Atmega 2560 PDF
Atmega 2560 PDF
Atmega 2560 PDF
2549K–AVR–01/07
Pin Configurations
Figure 1. TQFP-pinout ATmega640/1280/2560
PK2 (ADC10/PCINT18)
PK3 (ADC11/PCINT19)
PK4 (ADC12/PCINT20)
PK5 (ADC13/PCINT21)
PK6 (ADC14/PCINT22)
PK7 (ADC15/PCINT23)
PK0 (ADC8/PCINT16)
PK1 (ADC9/PCINT17)
PF5 (ADC5/TMS)
PF6 (ADC6/TDO)
PF4 (ADC4/TCK)
PF7 (ADC7/TDI)
PF1 (ADC1)
PF2 (ADC2)
PF3 (ADC3)
PF0 (ADC0)
PA0 (AD0)
PA1 (AD1)
PA2 (AD2)
AVCC
AREF
GND
GND
VCC
PJ7
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
(OC0A/OC1C/PCINT7) PB7
VCC
GND
(ICP4) PL0
(RXD1/INT2) PD2
(XCK1) PD5
(T4) PH7
(SCL/INT0) PD0
(TXD1/INT3) PD3
(ICP1) PD4
(T1) PD6
(T0) PD7
(OC5A) PL3
(OC5B) PL4
(OC5C) PL5
(ICP5) PL1
PL6
PL7
(T5) PL2
(TOSC2) PG3
(TOSC1) PG4
(SDA/INT1) PD1
XTAL2
XTAL1
RESET
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ATmega640/1280/1281/2560/2561
A A
B B
C C
D D
E E
F F
G G
H H
J J
K K
A GND AREF PF0 PF2 PF5 PK0 PK3 PK6 GND VCC
B AVCC PG5 PF1 PF3 PF6 PK1 PK4 PK7 PA0 PA2
C PE2 PE0 PE1 PF4 PF7 PK2 PK5 PJ7 PA1 PA3
D PE3 PE4 PE5 PE6 PH2 PA4 PA5 PA6 PA7 PG2
E PE7 PH0 PH1 PH3 PH5 PJ6 PJ5 PJ4 PJ3 PJ2
F VCC PH4 PH6 PB0 PL4 PD1 PJ1 PJ0 PC7 GND
G GND PB1 PB2 PB5 PL2 PD0 PD5 PC5 PC6 VCC
H PB3 PB4 RESET PL1 PL3 PL7 PD4 PC4 PC3 PC2
J PH7 PG3 PB6 PL0 XTAL2 PL6 PD3 PC1 PC0 PG1
K PB7 PG4 VCC GND XTAL1 PL5 PD2 PD6 PD7 PG0
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Figure 3. Pinout ATmega1281/2561
PF5 (ADC5/TMS)
PF6 (ADC6/TDO)
PF4 (ADC4/TCK)
PF7 (ADC7/TDI)
PF0 (ADC0)
PF1 (ADC1)
PF2 (ADC2)
PF3 (ADC3)
PA0 (AD0)
PA1 (AD1)
PA2 (AD2)
AVCC
AREF
GND
GND
VCC
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
(OC0B) PG5 1 48 PA3 (AD3)
3 INDEX CORNER
(TXD0/PDO) PE1 46 PA5 (AD5)
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
(SCL/INT0) PD0
(RXD1/INT2) PD2
(XCK1) PD5
(TXD1/INT3) PD3
(ICP1) PD4
(OC0A/OC1C/PCINT7) PB7
VCC
(T1) PD6
(T0) PD7
GND
(SDA/INT1) PD1
(TOSC2) PG3
(TOSC1) PG4
XTAL2
XTAL1
RESET
Note: The large center pad underneath the QFN/MLF package is made of metal and internally
connected to GND. It should be soldered or glued to the board to ensure good mechani-
cal stability. If the center pad is left unconnected, the package might loosen from the
board.
Disclaimer Typical values contained in this datasheet are based on simulations and characteriza-
tion of other AVR microcontrollers manufactured on the same process technology. Min.
and Max values will be available after the device is characterized.
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ATmega640/1280/1281/2560/2561
Overview
The ATmega640/1280/1281/2560/2561 is a low-power CMOS 8-bit microcontroller based on the AVR enhanced RISC
architecture. By executing powerful instructions in a single clock cycle, the ATmega640/1280/1281/2560/2561 achieves
throughputs approaching 1 MIPS per MHz allowing the system designer to optimize power consumption versus processing
speed.
Block Diagram
Power
Supervision
RESET PORT F (8) PORT K (8)
POR / BOD & PORT J (8) PORT E (8)
RESET
Watchdog
GND Timer
XTAL1
CPU
USART 1
PC7..0 PORT C (8) TWI SPI 8bit T/C 0 8bit T/C 2 USART 2
NOTE:
Shaded parts only available
in the 100-pin version.
Complete functionality for PORT D (8) PORT B (8) PORT H (8) PORT L (8)
the ADC, T/C4, and T/C5 only
available in the 100-pin version.
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The AVR core combines a rich instruction set with 32 general purpose working registers.
All the 32 registers are directly connected to the Arithmetic Logic Unit (ALU), allowing
two independent registers to be accessed in one single instruction executed in one clock
cycle. The resulting architecture is more code efficient while achieving throughputs up to
ten times faster than conventional CISC microcontrollers.
The ATmega640/1280/1281/2560/2561 provides the following features: 64K/128K/256K
bytes of In-System Programmable Flash with Read-While-Write capabilities, 4K bytes
EEPROM, 8K bytes SRAM, 54/86 general purpose I/O lines, 32 general purpose work-
ing registers, Real Time Counter (RTC), six flexible Timer/Counters with compare
modes and PWM, 4 USARTs, a byte oriented 2-wire Serial Interface, a 16-channel, 10-
bit ADC with optional differential input stage with programmable gain, programmable
Watchdog Timer with Internal Oscillator, an SPI serial port, IEEE std. 1149.1 compliant
JTAG test interface, also used for accessing the On-chip Debug system and program-
ming and six software selectable power saving modes. The Idle mode stops the CPU
while allowing the SRAM, Timer/Counters, SPI port, and interrupt system to continue
functioning. The Power-down mode saves the register contents but freezes the Oscilla-
tor, disabling all other chip functions until the next interrupt or Hardware Reset. In
Power-save mode, the asynchronous timer continues to run, allowing the user to main-
tain a timer base while the rest of the device is sleeping. The ADC Noise Reduction
mode stops the CPU and all I/O modules except Asynchronous Timer and ADC, to min-
imize switching noise during ADC conversions. In Standby mode, the Crystal/Resonator
Oscillator is running while the rest of the device is sleeping. This allows very fast start-up
combined with low power consumption. In Extended Standby mode, both the main
Oscillator and the Asynchronous Timer continue to run.
The device is manufactured using Atmel’s high-density nonvolatile memory technology.
The On-chip ISP Flash allows the program memory to be reprogrammed in-system
through an SPI serial interface, by a conventional nonvolatile memory programmer, or
by an On-chip Boot program running on the AVR core. The boot program can use any
interface to download the application program in the application Flash memory. Soft-
ware in the Boot Flash section will continue to run while the Application Flash section is
updated, providing true Read-While-Write operation. By combining an 8-bit RISC CPU
with In-System Self-Program mable Flash on a monolithic ch ip, the Atmel
ATmega640/1280/1281/2560/2561 is a powerful microcontroller that provides a highly
flexible and cost effective solution to many embedded control applications.
The ATmega640/1280/1281/2560/2561 AVR is supported with a full suite of program
and system development tools including: C compilers, macro assemblers, program
debugger/simulators, in-circuit emulators, and evaluation kits.
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ATmega640/1280/1281/2560/2561
Pin Descriptions
GND Ground.
Port A (PA7..PA0) Port A is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each
bit). The Port A output buffers have symmetrical drive characteristics with both high sink
and source capability. As inputs, Port A pins that are externally pulled low will source
current if the pull-up resistors are activated. The Port A pins are tri-stated when a reset
condition becomes active, even if the clock is not running.
Port A also serves the functions of various special features of the
ATmega640/1280/1281/2560/2561 as listed on page 91.
Port B (PB7..PB0) Port B is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each
bit). The Port B output buffers have symmetrical drive characteristics with both high sink
and source capability. As inputs, Port B pins that are externally pulled low will source
current if the pull-up resistors are activated. The Port B pins are tri-stated when a reset
condition becomes active, even if the clock is not running.
Port B has better driving capabilities than the other ports.
Port B also serves the functions of various special features of the
ATmega640/1280/1281/2560/2561 as listed on page 92.
Port C (PC7..PC0) Port C is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each
bit). The Port C output buffers have symmetrical drive characteristics with both high sink
and source capability. As inputs, Port C pins that are externally pulled low will source
current if the pull-up resistors are activated. The Port C pins are tri-stated when a reset
condition becomes active, even if the clock is not running.
Port C also serves the functions of special features of the
ATmega640/1280/1281/2560/2561 as listed on page 95.
Port D (PD7..PD0) Port D is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each
bit). The Port D output buffers have symmetrical drive characteristics with both high sink
and source capability. As inputs, Port D pins that are externally pulled low will source
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current if the pull-up resistors are activated. The Port D pins are tri-stated when a reset
condition becomes active, even if the clock is not running.
Port D also serves the functions of various special features of the
ATmega640/1280/1281/2560/2561 as listed on page 97.
Port E (PE7..PE0) Port E is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each
bit). The Port E output buffers have symmetrical drive characteristics with both high sink
and source capability. As inputs, Port E pins that are externally pulled low will source
current if the pull-up resistors are activated. The Port E pins are tri-stated when a reset
condition becomes active, even if the clock is not running.
Port E also serves the functions of various special features of the
ATmega640/1280/1281/2560/2561 as listed on page 99.
Port G (PG5..PG0) Port G is a 6-bit I/O port with internal pull-up resistors (selected for each bit). The Port G
output buffers have symmetrical drive characteristics with both high sink and source
capability. As inputs, Port G pins that are externally pulled low will source current if the
pull-up resistors are activated. The Port G pins are tri-stated when a reset condition
becomes active, even if the clock is not running.
Port G also serves the functions of various special features of the
ATmega640/1280/1281/2560/2561 as listed on page 105.
Port H (PH7..PH0) Port H is a 8-bit bi-directional I/O port with internal pull-up resistors (selected for each
bit). The Port H output buffers have symmetrical drive characteristics with both high sink
and source capability. As inputs, Port H pins that are externally pulled low will source
current if the pull-up resistors are activated. The Port H pins are tri-stated when a reset
condition becomes active, even if the clock is not running.
Port H also serves the functions of various special features of the
ATmega640/1280/2560 as listed on page 107.
Port J (PJ7..PJ0) Port J is a 8-bit bi-directional I/O port with internal pull-up resistors (selected for each
bit). The Port J output buffers have symmetrical drive characteristics with both high sink
and source capability. As inputs, Port J pins that are externally pulled low will source
current if the pull-up resistors are activated. The Port J pins are tri-stated when a reset
condition becomes active, even if the clock is not running.
Port J also serves the functions of various special features of the
ATmega640/1280/2560 as listed on page 109.
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ATmega640/1280/1281/2560/2561
Port K is a 8-bit bi-directional I/O port with internal pull-up resistors (selected for each
bit). The Port K output buffers have symmetrical drive characteristics with both high sink
and source capability. As inputs, Port K pins that are externally pulled low will source
current if the pull-up resistors are activated. The Port K pins are tri-stated when a reset
condition becomes active, even if the clock is not running.
Port K also serves the functions of various special features of the
ATmega640/1280/2560 as listed on page 111.
Port L (PL7..PL0) Port L is a 8-bit bi-directional I/O port with internal pull-up resistors (selected for each
bit). The Port L output buffers have symmetrical drive characteristics with both high sink
and source capability. As inputs, Port L pins that are externally pulled low will source
current if the pull-up resistors are activated. The Port L pins are tri-stated when a reset
condition becomes active, even if the clock is not running.
Port L also serves the functions of various special features of the
ATmega640/1280/2560 as listed on page 113.
RESET Reset input. A low level on this pin for longer than the minimum pulse length will gener-
ate a reset, even if the clock is not running. The minimum pulse length is given in Table
26 on page 58. Shorter pulses are not guaranteed to generate a reset.
XTAL1 Input to the inverting Oscillator amplifier and input to the internal clock operating circuit.
AVCC AVCC is the supply voltage pin for Port F and the A/D Converter. It should be externally
connected to VCC, even if the ADC is not used. If the ADC is used, it should be con-
nected to VCC through a low-pass filter.
AREF This is the analog reference pin for the A/D Converter.
Resources
A comprehensive set of development tools and application notes, and datasheets are
available for download on http://www.atmel.com/avr.
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AVR CPU Core
Introduction This section discusses the AVR core architecture in general. The main function of the
CPU core is to ensure correct program execution. The CPU must therefore be able to
access memories, perform calculations, control peripherals, and handle interrupts.
Program Status
Flash
Counter and Control
Program
Memory
Interrupt
32 x 8 Unit
Instruction General
Register Purpose SPI
Registrers Unit
Instruction Watchdog
Decoder Timer
Indirect Addressing
Direct Addressing
ALU Analog
Control Lines Comparator
I/O Module1
I/O Module n
EEPROM
I/O Lines
In order to maximize performance and parallelism, the AVR uses a Harvard architecture
– with separate memories and buses for program and data. Instructions in the program
memory are executed with a single level pipelining. While one instruction is being exe-
cuted, the next instruction is pre-fetched from the program memory. This concept
enables instructions to be executed in every clock cycle. The program memory is In-
System Reprogrammable Flash memory.
The fast-access Register File contains 32 x 8-bit general purpose working registers with
a single clock cycle access time. This allows single-cycle Arithmetic Logic Unit (ALU)
operation. In a typical ALU operation, two operands are output from the Register File,
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ATmega640/1280/1281/2560/2561
the operation is executed, and the result is stored back in the Register File – in one
clock cycle.
Six of the 32 registers can be used as three 16-bit indirect address register pointers for
Data Space addressing – enabling efficient address calculations. One of the these
address pointers can also be used as an address pointer for look up tables in Flash pro-
gram memory. These added function registers are the 16-bit X-, Y-, and Z-register,
described later in this section.
The ALU supports arithmetic and logic operations between registers or between a con-
stant and a register. Single register operations can also be executed in the ALU. After
an arithmetic operation, the Status Register is updated to reflect information about the
result of the operation.
Program flow is provided by conditional and unconditional jump and call instructions,
able to directly address the whole address space. Most AVR instructions have a single
16-bit word format. Every program memory address contains a 16- or 32-bit instruction.
Program Flash memory space is divided in two sections, the Boot Program section and
the Application Program section. Both sections have dedicated Lock bits for write and
read/write protection. The SPM instruction that writes into the Application Flash memory
section must reside in the Boot Program section.
During interrupts and subroutine calls, the return address Program Counter (PC) is
stored on the Stack. The Stack is effectively allocated in the general data SRAM, and
consequently the Stack size is only limited by the total SRAM size and the usage of the
SRAM. All user programs must initialize the SP in the Reset routine (before subroutines
or interrupts are executed). The Stack Pointer (SP) is read/write accessible in the I/O
space. The data SRAM can easily be accessed through the five different addressing
modes supported in the AVR architecture.
The memory spaces in the AVR architecture are all linear and regular memory maps.
A flexible interrupt module has its control registers in the I/O space with an additional
Global Interrupt Enable bit in the Status Register. All interrupts have a separate Interrupt
Vector in the Interrupt Vector table. The interrupts have priority in accordance with their
Interrupt Vector position. The lower the Interrupt Vector address, the higher the priority.
The I/O memory space contains 64 addresses for CPU peripheral functions as Control
Registers, SPI, and other I/O functions. The I/O Memory can be accessed directly, or as
the Data Space locations following those of the Register File, 0x20 - 0x5F. In addition,
the ATmega640/1280/1281/2560/2561 has Extended I/O space from 0x60 - 0x1FF in
SRAM where only the ST/STS/STD and LD/LDS/LDD instructions can be used.
ALU – Arithmetic Logic The high-performance AVR ALU operates in direct connection with all the 32 general
Unit purpose working registers. Within a single clock cycle, arithmetic operations between
general purpose registers or between a register and an immediate are executed. The
ALU operations are divided into three main categories – arithmetic, logical, and bit-func-
tions. Some implementations of the architecture also provide a powerful multiplier
supporting both signed/unsigned multiplication and fractional format. See the “Instruc-
tion Set” section for a detailed description.
Status Register The Status Register contains information about the result of the most recently executed
arithmetic instruction. This information can be used for altering program flow in order to
perform conditional operations. Note that the Status Register is updated after all ALU
operations, as specified in the Instruction Set Reference. This will in many cases
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remove the need for using the dedicated compare instructions, resulting in faster and
more compact code.
The Status Register is not automatically stored when entering an interrupt routine and
restored when returning from an interrupt. This must be handled by software.
SREG – AVR Status Register The AVR Status Register – SREG – is defined as:
Bit 7 6 5 4 3 2 1 0
0x3F (0x5F) I T H S V N Z C SREG
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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ATmega640/1280/1281/2560/2561
General Purpose The Register File is optimized for the AVR Enhanced RISC instruction set. In order to
Register File achieve the required performance and flexibility, the following input/output schemes are
supported by the Register File:
• One 8-bit output operand and one 8-bit result input
• Two 8-bit output operands and one 8-bit result input
• Two 8-bit output operands and one 16-bit result input
• One 16-bit output operand and one 16-bit result input
Figure 6 shows the structure of the 32 general purpose working registers in the CPU.
7 0 Addr.
R0 0x00
R1 0x01
R2 0x02
…
R13 0x0D
General R14 0x0E
Purpose R15 0x0F
Working R16 0x10
Registers R17 0x11
…
R26 0x1A X-register Low Byte
R27 0x1B X-register High Byte
R28 0x1C Y-register Low Byte
R29 0x1D Y-register High Byte
R30 0x1E Z-register Low Byte
R31 0x1F Z-register High Byte
Most of the instructions operating on the Register File have direct access to all registers,
and most of them are single cycle instructions.
As shown in Figure 6 on page 13, each register is also assigned a data memory
address, mapping them directly into the first 32 locations of the user Data Space.
Although not being physically implemented as SRAM locations, this memory organiza-
tion provides great flexibility in access of the registers, as the X-, Y- and Z-pointer
registers can be set to index any register in the file.
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The X-register, Y-register, and The registers R26..R31 have some added functions to their general purpose usage.
Z-register These registers are 16-bit address pointers for indirect addressing of the data space.
The three indirect address registers X, Y, and Z are defined as described in Figure 7.
15 XH XL 0
X-register 7 0 7 0
R27 (0x1B) R26 (0x1A)
15 YH YL 0
Y-register 7 0 7 0
R29 (0x1D) R28 (0x1C)
15 ZH ZL 0
Z-register 7 0 7 0
R31 (0x1F) R30 (0x1E)
In the different addressing modes these address registers have functions as fixed dis-
placement, automatic increment, and automatic decrement (see the instruction set
reference for details).
Stack Pointer The Stack is mainly used for storing temporary data, for storing local variables and for
storing return addresses after interrupts and subroutine calls. The Stack Pointer Regis-
ter always points to the top of the Stack. Note that the Stack is implemented as growing
from higher memory locations to lower memory locations. This implies that a Stack
PUSH command decreases the Stack Pointer.
The Stack Pointer points to the data SRAM Stack area where the Subroutine and Inter-
rupt Stacks are located. This Stack space in the data SRAM must be defined by the
program before any subroutine calls are executed or interrupts are enabled. The Stack
Pointer must be set to point above 0x0200. The initial value of the stack pointer is the
last address of the internal SRAM. The Stack Pointer is decremented by one when data
is pushed onto the Stack with the PUSH instruction, and it is decremented by two for
ATmega640/1280/1281 and three for ATmega2560/2561 when the return address is
pushed onto the Stack with subroutine call or interrupt. The Stack Pointer is incre-
mented by one when data is popped from the Stack with the POP instruction, and it is
incremented by two for ATmega640/1280/1281 and three for ATmega2560/2561 when
data is popped from the Stack with return from subroutine RET or return from interrupt
RETI.
The AVR Stack Pointer is implemented as two 8-bit registers in the I/O space. The num-
ber of bits actually used is implementation dependent. Note that the data space in some
implementations of the AVR architecture is so small that only SPL is needed. In this
case, the SPH Register will not be present.
Bit 15 14 13 12 11 10 9 8
0x3E (0x5E) SP15 SP14 SP13 SP12 SP11 SP10 SP9 SP8 SPH
0x3D (0x5D) SP7 SP6 SP5 SP4 SP3 SP2 SP1 SP0 SPL
7 6 5 4 3 2 1 0
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 1 0 0 0 0 1
1 1 1 1 1 1 1 1
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ATmega640/1280/1281/2560/2561
For ELPM/SPM instructions, the Z-pointer is a concatenation of RAMPZ, ZH, and ZL, as
shown in Figure 8. Note that LPM is not affected by the RAMPZ setting.
Bit ( 7 0 7 0 7 0
Individually)
RAMPZ ZH ZL
Bit (Z-pointer) 23 16 15 8 7 0
Bit (Individual- 7 0 7 0 7 0
ly)
EIND ZH ZL
Bit (Indirect- 23 16 15 8 7 0
pointer)
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Instruction Execution This section describes the general access timing concepts for instruction execution. The
Timing AVR CPU is driven by the CPU clock clkCPU, directly generated from the selected clock
source for the chip. No internal clock division is used.
Figure 10 shows the parallel instruction fetches and instruction executions enabled by
the Harvard architecture and the fast-access Register File concept. This is the basic
pipelining concept to obtain up to 1 MIPS per MHz with the corresponding unique results
for functions per cost, functions per clocks, and functions per power-unit.
clkCPU
1st Instruction Fetch
1st Instruction Execute
2nd Instruction Fetch
2nd Instruction Execute
3rd Instruction Fetch
3rd Instruction Execute
4th Instruction Fetch
Figure 11 shows the internal timing concept for the Register File. In a single clock cycle
an ALU operation using two register operands is executed, and the result is stored back
to the destination register.
clkCPU
Total Execution Time
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ATmega640/1280/1281/2560/2561
Reset and Interrupt The AVR provides several different interrupt sources. These interrupts and the separate
Handling Reset Vector each have a separate program vector in the program memory space. All
interrupts are assigned individual enable bits which must be written logic one together
with the Global Interrupt Enable bit in the Status Register in order to enable the interrupt.
Depending on the Program Counter value, interrupts may be automatically disabled
when Boot Lock bits BLB02 or BLB12 are programmed. This feature improves software
security. See the section “Memory Programming” on page 342 for details.
The lowest addresses in the program memory space are by default defined as the Reset
and Interrupt Vectors. The complete list of vectors is shown in “Interrupts” on page 69.
The list also determines the priority levels of the different interrupts. The lower the
address the higher is the priority level. RESET has the highest priority, and next is INT0
– the External Interrupt Request 0. The Interrupt Vectors can be moved to the start of
the Boot Flash section by setting the IVSEL bit in the MCU Control Register (MCUCR).
Refer to “Interrupts” on page 69 for more information. The Reset Vector can also be
moved to the start of the Boot Flash section by programming the BOOTRST Fuse, see
“Memory Programming” on page 342.
When an interrupt occurs, the Global Interrupt Enable I-bit is cleared and all interrupts
are disabled. The user software can write logic one to the I-bit to enable nested inter-
rupts. All enabled interrupts can then interrupt the current interrupt routine. The I-bit is
automatically set when a Return from Interrupt instruction – RETI – is executed.
There are basically two types of interrupts. The first type is triggered by an event that
sets the Interrupt Flag. For these interrupts, the Program Counter is vectored to the
actual Interrupt Vector in order to execute the interrupt handling routine, and hardware
clears the corresponding Interrupt Flag. Interrupt Flags can also be cleared by writing a
logic one to the flag bit position(s) to be cleared. If an interrupt condition occurs while the
corresponding interrupt enable bit is cleared, the Interrupt Flag will be set and remem-
bered until the interrupt is enabled, or the flag is cleared by software. Similarly, if one or
more interrupt conditions occur while the Global Interrupt Enable bit is cleared, the cor-
responding Interrupt Flag(s) will be set and remembered until the Global Interrupt
Enable bit is set, and will then be executed by order of priority.
The second type of interrupts will trigger as long as the interrupt condition is present.
These interrupts do not necessarily have Interrupt Flags. If the interrupt condition disap-
pears before the interrupt is enabled, the interrupt will not be triggered.
When the AVR exits from an interrupt, it will always return to the main program and exe-
cute one more instruction before any pending interrupt is served.
Note that the Status Register is not automatically stored when entering an interrupt rou-
tine, nor restored when returning from an interrupt routine. This must be handled by
software.
When using the CLI instruction to disable interrupts, the interrupts will be immediately
disabled. No interrupt will be executed after the CLI instruction, even if it occurs simulta-
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neously with the CLI instruction. The following example shows how this can be used to
avoid interrupts during the timed EEPROM write sequence.
C Code Example
char cSREG;
cSREG = SREG; /* store SREG value */
/* disable interrupts during timed sequence */
__disable_interrupt();
EECR |= (1<<EEMPE); /* start EEPROM write */
EECR |= (1<<EEPE);
SREG = cSREG; /* restore SREG value (I-bit) */
When using the SEI instruction to enable interrupts, the instruction following SEI will be
executed before any pending interrupts, as shown in this example.
C Code Example
__enable_interrupt(); /* set Global Interrupt Enable */
__sleep(); /* enter sleep, waiting for interrupt */
/* note: will enter sleep before any pending interrupt(s) */
Interrupt Response Time The interrupt execution response for all the enabled AVR interrupts is five clock cycles
minimum. After five clock cycles the program vector address for the actual interrupt han-
dling routine is executed. During these five clock cycle period, the Program Counter is
pushed onto the Stack. The vector is normally a jump to the interrupt routine, and this
jump takes three clock cycles. If an interrupt occurs during execution of a multi-cycle
instruction, this instruction is completed before the interrupt is served. If an interrupt
occurs when the MCU is in sleep mode, the interrupt execution response time is
increased by five clock cycles. This increase comes in addition to the start-up time from
the selected sleep mode.
A return from an interrupt handling routine takes five clock cycles. During these five
clock cycles, the Program Counter (three bytes) is popped back from the Stack, the
Stack Pointer is incremented by three, and the I-bit in SREG is set.
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ATmega640/1280/1281/2560/2561
AVR Memories
This section describes the different memories in the ATmega640/1280/1281/2560/2561.
The AVR architecture has two main memory spaces, the Data Memory and the Program
Memory space. In addition, the ATmega640/1280/1281/2560/2561 features an
EEPROM Memory for data storage. All three memory spaces are linear and regular.
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SRAM Data Memory Table 4 on page 21 shows how the ATmega640/1280/1281/2560/2561 SRAM Memory
is organized.
The ATmega640/1280/1281/2560/2561 is a complex microcontroller with more periph-
eral units than can be supported within the 64 location reserved in the Opcode for the IN
and OUT instructions. For the Extended I/O space from $060 - $1FF in SRAM, only the
ST/STS/STD and LD/LDS/LDD instructions can be used.
The first 4,608/8,704 Data Memory locations address both the Register File, the I/O
Memory, Extended I/O Memory, and the internal data SRAM. The first 32 locations
address the Register file, the next 64 location the standard I/O Memory, then 416 loca-
tions of Extended I/O memory and the next 8,192 locations address the internal data
SRAM.
An optional external data SRAM can be used with the
ATmega640/1280/1281/2560/2561. This SRAM will occupy an area in the remaining
address locations in the 64K address space. This area starts at the address following
the internal SRAM. The Register file, I/O, Extended I/O and Internal SRAM occupies the
lowest 4,608/8,704 bytes, so when using 64KB (65,536 bytes) of External Memory,
60,478/56,832 Bytes of External Memory are available. See “External Memory Inter-
face” on page 26 for details on how to take advantage of the external memory map.
When the addresses accessing the SRAM memory space exceeds the internal data
memory locations, the external data SRAM is accessed using the same instructions as
for the internal data memory access. When the internal data memories are accessed,
the read and write strobe pins (PG0 and PG1) are inactive during the whole access
cycle. External SRAM operation is enabled by setting the SRE bit in the XMCRA
Register.
Accessing external SRAM takes one additional clock cycle per byte compared to access
of the internal SRAM. This means that the commands LD, ST, LDS, STS, LDD, STD,
PUSH, and POP take one additional clock cycle. If the Stack is placed in external
SRAM, interrupts, subroutine calls and returns take three clock cycles extra because the
three-byte program counter is pushed and popped, and external memory access does
not take advantage of the internal pipe-line memory access. When external SRAM inter-
face is used with wait-state, one-byte external access takes two, three, or four additional
clock cycles for one, two, and three wait-states respectively. Interrupts, subroutine calls
and returns will need five, seven, or nine clock cycles more than specified in the instruc-
tion set manual for one, two, and three wait-states.
The five different addressing modes for the data memory cover: Direct, Indirect with Dis-
placement, Indirect, Indirect with Pre-decrement, and Indirect with Post-increment. In
the Register file, registers R26 to R31 feature the indirect addressing pointer registers.
The direct addressing reaches the entire data space.
The Indirect with Displacement mode reaches 63 address locations from the base
address given by the Y- or Z-register.
When using register indirect addressing modes with automatic pre-decrement and post-
increment, the address registers X, Y, and Z are decremented or incremented.
The 32 general purpose working registers, 64 I/O registers, and the 4,196/8,192 bytes of
internal data SRAM in the ATmega640/1280/1281/2560/2561 are all accessible through
20 ATmega640/1280/1281/2560/2561
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ATmega640/1280/1281/2560/2561
all these addressing modes. The Register File is described in “General Purpose Regis-
ter File” on page 13.
FFFF
Data Memory Access Times This section describes the general access timing concepts for internal memory access.
The internal data SRAM access is performed in two clkCPU cycles as described in Figure
12.
clkCPU
Address Compute Address Address valid
Data
Write
WR
Data
Read
RD
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EEPROM Data Memory The ATmega640/1280/1281/2560/2561 contains 4K bytes of data EEPROM memory. It
is organized as a separate data space, in which single bytes can be read and written.
The EEPROM has an endurance of at least 100,000 write/erase cycles. The access
between the EEPROM and the CPU is described in the following, specifying the
EEPROM Address Registers, the EEPROM Data Register, and the EEPROM Control
Register.
For a detailed description of SPI, JTAG and Parallel data downloading to the EEPROM,
see “Serial Downloading” on page 356, “Programming via the JTAG Interface” on page
361, and “Programming the EEPROM” on page 350 respectively.
EEPROM Read/Write Access The EEPROM Access Registers are accessible in the I/O space, see “Register Descrip-
tion” on page 32.
