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PCB DESIGN

BASICS
Hello friends!!

Welcome to the world of PCB designing, where you will not only learn but update yourself with various
advance technologies and designing tips.

First of all, let us see the basic of PCB Designing step by step, which will give you an idea what exactly
PCB designing is?

First step is schematic capture or schematic entry is done through an EDA (Electronic Design
Automation) tool.

Card dimensions and template are decided based on required circuitry and case of the PCB.
Determine the fixed components and heat sinks if required.

Deciding stack layers of the PCB. 4 to 12 layers or more depending on design complexity.
Ground plane and Power plane are decided. Signal planes, where signals are routed, are in top
layer as well as internal layers.

Line impedance determination using dielectric layer thickness, routing copper thickness and
trace-width. Trace separation also taken into account in case of differential signals.
Microstrip, stripline or dual stripline can be used to route signals.

Placement of the components. Thermal considerations and geometry are taken into account.
Vias and lands are marked.

Routing the signal trace. For optimal EMI per formance high frequency signals are routed in
internal layers between power or ground planes as power plane behaves as ground for AC.

And the last step Geber File generation for manufacturing.

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PCB DESIGN

DEFINITION
Printed Circuit = Electric circuit in which the conducting paths connecting circuit components are
affixed to a flat insulating board.

PWB vs. PCB

PWB = Printed Wiring Board
Copper traces and pads create point-to-point connection of components.

PCB = Printed Circuit Board

A PWB that contains functional circuits or components that are embedded in the copper.

IN THE BEIGNING
Engineer
Concept of design
Rough “scribble” of schematic
Breadboard proofing of concept

Designer
Hand draw full schematic
Hand draw layout of component placement (2x, 4x)
Hand tape circuitry on to mylar film
Hand inking of components and board nomenclature
Drill templates created using dots, donuts, symbols

Manufacturer
Photo-reduction of taped ar twork
Chemical etching of copper laminates
Hand cut silkscreens to squeegee onto board
“Bulls eye” drilling of holes
Hand mounting and soldering of components
Hand probes used to test functionality

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PCB DESIGN

ADVANCES MADE
Manufacturing
First to utilize advances in automation and computers
Digitizing replaces photo-reduction
NC Drill replaced “Bulls eye” drilling
Photographic imaging to create silkscreens
“Pick & Place” machines for component mounting
Wave solder machines reduces hand soldering

Designing
Hand drawing layouts digitized to create 1x film ar twork
CAD programs developed for board layout
Output of Gerber data to create 1x film ar twork
Output of NC Drill tapes

TODAY
Engineer
Develop concept and schematic in CAD/CAE tools
Computer simulating design replaces breadboard

Designer
CAD tools tie schematic and layout for “Intelligent” Designs
Component placement and circuit routing automated
Data output increased to include: Gerber data, NC Drill data, component placement data,
net list data, testing data, etc.

Manufacturer
Use Gerber and NC Drill data to fabricate bare board
Use component placement data to assemble board
Use net list and testing data to verify final product

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PCB DESIGN

DESIGN TECHNOLOGY GROWTH

General population likes what they see and want more

Industry answers the demands of their Customers

Technological growth results:

Smaller product packaging

More functionality per circuit card
Smaller components, Sur face Mount and Micro Technology
Increased component to board area density

Demand for faster time to market

Panelization for easier handling
Increased automation for faster turn around

Increased Demand for Quality Product

Statistical Process Control (SPC)
- Used for improving manufacturing and assembly processes

Concurrent Engineering (CE)

Design Engineer, PCB Designer, ManufacturingEngineer, Test Engineer, and Quality
Engineer all working as a team to develop the ultimate design

Integrated Product Development System (IPDS)

Development Team expanded to include the Customer and Suppliers
Concept to Delivery and Suppor t

“Design for…” becomes new buzz words for the electronic industry
DFM, DFT, DFR, DFC…DFX

