FUCULTY OF ENGINEERING

DEPARTMENT

OF

ELECTRICAL POWER ENGINEERING

SUBJECT

INSTRUMENTOIN AND CONTROL I

(INCT101)

PRACTICAL SIMULATION ASSIGNMENT

SIMULATION AND TESTING OF TEMPERATURE MEASUREMENT SYSTEM IN

MULTISIM

SEMESTER 2020A

REPORT SUBMISION
(HARD COPY and SOFT COPY TO TURNITIN)
REPORT SUBMISION GUIDE IN TURNITIN: TBA.
On or Before: Tuesday: 28 April 2020, 08:00 am.
DO NOT EMAIL YOUR REPORT.

Plagiarism Declaration to be signed by student on submitting work for assessment

I know and understand that plagiarism is using another person’s work and pretending it is one’s own, which is wrong. This report is
my own work. I have appropriately referenced the work of other people I have used. I have not allowed, and will not allow, anyone
to copy my work with the intention of passing it off as his or her own work.

……………………………………………………………………………………………………………………………
Name (in capital letters) Student Number Signature

DEPARTMENT OF ELECTRICAL POWER ENGINEERING

P.O. Box 1334, Durban, 400, Tel: 031 373 2062 or 031 373 2743, Fax: 031 373 2063

Revised: January 2020. Revised by: MC Leoaneka

Objectives

1. Design, test, and troubleshoot an application of the Wheatstone bridge and Op-Amp circuits using Multisim.
2. Compare the calculated values with the measurements obtained using Multisim.

After completing this lab, you should be able to:

 Describe the operation of a Resistance Temperature Detector, RTD (Background information for this assignment)

 Design a balance Wheatstone bridge circuit when the RTD temperature is 0°C.

 Design and implement an instrumentation amplifier in Multisim.

 Analyze electrical circuits, which include Wheatstone-bridge, Buffer amplifiers and Op-amps.

 Integrate the above subsystems to create an overall temperature measurement system in Multisim.

ii
Table of Contents

Table of Contents .............................................................................................................................................................. iii

List of Figures ................................................................................................................................................................... iii

1 Introduction ................................................................................................................................................................1

2 Literature Review.......................................................................................................................................................1

3 Design of Temperature Measurement System ...........................................................................................................2

3.1 Introduction ........................................................................................................................................................2

3.1 RTD Selection and Characteristic ......................................................................................................................3

3.2 Wheatstone Bridge Design and Balancing .........................................................................................................3

3.4 Differential Amplifier Design ............................................................................................................................4

3.5 Design this temperature measurement system using an inverting summing amplifier ......................................5

4 Simulation of Temperature Measurement System in Multisim ..........................................................................5

4.1 Resistance Measurement ....................................................................................................................................6

4.2 Implementation of Temperature Measurement System in Multisim .................................................................6

4.3 Implementation of Temperature Measurement System in section 3.5 in Multisim ...........................................7

5 Discussion of Results .............................................................................................................................................8

6 Conclusion ..............................................................................................................................................................8

References ..........................................................................................................................................................................8

Appendix A – Summary of Calculated Values and Simulation Results ........................................................................... A

Appendix B – Thin Film Platinum RTD ........................................................................................................................... B

Appendix C - Report Writing ............................................................................................................................................ C

Appendix C - Report Assessment Rubric ......................................................................................................................... D

List of Figures

Figure 1.1: Elements of a measurement system. [1] ......................................................................................................1

Figure 3.1: Temperature measurement system block diagram. ..................................................................................2

Figure 3.2: Wheatstone bridge........................................................................................................................................4

Figure 3.3: Differential amplifier circuit. ......................................................................................................................5

Figure 4.2: Overall temperature measurement system Schematic diagram. .............................................................7

Figure 4.3: Temperature measurement system Schematic diagram. ..........................................................................8

iii
1 Introduction

Temperature is one of the most frequently used process measurements. The expansion or contraction of solids, liquids
or gases, the change in electrical resistance of conductors and semiconductors, thermoelectric e.m.f.s and the change in
the current across the junction of semiconductor diodes and transistors are all examples of properties that change when
the temperature changes and can be used as basis of temperature sensors. [1]

In this assignment, you will design a simple temperature measurement system, which outputs a DC voltage, which
corresponds to the change in temperature. The system will use a RTD to detect the temperature; the electrical resistance
of the RTD changes as the temperature changes. You will use a Wheatstone bridge circuit to convert this resistance
change to a voltage change. The voltage output of the Wheatstone bridge circuit will be small relative to the amount of
temperature change (the measurement is said to have low sensitivity), so you will use an instrumentation amplifier to
increase the overall sensitivity of the temperature measurement system.