The write access time for the EEPROM is given in Table 5 on page 22. A self-timing
function, however, lets the user software detect when the next byte can be written. If the
user code contains instructions that write the EEPROM, some precautions must be
taken. In heavily filtered power supplies, VCC is likely to rise or fall slowly on power-
up/down. This causes the device for some period of time to run at a voltage lower than
specified as minimum for the clock frequency used. See “Preventing EEPROM Corrup-
tion” on page 24. for details on how to avoid problems in these situations.
In order to prevent unintentional EEPROM writes, a specific write procedure must be fol-
lowed. See the description of the EEPROM Control Register for details on this, “Register
Description” on page 32.
When the EEPROM is read, the CPU is halted for four clock cycles before the next
instruction is executed. When the EEPROM is written, the CPU is halted for two clock
cycles before the next instruction is executed.
The calibrated Oscillator is used to time the EEPROM accesses. Table 5 lists the typical
programming time for EEPROM access from the CPU.
The following code examples show one assembly and one C function for writing to the
EEPROM. The examples assume that interrupts are controlled (e.g. by disabling inter-
rupts globally) so that no interrupts will occur during execution of these functions. The
examples also assume that no Flash Boot Loader is present in the software. If such
code is present, the EEPROM write function must also wait for any ongoing SPM com-
mand to finish.
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ATmega640/1280/1281/2560/2561
C Code Example(1)
void EEPROM_write(unsigned int uiAddress, unsigned char ucData)
{
/* Wait for completion of previous write */
while(EECR & (1<<EEPE))
;
/* Set up address and Data Registers */
EEAR = uiAddress;
EEDR = ucData;
/* Write logical one to EEMPE */
EECR |= (1<<EEMPE);
/* Start eeprom write by setting EEPE */
EECR |= (1<<EEPE);
}
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The next code examples show assembly and C functions for reading the EEPROM. The
examples assume that interrupts are controlled so that no interrupts will occur during
execution of these functions.
C Code Example(1)
unsigned char EEPROM_read(unsigned int uiAddress)
{
/* Wait for completion of previous write */
while(EECR & (1<<EEPE))
;
/* Set up address register */
EEAR = uiAddress;
/* Start eeprom read by writing EERE */
EECR |= (1<<EERE);
/* Return data from Data Register */
return EEDR;
}
Preventing EEPROM During periods of low VCC, the EEPROM data can be corrupted because the supply volt-
Corruption age is too low for the CPU and the EEPROM to operate properly. These issues are the
same as for board level systems using EEPROM, and the same design solutions should
be applied.
An EEPROM data corruption can be caused by two situations when the voltage is too
low. First, a regular write sequence to the EEPROM requires a minimum voltage to
operate correctly. Secondly, the CPU itself can execute instructions incorrectly, if the
supply voltage is too low.
EEPROM data corruption can easily be avoided by following this design
recommendation:
Keep the AVR RESET active (low) during periods of insufficient power supply voltage.
This can be done by enabling the internal Brown-out Detector (BOD). If the detection
level of the internal BOD does not match the needed detection level, an external low
VCC reset Protection circuit can be used. If a reset occurs while a write operation is in
progress, the write operation will be completed provided that the power supply voltage is
sufficient.
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ATmega640/1280/1281/2560/2561
I/O Memory The I/O space definition of the ATmega640/1280/1281/2560/2561 is shown in “Register
Summary” on page 416.
All ATmega640/1280/1281/2560/2561 I/Os and peripherals are placed in the I/O space.
All I/O locations may be accessed by the LD/LDS/LDD and ST/STS/STD instructions,
transferring data between the 32 general purpose working registers and the I/O space.
I/O Registers within the address range 0x00 - 0x1F are directly bit-accessible using the
SBI and CBI instructions. In these registers, the value of single bits can be checked by
using the SBIS and SBIC instructions. Refer to the instruction set section for more
details. When using the I/O specific commands IN and OUT, the I/O addresses 0x00 -
0x3F must be used. When addressing I/O Registers as data space using LD and ST
instructions, 0x20 must be added to these addresses. The
ATmega640/1280/1281/2560/2561 is a complex microcontroller with more peripheral
units than can be supported within the 64 location reserved in Opcode for the IN and
OUT instructions. For the Extended I/O space from 0x60 - 0x1FF in SRAM, only the
ST/STS/STD and LD/LDS/LDD instructions can be used.
For compatibility with future devices, reserved bits should be written to zero if accessed.
Reserved I/O memory addresses should never be written.
Some of the Status Flags are cleared by writing a logical one to them. Note that, unlike
most other AVRs, the CBI and SBI instructions will only operate on the specified bit, and
can therefore be used on registers containing such Status Flags. The CBI and SBI
instructions work with registers 0x00 to 0x1F only.
The I/O and peripherals control registers are explained in later sections.
General Purpose I/O Registers The ATmega640/1280/1281/2560/2561 contains three General Purpose I/O Registers.
These registers can be used for storing any information, and they are particularly useful
for storing global variables and Status Flags. General Purpose I/O Registers within the
address range 0x00 - 0x1F are directly bit-accessible using the SBI, CBI, SBIS, and
SBIC instructions. See “Register Description” on page 32.
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External Memory With all the features the External Memory Interface provides, it is well suited to operate
Interface as an interface to memory devices such as External SRAM and Flash, and peripherals
such as LCD-display, A/D, and D/A. The main features are:
• Four different wait-state settings (including no wait-state).
• Independent wait-state setting for different External Memory sectors (configurable sector
size)
• The number of bits dedicated to address high byte is selectable
• Bus keepers on data lines to minimize current consumption (optional)
Overview When the eXternal MEMory (XMEM) is enabled, address space outside the internal
SRAM becomes available using the dedicated External Memory pins (see Figure 3 on
page 4, Table 39 on page 91, Table 45 on page 95, and Table 57 on page 105). The
memory configuration is shown in Figure 13.
0x0000
Internal memory
0x21FF
0x2200
Lower sector
SRW01
SRW00
SRL[2..0]
SRW11
SRW10
0xFFFF
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ATmega640/1280/1281/2560/2561
For details about the port override, see the alternate functions in section “I/O-Ports” on
page 83. The XMEM interface will auto-detect whether an access is internal or external.
If the access is external, the XMEM interface will output address, data, and the control
signals on the ports according to Figure 15 (this figure shows the wave forms without
wait-states). When ALE goes from high-to-low, there is a valid address on AD7:0. ALE is
low during a data transfer. When the XMEM interface is enabled, also an internal access
will cause activity on address, data and ALE ports, but the RD and WR strobes will not
toggle during internal access. When the External Memory Interface is disabled, the nor-
mal pin and data direction settings are used. Note that when the XMEM interface is
disabled, the address space above the internal SRAM boundary is not mapped into the
internal SRAM. Figure 14 illustrates how to connect an external SRAM to the AVR using
an octal latch (typically “74 x 573” or equivalent) which is transparent when G is high.
Address Latch Requirements Due to the high-speed operation of the XRAM interface, the address latch must be
selected with care for system frequencies above 8 MHz @ 4V and 4 MHz @ 2.7V.
When operating at conditions above these frequencies, the typical old style 74HC series
latch becomes inadequate. The External Memory Interface is designed in compliance to
the 74AHC series latch. However, most latches can be used as long they comply with
the main timing parameters. The main parameters for the address latch are:
• D to Q propagation delay (tPD).
• Data setup time before G low (tSU).
• Data (address) hold time after G low (TH).
The External Memory Interface is designed to guaranty minimum address hold time
after G is asserted low of th = 5 ns. Refer to tLAXX_LD/tLLAXX_ST in “External Data Memory
Timing” Tables 173 through Tables 180 on pages 385 - 387. The D-to-Q propagation
delay (tPD) must be taken into consideration when calculating the access time require-
ment of the external component. The data setup time before G low (t SU ) must not
exceed address valid to ALE low (tAVLLC) minus PCB wiring delay (dependent on the
capacitive load).
AD7:0 D Q A[7:0]
ALE G
A15:8 A[15:8]
RD RD
WR WR
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Pull-up and Bus-keeper The pull-ups on the AD7:0 ports may be activated if the corresponding Port register is
written to one. To reduce power consumption in sleep mode, it is recommended to dis-
able the pull-ups by writing the Port register to zero before entering sleep.
The XMEM interface also provides a bus-keeper on the AD7:0 lines. The bus-keeper
can be disabled and enabled in software as described in “XMCRB – External Memory
Control Register B” on page 36. When enabled, the bus-keeper will keep the previous
value on the AD7:0 bus while these lines are tri-stated by the XMEM interface.
Timing External Memory devices have different timing requirements. To meet these require-
ments, the XMEM interface provides four different wait-states as shown in Table 8. It is
important to consider the timing specification of the External Memory device before
selecting the wait-state. The most important parameters are the access time for the
external memory compared to the set-up requirement. The access time for the External
Memory is defined to be the time from receiving the chip select/address until the data of
this address actually is driven on the bus. The access time cannot exceed the time from
the ALE pulse must be asserted low until data is stable during a read sequence (See
tLLRL+ tRLRH - tDVRH in Tables 173 through Tables 180 on pages 385 - 387). The different
wait-states are set up in software. As an additional feature, it is possible to divide the
external memory space in two sectors with individual wait-state settings. This makes it
possible to connect two different memory devices with different timing requirements to
the same XMEM interface. For XMEM interface timing details, please refer to Table 173
to Table 180 and Figure 163 to Figure 166 in the “External Data Memory Timing” on
page 385.
Note that the XMEM interface is asynchronous and that the waveforms in the following
figures are related to the internal system clock. The skew between the internal and
external clock (XTAL1) is not guarantied (varies between devices temperature, and sup-
ply voltage). Consequently, the XMEM interface is not suited for synchronous operation.
Figure 15. External Data Memory Cycles without Wait-state (SRWn1=0 and SRWn0=0)
T1 T2 T3 T4
ALE
Write
WR
RD
Note: 1. SRWn1 = SRW11 (upper sector) or SRW01 (lower sector), SRWn0 = SRW10 (upper
sector) or SRW00 (lower sector). The ALE pulse in period T4 is only present if the
next instruction accesses the RAM (internal or external).
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ATmega640/1280/1281/2560/2561
Figure 16. External Data Memory Cycles with SRWn1 = 0 and SRWn0 = 1(1)
T1 T2 T3 T4 T5
ALE
Write
WR
Read
DA7:0 (XMBK = 1) Prev. data Address Data
RD
Note: 1. SRWn1 = SRW11 (upper sector) or SRW01 (lower sector), SRWn0 = SRW10 (upper
sector) or SRW00 (lower sector).
The ALE pulse in period T5 is only present if the next instruction accesses the RAM
(internal or external).
Figure 17. External Data Memory Cycles with SRWn1 = 1 and SRWn0 = 0(1)
T1 T2 T3 T4 T5 T6
ALE
Write
WR
Read
DA7:0 (XMBK = 1) Prev. data Address Data
RD
Note: 1. SRWn1 = SRW11 (upper sector) or SRW01 (lower sector), SRWn0 = SRW10 (upper
sector) or SRW00 (lower sector).
The ALE pulse in period T6 is only present if the next instruction accesses the RAM
(internal or external).
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Figure 18. External Data Memory Cycles with SRWn1 = 1 and SRWn0 = 1(1)
T1 T2 T3 T4 T5 T6 T7
ALE
Write
DA7:0 Prev. data Address XX Data
WR
Read
DA7:0 (XMBK = 1) Prev. data Address Data
RD
Note: 1. SRWn1 = SRW11 (upper sector) or SRW01 (lower sector), SRWn0 = SRW10 (upper
sector) or SRW00 (lower sector).
The ALE pulse in period T7 is only present if the next instruction accesses the RAM
(internal or external).
Using all Locations of Since the external memory is mapped after the internal memory as shown in Figure 13,
External Memory Smaller than the external memory is not addressed when addressing the first 8,704 bytes of data
64 KB space. It may appear that the first 8,704 bytes of the external memory are inaccessible
(external memory addresses 0x0000 to 0x21FF). However, when connecting an exter-
nal memory smaller than 64 KB, for example 32 KB, these locations are easily accessed
simply by addressing from address 0x8000 to 0xA1FF. Since the External Memory
Address bit A15 is not connected to the external memory, addresses 0x8000 to 0xA1FF
will appear as addresses 0x0000 to 0x21FF for the external memory. Addressing above
address 0xA1FF is not recommended, since this will address an external memory loca-
tion that is already accessed by another (lower) address. To the Application software,
the external 32 KB memory will appear as one linear 32 KB address space from 0x2200
to 0xA1FF. This is illustrated in Figure 19.
0x0000 0x0000
Internal Memory
0x21FF
0x2200
0x7FFF External
0x7FFF
0x8000 Memory
0x90FF
0x9100
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ATmega640/1280/1281/2560/2561
Using all 64KB Locations of Since the External Memory is mapped after the Internal Memory as shown in Figure 13,
External Memory only 56KB of External Memory is available by default (address space 0x0000 to 0x21FF
is reserved for internal memory). However, it is possible to take advantage of the entire
External Memory by masking the higher address bits to zero. This can be done by using
the XMMn bits and control by software the most significant bits of the address. By set-
ting Port C to output 0x00, and releasing the most significant bits for normal Port Pin
operation, the Memory Interface will address 0x0000 - 0x2FFF. See the following code
examples.
Care must be exercised using this option as most of the memory is masked away.
Assembly Code Example(1)
; OFFSET is defined to 0x4000 to ensure
; external memory access
; Configure Port C (address high byte) to
; output 0x00 when the pins are released
; for normal Port Pin operation
ldi r16, 0xFF
out DDRC, r16
ldi r16, 0x00
out PORTC, r16
; release PC7:6
ldi r16, (1<<XMM1)
sts XMCRB, r16
; write 0xAA to address 0x0001 of external
; memory
ldi r16, 0xaa
sts 0x0001+OFFSET, r16
; re-enable PC7:6 for external memory
ldi r16, (0<<XMM1)
sts XMCRB, r16
; store 0x55 to address (OFFSET + 1) of
; external memory
ldi r16, 0x55
sts 0x0001+OFFSET, r16
C Code Example(1)
#define OFFSET 0x4000
void XRAM_example(void)
{
unsigned char *p = (unsigned char *) (OFFSET + 1);
DDRC = 0xFF;
PORTC = 0x00;
XMCRB = (1<<XMM1);
*p = 0xaa;
XMCRB = 0x00;
*p = 0x55;
}
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Register Description
EEPROM registers
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• Bit 0 – EERE: EEPROM Read Enable
The EEPROM Read Enable Signal EERE is the read strobe to the EEPROM. When the
correct address is set up in the EEAR Register, the EERE bit must be written to a logic
one to trigger the EEPROM read. The EEPROM read access takes one instruction, and
the requested data is available immediately. When the EEPROM is read, the CPU is
halted for four cycles before the next instruction is executed.
The user should poll the EEPE bit before starting the read operation. If a write operation
is in progress, it is neither possible to read the EEPROM, nor to change the EEAR
Register.
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address space is configured as one sector, the wait-states are configured by the
SRW11 and SRW10 bits.
• Bit 3:2 – SRW11, SRW10: Wait-state Select Bits for Upper Sector
The SRW11 and SRW10 bits control the number of wait-states for the upper sector of
the external memory address space, see Table 8.
• Bit 1:0 – SRW01, SRW00: Wait-state Select Bits for Lower Sector
The SRW01 and SRW00 bits control the number of wait-states for the lower sector of
the external memory address space, see Table 8.
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XMCRB – External Memory
Control Register B Bit 7 6 5 4 3 2 1 0
(0x75) XMBK – – – – XMM2 XMM1 XMM0 XMCRB
Read/Write R/W R R R R R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Table 9. Port C Pins Released as Normal Port Pins when the External Memory is
Enabled
XMM2 XMM1 XMM0 # Bits for External Memory Address Released Port Pins
0 0 0 8 (Full 56KB space) None
0 0 1 7 PC7
0 1 0 6 PC7 - PC6
0 1 1 5 PC7 - PC5
1 0 0 4 PC7 - PC4
1 0 1 3 PC7 - PC3
1 1 0 2 PC7 - PC2
1 1 1 No Address high bits Full Port C
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System Clock and This section describes the clock options for the AVR microcontroller.
Clock Options
Overview Figure 20 presents the principal clock systems in the AVR and their distribution. All of
the clocks need not be active at a given time. In order to reduce power consumption, the
clocks to modules not being used can be halted by using different sleep modes, as
described in “Power Management and Sleep Modes” on page 50. The clock systems
are detailed below.
clkADC
clkASY clkFLASH
Clock
Multiplexer
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Clock Systems and their
Distribution
CPU Clock – clkCPU The CPU clock is routed to parts of the system concerned with operation of the AVR
core. Examples of such modules are the General Purpose Register File, the Status Reg-
ister and the data memory holding the Stack Pointer. Halting the CPU clock inhibits the
core from performing general operations and calculations.
I/O Clock – clkI/O The I/O clock is used by the majority of the I/O modules, like Timer/Counters, SPI, and
USART. The I/O clock is also used by the External Interrupt module, but note that some
external interrupts are detected by asynchronous logic, allowing such interrupts to be
detected even if the I/O clock is halted. Also note that start condition detection in the USI
module is carried out asynchronously when clkI/O is halted, TWI address recognition in
all sleep modes.
Flash Clock – clkFLASH The Flash clock controls operation of the Flash interface. The Flash clock is usually
active simultaneously with the CPU clock.
Asynchronous Timer Clock – The Asynchronous Timer clock allows the Asynchronous Timer/Counter to be clocked
clkASY directly from an external clock or an external 32 kHz clock crystal. The dedicated clock
domain allows using this Timer/Counter as a real-time counter even when the device is
in sleep mode.
ADC Clock – clkADC The ADC is provided with a dedicated clock domain. This allows halting the CPU and
I/O clocks in order to reduce noise generated by digital circuitry. This gives more accu-
rate ADC conversion results.
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Clock Sources The device has the following clock source options, selectable by Flash Fuse bits as
shown below. The clock from the selected source is input to the AVR clock generator,
and routed to the appropriate modules.
Note: 1. For all fuses “1” means unprogrammed while “0” means programmed.
Default Clock Source The device is shipped with internal RC oscillator at 8.0 MHz and with the fuse CKDIV8
programmed, resulting in 1.0 MHz system clock. The startup time is set to maximum
and time-out period enabled. (CKSEL = "0010", SUT = "10", CKDIV8 = "0"). The default
setting ensures that all users can make their desired clock source setting using any
available programming interface.
Clock Start-up Sequence Any clock source needs a sufficient VCC to start oscillating and a minimum number of
oscillating cycles before it can be considered stable.
To ensure sufficient VCC, the device issues an internal reset with a time-out delay (tTOUT)
after the device reset is released by all other reset sources. “On-chip Debug System” on
page 53 describes the start conditions for the internal reset. The delay (tTOUT) is timed
from the Watchdog Oscillator and the number of cycles in the delay is set by the SUTx
and CKSELx fuse bits. The selectable delays are shown in Table 11. The frequency of
the Watchdog Oscillator is voltage dependent as shown in “Typical Characteristics” on
page 390.
Main purpose of the delay is to keep the AVR in reset until it is supplied with minimum
Vcc. The delay will not monitor the actual voltage and it will be required to select a delay
longer than the Vcc rise time. If this is not possible, an internal or external Brown-Out
Detection circuit should be used. A BOD circuit will ensure sufficient Vcc before it
releases the reset, and the time-out delay can be disabled. Disabling the time-out delay
without utilizing a Brown-Out Detection circuit is not recommended.
The oscillator is required to oscillate for a minimum number of cycles before the clock is
considered stable. An internal ripple counter monitors the oscillator output clock, and
keeps the internal reset active for a given number of clock cycles. The reset is then
released and the device will start to execute. The recommended oscillator start-up time
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2549K–AVR–01/07
is dependent on the clock type, and varies from 6 cycles for an externally applied clock
to 32K cycles for a low frequency crystal.
The start-up sequence for the clock includes both the time-out delay and the start-up
time when the device starts up from reset. When starting up from Power-save or Power-
down mode, Vcc is assumed to be at a sufficient level and only the start-up time is
included.
Low Power Crystal Pins XTAL1 and XTAL2 are input and output, respectively, of an inverting amplifier
Oscillator which can be configured for use as an On-chip Oscillator, as shown in Figure 21. Either
a quartz crystal or a ceramic resonator may be used.
This Crystal Oscillator is a low power oscillator, with reduced voltage swing on the
XTAL2 output. It gives the lowest power consumption, but is not capable of driving other
clock inputs, and may be more susceptible to noise in noisy environments. In these
cases, refer to the “Full Swing Crystal Oscillator” on page 42.
C1 and C2 should always be equal for both crystals and resonators. The optimal value
of the capacitors depends on the crystal or resonator in use, the amount of stray capac-
itance, and the electromagnetic noise of the environment. Some initial guidelines for
choosing capacitors for use with crystals are given in Table 12. For ceramic resonators,
the capacitor values given by the manufacturer should be used.
C2
XTAL2
C1
XTAL1
GND
The Low Power Oscillator can operate in three different modes, each optimized for a
specific frequency range. The operating mode is selected by the fuses CKSEL3:1 as
shown in Table 12.
Notes: 1. The frequency ranges are preliminary values. Actual values are TBD.
2. This option should not be used with crystals, only with ceramic resonators.
3. If 8 MHz frequency exceeds the specification of the device (depends on VCC), the
CKDIV8 Fuse can be programmed in order to divide the internal frequency by 8. It
must be ensured that the resulting divided clock meets the frequency specification of
the device.
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Table 13. Start-up Times for the Low Power Crystal Oscillator Clock Selection
Start-up Time from Additional Delay
Oscillator Source / Power-down and from Reset
Power Conditions Power-save (VCC = 5.0V) CKSEL0 SUT1:0
Ceramic resonator, fast 258 CK 14CK + 4.1 ms(1) 0 00
rising power
Ceramic resonator, 258 CK 14CK + 65 ms(1) 0 01
slowly rising power
Ceramic resonator, 1K CK 14CK(2) 0 10
BOD enabled
Ceramic resonator, fast 1K CK 14CK + 4.1 ms(2) 0 11
rising power
Ceramic resonator, 1K CK 14CK + 65 ms(2) 1 00
slowly rising power
Crystal Oscillator, BOD 16K CK 14CK 01
1
enabled
Crystal Oscillator, fast 16K CK 14CK + 4.1 ms 10
1
rising power
Crystal Oscillator, 16K CK 14CK + 65 ms 11
1
slowly rising power
Notes: 1. These options should only be used when not operating close to the maximum fre-
quency of the device, and only if frequency stability at start-up is not important for the
application. These options are not suitable for crystals.
2. These options are intended for use with ceramic resonators and will ensure fre-
quency stability at start-up. They can also be used with crystals when not operating
close to the maximum frequency of the device, and if frequency stability at start-up is
not important for the application.
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Full Swing Crystal Pins XTAL1 and XTAL2 are input and output, respectively, of an inverting amplifier
Oscillator which can be configured for use as an On-chip Oscillator, as shown in Figure 21. Either
a quartz crystal or a ceramic resonator may be used.
This Crystal Oscillator is a full swing oscillator, with rail-to-rail swing on the XTAL2 out-
put. This is useful for driving other clock inputs and in noisy environments. The current
consumption is higher than the “Low Power Crystal Oscillator” on page 40. Note that the
Full Swing Crystal Oscillator will only operate for Vcc = 2.7 - 5.5 volts.
C1 and C2 should always be equal for both crystals and resonators. The optimal value
of the capacitors depends on the crystal or resonator in use, the amount of stray capac-
itance, and the electromagnetic noise of the environment. Some initial guidelines for
choosing capacitors for use with crystals are given in Table 15. For ceramic resonators,
the capacitor values given by the manufacturer should be used.
The operating mode is selected by the fuses CKSEL3:1 as shown in Table 14.
Notes: 1. The frequency ranges are preliminary values. Actual values are TBD.
2. If 8 MHz frequency exceeds the specification of the device (depends on VCC), the
CKDIV8 Fuse can be programmed in order to divide the internal frequency by 8. It
must be ensured that the resulting divided clock meets the frequency specification of
the device.
C2
XTAL2
C1
XTAL1
GND
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Table 15. Start-up Times for the Full Swing Crystal Oscillator Clock Selection
Start-up Time from Additional Delay
Oscillator Source / Power-down and from Reset
Power Conditions Power-save (VCC = 5.0V) CKSEL0 SUT1:0
(1)
Ceramic resonator, fast 258 CK 14CK + 4.1 ms 0 00
rising power
Ceramic resonator, 258 CK 14CK + 65 ms(1) 0 01
slowly rising power
Ceramic resonator, 1K CK 14CK(2) 0 10
BOD enabled
Ceramic resonator, fast 1K CK 14CK + 4.1 ms(2) 0 11
rising power
Ceramic resonator, 1K CK 14CK + 65 ms(2) 1 00
slowly rising power
Crystal Oscillator, BOD 16K CK 14CK 01
1
enabled
Crystal Oscillator, fast 16K CK 14CK + 4.1 ms 10
1
rising power
Crystal Oscillator, 16K CK 14CK + 65 ms 11
1
slowly rising power
Notes: 1. These options should only be used when not operating close to the maximum fre-
quency of the device, and only if frequency stability at start-up is not important for the
application. These options are not suitable for crystals.
2. These options are intended for use with ceramic resonators and will ensure fre-
quency stability at start-up. They can also be used with crystals when not operating
close to the maximum frequency of the device, and if frequency stability at start-up is
not important for the application.
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Low Frequency Crystal The device can utilize a 32.768 kHz watch crystal as clock source by a dedicated Low
Oscillator Frequency Crystal Oscillator. The crystal should be connected as shown in Figure 21.
When this Oscillator is selected, start-up times are determined by the SUT Fuses and
CKSEL0 as shown in Table 16.
Table 16. Start-up Times for the Low Frequency Crystal Oscillator Clock Selection
Start-up Time from Additional Delay
Power-down and from Reset
Power Conditions Power-save (VCC = 5.0V) CKSEL0 SUT1:0
(1)
BOD enabled 1K CK 14CK 0 00
Fast rising power 1K CK 14CK + 4.1 ms(1) 0 01
(1)
Slowly rising power 1K CK 14CK + 65 ms 0 10
Reserved 0 11
BOD enabled 32K CK 14CK 1 00
Fast rising power 32K CK 14CK + 4.1 ms 1 01
Slowly rising power 32K CK 14CK + 65 ms 1 10
Reserved 1 11
Note: 1. These options should only be used if frequency stability at start-up is not important
for the application.
Calibrated Internal RC By defaylt, the Internal RC Oscillator provides an approximate 8 MHz clock. Though volt-
Oscillator age and temperature dependent, this clock can be very accurately calibrated by the
user. See Table 172 on page 384 and “Internal Oscillator Speed” on page 409 for more
details. The device is shipped with the CKDIV8 Fuse programmed. See “System Clock
Prescaler” on page 47 for more details.
This clock may be selected as the system clock by programming the CKSEL Fuses as
shown in Table 17. If selected, it will operate with no external components. During reset,
hardware loads the pre-programmed calibration value into the OSCCAL Register and
thereby automatically calibrates the RC Oscillator. The accuracy of this calibration is
shown as Factory calibration in Table 172 on page 384.
By changing the OSCCAL register from SW, see “OSCCAL – Oscillator Calibration Reg-
ister” on page 48, it is possible to get a higher calibration accuracy than by using the
factory calibration. The accuracy of this calibration is shown as User calibration in Table
172 on page 384.
When this Oscillator is used as the chip clock, the Watchdog Oscillator will still be used
for the Watchdog Timer and for the Reset Time-out. For more information on the pre-
programmed calibration value, see the section “Calibration Byte” on page 345.
44 ATmega640/1280/1281/2560/2561
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Table 18. Start-up times for the internal calibrated RC Oscillator clock selection
Start-up Time from Power- Additional Delay from
Power Conditions down and Power-save Reset (VCC = 5.0V) SUT1:0
BOD enabled 6 CK 14CK 00
Fast rising power 6 CK 14CK + 4.1 ms 01
Slowly rising power 6 CK 14CK + 65 ms(1) 10
Reserved 11
128 kHz Internal The 128 kHz internal Oscillator is a low power Oscillator providing a clock of 128 kHz.
Oscillator The frequency is nominal at 3V and 25°C. This clock may be select as the system clock
by programming the CKSEL Fuses to “11” as shown in Table 19.
Table 20. Start-up Times for the 128 kHz Internal Oscillator
Start-up Time from Power- Additional Delay from
Power Conditions down and Power-save Reset SUT1:0
BOD enabled 6 CK 14CK 00
Fast rising power 6 CK 14CK + 4 ms 01
Slowly rising power 6 CK 14CK + 64 ms 10
Reserved 11
External Clock To drive the device from an external clock source, XTAL1 should be driven as shown in
Figure 23. To run the device on an external clock, the CKSEL Fuses must be pro-
grammed to “0000”.
NC XTAL2
EXTERNAL
CLOCK XTAL1
SIGNAL
GND
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2549K–AVR–01/07
When this clock source is selected, start-up times are determined by the SUT Fuses as
shown in Table 23.
When applying an external clock, it is required to avoid sudden changes in the applied
clock frequency to ensure stable operation of the MCU. A variation in frequency of more
than 2% from one clock cycle to the next can lead to unpredictable behavior. If changes
of more than 2% is required, ensure that the MCU is kept in Reset during the changes.
Note that the System Clock Prescaler can be used to implement run-time changes of
the internal clock frequency while still ensuring stable operation. Refer to “System Clock
Prescaler” on page 47 for details.
Clock Output Buffer The device can output the system clock on the CLKO pin. To enable the output, the
CKOUT Fuse has to be programmed. This mode is suitable when the chip clock is used
to drive other circuits on the system. The clock also will be output during reset, and the
normal operation of I/O pin will be overridden when the fuse is programmed. Any clock
source, including the internal RC Oscillator, can be selected when the clock is output on
CLKO. If the System Clock Prescaler is used, it is the divided system clock that is
output.
Timer/Counter Oscillator The device can operate its Timer/Counter2 from an external 32.768 kHz watch crystal or
a external clock source. See Figure 21 on page 40 for crystal connection.
Applying an external clock source to TOSC1 requires EXCLK in the ASSR Register writ-
ten to logic one. See “Asynchronous Operation of Timer/Counter2” on page 188 for
further description on selecting external clock as input instead of a 32 kHz crystal.
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System Clock Prescaler The ATmega640/1280/1281/2560/2561 has a system clock prescaler, and the system
clock can be divided by setting the “CLKPR – Clock Prescale Register” on page 48. This
feature can be used to decrease the system clock frequency and the power consump-
tion when the requirement for processing power is low. This can be used with all clock
source options, and it will affect the clock frequency of the CPU and all synchronous
peripherals. clkI/O, clkADC, clkCPU, and clkFLASH are divided by a factor as shown in Table
23.
