Visible Penetrant Examination Using The Water-Washable Process
Visible Penetrant Examination Using The Water-Washable Process
Visible Penetrant Examination Using The Water-Washable Process
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This test method is under the jurisdiction of ASTM Committee E-7 on Annual Book of ASTM Standards, Vol 05.01.
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Nondestructive Testing and is the direct responsibility of Subcommittee E07.03 on Annual Book of ASTM Standards, Vol 11.01.
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Liquid Penetrant and Magnetic Particle Methods. Annual Book of ASTM Standards, Vol 03.03.
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Current edition approved Dec. 10, 1998. Published February 1999. Originally Available from the American Society for Nondestructive Testing, 1711 Arlin-
published as E 1418 – 91. Last previous edition E 1418 – 92. gate Lane, PO Box 28518, Columbus, OH 43228–0518.
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2.3 Military Standard: normally used for production examination of large volumes of
MIL-STD-410 Nondestructive Testing Personnel Qualifica- parts or structures, where emphasis is on productivity. This test
tion and Certification6 method offers a wide latitude in applicability when extensive
2.4 AIA Standard: and controlled conditions are available.
NAS-410 Certification and Qualification of Nondestructive
Test Personnel7 6. Reagents and Materials
2.5 DoD Contracts — Unless otherwise specified, the issue 6.1 Visible, Water-Washable Liquid Penetrant Examination
of the documents that are DoD adopted are those listed in the Materials, consisting of applicable visible penetrants as rec-
issue of the DoDISS (Department of Defense Index of Speci- ommended by the manufacturer, and are classified as Type II
fications and Standards) cited in the solicitation. Visible Method A—Water-Washable (see Note 2).
NOTE 2—Refer to 8.1 for special requirements for sulfur, halogen, and
2.6 Order of Precedence — In the event of conflict between alkali metal content.
the text of this test method and the references cited herein, the NOTE 3—Caution: While approved penetrant materials will not ad-
text of this test method takes precedence. versely affect common metallic materials, some plastics or rubber may be
swollen or stained by certain penetrants.
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Incoming Parts
Spray Dip
Developer
DRY DEVELOP (Aqueous)
Dry
(See 7.1.6) (See 7.1.7)
Developer, Dry,
DEVELOP DRY Nonaqueous or
Liquid Film Dry
(See 7.1.7) (See 7.1.6)
EXAMINE
Visible (See 7.1.8) Examine
Mechanical
Water Rinse Detergent
Wash
POST CLEAN
(See 7.1.10 and Prac-
tice E 165, Annex
on Post Cleaning.)
Dry
7.1.1 Temperature Limits—The temperature of the penetrant blasting to remove the peened skin, and when penetrant
materials and the surface of the part to be processed should be entrapment in surface irregularities might mask the indications
from 40 to 120°F (4 to 49°C). When it is not practical to of unacceptable discontinuities or otherwise interfere with the
comply with these temperature limitations, the procedure must effectiveness of the examination. For metals unless otherwise
be qualified at the temperature of intended use as described in specified, perform etching when evidence exists that previous
9.2. cleaning, surface treatments, or service usage have produced a
7.1.2 Surface Conditioning Prior to Penetrant surface condition that degrades the effectiveness of penetrant
Examination—Satisfactory results can usually be obtained on examination. (See Annex A1.1.1.8 in Test Method E 165 for
surfaces in the as-welded, as-rolled, as-cast, or as-forged precautions).
conditions (or for ceramics in the densified condition). When
NOTE 6—When agreed between purchaser and supplier, grit blasting
only loose surface residuals are present, these may be removed without subsequent etching may be an acceptable cleaning method.
by wiping with a clean lint-free cloth. However, pre-cleaning
NOTE 7—Caution: Sand or shot blasting may possibly close indica-
of metals to remove processing residuals such as oil, graphite, tions and extreme care should be used with grinding and machining
scale, insulating materials, coatings, etc. should be done using operations.
cleaning solvents, vapor degreasing, or chemical removing NOTE 8—For structural or electronic ceramics, surface preparation by
processes. Surface conditioning by grinding, machining, pol- grinding, sand blasting and etching for penetrant examination is not
ishing, or etching shall follow shot, sand, grit, and vapor recommended because of the potential for damage.