An instrumentation system for making measurements consists of several elements, which are used to carry out particular
functions. These functional elements are shown in Figure 1.1.

Display

Input Output:
Sensor Signal Record measured
True processor value of
value of variable
variable
Transmit

Figure 1.1: Elements of a measurement system. [1]

The selection of a sensor for a particular application requires a consideration of the nature of the measurement required.
This means considering the variable to be measured, its nominal value, the range of values, the accuracy required, the
required speed of measurement, the reliability required and the environmental conditions under which the measurement
is to be made.

The nature of the output required from the sensor, this determining the signal processing required. The selection of
sensors cannot be taken in isolation from a consideration of the form of output that is required from the system after
signal processing, and thus there has to be a suitable marriage between sensor and signal processing. Then possible
components can be identified, taking into account such factors as their range, accuracy, linearity, speed of response,
reliability, life, power supply requirements, ruggedness, availability and cost.

2 Literature Review

“This practical simulation assignment requires a preliminary literature review; it should cover all the relevant theory and
any other detailed technical information needed to carry out this assignment. Any theoretical predictions would normally
be included in this section, although this may vary depending on the nature of the report. The subject matter of the theory
section should be logically developed, in carefully thought-out steps, under appropriate subheadings. Where diagrams

1
and equations are used to assist in the development of the theory, these should be properly introduced in the text: you
should never leave your reader having to guess why a diagram or equation has been put in a report.” [2]

The preliminary literature review should cover but not limited to the following points:

Temperature sensor overview, Types of temperature sensors, Temperature sensor selection, Measurement
principle of RTD, RTD Construction, RTD characteristic (Resistance Versus Temperature), RTD temperature
coefficient of resistance (), RTD Dissipation constant (Self-heating), Signal processing and conditioning
(Wheatstone bridge, Buffer amplifier, Differential amplifier), and Display (Voltmeter).

3 Design of Temperature Measurement System

3.1 Introduction

Design approaches tend to vary from individual to individual, however, the recommended procedures for this assignment
consist of the four discrete steps provided below. Feel free to modify these steps if you wish, but be prepared to
explain your design approach.

A common approach to this problem is to use a Wheatstone bridge circuit in conjunction with an Instrumentation
amplifier circuit to achieve the necessary sensitivity between temperature and output voltage. A block diagram of the
overall system is shown in Figure 3.1. The input to the overall system is the temperature of the RTD. The RTD converts
the temperature change into an output resistance change. This resistance change is used in a Wheatstone bridge circuit,
which converts this resistance change to a voltage change. The output voltage of the Wheatstone bridge circuit is
generally smaller than desired, so an amplifier is used to increase the amplitude of the overall output voltage from the
system. The list of main components are outlined in Table 3.1 below.

Figure 3.1: Temperature measurement system block diagram.

Table 3.1: List of Main Equipment.

Temperature Sensor Thin film platinum RTD
Signal processing Wheatstone bridge
Signal conditioner Instrumentation Amplifier
Display Voltmeter

In this practical, you are required to design a temperature measurement system using the RTD in Table 3.2 to measure
a temperature in the range, 00C to 1000C. Test the circuit under different temperature values in steps of 100C.

2
3.1 RTD Selection and Characteristic

a. RTD Specification

Select a Thin film platinum RTD as specified in Table 3.2.

Table 3.2: Thin film platinum RTD specification.

Type Thin film platinum RTD, (Name: HEL-700-TOA)
R at 0°C 100 Ω
Coefficient A 3.908 × 10−3 ℃−1
Coefficient B −5.775 × 10−7 ℃−2
Coefficient C −4.183 × 10−12 ℃−4

b. Calculate and record RTD resistance in Table 3.3 as temperature changes from 0ºC to 100ºC in steps of 10ºC intervals.
The resistance of thin film platinum RTD increases with temperature according to the following relation in Equations
1 to 3.

𝑡 > 0℃: 𝑅𝑡 = 𝑅0 (1 + 𝐴𝑡 + 𝐵𝑡 2 ) (1)

𝑡 = 0℃: 𝑅𝑡 = 𝑅0 (2)
𝑡 < 0℃: 𝑅𝑡 = 𝑅0 {1 + 𝐴𝑡 + 𝐵𝑡 2 + 𝐶𝑡 3 (𝑡 − 100)} (3)

Table 3.3: Temperature versus Resistance.