When switching between prescaler settings, the System Clock Prescaler ensures that
no glitches occurs in the clock system. It also ensures that no intermediate frequency is
higher than neither the clock frequency corresponding to the previous setting, nor the
clock frequency corresponding to the new setting.
The ripple counter that implements the prescaler runs at the frequency of the undivided
clock, which may be faster than the CPU's clock frequency. Hence, it is not possible to
determine the state of the prescaler - even if it were readable, and the exact time it takes
to switch from one clock division to the other cannot be exactly predicted. From the time
the CLKPS values are written, it takes between T1 + T2 and T1 + 2 * T2 before the new
clock frequency is active. In this interval, 2 active clock edges are produced. Here, T1 is
the previous clock period, and T2 is the period corresponding to the new prescaler
setting.
To avoid unintentional changes of clock frequency, a special write procedure must be
followed to change the CLKPS bits:
1. Write the Clock Prescaler Change Enable (CLKPCE) bit to one and all other bits
in CLKPR to zero.
2. Within four cycles, write the desired value to CLKPS while writing a zero to
CLKPCE.
Interrupts must be disabled when changing prescaler setting to make sure the write pro-
cedure is not interrupted.
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Register Description
OSCCAL – Oscillator
Bit 7 6 5 4 3 2 1 0
Calibration Register
(0x66) CAL7 CAL6 CAL5 CAL4 CAL3 CAL2 CAL1 CAL0 OSCCAL
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value Device Specific Calibration Value
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device at the present operating conditions. Note that any value can be written to the
CLKPS bits regardless of the CKDIV8 Fuse setting. The Application software must
ensure that a sufficient division factor is chosen if the selected clock source has a higher
frequency than the maximum frequency of the device at the present operating condi-
tions. The device is shipped with the CKDIV8 Fuse programmed.
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2549K–AVR–01/07
Power Management Sleep modes enable the application to shut down unused modules in the MCU, thereby
saving power. The AVR provides various sleep modes allowing the user to tailor the
and Sleep Modes power consumption to the application’s requirements.
Sleep Modes Figure 20 on page 37 presents the different clock systems in the
ATmega640/1280/1281/2560/2561, and their distribution. The figure is helpful in select-
ing an appropriate sleep mode. Table 24 shows the different sleep modes and their
wake-up sources.
Table 24. Active Clock Domains and Wake-up Sources in the Different Sleep Modes.
Active Clock Domains Oscillators Wake-up Sources
EEPROM Ready
WDT Interrupt
TWI Address
Pin Change
Main Clock
INT7:0 and
Timer Osc
Other I/O
Enabled
Enabled
clkFLASH
Source
Timer2
clkADC
Match
clkCPU
clkASY
SPM/
ADC
clkIO
Sleep Mode
Idle X X X X X(2) X X X X X X X
(2) (3) (2)
ADCNRM X X X X X X X X X X
Power-down X(3) X X
Power-save X X(2) X(3) X X X
(1) (3)
Standby X X X X
(2) (2) (3)
Extended Standby X X X X X X X
Notes: 1. Only recommended with external crystal or resonator selected as clock source.
2. If Timer/Counter2 is running in asynchronous mode.
3. For INT7:4, only level interrupt.
To enter any of the sleep modes, the SE bit in “SMCR – Sleep Mode Control Register”
on page 54 must be written to logic one and a SLEEP instruction must be executed. The
SM2, SM1, and SM0 bits in the SMCR Register select which sleep mode will be acti-
vated by the SLEEP instruction. See Table 25 on page 54 for a summary.
If an enabled interrupt occurs while the MCU is in a sleep mode, the MCU wakes up.
The MCU is then halted for four cycles in addition to the start-up time, executes the
interrupt routine, and resumes execution from the instruction following SLEEP. The con-
tents of the Register File and SRAM are unaltered when the device wakes up from
sleep. If a reset occurs during sleep mode, the MCU wakes up and executes from the
Reset Vector.
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Idle Mode When the SM2:0 bits are written to 000, the SLEEP instruction makes the MCU enter
Idle mode, stopping the CPU but allowing the SPI, USART, Analog Comparator, ADC,
2-wire Serial Interface, Timer/Counters, Watchdog, and the interrupt system to continue
operating. This sleep mode basically halts clkCPU and clkFLASH, while allowing the other
clocks to run.
Idle mode enables the MCU to wake up from external triggered interrupts as well as
internal ones like the Timer Overflow and USART Transmit Complete interrupts. If
wake-up from the Analog Comparator interrupt is not required, the Analog Comparator
can be powered down by setting the ACD bit in the Analog Comparator Control and Sta-
tus Register – ACSR. This will reduce power consumption in Idle mode. If the ADC is
enabled, a conversion starts automatically when this mode is entered.
ADC Noise Reduction When the SM2:0 bits are written to 001, the SLEEP instruction makes the MCU enter
Mode ADC Noise Reduction mode, stopping the CPU but allowing the ADC, the external inter-
rupts, 2-wire Serial Interface address match, Timer/Counter2 and the Watchdog to
continue operating (if enabled). This sleep mode basically halts clkI/O, clkCPU, and clk-
FLASH, while allowing the other clocks to run.
This improves the noise environment for the ADC, enabling higher resolution measure-
ments. If the ADC is enabled, a conversion starts automatically when this mode is
entered. Apart form the ADC Conversion Complete interrupt, only an External Reset, a
Watchdog System Reset, a Watchdog interrupt, a Brown-out Reset, a 2-wire serial inter-
face interrupt, a Timer/Counter2 interrupt, an SPM/EEPROM ready interrupt, an
external level interrupt on INT7:4 or a pin change interrupt can wakeup the MCU from
ADC Noise Reduction mode.
Power-down Mode When the SM2:0 bits are written to 010, the SLEEP instruction makes the MCU enter
Power-down mode. In this mode, the external Oscillator is stopped, while the external
interrupts, the 2-wire Serial Interface, and the Watchdog continue operating (if enabled).
Only an External Reset, a Watchdog Reset, a Brown-out Reset, 2-wire Serial Interface
address match, an external level interrupt on INT7:4, an external interrupt on INT3:0, or
a pin change interrupt can wake up the MCU. This sleep mode basically halts all gener-
ated clocks, allowing operation of asynchronous modules only.
Note that if a level triggered interrupt is used for wake-up from Power-down mode, the
changed level must be held for some time to wake up the MCU. Refer to “External Inter-
rupts” on page 77 for details.
When waking up from Power-down mode, there is a delay from the wake-up condition
occurs until the wake-up becomes effective. This allows the clock to restart and become
stable after having been stopped. The wake-up period is defined by the same CKSEL
Fuses that define the Reset Time-out period, as described in “Clock Sources” on page
39.
Power-save Mode When the SM2:0 bits are written to 011, the SLEEP instruction makes the MCU enter
Power-save mode. This mode is identical to Power-down, with one exception:
If Timer/Counter2 is enabled, it will keep running during sleep. The device can wake up
from either Timer Overflow or Output Compare event from Timer/Counter2 if the corre-
sponding Timer/Counter2 interrupt enable bits are set in TIMSK2, and the Global
Interrupt Enable bit in SREG is set.
If Timer/Counter2 is not running, Power-down mode is recommended instead of Power-
save mode.
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2549K–AVR–01/07
The Timer/Counter2 can be clocked both synchronously and asynchronously in Power-
save mode. If the Timer/Counter2 is not using the asynchronous clock, the
Timer/Counter Oscillator is stopped during sleep. If the Timer/Counter2 is not using the
synchronous clock, the clock source is stopped during sleep. Note that even if the syn-
chronous clock is running in Power-save, this clock is only available for the
Timer/Counter2.
Standby Mode When the SM2:0 bits are 110 and an external crystal/resonator clock option is selected,
the SLEEP instruction makes the MCU enter Standby mode. This mode is identical to
Power-down with the exception that the Oscillator is kept running. From Standby mode,
the device wakes up in six clock cycles.
Extended Standby Mode When the SM2:0 bits are 111 and an external crystal/resonator clock option is selected,
the SLEEP instruction makes the MCU enter Extended Standby mode. This mode is
identical to Power-save mode with the exception that the Oscillator is kept running.
From Extended Standby mode, the device wakes up in six clock cycles.Power Reduc-
tion Register
The Power Reduction Register (PRR), see “PRR0 – Power Reduction Register 0” on
page 55 and “PRR1 – Power Reduction Register 1” on page 56, provides a method to
stop the clock to individual peripherals to reduce power consumption. The current state
of the peripheral is frozen and the I/O registers can not be read or written. Resources
used by the peripheral when stopping the clock will remain occupied, hence the periph-
eral should in most cases be disabled before stopping the clock. Waking up a module,
which is done by clearing the bit in PRR, puts the module in the same state as before
shutdown.
Module shutdown can be used in Idle mode and Active mode to significantly reduce the
overall power consumption. See “Supply Current of IO modules” on page 395 for exam-
ples. In all other sleep modes, the clock is already stopped.
Minimizing Power There are several issues to consider when trying to minimize the power consumption in
Consumption an AVR controlled system. In general, sleep modes should be used as much as possi-
ble, and the sleep mode should be selected so that as few as possible of the device’s
functions are operating. All functions not needed should be disabled. In particular, the
following modules may need special consideration when trying to achieve the lowest
possible power consumption.
Analog to Digital Converter If enabled, the ADC will be enabled in all sleep modes. To save power, the ADC should
be disabled before entering any sleep mode. When the ADC is turned off and on again,
the next conversion will be an extended conversion. Refer to “ADC – Analog to Digital
Converter” on page 279 for details on ADC operation.
Analog Comparator When entering Idle mode, the Analog Comparator should be disabled if not used. When
entering ADC Noise Reduction mode, the Analog Comparator should be disabled. In
other sleep modes, the Analog Comparator is automatically disabled. However, if the
Analog Comparator is set up to use the Internal Voltage Reference as input, the Analog
Comparator should be disabled in all sleep modes. Otherwise, the Internal Voltage Ref-
erence will be enabled, independent of sleep mode. Refer to “AC – Analog Comparator”
on page 275 for details on how to configure the Analog Comparator.
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Brown-out Detector If the Brown-out Detector is not needed by the application, this module should be turned
off. If the Brown-out Detector is enabled by the BODLEVEL Fuses, it will be enabled in
all sleep modes, and hence, always consume power. In the deeper sleep modes, this
will contribute significantly to the total current consumption. Refer to “Brown-out Detec-
tion” on page 60 for details on how to configure the Brown-out Detector.
Internal Voltage Reference The Internal Voltage Reference will be enabled when needed by the Brown-out Detec-
tion, the Analog Comparator or the ADC. If these modules are disabled as described in
the sections above, the internal voltage reference will be disabled and it will not be con-
suming power. When turned on again, the user must allow the reference to start up
before the output is used. If the reference is kept on in sleep mode, the output can be
used immediately. Refer to “Internal Voltage Reference” on page 61 for details on the
start-up time.
Watchdog Timer If the Watchdog Timer is not needed in the application, the module should be turned off.
If the Watchdog Timer is enabled, it will be enabled in all sleep modes, and hence,
always consume power. In the deeper sleep modes, this will contribute significantly to
the total current consumption. Refer to “Interrupts” on page 69 for details on how to con-
figure the Watchdog Timer.
Port Pins When entering a sleep mode, all port pins should be configured to use minimum power.
The most important is then to ensure that no pins drive resistive loads. In sleep modes
where both the I/O clock (clkI/O) and the ADC clock (clkADC) are stopped, the input buff-
ers of the device will be disabled. This ensures that no power is consumed by the input
logic when not needed. In some cases, the input logic is needed for detecting wake-up
conditions, and it will then be enabled. Refer to the section “Digital Input Enable and
Sleep Modes” on page 87 for details on which pins are enabled. If the input buffer is
enabled and the input signal is left floating or have an analog signal level close to VCC/2,
the input buffer will use excessive power.
For analog input pins, the digital input buffer should be disabled at all times. An analog
signal level close to VCC/2 on an input pin can cause significant current even in active
mode. Digital input buffers can be disabled by writing to the Digital Input Disable Regis-
ters (DIDR2, DIDR1 and DIDR0). Refer to “DIDR2 – Digital Input Disable Register 2” on
page 300, “DIDR1 – Digital Input Disable Register 1” on page 278 and “DIDR0 – Digital
Input Disable Register 0” on page 300 for details.
On-chip Debug System If the On-chip debug system is enabled by the OCDEN Fuse and the chip enters sleep
mode, the main clock source is enabled, and hence, always consumes power. In the
deeper sleep modes, this will contribute significantly to the total current consumption.
There are three alternative ways to disable the OCD system:
• Disable the OCDEN Fuse.
• Disable the JTAGEN Fuse.
• Write one to the JTD bit in MCUCR.
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2549K–AVR–01/07
Register Description
SMCR – Sleep Mode Control The Sleep Mode Control Register contains control bits for power management.
Register
Bit 7 6 5 4 3 2 1 0
0x33 (0x53) – – – – SM2 SM1 SM0 SE SMCR
Read/Write R R R R R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Note: 1. Standby modes are only recommended for use with external crystals or resonators.
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2549K–AVR–01/07
PRR1 – Power Reduction
Register 1 Bit 7 6 5 4 3 2 1 0
(0x65) – – PRTIM5 PRTIM4 PRTIM3 PRUSART3 PRUSART2 PRUSART1 PRR1
Read/Write R R R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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System Control
and Reset
Resetting the AVR During reset, all I/O Registers are set to their initial values, and the program starts exe-
cution from the Reset Vector. The instruction placed at the Reset Vector must be a JMP
– Absolute Jump – instruction to the reset handling routine. If the program never
enables an interrupt source, the Interrupt Vectors are not used, and regular program
code can be placed at these locations. This is also the case if the Reset Vector is in the
Application section while the Interrupt Vectors are in the Boot section or vice versa. The
circuit diagram in Figure 24 shows the reset logic. Table 26 defines the electrical param-
eters of the reset circuitry.
The I/O ports of the AVR are immediately reset to their initial state when a reset source
goes active. This does not require any clock source to be running.
After all reset sources have gone inactive, a delay counter is invoked, stretching the
internal reset. This allows the power to reach a stable level before normal operation
starts. The time-out period of the delay counter is defined by the user through the SUT
and CKSEL Fuses. The different selections for the delay period are presented in “Clock
Sources” on page 39.
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2549K–AVR–01/07
Figure 24. Reset Logic
DATA BUS
MCU Status
Register (MCUSR)
PORF
BORF
EXTRF
WDRF
JTRF
Power-on Reset
Circuit
Brown-out
BODLEVEL [2..0] Reset Circuit
Pull-up Resistor
SPIKE
FILTER
JTAG Reset
Register
Watchdog
Oscillator
CKSEL[3:0]
SUT[1:0]
Power-on Reset A Power-on Reset (POR) pulse is generated by an On-chip detection circuit. The detec-
tion level is defined in Table 26. The POR is activated whenever VCC is below the
detection level. The POR circuit can be used to trigger the start-up Reset, as well as to
detect a failure in supply voltage.
A Power-on Reset (POR) circuit ensures that the device is reset from Power-on. Reach-
ing the Power-on Reset threshold voltage invokes the delay counter, which determines
how long the device is kept in RESET after VCC rise. The RESET signal is activated
again, without any delay, when VCC decreases below the detection level.
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VRST
RESET
tTOUT
TIME-OUT
INTERNAL
RESET
VRST
RESET
tTOUT
TIME-OUT
INTERNAL
RESET
External Reset An External Reset is generated by a low level on the RESET pin. Reset pulses longer
than the minimum pulse width (see Table 26) will generate a reset, even if the clock is
not running. Shorter pulses are not guaranteed to generate a reset. When the applied
signal reaches the Reset Threshold Voltage – VRST – on its positive edge, the delay
counter starts the MCU after the Time-out period – tTOUT – has expired.
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Brown-out Detection ATmega640/1280/1281/2560/2561 has an On-chip Brown-out Detection (BOD) circuit
for monitoring the VCC level during operation by comparing it to a fixed trigger level. The
trigger level for the BOD can be selected by the BODLEVEL Fuses. The trigger level
has a hysteresis to ensure spike free Brown-out Detection. The hysteresis on the detec-
tion level should be interpreted as VBOT+ = VBOT + VHYST/2 and VBOT- = VBOT - VHYST/2.
Note: 1. VBOT may be below nominal minimum operating voltage for some devices. For
devices where this is the case, the device is tested down to VCC = VBOT during the
production test. This guarantees that a Brown-Out Reset will occur before VCC drops
to a voltage where correct operation of the microcontroller is no longer guaranteed.
The test is performed using BODLEVEL = 110 for 4 MHz operation of
ATmega640V/1280V/1281V/2560V/2561V, BODLEVEL = 101 for 8 MHz operation of
ATmega640V/1280V/1281V/2560V/2561V and ATmega640/1280/1281, and
BODLEVEL = 100 for 16 MHz operation of ATmega640/1280/1281/2560/2561.
When the BOD is enabled, and VCC decreases to a value below the trigger level (VBOT-
in Figure 28), the Brown-out Reset is immediately activated. When VCC increases above
the trigger level (VBOT+ in Figure 28), the delay counter starts the MCU after the Time-
out period tTOUT has expired.
The BOD circuit will only detect a drop in VCC if the voltage stays below the trigger level
for longer than tBOD given in Table 26.
RESET
TIME-OUT tTOUT
INTERNAL
RESET
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Watchdog Reset When the Watchdog times out, it will generate a short reset pulse of one CK cycle dura-
tion. On the falling edge of this pulse, the delay timer starts counting the Time-out period
tTOUT. See “Watchdog Timer” on page 53. for details on operation of the Watchdog
Timer.
CK
Voltage Reference Enable The voltage reference has a start-up time that may influence the way it should be used.
Signals and Start-up Time The start-up time is given in Table 29. To save power, the reference is not always turned
on. The reference is on during the following situations:
1. When the BOD is enabled (by programming the BODLEVEL [2:0] Fuse).
2. When the bandgap reference is connected to the Analog Comparator (by setting
the ACBG bit in ACSR).
3. When the ADC is enabled.
Thus, when the BOD is not enabled, after setting the ACBG bit or enabling the ADC, the
user must always allow the reference to start up before the output from the Analog Com-
parator or ADC is used. To reduce power consumption in Power-down mode, the user
can avoid the three conditions above to ensure that the reference is turned off before
entering Power-down mode.
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Watchdog Timer ATmega640/1280/1281/2560/2561 has an Enhanced Watchdog Timer (WDT). The
main features are:
• Clocked from separate On-chip Oscillator
• 3 Operating modes
– Interrupt
– System Reset
– Interrupt and System Reset
• Selectable Time-out period from 16ms to 8s
• Possible Hardware fuse Watchdog always on (WDTON) for fail-safe mode
128kHz
OSCILLATOR
OSC/2K
OSC/4K
OSC/8K
OSC/16K
OSC/32K
OSC/64K
OSC/128K
OSC/256K
OSC/512K
OSC/1024K
WDP0
WDP1
WATCHDOG WDP2
RESET WDP3
WDE
MCU RESET
WDIF
INTERRUPT
WDIE
The Watchdog Timer (WDT) is a timer counting cycles of a separate on-chip 128 kHz
oscillator. The WDT gives an interrupt or a system reset when the counter reaches a
given time-out value. In normal operation mode, it is required that the system uses the
WDR - Watchdog Timer Reset - instruction to restart the counter before the time-out
value is reached. If the system doesn't restart the counter, an interrupt or system reset
will be issued.
In Interrupt mode, the WDT gives an interrupt when the timer expires. This interrupt can
be used to wake the device from sleep-modes, and also as a general system timer. One
example is to limit the maximum time allowed for certain operations, giving an interrupt
when the operation has run longer than expected. In System Reset mode, the WDT
gives a reset when the timer expires. This is typically used to prevent system hang-up in
case of runaway code. The third mode, Interrupt and System Reset mode, combines the
other two modes by first giving an interrupt and then switch to System Reset mode. This
mode will for instance allow a safe shutdown by saving critical parameters before a sys-
tem reset.
The Watchdog always on (WDTON) fuse, if programmed, will force the Watchdog Timer
to System Reset mode. With the fuse programmed the System Reset mode bit (WDE)
and Interrupt mode bit (WDIE) are locked to 1 and 0 respectively. To further ensure pro-
gram security, alterations to the Watchdog set-up must follow timed sequences. The
sequence for clearing WDE and changing time-out configuration is as follows:
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1. In the same operation, write a logic one to the Watchdog change enable bit
(WDCE) and WDE. A logic one must be written to WDE regardless of the previ-
ous value of the WDE bit.
2. Within the next four clock cycles, write the WDE and Watchdog prescaler bits
(WDP) as desired, but with the WDCE bit cleared. This must be done in one
operation.
The following code example shows one assembly and one C function for turning off the
Watchdog Timer. The example assumes that interrupts are controlled (e.g. by disabling
interrupts globally) so that no interrupts will occur during the execution of these
functions.
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Assembly Code Example(1)
WDT_off:
; Turn off global interrupt
cli
; Reset Watchdog Timer
wdr
; Clear WDRF in MCUSR
in r16, MCUSR
andi r16, (0xff & (0<<WDRF))
out MCUSR, r16
; Write logical one to WDCE and WDE
; Keep old prescaler setting to prevent unintentional time-out
ldi r16, WDTCSR
ori r16, (1<<WDCE) | (1<<WDE)
sts WDTCSR, r16
; Turn off WDT
ldi r16, (0<<WDE)
sts WDTCSR, r16
; Turn on global interrupt
sei
ret
C Code Example(1)
void WDT_off(void)
{
__disable_interrupt();
__watchdog_reset();
/* Clear WDRF in MCUSR */
MCUSR &= ~(1<<WDRF);
/* Write logical one to WDCE and WDE */
/* Keep old prescaler setting to prevent unintentional time-out
*/
WDTCSR |= (1<<WDCE) | (1<<WDE);
/* Turn off WDT */
WDTCSR = 0x00;
__enable_interrupt();
}
Note: 1. The example code assumes that the part specific header file is included.
Note: If the Watchdog is accidentally enabled, for example by a runaway pointer or
brown-out condition, the device will be reset and the Watchdog Timer will stay enabled.
If the code is not set up to handle the Watchdog, this might lead to an eternal loop of
time-out resets. To avoid this situation, the application software should always clear the
Watchdog System Reset Flag (WDRF) and the WDE control bit in the initialisation rou-
tine, even if the Watchdog is not in use.
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The following code example shows one assembly and one C function for changing the
time-out value of the Watchdog Timer.
Note: 1. The example code assumes that the part specific header file is included.
Note: The Watchdog Timer should be reset before any change of the WDP bits, since a
change in the WDP bits can result in a time-out when switching to a shorter time-out
period.
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Register Description
MCUSR – MCU Status The MCU Status Register provides information on which reset source caused an MCU
Register reset.
Bit 7 6 5 4 3 2 1 0
0x35 (0x55) – – – JTRF WDRF BORF EXTRF PORF MCUSR
Read/Write R R R R/W R/W R/W R/W R/W
Initial Value 0 0 0 See Bit Description
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Timer is in Interrupt Mode, and the corresponding interrupt is executed if time-out in the
Watchdog Timer occurs.
If WDE is set, the Watchdog Timer is in Interrupt and System Reset Mode. The first
time-out in the Watchdog Timer will set WDIF. Executing the corresponding interrupt
vector will clear WDIE and WDIF automatically by hardware (the Watchdog goes to Sys-
tem Reset Mode). This is useful for keeping the Watchdog Timer security while using
the interrupt. To stay in Interrupt and System Reset Mode, WDIE must be set after each
interrupt. This should however not be done within the interrupt service routine itself, as
this might compromise the safety-function of the Watchdog System Reset mode. If the
interrupt is not executed before the next time-out, a System Reset will be applied.
Note: 1. WDTON Fuse set to “0“ means programmed and “1” means unprogrammed.
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.
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Interrupts This section describes the specifics of the interrupt handling as performed in
ATmega640/1280/1281/2560/2561. For a general explanation of the AVR interrupt han-
dling, refer to “Reset and Interrupt Handling” on page 17.
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Table 32. Reset and Interrupt Vectors (Continued)
Vector Program
No. Address(2) Source Interrupt Definition
32 $003E TIMER3 CAPT Timer/Counter3 Capture Event
33 $0040 TIMER3 COMPA Timer/Counter3 Compare Match A
34 $0042 TIMER3 COMPB Timer/Counter3 Compare Match B
35 $0044 TIMER3 COMPC Timer/Counter3 Compare Match C
36 $0046 TIMER3 OVF Timer/Counter3 Overflow
37 $0048 USART1 RX USART1 Rx Complete
38 $004A USART1 UDRE USART1 Data Register Empty
39 $004C USART1 TX USART1 Tx Complete
40 $004E TWI 2-wire Serial Interface
41 $0050 SPM READY Store Program Memory Ready
(3)
42 $0052 TIMER4 CAPT Timer/Counter4 Capture Event
43 $0054 TIMER4 COMPA Timer/Counter4 Compare Match A
44 $0056 TIMER4 COMPB Timer/Counter4 Compare Match B
45 $0058 TIMER4 COMPC Timer/Counter4 Compare Match C
46 $005A TIMER4 OVF Timer/Counter4 Overflow
(3)
47 $005C TIMER5 CAPT Timer/Counter5 Capture Event
48 $005E TIMER5 COMPA Timer/Counter5 Compare Match A
49 $0060 TIMER5 COMPB Timer/Counter5 Compare Match B
50 $0062 TIMER5 COMPC Timer/Counter5 Compare Match C
51 $0064 TIMER5 OVF Timer/Counter5 Overflow
52 $0066(3) USART2 RX USART2 Rx Complete
53 $0068(3) USART2 UDRE USART2 Data Register Empty
(3)
54 $006A USART2 TX USART2 Tx Complete
(3)
55 $006C USART3 RX USART3 Rx Complete
56 $006E(3)) USART3 UDRE USART3 Data Register Empty
(3)
57 $0070 USART3 TX USART3 Tx Complete
Notes: 1. When the BOOTRST Fuse is programmed, the device will jump to the Boot Loader
address at reset, see “Memory Programming” on page 342.
2. When the IVSEL bit in MCUCR is set, Interrupt Vectors will be moved to the start of
the Boot Flash Section. The address of each Interrupt Vector will then be the address
in this table added to the start address of the Boot Flash Section.
3. Only available in ATmega640/1280/2560
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Reset and Interrupt Table 33 on page 71 shows Reset and Interrupt Vectors placement for the various com-
Vector placement binations of BOOTRST and IVSEL settings. If the program never enables an interrupt
source, the Interrupt Vectors are not used, and regular program code can be placed at
these locations. This is also the case if the Reset Vector is in the Application section
while the Interrupt Vectors are in the Boot section or vice versa.
Table 33. Reset and Interrupt Vectors Placement(1)
BOOTRST IVSEL Reset Address Interrupt Vectors Start Address
1 0 0x0000 0x0002
1 1 0x0000 Boot Reset Address + 0x0002
0 0 Boot Reset Address 0x0002
0 1 Boot Reset Address Boot Reset Address + 0x0002
Note: 1. The Boot Reset Address is shown in Table 140 on page 335 through Table 148 on
page 339. For the BOOTRST Fuse “1” means unprogrammed while “0” means
programmed.
The most typical and general program setup for the Reset and Interrupt Vector
Addresses in ATmega640/1280/1281/2560/2561 is:
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0x0040 jmp TIM3_COMPA ; Timer3 CompareA Handler
0x0042 jmp TIM3_COMPB ; Timer3 CompareB Handler
0x0044 jmp TIM3_COMPC ; Timer3 CompareC Handler
0x0046 jmp TIM3_OVF ; Timer3 Overflow Handler
0x0048 jmp USART1_RXC ; USART1 RX Complete Handler
0x004A jmp USART1_UDRE ; USART1,UDR Empty Handler
0x004C jmp USART1_TXC ; USART1 TX Complete Handler
0x004E jmp TWI ; 2-wire Serial Handler
0x0050 jmp SPM_RDY ; SPM Ready Handler
0x0052 jmp TIM4_CAPT ; Timer4 Capture Handler
0x0054 jmp TIM4_COMPA ; Timer4 CompareA Handler
0x0056 jmp TIM4_COMPB ; Timer4 CompareB Handler
0x0058 jmp TIM4_COMPC ; Timer4 CompareC Handler
0x005A jmp TIM4_OVF ; Timer4 Overflow Handler
0x005C jmp TIM5_CAPT ; Timer5 Capture Handler
0x005E jmp TIM5_COMPA ; Timer5 CompareA Handler
0x0060 jmp TIM5_COMPB ; Timer5 CompareB Handler
0x0062 jmp TIM5_COMPC ; Timer5 CompareC Handler
0x0064 jmp TIM5_OVF ; Timer5 Overflow Handler
0x0066 jmp USART2_RXC ; USART2 RX Complete Handler
0x0068 jmp USART2_UDRE ; USART2,UDR Empty Handler
0x006A jmp USART2_TXC ; USART2 TX Complete Handler
0x006C jmp USART3_RXC ; USART3 RX Complete Handler
0x006E jmp USART3_UDRE ; USART3,UDR Empty Handler
0x0070 jmp USART3_TXC ; USART3 TX Complete Handler
;
0x0072 RESET: ldi r16, high(RAMEND) ; Main program start
0x0073 out SPH,r16 ; Set Stack Pointer to top of RAM
0x0074 ldi r16, low(RAMEND)
0x0075 out SPL,r16
0x0076 sei ; Enable interrupts
0x0077 <instr> xxx
... ... ... ...
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When the BOOTRST Fuse is unprogrammed, the Boot section size set to 8K bytes and
the IVSEL bit in the MCUCR Register is set before any interrupts are enabled, the most
typical and general program setup for the Reset and Interrupt Vector Addresses is:
When the BOOTRST Fuse is programmed and the Boot section size set to 8K bytes, the
most typical and general program setup for the Reset and Interrupt Vector Addresses is:
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When the BOOTRST Fuse is programmed, the Boot section size set to 8K bytes and the
IVSEL bit in the MCUCR Register is set before any interrupts are enabled, the most typ-
ical and general program setup for the Reset and Interrupt Vector Addresses is:
Moving Interrupts The MCU Control Register controls the placement of the Interrupt Vector table, see
Between Application and Code Example below. For more details, see “Reset and Interrupt Handling” on page 17.
Boot Section
C Code Example
void Move_interrupts(void)
{
uchar temp;
/* Get MCUCR*/
temp = MCUCR;
/* Enable change of Interrupt Vectors */
MCUCR = temp|(1<<IVCE);
/* Move interrupts to Boot Flash section */
MCUCR = temp|(1<<IVSEL);
}
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Register Description
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External Interrupts The External Interrupts are triggered by the INT7:0 pin or any of the PCINT23:0 pins.
Observe that, if enabled, the interrupts will trigger even if the INT7:0 or PCINT23:0 pins
are configured as outputs. This feature provides a way of generating a software
interrupt.
