SAA5540PS Philips
SAA5540PS Philips
SAA5540PS Philips
DATA SHEET
SAA55xx
TV microcontrollers with Closed
Captioning (CC) and On-Screen
Display (OSD)
Preliminary specification 1999 Aug 02
File under Integrated Circuits, IC02
Philips Semiconductors Preliminary specification
1999 Aug 02 2
Philips Semiconductors Preliminary specification
1 FEATURES
• Single-chip microcontroller with integrated On-Screen
Display (OSD)
• One Time Programmable (OTP) memory for both
Program ROM and character sets
• Single power supply: 3.0 to 3.6 V
2 GENERAL DESCRIPTION
• 5 V tolerant digital inputs and I/O
The SAA55xx OSD only family of devices are a derivative
• 29 I/O port via individual addressable controls of the Philips industry standard 80C51 microcontroller and
• Programmable I/O for push-pull, open-drain and are intended for use as the central control mechanism in a
quasi-bidirectional television receiver. They provide control functions for the
• Two port lines with 8 mA sink (at <0.4 V) capability, for television system, On-Screen Display (OSD) and some
direct drive of Light Emitting Diode (LED) versions include an integrated data capture function.
• Single crystal oscillator for microcontroller, OSD and The main differences between the OSD only family and the
data capture SAA55xx Text/CC family of baseline devices are:
• Power reduction modes: Standby, Idle and Power-down • Program ROM size: 16 to 64-kbyte
• Byte level I2C-bus up to 200 kHz with dual port I/O • Display DRAM size: 1.25-kbyte (1 page Text OSD or
(Slave mode up to 400 kHz) CC/OSD)
• 32 Dynamically Redefinable Characters for OSDs • Auxiliary DRAM size: 0.75-kbyte
• Special graphic characters allowing four colours per • No teletext data capture (Closed Caption only)
character • Additional power saving mode (Standby).
• Selectable character height 9, 10, 13 and 16 TV lines
• Pin compatibility throughout family
• Operating temperature: −20 to +70°C
1999 Aug 02 3
Philips Semiconductors Preliminary specification
4 ORDERING INFORMATION
PACKAGE(2)
TYPE NUMBER(1) ROM RAM CC OSD
NAME DESCRIPTION VERSION
SAA5500PS/nnnn SDIP52 plastic shrink dual in-line SOT247-1 16-kbyte 256-byte no Standard
SAA5501PS/nnnn package; 52 leads (600 mil) 32-kbyte 512-byte no Standard
SAA5540PS/nnnn 16-kbyte 256-byte yes Enhanced
SAA5541PS/nnnn 32-kbyte 512-byte yes Enhanced
SAA5502PS/nnnn 48-kbyte 256-byte no Standard
SAA5503PS/nnnn 64-kbyte 512-byte no Standard
SAA5542PS/nnnn 48-kbyte 750-byte yes Enhanced
SAA5543PS/nnnn 64-kbyte 1-kbyte yes Enhanced
SAA5547PS/nnnn 24-kbyte 750-byte yes Enhanced
Notes
1. ‘nnnn’ is a four digit number uniquely referencing the microcontroller program mask.
2. For details of the LQFP100 package, please contact your local regional sales office for availability.
1999 Aug 02 4
Philips Semiconductors Preliminary specification
5 BLOCK DIAGRAM
DRAM MEMORY
(UP TO 2-KBYTE) INTERFACE
R
DATA G
CVBS DISPLAY
CAPTURE B
VDS
DATA VSYNC
DISPLAY
CVBS CAPTURE
TIMING HSYNC
TIMING
GSA005
1999 Aug 02 5
Philips Semiconductors Preliminary specification
6 PINNING INFORMATION
6.1 Pinning
handbook, halfpage
P2.0/TPWM 1 52 P1.5/SDA1
P2.1/PWM0 2 51 P1.4/SCL1
P2.2/PWM1 3 50 P1.7/SDA0
P2.3/PWM2 4 49 P1.6/SCL0
P2.4/PWM3 5 48 P1.3/T1
P2.5/PWM4 6 47 P1.2/INT0
P2.6/PWM5 7 46 P1.1/T0
P2.7/PWM6 8 45 P1.0/INT1
P3.0/ADC0 9 44 VDDP
P3.1/ADC1 10 43 RESET
P3.2/ADC2 11 42 XTALOUT
P3.3/ADC3 12 41 XTALIN
VSSC 13 40 OSCGND
SAA55xx
P0.0 14 39 VDDC
P0.1 15 38 VSSP
P0.2 16 37 VSYNC
P0.3 17 36 HSYNC
P0.4 18 35 VDS
P0.5 19 34 R
P0.6 20 33 G
P0.7 21 32 B
VSSA 22 31 VDDA
CVBS0 23 30 P3.4/PWM7
CVBS1 24 29 COR
SYNC_FILTER 25 28 VPE
IREF 26 27 FRAME
MBK951
1999 Aug 02 6
Philips Semiconductors Preliminary specification
100 P2.0/TPWM
98 P2.6/PWM5
97 P2.5/PWM4
96 P2.4/PWM3
95 P2.3/PWM2
94 P2.2/PWM1
93 P2.1/PWM0
84 P1.5/SDA1
82 P1.7/SDA0
83 P1.4/SCL1
81 P1.6/SCL0
79 P1.2/INT0
76 P1.0/INT1
80 P1.3/T1
78 P1.1/T0
99 n.c.
92 n.c.
91 n.c.
90 n.c.
89 n.c.
88 n.c.
87 n.c.
86 n.c.
85 n.c.
77 n.c.
handbook, full pagewidth
P2.7/PWM6 1 75 VDDP
P3.0/ADC0 2 74 n.c.
n.c. 3 73 RESET
P3.1/ADC1 4 72 n.c.
P3.2/ADC2 5 71 XTALOUT
P3.3/ADC3 6 70 XTALIN
n.c. 7 69 OSCGND
n.c. 8 68 n.c.
n.c. 9 67 n.c.
n.c. 10 66 n.c.
VSSC 11 65 n.c.
VSSP 12 64 n.c.
P0.5 13 SAA55xx 63 VDDC
n.c. 14 62 VPE_2
n.c. 15 61 n.c.
P0.0 16 60 VSSP
P0.1 17 59 P3.6
P0.2 18 58 n.c.
n.c. 19 57 n.c.
n.c. 20 56 n.c.
n.c. 21 55 VSYNC
P0.3 22 54 P3.5
n.c. 23 53 HSYNC
P0.4 24 52 VDS
P3.7 25 51 n.c.
n.c. 26
n.c. 27
P0.6 28
P0.7 29
VSSA 30
CVBS0 31
CVBS1 32
n.c. 33
SYNC_FILTER 34
IREF 35
n.c. 36
n.c. 37
n.c. 38
n.c. 39
n.c. 40
FRAME 41
VPE 42
COR 43
P3.4/PWM7 44
VDDA 45
B 46
G 47
R 48
n.c. 49
n.c. 50
GSA001
1999 Aug 02 7
Philips Semiconductors Preliminary specification
1999 Aug 02 8
Philips Semiconductors Preliminary specification
PIN
SYMBOL TYPE DESCRIPTION
SDIP52 LQFP100
COR 29 43 O Open-drain, active LOW output which allows selective
contrast reduction of the TV picture to enhance a
mixed mode display.
VDDA 31 45 − +3.3 V analog power supply
B 32 46 O Pixel rate output of the BLUE colour information.
G 33 47 O Pixel rate output of the GREEN colour information.
R 34 48 O Pixel rate output of the RED colour information.
VDS 35 52 O Video/data switch push-pull output for dot rate fast
blanking.
HSYNC 36 53 I Schmitt triggered input TTL version of the horizontal
sync pulse. The polarity of this pulse is programmable
by register bit TXT1.H POLARITY.
VSYNC 37 55 I Schmitt triggered input for a TTL version of the vertical
sync pulse. The polarity of this pulse is programmable
by register bit TXT1.V POLARITY.
VSSP 38 12, 60 − periphery ground
VDDC 39 63 − +3.3 V core power supply
OSCGND 40 69 − crystal oscillator ground
XTALIN 41 70 I 12 MHz crystal oscillator input
XTALOUT 42 71 O 12 MHz crystal oscillator output
RESET 43 73 I If the reset input is HIGH for at least 2 machine cycles
(24 oscillator periods) while the oscillator is running,
the device is reset. This pin should be connected to
VDDP via a capacitor.
VDDP 44 75 − +3.3 V periphery power supply
P1.0/INT1 45 76 I/O Port 1. 8-bit programmable bidirectional port with
P1.1/T0 46 78 I/O alternative functions.
P1.2/INT0 47 79 I/O P1.0/INT1 is external interrupt 1 which can be
P1.3/T1 48 80 I/O triggered on the rising and falling edge of the pulse.
P1.1/T0 is the Counter/Timer 0. P1.2/INT0 is external
P1.6/SCL0 49 81 I/O
interrupt 0. P1.3/T1 is the Counter/Timer 1.
P1.7/SDA0 50 82 I/O P1.6/SCL0 is the serial clock input for the I2C-bus and
P1.4/SCL1 51 83 I/O P1.7/SDA0 is the serial data port for the I2C-bus.
P1.5/SDA1 52 84 I/O P1.4/SCL1 is the serial clock input for the I2C-bus and
P1.5/SDA1 is the serial data port for the I2C-bus.