Temperature, ºC 0 10 20 30 40 50 60 70 80 90 100
RT, Ω (From Data sheet 100
or calculated)

c. Plot the RTD resistance, RRTD as temperature changes from 0ºC to 100ºC.

3.2 Wheatstone Bridge Design and Balancing

Design and build a Wheatstone bridge circuit which converts the resistance variation of the RTD to a voltage variation.
The output of this circuit should be (approximately) zero volts when the RTD temperature is 0ºC. Provide a schematic
of your Wheatstone bridge circuit in your report, along with the desired and actual resistance values used in the circuit.
Also in your report, record the voltage variation provided by the Wheatstone bridge circuit, resulting from the full range
of temperature change, from 0ºC to 100ºC.

In Figure 3.2, if it is assumed that all four resistances in the Wheatstone bridge have identical nominal values. In the
case when the Wheatstone bridge output voltage is to result from a varying resistance sensor, this requires one to obtain
two resistors with resistance exactly equal to the sensor’s nominal resistance.

The bridge is “balanced” when VAB=0, i.e. voltage reading, VAB is zero (approximately ± 0.05 volts). This occurs when
the ratio of R1:(RT @ 0°C) = R2:R3. The voltmeter can be zeroed around the nominal value of the RTD. Then, the Voltage
readings of VAB can be monitored as the temperature changes from 0°C to 100°C in steps of 10°C.

3
 Figure 3.2: Wheatstone bridge.

Determine the resistor values of the Wheatstone bridge circuit, such that the output voltage, VAB is positive over the
temperature range and the current through RTD is less than or equal to recommended operating current. Then, Calculate
and record the output voltage of the Wheatstone bridge corresponding to temperature changes from 0ºC to 100ºC in steps
of 10ºC intervals in Table 3.4. Varying RRTD to simulate the temperature variations, the bridge becomes unbalanced,
producing bridge output voltage variations. Plot the output voltage of the bridge as temperature changes from 0ºC
to 100ºC in steps of 10ºC.

Table 3.4: Temperature versus Bridge output Voltage, VAB.

Temperature, ºC 0 10 20 30 40 50 60 70 80 90 100

VAB, volts

3.4 Differential Amplifier Design

The minimum output voltage from the differential amplifier should be 0 V (approximately ±50 mV) when the
temperature of the RTD is at 0°C and the current through RTD should be less than or equal to recommended operating
current.

The output voltage from the Instrumentation amplifier should vary from 0 to 10 Volts when the temperature of RTD
varies from 0°C to 100°C.
That is: VOut,Max = VCC -2, VCC refers to a positive terminal of the Instrumentation amplifier.

VOut,Min = VEE +2, VEE refers to a negative terminal of the Instrumentation amplifier.

If VCC =12 V, then, VOut,Max = 10 V. Therefore, never exceed VOut,Max= VCC -2.

If VEE = -12 V, then, VOut,Min = -10 V. Therefore, never exceed VOut,Min= VEE +2.

Output voltage should be positive over a temperatures range of 0°C to 100°C.

0 V ≤ VOutput ≤ +10 V

4
Design a differential amplifier which amplifies the output voltage difference from the Wheatstone bridge to the levels
specified in the design requirements. The circuit schematic for a difference amplifier is provided in Figure 3.3.

Figure 3.3: Differential amplifier circuit.

Implement the circuit and provide a schematic of your circuit, along with desired and actual resistance values used in
your circuit in your report. The transfer function for this amplifier is given by Equation 2.

vOP  Amp Output 

R2
va  vb  (2)
R1

Calculate and record the output voltage of the differential amplifier as temperature changes from 0ºC to 100ºC in steps
of 10ºC in Table 3.5. Varying RRTD to simulate the temperature variations, the bridge becomes unbalanced, producing
bridge output voltage variations. The differential amplifier to make it suitable for display will amplify the voltage
variations. Plot the output voltage of the amplifier, VOP-Amp-Output as temperature changes from 0ºC to 100ºC.

Table 3.5: Temperature versus differential Amplifier output Voltage, VOP-Amp-Output.

Temperature, ºC 0 10 20 30 40 50 60 70 80 90 100

VOP-Amp-Output, volts

3.5 Design this temperature measurement system using an inverting summing amplifier

4 Simulation of Temperature Measurement System in Multisim

The process of model creation and use is just the scientific method in miniature. A model is a simplified representation
of a system. It would be expensive to build the real system to see if it works. More often, the model is just a first step in
designing a system. The steps in a simulation are:

 Define the system and define the objective,

 Determine the model’s scope and scale ( what is in it and how much detail ),
 Choose a programming language and code the model
 Run the model
 Gather data and analyse it.