The Pin change interrupt PCI2 will trigger if any enabled PCINT23:16 pin toggles, Pin
change interrupt PCI1 if any enabled PCINT15:8 toggles and Pin change interrupts
PCI0 will trigger if any enabled PCINT7:0 pin toggles. PCMSK2, PCMSK1 and PCMSK0
Registers control which pins contribute to the pin change interrupts. Pin change inter-
rupts on PCINT23 :0 are detected asynchronously. This implies that these interrupts can
be used for waking the part also from sleep modes other than Idle mode.
The External Interrupts can be triggered by a falling or rising edge or a low level. This is
set up as indicated in the specification for the External Interrupt Control Registers –
EICRA (INT3:0) and EICRB (INT7:4). When the external interrupt is enabled and is con-
figured as level triggered, the interrupt will trigger as long as the pin is held low. Note
that recognition of falling or rising edge interrupts on INT7:4 requires the presence of an
I/O clock, described in “Overview” on page 37. Low level interrupts and the edge inter-
rupt on INT3:0 are detected asynchronously. This implies that these interrupts can be
used for waking the part also from sleep modes other than Idle mode. The I/O clock is
halted in all sleep modes except Idle mode.
Note that if a level triggered interrupt is used for wake-up from Power-down, the
required level must be held long enough for the MCU to complete the wake-up to trigger
the level interrupt. If the level disappears before the end of the Start-up Time, the MCU
will still wake up, but no interrupt will be generated. The start-up time is defined by the
SUT and CKSEL Fuses as described in “System Clock and Clock Options” on page 37.
Pin Change Interrupt An example of timing of a pin change interrupt is shown in Figure 31.
Timing
Figure 31. Normal pin change interrupt.
pin_lat pcint_in_(0)
PCINT(0) D Q 0 pcint_syn pcint_setflag
LE PCIF
pin_sync x
clk
PCINT(0) in PCMSK(x) clk
clk
PCINT(n)
pin_lat
pin_sync
pcint_in_(n)
pcint_syn
pcint_setflag
PCIF
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Register Description
EICRA – External Interrupt The External Interrupt Control Register A contains control bits for interrupt sense
Control Register A control.
Bit 7 6 5 4 3 2 1 0
(0x69) ISC31 ISC30 ISC21 ISC20 ISC11 ISC10 ISC01 ISC00 EICRA
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
• Bits 7:0 – ISC31, ISC30 – ISC00, ISC00: External Interrupt 3 - 0 Sense Control
Bits
The External Interrupts 3 - 0 are activated by the external pins INT3:0 if the SREG I-flag
and the corresponding interrupt mask in the EIMSK is set. The level and edges on the
external pins that activate the interrupts are defined in Table 34. Edges on INT3:0 are
registered asynchronously. Pulses on INT3:0 pins wider than the minimum pulse width
given in Table 35 will generate an interrupt. Shorter pulses are not guaranteed to gener-
ate an interrupt. If low level interrupt is selected, the low level must be held until the
completion of the currently executing instruction to generate an interrupt. If enabled, a
level triggered interrupt will generate an interrupt request as long as the pin is held low.
When changing the ISCn bit, an interrupt can occur. Therefore, it is recommended to
first disable INTn by clearing its Interrupt Enable bit in the EIMSK Register. Then, the
ISCn bit can be changed. Finally, the INTn interrupt flag should be cleared by writing a
logical one to its Interrupt Flag bit (INTFn) in the EIFR Register before the interrupt is re-
enabled.
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• Bits 7:0 – ISC71, ISC70 - ISC41, ISC40: External Interrupt 7 - 4 Sense Control
Bits
The External Interrupts 7 - 4 are activated by the external pins INT7:4 if the SREG I-flag
and the corresponding interrupt mask in the EIMSK is set. The level and edges on the
external pins that activate the interrupts are defined in Table 36. The value on the
INT7:4 pins are sampled before detecting edges. If edge or toggle interrupt is selected,
pulses that last longer than one clock period will generate an interrupt. Shorter pulses
are not guaranteed to generate an interrupt. Observe that CPU clock frequency can be
lower than the XTAL frequency if the XTAL divider is enabled. If low level interrupt is
selected, the low level must be held until the completion of the currently executing
instruction to generate an interrupt. If enabled, a level triggered interrupt will generate an
interrupt request as long as the pin is held low.
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EIFR – External Interrupt Flag
Register Bit 7 6 5 4 3 2 1 0
0x1C (0x3C) INTF7 INTF6 INTF5 INTF4 INTF3 INTF2 INTF1 IINTF0 EIFR
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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PCMSK0 – Pin Change Mask
Bit 7 6 5 4 3 2 1 0
Register 0
(0x6B) PCINT7 PCINT6 PCINT5 PCINT4 PCINT3 PCINT2 PCINT1 PCINT0 PCMSK0
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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I/O-Ports
Introduction All AVR ports have true Read-Modify-Write functionality when used as general digital
I/O ports. This means that the direction of one port pin can be changed without uninten-
tionally changing the direction of any other pin with the SBI and CBI instructions. The
same applies when changing drive value (if configured as output) or enabling/disabling
of pull-up resistors (if configured as input). Each output buffer has symmetrical drive
characteristics with both high sink and source capability. The pin driver is strong enough
to drive LED displays directly. All port pins have individually selectable pull-up resistors
with a supply-voltage invariant resistance. All I/O pins have protection diodes to both
VCC and Ground as indicated in Figure 32. Refer to “Electrical Characteristics” on page
374 for a complete list of parameters.
Rpu
Pxn Logic
Cpin
See Figure
"General Digital I/O" for
Details
All registers and bit references in this section are written in general form. A lower case
“x” represents the numbering letter for the port, and a lower case “n” represents the bit
number. However, when using the register or bit defines in a program, the precise form
must be used. For example, PORTB3 for bit no. 3 in Port B, here documented generally
as PORTxn. The physical I/O Registers and bit locations are listed in “Table 70 and
Table 71 relates the alternate functions of Port L to the overriding signals shown in Fig-
ure 36 on page 89.” on page 114.
Three I/O memory address locations are allocated for each port, one each for the Data
Register – PORTx, Data Direction Register – DDRx, and the Port Input Pins – PINx. The
Port Input Pins I/O location is read only, while the Data Register and the Data Direction
Register are read/write. However, writing a logic one to a bit in the PINx Register, will
result in a toggle in the corresponding bit in the Data Register. In addition, the Pull-up
Disable – PUD bit in MCUCR disables the pull-up function for all pins in all ports when
set.
Using the I/O port as General Digital I/O is described in “Ports as General Digital I/O” on
page 84. Most port pins are multiplexed with alternate functions for the peripheral fea-
tures on the device. How each alternate function interferes with the port pin is described
in “Alternate Port Functions” on page 89. Refer to the individual module sections for a
full description of the alternate functions.
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Note that enabling the alternate function of some of the port pins does not affect the use
of the other pins in the port as general digital I/O.
Ports as General Digital The ports are bi-directional I/O ports with optional internal pull-ups. Figure 33 shows a
I/O functional description of one I/O-port pin, here generically called Pxn.
PUD
Q D
DDxn
Q CLR
WDx
RESET
RDx
DATA BUS
1
Pxn Q D
PORTxn 0
Q CLR
RESET
WRx WPx
SLEEP RRx
SYNCHRONIZER
RPx
D Q D Q
PINxn
L Q Q
clk I/O
Note: 1. WRx, WPx, WDx, RRx, RPx, and RDx are common to all pins within the same port.
clkI/O, SLEEP, and PUD are common to all ports.
Configuring the Pin Each port pin consists of three register bits: DDxn, PORTxn, and PINxn. As shown in
“Table 70 and Table 71 relates the alternate functions of Port L to the overriding signals
shown in Figure 36 on page 89.” on page 114, the DDxn bits are accessed at the DDRx
I/O address, the PORTxn bits at the PORTx I/O address, and the PINxn bits at the PINx
I/O address.
The DDxn bit in the DDRx Register selects the direction of this pin. If DDxn is written
logic one, Pxn is configured as an output pin. If DDxn is written logic zero, Pxn is config-
ured as an input pin.
If PORTxn is written logic one when the pin is configured as an input pin, the pull-up
resistor is activated. To switch the pull-up resistor off, PORTxn has to be written logic
zero or the pin has to be configured as an output pin. The port pins are tri-stated when
reset condition becomes active, even if no clocks are running.
If PORTxn is written logic one when the pin is configured as an output pin, the port pin is
driven high (one). If PORTxn is written logic zero when the pin is configured as an out-
put pin, the port pin is driven low (zero).
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Toggling the Pin Writing a logic one to PINxn toggles the value of PORTxn, independent on the value of
DDRxn. Note that the SBI instruction can be used to toggle one single bit in a port.
Switching Between Input and When switching between tri-state ({DDxn, PORTxn} = 0b00) and output high ({DDxn,
Output PORTxn} = 0b11), an intermediate state with either pull-up enabled {DDxn, PORTxn} =
0b01) or output low ({DDxn, PORTxn} = 0b10) must occur. Normally, the pull-up
enabled state is fully acceptable, as a high-impedant environment will not notice the dif-
ference between a strong high driver and a pull-up. If this is not the case, the PUD bit in
the MCUCR Register can be set to disable all pull-ups in all ports.
Switching between input with pull-up and output low generates the same problem. The
user must use either the tri-state ({DDxn, PORTxn} = 0b00) or the output high state
({DDxn, PORTxn} = 0b11) as an intermediate step.
Table 37 summarizes the control signals for the pin value.
(in MCUCR)
PORTxn
DDxn
PUD
Reading the Pin Value Independent of the setting of Data Direction bit DDxn, the port pin can be read through
the PINxn Register bit. As shown in Figure 33, the PINxn Register bit and the preceding
latch constitute a synchronizer. This is needed to avoid metastability if the physical pin
changes value near the edge of the internal clock, but it also introduces a delay. Figure
34 shows a timing diagram of the synchronization when reading an externally applied
pin value. The maximum and minimum propagation delays are denoted tpd,max and tpd,min
respectively.
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Figure 34. Synchronization when Reading an Externally Applied Pin value
SYSTEM CLK
SYNC LATCH
PINxn
t pd, max
t pd, min
Consider the clock period starting shortly after the first falling edge of the system clock.
The latch is closed when the clock is low, and goes transparent when the clock is high,
as indicated by the shaded region of the “SYNC LATCH” signal. The signal value is
latched when the system clock goes low. It is clocked into the PINxn Register at the suc-
ceeding positive clock edge. As indicated by the two arrows tpd,max and tpd,min, a
single signal transition on the pin will be delayed between ½ and 1½ system clock
period depending upon the time of assertion.
When reading back a software assigned pin value, a nop instruction must be inserted as
indicated in Figure 35. The out instruction sets the “SYNC LATCH” signal at the positive
edge of the clock. In this case, the delay tpd through the synchronizer is 1 system clock
period.
SYSTEM CLK
r16 0xFF
SYNC LATCH
PINxn
t pd
The following code example shows how to set port B pins 0 and 1 high, 2 and 3 low, and
define the port pins from 4 to 7 as input with pull-ups assigned to port pins 6 and 7. The
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resulting pin values are read back again, but as previously discussed, a nop instruction
is included to be able to read back the value recently assigned to some of the pins.
C Code Example
unsigned char i;
...
/* Define pull-ups and set outputs high */
/* Define directions for port pins */
PORTB = (1<<PB7)|(1<<PB6)|(1<<PB1)|(1<<PB0);
DDRB = (1<<DDB3)|(1<<DDB2)|(1<<DDB1)|(1<<DDB0);
/* Insert nop for synchronization*/
__no_operation();
/* Read port pins */
i = PINB;
...
Note: 1. For the assembly program, two temporary registers are used to minimize the time
from pull-ups are set on pins 0, 1, 6, and 7, until the direction bits are correctly set,
defining bit 2 and 3 as low and redefining bits 0 and 1 as strong high drivers.
Digital Input Enable and Sleep As shown in Figure 33, the digital input signal can be clamped to ground at the input of
Modes the schmitt-trigger. The signal denoted SLEEP in the figure, is set by the MCU Sleep
Controller in Power-down mode, Power-save mode, and Standby mode to avoid high
power consumption if some input signals are left floating, or have an analog signal level
close to VCC/2.
SLEEP is overridden for port pins enabled as external interrupt pins. If the external inter-
rupt request is not enabled, SLEEP is active also for these pins. SLEEP is also
overridden by various other alternate functions as described in “Alternate Port Func-
tions” on page 89.
If a logic high level (“one”) is present on an asynchronous external interrupt pin config-
ured as “Interrupt on Rising Edge, Falling Edge, or Any Logic Change on Pin” while the
external interrupt is not enabled, the corresponding External Interrupt Flag will be set
when resuming from the above mentioned Sleep mode, as the clamping in these sleep
mode produces the requested logic change.
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Unconnected Pins If some pins are unused, it is recommended to ensure that these pins have a defined
level. Even though most of the digital inputs are disabled in the deep sleep modes as
described above, floating inputs should be avoided to reduce current consumption in all
other modes where the digital inputs are enabled (Reset, Active mode and Idle mode).
The simplest method to ensure a defined level of an unused pin, is to enable the internal
pull-up. In this case, the pull-up will be disabled during reset. If low power consumption
during reset is important, it is recommended to use an external pull-up or pull-down.
Connecting unused pins directly to VCC or GND is not recommended, since this may
cause excessive currents if the pin is accidentally configured as an output.
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Alternate Port Functions Most port pins have alternate functions in addition to being general digital I/Os. Figure
36 shows how the port pin control signals from the simplified Figure 33 can be overrid-
den by alternate functions. The overriding signals may not be present in all port pins, but
the figure serves as a generic description applicable to all port pins in the AVR micro-
controller family.
PUOVxn
1
0
PUD
DDOExn
DDOVxn
1
0 Q D
DDxn
Q CLR
WDx
PVOExn RESET
RDx
PVOVxn
DATA BUS
1 1
Pxn
0 Q D 0
PORTxn
PTOExn
Q CLR
DIEOExn
WPx
DIEOVxn RESET
1 WRx
RRx
0 SLEEP
SYNCHRONIZER
RPx
D SET Q D Q
PINxn
L CLR Q CLR Q
clk I/O
DIxn
AIOxn
Note: 1. WRx, WPx, WDx, RRx, RPx, and RDx are common to all pins within the same port.
clkI/O, SLEEP, and PUD are common to all ports. All other signals are unique for each
pin.
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Table 38 summarizes the function of the overriding signals. The pin and port indexes
from Figure 36 are not shown in the succeeding tables. The overriding signals are gen-
erated internally in the modules having the alternate function.
The following subsections shortly describe the alternate functions for each port, and
relate the overriding signals to the alternate function. Refer to the alternate function
description for further details.
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Alternate Functions of Port A The Port A has an alternate function as the address low byte and data lines for the
External Memory Interface.
Table 40 and Table 41 relates the alternate functions of Port A to the overriding signals
shown in Figure 36 on page 89.
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Table 41. Overriding Signals for Alternate Functions in PA3:PA0
Signal
Name PA3/AD3 PA2/AD2 PA1/AD1 PA0/AD0
PUOE SRE SRE SRE SRE
PUOV ~(WR | ADA) • ~(WR | ADA) • ~(WR | ADA) • ~(WR | ADA) •
PORTA3 • PUD PORTA2 • PUD PORTA1 • PUD PORTA0 • PUD
DDOE SRE SRE SRE SRE
DDOV WR | ADA WR | ADA WR | ADA WR | ADA
PVOE SRE SRE SRE SRE
PVOV A3 • ADA | D3 A2• ADA | D2 A1 • ADA | D1 A0 • ADA | D0
OUTPUT • WR OUTPUT • WR OUTPUT • WR OUTPUT • WR
DIEOE 0 0 0 0
DIEOV 0 0 0 0
DI D3 INPUT D2 INPUT D1 INPUT D0 INPUT
AIO – – – –
Alternate Functions of Port B The Port B pins with alternate functions are shown in Table 42.
• OC0A/OC1C/PCINT7, Bit 7
OC0A, Output Compare Match A output: The PB7 pin can serve as an external output
for the Timer/Counter0 Output Compare. The pin has to be configured as an output
(DDB7 set “one”) to serve this function. The OC0A pin is also the output pin for the PWM
mode timer function.
OC1C, Output Compare Match C output: The PB7 pin can serve as an external output
for the Timer/Counter1 Output Compare C. The pin has to be configured as an output
(DDB7 set (one)) to serve this function. The OC1C pin is also the output pin for the
PWM mode timer function.
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PCINT7, Pin Change Interrupt source 7: The PB7 pin can serve as an external interrupt
source.
• OC1B/PCINT6, Bit 6
OC1B, Output Compare Match B output: The PB6 pin can serve as an external output
for the Timer/Counter1 Output Compare B. The pin has to be configured as an output
(DDB6 set (one)) to serve this function. The OC1B pin is also the output pin for the PWM
mode timer function.
PCINT6, Pin Change Interrupt source 6: The PB6 pin can serve as an external interrupt
source.
• OC1A/PCINT5, Bit 5
OC1A, Output Compare Match A output: The PB5 pin can serve as an external output
for the Timer/Counter1 Output Compare A. The pin has to be configured as an output
(DDB5 set (one)) to serve this function. The OC1A pin is also the output pin for the PWM
mode timer function.
PCINT5, Pin Change Interrupt source 5: The PB5 pin can serve as an external interrupt
source.
• OC2A/PCINT4, Bit 4
OC2A, Output Compare Match output: The PB4 pin can serve as an external output for
the Timer/Counter2 Output Compare. The pin has to be configured as an output (DDB4
set (one)) to serve this function. The OC2A pin is also the output pin for the PWM mode
timer function.
PCINT4, Pin Change Interrupt source 4: The PB4 pin can serve as an external interrupt
source.
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When the SPI0 is enabled as a master, the data direction of this pin is controlled by
DDB1. When the pin is forced to be an input, the pull-up can still be controlled by the
PORTB1 bit.
PCINT1, Pin Change Interrupt source 1: The PB1 pin can serve as an external interrupt
source.
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Table 46 and Table 47 relate the alternate functions of Port C to the overriding signals
shown in Figure 36 on page 89.
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Table 46. Overriding Signals for Alternate Functions in PC7:PC4
Signal
Name PC7/A15 PC6/A14 PC5/A13 PC4/A12
PUOE SRE • (XMM<1) SRE • (XMM<2) SRE • (XMM<3) SRE • (XMM<4)
PUOV 0 0 0 0
DDOE SRE • (XMM<1) SRE • (XMM<2) SRE • (XMM<3) SRE • (XMM<4)
DDOV 1 1 1 1
PVOE SRE • (XMM<1) SRE • (XMM<2) SRE • (XMM<3) SRE • (XMM<4)
PVOV A15 A14 A13 A12
DIEOE 0 0 0 0
DIEOV 0 0 0 0
DI – – – –
AIO – – – –
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Alternate Functions of Port D The Port D pins with alternate functions are shown in Table 48.
• T0 – Port D, Bit 7
T0, Timer/Counter0 counter source.
• T1 – Port D, Bit 6
T1, Timer/Counter1 counter source.
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• INT1/SDA – Port D, Bit 1
INT1, External Interrupt source 1. The PD1 pin can serve as an external interrupt source
to the MCU.
SDA, 2-wire Serial Interface Data: When the TWEN bit in TWCR is set (one) to enable
the 2-wire Serial Interface, pin PD1 is disconnected from the port and becomes the
Serial Data I/O pin for the 2-wire Serial Interface. In this mode, there is a spike filter on
the pin to suppress spikes shorter than 50 ns on the input signal, and the pin is driven by
an open drain driver with slew-rate limitation.
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Alternate Functions of Port E The Port E pins with alternate functions are shown in Table 51.
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CLKO - Divided System Clock: The divided system clock can be output on the PE7 pin.
The divided system clock will be output if the CKOUT Fuse is programmed, regardless
of the PORTE7 and DDE7 settings. It will also be output during reset.
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Table 53. Overriding Signals for Alternate Functions in PE3:PE0
Signal PE1/PDO(1)/ PE0/PDI(1)/
Name PE3/AIN1/OC3A PE2/AIN0/XCK0 TXD0 RXD0/PCINT8
PUOE 0 0 TXEN0 RXEN0
PUOV 0 0 0 PORTE0 • PUD
DDOE 0 XCK0 OUTPUT TXEN0 RXEN0
ENABLE
DDOV 0 1 1 0
PVOE OC3B ENABLE XCK0 OUTPUT TXEN0 0
ENABLE
PVOV OC3B XCK0 OUTPUT TXD0 0
DIEOE 0 0 0 PCINT8 • PCIE1
DIEOV 0 0 0 1
DI 0 XCK0 INPUT – RXD0
PE0 0 0 0 PCINT8 INPUT
AIO AIN1 INPUT AIN0 INPUT – –
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Alternate Functions of Port F The Port F has an alternate function as analog input for the ADC as shown in Table 54.
If some Port F pins are configured as outputs, it is essential that these do not switch
when a conversion is in progress. This might corrupt the result of the conversion. If the
JTAG interface is enabled, the pull-up resistors on pins PF7(TDI), PF5(TMS), and
PF4(TCK) will be activated even if a Reset occurs.
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• ADC3 – ADC0 – Port F, Bit 3:0
Analog to Digital Converter, Channel 3:0.
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• RD – Port G, Bit 1
RD is the external data memory read control strobe.
• WR – Port G, Bit 0
WR is the external data memory write control strobe.
Table 58 and Table 59 relates the alternate functions of Port G to the overriding signals
shown in Figure 36 on page 89.
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Table 58. Overriding Signals for Alternate Functions in PG5:PG4
Signal Name — — PG5/OC0B PG4/TOSC1
PUOE – – – AS2
PUOV – – – 0
DDOE – – – AS2
DDOV – – – 0
PVOE – – OC0B Enable 0
PVOV – – OC0B 0
PTOE – – – –
DIEOE – – – AS2
DIEOV – – – EXCLK
DI – – – –
AIO – – – T/C2 OSC INPUT
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• T4 – Port H, Bit 7
T4, Timer/Counter4 counter source.
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• RXD2 – Port H, Bit 0
RXD2, USART2 Receive pin: Receive Data (Data input pin for the USART2). When the
USART2 Receiver is enabled, this pin is configured as an input regardless of the value
of DDH0. When the USART2 forces this pin to be an input, a logical on in PORTH0 will
turn on the internal pull-up.
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Table 64. Overriding Signals for Alternate Functions in PJ7:PJ4
Signal Name PJ7 PJ6/ PCINT15 PJ5/ PCINT14 PJ4/ PCINT13
PUOE 0 0 0 0
PUOV 0 0 0 0
DDOE 0 0 0 0
DDOV 0 0 0 0
PVOE 0 0 0 0
PVOV 0 0 0 0
PTOE - - - -
DIEOE 0 PCINT15·PCIE1 PCINT14·PCIE1 PCINT13·PCIE1
DIEOV 0 1 1 1
DI 0 PCINT15 INPUT PCINT14 INPUT PCINT13 INPUT
AIO - - - -
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Table 68. Overriding Signals for Alternate Functions in PK3:PK0
PK3/ADC11/ PK2/ADC10/ PK1/ADC9/ PK0/ADC8/
Signal Name PCINT19 PCINT18 PCINT17 PCINT16
PUOE 0 0 0 0
PUOV 0 0 0 0
DDOE 0 0 0 0
DDOV 0 0 0 0
PVOE 0 0 0 0
PVOV 0 0 0 0
PTOE – – – –
DIEOE PCINT19 • PCINT18 • PCINT17 • PCINT16 •
PCIE2 PCIE2 PCIE2 PCIE2
DIEOV 1 1 1 1
DI PCINT19 INPUT PCINT18 INPUT PCINT17 PCINT16
INPUT INPUT
AIO ADC11 INPUT ADC10INPUT ADC9 INPUT ADC8 INPUT
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• T5 – Port L, Bit 2
T5, Timer/Counter5 counter source.
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Table 70 and Table 71 relates the alternate functions of Port L to the overriding signals
shown in Figure 36 on page 89.
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PORTC – Port C Data Register
Bit 7 6 5 4 3 2 1 0
0x08 (0x28) PORTC7 PORTC6 PORTC5 PORTC4 PORTC3 PORTC2 PORTC1 PORTC0 PORTC
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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PORTJ – Port J Data Register
Bit 7 6 5 4 3 2 1 0
(0x105) PORTJ7 PORTJ6 PORTJ5 PORTJ4 PORTJ3 PORTJ2 PORTJ1 PORTJ0 PORTJ
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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8-bit Timer/Counter0 Timer/Counter0 is a general purpose 8-bit Timer/Counter module, with two independent
Output Compare Units, and with PWM support. It allows accurate program execution
with PWM timing (event management) and wave generation. The main features are:
• Two Independent Output Compare Units
• Double Buffered Output Compare Registers
• Clear Timer on Compare Match (Auto Reload)
• Glitch Free, Phase Correct Pulse Width Modulator (PWM)
• Variable PWM Period
• Frequency Generator
• Three Independent Interrupt Sources (TOV0, OCF0A, and OCF0B)
Overview A simplified block diagram of the 8-bit Timer/Counter is shown in Figure 37. For the
actual placement of I/O pins, refer to “TQFP-pinout ATmega640/1280/2560” on page 2.
CPU accessible I/O Registers, including I/O bits and I/O pins, are shown in bold. The
device-specific I/O Register and bit locations are listed in the “Register Description” on
page 130.
Edge
Tn
Detector
TOP BOTTOM
( From Prescaler )
Timer/Counter
TCNTn
= =0
OCnA
(Int.Req.)
Waveform
= Generation
OCnA
OCRnA
Fixed
OCnB
TOP
(Int.Req.)
Value
DATA BUS
Waveform
= Generation
OCnB
OCRnB
TCCRnA TCCRnB
Registers The Timer/Counter (TCNT0) and Output Compare Registers (OCR0A and OCR0B) are
8-bit registers. Interrupt request (abbreviated to Int.Req. in the figure) signals are all vis-
ible in the Timer Interrupt Flag Register (TIFR0). All interrupts are individually masked
with the Timer Interrupt Mask Register (TIMSK0). TIFR0 and TIMSK0 are not shown in
the figure.
The Timer/Counter can be clocked internally, via the prescaler, or by an external clock
source on the T0 pin. The Clock Select logic block controls which clock source and edge
the Timer/Counter uses to increment (or decrement) its value. The Timer/Counter is
inactive when no clock source is selected. The output from the Clock Select logic is
referred to as the timer clock (clkT0).
The double buffered Output Compare Registers (OCR0A and OCR0B) are compared
with the Timer/Counter value at all times. The result of the compare can be used by the
Waveform Generator to generate a PWM or variable frequency output on the Output
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Compare pins (OC0A and OC0B). See “Output Compare Unit” on page 121. for details.
The Compare Match event will also set the Compare Flag (OCF0A or OCF0B) which
can be used to generate an Output Compare interrupt request.
Definitions Many register and bit references in this section are written in general form. A lower case
“n” replaces the Timer/Counter number, in this case 0. A lower case “x” replaces the
Output Compare Unit, in this case Compare Unit A or Compare Unit B. However, when
using the register or bit defines in a program, the precise form must be used, i.e.,
TCNT0 for accessing Timer/Counter0 counter value and so on.
The definitions in Table 72 are also used extensively throughout the document.
Timer/Counter Clock The Timer/Counter can be clocked by an internal or an external clock source. The clock
Sources source is selected by the Clock Select logic which is controlled by the Clock Select
(CS02:0) bits located in the Timer/Counter Control Register (TCCR0B). For details on
clock sources and prescaler, see “Timer/Counter 0, 1, 3, 4, and 5 Prescaler” on page
172.
Counter Unit The main part of the 8-bit Timer/Counter is the programmable bi-directional counter unit.
Figure 38 shows a block diagram of the counter and its surroundings.
Clock Select
count Edge
Tn
clear clkTn Detector
TCNTn Control Logic
direction
( From Prescaler )
bottom top
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Depending of the mode of operation used, the counter is cleared, incremented, or dec-
remented at each timer clock (clkT0). clkT0 can be generated from an external or internal
clock source, selected by the Clock Select bits (CS02:0). When no clock source is
selected (CS02:0 = 0) the timer is stopped. However, the TCNT0 value can be accessed
by the CPU, regardless of whether clkT0 is present or not. A CPU write overrides (has
priority over) all counter clear or count operations.
The counting sequence is determined by the setting of the WGM01 and WGM00 bits
located in the Timer/Counter Control Register (TCCR0A) and the WGM02 bit located in
the Timer/Counter Control Register B (TCCR0B). There are close connections between
how the counter behaves (counts) and how waveforms are generated on the Output
Compare outputs OC0A and OC0B. For more details about advanced counting
sequences and waveform generation, see “Modes of Operation” on page 124.
The Timer/Counter Overflow Flag (TOV0) is set according to the mode of operation
selected by the WGM02:0 bits. TOV0 can be used for generating a CPU interrupt.
Output Compare Unit The 8-bit comparator continuously compares TCNT0 with the Output Compare Regis-
ters (OCR0A and OCR0B). Whenever TCNT0 equals OCR0A or OCR0B, the
comparator signals a match. A match will set the Output Compare Flag (OCF0A or
OCF0B) at the next timer clock cycle. If the corresponding interrupt is enabled, the Out-
put Compare Flag generates an Output Compare interrupt. The Output Compare Flag is
automatically cleared when the interrupt is executed. Alternatively, the flag can be
cleared by software by writing a logical one to its I/O bit location. The Waveform Gener-
ator uses the match signal to generate an output according to operating mode set by the
WGM02:0 bits and Compare Output mode (COM0x1:0) bits. The max and bottom sig-
nals are used by the Waveform Generator for handling the special cases of the extreme
values in some modes of operation (“Modes of Operation” on page 124).
Figure 39 shows a block diagram of the Output Compare unit.
OCRnx TCNTn
= (8-bit Comparator )
OCFnx (Int.Req.)
top
bottom
Waveform Generator OCnx
FOCn
WGMn1:0 COMnX1:0
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The OCR0x Registers are double buffered when using any of the Pulse Width Modula-
tion (PWM) modes. For the normal and Clear Timer on Compare (CTC) modes of
operation, the double buffering is disabled. The double buffering synchronizes the
update of the OCR0x Compare Registers to either top or bottom of the counting
sequence. The synchronization prevents the occurrence of odd-length, non-symmetrical
PWM pulses, thereby making the output glitch-free.
The OCR0x Register access may seem complex, but this is not case. When the double
buffering is enabled, the CPU has access to the OCR0x Buffer Register, and if double
buffering is disabled the CPU will access the OCR0x directly.
