OZ826

Dual-Phase DC-DC Controller for AMD Mobile CPU

FEATURES GENERAL DESCRIPTION
• Dual-phase DC-DC controller with integrated drivers OZ826 is a DC/DC controller specifically developed to
• 6 bit AMD VID codes compatible support the design of power supplies for AMD mobile
• 1% output voltage accuracy microprocessors supporting the 6 bit VID codes (see Table
• 6V to 24V input supports 2s to 5s battery power 1). Its high efficiency under both light and heavy load
• Voltage Feed-Forward Compensation conditions, DC accuracy, remote voltage sensing and
• High efficiency, up to 94% excellent transient response make it a good choice for low
• High light-load efficiency: 80% at 200mA voltage CPUs.
• Non-audio skip mode
The core topology is based on a constant-ripple current
• Constant Ripple-Current topology facilitates optimum
sync-buck controller with integrated drivers. The voltage
inductor size
feed-forward compensation ensures a high rejection of
• Supports 60A output current input voltage transients.
• Ultra-fast transient recovery
• Adjustable load line support Overvoltage Protection (OVP) acts when the output voltage
• Slew control at start-up and OTF VID changes exceeds the 1.8V threshold. This protection condition is
• True differential output voltage remote sensing latched and the shutdown occurs. After an OVP event, the
• AMD compliant Power Good signal EN pin should be toggled or VDDA cycled to restart the
• VIN & VDDA Undervoltage Lockout Protection circuit.
• Latched over-voltage protection
• Cycle-by-cycle Overcurrent protection with latched Under Voltage Lockout (UVLO) circuit monitors both VDDA
timeout and VIN. Shut down occurs when VDDA falls below 4.2V
• Small, thin 5x5 QFN32 package or VIN is less than typically 4.8V.

The output is protected against overload by a cycle-by-

APPLICATIONS cycle Overcurrent Protection (OCP) circuit. Its limit is user-
Notebook CPU power supplies adjustable. Maximum OCP timeout is typically 1ms.

The Power Good (PG) signal is open drain unless the

ORDERING INFORMATION output voltage drops more than 250mV off the set VID.
Part Number Temp Range Package
At start-up the output voltage ramps up in a controlled
OZ826LN 0oC to 85oC 32 QFN 5x5mm manner with an externally adjustable slew rate.

SIMPLIFIED APPLICATION DIAGRAM PIN DIAGRAM

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07/31/08 OZ826-SF-v1.0 Page 1

Copyright © 2005-2008 by O2Micro All Rights Reserved
Patent #6,844,710
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OZ826
PIN DESCRIPTION
No. Name I/O Type Description
1 NC - - No internal connection
2 COMPV I/O Analog Compensation pin. Requires a capacitor to analog ground
3 VREF O Analog 1.55V, +/-1% precision reference voltage
4 TSET I Analog Adjusts the on time interval
Enables skip mode of operation when asserted low, 120kΩ internal
5 PSI_L I Digital
pull down resistor
Enables the controller operation. When asserted high, initiates the
6 EN I Digital
startup sequence. 120kΩ internal pull down resistor
Power good open drain output. It only provides an indication that the
7 PG O Digital
output voltage is within VID set voltage -250mV
8 HDR2 O Digital Output of the high side driver of phase 2
9 LX2 P Power Inductor switching node for phase 2
Positive supply for the high side driver of phase 2. A 0.22µF capacitor
10 BST2 P Power
should be placed between BST2 and LX2
11 LDR2 O Digital Output of the low side driver of phase 2
12 VDDP P Power Power supply for the low side drivers
13 GNDP P Power Power ground for low side drivers
14 LDR1 O Digital Output of the low side driver of phase 1
Positive supply for the high side driver of phase 1. A 0.22µF capacitor
15 BST1 P Power
should be placed between BST1 and LX1
16 LX1 P Power Inductor switching node for phase 1
17 HDR1 O Digital Output of the high side driver of phase 1
18 VIN I Analog Sensing pin for the input voltage of the power stage
19 VID0 I Digital Voltage Identification pin, bit 0, 120kΩ internal pull down resistor
20 VID1 I Digital Voltage Identification pin, bit 1, 120kΩ internal pull down resistor
21 VID2 I Digital Voltage Identification pin, bit 2, 120kΩ internal pull down resistor
22 VID3 I Digital Voltage Identification pin, bit 3, 120kΩ internal pull down resistor
23 VID4 I Digital Voltage Identification pin, bit 4, 120kΩ internal pull down resistor
24 VID5 I Digital Voltage Identification pin, bit 5, 120kΩ internal pull down resistor
25 NC - - No internal connection
26 ILIM I Analog Sets the current limit threshold
27 VDDA P Power +5V supply for the controller analog circuits.
Controls the slew rate of the output voltage during start up and OTF
28 SLEW I/O Analog
VID code change
Non-inverting current sense pin; also provides voltage feedback
29 CSP I Analog
information
30 CSN I Analog Inverting current sense pin
31 RSP I Analog Non-inverting voltage remote sense pin
32 RSN I Analog Inverting voltage remote sense pin
33 GNDA P Power Ground for the controller analog circuits

