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Naoe 2205: Heat Transfer: Conduction

This document discusses heat transfer by conduction. It defines conduction as the transfer of energy between particles due to temperature differences. The rate of conductive heat transfer depends on material properties like thermal conductivity and heat capacity. Thermal conductivity indicates how well a material conducts heat, while heat capacity represents how much energy it can store. The document provides examples of conduction and explores factors that influence the conductive heat transfer rate.

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Wasi Mahmud Siam
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0% found this document useful (0 votes)
44 views22 pages

Naoe 2205: Heat Transfer: Conduction

This document discusses heat transfer by conduction. It defines conduction as the transfer of energy between particles due to temperature differences. The rate of conductive heat transfer depends on material properties like thermal conductivity and heat capacity. Thermal conductivity indicates how well a material conducts heat, while heat capacity represents how much energy it can store. The document provides examples of conduction and explores factors that influence the conductive heat transfer rate.

Uploaded by

Wasi Mahmud Siam
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© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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NAOE 2205: HEAT TRANSFER

CONDUCTION

MEHRAN ISLAM
Lecturer, Department of Offshore Engineering,

BANGABANDHU SHEIKH MUJIBUR RAHMAN


MARITIME UNIVERSITY, BANGLADESH
INTRODUCTION
• We defined heat as the form of energy that can be transferred from one
system to another as a result of temperature difference.
• A thermodynamic analysis is concerned with the amount of heat
transfer as a system undergoes a process from one equilibrium state to
another.
• The science that deals with the determination of the rates of such
energy transfers is the heat transfer.
• The transfer of energy as heat is always from the higher-temperature
medium to the lower-temperature one
• Heat transfer stops when the two mediums reach the same
temperature.
MODES OF HEAT TRANSFER
• Heat can be transferred in three different modes: conduction, convection, and
radiation.
• All modes of heat transfer require the existence of a temperature difference
• All modes are from the high-temperature medium to a lower-temperature one.

• Reference (text, images, and equations) : HEAT AND MASS TRANSFER: FUNDAMENTALS & APPLICATIONS, FIFTH EDITION-
YUNUS A. ÇENGEL and AFSHIN J. GHAJAR (McGraw-Hill Education)
CONDUCTION
• Conduction is the transfer of energy from the more energetic particles of
a substance to the adjacent less energetic ones as a result of interactions
between the particles.
• Conduction can take place in solids, liquids, or gases.
• In gases and liquids, conduction is due to the collisions and diffusion of
the molecules during their random motion.
• In solids, it is due to the combination of vibrations of the molecules in a
lattice and the energy transport by free electrons.
• For example A cold canned drink in a warm room, eventually warms up to
the room temperature as a result of heat transfer from the room to the
drink through the aluminum can by conduction.
• The rate of heat conduction through a medium depends on the
Geometry of the medium,
Its thickness,
and the material of the medium,
as well as the temperature difference across the medium.
• Consider steady heat conduction through a large plane wall of
thickness ∆x= L and area A, as shown in Fig.
• The temperature difference across the wall is ∆T =T2 -T1.
• Experiments have shown that the rate of heat transfer 𝑄 through the
wall is doubled when the temperature difference ∆T across the wall or
the area A normal to the direction of heat transfer is doubled,
• but is halved when the wall thickness L is doubled.
• Thus we conclude that the rate of heat conduction through a plane
layer is proportional to the temperature difference across the layer and
the heat transfer area, but is inversely proportional to the thickness of
the layer.
• That is,

• Where the constant of proportionality k is the thermal conductivity of


the material, which is a measure of the ability of a material to conduct
heat.
• In the limiting case of ∆x0, the equation above reduces to the differential form:

• This is called Fourier’s law of heat conduction after J. Fourier.