Force Output Compare In non-PWM waveform generation modes, the match output of the comparator can be
forced by writing a one to the Force Output Compare (FOC0x) bit. Forcing Compare
Match will not set the OCF0x Flag or reload/clear the timer, but the OC0x pin will be
updated as if a real Compare Match had occurred (the COM0x1:0 bits settings define
whether the OC0x pin is set, cleared or toggled).
Compare Match Blocking by All CPU write operations to the TCNT0 Register will block any Compare Match that
TCNT0 Write occur in the next timer clock cycle, even when the timer is stopped. This feature allows
OCR0x to be initialized to the same value as TCNT0 without triggering an interrupt when
the Timer/Counter clock is enabled.
Using the Output Compare Since writing TCNT0 in any mode of operation will block all Compare Matches for one
Unit timer clock cycle, there are risks involved when changing TCNT0 when using the Output
Compare Unit, independently of whether the Timer/Counter is running or not. If the
value written to TCNT0 equals the OCR0x value, the Compare Match will be missed,
resulting in incorrect waveform generation. Similarly, do not write the TCNT0 value
equal to BOTTOM when the counter is down-counting.
The setup of the OC0x should be performed before setting the Data Direction Register
for the port pin to output. The easiest way of setting the OC0x value is to use the Force
Output Compare (FOC0x) strobe bits in Normal mode. The OC0x Registers keep their
values even when changing between Waveform Generation modes.
Be aware that the COM0x1:0 bits are not double buffered together with the compare
value. Changing the COM0x1:0 bits will take effect immediately.
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Compare Match Output The Compare Output mode (COM0x1:0) bits have two functions. The Waveform Gener-
Unit ator uses the COM0x1:0 bits for defining the Output Compare (OC0x) state at the next
Compare Match. Also, the COM0x1:0 bits control the OC0x pin output source. Figure 40
shows a simplified schematic of the logic affected by the COM0x1:0 bit setting. The I/O
Registers, I/O bits, and I/O pins in the figure are shown in bold. Only the parts of the
general I/O Port Control Registers (DDR and PORT) that are affected by the COM0x1:0
bits are shown. When referring to the OC0x state, the reference is for the internal OC0x
Register, not the OC0x pin. If a system reset occur, the OC0x Register is reset to “0”.
COMnx1
COMnx0 Waveform
D Q
FOCn Generator
1
OCnx
OCnx Pin
0
D Q
D Q
DDR
clk I/O
The general I/O port function is overridden by the Output Compare (OC0x) from the
Waveform Generator if either of the COM0x1:0 bits are set. However, the OC0x pin
direction (input or output) is still controlled by the Data Direction Register (DDR) for the
port pin. The Data Direction Register bit for the OC0x pin (DDR_OC0x) must be set as
output before the OC0x value is visible on the pin. The port override function is indepen-
dent of the Waveform Generation mode.
The design of the Output Compare pin logic allows initialization of the OC0x state before
the output is enabled. Note that some COM0x1:0 bit settings are reserved for certain
modes of operation. See “Register Description” on page 130.
Compare Output Mode and The Waveform Generator uses the COM0x1:0 bits differently in Normal, CTC, and PWM
Waveform Generation modes. For all modes, setting the COM0x1:0 = 0 tells the Waveform Generator that no
action on the OC0x Register is to be performed on the next Compare Match. For com-
pare output actions in the non-PWM modes refer to Table 73 on page 130. For fast
PWM mode, refer to Table 74 on page 130, and for phase correct PWM refer to Table
75 on page 131.
A change of the COM0x1:0 bits state will have effect at the first Compare Match after
the bits are written. For non-PWM modes, the action can be forced to have immediate
effect by using the FOC0x strobe bits.
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Modes of Operation The mode of operation, i.e., the behavior of the Timer/Counter and the Output Compare
pins, is defined by the combination of the Waveform Generation mode (WGM02:0) and
Compare Output mode (COM0x1:0) bits. The Compare Output mode bits do not affect
the counting sequence, while the Waveform Generation mode bits do. The COM0x1:0
bits control whether the PWM output generated should be inverted or not (inverted or
non-inverted PWM). For non-PWM modes the COM0x1:0 bits control whether the out-
put should be set, cleared, or toggled at a Compare Match (See “Compare Match
Output Unit” on page 148.).
For detailed timing information see “Timer/Counter Timing Diagrams” on page 128.
Normal Mode The simplest mode of operation is the Normal mode (WGM02:0 = 0). In this mode the
counting direction is always up (incrementing), and no counter clear is performed. The
counter simply overruns when it passes its maximum 8-bit value (TOP = 0xFF) and then
restarts from the bottom (0x00). In normal operation the Timer/Counter Overflow Flag
(TOV0) will be set in the same timer clock cycle as the TCNT0 becomes zero. The
TOV0 Flag in this case behaves like a ninth bit, except that it is only set, not cleared.
However, combined with the timer overflow interrupt that automatically clears the TOV0
Flag, the timer resolution can be increased by software. There are no special cases to
consider in the Normal mode, a new counter value can be written anytime.
The Output Compare Unit can be used to generate interrupts at some given time. Using
the Output Compare to generate waveforms in Normal mode is not recommended,
since this will occupy too much of the CPU time.
Clear Timer on Compare In Clear Timer on Compare or CTC mode (WGM02:0 = 2), the OCR0A Register is used
Match (CTC) Mode to manipulate the counter resolution. In CTC mode the counter is cleared to zero when
the counter value (TCNT0) matches the OCR0A. The OCR0A defines the top value for
the counter, hence also its resolution. This mode allows greater control of the Compare
Match output frequency. It also simplifies the operation of counting external events.
The timing diagram for the CTC mode is shown in Figure 41. The counter value
(TCNT0) increases until a Compare Match occurs between TCNT0 and OCR0A, and
then counter (TCNT0) is cleared.
TCNTn
OCn
(COMnx1:0 = 1)
(Toggle)
Period 1 2 3 4
An interrupt can be generated each time the counter value reaches the TOP value by
using the OCF0A Flag. If the interrupt is enabled, the interrupt handler routine can be
used for updating the TOP value. However, changing TOP to a value close to BOTTOM
when the counter is running with none or a low prescaler value must be done with care
since the CTC mode does not have the double buffering feature. If the new value written
to OCR0A is lower than the current value of TCNT0, the counter will miss the Compare
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Match. The counter will then have to count to its maximum value (0xFF) and wrap
around starting at 0x00 before the Compare Match can occur.
For generating a waveform output in CTC mode, the OC0A output can be set to toggle
its logical level on each Compare Match by setting the Compare Output mode bits to
toggle mode (COM0A1:0 = 1). The OC0A value will not be visible on the port pin unless
the data direction for the pin is set to output. The waveform generated will have a maxi-
mum frequency of fOC0 = fclk_I/O/2 when OCR0A is set to zero (0x00). The waveform
frequency is defined by the following equation:
f clk_I/O
f OCnx = -------------------------------------------------
-
2 ⋅ N ⋅ ( 1 + OCRnx )
The N variable represents the prescale factor (1, 8, 64, 256, or 1024).
As for the Normal mode of operation, the TOV0 Flag is set in the same timer clock cycle
that the counter counts from MAX to 0x00.
Fast PWM Mode The fast Pulse Width Modulation or fast PWM mode (WGM02:0 = 3 or 7) provides a high
frequency PWM waveform generation option. The fast PWM differs from the other PWM
option by its single-slope operation. The counter counts from BOTTOM to TOP then
restarts from BOTTOM. TOP is defined as 0xFF when WGM2:0 = 3, and OCR0A when
WGM2:0 = 7. In non-inverting Compare Output mode, the Output Compare (OC0x) is
cleared on the Compare Match between TCNT0 and OCR0x, and set at BOTTOM. In
inverting Compare Output mode, the output is set on Compare Match and cleared at
BOTTOM. Due to the single-slope operation, the operating frequency of the fast PWM
mode can be twice as high as the phase correct PWM mode that use dual-slope opera-
tion. This high frequency makes the fast PWM mode well suited for power regulation,
rectification, and DAC applications. High frequency allows physically small sized exter-
nal components (coils, capacitors), and therefore reduces total system cost.
In fast PWM mode, the counter is incremented until the counter value matches the TOP
value. The counter is then cleared at the following timer clock cycle. The timing diagram
for the fast PWM mode is shown in Figure 42. The TCNT0 value is in the timing diagram
shown as a histogram for illustrating the single-slope operation. The diagram includes
non-inverted and inverted PWM outputs. The small horizontal line marks on the TCNT0
slopes represent Compare Matches between OCR0x and TCNT0.
TCNTn
OCnx (COMnx1:0 = 2)
OCnx (COMnx1:0 = 3)
Period 1 2 3 4 5 6 7
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The Timer/Counter Overflow Flag (TOV0) is set each time the counter reaches TOP. If
the interrupt is enabled, the interrupt handler routine can be used for updating the com-
pare value.
In fast PWM mode, the compare unit allows generation of PWM waveforms on the
OC0x pins. Setting the COM0x1:0 bits to two will produce a non-inverted PWM and an
inverted PWM output can be generated by setting the COM0x1:0 to three: Setting the
COM0A1:0 bits to one allows the OC0A pin to toggle on Compare Matches if the
WGM02 bit is set. This option is not available for the OC0B pin (See Table 74 on page
130). The actual OC0x value will only be visible on the port pin if the data direction for
the port pin is set as output. The PWM waveform is generated by setting (or clearing)
the OC0x Register at the Compare Match between OCR0x and TCNT0, and clearing (or
setting) the OC0x Register at the timer clock cycle the counter is cleared (changes from
TOP to BOTTOM).
The PWM frequency for the output can be calculated by the following equation:
f clk_I/O
f OCnxPWM = -----------------
-
N ⋅ 256
The N variable represents the prescale factor (1, 8, 64, 256, or 1024).
The extreme values for the OCR0A Register represents special cases when generating
a PWM waveform output in the fast PWM mode. If the OCR0A is set equal to BOTTOM,
the output will be a narrow spike for each MAX+1 timer clock cycle. Setting the OCR0A
equal to MAX will result in a constantly high or low output (depending on the polarity of
the output set by the COM0A1:0 bits.)
A frequency (with 50% duty cycle) waveform output in fast PWM mode can be achieved
by setting OC0x to toggle its logical level on each Compare Match (COM0x1:0 = 1). The
waveform generated will have a maximum frequency of fOC0 = fclk_I/O/2 when OCR0A is
set to zero. This feature is similar to the OC0A toggle in CTC mode, except the double
buffer feature of the Output Compare unit is enabled in the fast PWM mode.
Phase Correct PWM Mode The phase correct PWM mode (WGM02:0 = 1 or 5) provides a high resolution phase
correct PWM waveform generation option. The phase correct PWM mode is based on a
dual-slope operation. The counter counts repeatedly from BOTTOM to TOP and then
from TOP to BOTTOM. TOP is defined as 0xFF when WGM2:0 = 1, and OCR0A when
WGM2:0 = 5. In non-inverting Compare Output mode, the Output Compare (OC0x) is
cleared on the Compare Match between TCNT0 and OCR0x while upcounting, and set
on the Compare Match while down-counting. In inverting Output Compare mode, the
operation is inverted. The dual-slope operation has lower maximum operation frequency
than single slope operation. However, due to the symmetric feature of the dual-slope
PWM modes, these modes are preferred for motor control applications.
In phase correct PWM mode the counter is incremented until the counter value matches
TOP. When the counter reaches TOP, it changes the count direction. The TCNT0 value
will be equal to TOP for one timer clock cycle. The timing diagram for the phase correct
PWM mode is shown on Figure 43. The TCNT0 value is in the timing diagram shown as
a histogram for illustrating the dual-slope operation. The diagram includes non-inverted
and inverted PWM outputs. The small horizontal line marks on the TCNT0 slopes repre-
sent Compare Matches between OCR0x and TCNT0.
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OCRnx Update
TCNTn
OCnx (COMnx1:0 = 2)
OCnx (COMnx1:0 = 3)
Period 1 2 3
The Timer/Counter Overflow Flag (TOV0) is set each time the counter reaches BOT-
TOM. The Interrupt Flag can be used to generate an interrupt each time the counter
reaches the BOTTOM value.
In phase correct PWM mode, the compare unit allows generation of PWM waveforms on
the OC0x pins. Setting the COM0x1:0 bits to two will produce a non-inverted PWM. An
inverted PWM output can be generated by setting the COM0x1:0 to three: Setting the
COM0A0 bits to one allows the OC0A pin to toggle on Compare Matches if the WGM02
bit is set. This option is not available for the OC0B pin (See Table 75 on page 131). The
actual OC0x value will only be visible on the port pin if the data direction for the port pin
is set as output. The PWM waveform is generated by clearing (or setting) the OC0x
Register at the Compare Match between OCR0x and TCNT0 when the counter incre-
ments, and setting (or clearing) the OC0x Register at Compare Match between OCR0x
and TCNT0 when the counter decrements. The PWM frequency for the output when
using phase correct PWM can be calculated by the following equation:
f clk_I/O
f OCnxPCPWM = -----------------
-
N ⋅ 510
The N variable represents the prescale factor (1, 8, 64, 256, or 1024).
The extreme values for the OCR0A Register represent special cases when generating a
PWM waveform output in the phase correct PWM mode. If the OCR0A is set equal to
BOTTOM, the output will be continuously low and if set equal to MAX the output will be
continuously high for non-inverted PWM mode. For inverted PWM the output will have
the opposite logic values.
At the very start of period 2 in Figure 43 OCnx has a transition from high to low even
though there is no Compare Match. The point of this transition is to guarantee symmetry
around BOTTOM. There are two cases that give a transition without Compare Match.
• OCR0A changes its value from MAX, like in Figure 43. When the OCR0A value is
MAX the OCn pin value is the same as the result of a down-counting Compare
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Match. To ensure symmetry around BOTTOM the OCn value at MAX must
correspond to the result of an up-counting Compare Match.
• The timer starts counting from a value higher than the one in OCR0A, and for that
reason misses the Compare Match and hence the OCn change that would have
happened on the way up.
Timer/Counter Timing The Timer/Counter is a synchronous design and the timer clock (clkT0) is therefore
Diagrams shown as a clock enable signal in the following figures. The figures include information
on when Interrupt Flags are set. Figure 44 contains timing data for basic Timer/Counter
operation. The figure shows the count sequence close to the MAX value in all modes
other than phase correct PWM mode.
clkI/O
clkTn
(clkI/O /1)
TOVn
Figure 45 shows the same timing data, but with the prescaler enabled.
clkI/O
clkTn
(clkI/O /8)
TOVn
Figure 46 shows the setting of OCF0B in all modes and OCF0A in all modes except
CTC mode and PWM mode, where OCR0A is TOP.
Figure 46. Timer/Counter Timing Diagram, Setting of OCF0x, with Prescaler (fclk_I/O/8)
clkI/O
clkTn
(clkI/O /8)
OCFnx
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Figure 47 shows the setting of OCF0A and the clearing of TCNT0 in CTC mode and fast
PWM mode where OCR0A is TOP.
Figure 47. Timer/Counter Timing Diagram, Clear Timer on Compare Match mode, with
Prescaler (fclk_I/O/8)
clkI/O
clkTn
(clkI/O /8)
TCNTn
TOP - 1 TOP BOTTOM BOTTOM + 1
(CTC)
OCRnx TOP
OCFnx
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Register Description
TCCR0A – Timer/Counter
Bit 7 6 5 4 3 2 1 0
Control Register A
0x24 (0x44) COM0A1 COM0A0 COM0B1 COM0B0 – – WGM01 WGM00 TCCR0A
Read/Write R/W R/W R/W R/W R R R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Table 74 shows the COM0A1:0 bit functionality when the WGM01:0 bits are set to fast
PWM mode.
Note: 1. A special case occurs when OCR0A equals TOP and COM0A1 is set. In this case,
the Compare Match is ignored, but the set or clear is done at BOTTOM. See “Fast
PWM Mode” on page 125 for more details.
Table 75 on page 131 shows the COM0A1:0 bit functionality when the WGM02:0 bits
are set to phase correct PWM mode.
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Note: 1. A special case occurs when OCR0A equals TOP and COM0A1 is set. In this case,
the Compare Match is ignored, but the set or clear is done at TOP. See “Phase Cor-
rect PWM Mode” on page 126 for more details.
Table 74 shows the COM0B1:0 bit functionality when the WGM02:0 bits are set to fast
PWM mode.
Note: 1. A special case occurs when OCR0B equals TOP and COM0B1 is set. In this case,
the Compare Match is ignored, but the set or clear is done at BOTTOM. See “Fast
PWM Mode” on page 125 for more details.
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Table 75 shows the COM0B1:0 bit functionality when the WGM02:0 bits are set to
phase correct PWM mode.
Note: 1. A special case occurs when OCR0B equals TOP and COM0B1 is set. In this case,
the Compare Match is ignored, but the set or clear is done at TOP. See “Phase Cor-
rect PWM Mode” on page 126 for more details.
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TCCR0B – Timer/Counter
Bit 7 6 5 4 3 2 1 0
Control Register B
0x25 (0x45) FOC0A FOC0B – – WGM02 CS02 CS01 CS00 TCCR0B
Read/Write W W R R R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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Table 80. Clock Select Bit Description
CS02 CS01 CS00 Description
0 0 0 No clock source (Timer/Counter stopped)
0 0 1 clkI/O/(No prescaling)
0 1 0 clkI/O/8 (From prescaler)
0 1 1 clkI/O/64 (From prescaler)
1 0 0 clkI/O/256 (From prescaler)
1 0 1 clkI/O/1024 (From prescaler)
1 1 0 External clock source on T0 pin. Clock on falling edge.
1 1 1 External clock source on T0 pin. Clock on rising edge.
If external pin modes are used for the Timer/Counter0, transitions on the T0 pin will
clock the counter even if the pin is configured as an output. This feature allows software
control of the counting.
TCNT0 – Timer/Counter
Bit 7 6 5 4 3 2 1 0
Register
0x26 (0x46) TCNT0[7:0] TCNT0
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
The Timer/Counter Register gives direct access, both for read and write operations, to
the Timer/Counter unit 8-bit counter. Writing to the TCNT0 Register blocks (removes)
the Compare Match on the following timer clock. Modifying the counter (TCNT0) while
the counter is running, introduces a risk of missing a Compare Match between TCNT0
and the OCR0x Registers.
The Output Compare Register A contains an 8-bit value that is continuously compared
with the counter value (TCNT0). A match can be used to generate an Output Compare
interrupt, or to generate a waveform output on the OC0A pin.
The Output Compare Register B contains an 8-bit value that is continuously compared
with the counter value (TCNT0). A match can be used to generate an Output Compare
interrupt, or to generate a waveform output on the OC0B pin.
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TIMSK0 – Timer/Counter
Bit 7 6 5 4 3 2 1 0
Interrupt Mask Register
(0x6E) – – – – – OCIE0B OCIE0A TOIE0 TIMSK0
Read/Write R R R R R R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
TIFR0 – Timer/Counter 0
Bit 7 6 5 4 3 2 1 0
Interrupt Flag Register
0x15 (0x35) – – – – – OCF0B OCF0A TOV0 TIFR0
Read/Write R R R R R R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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• Bit 0 – TOV0: Timer/Counter0 Overflow Flag
The bit TOV0 is set when an overflow occurs in Timer/Counter0. TOV0 is cleared by
hardware when executing the corresponding interrupt handling vector. Alternatively,
TOV0 is cleared by writing a logic one to the flag. When the SREG I-bit, TOIE0
(Timer/Counter0 Overflow Interrupt Enable), and TOV0 are set, the Timer/Counter0
Overflow interrupt is executed.
The setting of this flag is dependent of the WGM02:0 bit setting. Refer to Table 79,
“Waveform Generation Mode Bit Description” on page 132.
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Overview Most register and bit references in this section are written in general form. A lower case
“n” replaces the Timer/Counter number, and a lower case “x” replaces the Output Com-
pare unit channel. However, when using the register or bit defines in a program, the
precise form must be used, i.e., TCNT1 for accessing Timer/Counter1 counter value
and so on.
A simplified block diagram of the 16-bit Timer/Counter is shown in Figure 48. For the
actual placement of I/O pins, see “TQFP-pinout ATmega640/1280/2560” on page 2 and
“Pinout ATmega1281/2561” on page 4. CPU accessible I/O Registers, including I/O bits
and I/O pins, are shown in bold. The device-specific I/O Register and bit locations are
listed in the “Register Description” on page 160.
The Power Reduction Timer/Counter1 bit, PRTIM1, in “PRR0 – Power Reduction Regis-
ter 0” on page 55 must be written to zero to enable Timer/Counter1 module.
The Power Reduction Timer/Counter3 bit, PRTIM3, in “PRR1 – Power Reduction Regis-
ter 1” on page 56 must be written to zero to enable Timer/Counter3 module.
The Power Reduction Timer/Counter4 bit, PRTIM4, in “PRR1 – Power Reduction Regis-
ter 1” on page 56 must be written to zero to enable Timer/Counter4 module.
The Power Reduction Timer/Counter5 bit, PRTIM5, in “PRR1 – Power Reduction Regis-
ter 1” on page 56 must be written to zero to enable Timer/Counter5 module.
Timer/Counter4 and Timer/Counter5 only have full functionality in the
ATmega640/1280/2560. Input capture and output compare are not available in the
ATmega1281/2561.
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Figure 48. 16-bit Timer/Counter Block Diagram(1)
Count TOVn
Clear (Int.Req.)
Control Logic
Direction TCLK Clock Select
Edge
Tn
Detector
TOP BOTTOM
( From Prescaler )
Timer/Counter
TCNTn
= =0
OCFnA
(Int.Req.)
Waveform
= OCnA
Generation
OCRnA
Fixed OCFnB
TOP (Int.Req.)
Values
Waveform
= OCnB
Generation
DATABUS
OCRnB
OCFnC
(Int.Req.)
Waveform
= OCnC
Generation
OCRnC
( From Analog
Comparator Ouput )
ICFn (Int.Req.)
Edge Noise
ICRn
Detector Canceler
ICPn
Note: 1. Refer to Figure 1 on page 2, Table 41 on page 92, and Table 47 on page 96 for
Timer/Counter1 and 3 and 3 pin placement and description.
Registers The Timer/Counter (TCNTn), Output Compare Registers (OCRnA/B/C), and Input Cap-
ture Register (ICRn) are all 16-bit registers. Special procedures must be followed when
accessing the 16-bit registers. These procedures are described in the section “Access-
ing 16-bit Registers” on page 139. The Timer/Counter Control Registers (TCCRnA/B/C)
are 8-bit registers and have no CPU access restrictions. Interrupt requests (shorten as
Int.Req.) signals are all visible in the Timer Interrupt Flag Register (TIFRn). All interrupts
are individually masked with the Timer Interrupt Mask Register (TIMSKn). TIFRn and
TIMSKn are not shown in the figure since these registers are shared by other timer
units.
The Timer/Counter can be clocked internally, via the prescaler, or by an external clock
source on the Tn pin. The Clock Select logic block controls which clock source and edge
the Timer/Counter uses to increment (or decrement) its value. The Timer/Counter is
inactive when no clock source is selected. The output from the clock select logic is
referred to as the timer clock (clkTn).
The double buffered Output Compare Registers (OCRnA/B/C) are compared with the
Timer/Counter value at all time. The result of the compare can be used by the Waveform
Generator to generate a PWM or variable frequency output on the Output Compare pin
(OCnA/B/C). See “Output Compare Units” on page 146.. The compare match event will
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also set the Compare Match Flag (OCFnA/B/C) which can be used to generate an Out-
put Compare interrupt request.
The Input Capture Register can capture the Timer/Counter value at a given external
(edge triggered) event on either the Input Capture pin (ICPn) or on the Analog Compar-
ator pins (See “AC – Analog Comparator” on page 275.) The Input Capture unit includes
a digital filtering unit (Noise Canceler) for reducing the chance of capturing noise spikes.
The TOP value, or maximum Timer/Counter value, can in some modes of operation be
defined by either the OCRnA Register, the ICRn Register, or by a set of fixed values.
When using OCRnA as TOP value in a PWM mode, the OCRnA Register can not be
used for generating a PWM output. However, the TOP value will in this case be double
buffered allowing the TOP value to be changed in run time. If a fixed TOP value is
required, the ICRn Register can be used as an alternative, freeing the OCRnA to be
used as PWM output.
Definitions The following definitions are used extensively throughout the document:
Table 81. Definitions
BOTTOM The counter reaches the BOTTOM when it becomes 0x0000.
MAX The counter reaches its MAXimum when it becomes 0xFFFF (decimal 65535).
TOP The counter reaches the TOP when it becomes equal to the highest value in the
count sequence. The TOP value can be assigned to be one of the fixed values:
0x00FF, 0x01FF, or 0x03FF, or to the value stored in the OCRnA or ICRn
Register. The assignment is dependent of the mode of operation.
Accessing 16-bit The TCNTn, OCRnA/B/C, and ICRn are 16-bit registers that can be accessed by the
Registers AVR CPU via the 8-bit data bus. The 16-bit register must be byte accessed using two
read or write operations. Each 16-bit timer has a single 8-bit register for temporary stor-
ing of the high byte of the 16-bit access. The same Temporary Register is shared
between all 16-bit registers within each 16-bit timer. Accessing the low byte triggers the
16-bit read or write operation. When the low byte of a 16-bit register is written by the
CPU, the high byte stored in the Temporary Register, and the low byte written are both
copied into the 16-bit register in the same clock cycle. When the low byte of a 16-bit reg-
ister is read by the CPU, the high byte of the 16-bit register is copied into the Temporary
Register in the same clock cycle as the low byte is read.
Not all 16-bit accesses uses the Temporary Register for the high byte. Reading the
OCRnA/B/C 16-bit registers does not involve using the Temporary Register.
To do a 16-bit write, the high byte must be written before the low byte. For a 16-bit read,
the low byte must be read before the high byte.
The following code examples show how to access the 16-bit timer registers assuming
that no interrupts updates the temporary register. The same principle can be used
directly for accessing the OCRnA/B/C and ICRn Registers. Note that when using “C”,
the compiler handles the 16-bit access.
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Assembly Code Examples(1)
...
; Set TCNTn to 0x01FF
ldi r17,0x01
ldi r16,0xFF
out TCNTnH,r17
out TCNTnL,r16
; Read TCNTn into r17:r16
in r16,TCNTnL
in r17,TCNTnH
...
C Code Examples(1)
unsigned int i;
...
/* Set TCNTn to 0x01FF */
TCNTn = 0x1FF;
/* Read TCNTn into i */
i = TCNTn;
...
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The following code examples show how to do an atomic read of the TCNTn Register
contents. Reading any of the OCRnA/B/C or ICRn Registers can be done by using the
same principle.
C Code Example(1)
unsigned int TIM16_ReadTCNTn( void )
{
unsigned char sreg;
unsigned int i;
/* Save global interrupt flag */
sreg = SREG;
/* Disable interrupts */
__disable_interrupt();
/* Read TCNTn into i */
i = TCNTn;
/* Restore global interrupt flag */
SREG = sreg;
return i;
}
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The following code examples show how to do an atomic write of the TCNTn Register
contents. Writing any of the OCRnA/B/C or ICRn Registers can be done by using the
same principle.
C Code Example(1)
void TIM16_WriteTCNTn( unsigned int i )
{
unsigned char sreg;
unsigned int i;
/* Save global interrupt flag */
sreg = SREG;
/* Disable interrupts */
__disable_interrupt();
/* Set TCNTn to i */
TCNTn = i;
/* Restore global interrupt flag */
SREG = sreg;
}
Reusing the Temporary High If writing to more than one 16-bit register where the high byte is the same for all registers
Byte Register written, then the high byte only needs to be written once. However, note that the same
rule of atomic operation described previously also applies in this case.
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Timer/Counter Clock The Timer/Counter can be clocked by an internal or an external clock source. The clock
Sources source is selected by the Clock Select logic which is controlled by the Clock Select
(CSn2:0) bits located in the Timer/Counter control Register B (TCCRnB). For details on
clock sources and prescaler, see “Timer/Counter 0, 1, 3, 4, and 5 Prescaler” on page
172.
Counter Unit The main part of the 16-bit Timer/Counter is the programmable 16-bit bi-directional
counter unit. Figure 49 shows a block diagram of the counter and its surroundings.
TEMP (8-bit)
Clock Select
Count Edge
Tn
TCNTnH (8-bit) TCNTnL (8-bit) Clear clkTn Detector
Control Logic
Direction
TCNTn (16-bit Counter)
( From Prescaler )
TOP BOTTOM
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how waveforms are generated on the Output Compare outputs OCnx. For more details
about advanced counting sequences and waveform generation, see “Modes of Opera-
tion” on page 149.
The Timer/Counter Overflow Flag (TOVn) is set according to the mode of operation
selected by the WGMn3:0 bits. TOVn can be used for generating a CPU interrupt.
Input Capture Unit The Timer/Counter incorporates an input capture unit that can capture external events
and give them a time-stamp indicating time of occurrence. The external signal indicating
an event, or multiple events, can be applied via the ICPn pin or alternatively, for the
Timer/Counter1 only, via the Analog Comparator unit. The time-stamps can then be
used to calculate frequency, duty-cycle, and other features of the signal applied. Alter-
natively the time-stamps can be used for creating a log of the events.
The Input Capture unit is illustrated by the block diagram shown in Figure 50. The ele-
ments of the block diagram that are not directly a part of the input capture unit are gray
shaded. The small “n” in register and bit names indicates the Timer/Counter number.
TEMP (8-bit)
Analog
Comparator Noise Edge
ICFn (Int.Req.)
Canceler Detector
ICPn
Note: The Analog Comparator Output (ACO) can only trigger the Timer/Counter1 ICP – not
Timer/Counter3, 4 or 5.
When a change of the logic level (an event) occurs on the Input Capture Pin (ICPn),
alternatively on the analog Comparator output (ACO), and this change confirms to the
setting of the edge detector, a capture will be triggered. When a capture is triggered, the
16-bit value of the counter (TCNTn) is written to the Input Capture Register (ICRn). The
Input Capture Flag (ICFn) is set at the same system clock as the TCNTn value is copied
into ICRn Register. If enabled (TICIEn = 1), the input capture flag generates an input
capture interrupt. The ICFn flag is automatically cleared when the interrupt is executed.
Alternatively the ICFn flag can be cleared by software by writing a logical one to its I/O
bit location.
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Reading the 16-bit value in the Input Capture Register (ICRn) is done by first reading the
low byte (ICRnL) and then the high byte (ICRnH). When the low byte is read the high
byte is copied into the high byte Temporary Register (TEMP). When the CPU reads the
ICRnH I/O location it will access the TEMP Register.
The ICRn Register can only be written when using a Waveform Generation mode that
utilizes the ICRn Register for defining the counter’s TOP value. In these cases the
Waveform Generation mode (WGMn3:0) bits must be set before the TOP value can be
written to the ICRn Register. When writing the ICRn Register the high byte must be writ-
ten to the ICRnH I/O location before the low byte is written to ICRnL.