5
4.1 Resistance Measurement

Create a schematic in Multisim for the circuit in Figures 4.1 below. Run the simulation and record the resistance of RTD
as the temperature changes from 0℃ to 100℃ in steps of 10℃ intervals in Table 4.1. Plot the RTD resistance, RRTD as
temperature changes from 0ºC to 100ºC.

Figure 4.1: Resistance measurement.

4.2 Implementation of Temperature Measurement System in Multisim

Implement the overall temperature measurement system in Multisim and verify that voltage increases as temperature
increases and decreases as temperature decreases. Record the range of voltages in your report, corresponding to the full
range of temperature change provided in the design requirements. Given the design requirements, and the schematic
diagram for the circuit design as shown in Figures 4.2:

 Build the circuit indicated in Figure 4.2 using Multisim.

 Test the circuit under different RTD values in steps of 100C intervals.
 Adjust RRTD (by pressing the T or SHIFT+T keys) until RT is equal to corresponding RTD resistance values as
temperature changes from 00C to 1000C, (Varying RRTD to simulate the temperature variations in steps of 10ºC).
 Using Multisim, record voltage readings, VAB and VOutput in Table 4.1 as temperature changes from 00C to 1000C at
100C intervals.
 Plot the measured output voltage, VAB as temperature changes from 0ºC to 100ºC.
 Plot the measured output voltage, VOutput as temperature changes from 0ºC to 100ºC.

6
 Figure 4.2: Overall temperature measurement system Schematic diagram.

Table 4.1: Simulation results.

Temperature (ºC) 0 10 20 30 40 50 60 70 80 90 100

RT, Ω (Measured)

VAB, (V) (Measured)

Vout, (V) (Measured)

4.3 Implementation of Temperature Measurement System in section 3.5 in Multisim

Implement the overall temperature measurement system using the inverting summing amplifier in Multisim and verify
that voltage increases as temperature increases and decreases as temperature decreases. Record the range of voltages in
your report, corresponding to the full range of temperature change provided in the design requirements. Include the
schematic diagram and results for the circuit design using the inverting summing amplifier. Given the design
requirements, and the schematic diagram for the circuit design as shown in Figures 4.3:

 Build the circuit using the inverting summing amplifier in Multisim.

 Test the circuit under different RTD values in steps of 100C intervals.
 Adjust RRTD (by pressing the T or SHIFT+T keys) until RT is equal to corresponding RTD resistance values as
temperature changes from 00C to 1000C, (Varying RRTD to simulate the temperature variations in steps of 10ºC).
 Using Multisim, record output voltage readings, as temperature changes from 00C to 1000C at 100C intervals.
 Plot the measured output voltage as temperature changes from 0ºC to 100ºC.

7
 Figure 4.3: Temperature measurement system Schematic diagram.

Table 4.2: Simulation results.

Temperature (ºC) 0 10 20 30 40 50 60 70 80 90 100

Voutput, (V) (Measured)

5 Discussion of Results

The Discussion of results is the most important part of the report that is, Analysis and interpretation of results. The
discussion of the results includes but not limited to the following:

1 Compare expected results with those obtained, see Table A1 in Appendix A,

2 Analyze errors,

3 Explain results in terms of theory,

4 Relate results to objective (s),

5 Compare results to similar studies,

6 Analyze the strengths and limitations of design implementation in Multisim.

6 Conclusion

In successful completion of this practical simulation assignment, you must be able to demonstrate that you understand
temperature measurement system design in the form of technical report. The material in the report should be arranged
in the sequence shown in Table B1 in Appendix A. The assessment criterial is shown in Appendix C.

References

[1] W. Bolton: Instrumentation and Control Systems, 2004

[2] http://www.ee.und.ac.za/School/School Information 2002/Report Writing.htm, “Guidelines to Report
Writing”, 22 April 2008.

8
Appendix A – Summary of Calculated Values and Simulation Results

The design calculations should be in the main body of the report. The output values calculations, (RRTD, VAB, VOutput)
should be in the Appendix, includes large Tables like Table A1.

Table A1: Summary of Calculated Values and Simulation Results.