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7.1.3 Removal of Surface Contaminants: NOTE 10—Caution: Not all penetrant materials are suitable for elec-
7.1.3.1 Precleaning—The success of any penetrant exami- trostatic spray applications, so tests should be conducted prior to use.
nation procedure is greatly dependent upon the surface and NOTE 11—Warning: With spray applications, it is important that there
be proper ventilation. This is generally accomplished through the use of a
discontinuity being free of any contaminant (solid or liquid) properly designed spray booth or exhaust system, or both.
that might interfere with the penetrant process. All parts or
areas of parts to be examined must be clean and dry before the 7.1.4.2 Penetrant Dwell Time—After application, allow ex-
penetrant is applied. If only a section of a part, such as weld, cess penetrant to drain from the part (care should be taken to
including the heat affected zone is to be examined, remove all prevent pools of penetrant on the part), while allowing for
contaminants from the area being examined as defined by the proper penetrant dwell time (see Table 1). The length of time
contracting parties.“ Clean” is intended to mean that the the penetrant must remain on the part to allow proper penetra-
surface must be free of rust, scale, welding flux, spatter, grease, tion should be as recommended by the penetrant manufacturer.
paint, oily films, dirt, etc., that might interfere with penetration. Table 1, however, provides a guide for selection of penetrant
All of these contaminants can prevent the penetrant from dwell times for a variety of materials, their form, and types of
entering discontinuities. (See the annex on cleaning of parts discontinuities.
and materials in Test Method E 165 for more detailed cleaning NOTE 12—For some specific applications in structural ceramics (for
methods.) example, detecting parting lines in slip-cast material), the required
penetrant dwell time should be determined experimentally and may be
NOTE 9—Caution: Residues from cleaning processes such as strong longer than that shown in Table 1 and its notes.
alkalies, pickling solutions, and chromates, in particular, may adversely
react with the penetrant and reduce its sensitivity and performance. 7.1.5 Removal of Excess Penetrant—After the required
penetration time, the excess penetrant on the surface being
7.1.3.2 Drying After Cleaning—It is essential that the sur-
examined must be removed with water, usually a washing
faces be thoroughly dry after cleaning, since any liquid residue
operation. It can be washed off manually, by the use of
will hinder the entrance of the penetrant. Drying may be
automatic or semi-automatic water-spray equipment or by
accomplished by warming the parts in drying ovens, with
immersion. Accumulation of water in pockets or recesses of the
infrared lamps, forced hot or cold air, or by exposure to
surface must be avoided. If the final rinse step is effective, as
ambient temperature.
evidenced by difficulty in removing the excess penetrant, dry
7.1.4 Penetrant Applications—After the area to be exam-
(see 7.1.6) and reclean the part, then reapply the penetrant for
ined has been cleaned, dried, and is within the specified
the prescribed dwell time.
temperature range, apply the penetrant to the surface to be
examined so that the entire part or area under examination is NOTE 13—Caution: Avoid overwashing. Excessive washing can cause
completely covered with penetrant. penetrant to be washed out of discontinuities.
7.1.4.1 Modes of Application—There are various modes of 7.1.5.1 Rinsing—For immersion rinsing, parts are com-
effective application of penetrant such as immersion, brushing, pletely immersed in the water bath with air or mechanical
flooding, or spraying. Small parts are quite often placed in agitation. Effective rinsing of water-washable penetrants by
suitable baskets and dipped into a tank of penetrant. On larger spray application can be accomplished by either manual or
parts, and those with complex geometries, penetrant can be automatic water-spray rinsing of the parts.
applied effectively by brushing or spraying. Both conventional (a) Rinse time should not exceed 120 s unless otherwise
and electrostatic spray guns are appropriate means of applying specified by part or material specification.
liquid penetrants to the part surfaces. Electrostatic spray (b) The temperature of the water should be relatively
application can eliminate excess liquid build-up of penetrant on constant and should be maintained within the range of 50 to
the surface, minimize overspray, and minimize the amount of 100°F (10 to 38°C).
penetrant entering hollow-cored passages that might serve as (c) Spray rinse water pressure should not be greater than 40
penetrant reservoirs, causing severe bleedout problems during psi (280 kPa).
examination. Aerosol sprays are also very effective and a 7.1.5.2 Removal by Wiping—In special applications, pen-
convenient portable means of application. etrant removal may be performed by wiping the surface with a
TABLE 1 Recommended Minimum Dwell Times
Dwell TimesA (minutes)
Material Form Type of Discontinuity
PenetrantB DeveloperC
Aluminum, magnesium, steel, brass castings and welds cold shuts, porosity, lack of fusion, cracks 5 10
and bronze, titanium and high- (all forms)
temperature alloys
wrought materials—extrusions, laps, cracks (all forms) 10 10
forgings, plate
Carbide-tipped tools lack of fusion, porosity, cracks 5 10
Plastic all forms cracks 5 10
Glass all forms cracks 5 10
Ceramic all forms cracks, porosity 5 10
A
For temperature range from 40 to 120°F (4 to 49°C).