OZ826-SF-v1.0 Page 2
 www.DataSheet4U.com
OZ826
TYPICAL APPLICATION SCHEMATIC

R1
VID0 VIN VDC

M1 M2
VID1 1k BSC119N03S BSC119N03S
CIN1 CIN2
VID2 C3 10uF/25V 10uF/25V
10nF/25V
VID3

VID4

VID5 HDR1
L1
LX1

0.6uH/30A 1.5mohm
M3 M4
BSC22N03S BSC22N03S
24 C4 R3
23
22
21
20
19
18
17
+5V U1 0.22uF/10V D3 1.5k
D1

HDR1
VIN
VID5
VID4
VID3
VID2
VID1
VID0
+5V
15MQ040N
R5
22 25 16 MBR0540
NC LX1
ILIM 26 15 BST1 CSP
ILIM BST1
VDDA 27 14 C6 R8
VDDA LDR1
SLEW 28 13
SLEW GNDP C7
CSP 29 12
CSP OZ826 VDDP
CSN 30 11 LDR1 22pF/10V
470nF/10V 2.2
CSN LDR2
C8 C9 VDDFB_H 31 10 BST2 C10
RSP BST2
1uF/10V 10nF/10V VDDFB_L 32 9
RSN LX2
M5 M6 CSN
COMPV

1uF/10V BSC119N03S BSC119N03S

GNDA

HDR2
VREF
TSET
PSIB

PG
NC

D2 CIN3 CIN4
EN

10uF/25V 10uF/25V
33

1
2
3
4
5
6
7
8

VREF MBR0540 C11

R9
C12 10nF/10V
1.5k
0.22uF/10V
C14 HDR2
COMPV

R11 R12 0.22uF/10V

L2
35k 10k LX2

0.6uH/30A 1.5mohm
M7 M8
ILIM TSET BSC22N03S BSC22N03S

D6 C15 C16 C17 C18 VDD_CORE

+ + + +
330uF 330uF 330uF 330uF
R15 15MQ040N
C19 R14 C20 C21
90k
15.8k
10nF/10V NO POP 100nF/10V 1nF/10V

MICROPROCESSOR

+5V
LDR2 C22 C23 C24 C25
PSI_L 47uF/6.3V 47uF/6.3V 47uF/6.3V 47uF/6.3V
R17
1k9
EN

R16
VDDFB_H

665

VDDFB_L R18

665

PWRGD_VDD

Typical Application Schematic: Dual Phase AMD Mobile CPU Core Power Supply with 60A Load Current Capability

