MMBTH10LT1, MMBTH10 4LT1 VHF/UHF Transistor: NPN Silicon

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MMBTH10LT1,

MMBTH10−4LT1
Preferred Devices

VHF/UHF Transistor
NPN Silicon
• Device Marking: 3EM
Device Marking: http://onsemi.com

Features
COLLECTOR
• Pb−Free Package May be Available. The G−Suffix Denotes a 3
Pb−Free Lead Finish
1
BASE
MAXIMUM RATINGS
Rating Symbol Value Unit 2
EMITTER
Collector-Emitter Voltage VCEO 25 Vdc
Collector-Base Voltage VCBO 30 Vdc
Emitter-Base Voltage VEBO 3.0 Vdc
3
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit 1
Total Device Dissipation PD 2
FR−5 Board (Note 1)
TA = 25°C 225 mW CASE 318
Derate above 25°C 1.8 mW/°C SOT−23
Thermal Resistance, RθJA 556 °C/W STYLE 6
Junction to Ambient (Note 1)
Total Device Dissipation PD
Alumina Substrate (Note 2)
TA = 25°C 300 mW ORDERING INFORMATION
Derate above 25°C 2.4 mW/°C
Device Package Shipping†
Thermal Resistance, RθJA 417 °C/W
Junction to Ambient (Note 2) MMBTH10LT1 SOT−23 3000/Tape & Reel
Junction and Storage TJ, Tstg −55 to °C MMBTH10LT1G SOT−23 3000/Tape & Reel
Temperature Range +150 (Pb−Free)

1. FR−5 = 1.0 x 0.75 x 0.062 in. MMBTH10−4LT1 SOT−23 3000/Tape & Reel
2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.

Preferred devices are recommended choices for future use


and best overall value.

 Semiconductor Components Industries, LLC, 2003 1 Publication Order Number:


December, 2003 − Rev. 2 MMBTH10LT1/D
MMBTH10LT1, MMBTH10−4LT1

ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)


Characteristic Symbol Min Typ Max Unit
OFF CHARACTERISTICS
Collector−Emitter Breakdown Voltage V(BR)CEO 25 − − Vdc
(IC = 1.0 mAdc, IB = 0)

Collector−Base Breakdown Voltage V(BR)CBO 30 − − Vdc


(IC = 100 µAdc, IE = 0)

Emitter−Base Breakdown Voltage V(BR)EBO 3.0 − − Vdc


(IE = 10 µAdc, IC = 0)

Collector Cutoff Current ICBO − − 100 nAdc


(VCB = 25 Vdc, IE = 0)

Emitter Cutoff Current IEBO − − 100 nAdc


(VEB = 2.0 Vdc, IC = 0)

ON CHARACTERISTICS
DC Current Gain hFE −
(IC = 4.0 mAdc, VCE = 10 Vdc) MMBTH10LT1 60 − −
MMBTH10−4LT1 120 − 240
Collector−Emitter Saturation Voltage VCE(sat) − − 0.5 Vdc
(IC = 4.0 mAdc, IB = 0.4 mAdc)

Base−Emitter On Voltage VBE − − 0.95 Vdc


(IC = 4.0 mAdc, VCE = 10 Vdc)

SMALL−SIGNAL CHARACTERISTICS
Current−Gain − Bandwidth Product fT MHz
(IC = 4.0 mAdc, VCE = 10 Vdc, f = 100 MHz) MMBTH10LT1 650 − −
MMBTH10−4LT1 800 − −
Collector−Base Capacitance Ccb − − 0.7 pF
(VCB= 10 Vdc, IE = 0, f = 1.0 MHz)

Common−Base Feedback Capacitance Crb − − 0.65 pF


(VCB= 10 Vdc, IE = 0, f = 1.0 MHz)

Collector Base Time Constant rb′Cc − − 9.0 ps


(IC= 4.0 mAdc, VCB = 10 Vdc, f = 31.8 MHz)