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PCB DESIGN

INDUSTRY STANDARDS
Board Level
IPC-2221 Generic Standard for Printed Board Design
IPC-4101 Specification for Base Materials
IPC-4103 Materials for High Speed/High Frequency boards
IPC-7351 Sur face Mount Design and Land Pattern
IPC-SM-840 Solder Mask Standard
IPC-TM-650 Test Methods Manual

Assembly Level
IPC-A-610 Acceptability of Printed Board Assemblies
J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies

Documentation
MIL-STD-100 Engineering Drawing Practices
ASME Y14.100 Replaces MIL-STD-100 for non-Military
IPC-D-325 Documentation Requirements for Printed Boards, Assemblies and Suppor t
Drawings
ASME Y14.5 Dimensioning and Tolerancing

CLASSES AND TYPES

1. Performance Classes
Determined by End use of product

2. Board Types
Bare board configurations

3. Producibility Levels
Circuit design complexity

4. Assembly Classes
Component mounting complexity

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PCB DESIGN

1. PERFORMANCE CLASSES
Class 1 – General Electronics Products
Main impor tance is functionality. Cosmetic imper fections not impor tant
Some computers and computer peripherals

Class 2 – Dedicated Service Electronics Products

Extended life and uninterrupted service desired, but not required
Communications, sophisticated business machines, instruments

Class 3 – High Reliability Electronics Products

Continued per formance or per formance on demand is required. Downtime is not acceptable
Life suppor t systems, critical weapons systems

2. BOARD TYPES
Type 1 – Single-Sided Printed Board
Type 2 – Double-Sided Printed Board
Type 3 – Multilayer without blind and/or buried vias
Type 4 – Multilayer with blind and/or buried vias
Type 5 – Multilayer Metal Core without blind and/or buried vias
Type 6 – Multilayer Metal Core with blind and/or buried vias

3. PRODUCIBILITY LEVELS
Level A - General Design Complexity
Preferred

Level B - Moderate Design Complexity

Standard

Level C - High Design Complexity

Reduced Producibility

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PCB DESIGN

4. ASSEMBLY CLASSES
Class A – Through-hole mounted components only
Class B – Sur face Mount components only
Class C – Simplistic through-hole and sur face mount intermixed assembly
Class X – Complex intermixed assembly (Through-hole, sur face mount, fine pitch and BGA)
Class Y – Complex intermixed assembly (Through-hole, sur face mount, ultrafine pitch and chip
scale)
Class Z – Complex intermixed assembly (Through-hole, ultrafine pitch, COB, flip-chip and TAB)

COMPONENTS
Types of Components
Passive vs. Active
Symbols and Designations

Package Types
Through-hole
Sur face Mount

Surface Mount Lead Styles

Polarity and Orientation

TYPES OF COMPONENTS
Passive Components: Basic function does not change when they receive a signal

Component Function Symbol Designation

Capacitor Stores and discharges C
electricity

Resistor Limits the flow of electrical R

current 1 3
2 4

Inductor Creates magnetic field when L

current flows through

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PCB DESIGN

TYPES OF COMPONENTS
Active Components: Basic function of component changes when a signal is received

Component Function Symbol Designation

Diode Only allows current to flow in D or CR
one direction. Changes AC to DC. ZONOR
Voltage limiter for DC
voltage (zener)
LED

Transistor Amplify, oscillate, and provide C 3

Q
1

switching action on electrical B NPN

circuits E
2

C 3

1
B PNP
2
E

Integrated Various Signal Processing Determined by U

Circuit (IC) functions function of device

PACKAGES TYPE
Surface Mount - Components with leads that are mounted directly onto lands that are on the
sur face of the board

Package Type Description Typical Components

Chip Usually ceramic bodied package with Resistors, Capacitors,
metal termination on each and rectangular Inductors, some Diodes

