2-9: Output Voltage vs. Input FIGURE 2-12: Output Voltage vs. Load
Voltage. Current.
1.40
VOUT = 1.8V
1.30 +130°C
Dropout Voltage (V)
+90°C
1.20
+25°C
1.10
1.00
0°C
0.90
-45°C
0.80
0.70
0.60
100 120 140 160 180 200
FIGURE 2-13: Dropout Voltage vs. Load FIGURE 2-16: Dynamic Line Response.
Current.
1.00
VOUT = 2.8V
0.90
0.80
Dropout Voltage (V)
+130°C
0.70 +90°C
0.60
+25°C
0.50
0.40
+0°C
0.30
-45°C
0.20
0.10
0.00
0 25 50 75 100 125 150 175 200 225 250
Load Current (mA)
FIGURE 2-14: Dropout Voltage vs. Load FIGURE 2-17: Dynamic Line Response.
Current.
0.50 600.00
VOUT = 5.0V VOUT = 2.8V
Short Circuit Current (mA)
+130°C
0.35 +90°C 400.00
0.30
+25°C 300.00
0.25
0.20
+0°C 200.00
0.15
-45°C
0.10 100.00
0.05
0.00 0.00
0 25 50 75 100 125 150 175 200 225 250 4 6 8 10 12 14
FIGURE 2-15: Dropout Voltage vs. Load FIGURE 2-18: Short Circuit Current vs.
Current. Input Voltage.
0.20 0.20
VIN = 6V VOUT = 1.2V
0.15
VIN = 2.7V to 13.2V
0.10 0.16
0.05
0.00 0.12
-0.05 1 mA
VIN = 4V
-0.10 VIN = 10V VIN = 12V 0.08
0 mA
-0.15
-0.20 VIN = 13.2V 0.04 100 mA
VOUT = 1.2V
-0.25 ILOAD = 0.1 mA to 200 mA
-0.30 0.00
-45 -20 5 30 55 80 105 130 -45 -20 5 30 55 80 105 130
Temperature (°C) Temperature (°C)
FIGURE 2-19: Load Regulation vs. FIGURE 2-22: Line Regulation vs.
Temperature. Temperature.
0.40 0.20
VOUT = 2.8V VOUT = 2.8V
0.30
ILOAD = 1 mA to 250 mA VIN = 3.8V to 13.2V
0.20 0.16
250 mA
0.10
0.00 0.12 200 mA
-0.10
-0.20 VIN = 6V 0.08
0 mA
-0.30 VIN = 10V 100 mA
-0.40 VIN = 13.2V 0.04
VIN = 3.8V
-0.50
-0.60 0.00
-45 -20 5 30 55 80 105 130 -45 -20 5 30 55 80 105 130
Temperature (°C) Temperature (°C)
FIGURE 2-20: Load Regulation vs. FIGURE 2-23: Line Regulation vs.
Temperature. Temperature.
0.40 0.16
VOUT = 5.0V VOUT = 5.0V
ILOAD = 1 mA to 250 mA VIN = 6.0V to 13.2V
Line Regulation (%/V)
Load Regulation (%)
FIGURE 2-21: Load Regulation vs. FIGURE 2-24: Line Regulation vs.
Temperature. Temperature.
0
-10
-20
-30
PSRR (dB)
-40
-50 VR=1.2V
-60 COUT=1.0 μF ceramic X7R
VIN=2.7V
-70 CIN=0 μF
-80 IOUT=1.0 mA
-90
0.01 0.1 1 10 100 1000
Frequency (kHz)
0
-10
-20
-30
PSRR (dB)
-40
-50 VR=5.0V
-60 COUT=1.0 μF ceramic X7R
VIN=6.0V
-70 CIN=0 μF
-80 IOUT=1.0 mA
-90
0.01 0.1 1 10 100 1000
Frequency (kHz)
FIGURE 2-26: Power Supply Ripple FIGURE 2-29: Dynamic Load Response.
