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Major Manufacturing Facilities: Collaboration / Technical Tie-Ups

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0% found this document useful (0 votes)
115 views

Major Manufacturing Facilities: Collaboration / Technical Tie-Ups

Uploaded by

Sona Dutta
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as DOCX, PDF, TXT or read online on Scribd
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Bosch Automotive Electronics India Pvt. Ltd.

is a 100% subsidiary Robert Bosch GmbH, incorporated in April


2008 to manufacture Electronic Control Units for the Automotive Electronics Division.
Naganathapura Plant was established in the year 1989. Among the other Bosch Limited Plants in India,
Naganathapura Plant is the 3rd Bosch Plant. The major products being manufactured in Naganathapura Plant
are Spark Plugs, Starter Motors, Alternators and Generators.

HMT MACHINE TOOLS, BANGALORE COMPLEX

Major Manufacturing Facilities

Experienced design expertise and latest design facilities

Can handle machining of components of variety weighing up to 20 tons

Up-to-date tool room and inspection facilities

Machine shop to build huge structures with stress relieving facilities

Machine shop to manufacture small and heavy components

Facilities for assembly and retrofitting of heavy machine tools

Heat treatment facilities

Foundry with facilities to produce heavy, small and medium castings of ferrous metals with facilities like pattern
shop and fettering shop

Captive foundry of capacity 1500 MT per annum – Size of Grey Cast Iron casting up to 9MT & S.G. Iron up to 5 MT

Can handle machining of components & assemblies of tool room class precision machine tools.

Measurement & inspection facilities with precision machines viz., Coordinate Measuring Machine

Material testing laboratory

All facilities required for plated through hole ( PTH ) PCB assembly like preparation / insertion / assembly &
component soldering.

Facilities for cleaning of electronic PC Bs

Wave soldering machine

Desoldering Machine

  Component Insertion Machine

PCB Drilling Machine

Trimming machine

 
 
Collaboration / Technical Tie-ups
TURNING
Year Collaborator Country Product

1949-66 Oerlikon Switzerland High precision Centre Lathes

1959-66 ErnaultBatignolles France Production Centre Lathes (LB)

1964-74 Haut Rhin France France Single Spindle Automatics

1966-74 Gildemeister FRG Multispindle Bar & Chucking Automatics

1966-77 Ernault Somua France Copying Lathes (S. Pilote)

Jones & Lamson


1966-71 USA FAY Automatic Lathes
DivisionWaterburyFarrel

1966-71 Gildemeister FRG Drum Type Turret Lathes

1969-74 Oerlikon Switzerland Multipurpose Lathes (DA)

Heavy Duty Engine Lathes & Machining Centres for


1970-75 American Tool Works USA
Drilling Milling & Boring Operations

1971-78 Petermann Switzerland Sliding Headstock Automatics

1984-92 Gildemeister FRG MultispindleAutomatics (GF, GS)

1986-91 Gildemeister FRG GDM Series Chuckers

 
GRINDING

Year Collaborator Country Product

1959-66 Olivette Italy Cylindrical Grinding Machines

1961-71 Limex GDR Hydraulic Surface Grinding Machines (SFW)

1985-93 Buderus FRG Precision Internal Grinding Machines

GEAR CUTTING
Year Collaborator Country Product

1963-70 Drummond Brothers UK Gear Shapers(Maricut 2A & 3A)

1964-71 Liebherr FRG Gear Hobbing Machines(L series)

1976-79 Cross USA Gear Chamfering Machines

1983-91 Liebherr FRG Heavy Duty Gear Hobbers

1983-91 Liebherr FRG High Speed Gear Shapers (WS1)

GENERAL PURPOSE MACHINES & OTHERS


Year Collaborator Country Product

1958-65 Hermann Kolb FRG Radial Drilling Machines (RM)

Broaching Machines – Horizontal &


1967-77 Oswald Forst FRG
Vertical (Internal & External)

1968-73 Fin Motil Switzerland Clamping Chucks

1969-76 Ateliers GSP France Drilling & Boring Machines

1982-90 Oswald Forst FRG Surface Broaching Machines

1982-90 Oswald Forst FRG Surface Broaching Machines

1984-90 Carl Zeiss Jena GDR Ballscrews

1984-94 Siemens FRG CNC Control Systems

 
METAL FORMING
Year Collaborator Country Product

Diecasting & Plastic Injection Moulding


1969-79 Interfonda Switzerland
Machines

1982 Interfonda Switzerland Diecasting Dies

1981-89 Reissenhauser FRG Plastic Extrusion Machines


 

Major Projects Executed / Achieved


Idigenisation of critical components for multi-spindle automats

Specialised components for aerospace applications and radar assembly.