For more information on how to access the 16-bit registers refer to “Accessing 16-bit
Registers” on page 139.
Input Capture Trigger Source The main trigger source for the input capture unit is the Input Capture Pin (ICPn).
Timer/Counter1 can alternatively use the analog comparator output as trigger source for
the input capture unit. The Analog Comparator is selected as trigger source by setting
the analog Comparator Input Capture (ACIC) bit in the Analog Comparator Control and
Status Register (ACSR). Be aware that changing trigger source can trigger a capture.
The input capture flag must therefore be cleared after the change.
Both the Input Capture Pin (ICPn) and the Analog Comparator output (ACO) inputs are
sampled using the same technique as for the Tn pin (Figure 61 on page 172). The edge
detector is also identical. However, when the noise canceler is enabled, additional logic
is inserted before the edge detector, which increases the delay by four system clock
cycles. Note that the input of the noise canceler and edge detector is always enabled
unless the Timer/Counter is set in a Waveform Generation mode that uses ICRn to
define TOP.
An input capture can be triggered by software by controlling the port of the ICPn pin.
Noise Canceler The noise canceler improves noise immunity by using a simple digital filtering scheme.
The noise canceler input is monitored over four samples, and all four must be equal for
changing the output that in turn is used by the edge detector.
The noise canceler is enabled by setting the Input Capture Noise Canceler (ICNCn) bit
in Timer/Counter Control Register B (TCCRnB). When enabled the noise canceler intro-
duces additional four system clock cycles of delay from a change applied to the input, to
the update of the ICRn Register. The noise canceler uses the system clock and is there-
fore not affected by the prescaler.
Using the Input Capture Unit The main challenge when using the Input Capture unit is to assign enough processor
capacity for handling the incoming events. The time between two events is critical. If the
processor has not read the captured value in the ICRn Register before the next event
occurs, the ICRn will be overwritten with a new value. In this case the result of the cap-
ture will be incorrect.
When using the Input Capture interrupt, the ICRn Register should be read as early in the
interrupt handler routine as possible. Even though the Input Capture interrupt has rela-
tively high priority, the maximum interrupt response time is dependent on the maximum
number of clock cycles it takes to handle any of the other interrupt requests.
Using the Input Capture unit in any mode of operation when the TOP value (resolution)
is actively changed during operation, is not recommended.
Measurement of an external signal’s duty cycle requires that the trigger edge is changed
after each capture. Changing the edge sensing must be done as early as possible after
the ICRn Register has been read. After a change of the edge, the Input Capture Flag
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(ICFn) must be cleared by software (writing a logical one to the I/O bit location). For
measuring frequency only, the clearing of the ICFn Flag is not required (if an interrupt
handler is used).
Output Compare Units The 16-bit comparator continuously compares TCNTn with the Output Compare Regis-
ter (OCRnx). If TCNT equals OCRnx the comparator signals a match. A match will set
the Output Compare Flag (OCFnx) at the next timer clock cycle. If enabled (OCIEnx =
1), the Output Compare Flag generates an Output Compare interrupt. The OCFnx Flag
is automatically cleared when the interrupt is executed. Alternatively the OCFnx Flag
can be cleared by software by writing a logical one to its I/O bit location. The Waveform
Generator uses the match signal to generate an output according to operating mode set
by the Waveform Generation mode (WGMn3:0) bits and Compare Output mode
(COMnx1:0) bits. The TOP and BOTTOM signals are used by the Waveform Generator
for handling the special cases of the extreme values in some modes of operation (See
“Modes of Operation” on page 149.)
A special feature of Output Compare unit A allows it to define the Timer/Counter TOP
value (i.e., counter resolution). In addition to the counter resolution, the TOP value
defines the period time for waveforms generated by the Waveform Generator.
Figure 51 shows a block diagram of the Output Compare unit. The small “n” in the regis-
ter and bit names indicates the device number (n = n for Timer/Counter n), and the “x”
indicates Output Compare unit (A/B/C). The elements of the block diagram that are not
directly a part of the Output Compare unit are gray shaded.
TEMP (8-bit)
OCRnxH Buf. (8-bit) OCRnxL Buf. (8-bit) TCNTnH (8-bit) TCNTnL (8-bit)
= (16-bit Comparator )
OCFnx (Int.Req.)
TOP
Waveform Generator OCnx
BOTTOM
WGMn3:0 COMnx1:0
The OCRnx Register is double buffered when using any of the twelve Pulse Width Mod-
ulation (PWM) modes. For the Normal and Clear Timer on Compare (CTC) modes of
operation, the double buffering is disabled. The double buffering synchronizes the
update of the OCRnx Compare Register to either TOP or BOTTOM of the counting
sequence. The synchronization prevents the occurrence of odd-length, non-symmetrical
PWM pulses, thereby making the output glitch-free.
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The OCRnx Register access may seem complex, but this is not case. When the double
buffering is enabled, the CPU has access to the OCRnx Buffer Register, and if double
buffering is disabled the CPU will access the OCRnx directly. The content of the OCR1x
(Buffer or Compare) Register is only changed by a write operation (the Timer/Counter
does not update this register automatically as the TCNT1 and ICR1 Register). Therefore
OCR1x is not read via the high byte temporary register (TEMP). However, it is a good
practice to read the low byte first as when accessing other 16-bit registers. Writing the
OCRnx Registers must be done via the TEMP Register since the compare of all 16 bits
is done continuously. The high byte (OCRnxH) has to be written first. When the high
byte I/O location is written by the CPU, the TEMP Register will be updated by the value
written. Then when the low byte (OCRnxL) is written to the lower eight bits, the high byte
will be copied into the upper 8-bits of either the OCRnx buffer or OCRnx Compare Reg-
ister in the same system clock cycle.
For more information of how to access the 16-bit registers refer to “Accessing 16-bit
Registers” on page 139.
Force Output Compare In non-PWM Waveform Generation modes, the match output of the comparator can be
forced by writing a one to the Force Output Compare (FOCnx) bit. Forcing compare
match will not set the OCFnx Flag or reload/clear the timer, but the OCnx pin will be
updated as if a real compare match had occurred (the COMn1:0 bits settings define
whether the OCnx pin is set, cleared or toggled).
Compare Match Blocking by All CPU writes to the TCNTn Register will block any compare match that occurs in the
TCNTn Write next timer clock cycle, even when the timer is stopped. This feature allows OCRnx to be
initialized to the same value as TCNTn without triggering an interrupt when the
Timer/Counter clock is enabled.
Using the Output Compare Since writing TCNTn in any mode of operation will block all compare matches for one
Unit timer clock cycle, there are risks involved when changing TCNTn when using any of the
Output Compare channels, independent of whether the Timer/Counter is running or not.
If the value written to TCNTn equals the OCRnx value, the compare match will be
missed, resulting in incorrect waveform generation. Do not write the TCNTn equal to
TOP in PWM modes with variable TOP values. The compare match for the TOP will be
ignored and the counter will continue to 0xFFFF. Similarly, do not write the TCNTn value
equal to BOTTOM when the counter is downcounting.
The setup of the OCnx should be performed before setting the Data Direction Register
for the port pin to output. The easiest way of setting the OCnx value is to use the Force
Output Compare (FOCnx) strobe bits in Normal mode. The OCnx Register keeps its
value even when changing between Waveform Generation modes.
Be aware that the COMnx1:0 bits are not double buffered together with the compare
value. Changing the COMnx1:0 bits will take effect immediately.
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Compare Match Output The Compare Output mode (COMnx1:0) bits have two functions. The Waveform Gener-
Unit ator uses the COMnx1:0 bits for defining the Output Compare (OCnx) state at the next
compare match. Secondly the COMnx1:0 bits control the OCnx pin output source. Fig-
ure 52 shows a simplified schematic of the logic affected by the COMnx1:0 bit setting.
The I/O Registers, I/O bits, and I/O pins in the figure are shown in bold. Only the parts of
the general I/O Port Control Registers (DDR and PORT) that are affected by the
COMnx1:0 bits are shown. When referring to the OCnx state, the reference is for the
internal OCnx Register, not the OCnx pin. If a system reset occur, the OCnx Register is
reset to “0”.
COMnx1
COMnx0 Waveform
D Q
FOCnx Generator
1
OCnx
OCnx Pin
0
D Q
DATA BUS
PORT
D Q
DDR
clk I/O
The general I/O port function is overridden by the Output Compare (OCnx) from the
Waveform Generator if either of the COMnx1:0 bits are set. However, the OCnx pin
direction (input or output) is still controlled by the Data Direction Register (DDR) for the
port pin. The Data Direction Register bit for the OCnx pin (DDR_OCnx) must be set as
output before the OCnx value is visible on the pin. The port override function is generally
independent of the Waveform Generation mode, but there are some exceptions. Refer
to Table 83, Table 84 and Table 85 for details.
The design of the Output Compare pin logic allows initialization of the OCnx state before
the output is enabled. Note that some COMnx1:0 bit settings are reserved for certain
modes of operation. See “Register Description” on page 160.
The COMnx1:0 bits have no effect on the Input Capture unit.
Compare Output Mode and The Waveform Generator uses the COMnx1:0 bits differently in normal, CTC, and PWM
Waveform Generation modes. For all modes, setting the COMnx1:0 = 0 tells the Waveform Generator that no
action on the OCnx Register is to be performed on the next compare match. For com-
pare output actions in the non-PWM modes refer to Table 83 on page 161. For fast
PWM mode refer to Table 84 on page 161, and for phase correct and phase and fre-
quency correct PWM refer to Table 85 on page 161.
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A change of the COMnx1:0 bits state will have effect at the first compare match after the
bits are written. For non-PWM modes, the action can be forced to have immediate effect
by using the FOCnx strobe bits.
Modes of Operation The mode of operation, i.e., the behavior of the Timer/Counter and the Output Compare
pins, is defined by the combination of the Waveform Generation mode (WGMn3:0) and
Compare Output mode (COMnx1:0) bits. The Compare Output mode bits do not affect
the counting sequence, while the Waveform Generation mode bits do. The COMnx1:0
bits control whether the PWM output generated should be inverted or not (inverted or
non-inverted PWM). For non-PWM modes the COMnx1:0 bits control whether the out-
put should be set, cleared or toggle at a compare match (See “Compare Match Output
Unit” on page 148.)
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Normal Mode The simplest mode of operation is the Normal mode (WGMn3:0 = 0). In this mode the
counting direction is always up (incrementing), and no counter clear is performed. The
counter simply overruns when it passes its maximum 16-bit value (MAX = 0xFFFF) and
then restarts from the BOTTOM (0x0000). In normal operation the Timer/Counter Over-
flow Flag (TOVn) will be set in the same timer clock cycle as the TCNTn becomes zero.
The TOVn Flag in this case behaves like a 17th bit, except that it is only set, not cleared.
However, combined with the timer overflow interrupt that automatically clears the TOVn
Flag, the timer resolution can be increased by software. There are no special cases to
consider in the Normal mode, a new counter value can be written anytime.
The Input Capture unit is easy to use in Normal mode. However, observe that the maxi-
mum interval between the external events must not exceed the resolution of the counter.
If the interval between events are too long, the timer overflow interrupt or the prescaler
must be used to extend the resolution for the capture unit.
The Output Compare units can be used to generate interrupts at some given time. Using
the Output Compare to generate waveforms in Normal mode is not recommended,
since this will occupy too much of the CPU time.
Clear Timer on Compare In Clear Timer on Compare or CTC mode (WGMn3:0 = 4 or 12), the OCRnA or ICRn
Match (CTC) Mode Register are used to manipulate the counter resolution. In CTC mode the counter is
cleared to zero when the counter value (TCNTn) matches either the OCRnA (WGMn3:0
= 4) or the ICRn (WGMn3:0 = 12). The OCRnA or ICRn define the top value for the
counter, hence also its resolution. This mode allows greater control of the compare
match output frequency. It also simplifies the operation of counting external events.
The timing diagram for the CTC mode is shown in Figure 53. The counter value
(TCNTn) increases until a compare match occurs with either OCRnA or ICRn, and then
counter (TCNTn) is cleared.
TCNTn
OCnA
(COMnA1:0 = 1)
(Toggle)
Period 1 2 3 4
An interrupt can be generated at each time the counter value reaches the TOP value by
either using the OCFnA or ICFn Flag according to the register used to define the TOP
value. If the interrupt is enabled, the interrupt handler routine can be used for updating
the TOP value. However, changing the TOP to a value close to BOTTOM when the
counter is running with none or a low prescaler value must be done with care since the
CTC mode does not have the double buffering feature. If the new value written to
OCRnA or ICRn is lower than the current value of TCNTn, the counter will miss the com-
pare match. The counter will then have to count to its maximum value (0xFFFF) and
wrap around starting at 0x0000 before the compare match can occur. In many cases
this feature is not desirable. An alternative will then be to use the fast PWM mode using
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OCRnA for defining TOP (WGMn3:0 = 15) since the OCRnA then will be double
buffered.
For generating a waveform output in CTC mode, the OCnA output can be set to toggle
its logical level on each compare match by setting the Compare Output mode bits to tog-
gle mode (COMnA1:0 = 1). The OCnA value will not be visible on the port pin unless the
data direction for the pin is set to output (DDR_OCnA = 1). The waveform generated will
have a maximum frequency of fOCnA = fclk_I/O/2 when OCRnA is set to zero (0x0000). The
waveform frequency is defined by the following equation:
f clk_I/O
f OCnA = --------------------------------------------------
-
2 ⋅ N ⋅ ( 1 + OCRnA )
The N variable represents the prescaler factor (1, 8, 64, 256, or 1024).
As for the Normal mode of operation, the TOVn Flag is set in the same timer clock cycle
that the counter counts from MAX to 0x0000.
Fast PWM Mode The fast Pulse Width Modulation or fast PWM mode (WGMn3:0 = 5, 6, 7, 14, or 15) pro-
vides a high frequency PWM waveform generation option. The fast PWM differs from
the other PWM options by its single-slope operation. The counter counts from BOTTOM
to TOP then restarts from BOTTOM. In non-inverting Compare Output mode, the Output
Compare (OCnx) is cleared on the compare match between TCNTn and OCRnx, and
set at BOTTOM. In inverting Compare Output mode output is set on compare match and
cleared at BOTTOM. Due to the single-slope operation, the operating frequency of the
fast PWM mode can be twice as high as the phase correct and phase and frequency
correct PWM modes that use dual-slope operation. This high frequency makes the fast
PWM mode well suited for power regulation, rectification, and DAC applications. High
frequency allows physically small sized external components (coils, capacitors), hence
reduces total system cost.
The PWM resolution for fast PWM can be fixed to 8-, 9-, or 10-bit, or defined by either
ICRn or OCRnA. The minimum resolution allowed is 2-bit (ICRn or OCRnA set to
0x0003), and the maximum resolution is 16-bit (ICRn or OCRnA set to MAX). The PWM
resolution in bits can be calculated by using the following equation:
log ( TOP + 1 )
R FPWM = -----------------------------------
log ( 2 )
In fast PWM mode the counter is incremented until the counter value matches either
one of the fixed values 0x00FF, 0x01FF, or 0x03FF (WGMn3:0 = 5, 6, or 7), the value in
ICRn (WGMn3:0 = 14), or the value in OCRnA (WGMn3:0 = 15). The counter is then
cleared at the following timer clock cycle. The timing diagram for the fast PWM mode is
shown in Figure 54. The figure shows fast PWM mode when OCRnA or ICRn is used to
define TOP. The TCNTn value is in the timing diagram shown as a histogram for illus-
trating the single-slope operation. The diagram includes non-inverted and inverted PWM
outputs. The small horizontal line marks on the TCNTn slopes represent compare
matches between OCRnx and TCNTn. The OCnx Interrupt Flag will be set when a com-
pare match occurs.
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Figure 54. Fast PWM Mode, Timing Diagram
OCRnx / TOP Update
and TOVn Interrupt Flag
Set and OCnA Interrupt
Flag Set or ICFn
Interrupt Flag Set
(Interrupt on TOP)
TCNTn
OCnx (COMnx1:0 = 2)
OCnx (COMnx1:0 = 3)
Period 1 2 3 4 5 6 7 8
The Timer/Counter Overflow Flag (TOVn) is set each time the counter reaches TOP. In
addition the OCnA or ICFn Flag is set at the same timer clock cycle as TOVn is set
when either OCRnA or ICRn is used for defining the TOP value. If one of the interrupts
are enabled, the interrupt handler routine can be used for updating the TOP and com-
pare values.
When changing the TOP value the program must ensure that the new TOP value is
higher or equal to the value of all of the Compare Registers. If the TOP value is lower
than any of the Compare Registers, a compare match will never occur between the
TCNTn and the OCRnx. Note that when using fixed TOP values the unused bits are
masked to zero when any of the OCRnx Registers are written.
The procedure for updating ICRn differs from updating OCRnA when used for defining
the TOP value. The ICRn Register is not double buffered. This means that if ICRn is
changed to a low value when the counter is running with none or a low prescaler value,
there is a risk that the new ICRn value written is lower than the current value of TCNTn.
The result will then be that the counter will miss the compare match at the TOP value.
The counter will then have to count to the MAX value (0xFFFF) and wrap around start-
ing at 0x0000 before the compare match can occur. The OCRnA Register however, is
double buffered. This feature allows the OCRnA I/O location to be written anytime.
When the OCRnA I/O location is written the value written will be put into the OCRnA
Buffer Register. The OCRnA Compare Register will then be updated with the value in
the Buffer Register at the next timer clock cycle the TCNTn matches TOP. The update is
done at the same timer clock cycle as the TCNTn is cleared and the TOVn Flag is set.
Using the ICRn Register for defining TOP works well when using fixed TOP values. By
using ICRn, the OCRnA Register is free to be used for generating a PWM output on
OCnA. However, if the base PWM frequency is actively changed (by changing the TOP
value), using the OCRnA as TOP is clearly a better choice due to its double buffer
feature.
In fast PWM mode, the compare units allow generation of PWM waveforms on the
OCnx pins. Setting the COMnx1:0 bits to two will produce a non-inverted PWM and an
inverted PWM output can be generated by setting the COMnx1:0 to three (see Table on
page 161). The actual OCnx value will only be visible on the port pin if the data direction
for the port pin is set as output (DDR_OCnx). The PWM waveform is generated by set-
ting (or clearing) the OCnx Register at the compare match between OCRnx and TCNTn,
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and clearing (or setting) the OCnx Register at the timer clock cycle the counter is
cleared (changes from TOP to BOTTOM).
The PWM frequency for the output can be calculated by the following equation:
f clk_I/O
f OCnxPWM = ----------------------------------
-
N ⋅ ( 1 + TOP )
The N variable represents the prescaler divider (1, 8, 64, 256, or 1024).
The extreme values for the OCRnx Register represents special cases when generating
a PWM waveform output in the fast PWM mode. If the OCRnx is set equal to BOTTOM
(0x0000) the output will be a narrow spike for each TOP+1 timer clock cycle. Setting the
OCRnx equal to TOP will result in a constant high or low output (depending on the polar-
ity of the output set by the COMnx1:0 bits.)
A frequency (with 50% duty cycle) waveform output in fast PWM mode can be achieved
by setting OCnA to toggle its logical level on each compare match (COMnA1:0 = 1).
This applies only if OCR1A is used to define the TOP value (WGM13:0 = 15). The wave-
form generated will have a maximum frequency of fOCnA = fclk_I/O/2 when OCRnA is set to
zero (0x0000). This feature is similar to the OCnA toggle in CTC mode, except the dou-
ble buffer feature of the Output Compare unit is enabled in the fast PWM mode.
Phase Correct PWM Mode The phase correct Pulse Width Modulation or phase correct PWM mode (WGMn3:0 = 1,
2, 3, 10, or 11) provides a high resolution phase correct PWM waveform generation
option. The phase correct PWM mode is, like the phase and frequency correct PWM
mode, based on a dual-slope operation. The counter counts repeatedly from BOTTOM
(0x0000) to TOP and then from TOP to BOTTOM. In non-inverting Compare Output
mode, the Output Compare (OCnx) is cleared on the compare match between TCNTn
and OCRnx while upcounting, and set on the compare match while downcounting. In
inverting Output Compare mode, the operation is inverted. The dual-slope operation has
lower maximum operation frequency than single slope operation. However, due to the
symmetric feature of the dual-slope PWM modes, these modes are preferred for motor
control applications.
The PWM resolution for the phase correct PWM mode can be fixed to 8-, 9-, or 10-bit, or
defined by either ICRn or OCRnA. The minimum resolution allowed is 2-bit (ICRn or
OCRnA set to 0x0003), and the maximum resolution is 16-bit (ICRn or OCRnA set to
MAX). The PWM resolution in bits can be calculated by using the following equation:
In phase correct PWM mode the counter is incremented until the counter value matches
either one of the fixed values 0x00FF, 0x01FF, or 0x03FF (WGMn3:0 = 1, 2, or 3), the
value in ICRn (WGMn3:0 = 10), or the value in OCRnA (WGMn3:0 = 11). The counter
has then reached the TOP and changes the count direction. The TCNTn value will be
equal to TOP for one timer clock cycle. The timing diagram for the phase correct PWM
mode is shown on Figure 55. The figure shows phase correct PWM mode when OCRnA
or ICRn is used to define TOP. The TCNTn value is in the timing diagram shown as a
histogram for illustrating the dual-slope operation. The diagram includes non-inverted
and inverted PWM outputs. The small horizontal line marks on the TCNTn slopes repre-
sent compare matches between OCRnx and TCNTn. The OCnx Interrupt Flag will be
set when a compare match occurs.
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Figure 55. Phase Correct PWM Mode, Timing Diagram
TCNTn
OCnx (COMnx1:0 = 2)
OCnx (COMnx1:0 = 3)
Period 1 2 3 4
The Timer/Counter Overflow Flag (TOVn) is set each time the counter reaches BOT-
TOM. When either OCRnA or ICRn is used for defining the TOP value, the OCnA or
ICFn Flag is set accordingly at the same timer clock cycle as the OCRnx Registers are
updated with the double buffer value (at TOP). The Interrupt Flags can be used to gen-
erate an interrupt each time the counter reaches the TOP or BOTTOM value.
When changing the TOP value the program must ensure that the new TOP value is
higher or equal to the value of all of the Compare Registers. If the TOP value is lower
than any of the Compare Registers, a compare match will never occur between the
TCNTn and the OCRnx. Note that when using fixed TOP values, the unused bits are
masked to zero when any of the OCRnx Registers are written. As the third period shown
in Figure 55 illustrates, changing the TOP actively while the Timer/Counter is running in
the phase correct mode can result in an unsymmetrical output. The reason for this can
be found in the time of update of the OCRnx Register. Since the OCRnx update occurs
at TOP, the PWM period starts and ends at TOP. This implies that the length of the fall-
ing slope is determined by the previous TOP value, while the length of the rising slope is
determined by the new TOP value. When these two values differ the two slopes of the
period will differ in length. The difference in length gives the unsymmetrical result on the
output.
It is recommended to use the phase and frequency correct mode instead of the phase
correct mode when changing the TOP value while the Timer/Counter is running. When
using a static TOP value there are practically no differences between the two modes of
operation.
In phase correct PWM mode, the compare units allow generation of PWM waveforms on
the OCnx pins. Setting the COMnx1:0 bits to two will produce a non-inverted PWM and
an inverted PWM output can be generated by setting the COMnx1:0 to three (See Table
85 on page 161). The actual OCnx value will only be visible on the port pin if the data
direction for the port pin is set as output (DDR_OCnx). The PWM waveform is gener-
ated by setting (or clearing) the OCnx Register at the compare match between OCRnx
and TCNTn when the counter increments, and clearing (or setting) the OCnx Register at
compare match between OCRnx and TCNTn when the counter decrements. The PWM
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frequency for the output when using phase correct PWM can be calculated by the fol-
lowing equation:
f clk_I/O
f OCnxPCPWM = ---------------------------
-
2 ⋅ N ⋅ TOP
The N variable represents the prescaler divider (1, 8, 64, 256, or 1024).
The extreme values for the OCRnx Register represent special cases when generating a
PWM waveform output in the phase correct PWM mode. If the OCRnx is set equal to
BOTTOM the output will be continuously low and if set equal to TOP the output will be
continuously high for non-inverted PWM mode. For inverted PWM the output will have
the opposite logic values. If OCR1A is used to define the TOP value (WGM13:0 = 11)
and COM1A1:0 = 1, the OC1A output will toggle with a 50% duty cycle.
Phase and Frequency Correct The phase and frequency correct Pulse Width Modulation, or phase and frequency cor-
PWM Mode rect PWM mode (WGMn3:0 = 8 or 9) provides a high resolution phase and frequency
correct PWM waveform generation option. The phase and frequency correct PWM
mode is, like the phase correct PWM mode, based on a dual-slope operation. The
counter counts repeatedly from BOTTOM (0x0000) to TOP and then from TOP to BOT-
TOM. In non-inverting Compare Output mode, the Output Compare (OCnx) is cleared
on the compare match between TCNTn and OCRnx while upcounting, and set on the
compare match while downcounting. In inverting Compare Output mode, the operation
is inverted. The dual-slope operation gives a lower maximum operation frequency com-
pared to the single-slope operation. However, due to the symmetric feature of the dual-
slope PWM modes, these modes are preferred for motor control applications.
The main difference between the phase correct, and the phase and frequency correct
PWM mode is the time the OCRnx Register is updated by the OCRnx Buffer Register,
(see Figure 55 and Figure 56).
The PWM resolution for the phase and frequency correct PWM mode can be defined by
either ICRn or OCRnA. The minimum resolution allowed is 2-bit (ICRn or OCRnA set to
0x0003), and the maximum resolution is 16-bit (ICRn or OCRnA set to MAX). The PWM
resolution in bits can be calculated using the following equation:
log ( TOP + 1 )
R PFCPWM = -----------------------------------
log ( 2 )
In phase and frequency correct PWM mode the counter is incremented until the counter
value matches either the value in ICRn (WGMn3:0 = 8), or the value in OCRnA
(WGMn3:0 = 9). The counter has then reached the TOP and changes the count direc-
tion. The TCNTn value will be equal to TOP for one timer clock cycle. The timing
diagram for the phase correct and frequency correct PWM mode is shown on Figure 56.
The figure shows phase and frequency correct PWM mode when OCRnA or ICRn is
used to define TOP. The TCNTn value is in the timing diagram shown as a histogram for
illustrating the dual-slope operation. The diagram includes non-inverted and inverted
PWM outputs. The small horizontal line marks on the TCNTn slopes represent compare
matches between OCRnx and TCNTn. The OCnx Interrupt Flag will be set when a com-
pare match occurs.
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Figure 56. Phase and Frequency Correct PWM Mode, Timing Diagram
OCnA Interrupt Flag Set
or ICFn Interrupt Flag Set
(Interrupt on TOP)
OCRnx/TOP Updateand
TOVn Interrupt Flag Set
(Interrupt on Bottom)
TCNTn
OCnx (COMnx1:0 = 2)
OCnx (COMnx1:0 = 3)
Period 1 2 3 4
The Timer/Counter Overflow Flag (TOVn) is set at the same timer clock cycle as the
OCRnx Registers are updated with the double buffer value (at BOTTOM). When either
OCRnA or ICRn is used for defining the TOP value, the OCnA or ICFn Flag set when
TCNTn has reached TOP. The Interrupt Flags can then be used to generate an interrupt
each time the counter reaches the TOP or BOTTOM value.
When changing the TOP value the program must ensure that the new TOP value is
higher or equal to the value of all of the Compare Registers. If the TOP value is lower
than any of the Compare Registers, a compare match will never occur between the
TCNTn and the OCRnx.
As Figure 56 shows the output generated is, in contrast to the phase correct mode, sym-
metrical in all periods. Since the OCRnx Registers are updated at BOTTOM, the length
of the rising and the falling slopes will always be equal. This gives symmetrical output
pulses and is therefore frequency correct.
Using the ICRn Register for defining TOP works well when using fixed TOP values. By
using ICRn, the OCRnA Register is free to be used for generating a PWM output on
OCnA. However, if the base PWM frequency is actively changed by changing the TOP
value, using the OCRnA as TOP is clearly a better choice due to its double buffer
feature.
In phase and frequency correct PWM mode, the compare units allow generation of
PWM waveforms on the OCnx pins. Setting the COMnx1:0 bits to two will produce a
non-inverted PWM and an inverted PWM output can be generated by setting the
COMnx1:0 to three (See Table 85 on page 161). The actual OCnx value will only be vis-
ible on the port pin if the data direction for the port pin is set as output (DDR_OCnx). The
PWM waveform is generated by setting (or clearing) the OCnx Register at the compare
match between OCRnx and TCNTn when the counter increments, and clearing (or set-
ting) the OCnx Register at compare match between OCRnx and TCNTn when the
counter decrements. The PWM frequency for the output when using phase and fre-
quency correct PWM can be calculated by the following equation:
f clk_I/O
f OCnxPFCPWM = ---------------------------
-
2 ⋅ N ⋅ TOP
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The N variable represents the prescaler divider (1, 8, 64, 256, or 1024).
The extreme values for the OCRnx Register represents special cases when generating
a PWM waveform output in the phase correct PWM mode. If the OCRnx is set equal to
BOTTOM the output will be continuously low and if set equal to TOP the output will be
set to high for non-inverted PWM mode. For inverted PWM the output will have the
opposite logic values. If OCR1A is used to define the TOP value (WGM13:0 = 9) and
COM1A1:0 = 1, the OC1A output will toggle with a 50% duty cycle.
Timer/Counter Timing The Timer/Counter is a synchronous design and the timer clock (clkTn) is therefore
Diagrams shown as a clock enable signal in the following figures. The figures include information
on when Interrupt Flags are set, and when the OCRnx Register is updated with the
OCRnx buffer value (only for modes utilizing double buffering). Figure 57 shows a timing
diagram for the setting of OCFnx.
clkI/O
clkTn
(clkI/O /1)
OCFnx
Figure 58 shows the same timing data, but with the prescaler enabled.
Figure 58. Timer/Counter Timing Diagram, Setting of OCFnx, with Prescaler (fclk_I/O/8)
clkI/O
clkTn
(clkI/O /8)
OCFnx
Figure 59 shows the count sequence close to TOP in various modes. When using phase
and frequency correct PWM mode the OCRnx Register is updated at BOTTOM. The
timing diagrams will be the same, but TOP should be replaced by BOTTOM, TOP-1 by
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BOTTOM+1 and so on. The same renaming applies for modes that set the TOVn Flag
at BOTTOM.
clkI/O
clkTn
(clkI/O /1)
TCNTn
TOP - 1 TOP BOTTOM BOTTOM + 1
(CTC and FPWM)
TCNTn
TOP - 1 TOP TOP - 1 TOP - 2
(PC and PFC PWM)
TOVn (FPWM)
and ICFn (if used
as TOP)
OCRnx
Old OCRnx Value New OCRnx Value
(Update at TOP)
Figure 60 shows the same timing data, but with the prescaler enabled.