MELF Metal Electrode Face Diodes, Resistors

Metal terminations on each end of cylindrical body

LCC Leadless Chip Carrier ICs

No leads, metalization in form of castellations for attachment

SOIC Small Outline Integrated Circuit ICs

Similar to DIP package with leads formed for sur face mounting

QFP Quad Flat Pack ICs

Leads extend from four sides of the component

BGA Ball Grid Array ICs

Sur face mount version of PGA.
Leads are tiny metal balls on bottom of component

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PCB DESIGN

SURFACE MOUNT LEAD TYPE

Gull Wing - Bends down and away from component
J-Lead - Bends down and under component
L-Lead - Inward formed under component
Flat Lead - Extends straight out from component
Ball - Tiny metal ball mounted to bottom sur face
Lead Pitch - Distance from center of one pin to center of adjacent pin
Standard: 25 - 50 mils
Fine: 11.8 - 19.7 mils
Ultrafine: < 11.8 mils

POLARITY AND ORIENTATION

Polarity
Positive and negative ends of a two pin device
Positive or anode lead graphical representation
Capacitor - Identified with a (+) and/or square pad
Diode - Identified flat end of triangle and/or square pad
Negative or cathode lead graphical representation
Capacitor - Not identified
Diode - Identified by bar end of diode symbol

Orientation
Identification of pin 1 of multi-pin devices
Dot, notch or number identification on component
Square pad or silkscreened dot on board sur face
Pin count direction typically counter-clockwise from pin 1

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PCB DESIGN

DOCUMENTATION
1. Master Drawing
Supplies all the information needed to fabricate the bare board
Minimum information required per IPC-D-325:
Design requirements Silkscreen requirements
Board detail & construction Marking requirements
Conductor definition Bow & twist requirements
Minimum spacing requirements Test coupons requirements
Ar twork configuration control Electrical Test requirements
Fabrication allowances Per formance requirements
Solder mask requirements Master pattern drawing
Reference to CAD data

MASTER DRAWING SAMPLE

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PCB DESIGN

DOCUMENTATION
3. Printed Board Assembly Drawing
PRINTED BOARD ASSEMBLY DRAWING SAMPLE

4. Parts List – Bill of Materials (BOM)

Tabulation of all parts and materials used in the construction of a printed board assembly
Can be a Separate Parts List or Integral Parts List
Minimum information required per IPC-D-325 :
Item (Find) Number
Electrical component cross-reference
Par t Information
(1) Components (2) Hardware (3) Bulk Materials
Quantities
Referenced Processes

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PCB DESIGN

DOCUMENTATION
4. Parts List – Bill of Materials (BOM)
PART LIST BILL OF MATERIALS(BOM) SAMPLE

Parts List, 15000173, Revision B2, 7-JAN-97

Item Supplier Par t# Description Reference Assembly Variation Quantity

Designator 01 02 03 04
01 Hadco 5101342 Board BRD1 1 1
02 Nec 8201342 Board BRD1 1 1
03 Motorola 1N6378 Diode D1, D2 2 2
04 Motorola 1N6337 Diode D1, D2 2 2
05 HP 5082-2835 Diode Schottky D3 1 1 1 1
06 Dialight 550-3007 Connector, VME 100 pin J1 1 1 1 1
07 Signetic 74HTC126E IC, Dip E1 1 1 1 1
SUB Harris CD74HTC125E IC, Dip E1 1 1 1 1
08 Signetic 74HTC126E IC, Dip E2 1 1
09 Harris CD74HTC125N IC, Dip E2 1 1
10 Kemet C322C104M5U5CA Capacitor, .1uF, 50V, Mono C1-C3 3 3 3 3
11 Maxim MAX238CWG IC, SMT GULL E3 1 1 1 1
12 Kemet C12062C104K5RAC Capacitor, 1206 .1uF C4, C5 2 2 2 2
SUB MEPCO 12062R104K9BB0 Capacitor, 1206 .1uF C4, C5 2 2 2 2
13 BRADY LTA-1-652-10 Label, 0.25 x 1.875 1 1 1 1
14 BRADY LTA-1-655-08 Label 1 1 1 1