VPE_2 − 62 I OTP programming voltage
n.c. − 3, 7 to 10, 14, 15, 19 to 21, − not connected
23, 26, 27, 33, 36 to 40,
49 to 51, 56 to 58, 61,
64 to 68, 72, 74, 77,
85 to 92, 99
1999 Aug 02 9
Philips Semiconductors Preliminary specification
1999 Aug 02 10
Philips Semiconductors Preliminary specification
USER ROM
(64K x 8-BIT)
USER ROM
(9K x 12-BIT)
GSA006
PROGRAM ROM
DISABLED ENABLED
CHARACTER ROM
DISABLED ENABLED
GSA007
1999 Aug 02 11
Philips Semiconductors Preliminary specification
PROGRAM ROM
ENABLED ENABLED
CHARACTER ROM
ENABLED ENABLED
GSA008
FFH
accessible accessible
by indirect by direct
upper 128 bytes
addressing addressing
only only
80H
7FH
accessible
by direct
lower 128 bytes
and indirect
addressing
00H MBK956
1999 Aug 02 12
Philips Semiconductors Preliminary specification
30H
2FH
bit-addressable space
(bit addresses 00H to 7FH)
20H
R7 1FH
R0 18H
R7 17H
R0 08H
R7 07H
R0 0 MGM677
1999 Aug 02 13
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in
_white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in
white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ...
Philips Semiconductors
and On-Screen Display (OSD)
TV microcontrollers with Closed Captioning (CC)
The Special Function Register (SFR) space is used for port latches, timer, peripheral control, acquisition control, display control, etc. These registers
can only be accessed by direct addressing. Sixteen of the addresses in the SFR space are both bit and byte addressable. The bit addressable SFRs
are those whose address ends in 0H or 8H. A summary of the SFR map in address order is shown in Table 2.
A description of each of the SFR bits is shown in Table 3 which presents the SFRs in alphabetical order.
8CH R/W TH0 TH07 TH06 TH05 TH04 TH03 TH02 TH01 TH00 00H
8DH R/W TH1 TH17 TH16 TH15 TH14 TH13 TH12 TH11 TH10 00H
90H R/W P1 P17 P16 P15 P14 P13 P12 P11 P10 FFH
96H R/W P0CFGA P0CFGA7 P0CFGA6 P0CFGA5 P0CFGA4 P0CFGA3 P0CFGA2 P0CFGA1 P0CFGA0 FFH
97H R/W P0CFGB P0CFGB7 P0CFGB6 P0CFGB5 P0CFGB4 P0CFGB3 P0CFGB2 P0CFGB1 P0CFGB0 00H
98H R/W SADB 0 0 0 DC_COMP SAD3 SAD2 SAD1 SAD0 00H
9EH R/W P1CFGA P1CFGA7 P1CFGA6 P1CFGA5 P1CFGA4 P1CFGA3 P1CFGA2 P1CFGA1 P1CFGA0 FFH
9FH R/W P1CFGB P1CFGB7 P1CFGB6 P1CFGB5 P1CFGB4 P1CFGB3 P1CFGB2 P1CFGB1 P1CFGB0 00H
A0H R/W P2 P27 P26 P25 P24 P23 P22 P21 P20 FFH
A6H R/W P2CFGA P2CFGA7 P2CFGA6 P2CFGA5 P2CFGA4 P2CFGA3 P2CFGA2 P2CFGA1 P2CFGA0 FFH
Preliminary specification
A7H R/W P2CFGB P2CFGB7 P2CFGB6 P2CFGB5 P2CFGB4 P2CFGB3 P2CFGB2 P2CFGB1 P2CFGB0 00H
A8H R/W IE EA EBUSY ES2 ECC ET1 EX1 ET0 EX0 00H
SAA55xx
B0H R/W P3 P37 P36 P35 P34 P33 P32 P31 P30 FFH
B2H R/W TXT18 NOT3 NOT2 NOT1 NOT0 0 0 BS1 BS0 00H
B3H R/W TXT19 TEN TC2 TC1 TC0 0 0 TS1 TS0 00H
B4H R/W TXT20 DRCS OSD 0 0 OSD LANG OSD LAN2 OSD LAN1 OSD LAN0 00H
ENABLE PLANES ENABLE
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in
_white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in
white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ...
1999 Aug 02
Philips Semiconductors
ADD R/W NAME 7 6 5 4 3 2 1 0 RESET
OUT ON OUT ON IN
C6H R/W TXT6 BKGND BKGND IN COR OUT COR IN TEXT OUT TEXT IN PICTURE PICTURE 03H
OUT ON OUT ON IN
C7H R/W TXT7 (reserved) CURSOR (reserved) (reserved)0 DOUBLE BOX ON 24 BOX ON BOX ON 0 00H
0 ON 0 HEIGHT 1 − 23
C8H R/W TXT8 (reserved) FLICKER (reserved) DISABLE PKT 26 WSS WSS ON CVBS1/ 00H
0 STOP ON 0 SPANISH RECEIVED RECEIVED CVBS0
C9H R/W TXT9 CURSOR CLEAR (reserved) R4 R3 R2 R1 R0 00H
FREEZE MEMORY 0
CAH R/W TXT10 0 0 C5 C4 C3 C2 C1 C0 00H
CBH R/W TXT11 D7 D6 D5 D4 D3 D2 D1 D0 00H
Preliminary specification
CCH R TXT12 525/625 ROM VER4 ROM VER3 ROM VER2 ROM VER1 ROM VER0 1 VIDEO XXXX
SYNC SIGNAL XX1X
QUALITY
SAA55xx
D0H R/W PSW C AC F0 RS1 RS0 OV − P 00H
D2H R/W TDACL TD7 TD6 TD5 TD4 TD3 TD2 TD1 TD0 00H
D3H R/W TDACH TPWE 1 TD13 TD12 TD11 TD10 TD9 TD8 40H
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in
_white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in
white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ...
1999 Aug 02
Philips Semiconductors
ADD R/W NAME 7 6 5 4 3 2 1 0 RESET
E8H R/W SAD VHI CH1 CH0 ST SAD7 SAD6 SAD5 SAD4 00H
F0H R/W B B7 B6 B5 B4 B3 B2 B1 B0 00H
F7H W WDTKEY WKEY7 WKEY6 WKEY5 WKEY4 WKEY3 WKEY2 WKEY1 WKEY0 00H
F8H R/W TXT13 (reserved) PAGE 525 (reserved) (reserved) (reserved) (reserved) (reserved) XXXX
0 CLEARING DISPLAY 0 0 0 0 0 XXX0
FAH R/W XRAMP XRAMP7 XRAMP6 XRAMP5 XRAMP4 XRAMP3 XRAMP2 XRAMP1 XRAMP0 00H
FBH R/W ROMBK STANDBY 0 0 0 0 0 (reserved) (reserved) 00H
0 0
FFH R/W WDT WDV7 WDV6 WDV5 WDV4 WDV3 WDV2 WDV1 WDV0 00H
Preliminary specification
SAA55xx
Philips Semiconductors Preliminary specification
1999 Aug 02 17
Philips Semiconductors Preliminary specification
BIT FUNCTION
Port 1 (P1)
P17 to P10 Port 1 I/O register connected to external pins
Port 2 (P2)
P27 to P20 Port 2 I/O register connected to external pins
Port 3 (P3)
P37 to P30 Port 3 I/O register connected to external pins; P37 to P35 are only available with
the LQFP100 package
Port 0 Configuration A (P0CFGA) and Port 0 Configuration B (P0CFGB)
P0CFGA<7:0> and P0CFGB<7:0> These two registers are used to configure Port 0 pins. For example, the I/O
configuration of Port 0 pin 3 is controlled using bit 3 in both P0CFGA and
P0CFGB. P0CFGB<x>/P0CFGA<x>:
00 = P0.x in open-drain configuration
01 = P0.x in quasi-bidirectional configuration
10 = P0.x in high-impedance configuration
11 = P0.x in push-pull configuration
Port 1 Configuration A (P1CFGA) and Port 1 Configuration B (P1CFGB)
P1CFGA<7:0> and P1CFGB<7:0> These two registers are used to configure Port 1 pins. For example, the I/O
configuration of Port 1 pin 3 is controlled using bit 3 in both P1CFGA and
P1CFGB. P1CFGB<x>/P1CFGA<x>:
00 = P1.x in open-drain configuration
01 = P1.x in quasi-bidirectional configuration
10 = P1.x in high-impedance configuration
11 = P1.x in push-pull configuration
Port 2 Configuration A (P2CFGA) and Port 2 Configuration B (P2CFGB)
P2CFGA<7:0> and P2CFGB<7:0> These two registers are used to configure Port 2 pins. For example, the I/O
configuration of Port 2 pin 3 is controlled by using bit 3 in both P2CFGA and
P2CFGB. P2CFGB<x>/P2CFGA<x>:
00 = P2.x in open-drain configuration
01 = P2.x in quasi-bidirectional configuration
10 = P2.x high-impedance configuration
11 = P2.x push-pull configuration
Port 3 Configuration A (P3CFGA) and Port 3 Configuration B (P3CFGB)
P3CFGA<7:0> and P3CFGB<7:0> These two registers are used to configure Port 3 pins. For example, the I/O
configuration of Port 3 pin 3 is controlled using bit 3 in both P3CFGA and
P3CFGB. P3CFGB<x>/P3CFGA<x>:
00 = P3.x in open-drain configuration
01 = P3.x in quasi-bidirectional configuration
10 = P3.x in high-impedance configuration
11 = P3.x in push-pull configuration
1999 Aug 02 18
Philips Semiconductors Preliminary specification
BIT FUNCTION
Power Control Register (PCON)
ARD auxiliary RAM disable, all MOVX instructions access the external data memory
RFI disable ALE during internal access to reduce radio frequency interference
WLE Watchdog Timer enable
GF1 general purpose flag
GF0 general purpose flag
PD Power-down mode activation bit
IDL Idle mode activation bit
Program Status Word (PSW)
C carry bit
AC auxiliary carry bit
F0 flag 0, general purpose flag
RS1 to RS0 register bank selector bits; RS<1:0>:
00 = Bank 0 (00H to 07H)
01 = Bank 1 (08H to 0FH)
10 = Bank 2 (10H to 17H)
11 = Bank 3 (18H to 1FH)
OV overflow flag
P parity bit
Pulse Width Modulator 0 Control Register (PWM0)
PW0E activate this PWM (logic 1)
PW0V5 to PW0V0 pulse width modulator high time
Pulse Width Modulator 1 Control Register (PWM1)
PW1E activate this PWM (logic 1)
PW1V5 to PW1V0 pulse width modulator high time
Pulse Width Modulator 2 Control Register (PWM2)
PW2E activate this PWM (logic 1)
PW2V5 to PW2V0 pulse width modulator high time
Pulse Width Modulator 3 Control Register (PWM3)
PW3E activate this PWM (logic 1)
PW3V5 to PW3V0 pulse width modulator high time
Pulse Width Modulator 4 Control Register (PWM4)
PW4E activate this PWM (logic 1)
PW4V5 to PW4V0 pulse width modulator high time
Pulse Width Modulator 5 Control Register (PWM5)
PW5E activate this PWM (logic 1)
PW5V5 to PW5V0 pulse width modulator high time
1999 Aug 02 19
Philips Semiconductors Preliminary specification
BIT FUNCTION
Pulse Width Modulator 6 Control Register (PWM6)
PW6E activate this PWM (logic 1)
PW6V5 to PW6V0 pulse width modulator high time
Pulse Width Modulator 7 Control Register (PWM7)
PW7E activate this PWM (logic 1)
PW7V5 to PW7V0 pulse width modulator high time
ROM Bank (ROMBK)
STBY Standby mode enabled (logic 1)
I2C-bus Slave Address Register (S1ADR)
ADR6 to ADR0 I2C-bus slave address to which the device will respond
GC enable I2C-bus general call address (logic 1)
I2C-bus Control Register (S1CON)
CR2 to CR0 clock rate bits; CR<2:0>:
000 = 100 kHz bit rate
001 = 3.75 kHz bit rate
010 = 150 kHz bit rate
011 = 200 kHz bit rate
100 = 25 kHz bit rate
101 = 1.875 kHz bit rate
110 = 37.5 kHz bit rate
111 = 50 kHz bit rate
ENSI enable I2C-bus interface (logic 1)
STA START flag. When this bit is set in slave mode, the hardware checks the I2C-bus
and generates a START condition if the bus is free or after the bus becomes free.