Rejection vs. Frequency.
100
VR=5.0V, VIN=6.0V IOUT=50 mA
10
Noise (μV/Hz)
VR=2,8V, VIN=3.8V
1
0.01
0.001
0.01 0.1 1 10 100 1000
Frequency (kHz)
FIGURE 2-27: Output Noise vs. Frequency. FIGURE 2-30: Dynamic Load Response.
MCP1702
VIN VOUT
Error Amplifier
+VIN
Voltage
-
Reference
+
Overcurrent
Overtemperature
GND
Standard
3-Lead SOT-89 Example:
Extended Temp
Symbol Voltage * Symbol Voltage *
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
D
e1
2 1
E
E1
A A2 c φ
A1 L
8QLWV 0,//,0(7(56
'LPHQVLRQ/LPLWV 0,1 120 0$;
1XPEHURI3LQV 1
/HDG3LWFK H %6&
2XWVLGH/HDG3LWFK H %6&
2YHUDOO+HLJKW $ ±
0ROGHG3DFNDJH7KLFNQHVV $ ±
6WDQGRII $ ±
2YHUDOO:LGWK ( ±
0ROGHG3DFNDJH:LGWK ( ±
2YHUDOO/HQJWK ' ±
)RRW/HQJWK / ±
)RRW$QJOH ±
/HDG7KLFNQHVV F ±
/HDG:LGWK E ±
1RWHV
'LPHQVLRQV'DQG(GRQRWLQFOXGHPROGIODVKRUSURWUXVLRQV0ROGIODVKRUSURWUXVLRQVVKDOOQRWH[FHHGPPSHUVLGH
'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0
%6& %DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
/HDG3ODVWLF6PDOO2XWOLQH7UDQVLVWRU+HDGHU0%>627@
1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW
KWWSZZZPLFURFKLSFRPSDFNDJLQJ
D1
E
H
L
1 2 N
b
b1 b1
e
e1 E1
8QLWV 0,//,0(7(56
'LPHQVLRQ/LPLWV 0,1 0$;
1XPEHURI/HDGV 1
3LWFK H %6&
2XWVLGH/HDG3LWFK H %6&
2YHUDOO+HLJKW $
2YHUDOO:LGWK +
0ROGHG3DFNDJH:LGWKDW%DVH (
0ROGHG3DFNDJH:LGWKDW7RS (
2YHUDOO/HQJWK '
7DE/HQJWK '
)RRW/HQJWK /
/HDG7KLFNQHVV F
/HDG:LGWK E
/HDGV :LGWK E
1RWHV
'LPHQVLRQV'DQG(GRQRWLQFOXGHPROGIODVKRUSURWUXVLRQV0ROGIODVKRUSURWUXVLRQVVKDOOQRWH[FHHGPPSHUVLGH
'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0
%6& %DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
/HDG3ODVWLF7UDQVLVWRU2XWOLQH72>72@
1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW
KWWSZZZPLFURFKLSFRPSDFNDJLQJ
E
1 N
1 2
3
b
e
c
8QLWV ,1&+(6
'LPHQVLRQ/LPLWV 0,1 0$;
1XPEHURI3LQV 1
3LWFK H %6&
%RWWRPWR3DFNDJH)ODW '
2YHUDOO:LGWK (
2YHUDOO/HQJWK $
0ROGHG3DFNDJH5DGLXV 5
7LSWR6HDWLQJ3ODQH / ±
/HDG7KLFNQHVV F
/HDG:LGWK E
1RWHV
'LPHQVLRQV$DQG(GRQRWLQFOXGHPROGIODVKRUSURWUXVLRQV0ROGIODVKRUSURWUXVLRQVVKDOOQRWH[FHHGSHUVLGH
'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0
%6& %DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV
0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &%
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
ISBN: 978-1-60932-690-6
08/04/10