Development of Linear Transfer Machines

Development of 3-piece Manipulators and Rugged Duty Manipulators for Nuclear Applications

Specialised components for LC As

Refurbishing of precision class machines – Jig Boring, Jig Milling, Vertical Boring machines, etc. and imported Machining Centers

Development of HINUMERIK 4200 CNC system (controlling up to 9 axes and 3 spindles).

HINUMERIK 2300 CNC system

HINUMERIK 2300 W for Wire cut applications

ERP Software Package

Awards of Excellence
1961, 1962 President’s Certificate of Merit for All Round Performance.

1964-65 Institution of Engineers’ Best Design Award for Grinding/Lapping Machine

1969, 1970,1975,
National Safety Award for outstanding performance in Industrial Safety
1976, 1981, 1984

1983 Best Productivity Performance in Machine Tool Industry Sector.

1984 1984 1984-89 National Productivity Council Award

FIE Foundation Award for Excellence in Design at IMTEX 89 for 6-Axes CNC
1989
Gear Hobbing Machine

DGTD National Award for Technology Development for CNC Heavy Duty Lathe,
1992
L60 CNC

CMTI-PMT Foundation Award for Excellence in Design at IMTEX 1995 for CNC
1995
Precision Chucker PC 10

CMTI-PMT Foundation Award for Excellence in Design at IMTEX 2001 for CNC
2001
Sliding Head Automat A 16 CNC

FIE Foundation Award for Excellence in Design at IMTEX 2004 For CNC Surface
2004
Grinding Machine SSG

2013 FIE  - Foundation award for excellence in Design at IMTEX 2013 for VT MC 500 5A
 

Products Range
Turning
L45/50/60/70
Flat Bed Lathes-CNC STARTURN    
CNC
Flat Bed Lathes – Non CNC     L45/50/60/70 HDL 70

Slant Bed Lathes – CNC PRECITURN      

Sliding Automat – CNC A 16 CNC      

Sliding Headstock Automat


       
– Non CNC

CNC Chuckers TSC 20      

CNC Chuckers TSC 20      

CNC Turnmill Center GDM 42 GDM 65 GDM 90  

MultispindleAutomats – Non
ASH 160 AAH 150   AS 32/48/67
CNC
 
Milling / Machining Centers
DrillTap Center BLITZ 30 DT 40    

Cylindrical – CNC G12 CNC/GNC18      

Cylindrical – Non-CNC G17/22      

Surface – CNC SGC1 SSG1 SGM I / II SFW1C

Rotary Surface – CNC RSG 500/800      

GIN 20/2A,3A,
Internal – CNC GIN 90/2A GIN 30/4A GIN 16T/2A
4A

Universal – CNC GNC 15 / G22 CNC G60 CNC    

Thread & Worm TH 160 / 1000      

Gear Cutting

H400 CNC L200 CNC /3A,


Gear Hobbing – CNC H250 CNC /4A  
2A / 4A 4A, 5A

Gear Hobbing – Non CNC   H250 H400  

WS1 CNC /
Gear Shaping – CNC WS1 CNC /1A    
3A

Drilling

CNCCD
Coordinate      
2000x2000/1200x1200

Radial RM 62/63/65      

DIECASTING & PLASTIC INJECTION MOULDING

Cold Chamber DC 80 DC 120 DC 180 H 250D

Pressure Die
H400D DC 500 H660D DC 800
Casting Machines -

Horizontal Type –
DC 1100      
80 to 1100 tonnes
 
Refurbishing & Retrofittings
Heavy Duty Heavy Duty Horizontal Twin Vertical Spindle CNC
Four Guideway Combination Turret Spindle CNC Chucker
Lathe, Vertical
Lathe Chucker
Turret Lathe

Cylindrical
Cylindrical Grinder - Cylindrical Grinder - Cylindrical Grinder -
Grinding
Fortuna Studer HMT
Machine

Internal
Internal Grinder - Universal Grinder -
Grinder -  
HMT Kellenberger
Fortuna