If the device operates in master mode it will generate a repeated START
condition.
STO STOP flag. If this bit is set in a master mode a STOP condition is generated.
A STOP condition detected on the I2C-bus clears this bit. This bit may also be set
in slave mode in order to recover from an error condition. In this case no STOP
condition is generated to the I2C-bus, but the hardware releases the SDA and
SCL lines and switches to the not selected receiver mode. The STOP flag is
cleared by the hardware.
1999 Aug 02 20
Philips Semiconductors Preliminary specification
BIT FUNCTION
SI Serial Interrupt flag. This flag is set and an interrupt request is generated, after
any of the following events occur:
• A START condition is generated in master mode
• The own slave address has been received during AA = 1
• The general call address has been received while S1ADR.GC and AA = 1
• A data byte has been received or transmitted in master mode (even if arbitration
is lost)
• A data byte has been received or transmitted as selected slave
• A STOP or START condition is received as selected slave receiver or
transmitter. While the SI flag is set, SCL remains LOW and the serial transfer is
suspended. SI must be reset by software.
AA Assert Acknowledge flag. When this bit is set, an acknowledge is returned
after any one of the following conditions:
• Own slave address is received
• General call address is received (S1ADR.GC = 1)
• A data byte is received, while the device is programmed to be a master receiver
• A data byte is received, while the device is selected slave receiver.
When the bit is reset, no acknowledge is returned. Consequently, no interrupt is
requested when the own address or general call address is received.
I2C-bus Data Register (S1DAT)
DAT7 to DAT0 I2C-bus data
I2C-bus Status Register (S1STA)
STAT4 to STAT0 I2C-bus interface status
Software ADC Register (SAD)
VHI analog input voltage greater than DAC voltage (logic 1)
CH1 to CH0 ADC input channel select; CH<1:0>:
00 = ADC3
01 = ADC0
10 = ADC1
11 = ADC2
ST(1) initiate voltage comparison between ADC input channel and SAD value
SAD7 to SAD4 4 MSBs of DAC input word
Software ADC Control Register (SADB)
DC_COMP enable DC comparator mode (logic 1)
SAD3 to SAD0 4 LSBs of SAD value
Stack Pointer (SP)
SP7 to SP0 stack pointer value
1999 Aug 02 21
Philips Semiconductors Preliminary specification
BIT FUNCTION
Timer/Counter Control Register (TCON)
TF1 Timer 1 overflow flag. Set by hardware on timer/counter overflow. Cleared by
hardware when processor vectors to interrupt routine.
TR1 Timer 1 run control bit. Set/cleared by software to turn timer/counter on/off.
TF0 Timer 0 overflow flag. Set by hardware on timer/counter overflow. Cleared by
hardware when processor vectors to interrupt routine.
TR0 Timer 0 run control bit. Set/cleared by software to turn timer/counter on/off.
IE1 Interrupt 1 edge flag (both edges generate flag). Set by hardware when
external interrupt edge detected. Cleared by hardware when interrupt processed.
IT1 Interrupt 1 type control bit. Set/cleared by software to specify edge/LOW level
triggered external interrupts.
IE0 Interrupt 0 edge l flag. Set by hardware when external interrupt edge detected.
Cleared by hardware when interrupt processed.
IT0 Interrupt 0 type flag. Set/cleared by software to specify falling edge/LOW level
triggered external interrupts.
14-bit PWM MSB Register (TDACH)
TPWE activate this 14-bit PWM (logic 1)
TD13 to TD8 6 MSBs of 14-bit number to be output by the 14-bit PWM
14-bit PWM LSB Register (TDACL)
TD7 to TD0 8 LSBs of 14-bit number to be output by the 14-bit PWM
Timer 0 High byte (TH0)
TH07 to TH00 Timer 0 high byte
Timer 1 High byte (TH1)
TH17 to TH10 Timer 1 high byte
Timer 0 Low byte (TL0)
TL07 to TL00 Timer 0 low byte
Timer 1 Low byte (TL1)
TL17 to TL10 Timer 1 low byte
Timer/Counter Mode Control (TMOD)
GATE gating control Timer/Counter 1
C/T Counter/Timer 1 selector
M1 to M0 mode control bits timer/counter 1; M<1:0>:
00 = 8-bit timer or 8-bit counter with divide-by-32 prescaler
01 = 16-bit time interval or event counter
10 = 8-bit time interval or event counter with automatic reload upon overflow;
reload value stored in TH1
11 = stopped
GATE gating control Timer/Counter 0
C/T Counter/Timer 0 selector
1999 Aug 02 22
Philips Semiconductors Preliminary specification
BIT FUNCTION
M1 to M0 mode control bits timer/counter 0; M<1:0>:
00 = 8-bit timer or 8-bit counter with divide-by-32 prescaler
01 = 16-bit time interval or event counter
10 = 8-bit time interval or event counter with automatic reload upon overflow;
reload value stored in TH0
11 = one 8-bit time interval or event counter and one 8-bit time interval counter
Text Register 0 (TXT0)
AUTO FRAME frame output is switched off automatically if any video displayed (logic 1)
DISABLE FRAME force frame output to be LOW (logic 1)
Text Register 1 (TXT1)
FIELD POLARITY VSYNC pulse in second half of line during even field (logic 1)
H POLARITY HSYNC reference edge is negative going (logic 1)
V POLARITY VSYNC reference edge is negative going (logic 1)
Text Register 4 (TXT4)
OSD BANK ENABLE alternate OSD location available via graphic attribute, additional 32 location
(logic 1)
QUAD WIDTH ENABLE enable display of quadruple width characters (logic 1)
EAST/WEST eastern character selection of character codes A0H to FFH (logic 1)
DISABLE DOUBLE HEIGHT disable normal decoding of double height characters (logic 1)
B MESH ENABLE enable meshing of black background (logic 1)
C MESH ENABLE enable meshing of coloured background (logic 1)
TRANS ENABLE display black background as video (logic 1)
SHADOW ENABLE display shadow/fringe (default SE black) (logic 1)
Text Register 5 (TXT5)
BKGND OUT background colour displayed outside teletext boxes (logic 1)
BKGND IN background colour displayed inside teletext boxes (logic 1)
COR OUT COR active outside teletext and OSD boxes (logic 1)
COR IN COR active inside teletext and OSD boxes (logic 1)
TEXT OUT text displayed outside teletext boxes (logic 1)
TEXT IN text displayed inside teletext boxes (logic 1)
PICTURE ON OUT video displayed outside teletext boxes (logic 1)
PICTURE ON IN video displayed inside teletext boxes (logic 1)
Text Register 6 (TXT6)
BKGND OUT background colour displayed outside teletext boxes (logic 1)
BKGND IN background colour displayed inside teletext boxes (logic 1)
COR OUT COR active outside teletext and OSD boxes (logic 1)
COR IN COR active inside teletext and OSD boxes (logic 1)
TEXT OUT text displayed outside teletext boxes (logic 1)
TEXT IN text displayed inside teletext boxes (logic 1)
PICTURE ON OUT video displayed outside teletext boxes (logic 1)
1999 Aug 02 23
Philips Semiconductors Preliminary specification
BIT FUNCTION
PICTURE ON IN video displayed inside teletext boxes (logic 1)
Text Register 7 (TXT7)
CURSOR ON display cursor at position given by TXT9 and TXT10 (logic 1)
DOUBLE HEIGHT display each character as twice normal height (logic 1)
BOX ON 24 enable display of teletext boxes in memory row 24 (logic 1)
BOX ON 1 − 23 enable display of teletext boxes in memory row 1 to 23 (logic 1)
BOX ON 0 enable display of teletext boxes in memory row 0 (logic 1)
Text Register 8 (TXT8)
FLICKER STOP ON disable ‘Flicker Stopper’ circuitry (logic 1)
DISABLE SPANISH disable special treatment of Spanish packet 26 characters (logic 1)
PKT 26 RECEIVED(2) packet 26 data has been processed (logic 1)
WSS RECEIVED(2) wide screen signalling data has been processed (logic 1)
WSS ON enable acquisition of WSS data (logic 1)
CVBS1/CVBS0 select CVBS1 as source for device (logic 1)
Text Register 9 (TXT9)