B
Maximum penetrant dwell time 60 min in accordance with 7.1.4.2.
C
Development time begins as soon as wet developer coating has dried on surface of parts (recommended minimum). Minimum development time in accordance with
7.1.7.2.
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clean, absorbent material dampened with water until the excess 7.1.7.3 Liquid Film Developers—Apply by spraying or
surface penetrant is removed, as determined by visual exami- dipping as recommended by the manufacturer. Spray parts in
nation. A solvent cleaner may be used instead of water to wipe such a manner as to ensure complete coverage of the area being
off excess penetrant. examined with a thin and even film of developer.
7.1.6 Drying—During the preparation of parts for examina- 7.1.7.4 Developer Time—The length of time the developer
tion, drying is necessary following the application of the is to remain on the part prior to examination should not be less
aqueous developer or prior to applying nonaqueous wet devel- than 10 min. Developing time begins as soon as the wet
opers. Drying time will vary with the size, nature, and number (aqueous and nonaqueous) developer coating is dry (that is, the
of parts under examination. solvent carrier has evaporated to dryness). The maximum
7.1.6.1 Modes of Drying—Parts can be dried by using a permitted developing times are 2 h for aqueous developers and
hot-air recirculating oven, a hot- or cold-air blast, or by 1 h for nonaqueous developers.
exposure to ambient temperature. Drying is best done in a 7.1.8 Examination—Perform examination of parts after the
thermostatically controlled, recirculating hot-air dryer. applicable development time as specified in 8.1.7.5 to allow for
NOTE 14—Caution: Drying oven temperature should not exceed 160°F
bleedout or penetrant from discontinuities onto the developer
(71°C). coating. It is good practice to observe the surface while
applying the developer as an aid in evaluating indications.
7.1.6.2 Drying Time Limits—Do not allow parts to remain 7.1.8.1 Visible Light Level—Visible penetrant indications
in the drying oven any longer than is necessary to dry the part. can be examined in either natural or artificial light. Adequate
Excessive time in the dryer may impair the sensitivity of the illumination is required to ensure no loss of the sensitivity of
examination. the examination. A minimum light intensity at the examination
7.1.7 Developer Application—There are various modes of site of 100 fc (1000 1x/m2) is recommended.
effective application of the various types of developers such as 7.1.8.2 Housekeeping—Keep the examination area free of
immersing, flooding, or spraying. The size, configuration, interfering debris. Practice good housekeeping at all times.
surface condition, number of parts to be processed, etc., will
7.1.9 Evaluation—Unless otherwise agreed upon, it is nor-
influence the choice of developer application.
mal practice to evaluate the discontinuity indication based on
7.1.7.1 Aqueous Developers—Apply aqueous developers to
the size of the developer stain created by the developer’s
the part immediately after the excess penetrant has been
absorption of the penetrant (see Reference Photographs E 433).
removed from the part and prior to drying. The dried developer
7.1.10 Post Cleaning—Post cleaning is necessary in those
coating appears as a translucent or white coating on the part.
cases where residual penetrant or developer could interfere
Prepare and maintain aqueous developers in accordance with
with subsequent processing or with service requirements. It is
the manufacturer’s instructions and apply them in such a
particularly important where residual penetrant examination
manner as to ensure complete and even part coverage. Exercise
materials might combine with other factors in service to
caution when using a wet developer with water-washable
produce corrosion. A suitable technique, such as machine
penetrants to avoid possible stripping of indications. Aqueous
wash, vapor degreasing, solvent soak, or ultrasonic cleaning
developers may be applied by flowing, or immersing the part.
may be employed (see the annex on post cleaning in Test
Atomized spraying is not recommended since a spotty film
Method E 165). In the case of developers, it is recommended
may result. It is most common to immerse the parts in the
that if developer removal is necessary, carry it out as promptly
prepared developer bath. Immerse parts only long enough to
as possible after examination so that it does not fix on the part.