5. Schematic Diagram
Graphical representation of symbols, electrical connections, components and functions of a
specific circuit arrangement.
Minimum information required per IPC-D-325 :
Functional flow left to right, top to bottom
Reference Designations for each component depicted
Unused pins
Spares
Ground and Power Table
Highest reference designation used
Reference designations not used
Definition of non-standard symbols used

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PCB DESIGN

DOCUMENTATION
5. Schematic Diagram
SCHEMATIC DIAGRAM SAMPLE:

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PCB DESIGN

PCB DESIGN PROCESS

This was the basic introduction now we will see PCB design process in detail, which will help you to
understand design process very precisely and thoroughly.

PCB designing process sequence:

Before the design

Preparing the design
Draw the board
Impor t the net
Place the par ts
Route the traces
Final work
Post processing

BEFORE THE DESIGN

You will need (as a minimum)
The required dimensions of the board
A list of par ts to be used on the board
The data sheets for each par t
A schematic diagram of the board

Board Domension
Where does the board go?
Into a case
Slides into a rack

What are the external dimensions for the board?

Board requires connections to:

Obtain power
Exchange information
Display results

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PCB DESIGN

BEFORE THE DESIGN

Board Dimension
Where do the connectors go?

What size connectors are to be used?

How is the board held in place?

Guide rails
Mounting bracket(s)
Bolts

Are there any height restrictions?

Some components have higher profiles

Transformers
Large capacitors
Batteries

What thickness of copper should be used?

The more current to be carried, the thicker the copper has to be.
Copper laminate thickness is usually given in ounces per square foot
For general use boards, a common thickness is 1 oz copper (1.4 mil, 0.0014in,
0.035mm, 35m)

Part List

Known also as the BOM (bill of materials)

Each par t is must be identified by a unique reference designator and a par t description
e.g. R5 “1 k, ¼ watt metal film resistor, 5%”

Data Sheet For Each Part

The most impor tant information is the physical dimensions of the par t
if you do not have a data sheet obtain par t and measure it yourself
not as accurate as using par t manufacturer’s information, but better than guessing

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PCB DESIGN

BEFORE THE DESIGN

Schematic Diagram Of The Design
Shows the connection of the par ts on the board
Each par t on schematic has a reference designator that matches that on the BOM
Most ECAD programs give an automatic generation of the BOM

PREPARING THE DESIGN

Two steps involved here are:
A. Generation of the netlist
B. Creating the Par ts Database

Generation of The Netlist

The netlist is a file that has the device names of the par ts used on the board
It also shows the “nets” - interconnections between the pins of the par ts
Although can be typed by hand if schematic was manually drawn best to let system generate it
from the schematic
The netlist file is critical to PCB function. Should be double checked as the smallest mistake
can cause board to be scrapped

Creating The Parts Database

Most ECAD systems define the par ts to be placed on the board as a special type of file called the
PDB file
Allows better use of computer memory and disk resources by allowing multiple instances
PDB is built in a hierarchy
Devices Packages Pads
Pads
Entities that inter face the par t pins to the copper traces of the board
Pad must be big enough top allow enough copper around a hole (for thru-hole components)
If pad is too large may have trouble soldering
Many ECAD systems include solder mask information with the pad files
Packages
Entities that represent the par t. Consist of lines and text
Lines represent the maximum dimensions of the par t on the assembly drawing and the layout

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PCB DESIGN

PREPARING THE DESIGN

Creating The Parts Database
Lines are also drawn on a different layer to represent the par t outline on the silkscreen legend
Text shows the designator for the par t when placed on the board
Devices
Entities that link the value or par t number of a par t with the ECAD package
Thus can design one “DIP14” package and a number of device files to link “74S00” and other
par t numbers to it in the netlist
On many systems these are text files to allow for selective swapping of pins and mapping of pin
numbers to a different pin when inser ted