Temp Calculation Values Simulation Results

(°C) RRTD VAB VOutput RRTD VAB VOutput

10

20

30

40

50

60

70

80

90

100

A
Appendix B – Thin Film Platinum RTD
################## Component Detail Report ##################

Group(ANSI) Group(DIN)

Family(ANSI) Family(DIN)

################## Component ##################

Database Name: Master Database

Family Group: Misc
Family: TRANSDUCERS
Name: HEL-700-T0A
Author: DMN; HDM
Date: October 17, 2006
Function: Thin Film Platinum RTD
Thermal resistance junction: 0.00
Thermal resistance case: 0.00
Power dissipation: 0.00
Derating Knee Point: 0.00
Min Operating Temp: -200.00
Max Operating Temp: 540.00
ESD: 0.00

################## Symbol ##################

Symbol(ANSI) Symbol(DIN)

################## Model ##################

Model ID: HEL-700-T

Model manufacturer: Honeywell Sensing and Control
Model template:

* !!!BEGIN-INTERACT
* : increment ++++f4 ;
* -200.0 constant mintemp
* 540.0 constant maxtemp
* 100.0 VARIABLE resistance
* 100.0 VARIABLE zerodegres
* 3.908e-3 VARIABLE coeffA
* -5.775e-7 VARIABLE coeffB
* -4.183e-12 VARIABLE coeffC
* 27.0 VARIABLE setting

B
Appendix C - Report Writing

Using suitable diagrams, graphs, and tables, present your findings of this practical simulation assignment in a report of
not more than 20, A4 pages, using a format acceptable for the technical report writing. The report should include the
following items in Table C1 below. (No copy paste from the internet).

Table C1: Headings and page numbering [2]

Headings Page numbers
Cover page / Title page
Abstract ii
Table of contents Use Roman numerals iii
List of symbols iv
Introduction 1
Objectives Number each page 2
Method or Methodology or Procedures sequentially from 1 …
Discussion of results / Interpretation of results …
Conclusion and recommendations …
References Number each page A1
Appendices sequentially from A1 A2

REPORT SUBMISION
(HARD COPY and SOFT COPY IN TURNITIN)
REPORT SUBMISION GUIDE IN TURNITIN: TBA.
On or Before: Tuesday: 20 April 2020, 08:00 pm.
DO NOT EMAIL YOUR REPORT.

NOTE: If you cannot get to DUT to hand in on time, then you may send the printed copy by Courier
(OVER NIGHT DILIVERY SERVICE) before the deadline, Latest Friday: 24 April 2019, 09:00 am.

Save a Multisim file name as your student number and email it to: [email protected]

PENALTIES FOR LATE SUBMISSIONS: ITEM WILL BE RETURNED UNMARKED.

NOTICE:
· Submission date is FINAL.
· Penalty for late submission is given above.
· The student is expected to plan pro-actively in case of eventualities such as study commitments, sickness etc.

C
Appendix C - Report Assessment Rubric

OUTCOME CRITERIA 0-4

Layout, The report is well laid out, the presentation is excellent, and the spelling and
Presentation, grammar are of high standard. See Appendix of Study Guide.
Spelling &
Grammar
Logic of The reader finds it easy to follow the logic of the information; Report is
Information Consistently clear and focused.
Layout
Abstract All the following words describe the abstract: informative, concise,
Statement of the work performed its objectives and scope, and the major
conclusions reached.
Introduction The introduction does all of the following: gives an overview of the practical;
the limitations of the practical; discusses the benefits of the practical; has a
broad plan that leads the reader through the simulation practical process.

Technical Content The main body text deals with all of the following: significance of the
(Design) practical; validity and reliability of the work done in the practical; evaluation
of the practical with theory; problems encountered and solutions found;
evaluation of the effectiveness of the methods used to carry out the practical.
(The design calculations should be in the main body of the report.)
Calculations Calculations are all: relevant; accurate; well laid out. The output values
calculations (RRTD, VAB, Voutput,) should be in the Appendix.
Figures, Tables & Figures, Diagrams & Tables are all: clearly drawn; relevant to the text;
Diagrams meaningful.
Conclusion The conclusion deals with all of the following: key-points; decisions made;
outcomes; observations; etc
Referencing A comprehensive reference list is given indicating that the student has done
adequate research. All references are referred to in the text in a consistent
manner.
Appendices Appendices are referred to in the main text; play an important role; the
report would be incomplete without them.
TOTAL / 40

TOTAL %
Assessor Comments:

4 = All components are included and outcome is fully achieved.

3 = Most components are included and outcome is mostly achieved.
2 = Most components are included and outcome is only partly achieved.
1 = Little if any components are included and outcome is NOT achieved.
0 = Item omitted entirely or is of unacceptably low standard.