Double Column
Coordinate Multispindle Drilling Drilling & Tapping
 
Drilling Machine Machine
Machine

5-Axes
Gear Teeth
Horizontal Multispindle Drilling
Chamfering Fine Boring Machine
Machining SPM
Machine
Center
 
Special Application Components/Jigs/Fixtures
Transonic Test Radar Housing
LCA Wing Moulds for Reflector
Aerospace Insert of Wind Assembly
Assembly Jig Antenna Satellite
Tunnel Components

Avionics
       
Components

Heavy Machine Precision needles


Others Tool Bed for radio isotope    
Casting impregnation
 
SPECIAL PURPOSE MACHINES

Double Ended Facing & Centering Machine

Fine Boring Machine Multispindle Drilling Machine

Two-way Drilling & Hole Milling/Reaming Machine

9-Station Rotary Indexing Machine

Triplex Milling Machine

3-Station Linear Indexing, Drilling, Hole Milling Machine

3-Station Linear Indexing, Drilling, Hole Milling Machine

4-Sides Tapping Machine

CNC 4-Axes Chucker

CNC Drilling & Reaming Machine

SPM for battery Manufacturing

Head Turning & Mouth Reaming Machine

2-Axes CNC Precision Coordinate Table


Dual Spindle Case Trimming Machine

Flash Hole Drilling Machine

Duplex Milling Machine

Bilateral Master-Slave servo manipulators

Rugged Duty Extended Reach Manipulator

Three-piece Master-Slave Servomanipulator

Sub-system for Engineering Tomography

Paper Tube Sizing & Finishing Machine


 
Computer Numeric Control (CNC) Systems

CNC Systems for turning,


milling, drilling, boring,
machining centres, grinding
HINUMERIK
and special purpose HINUMERIK 2100T /
HINUMERIK HINUMERIK 3100M /
machines with built-in 2000T SINUMERIK 810T /
2100M / 2000M 2200T 3100T /
programmable logic 810M / 810G
3100G
controller, CRT display /
TFT and configurability
function.

CATIA - which stands for Computer Aided Three-dimensional Interactive Application - is the most powerful


and widely used CAD (computer aided design) software of its kind in the world. CATIA is owned/developed
by Dassault Systems of France and until 2010, was marketed worldwide by IBM.

A Rube Goldberg (American cartoonist) machine is a machine intentionally designed to perform a simple task in an
indirect and overcomplicated fashion. Often, these machines consist of a series of simple devices that are linked
together to produce a domino effect, in which each device triggers the next one, and the original goal is achieved only
after many steps.

Dye Sensitized Solar Cells


Dye Sensitized solar cells (DSSC), also sometimes referred to as dye sensitised cells (DSC), are a

third generation photovoltaic (solar) cell that converts any visible light into electrical energy.
This new class of advanced solar cell can be likened to artificial photosynthesis due to the way in which it mimics
nature’s absorption of light energy.
Dye Sensitized solar cells (DSSC) were invented in 1991 by Professor Michael Graetzel and Dr Brian O’Regan at Ã
‰cole Polytechnique Fédérale de Lausanne (EPFL), Switzerland and is often referred to as the GrÃetzel cell, we call
it GCell.
DSSC is a disruptive technology that can be used to produce electricity in a wide range of light conditions, indoors and
outdoors, enabling the user to convert both artificial and natural light into energy to power a broad range of electronic
devices.

How does DSSC work?


1. The dye is the photoactive material of DSSC, and can
produce electricity once it is sensitized by light
2. The dye catches photons of incoming light (sunlight and
ambient artificial light) and uses their energy to excite
electrons, behaving like chlorophyll in photosynthesis
3. The dye injects this excited electron into the Titanum
Dioxide (a white pigment commonly found in white paint)
4. The electron is conducted away by nanocrystalline
titanium dioxide (a nano-scale crystallized form of the
titanium dioxide).
5. A chemical electrolyte in the cell then closes the circuit so
that the electrons are returned back to the dye
6. It is the movement of these electrons that creates energy
which can be harvested into a rechargeable battery, super
capacitor or another electrical device.

DSSC advantages include:


Low-light performance
GCell works in a wide array of lighting conditions that makes it suitable for a diverse range of shaded and diffuse light
locations, without suffering from angular dependence of sunlight or light.

Optimised performance
GCell materials and dyes can be tuned for optimisation in a variety of lighting conditions making it suitable for indoor
applications and outdoor applications.

Higher temperature performance


Efficiency of GCell does not degrade with increased temperature, meaning you can continue to efficiently harvest energy
in direct sunlight.