OZ826-SF-v1.0 Page 3
 OZ826
BILL OF MATERIALS
Item Qty Reference Value Vendor Part Number
C4532X7R1E106M TDK
1 4 CIN1,CIN2,CIN3,CIN4 10µF/25V
250S43X5R106M Johanson Dielectrics
2 1 C3 10nF/50V Ceramic – X7R or X5R
3 3 C4, C12, C14 220nF/10V Ceramic – X7R or X5R
4 1 C6 470nF/10V Ceramic – X7R or X5R
5 1 C7, 22pF/10V Ceramic – X7R or X5R
C1608X5R1A105K TDK
6 2 C8, C10 1µF/10V
100R14X5R105M Johanson Dielectrics
7 3 C9, C11, C19 10nF/10V Ceramic – X7R or X5R
8 4 C15, C16, C17, C18 330µF/2.5V SPCAP, POSCAP, OSCON
9 1 C20 100nF Ceramic – X7R or X5R
10 1 C21 1nF/10V Ceramic – X7R or X5R
11 4 C22, C23, C24, C25 47uF/6.3V 630S43X5R476MJohanson Dielectrics
12 2 D1, D2 MBR0540 International Rectifier, Vishay Siliconix
13 2 D3, D4 15MQ040N International Rectifier, Vishay Siliconix
14 2 L1, L2 0.6µH/30A 1.5mΩ FDH1055 0R56 TOKO
15 4 M1, M2, M5, M6 BSC119N03S Infineon
16 4 M3, M4, M7, M8 BSC022N03S Infineon
17 1 R1 1k Any
18 2 R3, R9 1.5k Any
19 1 R5 22 Any
20 1 R8 2.2 Any
21 1 R11 35k Any
22 1 R12 10k Any
23 1 R14 15.8k Any
24 2 R16, R18 665 Any
25 1 R17 1.9k Any
26 1 U1 OZ826 O2Micro, Inc.

COMPONENT SUPPLIERS
Contact Information
Manufacturer
Phone Website
Power MOSFETs
Fairchild
888-522-5372 (USA) www.fairchildsemi.com
Semiconductor
International
310-322-3331 (USA) www.irf.com
Rectifier
Siliconix (Vishay) 203-268-6261 (USA) www.vishay.com
Philips 408-474-8142 (USA) www.semiconductors.philips.com
Infineon 858-526-2201 (USA) www.infineon.com
Magnetics/Inductors
Coilcraft 800-322-2645 (USA) www.coilcraft.com
Coiltronics 561-752-5000 (USA) www.coiltronics.com
TOKO 858-675-8013 (USA) www.tokoam.com
Sumida 408-982-9660 (USA) www.sumida.com
Capacitors
www.DataSheet4U.com
Sanyo 65-6281-3226 (Singapore) www.secc.co.jp
Kemet 408-986-0424 (USA) www.kemet.com
Other Components
847-803-6100 (USA)
TDK www.component.tdk.com
81-3-5201-7241 (Japan)
03-3667-3408 (Japan)
Taiyo Yuden www.t-yuden.com
408-573-4150 (USA)

OZ826-SF-v1.0 Page 4
 OZ826
PACKAGE INFORMATION - 32 PIN QFN
Exposed pad is GNDA (pin 33) and must be soldered to PCB

1 1

2 2
3 3

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Rth j-a (QFN-32 5x5mm package) = 26ºC/W

OZ826-SF-v1.0 Page 5
 OZ826

DIMENSION TABLE RECOMMENDED LANDING PATTERN

SPECIFICATION D1 E1
SYMBOL
32L QLP 5X5 BODY
D1 0.25
E1 0.50
L1 0.94
P1 2.8 PIN 1
F 4.25

P1
F

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OZ826-SF-v1.0 Page 6
 OZ826
IMPORTANT NOTICE
No portion of O2Micro specifications/datasheets or any of its subparts may be reproduced in any form, or by any means,
without prior written permission from O2Micro.

O2Micro and its subsidiaries reserve the right to make changes to their datasheets and/or products or to discontinue any
product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before
placing orders, that information being relied on is current and complete. All products are sold subject to the terms and
conditions of sale supplied at the time of order acknowledgment, including those pertaining to warranty, patent infringement,
and limitation of liability.

O2Micro warrants performance of its products to the specifications applicable at the time of sale in accordance with
O2Micro’s standard warranty. Testing and other quality control techniques are utilized to the extent O2Micro deems
necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except
those mandated by government requirements.

Customer acknowledges that O2Micro products are not designed, manufactured or intended for incorporation into any
systems or products intended for use in connection with life support or other hazardous activities or environments in which
the failure of the O2Micro products could lead to death, bodily injury, or property or environmental damage (“High Risk
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relating to the use of O2Micro products in connection with any High Risk Activities.

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without limitation, any warranties of merchantability or fitness for a particular purpose, and any warranty that such Support
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COPYRIGHT © 2005-2008, O2Micro International Limited

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OZ826-SF-v1.0 Page 7