coat all of the part surfaces with the developer, since if parts are
left in bath too long, penetrant entrapments may leach out. NOTE 16—Caution: Developers should be removed prior to vapor
Immediately remove parts from the developer bath and allow degreasing. Vapor degreasing can bake developer on parts.
to drain. Drain all excess developer from recesses and trapped
sections to eliminate developer pooling, that can obscure 8. Special Requirements
discontinuities. Dry the parts in accordance with 7.1.6. 8.1 Impurities:
7.1.7.2 Nonaqueous, Wet Developers—Nonaqueous, wet 8.1.1 When using penetrant materials on austenitic stainless
developer carriers evaporate very rapidly at normal room steels, titanium, nickel base, or other high-temperature alloys,
temperature and do not, therefore, require the use of a dryer. the need to restrict impurities such as sulfur, halogens, and
After the excess penetrant has been removed and the surface alkali metals must be considered. These impurities may cause
has been dried, apply these developers to the surface by embrittlement or corrosion, particularly at elevated tempera-
spraying in such a manner as to ensure complete coverage with tures. Any such evaluation should include consideration of the
a thin even film of developer. Application of excessive devel- form in which the impurities are present. Some penetrant
oper should be avoided. Dipping or flooding parts with materials contain significant amounts of these impurities in the
nonaqueous, wet developers is prohibited, since it will flush form of volatile organic solvents. These normally evaporate
(dissolve) the penetrant from within the discontinuities because quickly and usually do not cause problems. Other materials
of the solvent action of these types of developers. may contain impurities that are not volatile and may react with
the part, particularly in the presence of moisture or elevated
NOTE 15—Warning: The vapors from the evaporating, volatile, sol-
vent developer carrier may be hazardous. Proper ventilation should be temperatures.
provided in all cases, but especially when the surface to be examined is 8.1.2 Because volatile solvents leave the surface quickly
inside a closed volume such as a process drum or a small storage tank. without reaction under normal inspection procedures, penetrant
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materials are normally subjected to an evaporation procedure 9. Qualification and Requalification
to remove the solvents before the materials are analyzed for 9.1 Personnel Qualification—When required by user/
impurities. The residue from this procedure is then analyzed in supplier agreement, all examination personnel shall be
accordance with Practice D 129, Test Method D 1552, or qualified/certified in accordance with a written practice con-
Practice D 129 for decomposition followed by Method B forming to the applicable edition of Recommended Practice
(Turbidimetric Method) of Test Methods D 516 for sulfur. The SNT-TC-1A, ANSI/ASNT-CP-189, NAS-410, or MIL-STD-
residue may also be analyzed in accordance with Test Method 410.
D 808 or the annex on methods for measuring total chlorine 9.2 Procedure Qualification—Qualification of procedures
content in combustible liquid penetrant materials in Test using times or conditions differing from those specified or for
Method E 165 (for halogens other than fluorine) and the annex new materials may be performed by any of several methods
on method for measuring total fluorine content in combustible and should be agreed upon by the contracting parties. A test
liquid penetrant materials in Test Method E 165 (for fluorine). piece containing one or more discontinuities of the smallest
The Annex on Determination of Anions and Cations by Ion relevant size is used. The test piece may contain real or
Chromatography in Test Method E 165 can be used as an simulated discontinuities, providing it displays the character-
alternate procedure. Alkali metals in the residue are determined istics of the discontinuities encountered in production exami-
by flame photometry or atomic absorption spectrophotometry. nations.
NOTE 17—Some current standards indicate that impurity levels of 9.3 Nondestructive Testing Agency Qualification—If a non-
sulfur and halogens exceeding 1 % of any one suspect element are destructive testing agency as described in Practice E 543 is
considered excessive. However, this high a level may be unacceptable for used to perform the examination, the agency shall meet the
some applications, so the actual maximum acceptable impurity level must requirements of Practice E 543.
be decided between supplier and user on a case by case basis. 9.4 Requalification may be required when a change or
8.2 Elevated Temperature Examination—Where penetrant substitution is made in the type of penetrant materials or in the
examination is performed on parts that must be maintained at procedure (see 9.2).
elevated temperature during examination, special materials and
processing techniques may be required. Such examination 10. Keywords
requires qualification in accordance with 9.2. The manufactur- 10.1 nondestructive testing; visible liquid penetrant testing;
er’s recommendations should be observed. water-washable method
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