Low energy manufacturing process


GCell is manufactured using a low-energy consumption, high-efficiency, roll-to-roll manufacturing technique.
Dye-sensitized solar cells
Fig 1: Type of cell made at the EPFL by Grätzel and O'Regan

Fig 2: Operation of a Grätzel cell.

In the late 1960s it was discovered that illuminated organic dyes


can generate electricity at oxide electrodes in electrochemical
cells. The instability of the dye solar cell was identified as a main
challenge. Its efficiency could, during the following two decades,
be improved by optimizing the porosity of the electrode prepared
from fine oxide powder, but the instability remained a problem.
A modern DSSC is composed of a porous layer of titanium
dioxide nanoparticles, covered with a molecular dye that absorbs
sunlight, like the chlorophyll in green leaves. The titanium dioxide
is immersed under an electrolyte solution, above which is
a platinum-based catalyst. As in a conventional alkaline battery,
an anode (the titanium dioxide) and a cathode (the platinum) are
placed on either side of a liquid conductor (the electrolyte).
Sunlight passes through the transparent electrode into the dye
layer where it can excite electrons that then flow into the titanium
dioxide. The electrons flow toward the transparent electrode
where they are collected for powering a load. After flowing
through the external circuit, they are re-introduced into the cell on
a metal electrode on the back, flowing into the electrolyte. The
electrolyte then transports the electrons back to the dye
molecules.
Dye-sensitized solar cells separate the two functions provided by
silicon in a traditional cell design. Normally the silicon acts as
both the source of photoelectrons, as well as providing the
electric field to separate the charges and create a current. In the dye-sensitized solar cell, the bulk of the
semiconductor is used solely for charge transport, the photoelectrons are provided from a
separate photosensitive dye. Charge separation occurs at the surfaces between the dye, semiconductor and
electrolyte.
The dye molecules are quite small (nanometer sized), so in order to capture a reasonable amount of the incoming
light the layer of dye molecules needs to be made fairly thick, much thicker than the molecules themselves. To
address this problem, a nanomaterial is used as a scaffold to hold large numbers of the dye molecules in a 3-D
matrix, increasing the number of molecules for any given surface area of cell. In existing designs, this scaffolding is
provided by the semiconductor material, which serves double-duty.

Construction
In the case of the original Grätzel and O'Regan design, the cell has 3 primary parts. On top is a
transparent anode made of fluoride-doped tin dioxide (SnO2: F) deposited on the back of a (typically glass) plate. On
the back of this conductive plate is a thin layer of titanium dioxide (TiO2), which forms into a highly porous structure
with an extremely high surface area. The (TiO2) is chemically bound by a process called sintering. TiO2only absorbs
a small fraction of the solar photons (those in the UV).The plate is then immersed in a mixture of a
photosensitive ruthenium-polypyridine dye (also called molecular sensitizers) and a solvent. After soaking the film in
the dye solution, a thin layer of the dye is left covalently bonded to the surface of the TiO 2. The bond is either an
ester, chelating, or bidentate bridging linkage.
A separate plate is then made with a thin layer of the iodide electrolyte spread over a conductive sheet,
typically platinum metal. The two plates are then joined and sealed together to prevent the electrolyte from leaking.
The construction is simple enough that there are hobby kits available to hand-construct them.Although they use a
number of "advanced" materials, these are inexpensive compared to the silicon needed for normal cells because
they require no expensive manufacturing steps. TiO2, for instance, is already widely used as a paint base.
One of the efficient DSSCs devices uses ruthenium-based molecular dye, e.g. [Ru (4,4'-dicarboxy-2,2'-
bipyridine)2(NCS)2] (N3), that is bound to a photoanode via carboxylate moieties. The photoanode consists of 12 μm
thick film of transparent 10–20 nm diameter TiO2 nanoparticles covered with a 4 μm thick film of much larger
(400 nm diameter) particles that scatter photons back into the transparent film. The excited dye rapidly injects an
electron into the TiO2 after light absorption. The injected electron diffuses through the sintered particle network to be
collected at the front side transparent conducting oxide (TCO) electrode, while the dye is regenerated via reduction
by a redox shuttle, I3/I, dissolved in a solution. Diffusion of the oxidized form of the shuttle to the counter electrode
completes the circuit.