CURSOR FREEZE lock cursor at current position (logic 1)
CLEAR MEMORY(1) clear memory block pointed to by TXT15
R4 to R0(2) current memory row value
Text Register 10 (TXT10)
C5 to C0(3) current memory column value
Text Register 11 (TXT11)
D7 to D0 data value written or read from memory location defined by TXT9, TXT10 and
TXT15
Text Register 12 (TXT12)
525/625 SYNC(4) 525-line CVBS signal is being received (logic 1)
ROM VER4 to ROM VER0 mask programmable identification for character set
VIDEO SIGNAL QUALITY acquisition can be synchronised to CVBS (logic 1)
Text Register 13 (TXT13)
PAGE CLEARING software or power-on page clear in progress (logic 1)
525 DISPLAY 525-line synchronisation for display (logic 1)
Text Register 17 (TXT17)
FORCE ACQ1 to FORCE ACQ0 FORCE ACQ<1:0>:
00 = automatic selection
01 = force 525 timing, force 525 teletext standard
10 = force 625 timing, force 625 teletext standard
11 = force 625 timing, force 525 teletext standard
1999 Aug 02 24
Philips Semiconductors Preliminary specification
BIT FUNCTION
FORCE DISP1 to FORCE DISP0 FORCE DISP<1:0>:
00 = automatic selection
01 = force display to 525 mode (9 lines per row)
10 = force display to 625 mode (10 lines per row)
11 = not valid (default to 625 mode)
SCREEN COL2 to SCREEN COL0 Defines colour to be displayed instead of TV picture and black background; these
bits are equivalent to the RGB components. SCREEN COL<2:0>:
000 = transparent
001 = CLUT entry 9
010 = CLUT entry 10
011 = CLUT entry 11
100 = CLUT entry 12
101 = CLUT entry 13
110 = CLUT entry 14
111 = CLUT entry 15
Text Register 18 (TXT18)
NOT3 to NOT0 national option table selection, maximum of 31 when used with EAST/WEST bit
BS1 to BS0 basic character set selection
Text Register 19 (TXT19)
TEN enable twist character set (logic 1)
TC2 to TC0 language control bits (C12, C13 and C14) that has twisted character set
TS1 to TS0 twist character set selection
Text Register 20 (TXT20)
DRCS ENABLE re-map column 9 to DRCS in TXT mode (logic 1)
OSD PLANES character code columns 8 and 9 defined as double plane characters (logic 1)
OSD LANG ENABLE enable use of OSD LAN<2:0> to define language option for display, instead of
C12, C13 and C14
OSD LAN2 to OSD LAN0 alternative C12, C13 and C14 bits for use with OSD menus
Text Register 21 (TXT21)
DISP LINES1 to DISP LINES0 the number of display lines per character row; DISP LINES<1:0>:
00 = 10 lines per character (defaults to 9 lines in 525 mode)
01 = 13 lines per character
10 = 16 lines per character
11 = reserved (logic 1)
CHAR SIZE1 to CHAR SIZE0 character matrix size; CHAR SIZE<1:0>:
00 = 10 lines per character (matrix 12 × 10)
01 = 13 lines per character (matrix 12 × 13)
10 = 16 lines per character (matrix 12 × 16)
11 = reserved
I2C PORT 1 enable I2C-bus Port 1 selection (P1.5/SDA1 and P1.4/SCL1) (logic 1)
1999 Aug 02 25
Philips Semiconductors Preliminary specification
BIT FUNCTION
CC ON closed caption acquisition on (logic 1)
I2C PORT 0 enable I2C-bus Port 0 selection (P1.7/SDA0 and P1.6/SCL0) (logic 1)
CC/TXT display configured for CC mode (logic 1)
Text Register 22 (TXT22)
GPF7 to GPF5 general purpose register, bits defined by mask programmable bits
GPF4 reserved
GPF3 PWM0, PWM1, PWM2 and PWM3 output on Port 2.1 to Port 2.4 respectively
(logic 1)
GPF2 enable closed caption acquisition (logic 1)
GPF1 and GPF0 reserved
Watchdog Timer (WDT)
WDV7 to WDV0 Watchdog Timer period
Watchdog Timer Key (WDTKEY)
WKEY7 to WKEY0(5) Watchdog Timer Key value
XRAMP
XRAMP7 to XRAMP0 internal RAM access upper byte address
Notes
1. This flag is set by software and reset by hardware.
2. Valid range TXT mode 0 to 24.
3. Valid range TXT mode 0 to 39.
4. Only valid when VIDEO SIGNAL QUALITY is set.
5. Must be set to 55H to disable Watchdog Timer when active.
1999 Aug 02 26
Philips Semiconductors Preliminary specification
1999 Aug 02 27
Philips Semiconductors Preliminary specification
handbook, halfpage
7FFFH FFFFH
8C00H
8BFFH
DYNAMICALLY
REDEFINABLE
CHARACTERS
8800H
87FFH
DISPLAY REGISTERS
87F0H
2400H
23FFH 871FH
DISPLAY RAM CLUT
FOR 8700H
TEXT OSD (1)
2000H
845FH
DISPLAY RAM
02FFH FOR
DATA RAM CLOSED CAPTION (1)
0000H 8000H
GSA009
1999 Aug 02 28
Philips Semiconductors Preliminary specification
FFH 01FFH
1999 Aug 02 29
Philips Semiconductors Preliminary specification
9 REDUCED POWER MODES • The third method of terminating Idle mode is with an
external hardware reset. Since the oscillator is running,
There are three power saving modes: Standby, Idle and
the hardware reset need only be active for two machine
Power-down, incorporated into the OSD only device.
cycles (24 clocks at 12 MHz) to complete the reset
When utilizing any of these modes, power to the device
operation. Reset defines all SFRs and Display memory
(VDDP, VDDC and VDDA) should be maintained, since power
to an initialized state, but maintains all other RAM
saving is achieved by clock gating on a section by section
values. Code execution commences with the Program
basis.
Counter set to ‘0000’.
9.1 Idle mode
9.2 Power-down mode
During Idle mode, Acquisition, Display and the Central
In Power-down mode the crystal oscillator is stopped.
Processing Unit (CPU) sections of the device are disabled.
The contents of all SFRs and Data memory are
The following functions remain active:
maintained, However, the contents of the Auxiliary/Display
• Memory interface memory are lost. The port pins maintain the values defined
• I2C-bus interface by their associated SFRs. Since the output values on RGB
• Timer/Counters and VDS are maintained the display output must be made
inactive before entering Power-down mode.
• Watchdog Timer
The Power-down mode is activated by setting the PD bit in
• Pulse Width Modulators.
the PCON register. It is advised to disable the Watchdog
To enter Idle mode the IDL bit in the PCON register must Timer prior to entering Power-down.
be set. The Watchdog Timer must be disabled prior to
There are three methods of exiting Power-down mode:
entering the Idle mode to prevent the device being reset.
Once in Idle mode, the crystal oscillator continues to run, • An external interrupt provides the first mechanism for
but the internal clock to the CPU, Acquisition and Display waking from Power-down. Since the clock is stopped,
are gated out. However, the clocks to the Memory external interrupts need to be set level sensitive prior to
interface, I2C-bus interface, timer/counters, Watchdog entering Power-down. The interrupt is serviced, and
Timer and Pulse Width Modulators are maintained. following the instruction RETI, the next instruction to be
The CPU state is frozen along with the status of all SFRs, executed will be the one after the instruction that put the
internal RAM contents are maintained, as are the device device into Power-down mode.
output pin values. • A second method of exiting power-down is via an
Since the output values on Red Green Blue (RGB) and the interrupt generated by the SAD DC Compare circuit.
Video Data Switch (VDS) are maintained the display When the device is configured in this mode, detection of
a certain analog threshold at the input to the SAD may
output must be disabled before entering this mode.
be used to trigger wake-up of the device i.e. TV Front
There are three methods to recover from Idle mode: Panel Key-press. As above, the interrupt is serviced,
• Assertion of an enabled interrupt will cause the IDL bit to and following the instruction RETI, the next instruction to
be cleared by hardware, thus terminating Idle mode. be executed will be the one following the instruction that
The interrupt is serviced, and following the instruction put the device into the Power-down.