DRAW THE BOARD

First draw outline of the board

Need a datum

Place tool holes at three corners

Two are on same ver tical axis and third on same horizontal axis as the first
Hole at intersection of horizontal and ver tical axis is the datum or (0,0) coordinate of the PCB

May need to set-up placement keep-out areas:

if board fits into a card rack need to allow for amount of board that sits in the slides
a keep- out of 0.050” around board edge to allow for manufacturing tolerances

May need special keep-out areas:

to impose height limitations
to limit what par ts and signals may be routed within them
to allow for testing and assembly

IMPORT THE NETLIST

The netlist is then read in and associated with any pre-existing fixed par ts on the board
Any errors made will usually be apparent here – automatic error detection is one of the big
advantages of using ECAD systems

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PCB DESIGN

PLACE THE PARTS

Placement factors
Electrical function
Physical size
Temperature factors
Routability
Most ECAD programs have autoplacement options. Often only good for boards with just a few
par ts
Even for manual placement programs have aids
Ratsnest display shows all connections

Placement Guidelines
Can save space by using both sides of the board in the old days par ts went on one side called
the component side. With the advent of sur face mount this is now the “primary” side, as
components can be placed on both sides
Sur face mount devices are smaller than conventional ones
Use a standard grid. A common size is 0.025”
easier to align components
Place par ts in only one or two orientations, ver tical and horizontal
non-or thogonal angles are harder to assemble
Place polarized par ts in the same orientation to keep assembly and repair errors to a minimum
all diode cathodes to be up or to the right
Place IC packages in an even matrix and make sure they are functionally grouped
power and ground connections will be easier
Arrange par ts so:
they are evenly spaced
do not overlap
their pads are a sufficient distance apar t to allow traces to pass between them
pads should have minimum 0.020” gap in a general purpose board
Axial par ts such as resistors and capacitors should be placed so:
there is an equal amount of lead wire on either side of the body
the two pads are at a similar distance as other axial par ts
general value is 0.500” for smaller par ts

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PCB DESIGN

PLACE THE PARTS

Placement Guidelines
Usually should not allow a lead to bend more than twice the lead diameter from the body of the
par t
Allow sufficient diameter around mounting holes for hardware to be inser ted and tightened
without affecting neighbouring par ts
Allow sufficient distance between par ts so that their leads will not touch when bent over to
secure them before soldering

Edge connector device placed to reduce routing length

Analog circuit placed near output connector to reduce digital noise

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PCB DESIGN

PLACE THE PARTS

Placement Guidelines

Device driving analog circuit placed adjacent to analog circuit

Other devices placed according to circuit flow

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PCB DESIGN

PLACE THE PARTS

Placement Guidelines

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PCB DESIGN

PLACE THE PARTS

Placement Guidelines

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PCB DESIGN

ROUTING THE BOARD

Routing is the connecting of the par ts that have been placed on the board
Can be done manually or automatically
usually better to do automatically
Even if adopt automatic routing it is good practice to lay out power and ground traces
use a “rail” structure where possible with parallel ground and power traces between rows of Ics
use a wide trace for these runs 0.05” for power and 0.100” for ground can usually use 0.025”
traces for connecting each par t to to the rail but do calculations first
Good routing strategy normally has traces on side of the board ver tical, with the other horizontal.
It is cheaper to have signal traces 0.013” on a 0.025” centers. Many shops can do 0.004” on
0.008” centers (or even finer), but this is often overkill
Good routing strategy normally means trace should be as shor t and direct as possible
Could be possible to have all signal traces star ting and ending on a component pad
trace would then snake around so much that circuit function is degraded
avoid this problem by using pads without component leads. These are called feed-thrus or vias
Vias allow better routing of the board as ver tical/horizontal strategy is maintained as well as
minimizing signal path
Although professional designers take pride in minimizing number of vias, they lead to better
designs
Critical signals are best done by hand. This allows the signal trace to have less bends and vias than
the auto router would use
Flag the trace before turning on the auto router so that it is not moved
On a complex board some signals will not be routed and must be finished manually
This is where the skill of the designer comes in
If 95% of the board is finished by the auto router, it can be quite time consuming and tricky to finish
the last 5% manually