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clkI/O
clkTn
(clkI/O/8)
TCNTn
TOP - 1 TOP BOTTOM BOTTOM + 1
(CTC and FPWM)
TOVn (FPWM)
and ICF n (if used
as TOP)
OCRnx
Old OCRnx Value New OCRnx Value
(Update at TOP)
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Register Description
TCCR1A – Timer/Counter 1
Control Register A
Bit 7 6 5 4 3 2 1 0
(0x80) COM1A1 COM1A0 COM1B1 COM1B0 COM1C1 COM1C0 WGM11 WGM10 TCCR1A
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
TCCR3A – Timer/Counter 3
Control Register A
Bit 7 6 5 4 3 2 1 0
(0x90) COM3A1 COM3A0 COM3B1 COM3B0 COM3C1 COM3C0 WGM31 WGM30 TCCR3A
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
TCCR4A – Timer/Counter 4
Control Register A
Bit 7 6 5 4 3 2 1 0
(0xA0) COM4A1 COM4A0 COM4B1 COM4B0 COM4C1 COM4C0 WGM41 WGM40 TCCR4A
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
TCCR5A – Timer/Counter 5
Control Register A
Bit 7 6 5 4 3 2 1 0
(0x120) COM5A1 COM5A0 COM5B1 COM5B0 COM5C1 COM5C0 WGM51 WGM50 TCCR5A
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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.
Table 84 shows the COMnx1:0 bit functionality when the WGMn3:0 bits are set to the
fast PWM mode.
Table 85. Compare Output Mode, Phase Correct and Phase and Frequency Correct
PWM
COMnA1 COMnA0
COMnB1 COMnB0
COMnC1 COMnC0 Description
0 0 Normal port operation, OCnA/OCnB/OCnC disconnected.
0 1 WGM13:0 =9 or 11: Toggle OC1A on Compare Match, OC1B and
OC1C disconnected (normal port operation). For all other WGM1
settings, normal port operation, OC1A/OC1B/OC1C disconnected.
1 0 Clear OCnA/OCnB/OCnC on compare match when up-counting. Set
OCnA/OCnB/OCnC on compare match when downcounting.
1 1 Set OCnA/OCnB/OCnC on compare match when up-counting. Clear
OCnA/OCnB/OCnC on compare match when downcounting.
Note: A special case occurs when OCRnA/OCRnB/OCRnC equals TOP and
COMnA1/COMnB1//COMnC1 is set. See “Phase Correct PWM Mode” on page 153. for
more details.
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TCCR1B – Timer/Counter 1
Control Register B Bit 7 6 5 4 3 2 1 0
(0x81) ICNC1 ICES1 – WGM13 WGM12 CS12 CS11 CS10 TCCR1B
Read/Write R/W R/W R R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
TCCR3B – Timer/Counter 3
Control Register B Bit 7 6 5 4 3 2 1 0
(0x91) ICNC3 ICES3 – WGM33 WGM32 CS32 CS31 CS30 TCCR3B
Read/Write R/W R/W R R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
TCCR4B – Timer/Counter 4
Control Register B Bit 7 6 5 4 3 2 1 0
(0xA1) ICNC4 ICES4 – WGM43 WGM42 CS42 CS41 CS40 TCCR4B
Read/Write R/W R/W R R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
TCCR5B – Timer/Counter 5
Control Register B Bit 7 6 5 4 3 2 1 0
(0x121) ICNC5 ICES5 – WGM53 WGM52 CS52 CS51 CS50 TCCR5B
Read/Write R/W R/W R R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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If external pin modes are used for the Timer/Countern, transitions on the Tn pin will
clock the counter even if the pin is configured as an output. This feature allows software
control of the counting.
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TCCR1C – Timer/Counter 1
Bit 7 6 5 4 3 2 1 0
Control Register C
(0x82) FOC1A FOC1B FOC1C – – – – – TCCR1C
Read/Write W W W R R R R R
Initial Value 0 0 0 0 0 0 0 0
TCCR3C – Timer/Counter 3
Bit 7 6 5 4 3 2 1 0
Control Register C
(0x92) FOC3A FOC3B FOC3C – – – – – TCCR3C
Read/Write W W W R R R R R
Initial Value 0 0 0 0 0 0 0 0
TCCR4C – Timer/Counter 4
Bit 7 6 5 4 3 2 1 0
Control Register C
(0xA2) FOC4A FOC4B FOC4C – – – – – TCCR4C
Read/Write W W W R R R R R
Initial Value 0 0 0 0 0 0 0 0
TCCR5C – Timer/Counter 5
Bit 7 6 5 4 3 2 1 0
Control Register C
(0x122) FOC5A FOC5B FOC3C – – – – – TCCR5C
Read/Write W W W R R R R R
Initial Value 0 0 0 0 0 0 0 0
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The two Timer/Counter I/O locations (TCNTnH and TCNTnL, combined TCNTn) give
direct access, both for read and for write operations, to the Timer/Counter unit 16-bit
counter. To ensure that both the high and low bytes are read and written simultaneously
when the CPU accesses these registers, the access is performed using an 8-bit tempo-
rary High Byte Register (TEMP). This temporary register is shared by all the other 16-bit
registers. See “Accessing 16-bit Registers” on page 139.
Modifying the counter (TCNTn) while the counter is running introduces a risk of missing
a compare match between TCNTn and one of the OCRnx Registers.
Writing to the TCNTn Register blocks (removes) the compare match on the following
timer clock for all compare units.
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OCR1AH and OCR1AL –
Bit 7 6 5 4 3 2 1 0
Output Compare Register 1 A
(0x89) OCR1A[15:8] OCR1AH
(0x88) OCR1A[7:0] OCR1AL
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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The Output Compare Registers contain a 16-bit value that is continuously compared
with the counter value (TCNTn). A match can be used to generate an Output Compare
interrupt, or to generate a waveform output on the OCnx pin.
The Output Compare Registers are 16-bit in size. To ensure that both the high and low
bytes are written simultaneously when the CPU writes to these registers, the access is
performed using an 8-bit temporary High Byte Register (TEMP). This temporary register
is shared by all the other 16-bit registers. See “Accessing 16-bit Registers” on page 139.
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ICR1H and ICR1L – Input
Bit 7 6 5 4 3 2 1 0
Capture Register 1
(0x87) ICR1[15:8] ICR1H
(0x86) ICR1[7:0] ICR1L
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
The Input Capture is updated with the counter (TCNTn) value each time an event occurs
on the ICPn pin (or optionally on the Analog Comparator output for Timer/Counter1).
The Input Capture can be used for defining the counter TOP value.
The Input Capture Register is 16-bit in size. To ensure that both the high and low bytes
are read simultaneously when the CPU accesses these registers, the access is per-
formed using an 8-bit temporary High Byte Register (TEMP). This temporary register is
shared by all the other 16-bit registers. See “Accessing 16-bit Registers” on page 139.
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TIMSK1 – Timer/Counter 1
Bit 7 6 5 4 3 2 1 0
Interrupt Mask Register
(0x6F) – – ICIE1 – OCIE1C OCIE1B OCIE1A TOIE1 TIMSK1
Read/Write R R R/W R R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
TIMSK3 – Timer/Counter 3
Bit 7 6 5 4 3 2 1 0
Interrupt Mask Register
(0x71) – – ICIE3 – OCIE3C OCIE3B OCIE3A TOIE3 TIMSK3
Read/Write R R R/W R R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
TIMSK4 – Timer/Counter 4
Bit 7 6 5 4 3 2 1 0
Interrupt Mask Register
(0x72) – – ICIE4 – OCIE4C OCIE4B OCIE4A TOIE4 TIMSK4
Read/Write R R R/W R R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
TIMSK5 – Timer/Counter 5
Bit 7 6 5 4 3 2 1 0
Interrupt Mask Register
(0x73) – – ICIE5 – OCIE5C OCIE5B OCIE5A TOIE5 TIMSK5
Read/Write R R R/W R R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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TIFR1 – Timer/Counter1
Bit 7 6 5 4 3 2 1 0
Interrupt Flag Register
0x16 (0x36) – – ICF1 – OCF1C OCF1B OCF1A TOV1 TIFR1
Read/Write R R R/W R R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
TIFR3 – Timer/Counter3
Bit 7 6 5 4 3 2 1 0
Interrupt Flag Register
0x18 (0x38) – – ICF3 – OCF3C OCF3B OCF3A TOV3 TIFR3
Read/Write R R R/W R R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
TIFR4 – Timer/Counter4
Bit 7 6 5 4 3 2 1 0
Interrupt Flag Register
0x19 (0x39) – – ICF4 – OCF4C OCF4B OCF4A TOV4 TIFR4
Read/Write R R R/W R R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
TIFR5 – Timer/Counter5
Bit 7 6 5 4 3 2 1 0
Interrupt Flag Register
0x1A (0x3A) – – ICF5 – OCF5C OCF5B OCF5A TOV5 TIFR5
Read/Write R R R/W R R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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OCFnA is automatically cleared when the Output Compare Match A Interrupt Vector is
executed. Alternatively, OCFnA can be cleared by writing a logic one to its bit location.
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Timer/Counter 0, 1, 3, 4, and 5 Prescaler
Timer/Counter 0, 1, 3, 4, and 5 share the same prescaler module, but the
Timer/Counters can have different prescaler settings. The description below applies to
all Timer/Counters. Tn is used as a general name, n = 0, 1, 3, 4, or 5.
Internal Clock Source The Timer/Counter can be clocked directly by the system clock (by setting the CSn2:0 =
1). This provides the fastest operation, with a maximum Timer/Counter clock frequency
equal to system clock frequency (fCLK_I/O). Alternatively, one of four taps from the pres-
caler can be used as a clock source. The prescaled clock has a frequency of either
fCLK_I/O/8, fCLK_I/O/64, fCLK_I/O/256, or fCLK_I/O/1024.
Prescaler Reset The prescaler is free running, i.e., operates independently of the Clock Select logic of
the Timer/Counter, and it is shared by the Timer/Counter Tn. Since the prescaler is not
affected by the Timer/Counter’s clock select, the state of the prescaler will have implica-
tions for situations where a prescaled clock is used. One example of prescaling artifacts
occurs when the timer is enabled and clocked by the prescaler (6 > CSn2:0 > 1). The
number of system clock cycles from when the timer is enabled to the first count occurs
can be from 1 to N+1 system clock cycles, where N equals the prescaler divisor (8, 64,
256, or 1024).
It is possible to use the prescaler reset for synchronizing the Timer/Counter to program
execution. However, care must be taken if the other Timer/Counter that shares the
same prescaler also uses prescaling. A prescaler reset will affect the prescaler period
for all Timer/Counters it is connected to.
External Clock Source An external clock source applied to the Tn pin can be used as Timer/Counter clock
(clkTn). The Tn pin is sampled once every system clock cycle by the pin synchronization
logic. The synchronized (sampled) signal is then passed through the edge detector. Fig-
ure 61 shows a functional equivalent block diagram of the Tn synchronization and edge
detector logic. The registers are clocked at the positive edge of the internal system clock
(clkI/O). The latch is transparent in the high period of the internal system clock.
The edge detector generates one clkTn pulse for each positive (CSn2:0 = 7) or negative
(CSn2:0 = 6) edge it detects.
Tn D Q D Q D Q Tn_sync
(To Clock
Select Logic)
LE
clk I/O
The synchronization and edge detector logic introduces a delay of 2.5 to 3.5 system
clock cycles from an edge has been applied to the Tn pin to the counter is updated.
Enabling and disabling of the clock input must be done when Tn has been stable for at
least one system clock cycle, otherwise it is a risk that a false Timer/Counter clock pulse
is generated.
Each half period of the external clock applied must be longer than one system clock
cycle to ensure correct sampling. The external clock must be guaranteed to have less
than half the system clock frequency (fExtClk < fclk_I/O/2) given a 50/50% duty cycle. Since
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the edge detector uses sampling, the maximum frequency of an external clock it can
detect is half the sampling frequency (Nyquist sampling theorem). However, due to vari-
ation of the system clock frequency and duty cycle caused by Oscillator source (crystal,
resonator, and capacitors) tolerances, it is recommended that maximum frequency of an
external clock source is less than fclk_I/O/2.5.
An external clock source can not be prescaled.
PSR10
Tn
Synchronization
Tn
Synchronization
CSn0 CSn0
CSn1 CSn1
CSn2 CSn2
Register Description
GTCCR – General
Bit 7 6 5 4 3 2 1 0
Timer/Counter Control
0x23 (0x43) TSM – – – – – PSRASY PSRSYNC GTCCR
Register
Read/Write R/W R R R R R R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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Output Compare
Modulator
(OCM1C0A)
Overview The Output Compare Modulator (OCM) allows generation of waveforms modulated with
a carrier frequency. The modulator uses the outputs from the Output Compare Unit C of
the 16-bit Timer/Counter1 and the Output Compare Unit of the 8-bit Timer/Counter0. For
more details about these Timer/Counters see “Timer/Counter 0, 1, 3, 4, and 5 Prescaler”
on page 172 and “8-bit Timer/Counter2 with PWM and Asynchronous Operation” on
page 176.
Timer/Counter 1 OC1C
Pin
OC1C /
Timer/Counter 0 OC0A OC0A / PB7
When the modulator is enabled, the two output compare channels are modulated
together as shown in the block diagram (Figure 63).
Description The Output Compare unit 1C and Output Compare unit 2 shares the PB7 port pin for
output. The outputs of the Output Compare units (OC1C and OC0A) overrides the nor-
mal PORTB7 Register when one of them is enabled (i.e., when COMnx1:0 is not equal
to zero). When both OC1C and OC0A are enabled at the same time, the modulator is
automatically enabled.
The functional equivalent schematic of the modulator is shown on Figure 64. The sche-
matic includes part of the Timer/Counter units and the port B pin 7 output driver circuit.
COM1C1 Modulator
COM1C0
0
1
( From Waveform Generator ) D Q
1
OC1C
Pin
0
OC1C /
( From Waveform Generator ) D Q OC0A/ PB7
OC0A
D Q D Q
PORTB7 DDRB7
DATABUS
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When the modulator is enabled the type of modulation (logical AND or OR) can be
selected by the PORTB7 Register. Note that the DDRB7 controls the direction of the
port independent of the COMnx1:0 bit setting.
Timing Example Figure 65 illustrates the modulator in action. In this example the Timer/Counter1 is set to
operate in fast PWM mode (non-inverted) and Timer/Counter0 uses CTC waveform
mode with toggle Compare Output mode (COMnx1:0 = 1).
clk I/O
OC1C
(FPWM Mode)
OC0A
(CTC Mode)
PB7
(PORTB7 = 0)
PB7
(PORTB7 = 1)
1 2 3
(Period)
In this example, Timer/Counter2 provides the carrier, while the modulating signal is gen-
erated by the Output Compare unit C of the Timer/Counter1.
The resolution of the PWM signal (OC1C) is reduced by the modulation. The reduction
factor is equal to the number of system clock cycles of one period of the carrier (OC0A).
In this example the resolution is reduced by a factor of two. The reason for the reduction
is illustrated in Figure 65 at the second and third period of the PB7 output when
PORTB7 equals zero. The period 2 high time is one cycle longer than the period 3 high
time, but the result on the PB7 output is equal in both periods.
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8-bit Timer/Counter2 with PWM and Asynchronous Operation
Timer/Counter2 is a general purpose, single channel, 8-bit Timer/Counter module. The
main features are:
• Single Channel Counter
• Clear Timer on Compare Match (Auto Reload)
• Glitch-free, Phase Correct Pulse Width Modulator (PWM)
• Frequency Generator
• 10-bit Clock Prescaler
• Overflow and Compare Match Interrupt Sources (TOV2, OCF2A and OCF2B)
• Allows Clocking from External 32 kHz Watch Crystal Independent of the I/O Clock
Overview A simplified block diagram of the 8-bit Timer/Counter is shown in Figure 59.. For the
actual placement of I/O pins, see “Pin Configurations” on page 2. CPU accessible I/O
Registers, including I/O bits and I/O pins, are shown in bold. The device-specific I/O
Register and bit locations are listed in the “Register Description” on page 191.
The Power Reduction Timer/Counter2 bit, PRTIM2, in “PRR0 – Power Reduction Regis-
ter 0” on page 55 must be written to zero to enable Timer/Counter2 module.
Count TOVn
Clear (Int.Req.)
Control Logic
Direction clkTn TOSC1
T/C
Oscillator
Prescaler TOSC2
TOP BOTTOM
clkI/O
Timer/Counter
TCNTn
= =0
OCnA
(Int.Req.)
Waveform
= Generation
OCnA
OCRnA
Fixed
OCnB
TOP
(Int.Req.)
Value
DATA BUS
Waveform
= Generation
OCnB
OCRnB clkI/O
Synchronized Status flags
Synchronization Unit
clkASY
asynchronous mode
Status flags select (ASn)
ASSRn
TCCRnA TCCRnB
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Registers The Timer/Counter (TCNT2) and Output Compare Register (OCR2A and OCR2B) are
8-bit registers. Interrupt request (abbreviated to Int.Req.) signals are all visible in the
Timer Interrupt Flag Register (TIFR2). All interrupts are individually masked with the
Timer Interrupt Mask Register (TIMSK2). TIFR2 and TIMSK2 are not shown in the
figure.
The Timer/Counter can be clocked internally, via the prescaler, or asynchronously
clocked from the TOSC1/2 pins, as detailed later in this section. The asynchronous
operation is controlled by the Asynchronous Status Register (ASSR). The Clock Select
logic block controls which clock source the Timer/Counter uses to increment (or decre-
ment) its value. The Timer/Counter is inactive when no clock source is selected. The
output from the Clock Select logic is referred to as the timer clock (clkT2).
The double buffered Output Compare Register (OCR2A and OCR2B) are compared
with the Timer/Counter value at all times. The result of the compare can be used by the
Waveform Generator to generate a PWM or variable frequency output on the Output
Compare pins (OC2A and OC2B). See “Output Compare Unit” on page 184. for details.
The compare match event will also set the Compare Flag (OCF2A or OCF2B) which can
be used to generate an Output Compare interrupt request.
Definitions Many register and bit references in this document are written in general form. A lower
case “n” replaces the Timer/Counter number, in this case 2. However, when using the
register or bit defines in a program, the precise form must be used, i.e., TCNT2 for
accessing Timer/Counter2 counter value and so on.
The definitions in Table 87 are also used extensively throughout the section.
Timer/Counter Clock The Timer/Counter can be clocked by an internal synchronous or an external asynchro-
Sources nous clock source. The clock source clkT2 is by default equal to the MCU clock, clkI/O.
When the AS2 bit in the ASSR Register is written to logic one, the clock source is taken
from the Timer/Counter Oscillator connected to TOSC1 and TOSC2. For details on
asynchronous operation, see “Asynchronous Operation of Timer/Counter2” on page
188. For details on clock sources and prescaler, see “Timer/Counter Prescaler” on page
190.
Counter Unit The main part of the 8-bit Timer/Counter is the programmable bi-directional counter unit.
Figure 67 shows a block diagram of the counter and its surrounding environment.
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Figure 67. Counter Unit Block Diagram
TOVn
DATA BUS (Int.Req.)
TOSC1
count
T/C
clear clk Tn
TCNTn Control Logic Prescaler Oscillator
direction
TOSC2
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Modes of Operation The mode of operation, i.e., the behavior of the Timer/Counter and the Output Compare
pins, is defined by the combination of the Waveform Generation mode (WGM22:0) and
Compare Output mode (COM2x1:0) bits. The Compare Output mode bits do not affect
the counting sequence, while the Waveform Generation mode bits do. The COM2x1:0
bits control whether the PWM output generated should be inverted or not (inverted or
non-inverted PWM). For non-PWM modes the COM2x1:0 bits control whether the out-
put should be set, cleared, or toggled at a compare match (See “Compare Match Output
Unit” on page 185.).
For detailed timing information refer to “Timer/Counter Timing Diagrams” on page 186.
Normal Mode The simplest mode of operation is the Normal mode (WGM22:0 = 0). In this mode the
counting direction is always up (incrementing), and no counter clear is performed. The
counter simply overruns when it passes its maximum 8-bit value (TOP = 0xFF) and then
restarts from the bottom (0x00). In normal operation the Timer/Counter Overflow Flag
(TOV2) will be set in the same timer clock cycle as the TCNT2 becomes zero. The
TOV2 Flag in this case behaves like a ninth bit, except that it is only set, not cleared.
However, combined with the timer overflow interrupt that automatically clears the TOV2
Flag, the timer resolution can be increased by software. There are no special cases to
consider in the Normal mode, a new counter value can be written anytime.
The Output Compare unit can be used to generate interrupts at some given time. Using
the Output Compare to generate waveforms in Normal mode is not recommended,
since this will occupy too much of the CPU time.
Clear Timer on Compare In Clear Timer on Compare or CTC mode (WGM22:0 = 2), the OCR2A Register is used
Match (CTC) Mode to manipulate the counter resolution. In CTC mode the counter is cleared to zero when
the counter value (TCNT2) matches the OCR2A. The OCR2A defines the top value for
the counter, hence also its resolution. This mode allows greater control of the compare
match output frequency. It also simplifies the operation of counting external events.
The timing diagram for the CTC mode is shown in Table 68. The counter value (TCNT2)
increases until a compare match occurs between TCNT2 and OCR2A, and then counter
(TCNT2) is cleared.
TCNTn
OCnx
(COMnx1:0 = 1)
(Toggle)
Period 1 2 3 4
An interrupt can be generated each time the counter value reaches the TOP value by
using the OCF2A Flag. If the interrupt is enabled, the interrupt handler routine can be
used for updating the TOP value. However, changing TOP to a value close to BOTTOM
when the counter is running with none or a low prescaler value must be done with care
since the CTC mode does not have the double buffering feature. If the new value written
to OCR2A is lower than the current value of TCNT2, the counter will miss the compare
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match. The counter will then have to count to its maximum value (0xFF) and wrap
around starting at 0x00 before the compare match can occur.
For generating a waveform output in CTC mode, the OC2A output can be set to toggle
its logical level on each compare match by setting the Compare Output mode bits to tog-
gle mode (COM2A1:0 = 1). The OC2A value will not be visible on the port pin unless the
data direction for the pin is set to output. The waveform generated will have a maximum
frequency of fOC2A = fclk_I/O/2 when OCR2A is set to zero (0x00). The waveform fre-
quency is defined by the following equation:
f clk_I/O
f OCnx = -------------------------------------------------
-
2 ⋅ N ⋅ ( 1 + OCRnx )
The N variable represents the prescale factor (1, 8, 32, 64, 128, 256, or 1024).
As for the Normal mode of operation, the TOV2 Flag is set in the same timer clock cycle
that the counter counts from MAX to 0x00.
Fast PWM Mode The fast Pulse Width Modulation or fast PWM mode (WGM22:0 = 3 or 7) provides a high
frequency PWM waveform generation option. The fast PWM differs from the other PWM
option by its single-slope operation. The counter counts from BOTTOM to TOP then
restarts from BOTTOM. TOP is defined as 0xFF when WGM22:0 = 3, and OCR2A when
MGM22:0 = 7. In non-inverting Compare Output mode, the Output Compare (OC2x) is
cleared on the compare match between TCNT2 and OCR2x, and set at BOTTOM. In
inverting Compare Output mode, the output is set on compare match and cleared at
BOTTOM. Due to the single-slope operation, the operating frequency of the fast PWM
mode can be twice as high as the phase correct PWM mode that uses dual-slope oper-
ation. This high frequency makes the fast PWM mode well suited for power regulation,
rectification, and DAC applications. High frequency allows physically small sized exter-
nal components (coils, capacitors), and therefore reduces total system cost.
In fast PWM mode, the counter is incremented until the counter value matches the TOP
value. The counter is then cleared at the following timer clock cycle. The timing diagram
for the fast PWM mode is shown in Figure 60. The TCNT2 value is in the timing diagram
shown as a histogram for illustrating the single-slope operation. The diagram includes
non-inverted and inverted PWM outputs. The small horizontal line marks on the TCNT2
slopes represent compare matches between OCR2x and TCNT2.
TCNTn
OCnx (COMnx1:0 = 2)
OCnx (COMnx1:0 = 3)
Period 1 2 3 4 5 6 7
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The Timer/Counter Overflow Flag (TOV2) is set each time the counter reaches TOP. If
the interrupt is enabled, the interrupt handler routine can be used for updating the com-
pare value.
In fast PWM mode, the compare unit allows generation of PWM waveforms on the
OC2x pin. Setting the COM2x1:0 bits to two will produce a non-inverted PWM and an
inverted PWM output can be generated by setting the COM2x1:0 to three. TOP is
defined as 0xFF when WGM2:0 = 3, and OCR2A when WGM2:0 = 7 (See Table 89 on
page 191). The actual OC2x value will only be visible on the port pin if the data direction
for the port pin is set as output. The PWM waveform is generated by setting (or clearing)
the OC2x Register at the compare match between OCR2x and TCNT2, and clearing (or
setting) the OC2x Register at the timer clock cycle the counter is cleared (changes from
TOP to BOTTOM).
The PWM frequency for the output can be calculated by the following equation:
f clk_I/O
f OCnxPWM = -----------------
-
N ⋅ 256
The N variable represents the prescale factor (1, 8, 32, 64, 128, 256, or 1024).
The extreme values for the OCR2A Register represent special cases when generating a
PWM waveform output in the fast PWM mode. If the OCR2A is set equal to BOTTOM,
the output will be a narrow spike for each MAX+1 timer clock cycle. Setting the OCR2A
equal to MAX will result in a constantly high or low output (depending on the polarity of
the output set by the COM2A1:0 bits.)
A frequency (with 50% duty cycle) waveform output in fast PWM mode can be achieved
by setting OC2x to toggle its logical level on each compare match (COM2x1:0 = 1). The
waveform generated will have a maximum frequency of foc2 = fclk_I/O/2 when OCR2A is
set to zero. This feature is similar to the OC2A toggle in CTC mode, except the double
buffer feature of the Output Compare unit is enabled in the fast PWM mode.
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Phase Correct PWM Mode The phase correct PWM mode (WGM22:0 = 1 or 5) provides a high resolution phase
correct PWM waveform generation option. The phase correct PWM mode is based on a
dual-slope operation. The counter counts repeatedly from BOTTOM to TOP and then
from TOP to BOTTOM. TOP is defined as 0xFF when WGM22:0 = 1, and OCR2A when
MGM22:0 = 5. In non-inverting Compare Output mode, the Output Compare (OC2x) is
cleared on the compare match between TCNT2 and OCR2x while upcounting, and set
on the compare match while downcounting. In inverting Output Compare mode, the
operation is inverted. The dual-slope operation has lower maximum operation frequency
than single slope operation. However, due to the symmetric feature of the dual-slope
PWM modes, these modes are preferred for motor control applications.
In phase correct PWM mode the counter is incremented until the counter value matches
TOP. When the counter reaches TOP, it changes the count direction. The TCNT2 value
will be equal to TOP for one timer clock cycle. The timing diagram for the phase correct
PWM mode is shown on Figure 70. The TCNT2 value is in the timing diagram shown as
a histogram for illustrating the dual-slope operation. The diagram includes non-inverted
and inverted PWM outputs. The small horizontal line marks on the TCNT2 slopes repre-
sent compare matches between OCR2x and TCNT2.
OCRnx Update
TCNTn
OCnx (COMnx1:0 = 2)
OCnx (COMnx1:0 = 3)
Period 1 2 3
The Timer/Counter Overflow Flag (TOV2) is set each time the counter reaches BOT-
TOM. The Interrupt Flag can be used to generate an interrupt each time the counter
reaches the BOTTOM value.
In phase correct PWM mode, the compare unit allows generation of PWM waveforms on
the OC2x pin. Setting the COM2x1:0 bits to two will produce a non-inverted PWM. An
inverted PWM output can be generated by setting the COM2x1:0 to three. TOP is
defined as 0xFF when WGM2:0 = 3, and OCR2A when MGM2:0 = 7 (See Table 90 on
page 192). The actual OC2x value will only be visible on the port pin if the data direction
for the port pin is set as output. The PWM waveform is generated by clearing (or setting)
the OC2x Register at the compare match between OCR2x and TCNT2 when the
counter increments, and setting (or clearing) the OC2x Register at compare match
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between OCR2x and TCNT2 when the counter decrements. The PWM frequency for the
output when using phase correct PWM can be calculated by the following equation:
f clk_I/O
f OCnxPCPWM = -----------------
-
N ⋅ 510
The N variable represents the prescale factor (1, 8, 32, 64, 128, 256, or 1024).
The extreme values for the OCR2A Register represent special cases when generating a
PWM waveform output in the phase correct PWM mode. If the OCR2A is set equal to
BOTTOM, the output will be continuously low and if set equal to MAX the output will be
continuously high for non-inverted PWM mode. For inverted PWM the output will have
the opposite logic values.
At the very start of period 2 in Figure 70 OCnx has a transition from high to low even
though there is no Compare Match. The point of this transition is to guarantee symmetry
around BOTTOM. There are two cases that give a transition without Compare Match.
• OCR2A changes its value from MAX, like in Figure 70. When the OCR2A value is
MAX the OCn pin value is the same as the result of a down-counting compare
match. To ensure symmetry around BOTTOM the OCn value at MAX must
correspond to the result of an up-counting Compare Match.
• The timer starts counting from a value higher than the one in OCR2A, and for that
reason misses the Compare Match and hence the OCn change that would have
happened on the way up.
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Output Compare Unit The 8-bit comparator continuously compares TCNT2 with the Output Compare Register
(OCR2A and OCR2B). Whenever TCNT2 equals OCR2A or OCR2B, the comparator
signals a match. A match will set the Output Compare Flag (OCF2A or OCF2B) at the
next timer clock cycle. If the corresponding interrupt is enabled, the Output Compare
Flag generates an Output Compare interrupt. The Output Compare Flag is automatically
cleared when the interrupt is executed. Alternatively, the Output Compare Flag can be
cleared by software by writing a logical one to its I/O bit location. The Waveform Gener-
ator uses the match signal to generate an output according to operating mode set by the
WGM22:0 bits and Compare Output mode (COM2x1:0) bits. The max and bottom sig-
nals are used by the Waveform Generator for handling the special cases of the extreme
values in some modes of operation (“Modes of Operation” on page 179).
Figure 57 on page 157 shows a block diagram of the Output Compare unit.
OCRnx TCNTn
= (8-bit Comparator )
OCFnx (Int.Req.)
top
bottom
Waveform Generator OCnx
FOCn
WGMn1:0 COMnX1:0
The OCR2x Register is double buffered when using any of the Pulse Width Modulation
(PWM) modes. For the Normal and Clear Timer on Compare (CTC) modes of operation,
the double buffering is disabled. The double buffering synchronizes the update of the
OCR2x Compare Register to either top or bottom of the counting sequence. The syn-
chronization prevents the occurrence of odd-length, non-symmetrical PWM pulses,
thereby making the output glitch-free.