RETI, the next instruction to be executed will be the one • The third method of terminating the Power-down mode
after the instruction that put the device into Idle mode. is with an external hardware reset. Reset defines all
• A second method of exiting the Idle mode is via an SFRs and Display memory, but maintains all other RAM
interrupt generated by the Software Analog-to-Digital values. Code execution commences with the Program
(SAD) DC Compare circuit. When the device is Counter set to ‘0000’.
configured in this mode, detection of an analog
threshold at the input to the SAD may be used to trigger
wake-up of the device i.e. TV Front Panel Key-press.
As above, the interrupt is serviced, and following the
instruction RETI, the next instruction to be executed will
be the one following the instruction that put the device
into Idle mode.
1999 Aug 02 30
Philips Semiconductors Preliminary specification
• Memory interface Note that the I2C-bus ports (P1.4, P1.5, P1.6 and P1.7)
can only be configured as open-drain.
• I2C-bus interface
• Timer/Counters 10.2.2 QUASI-BIDIRECTIONAL
• Watchdog Timer
The quasi-bidirectional configuration is a combination of
• Software ADC open-drain and push-pull. It requires an external pull-up
• Pulse Width Modulators resistor to VDDP (nominally 3.3 V). When a signal transition
from LOW-to-HIGH is output from the device, the pad is
To enter Standby mode, the STANDBY control bit in the
put into push-pull configuration for one clock cycle
ROMBK SFR (bit 7) must be set. It can be used in
(166 ns) after which the pad goes into open-drain
conjunction with either Idle or Power-down modes to
configuration. This configuration is used to speed up the
switch between power saving modes. This mode enables
edges of signal transitions. This is the default state of
the 80C51 core to decode either IR remote commands or
operation of the pads after reset.
receive I2C-bus commands without the device being fully
powered.
10.2.3 HIGH-IMPEDANCE
The Standby state is maintained upon exit from either the The high-impedance configuration can be used for input
Idle mode or Power-down mode. No wake-up from only operation of the port. When using this configuration
Standby is necessary as the 80C51 core remains the two output transistors are turned off.
operational.
Since the output values on RGB and VDS are maintained 10.2.4 PUSH-PULL
the display output must be disabled before entering this The push-pull configuration can be used for output only.
mode. In this configuration the signal is driven to either 0 V or
VDDP, which is nominally 3.3 V.
10 I/O FACILITY
10.3 Port alternative functions
10.1 I/O ports
Ports 1, 2 and 3 are shared with alternative functions to
The SAA55xx devices have 29 I/O lines, each is enable control of external devices and circuitry.
individually addressable, or form 3 parallel 8-bit The alternative functions are enabled by setting the
addressable ports which are Port 0, Port 1 and Port 2. appropriate SFR and also writing a logic 1 to the port bit
Port 3 has 5-bit parallel I/Os only.
that the function occupies.
10.2 Port type 10.4 LED support
All individual ports can be programmed to function in one
Port pins P0.5 and P0.6 have a 8 mA current sinking
of four I/O configurations: open-drain, quasi-bidirectional,
capability to enable LEDs in series with current limiting
high-impedance and push-pull. The I/O configuration is
resistors to be driven directly, without the need for
selected using two associated Port Configuration additional buffering circuitry.
Registers: PnCFGA and PnCFGB (where n = port number
0, 1, 2 or 3); see Table 3.
1999 Aug 02 31
Philips Semiconductors Preliminary specification
1999 Aug 02 32
Philips Semiconductors Preliminary specification
H2
ET0
L2
H3
EX1
L3
H4
ET1
L4
H5
ES2
L5
GSA033
interrupt source global priority
source enable enable control
SFR IE<0:6> SFR IE.7 SFR IP<0:6>
1999 Aug 02 33
Philips Semiconductors Preliminary specification
1999 Aug 02 34
Philips Semiconductors Preliminary specification
14.2 Tuning Pulse Width Modulator (TPWM) The resolution of the DAC voltage with a nominal value is
3.3⁄ ≈ 13 mV. The external analog voltage has a lower
256
The device has a single 14-bit PWM that can be used for
value equivalent to VSSA and an upper value equivalent to
Voltage Synthesis Tuning. The method of operation is
VDDP − Vtn, where Vtn is the threshold voltage for an N type
similar to the normal PWM except that the repetition period
Metal Oxide Semiconductor transistor. The reason for this
is 42.66 µs.
is that the input pins for the analog signals (P3.0 to P3.3)
are 5 V tolerant for normal port operations, i.e. when not
14.3 TPWM control
used as analog input. To protect the analog multiplexer
Two SFRs are used to control the TPWM, they are TDACL and comparator circuitry from the 5 V, a series transistor is
and TDACH. The TPWM is enabled by setting the used to limit the voltage. This limiting introduces a voltage
TPWE bit in the TDACH SFR. The most significant bits drop equivalent to Vtn (≈0.6 V) on the input voltage.
TD<13:7> alter the high period between 0 and 42.33 µs. Therefore, for an input voltage in the range VDDP to
The seven least significant bits TD<6:0> extend certain VDDP − Vtn the SAD returns the same comparison value.
pulses by a further 0.33 µs, e.g. if TD<6:0> = 01H then
1 in 128 periods will be extended by 0.33 µs, if 14.4.3 SAD DC COMPARATOR MODE
TD<6:0> = 02H then 2 in 128 periods will be extended.
The SAD module incorporates a DC Comparator mode
The TPWM will not start to output a new value until TDACH which is selected using the DC_COMP control bit in the
has been written to. Therefore, if the value is to be SADB SFR. This mode enables the microcontroller to
changed, TDACL should be written before TDACH. detect a threshold crossing at the input to the selected
analog input pin (P3.0/ADC0, P3.1/ADC1, P3.2/ADC2 or
14.4 Software ADC (SAD) P3.3/ADC3) of the software ADC. A level sensitive
interrupt is generated when the analog input voltage level
Four successive approximation Analog-to-Digital
at the pin falls below the analog output level of the SAD
Converters can be implemented in software by making use
DAC.
of the on-board 8-bit Digital-to-Analog Converter and
Analog Comparator. This mode is intended to provide the device with a
wake-up mechanism from Power-down or Idle mode when
14.4.1 SAD CONTROL a key-press on the front panel of the TV is detected.
The control of the required analog input is done using the The following software sequence should be used when
channel select bits CH<1:0> in the SAD SFR, this selects utilizing this mode for Power-down or Idle:
the required analog input to be passed to one of the inputs 1. Disable INT1 using the IE SFR.
of the comparator. The second comparator input is
generated by the DAC whose value is set by the bits 2. Set INT1 to level sensitive using the TCON SFR.
SAD<7:0> in the SAD and SADB SFRs. A comparison 3. Set the DAC digital input level to the desired threshold
between the two inputs is made when the start compare bit level using SAD/SADB SFRs and select the required
ST in the SAD SFR is set, this must be at least one input pin (P3.0/ADC0, P3.1/ADC1, P3.2/ADC2 or
instruction cycle after the SAD<7:0> value has been set. P3.3/ADC3) using CH<1:0> in the SAD SFR.
The result of the comparison is given on VHI one 4. Enter DC Compare mode by setting the DC_COMP
instruction cycle after the setting of ST. enable bit in the SADB SFR.
5. Enable INT1 using the IE SFR.
14.4.2 SAD INPUT VOLTAGE
6. Enter Power-down/Idle mode. Upon wake-up the SAD
The external analog voltage that is used for comparison should be restored to its conventional operating mode
with the internally generated DAC voltage does not have by disabling the DC_COMP control bit.
the same voltage range. The DAC has a lower reference
level of VSSA and an upper reference level of VDDP.
1999 Aug 02 35
Philips Semiconductors Preliminary specification
ADC0
ADC1
MUX
4:1
ADC2
ADC3
CH<1:0> VHI
SAD<3:0>
8-BIT
DAC
SADB<3:0>
MBK960
1999 Aug 02 36
Philips Semiconductors Preliminary specification
The I2C-bus consists of a serial data (SDA) line and a The memory is partitioned into two distinct areas, the
serial clock (SCL) line. The definition of the I2C-bus dedicated Auxiliary RAM area, and the Display RAM area.
protocol can be found in the document “The I2C-bus and The Display RAM area when not being used for Data
how to use it (including specification)”. This document may Capture or Display can be used as an extension to the
be ordered using the code 9398 393 40011. auxiliary RAM area.
1999 Aug 02 37
Philips Semiconductors Preliminary specification
1999 Aug 02 38
Philips Semiconductors Preliminary specification
23FFH
TEXT DISPLAY
2000H
86FFH
86FFH
AUXILIARY CC DISPLAY
0000H 8000H
GSA011
1999 Aug 02 39
Philips Semiconductors Preliminary specification
1999 Aug 02 40
Philips Semiconductors Preliminary specification
1999 Aug 02 41
Philips Semiconductors Preliminary specification
CVBS
SWITCH
CVBS
SYNC
ADC SYNC_FILTER
SEPARATOR
data<7:0> VCS
DATA SLICER
ACQUISITION
AND
TIMING
CLOCK RECOVERY
TTC TTD
ACQUISITION
FOR
CC/WSS GSA010
1999 Aug 02 42
Philips Semiconductors Preliminary specification
DISPLAY
TIMING
address
address PARALLEL/SERIAL
MICROPROCESSOR FUNCTION
data data CONVERTER
INTERFACE REGISTERS
control AND FRINGING
address
DATA
CLUT RAM
BUFFER
data
CHARACTER
ROM
AND CHARACTER
DRCs address FONT DAC DAC DAC
ADDRESSING
MBK965 R G B FB
1999 Aug 02 43
Philips Semiconductors Preliminary specification
18.2 Display modes TXT: This attribute is set by the control character ‘flash’
(08H) and remains valid until the end of the row or until
The display section has two distinct modes with different
reset by the control character ‘steady’ (09H).
features available in each. The two modes are:
• TXT: This is the display configured for WST with 18.3.2 BOXES
additional serial and global attributes. The display is
configured as a fixed 25 rows with 40 characters per CC: This attribute is valid from the time set until end of row
row. In the OSD only family this mode can only be or otherwise modified if set with Serial Mode 0. If set with
utilised for display of Text style OSD, no Teletext Data Serial Mode 1, then it is set from the next character
Capture is present. onwards.