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MMBTH10LT1, MMBTH10−4LT1

TYPICAL CHARACTERISTICS

COMMON−BASE y PARAMETERS versus FREQUENCY


(VCB = 10 Vdc, IC = 4.0 mAdc, TA = 25°C)
yib, INPUT ADMITTANCE
80 0

70 gib
y ib , INPUT ADMITTANCE (mmhos)

−10
60
−20
50

jb ib (mmhos)
−b ib 1000 MHz
40 −30

30 700
−40
20 400 200 100
−50
10

0 −60
100 200 300 400 500 700 1000 0 10 20 30 40 50 60 70 80
f, FREQUENCY (MHz) gib (mmhos)
Figure 1. Rectangular Form Figure 2. Polar Form

yfb, FORWARD TRANSFER ADMITTANCE


y ib , FORWARD TRANSFER ADMITTANCE (mmhos)

70 60
bfb 400
60 200
50 50 600
100
40
700
−g fb
30 40
jb fb (mmhos)

20
10 30
1000 MHz
0
−10 20
−20
−30 10
100 200 300 400 500 700 1000 70 60 50 40 30 20 10 0 −10 −20 −30
f, FREQUENCY (MHz) gfb (mmhos)
Figure 3. Rectangular Form Figure 4. Polar Form

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3
MMBTH10LT1, MMBTH10−4LT1

TYPICAL CHARACTERISTICS

COMMON−BASE y PARAMETERS versus FREQUENCY


(VCB = 10 Vdc, IC = 4.0 mAdc, TA = 25°C)
yrb, REVERSE TRANSFER ADMITTANCE
y rb , REVERSE TRANSFER ADMITTANCE (mmhos)

5.0 0
100
4.0 −1.0 200
MPS H11

3.0 400

jb rb (mmhos)
−2.0
−brb
2.0 −brb
−3.0
700
MPS H10
1.0 −4.0
−grb 1000 MHz
0 −5.0
100 200 300 400 500 700 1000 −2.0 −1.8 −1.2 −0.8 −0.4 0 0.4 0.8 1.2 1.6 2.0
f, FREQUENCY (MHz) grb (mmhos)

Figure 5. Rectangular Form Figure 6. Polar Form

yob, OUTPUT ADMITTANCE


10 10
1000 MHz
9.0
yob, OUTPUT ADMITTANCE (mmhos)

8.0 8.0
7.0 700
6.0 6.0
jb ob(mmhos)

5.0 bob
4.0 4.0 400
3.0
200
2.0 2.0
gob
1.0 100
0 0
100 200 300 400 500 700 1000 0 2.0 4.0 6.0 8.0 10
f, FREQUENCY (MHz) gob (mmhos)

Figure 7. Rectangular Form Figure 8. Polar Form

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MMBTH10LT1, MMBTH10−4LT1

PACKAGE DIMENSIONS

SOT−23
(TO−236AB)
CASE 318−08
ISSUE AH
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
A IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
L 4. 318−03 AND −07 OBSOLETE, NEW STANDARD
318−08.
3 INCHES MILLIMETERS
B S DIM MIN MAX MIN MAX
1 2 A 0.1102 0.1197 2.80 3.04
B 0.0472 0.0551 1.20 1.40
C 0.0350 0.0440 0.89 1.11
V G D 0.0150 0.0200 0.37 0.50
G 0.0701 0.0807 1.78 2.04
H 0.0005 0.0040 0.013 0.100
J 0.0034 0.0070 0.085 0.177
C K 0.0140 0.0285 0.35 0.69
L 0.0350 0.0401 0.89 1.02
H S 0.0830 0.1039 2.10 2.64
D J V 0.0177 0.0236 0.45 0.60
K
STYLE 6:
PIN 1. BASE
2. EMITTER
3. COLLECTOR

SOLDERING FOOTPRINT*

0.95
0.95 0.037
0.037

2.0
0.079

0.9
0.035

0.8
0.031
SCALE 10:1 inches
mm 

Figure 9. SOT−23

*For additional information on our Pb−Free strategy and soldering


details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

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5
MMBTH10LT1, MMBTH10−4LT1

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6
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