FINAL WORK
After placement and routing is complete will need to:
(A) Adjust the silkscreen legend
(B) Prepare a fabrication drawing
(C) Prepare an assembly drawing

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PCB DESIGN

FINAL WORK
(A) Adjust The Silkscreen Legend

Par t outlines need to be trimmed to keep lines off pads and vias
many ECAD programs do this automatically
Reference designators need to be moved for same reason and also so they can be seen when
par t is installed
May need other details to be shown

(B) Prepare A Fabrication Drawing

Dimensions of board are to be shown in reference to the datum tool hole

Different symbol should be shown for each hole size
Table to be given showing quantity of each hole size

(C) Prepare As Assembly Drawing

Used as an aid for building and repairing the board

Outlines of par ts and reference designators to be shown
Any special assembly instructions to be shown
For simple boards some companies just use a copy of the silkscreen legend as their assembly
drawing

POST PROCESSING
Prepares data that is used by the manufacturer to generate the finished board
First step is to print the fabrication and assembly drawings
Should check these before sending out. Correction of mistakes once board has been made are very
expensive
Second step is to generate the NC drill file of hole positions
Manufacturer uses this data to set-up for drilling the boards
Can set up drills by optically inputting data from assembly drawing
this is more expensive and error prone
better to generate the drill file
Third step is to generate the ar t work for the board
Each layer of the board must have a master ar twork with opaque features on a clear background
May be possible to do printing yourself but better to send to a reprographic company
Many manufacturers accept photo plot files (gerber files)

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PCB DESIGN

PCB DESIGN TOOLS & SOFTWARES

Here is the list of various designing tools & softwares with their applications, which helps you to
design your PCB as per your requirement.

EAGLE
Nice, easy to use CAD/CAM software for PCB schematic and routing. .BRD files for prototyping. You
can download free evaluation version.

gEDA
gEDA is a free, open-source schematic capture and layout package that runs on Linux.

ZenitPCB
ZenitPCB is a freeware layout software.

PCB
Free unix PCB editor.

FREE-PCB
FreePCB is a free, open-source printed circuit board layout editor for Microsoft Windows!

TinyCAD
TinyCAD is a free open-source schematic editor.

KICAD
GPL open source schematic capture and PCB routing.

TCI3
Free PCB routing and schematic capture software.

SCORE
Free schematic capture software (Alfa version).

OSMOND PPC
FREE MAC PCB CAD/CAM software.

MINIMAL PCB EDITOR

Open source schematic capture and board layout editor for windows.

PROTEL
CAD/CAM software for schematic and routing. You can download 30 days free trial. Protel offers
free old-DOS based software called EasyTrax.

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PCB DESIGN

PCB DESIGN TOOLS & SOFTWARES

CADSTAR
CAD/CAM software for schematic and routing. Have free for download limited demo version.

ORCAD
CAD/CAM software. No demo/evaluation version.

CIRCUIT MAKER
CAD/CAM software for schematic and routing. You can download limited demo version.

P-CAD 2000
PCB CAD/CAM software. You can download FREE trial version.

PCB ELEGANCE
Nice looking CAD/CAM software for schematic and routing. You can download limited demo
version.

EDWIN
CAD/CAM software for schematic and routing. You can download limited demo version.

VISUALPC
You can download limited demo version.

BPECS32
Very limited PCB CAD software. You can download limited demo version.

AUTOENGINEER
PCB CAD/CAM software. You can download limited demo version.

EXPERT PCB
PCB CAD/CAM software. You can download limited demo version.

CIRCAD
PCB CAD/CAM software. You can download limited demo version.