• CC: This is the display configured as the US Closed In Text mode (within CC mode) the background colour is
Caption mode. The display is configured as a maximum displayed regardless of the setting of the box attribute bit.
of 16 rows with a maximum of 48 characters per row. Boxes take effect only during mixed mode, where boxes
are set in this mode the background colour is displayed.
In both of the above modes the character matrix, and Character locations where boxes are not set show
TV lines per row can be defined. There is an option of
video/screen colour (depending on the setting in the
9, 10, 13 and 16 TV lines per display row, and a character
MMR Display Control) instead of the background colour.
matrix (H × V) of 12 × 9, 12 × 10, 12 × 13 or 12 × 16. Not all
combinations of TV lines per row and maximum display TXT: Two types of boxes exist, the teletext box and the
rows give a sensible OSD display, since there is a limited OSD box. The teletext box is activated by the ‘start box’
number of TV scan lines available. control character (0BH). Two start box characters are
required to begin a teletext box, with the box starting
Special Function Register TXT21 and memory mapped between the 2 characters. The box ends at the end of the
registers are used to control the mode selection.
line or after a ‘end box’ control character.
18.3 Display feature descriptions TXT mode can also use OSD boxes, they are started using
size, implying OSD control characters (BCH, BDH, BEH
All display features are now described in detail for both and BFH). The box starts after the control character (set
TXT and CC modes. after) and ends either at the end of the row or at the next
size implying OSD character (set at).
18.3.1 FLASH
The attributes flash, teletext box, conceal, separate
Flashing causes the foreground colour pixel to be
graphics, twist and hold graphics are all reset at the start
displayed as the background pixels.The flash frequency is
of an OSD box, as they are at the start of the row.
controlled by software setting and resetting the MMR
OSD boxes are only valid in TV mode which is defined by
Status (see Table 28) at the appropriate interval.
TXT5 = 03H and TXT6 = 03H.
CC: This attribute is valid from the time set (see Table 16)
until the end of the row or until otherwise modified.
1999 Aug 02 44
Philips Semiconductors Preliminary specification
18.3.3 SIZE Three vertical sizes are available normal (×1), double (×2)
and quadruple (×4). The control characters ‘normal size’
The size of the characters can be modified in both the
(0CH/BCH) enable normal size, the ‘double height’ or
horizontal and vertical directions.
‘double size’ (0DH/BDH/0FH/BFH) enable double height
CC: Two sizes are available in both the horizontal and characters. Quadruple height characters are achieved by
vertical directions. The sizes available are normal (×1), using double height characters and setting the global
double (×2) height/width and any combination of these. attributes TXT7.DOUBLE HEIGHT (expand) and
The attribute setting is always valid for the whole row. TXT7.BOTTOM/TOP.
Mixing of sizes within a row is not possible.
If double height characters are used in Teletext mode,
TXT: Three horizontal sizes are available normal (×1), single height characters in the lower row of the double
double (×2) and quadruple (×4). The control characters height character are automatically disabled.
‘normal size’ (0CH/BCH) enables normal size, the ‘double
width’ or ‘double size’ (0EH/BEH/0FH/BFH) enables 18.3.4 ITALIC
double width characters.
CC: This attribute is valid from the time set until the end of
Any two consecutive combination of ‘double width’ or the row or otherwise modified. The attribute causes the
‘double size’ (0EH/BEH/0FH/BFH) activates quadruple character foreground pixels to be offset horizontally by
width characters, provided quadruple width characters are 1 pixel per 4 scan lines (interlaced mode). The base is the
enabled by TXT4.QUAD WIDTH ENABLE. bottom left character matrix pixel. The pattern of the
character is indented as shown in Fig.17.
TXT: The Italic attribute is not available.
MBK970
Field 1
Field 2
1999 Aug 02 45
Philips Semiconductors Preliminary specification
1999 Aug 02 46
Philips Semiconductors Preliminary specification
18.3.9 UNDERLINE CC: The fringe attribute (see Table 16, Serial Mode 0,
bit 9) is valid from the time set until the end of the row or
The underline attribute causes the characters to have the
otherwise modified.
bottom scan line of the character cell forced to foreground
colour, including spaces. If background duration is set, TXT: The display of fringing in TXT mode is controlled by
then underline is set until the end of the text area. the TXT4.SHADOW ENABLE bit.
CC: The underline attribute (see Table 16, Serial Mode When set, all the alphanumeric characters being displayed
0/1, bit 4) is valid from the time set until the end of row or are shadowed, graphics characters are not shadowed.
otherwise modified.
18.3.13 MESHING
TXT: This attribute is not available.
The attribute effects the background colour being
18.3.10 OVERLINE displayed. Alternate pixels are displayed as the
background colour or video.The structure is offset by
The overline attribute causes the characters to have the
1 pixel from scan line to scan line, thus achieving a
top scan line of the character cell forced to foreground
checker board display of the background colour and video.
colour, including spaces. If background duration is set,
An example of meshing is shown in Fig.19.
then overline is set until the end of the text area.
CC: The setting of the MSH bit in MMR Display Control
CC: The overline attribute (see Table 16, Serial Mode 0/1,
has the effect of meshing any background colour.
bit 5) is valid from the time set until end of row or otherwise
modified. Overlining of italic characters is not possible. TXT: There are two meshing attributes one that only
affects black background colours TXT4.B MESH ENABLE
TXT: This attribute is not available.
and a second that only affects backgrounds other than
black TXT4.C MESH ENABLE. A black background is
18.3.11 END OF ROW
defined as CLUT entry 8, a non-black background is
CC: The number of characters in a row is flexible and can defined as CLUT entry 9 to 15.
be determined by the end of row attribute (see Table 16,
Serial Mode 1, bit 9). However, the maximum number of 18.3.14 CURSOR
character positions displayed is determined by the setting
The cursor operates by reversing the background and
of the MMR Text Position Horizontal and MMR Text Area
foreground colours in the character position pointed to by
End.
the active cursor position. The cursor is enabled using
Note that when using the end of row attribute the next TXT7.CURSOR ON. When active, the row the cursor
character location after the attribute should always be appears on is defined by TXT9.R<4:0> and the column is
occupied by a ‘space’. defined by TXT10.C<5:0>. The position of the cursor can
be fixed using TXT9.CURSOR FREEZE. The cursor
TXT: This attribute is not available, row length is fixed at
display is shown in Fig.20.
40 characters.
CC: The valid range for row is 0 to 15. The valid range for
18.3.12 FRINGING column is 0 to 47. The cursor remains rectangular at all
times, its shape is not affected by italic attribute, therefore
A fringe (shadow) can be defined around characters.
it is not advised to use the cursor with italic characters.
The fringe direction is individually selectable in any of the
North, South, East and West direction using the TXT: The valid range for row positioning is 0 to 24.
MMR Fringing Control. The colour of the fringe can also be The valid range for column is 0 to 39.
defined as one of the entries in the CLUT, again using
MMR Fringing Control. An example of south and
south-west fringing is shown in Fig.18.
1999 Aug 02 47
Philips Semiconductors Preliminary specification
MBK972
MBK973
AB C D E F
MBK971
1999 Aug 02 48
Philips Semiconductors Preliminary specification
VOLUME
1999 Aug 02 49
Philips Semiconductors Preliminary specification
1999 Aug 02 50
Philips Semiconductors Preliminary specification
1999 Aug 02 51
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in
_white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in
white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ...
1999 Aug 02
Philips Semiconductors
E/W = 0 E/W = 1
graphics back-
alpha
0 0 1 0 2 green green OSD OSD OSD OSD ground
green
back-
alpha graphics
0 1 1 0 6 OSD OSD OSD OSD ground
cyan cyan
cyan
alpha back-
graphics
0 1 1 1 7 white OSD OSD OSD OSD ground
white
white
52
conceal
1 0 0 0 8 flash display OSD OSD OSD OSD
1 0 0 1 9 steady contiguous
OSD OSD OSD OSD
graphics
separated
1 0 1 0 A end box OSD OSD OSD OSD
graphics
nat nat
1 0 1 1 B start box twist OSD OSD OSD OSD
opt opt
black normal
normal nat nat
1 1 0 0 C back - OSD OSD OSD OSD size
height opt opt
ground OSD
new double
double back - nat nat
1 1 0 1 D OSD OSD OSD OSD height
height opt opt
ground OSD
double
double hold nat nat
1 1 1 0 E OSD OSD OSD OSD width
width graphics opt opt
OSD
Preliminary specification
handbook, full pagewidth
double
double release nat
1 1 1 1 F OSD OSD OSD OSD size
size graphics opt OSD
MBK974
SAA55xx
nat
character dependent on the language of page, refer to National Option characters
opt
1999 Aug 02 53
Philips Semiconductors Preliminary specification
Screen colour is displayed from 10.5 ms to 62.5 ms after 18.6.2 DISPLAY MAP
the active edge of the HSYNC input and on TV lines
The display map allows a flexible allocation of data in the
23 to 310 inclusive, for a 625-line display, and lines
memory to individual rows.