• Here dT/dx is the temperature gradient, which is the slope of the temperature
curve on a T-x diagram (the rate of change of T with x), at location x.
• The relation above indicates that the rate of heat conduction in a given direction is
proportional to the temperature gradient in that direction.
• Heat is conducted in the direction of decreasing temperature, and the temperature
gradient becomes negative when temperature decreases with increasing x.
• The negative sign in Eq. ensures that heat transfer in the positive x direction is a
positive quantity.
• The heat transfer area A is always normal to the direction of heat
transfer.
• For heat loss through a 5-m-long, 3-m-high, and 25-cm-thick wall, for
example, the heat transfer area is A=15 m2.
• Note that the thickness of the wall has no effect on A.
THERMAL CONDUCTIVITY
• we have defined the property specific heat cp as a measure of a
material’s ability to store thermal energy.
• For example, cp = 4.18 kJ/kg·°C for water and cp = 0.45 kJ/kg·°C for
iron at room temperature
• which indicates that water can store almost 10 times the energy that
iron can per unit mass.
• Likewise, the thermal conductivity k is a measure of a material’s
ability to conduct heat.
• For example, k=0.607 W/m·K for water and k =80.2 W/m·K for iron
at room temperature,
• which indicates that iron conducts heat more than 100 times faster
than water can.
• Thus we say that water is a poor heat conductor relative to iron,
although water is an excellent medium to store thermal energy.
• The thermal conductivity of a material can be defined as the rate of
heat transfer through a unit thickness of the material per unit area per
unit temperature difference.
• The thermal conductivity of a material is a measure of the ability of
the material to conduct heat.
• A high value for thermal conductivity indicates that the material is a
good heat conductor,
• A low value indicates that the material is a poor heat conductor or
insulator.
• The thermal conductivity of pure copper at room temperature is
• k = 401 W/m·K, which indicates that a 1-m-thick copper wall will
conduct heat at a rate of 401 W/m2 area per K temperature difference
across the wall.
• Materials such as copper and silver that are good electric conductors
are also good heat conductors, and have high values of thermal
conductivity.
• Materials such as rubber, wood, and Styrofoam are poor conductors of
heat and have low conductivity values.
• Unlike metals, which are good electrical and heat conductors,
crystalline solids such as diamond and semiconductors such as silicon
are good heat conductors but poor electrical conductors.
• As a result, such materials find widespread use in the electronics
industry.
• Despite their higher price, diamond heat sinks are used in the cooling
of sensitive electronic components because of the excellent thermal
conductivity of diamond.
• Silicon oils and gaskets are commonly used in the packaging of
electronic components because they provide both good thermal contact
and good electrical insulation.
• The thermal conductivity of an alloy of two metals is usually much
lower than that of either metal.
• Even small amounts in a pure metal of “foreign” molecules that are
good conductors themselves seriously disrupt the transfer of heat in
that metal.
• The thermal conductivity of steel containing just 1 percent of chrome
is 62 W/m·K, while the thermal conductivities of iron and chromium
are 83 and 95 W/m·K, respectively.
• The temperature dependence of thermal conductivity causes
considerable complexity in conduction analysis.
• Therefore, it is common practice to evaluate the thermal conductivity
k at the average temperature and treat it as a constant in calculations.
• In heat transfer analysis, a material is normally assumed to be
isotropic.
• That is, to have uniform properties in all directions. This assumption is
realistic for most materials,
• Except those that exhibit different structural characteristics in different
directions, such as laminated composite materials and wood
(anisotropic materials).
• The thermal conductivity of wood across the grain, for example, is
different than that parallel to the grain.
HEAT CAPACITY
• The product cp, which is frequently encountered in heat transfer
analysis, is called the heat capacity of a material.
• Both the specific heat cp and the heat capacity cp represent the heat
storage capability of a material.
• But cp expresses it per unit mass whereas cp expresses it per unit
volume,
• As can be noticed from their units J/kg·K and J/m3·K, respectively.
THERMAL DIFFUSIVITY
• Another material property that appears in the transient heat conduction
analysis is the thermal diffusivity, which represents how fast heat
diffuses through a material and is defined as:

• Note that the thermal conductivity k represents how well a material


conducts heat, and the heat capacity cp represents how much energy a
material stores per unit volume.
• Therefore, the thermal diffusivity of a material can be viewed as the
ratio of the heat conducted through the material to the heat stored per
unit volume.
• A material that has a high thermal conductivity or a low heat capacity
will obviously have a large thermal diffusivity.
• The larger the thermal diffusivity, the faster the propagation of heat
into the medium.
• A small value of thermal diffusivity means that heat is mostly
absorbed by the material and a small amount of heat is conducted
further.

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