LAYOUT
PCB CAD/CAM software. You can download free version.

CIRCUIT LAYOUT
PCB CAD/CAM software. You can download limited demo version.

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PCB DESIGN

PCB DESIGN TOOLS & SOFTWARES

MCCAD
PCB CAD/CAM software. You can download limited demo version.

DREAM CAD
Japanese PCB CAD/CAM software. You can download limited demo version.

E-CAD
Supermax CAD/CAM software, runs on NT. You can download limited demo version.

POWERPCB
CAD/CAM software. No demo/evaluation version.

PCB ASSISTANT
Low cost PCB CAD software. You can download limited demo version.

PCB DESIGNER
Low cost PCB CAD software. You can download limited demo version.

QCAD
PCB CAD/CAM software. You can download limited demo version.

QUICK ROUTE
PCB CAD/CAM software. You can download limited demo version.

TARGET 3001
PCB CAD/CAM software. You can download limited demo version.

WIN CIRCUIT 98
PCB CAD/CAM software. You can download limited demo version.

BOARD EDITOR
Low cost PCB CAD software. You can download free demo version.

VUTRAX
PCB CAD/CAM software. You can download limited demo version.

CIRCUIT CREATOR
PCB CAD/CAM software. You can download free demo version.

PADSPCB
PADS PCB CAD/CAM software. You can download free limited demo version on this ftp server.

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PCB DESIGN

PCB DESIGN TOOLS & SOFTWARES

DESIGN WORKS
PCB schematic capture and simulation software. You can download free evaluation version.

LAY01
PCB CAD/CAM software with limited demo version (200 pins) for free download.

GElectronic
Low cost PCB routing and schematic capture software.

PRO-Board, PRO-Net
Schematic capture and routing for AMIGA computers.

CSIEDA
Schematic capture and routing for PC.

VISUALPCB
Low cost schematic capture, spice and routing for PC.

WINBOARD
CAD/CAM software for schematic and routing. You can download limited demo version.

ULTIBOARD
CAD/CAM software for schematic and routing. You can download limited demo version.

EASY PC
PCB CAD/CAM software.

RANGER
PCB CAD/CAM software. You can download limited demo version.

PROTEUS
Low cost CAD/CAM software. You can download limited demo version.

EPD - Electronics Packaging Designer

RF/hybrid/flex design tools based on AutoCAD.No demo available for direct download.

AutoTrax Eda
Schematic design and PCB routing software. You can download free copy from the web site.

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 PCB Supplier of the Best Quality, Lowest Price
and Reliable Lead Time

PCB DESIGN

PCB DESIGN TOOLS & SOFTWARES

SprintLayout
Low cost tool to create layouts for single-sided and double-sided PCBs . You can download limited
demo version from the web site. NO DRC check which make this program quite useless.

CADINT
Schematic capture and PCB routing. Have 30 days trial version for download.

Merlin PCB Designer

Shareware for Corel Draw which allow PCBs to be routed.

WINQCAD
Schematic capture, PCB routing, autorute. Have free 200 pin version for download.

Pulsonix
PCB schematic capture and routing software. 100 pin restricted demo available.

DIPTRACE
PCB schematic capture and routing software. 30 days evaluation version. Not-for-profit version
available allows 4 layers and 1000 pins.

RIMU PCB
Low cost PCB schematic capture and routing software. Demo version is available for download

TopoR
Schematic capture and PCB layout with some unique features as round edges auto-routing, made in
Russia. Demo version is available for download

TINA
Schematic capture and PCB layout with analysis and spice. Demo version is available for download.

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 The Best Quality PCB Supplier

36 Nanleen Rise, The Gardens

PO Box 75474, Manurewa, Auckland-NZ

Phone : +64 9 269 6916 | Fax : +64 9 269 6926

Mobile : +64 21 0304183

Visit us: www. qualieco circuits.co.nz • • • • • •