17 to 260 inclusive for a 525-line display.
Sixteen words are provided in the display memory for this
CC: The screen colour is defined by the MMR Display
purpose. The lower 10 bits address the first word in the
Control and points to a location in the CLUT table.
memory where the row data starts. This value is an offset
The screen colour covers the full video width. It is visible
in terms of 16-bit words from the start of Display memory
when the Full Text or Mixed Screen Colour mode is set
(8000H). The most significant bit enables the display when
and no foreground or background pixels are being
not within the scroll (dynamic) area.
displayed.
The display map memory is fixed at the first 16 words in
TXT: The register bits TXT17.SCREEN COL<2:0> can be
the Closed Caption display memory.
used to define a colour to be displayed in place of
TV picture and the black background colour. If the bits are
Table 19 Display map bit allocation
all set to zero, the screen colour is defined as ‘transparent’
and TV picture and background colour are displayed as BIT FUNCTION
normal. Otherwise the bits define CLUT entries 9 to 15.
11 Text display enable, valid outside soft
scroll area. 0 = disable; 1 = enable.
18.6 Text display controls
10 This bit is reserved, should be set to
18.6.1 TEXT DISPLAY CONFIGURATION (CC MODE) logic 0.
Two types of areas are possible. The one area is static and 9 to 0 Pointer to row data.
the other is dynamic. The dynamic area allows scrolling of
a region to take place. The areas cannot cross each other.
Only one scroll region is possible.
1999 Aug 02 54
Philips Semiconductors Preliminary specification
0 0
display
1 possible 1
2 2
3 3
4 4
5 10
6 soft scrolling 11
display Enable
7 display possible 3
map bit = 0
entries 8 4
9 9
10 10
11 11
12 12
13 display 13
14 possible 14
15 15
MBK966
display
data
1999 Aug 02 55
Philips Semiconductors Preliminary specification
18.6.3 SOFT SCROLL ACTION If the number of rows allocated to the scroll counter is
larger than the defined visible scroll area, this allows parts
The dynamic scroll region is defined by the MMR Scroll
of rows at the top and bottom to be displayed during the
Area, MMR Scroll Range, MMR Top Scroll line and the
scroll function. The registers can be written throughout the
MMR Status. The scroll area is enabled when the SCON
field and the values are updated for display with the next
bit is set in MMR Status.
field sync. Care should be taken that the register pairs are
The position of the soft scroll area window is defined using written to by the software in the same field.
the Soft Scroll Position (SSP<3:0>), and the height of the
Only a region that contains only single height rows or only
window is defined using the Soft Scroll Height (SSH<3:0>)
double height rows can be scrolled.
both are in MMR Scroll Range. The rows that are scrolled
through the window are defined using the Start Scroll Row TXT: The display is organised as a fixed size of 25 rows
(STS<3:0>) and the Stop Scroll Row (SPS<3:0>) both are (0 to 24) of 40 columns (0 to 39), This is the standard size
in MMR Scroll Area. for teletext transmissions. The control data in row 25 is not
displayed but is used to configure the display page
The soft scrolling function is done by modifying the Scroll
correctly.
Line (SCL<3:0>) in MMR Top Scroll Line. and the first
scroll row value SCR<3:0> in the MMR Status.
1999 Aug 02 56
Philips Semiconductors Preliminary specification
MBK977
1999 Aug 02 57
Philips Semiconductors Preliminary specification
1999 Aug 02 58
Philips Semiconductors Preliminary specification
18.7 Display positioning The screen colour extends over a large vertical and
horizontal range so that no offset is needed. The text area
The display consists of the screen colour covering the
is offset in both directions relative to the vertical and
whole screen and the text area that is placed within the
horizontal sync pulses.
visible screen area.
horizontal
sync
delay vertical
TEXT AREA sync
56 µs MGL150
1999 Aug 02 59
Philips Semiconductors Preliminary specification
18.7.1 SCREEN COLOUR DISPLAY AREA Note that the Text Position Vertical Register should not be
set to 00H as the Display Busy interrupt is not generated
This area is covered by the screen colour. The screen
in these circumstances.
colour display area starts with a fixed offset of 8 µs from
the leading edge of the horizontal sync pulse in the
18.8 Character set
horizontal direction. A vertical offset is not necessary.
To facilitate the global nature of the device the character
Table 20 Screen colour display area set has the ability to accommodate a large number of
characters, which can be stored in different matrices.
POSITION 525-LINE
Horizontal Start at 8 µs after leading edge of 18.8.1 CHARACTER MATRICES
horizontal sync for 56 µs.
The character matrices that can be accommodated in both
Vertical Line 9, Field 1 (321, Field 2) to leading display modes are:
edge of vertical sync (line numbering
using 625 standard). (H × V × planes) 12 × 9 × 1, 12 × 10 × 1, 12 × 13 × 1,
12 × 16 × 1.
18.7.2 TEXT DISPLAY AREA These modes allow two colours per character position.
The text area can be defined to start with an offset in both In CC mode two additional character matrices are
the horizontal and vertical direction. available to allow four colours per character.
1999 Aug 02 60
Philips Semiconductors Preliminary specification
1999 Aug 02 61
Philips Semiconductors Preliminary specification
2400H
handbook, full pagewidth
LOOK-UP SET 3
0600H
≅ 710 TEXT
OR LOOK-UP SET 2
430 TEXT + 176 CC
0400H
1999 Aug 02 62
Philips Semiconductors Preliminary specification
0 1 2 3 4 5 6 7 8 9 A B C D E F
0 ® SP 0 @ P ú p
1 ˚ ! 1 A Q a q
2 1/2 " 2 B R b r
3 ¿ # 3 C S c s
Character code rows (bits 0 to 3)
4 ™ $ 4 D T d t
5 ¢ % 5 E U e u
6 £ & 6 F V f v
7 ´ 7 G W g w
8 à ( 8 H X h x
9 _ ) 9 I Y i y
A è á : J Z j z
B â + ; K [ k ç
C ê , < L é l
D î - = M ] m Ñ
E ô . > N Í n ñ
F û / ? O ó o n
MBK976
1999 Aug 02 63
Philips Semiconductors Preliminary specification
18.10 Redefinable characters The remapping of the standard OSD to the DRCs is
activated when the TXT20.DRCS ENABLE bit is set.
A number of Dynamically Redefinable Characters (DRCs)
The selection of Normal or Special OSD symbols is
are available. These are mapped onto the normal
defined by the TXT20.OSD PLANES.
character codes, and replace the predefined ROM value.
Each character is stored in a matrix of 12 × 16 × 1
There are 32 DRCs, the first 16 occupy the character
(V × H × planes), this allows for all possible character
codes 80H to 8FH, the second 16 occupy the locations
matrices to be defined within a single location.
90H to 9FH. This allows for 32 DRCs or 16 Special DRCs.
A
01
883F 02
8840 03
04
CHARACTER 2 82H 05
885F 06
07
08
09
0A
0B
0C
8BC0 0D
0E
CHARACTER 30 9EH 0F
8BDF
12 bits
8BE0
CHARACTER 31 9FH
8BFF MBK969
1999 Aug 02 64
Philips Semiconductors Preliminary specification
1999 Aug 02 65
Philips Semiconductors Preliminary specification
1999 Aug 02 66
Philips Semiconductors Preliminary specification
1999 Aug 02 67
Philips Semiconductors Preliminary specification
1999 Aug 02 68
Philips Semiconductors Preliminary specification
20 LIMITING VALUES
In accordance with Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VDDX supply voltage (all supplies) −0.5 +4.0 V
VI input voltage (any input) note 1 −0.5 VDD + 0.5 or 4.1 V
VO output voltage (any output) note 1 −0.5 VDD + 0.5 V
IO output current (each output) − ±10 mA
IIOK DC input or output diode current − ±20 mA
Tamb operating ambient temperature −20 +70 °C
Tstg storage temperature −55 +125 °C
Note
1. This maximum value refers to 5 V tolerant I/Os and may be 6 V maximum, but only when VDD is present.
21 CHARACTERISTICS
VDD = 3.3 V ± 10%; VSS = 0 V; Tamb = −20 to +70 °C; unless otherwise specified.
1999 Aug 02 69
Philips Semiconductors Preliminary specification
1999 Aug 02 70
Philips Semiconductors Preliminary specification
1999 Aug 02 71
Philips Semiconductors Preliminary specification
1999 Aug 02 72
Philips Semiconductors Preliminary specification
1
5. C 0(max) = 35 – --- ( C osc + C IO + C ext )
2
1999 Aug 02 73
Philips Semiconductors Preliminary specification
Notes
1. A device must internally provide a hold time of at least 300 ns for the SDA signal (referred to the VIH(min) of the SCL
signal) in order to bridge the undefined region of the falling edge of SCL.
2. The maximum fHD;DAT has only to be met if the device does not stretch the LOW period tLOW of the SCL signal.
3. A fast-mode I2C-bus device can be used in a standard-mode I2C-bus system, but the requirement tSU;DAT ≥250 ns
must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal.
If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line
trmax + tSU;DAT = 1000 + 250 = 1250 ns (according to the standard-mode I2C-bus specification) before the SCL line
is released.
