MMBTH10LT1, MMBTH10 4LT1 VHF/UHF Transistor: NPN Silicon
MMBTH10LT1, MMBTH10 4LT1 VHF/UHF Transistor: NPN Silicon
MMBTH10LT1, MMBTH10 4LT1 VHF/UHF Transistor: NPN Silicon
MMBTH10−4LT1
Preferred Devices
VHF/UHF Transistor
NPN Silicon
• Device Marking: 3EM
Device Marking: http://onsemi.com
Features
COLLECTOR
• Pb−Free Package May be Available. The G−Suffix Denotes a 3
Pb−Free Lead Finish
1
BASE
MAXIMUM RATINGS
Rating Symbol Value Unit 2
EMITTER
Collector-Emitter Voltage VCEO 25 Vdc
Collector-Base Voltage VCBO 30 Vdc
Emitter-Base Voltage VEBO 3.0 Vdc
3
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit 1
Total Device Dissipation PD 2
FR−5 Board (Note 1)
TA = 25°C 225 mW CASE 318
Derate above 25°C 1.8 mW/°C SOT−23
Thermal Resistance, RθJA 556 °C/W STYLE 6
Junction to Ambient (Note 1)
Total Device Dissipation PD
Alumina Substrate (Note 2)
TA = 25°C 300 mW ORDERING INFORMATION
Derate above 25°C 2.4 mW/°C
Device Package Shipping†
Thermal Resistance, RθJA 417 °C/W
Junction to Ambient (Note 2) MMBTH10LT1 SOT−23 3000/Tape & Reel
Junction and Storage TJ, Tstg −55 to °C MMBTH10LT1G SOT−23 3000/Tape & Reel
Temperature Range +150 (Pb−Free)
1. FR−5 = 1.0 x 0.75 x 0.062 in. MMBTH10−4LT1 SOT−23 3000/Tape & Reel
2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
ON CHARACTERISTICS
DC Current Gain hFE −
(IC = 4.0 mAdc, VCE = 10 Vdc) MMBTH10LT1 60 − −
MMBTH10−4LT1 120 − 240
Collector−Emitter Saturation Voltage VCE(sat) − − 0.5 Vdc
(IC = 4.0 mAdc, IB = 0.4 mAdc)
SMALL−SIGNAL CHARACTERISTICS
Current−Gain − Bandwidth Product fT MHz
(IC = 4.0 mAdc, VCE = 10 Vdc, f = 100 MHz) MMBTH10LT1 650 − −
MMBTH10−4LT1 800 − −
Collector−Base Capacitance Ccb − − 0.7 pF
(VCB= 10 Vdc, IE = 0, f = 1.0 MHz)
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2
MMBTH10LT1, MMBTH10−4LT1
TYPICAL CHARACTERISTICS
70 gib
y ib , INPUT ADMITTANCE (mmhos)
−10
60
−20
50
jb ib (mmhos)
−b ib 1000 MHz
40 −30
30 700
−40
20 400 200 100
−50
10
0 −60
100 200 300 400 500 700 1000 0 10 20 30 40 50 60 70 80
f, FREQUENCY (MHz) gib (mmhos)
Figure 1. Rectangular Form Figure 2. Polar Form
70 60
bfb 400
60 200
50 50 600
100
40
700
−g fb
30 40
jb fb (mmhos)
20
10 30
1000 MHz
0
−10 20
−20
−30 10
100 200 300 400 500 700 1000 70 60 50 40 30 20 10 0 −10 −20 −30
f, FREQUENCY (MHz) gfb (mmhos)
Figure 3. Rectangular Form Figure 4. Polar Form
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3
MMBTH10LT1, MMBTH10−4LT1
TYPICAL CHARACTERISTICS
5.0 0
100
4.0 −1.0 200
MPS H11
3.0 400
jb rb (mmhos)
−2.0
−brb
2.0 −brb
−3.0
700
MPS H10
1.0 −4.0
−grb 1000 MHz
0 −5.0
100 200 300 400 500 700 1000 −2.0 −1.8 −1.2 −0.8 −0.4 0 0.4 0.8 1.2 1.6 2.0
f, FREQUENCY (MHz) grb (mmhos)
8.0 8.0
7.0 700
6.0 6.0
jb ob(mmhos)
5.0 bob
4.0 4.0 400
3.0
200
2.0 2.0
gob
1.0 100
0 0
100 200 300 400 500 700 1000 0 2.0 4.0 6.0 8.0 10
f, FREQUENCY (MHz) gob (mmhos)
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4
MMBTH10LT1, MMBTH10−4LT1
PACKAGE DIMENSIONS
SOT−23
(TO−236AB)
CASE 318−08
ISSUE AH
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
A IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
L 4. 318−03 AND −07 OBSOLETE, NEW STANDARD
318−08.
3 INCHES MILLIMETERS
B S DIM MIN MAX MIN MAX
1 2 A 0.1102 0.1197 2.80 3.04
B 0.0472 0.0551 1.20 1.40
C 0.0350 0.0440 0.89 1.11
V G D 0.0150 0.0200 0.37 0.50
G 0.0701 0.0807 1.78 2.04
H 0.0005 0.0040 0.013 0.100
J 0.0034 0.0070 0.085 0.177
C K 0.0140 0.0285 0.35 0.69
L 0.0350 0.0401 0.89 1.02
H S 0.0830 0.1039 2.10 2.64
D J V 0.0177 0.0236 0.45 0.60
K
STYLE 6:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
SOLDERING FOOTPRINT*
0.95
0.95 0.037
0.037
2.0
0.079
0.9
0.035
0.8
0.031
SCALE 10:1 inches
mm
Figure 9. SOT−23
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5
MMBTH10LT1, MMBTH10−4LT1
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
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6
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