Mechanism of DSSCs
The main processes that occur in a DSSC
Step 1: The following primary steps convert photons (light) to current:

1. The incident photon is absorbed by Ru complex photosensitizers adsorbed on the TiO 2 surface.
2. The photosensitizers are excited from the ground state (S) to the excited state (S ∗). The excited electrons
are injected into the conduction band of the TiO2 electrode. This results in the oxidation of the
photosensitizer (S+).
S + hν  
 

→ S∗
 

4. The injected electrons in the conduction band of TiO2 are transported between TiO2 nanoparticles with
diffusion toward the back contact (TCO). And the electrons finally reach the counter electrode through the
circuit.
5. The oxidized photosensitizer (S+) accepts electrons from the I− ion redox mediator leading to regeneration of
the ground state (S), and two I−-Ions are oxidized to elementary Iodine which reacts with I− to the oxidized
state, I3−.
S+ +  
 

e− → S
 

6. The oxidized redox mediator, I3−, diffuses toward the counter electrode and then it is reduced to I− ions.
I3− + 2  
 

e− → 3 I−
 

The efficiency of a DSSC depends on four energy levels of the component: the excited state (approximately LUMO)
and the ground state (HOMO) of the photosensitizer, the Fermi level of the TiO 2 electrode and the redox potential of
the mediator (I−/I3−) in the electrolyte.

Disadvantages
The major disadvantage to the DSSC design is the use of the liquid electrolyte, which has temperature stability
problems. At low temperatures the electrolyte can freeze, ending power production and potentially leading to
physical damage. Higher temperatures cause the liquid to expand, making sealing the panels a serious problem.
Another disadvantage is that costly ruthenium (dye), platinum (catalyst) and conducting glass or plastic (contact) are
needed to produce a DSSC. A third major drawback is that the electrolyte solution contains volatile organic
compounds (or VOC's), solvents which must be carefully sealed as they are hazardous to human health and the
environment. This, along with the fact that the solvents permeate plastics, has precluded large-scale outdoor
application and integration into flexible structure.
Replacing the liquid electrolyte with a solid has been a major ongoing field of research. Recent experiments using
solidified melted salts have shown some promise, but currently suffer from higher degradation during continued
operation, and are not flexible.

Developments-
2012
Northwestern University researchers announced a solution to a primary problem of DSSCs that of difficulties in using
and containing the liquid electrolyte and the consequent relatively short useful life of the device. This is achieved
through the use of nanotechnology and the conversion of the liquid electrolyte to a solid. The current efficiency is
about half that of silicon cells, but the cells are lightweight and potentially of much lower cost to produce.
2013
During the last 5–10 years, a new kind of DSSC has been developed — the solid state dye-sensitized solar cell. In
this case the liquid electrolyte is replaced by one of several solid hole conducting materials. From 2009 to 2013 the
efficiency of Solid State DSSCs has dramatically increased from 4% to 15%. Michael Grätzel announced the
fabrication of Solid State DSSCs with 15.0% efficiency, reached by the means of a
hybrid perovskite CH3NH3PbI3 dye, subsequently deposited from the separated solutions of CH 3NH3I and PbI2.
The first architectural integration was demonstrated at EPFL's new convention center in partnership with Romande
Energie. The total surface is 300 m2, in 1400 modules of 50 cm x 35 cm. Designed by artists Daniel Schlaepfer and
Catherine Bolle.
2018
Researchers have investigated the role of surface plasmon resonances present on gold nanorods in the
performance of dye-sensitized solar cells. They found that with an increase Nano rod concentration, the light
absorption grew linearly; however, charge extraction was also dependent on the concentration. With an optimized
concentration, they found that the overall power conversion efficiency improved from 5.31 to 8.86% for Y123 dye-
sensitized solar cells.
The synthesis of one-dimensional TiO2 nanostructures directly on fluorine-doped tin oxide glass substrates was
successful demonstrated via a two-stop solvothermal reaction. Additionally, through a TiO2 sol treatment, the
performance of the dual TiO2 nanowire cells was enhanced, reaching a power conversion efficiency of 7.65%.
Stainless steel based counter-electrodes for DSSCs have been reported which further reduce cost compared to
conventional platinum based counter electrode and are suitable for outdoor application.
Researchers from EPFL have advanced the DSSCs based on copper complexes redox electrolytes, which have
achieved 13.1% efficiency under standard AM1.5G, 100 mW/cm2conditions and record 32% efficiency under 1000
lux of indoor light

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