4. Cb = total capacitance of one bus line in pF.
1999 Aug 02 74
Philips Semiconductors Preliminary specification
Notes to Tables 30 to 33
1. ppm = fraction of defective devices, in parts per million.
2. FPM = fraction of devices failing at test condition, in Failures Per Million.
3. FITS = Failures In Time Standard.
1999 Aug 02 75
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in
_white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in
white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ...
23 APPLICATION INFORMATION
Philips Semiconductors
and On-Screen Display (OSD)
TV microcontrollers with Closed Captioning (CC)
40 V VDD VDD
A0 VDD
A1 RC
Vtune PH2369 EEPROM
VDD VDD A2 PCF8582E SCL
VSS SDA
47 µF 100 nF
VDD
VSS VSS VSS
VSS
VDD VSS
P2.0/TPWM P1.5/SDA1
1 52
P2.1/PWM0 P1.4/SCL1
brightness 2 51
P2.2/PWM1 P1.7/SDA0
contrast 3 50
P2.3/PWM2 P1.6/SCL0 TV
saturation 4 49 control
P2.4/PWM3 P1.3/T1 signals
hue 5 48
P2.5/PWM4 P1.2/INT0
volume (L) 6 47
P2.6/PWM5 P1.1/T0
volume (R) 7 46
P2.7/PWM6 P1.0/INT1
8 45
VSS VDDP VDD
P3.0/ADC0 IR
9 44
Vafc 10 µF RECEIVER
P3.1/ADC1 RESET VDD
AV status 10 43
P3.2/ADC2 XTALOUT
11 42
12 MHz
P3.3/ADC3 XTALIN
12 41 VDD
76
program+
VSSD OSCGND 56 pF
13 40
VSS VDD 100 nF 47 µF
P0.0 SAA55xx VDDC
program− VHF-L 14 39
VSSP VSS
P0.1
VHF-H 15 38
P0.2 VSS
TV control VSYNC
menu UHF 16 37 field flyback
signals
P0.3 HSYNC
17 36 line flyback
P0.4 VDS
18 35
minus(−)
P0.5 R
19 34
VDD 1 kΩ P0.6 33 G
plus(+) 20
P0.7 32 B
VSS 1 kΩ 21
VSSA VDDA VDD to TV’s
31
VSS 22 150 Ω VDD display
CVBS0 P3.4/PWM7 circuits
30
23
100 nF CVBS1 COR
Preliminary specification
24 29 VSS
100 nF SYNC_FILTER VPE
CVBS (IF)
25 28
VSS
CVBS (SCART) IREF FRAME
26 27
SAA55xx
100 nF 24 kΩ
MBK980
VSS
24 ELECTROMAGNETIC COMPATIBILITY (EMC) Using a device socket will unfortunately add to the area
GUIDELINES and inductance of the external bypass loop.
Optimization of circuit return paths and minimisation of A ferrite bead or inductor with resistive characteristics at
common mode emission will be assisted by using a double high frequencies may be utilised in the supply line close to
sided printed-circuit board (PCB) with low inductance the decoupling capacitor to provide a high impedance.
ground plane. To prevent pollution by conduction onto the signal lines
(which may then radiate) signals connected to the
On a single-sided PCB a local ground plane under the
VDD supply via a pull up resistor should not be connected
whole Integrated Circuit (IC) should be present as shown
to the IC side of this ferrite component.
in Fig.32. This should be connected by the widest possible
connection back to the PCB ground connection, and bulk OSCGND should be connected only to the crystal load
electrolytic decoupling capacitor. It should preferably not capacitors and not the local or circuit ground.
connect to other grounds on the way, and no wire links
Physical connection distances to associated active
should be present in this connect. The use of wire links
devices should be short.
increases ground bounce by introducing inductance into
the ground. Output traces should be routed with close proximity to
mutually coupled ground return paths.
The supply pins can be decoupled at the pin to the ground
plane under the IC. This is easily accomplished using
surface mount capacitors, which are more effective than
leaded components at high frequency.
VDDA
IC
VSSC VSSA MBK979
1999 Aug 02 77
Philips Semiconductors Preliminary specification
25 PACKAGE OUTLINES
SDIP52: plastic shrink dual in-line package; 52 leads (600 mil) SOT247-1
seating plane
D ME
A2 A
L
A1
c
Z e w M (e 1)
b1
MH
b
52 27
pin 1 index
E
1 26
0 5 10 mm
scale
UNIT
A A1 A2
b b1 c D (1) E (1) e e1 L ME MH w Z (1)
max. min. max. max.
1.3 0.53 0.32 47.9 14.0 3.2 15.80 17.15
mm 5.08 0.51 4.0 1.778 15.24 0.18 1.73
0.8 0.40 0.23 47.1 13.7 2.8 15.24 15.90
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
90-01-22
SOT247-1
95-03-11
1999 Aug 02 78
Philips Semiconductors Preliminary specification
LQFP100: plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm SOT407-1
c
y
X
A
75 51
76 50
ZE
E HE A A2 (A 3)
A1
w M
θ
bp
Lp
L
pin 1 index
100 detail X
26
1 25
ZD v M A
e w M
bp
D B
HD v M B
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
95-12-19
SOT407-1
97-08-04
1999 Aug 02 79
Philips Semiconductors Preliminary specification
26 SOLDERING The total contact time of successive solder waves must not
exceed 5 seconds.
26.1 Introduction to soldering through-hole mount
packages The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
This text gives a brief insight to wave, dip and manual
specified maximum storage temperature (Tstg(max)). If the
soldering. A more in-depth account of soldering ICs can be
printed-circuit board has been pre-heated, forced cooling
found in our “Data Handbook IC26; Integrated Circuit
may be necessary immediately after soldering to keep the
Packages” (document order number 9398 652 90011).
temperature within the permissible limit.
Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit 26.3 Manual soldering
board.
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
26.2 Soldering by dipping or by solder wave
2 mm above it. If the temperature of the soldering iron bit
The maximum permissible temperature of the solder is is less than 300 °C it may remain in contact for up to
260 °C; solder at this temperature must not be in contact 10 seconds. If the bit temperature is between
with the joints for more than 5 seconds. 300 and 400 °C, contact may be up to 5 seconds.
26.4 Suitability of through-hole mount IC packages for dipping and wave soldering methods
SOLDERING METHOD
PACKAGE
DIPPING WAVE
DBS, DIP, HDIP, SDIP, SIL suitable suitable(1)
Note
1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
1999 Aug 02 80
Philips Semiconductors Preliminary specification
27 DEFINITIONS
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
1999 Aug 02 81
Philips Semiconductors Preliminary specification
NOTES
1999 Aug 02 82
Philips Semiconductors Preliminary specification
NOTES
1999 Aug 02 83
Philips Semiconductors – a worldwide company
Argentina: see South America Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +31 40 27 82785, Fax. +31 40 27 88399
Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +64 9 849 4160, Fax. +64 9 849 7811
Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Norway: Box 1, Manglerud 0612, OSLO,
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, Tel. +47 22 74 8000, Fax. +47 22 74 8341
220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Pakistan: see Singapore
Belgium: see The Netherlands Philippines: Philips Semiconductors Philippines Inc.,
Brazil: see South America 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA, Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. +359 2 68 9211, Fax. +359 2 68 9102 Tel. +48 22 612 2831, Fax. +48 22 612 2327
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Portugal: see Spain
Tel. +1 800 234 7381, Fax. +1 800 943 0087 Romania: see Italy
China/Hong Kong: 501 Hong Kong Industrial Technology Centre, Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +7 095 755 6918, Fax. +7 095 755 6919
Tel. +852 2319 7888, Fax. +852 2319 7700 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Colombia: see South America Tel. +65 350 2538, Fax. +65 251 6500
Czech Republic: see Austria Slovakia: see Austria
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Slovenia: see Italy
Tel. +45 33 29 3333, Fax. +45 33 29 3905 South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
Finland: Sinikalliontie 3, FIN-02630 ESPOO, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +358 9 615 800, Fax. +358 9 6158 0920 Tel. +27 11 471 5401, Fax. +27 11 471 5398
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, South America: Al. Vicente Pinzon, 173, 6th floor,
Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 04547-130 SÃO PAULO, SP, Brazil,
Germany: Hammerbrookstraße 69, D-20097 HAMBURG, Tel. +55 11 821 2333, Fax. +55 11 821 2382
Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Spain: Balmes 22, 08007 BARCELONA,
Hungary: see Austria Tel. +34 93 301 6312, Fax. +34 93 301 4107
India: Philips INDIA Ltd, Band Box Building, 2nd floor, Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Tel. +91 22 493 8541, Fax. +91 22 493 0966 Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Indonesia: PT Philips Development Corporation, Semiconductors Division, Tel. +41 1 488 2741 Fax. +41 1 488 3263
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874
Ireland: Newstead, Clonskeagh, DUBLIN 14, Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
Tel. +353 1 7640 000, Fax. +353 1 7640 200 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, Tel. +66 2 745 4090, Fax. +66 2 398 0793
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI), ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Tel. +39 039 203 6838, Fax +39 039 203 6800 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
Tel. +82 2 709 1412, Fax. +82 2 709 1415 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +1 800 234 7381, Fax. +1 800 943 0087
Tel. +60 3 750 5214, Fax. +60 3 757 4880 Uruguay: see South America
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Vietnam: see Singapore
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Middle East: see Italy Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors, Internet: http://www.semiconductors.philips.com
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Printed in The Netherlands 545004/01/pp84 Date of release: 1999 Aug 02 Document order number: 9397 750 05737