The OCR2x Register access may seem complex, but this is not case. When the double
buffering is enabled, the CPU has access to the OCR2x Buffer Register, and if double
buffering is disabled the CPU will access the OCR2x directly.
Force Output Compare In non-PWM waveform generation modes, the match output of the comparator can be
forced by writing a one to the Force Output Compare (FOC2x) bit. Forcing compare
match will not set the OCF2x Flag or reload/clear the timer, but the OC2x pin will be
updated as if a real compare match had occurred (the COM2x1:0 bits settings define
whether the OC2x pin is set, cleared or toggled).
Compare Match Blocking by All CPU write operations to the TCNT2 Register will block any compare match that
TCNT2 Write occurs in the next timer clock cycle, even when the timer is stopped. This feature allows
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OCR2x to be initialized to the same value as TCNT2 without triggering an interrupt when
the Timer/Counter clock is enabled.
Using the Output Compare Since writing TCNT2 in any mode of operation will block all compare matches for one
Unit timer clock cycle, there are risks involved when changing TCNT2 when using the Output
Compare channel, independently of whether the Timer/Counter is running or not. If the
value written to TCNT2 equals the OCR2x value, the compare match will be missed,
resulting in incorrect waveform generation. Similarly, do not write the TCNT2 value
equal to BOTTOM when the counter is downcounting.
The setup of the OC2x should be performed before setting the Data Direction Register
for the port pin to output. The easiest way of setting the OC2x value is to use the Force
Output Compare (FOC2x) strobe bit in Normal mode. The OC2x Register keeps its
value even when changing between Waveform Generation modes.
Be aware that the COM2x1:0 bits are not double buffered together with the compare
value. Changing the COM2x1:0 bits will take effect immediately.
Compare Match Output The Compare Output mode (COM2x1:0) bits have two functions. The Waveform Gener-
Unit ator uses the COM2x1:0 bits for defining the Output Compare (OC2x) state at the next
compare match. Also, the COM2x1:0 bits control the OC2x pin output source. Figure 72
shows a simplified schematic of the logic affected by the COM2x1:0 bit setting. The I/O
Registers, I/O bits, and I/O pins in the figure are shown in bold. Only the parts of the
general I/O Port Control Registers (DDR and PORT) that are affected by the COM2x1:0
bits are shown. When referring to the OC2x state, the reference is for the internal OC2x
Register, not the OC2x pin.
COMnx1
COMnx0 Waveform
D Q
FOCnx Generator
1
OCnx
OCnx Pin
0
D Q
DATA BUS
PORT
D Q
DDR
clk I/O
The general I/O port function is overridden by the Output Compare (OC2x) from the
Waveform Generator if either of the COM2x1:0 bits are set. However, the OC2x pin
direction (input or output) is still controlled by the Data Direction Register (DDR) for the
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port pin. The Data Direction Register bit for the OC2x pin (DDR_OC2x) must be set as
output before the OC2x value is visible on the pin. The port override function is indepen-
dent of the Waveform Generation mode.
The design of the Output Compare pin logic allows initialization of the OC2x state before
the output is enabled. Note that some COM2x1:0 bit settings are reserved for certain
modes of operation. See “Register Description” on page 191.
Compare Output Mode and The Waveform Generator uses the COM2x1:0 bits differently in normal, CTC, and PWM
Waveform Generation modes. For all modes, setting the COM2x1:0 = 0 tells the Waveform Generator that no
action on the OC2x Register is to be performed on the next compare match. For com-
pare output actions in the non-PWM modes refer to Table 91 on page 192. For fast
PWM mode, refer to Table 92 on page 192, and for phase correct PWM refer to Table
93 on page 193.
A change of the COM2x1:0 bits state will have effect at the first compare match after the
bits are written. For non-PWM modes, the action can be forced to have immediate effect
by using the FOC2x strobe bits.
Timer/Counter Timing The following figures show the Timer/Counter in synchronous mode, and the timer clock
Diagrams (clkT2) is therefore shown as a clock enable signal. In asynchronous mode, clkI/O should
be replaced by the Timer/Counter Oscillator clock. The figures include information on
when Interrupt Flags are set. Figure 73 contains timing data for basic Timer/Counter
operation. The figure shows the count sequence close to the MAX value in all modes
other than phase correct PWM mode.
clkI/O
clkTn
(clkI/O /1)
TOVn
Figure 74 shows the same timing data, but with the prescaler enabled.
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clkI/O
clkTn
(clkI/O /8)
TOVn
Figure 75 shows the setting of OCF2A in all modes except CTC mode.
Figure 75. Timer/Counter Timing Diagram, Setting of OCF2A, with Prescaler (fclk_I/O/8)
clkI/O
clkTn
(clkI/O /8)
OCFnx
Figure 76 shows the setting of OCF2A and the clearing of TCNT2 in CTC mode.
Figure 76. Timer/Counter Timing Diagram, Clear Timer on Compare Match mode, with
Prescaler (fclk_I/O/8)
clkI/O
clkTn
(clkI/O /8)
TCNTn
TOP - 1 TOP BOTTOM BOTTOM + 1
(CTC)
OCRnx TOP
OCFnx
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Asynchronous Operation of Timer/Counter2
When Timer/Counter2 operates asynchronously, some considerations must be taken.
• Warning: When switching between asynchronous and synchronous clocking of
Timer/Counter2, the Timer Registers TCNT2, OCR2x, and TCCR2x might be
corrupted. A safe procedure for switching clock source is:
1. Disable the Timer/Counter2 interrupts by clearing OCIE2x and TOIE2.
2. Select clock source by setting AS2 as appropriate.
3. Write new values to TCNT2, OCR2x, and TCCR2x.
4. To switch to asynchronous operation: Wait for TCN2UB, OCR2xUB, and
TCR2xUB.
5. Clear the Timer/Counter2 Interrupt Flags.
6. Enable interrupts, if needed.
• The CPU main clock frequency must be more than four times the Oscillator
frequency.
• When writing to one of the registers TCNT2, OCR2x, or TCCR2x, the value is
transferred to a temporary register, and latched after two positive edges on TOSC1.
The user should not write a new value before the contents of the temporary register
have been transferred to its destination. Each of the five mentioned registers have
their individual temporary register, which means that e.g. writing to TCNT2 does not
disturb an OCR2x write in progress. To detect that a transfer to the destination
register has taken place, the Asynchronous Status Register – ASSR has been
implemented.
• When entering Power-save or ADC Noise Reduction mode after having written to
TCNT2, OCR2x, or TCCR2x, the user must wait until the written register has been
updated if Timer/Counter2 is used to wake up the device. Otherwise, the MCU will
enter sleep mode before the changes are effective. This is particularly important if
any of the Output Compare2 interrupt is used to wake up the device, since the
Output Compare function is disabled during writing to OCR2x or TCNT2. If the write
cycle is not finished, and the MCU enters sleep mode before the corresponding
OCR2xUB bit returns to zero, the device will never receive a compare match
interrupt, and the MCU will not wake up.
• If Timer/Counter2 is used to wake the device up from Power-save or ADC Noise
Reduction mode, precautions must be taken if the user wants to re-enter one of
these modes: The interrupt logic needs one TOSC1 cycle to be reset. If the time
between wake-up and re-entering sleep mode is less than one TOSC1 cycle, the
interrupt will not occur, and the device will fail to wake up. If the user is in doubt
whether the time before re-entering Power-save or ADC Noise Reduction mode is
sufficient, the following algorithm can be used to ensure that one TOSC1 cycle has
elapsed:
1. Write a value to TCCR2x, TCNT2, or OCR2x.
2. Wait until the corresponding Update Busy Flag in ASSR returns to zero.
3. Enter Power-save or ADC Noise Reduction mode.
• When the asynchronous operation is selected, the 32.768 kHz Oscillator for
Timer/Counter2 is always running, except in Power-down and Standby modes. After
a Power-up Reset or wake-up from Power-down or Standby mode, the user should
be aware of the fact that this Oscillator might take as long as one second to stabilize.
The user is advised to wait for at least one second before using Timer/Counter2
after power-up or wake-up from Power-down or Standby mode. The contents of all
Timer/Counter2 Registers must be considered lost after a wake-up from Power-
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down or Standby mode due to unstable clock signal upon start-up, no matter
whether the Oscillator is in use or a clock signal is applied to the TOSC1 pin.
• Description of wake up from Power-save or ADC Noise Reduction mode when the
timer is clocked asynchronously: When the interrupt condition is met, the wake up
process is started on the following cycle of the timer clock, that is, the timer is
always advanced by at least one before the processor can read the counter value.
After wake-up, the MCU is halted for four cycles, it executes the interrupt routine,
and resumes execution from the instruction following SLEEP.
• Reading of the TCNT2 Register shortly after wake-up from Power-save may give an
incorrect result. Since TCNT2 is clocked on the asynchronous TOSC clock, reading
TCNT2 must be done through a register synchronized to the internal I/O clock
domain. Synchronization takes place for every rising TOSC1 edge. When waking up
from Power-save mode, and the I/O clock (clkI/O) again becomes active, TCNT2 will
read as the previous value (before entering sleep) until the next rising TOSC1 edge.
The phase of the TOSC clock after waking up from Power-save mode is essentially
unpredictable, as it depends on the wake-up time. The recommended procedure for
reading TCNT2 is thus as follows:
1. Write any value to either of the registers OCR2x or TCCR2x.
2. Wait for the corresponding Update Busy Flag to be cleared.
3. Read TCNT2.
• During asynchronous operation, the synchronization of the Interrupt Flags for the
asynchronous timer takes 3 processor cycles plus one timer cycle. The timer is
therefore advanced by at least one before the processor can read the timer value
causing the setting of the Interrupt Flag. The Output Compare pin is changed on the
timer clock and is not synchronized to the processor clock.
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Timer/Counter Prescaler Figure 77. Prescaler for Timer/Counter2
clkI/O clkT2S
10-BIT T/C PRESCALER
Clear
TOSC1
clkT2S/8
clkT2S/32
clkT2S/64
clkT2S/128
clkT2S/256
clkT2S/1024
AS2
PSRASY 0
CS20
CS21
CS22
The clock source for Timer/Counter2 is named clkT2S. clkT2S is by default connected to
the main system I/O clock clkIO. By setting the AS2 bit in ASSR, Timer/Counter2 is asyn-
chronously clocked from the TOSC1 pin. This enables use of Timer/Counter2 as a Real
Time Counter (RTC). When AS2 is set, pins TOSC1 and TOSC2 are disconnected from
Port C. A crystal can then be connected between the TOSC1 and TOSC2 pins to serve
as an independent clock source for Timer/Counter2. The Oscillator is optimized for use
with a 32.768 kHz crystal. By setting the EXCLK bit in the ASSR, a 32 KHz external
clock can be applied. See “ASSR – Asynchronous Status Register” on page 196 for
details.
For Timer/Counter2, the possible prescaled selections are: clkT2S/8, clkT2S/32, clkT2S/64,
clkT2S/128, clkT2S/256, and clkT2S/1024. Additionally, clkT2S as well as 0 (stop) may be
selected. Setting the PSRASY bit in GTCCR resets the prescaler. This allows the user
to operate with a predictable prescaler.
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Register Description
TCCR2A –Timer/Counter
Bit 7 6 5 4 3 2 1 0
Control Register A
(0xB0) COM2A1 COM2A0 COM2B1 COM2B0 – – WGM21 WGM20 TCCR2A
Read/Write R/W R/W R/W R/W R R R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Table 89 shows the COM2A1:0 bit functionality when the WGM21:0 bits are set to fast
PWM mode.
Note: 1. A special case occurs when OCR2A equals TOP and COM2A1 is set. In this case,
the Compare Match is ignored, but the set or clear is done at BOTTOM. See “Fast
PWM Mode” on page 180 for more details.
Table 90 shows the COM2A1:0 bit functionality when the WGM22:0 bits are set to
phase correct PWM mode.
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Table 90. Compare Output Mode, Phase Correct PWM Mode(1)
COM2A1 COM2A0 Description
0 0 Normal port operation, OC2A disconnected.
0 1 WGM22 = 0: Normal Port Operation, OC2A Disconnected.
WGM22 = 1: Toggle OC2A on Compare Match.
1 0 Clear OC2A on Compare Match when up-counting. Set OC2A on
Compare Match when down-counting.
1 1 Set OC2A on Compare Match when up-counting. Clear OC2A on
Compare Match when down-counting.
Note: 1. A special case occurs when OCR2A equals TOP and COM2A1 is set. In this case,
the Compare Match is ignored, but the set or clear is done at TOP. See “Phase Cor-
rect PWM Mode” on page 182 for more details.
Table 92 shows the COM2B1:0 bit functionality when the WGM22:0 bits are set to fast
PWM mode.
Note: 1. A special case occurs when OCR2B equals TOP and COM2B1 is set. In this case,
the Compare Match is ignored, but the set or clear is done at BOTTOM. See “Fast
PWM Mode” on page 180 for more details.
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Table 93 shows the COM2B1:0 bit functionality when the WGM22:0 bits are set to
phase correct PWM mode.
Note: 1. A special case occurs when OCR2B equals TOP and COM2B1 is set. In this case,
the Compare Match is ignored, but the set or clear is done at TOP. See “Phase Cor-
rect PWM Mode” on page 182 for more details.
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TCCR2B – Timer/Counter
Bit 7 6 5 4 3 2 1 0
Control Register B
(0xB1) FOC2A FOC2B – – WGM22 CS22 CS21 CS20 TCCR2B
Read/Write W W R R R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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TCNT2 – Timer/Counter
Bit 7 6 5 4 3 2 1 0
Register
(0xB2) TCNT2[7:0] TCNT2
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
The Timer/Counter Register gives direct access, both for read and write operations, to
the Timer/Counter unit 8-bit counter. Writing to the TCNT2 Register blocks (removes)
the Compare Match on the following timer clock. Modifying the counter (TCNT2) while
the counter is running, introduces a risk of missing a Compare Match between TCNT2
and the OCR2x Registers.
The Output Compare Register A contains an 8-bit value that is continuously compared
with the counter value (TCNT2). A match can be used to generate an Output Compare
interrupt, or to generate a waveform output on the OC2A pin.
The Output Compare Register B contains an 8-bit value that is continuously compared
with the counter value (TCNT2). A match can be used to generate an Output Compare
interrupt, or to generate a waveform output on the OC2B pin.
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ASSR – Asynchronous Status
Bit 7 6 5 4 3 2 1 0
Register
(0xB6) – EXCLK AS2 TCN2UB OCR2AUB OCR2BUB TCR2AUB TCR2BUB ASSR
Read/Write R R/W R/W R R R R R
Initial Value 0 0 0 0 0 0 0 0
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The mechanisms for reading TCNT2, OCR2A, OCR2B, TCCR2A and TCCR2B are dif-
ferent. When reading TCNT2, the actual timer value is read. When reading OCR2A,
OCR2B, TCCR2A and TCCR2B the value in the temporary storage register is read.
TIMSK2 – Timer/Counter2
Bit 7 6 5 4 3 2 1 0
Interrupt Mask Register
(0x70) – – – – – OCIE2B OCIE2A TOIE2 TIMSK2
Read/Write R R R R R R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
TIFR2 – Timer/Counter2
Bit 7 6 5 4 3 2 1 0
Interrupt Flag Register
0x17 (0x37) – – – – – OCF2B OCF2A TOV2 TIFR2
Read/Write R R R R R R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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• Bit 0 – TOV2: Timer/Counter2 Overflow Flag
The TOV2 bit is set (one) when an overflow occurs in Timer/Counter2. TOV2 is cleared
by hardware when executing the corresponding interrupt handling vector. Alternatively,
TOV2 is cleared by writing a logic one to the flag. When the SREG I-bit, TOIE2A
(Timer/Counter2 Overflow Interrupt Enable), and TOV2 are set (one), the
Timer/Counter2 Overflow interrupt is executed. In PWM mode, this bit is set when
Timer/Counter2 changes counting direction at 0x00.
GTCCR – General
Bit 7 6 5 4 3 2 1 0
Timer/Counter Control
0x23 (0x43) TSM – – – – – PSRASY PSRSYNC GTCCR
Register
Read/Write R/W R R R R R R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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DIVIDER
/2/4/8/16/32/64/128
SPI2X
SPI2X
Note: 1. Refer to Figure 1 on page 2, and Table 42 on page 92 for SPI pin placement.
The interconnection between Master and Slave CPUs with SPI is shown in Figure 79.
The system consists of two shift Registers, and a Master clock generator. The SPI Mas-
ter initiates the communication cycle when pulling low the Slave Select SS pin of the
desired Slave. Master and Slave prepare the data to be sent in their respective shift
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Registers, and the Master generates the required clock pulses on the SCK line to inter-
change data. Data is always shifted from Master to Slave on the Master Out – Slave In,
MOSI, line, and from Slave to Master on the Master In – Slave Out, MISO, line. After
each data packet, the Master will synchronize the Slave by pulling high the Slave Select,
SS, line.
When configured as a Master, the SPI interface has no automatic control of the SS line.
This must be handled by user software before communication can start. When this is
done, writing a byte to the SPI Data Register starts the SPI clock generator, and the
hardware shifts the eight bits into the Slave. After shifting one byte, the SPI clock gener-
ator stops, setting the end of Transmission Flag (SPIF). If the SPI Interrupt Enable bit
(SPIE) in the SPCR Register is set, an interrupt is requested. The Master may continue
to shift the next byte by writing it into SPDR, or signal the end of packet by pulling high
the Slave Select, SS line. The last incoming byte will be kept in the Buffer Register for
later use.
When configured as a Slave, the SPI interface will remain sleeping with MISO tri-stated
as long as the SS pin is driven high. In this state, software may update the contents of
the SPI Data Register, SPDR, but the data will not be shifted out by incoming clock
pulses on the SCK pin until the SS pin is driven low. As one byte has been completely
shifted, the end of Transmission Flag, SPIF is set. If the SPI Interrupt Enable bit, SPIE,
in the SPCR Register is set, an interrupt is requested. The Slave may continue to place
new data to be sent into SPDR before reading the incoming data. The last incoming byte
will be kept in the Buffer Register for later use.
SHIFT
ENABLE
The system is single buffered in the transmit direction and double buffered in the receive
direction. This means that bytes to be transmitted cannot be written to the SPI Data
Register before the entire shift cycle is completed. When receiving data, however, a
received character must be read from the SPI Data Register before the next character
has been completely shifted in. Otherwise, the first byte is lost.
In SPI Slave mode, the control logic will sample the incoming signal of the SCK pin. To
ensure correct sampling of the clock signal, the minimum low and high periods should
be:
Low period: longer than 2 CPU clock cycles
High period: longer than 2 CPU clock cycles
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When the SPI is enabled, the data direction of the MOSI, MISO, SCK, and SS pins is
overridden according to Table 96. For more details on automatic port overrides, refer to
“Alternate Port Functions” on page 89.
Table 96. SPI Pin Overrides(1)
Pin Direction, Master SPI Direction, Slave SPI
MOSI User Defined Input
MISO Input User Defined
SCK User Defined Input
SS User Defined Input
Note: 1. See “Alternate Functions of Port B” on page 92 for a detailed description of how to
define the direction of the user defined SPI pins.
The following code examples show how to initialize the SPI as a Master and how to per-
form a simple transmission. DDR_SPI in the examples must be replaced by the actual
Data Direction Register controlling the SPI pins. DD_MOSI, DD_MISO and DD_SCK
must be replaced by the actual data direction bits for these pins. E.g. if MOSI is placed
on pin PB5, replace DD_MOSI with DDB5 and DDR_SPI with DDRB.
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Assembly Code Example(1)
SPI_MasterInit:
; Set MOSI and SCK output, all others input
ldi r17,(1<<DD_MOSI)|(1<<DD_SCK)
out DDR_SPI,r17
; Enable SPI, Master, set clock rate fck/16
ldi r17,(1<<SPE)|(1<<MSTR)|(1<<SPR0)
out SPCR,r17
ret
SPI_MasterTransmit:
; Start transmission of data (r16)
out SPDR,r16
Wait_Transmit:
; Wait for transmission complete
sbis SPSR,SPIF
rjmp Wait_Transmit
ret
C Code Example(1)
void SPI_MasterInit(void)
{
/* Set MOSI and SCK output, all others input */
DDR_SPI = (1<<DD_MOSI)|(1<<DD_SCK);
/* Enable SPI, Master, set clock rate fck/16 */
SPCR = (1<<SPE)|(1<<MSTR)|(1<<SPR0);
}
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The following code examples show how to initialize the SPI as a Slave and how to per-
form a simple reception.
SPI_SlaveReceive:
; Wait for reception complete
sbis SPSR,SPIF
rjmp SPI_SlaveReceive
; Read received data and return
in r16,SPDR
ret
C Code Example(1)
void SPI_SlaveInit(void)
{
/* Set MISO output, all others input */
DDR_SPI = (1<<DD_MISO);
/* Enable SPI */
SPCR = (1<<SPE);
}
char SPI_SlaveReceive(void)
{
/* Wait for reception complete */
while(!(SPSR & (1<<SPIF)))
;
/* Return Data Register */
return SPDR;
}
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SS Pin Functionality
Slave Mode When the SPI is configured as a Slave, the Slave Select (SS) pin is always input. When
SS is held low, the SPI is activated, and MISO becomes an output if configured so by
the user. All other pins are inputs. When SS is driven high, all pins are inputs, and the
SPI is passive, which means that it will not receive incoming data. Note that the SPI
logic will be reset once the SS pin is driven high.
The SS pin is useful for packet/byte synchronization to keep the slave bit counter syn-
chronous with the master clock generator. When the SS pin is driven high, the SPI slave
will immediately reset the send and receive logic, and drop any partially received data in
the Shift Register.
Master Mode When the SPI is configured as a Master (MSTR in SPCR is set), the user can determine
the direction of the SS pin.
If SS is configured as an output, the pin is a general output pin which does not affect the
SPI system. Typically, the pin will be driving the SS pin of the SPI Slave.
If SS is configured as an input, it must be held high to ensure Master SPI operation. If
the SS pin is driven low by peripheral circuitry when the SPI is configured as a Master
with the SS pin defined as an input, the SPI system interprets this as another master
selecting the SPI as a slave and starting to send data to it. To avoid bus contention, the
SPI system takes the following actions:
1. The MSTR bit in SPCR is cleared and the SPI system becomes a Slave. As a
result of the SPI becoming a Slave, the MOSI and SCK pins become inputs.
2. The SPIF Flag in SPSR is set, and if the SPI interrupt is enabled, and the I-bit in
SREG is set, the interrupt routine will be executed.
Thus, when interrupt-driven SPI transmission is used in Master mode, and there exists a
possibility that SS is driven low, the interrupt should always check that the MSTR bit is
still set. If the MSTR bit has been cleared by a slave select, it must be set by the user to
re-enable SPI Master mode.
Data Modes There are four combinations of SCK phase and polarity with respect to serial data,
which are determined by control bits CPHA and CPOL. The SPI data transfer formats
are shown in Figure 80 and Figure 81. Data bits are shifted out and latched in on oppo-
site edges of the SCK signal, ensuring sufficient time for data signals to stabilize. This is
clearly seen by summarizing Table 98 and Table 99, as done below:
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SCK (CPOL = 0)
mode 0
SCK (CPOL = 1)
mode 2
SAMPLE I
MOSI/MISO
CHANGE 0
MOSI PIN
CHANGE 0
MISO PIN
SS
MSB first (DORD = 0) MSB Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 LSB
LSB first (DORD = 1) LSB Bit 1 Bit 2 Bit 3 Bit 4 Bit 5 Bit 6 MSB
SCK (CPOL = 0)
mode 1
SCK (CPOL = 1)
mode 3
SAMPLE I
MOSI/MISO
CHANGE 0
MOSI PIN
CHANGE 0
MISO PIN
SS
MSB first (DORD = 0) MSB Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 LSB
LSB first (DORD = 1) LSB Bit 1 Bit 2 Bit 3 Bit 4 Bit 5 Bit 6 MSB
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Register Description
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SPDR – SPI Data Register
Bit 7 6 5 4 3 2 1 0
0x2E (0x4E) MSB LSB SPDR
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value X X X X X X X X Undefined
The SPI Data Register is a read/write register used for data transfer between the Regis-
ter File and the SPI Shift Register. Writing to the register initiates data transmission.
Reading the register causes the Shift Register Receive buffer to be read.
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USART The Universal Synchronous and Asynchronous serial Receiver and Transmitter
(USART) is a highly flexible serial communication device. The main features are:
• Full Duplex Operation (Independent Serial Receive and Transmit Registers)
• Asynchronous or Synchronous Operation
• Master or Slave Clocked Synchronous Operation
• High Resolution Baud Rate Generator
• Supports Serial Frames with 5, 6, 7, 8, or 9 Data Bits and 1 or 2 Stop Bits
• Odd or Even Parity Generation and Parity Check Supported by Hardware
• Data OverRun Detection
• Framing Error Detection
• Noise Filtering Includes False Start Bit Detection and Digital Low Pass Filter
• Three Separate Interrupts on TX Complete, TX Data Register Empty and RX Complete
• Multi-processor Communication Mode
• Double Speed Asynchronous Communication Mode
Quad USART The ATmega640/1280/2560 has four USART’s, USART0, USART1, USART2, and
USART3. The functionality for all four USART’s is described below. USART0, USART1,
USART2, and USART3 have different I/O registers as shown in “Register Summary” on
page 416.
Overview A simplified block diagram of the USART Transmitter is shown in Figure 82 on page
210. CPU accessible I/O Registers and I/O pins are shown in bold.
The Power Reducion USART0 bit, PRUSART0, in “PRR0 – Power Reduction Register
0” on page 55 must be disabled by writing a logical zero to it.
The Power Reducion USART1 bit, PRUSART1, in “PRR1 – Power Reduction Register
1” on page 56 must be disabled by writing a logical zero to it.
The Power Reducion USART2 bit, PRUSART2, in “PRR1 – Power Reduction Register
1” on page 56 must be disabled by writing a logical zero to it.
The Power Reducion USART3 bit, PRUSART3, in “PRR1 – Power Reduction Register
1” on page 56 must be disabled by writing a logical zero to it.
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Figure 82. USART Block Diagram(1)
Clock Generator
UBRR[H:L]
OSC
Transmitter
TX
UDR (Transmit)
CONTROL
PARITY
GENERATOR
DATA BUS
PIN
TRANSMIT SHIFT REGISTER TxD
CONTROL
Receiver
CLOCK RX
RECOVERY CONTROL
DATA PIN
RECEIVE SHIFT REGISTER RxD
RECOVERY CONTROL
PARITY
UDR (Receive)
CHECKER
Note: 1. See Figure 1 on page 2, Figure 3 on page 4, Table 48 on page 97, Table 51 on page
99, Table 60 on page 107 and Table 63 on page 109 for USART pin placement.
The dashed boxes in the block diagram separate the three main parts of the USART
(listed from the top): Clock Generator, Transmitter and Receiver. Control Registers are
shared by all units. The Clock Generation logic consists of synchronization logic for
external clock input used by synchronous slave operation, and the baud rate generator.
The XCKn (Transfer Clock) pin is only used by synchronous transfer mode. The Trans-
mitter consists of a single write buffer, a serial Shift Register, Parity Generator and
Control logic for handling different serial frame formats. The write buffer allows a contin-
uous transfer of data without any delay between frames. The Receiver is the most
complex part of the USART module due to its clock and data recovery units. The recov-
ery units are used for asynchronous data reception. In addition to the recovery units, the
Receiver includes a Parity Checker, Control logic, a Shift Register and a two level
receive buffer (UDRn). The Receiver supports the same frame formats as the Transmit-
ter, and can detect Frame Error, Data OverRun and Parity Errors.
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Clock Generation The Clock Generation logic generates the base clock for the Transmitter and Receiver.
The USARTn supports four modes of clock operation: Normal asynchronous, Double
Speed asynchronous, Master synchronous and Slave synchronous mode. The UMSELn
bit in USART Control and Status Register C (UCSRnC) selects between asynchronous
and synchronous operation. Double Speed (asynchronous mode only) is controlled by
the U2Xn found in the UCSRnA Register. When using synchronous mode (UMSELn =
1), the Data Direction Register for the XCKn pin (DDR_XCKn) controls whether the
clock source is internal (Master mode) or external (Slave mode). The XCKn pin is only
active when using synchronous mode.
Figure 83 shows a block diagram of the clock generation logic.
Prescaling UBRR+1
/2 /4 /2
Down-Counter 0
1
0
OSC txclk
1
DDR_XCK
Sync Edge
xcki Register Detector 0
XCK UMSEL
xcko 1
Pin
DDR_XCK UCPOL 1
rxclk
0
Signal description:
txclk Transmitter clock (Internal Signal).
rxclk Receiver base clock (Internal Signal).
xcki Input from XCK pin (internal Signal). Used for synchronous slave operation.
xcko Clock output to XCK pin (Internal Signal). Used for synchronous master
operation.
fOSC XTAL pin frequency (System Clock).
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Internal Clock Generation – Internal clock generation is used for the asynchronous and the synchronous master
The Baud Rate Generator modes of operation. The description in this section refers to Figure 83.
The USART Baud Rate Register (UBRRn) and the down-counter connected to it func-
tion as a programmable prescaler or baud rate generator. The down-counter, running at
system clock (fosc), is loaded with the UBRRn value each time the counter has counted
down to zero or when the UBRRLn Register is written. A clock is generated each time
the counter reaches zero. This clock is the baud rate generator clock output (=
fosc/(UBRRn+1)). The Transmitter divides the baud rate generator clock output by 2, 8 or
16 depending on mode. The baud rate generator output is used directly by the
Receiver’s clock and data recovery units. However, the recovery units use a state
machine that uses 2, 8 or 16 states depending on mode set by the state of the UMSELn,
U2Xn and DDR_XCKn bits.
Table 101 contains equations for calculating the baud rate (in bits per second) and for
calculating the UBRRn value for each mode of operation using an internally generated
clock source.
f OSC
BAUD = -----------------------------------------
-
16 ( UBRRn + 1 )
f OSC
BAUD = --------------------------------------
-
2 ( UBRRn + 1 )
Note: 1. The baud rate is defined to be the transfer rate in bit per second (bps)
BAUD Baud rate (in bits per second, bps)
fOSC System Oscillator clock frequency
UBRRn Contents of the UBRRHn and UBRRLn Registers, (0-4095)
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Some examples of UBRRn values for some system clock frequencies are found in Table
109 on page 232.
Double Speed Operation The transfer rate can be doubled by setting the U2Xn bit in UCSRnA. Setting this bit
(U2Xn) only has effect for the asynchronous operation. Set this bit to zero when using synchro-
nous operation.
Setting this bit will reduce the divisor of the baud rate divider from 16 to 8, effectively
doubling the transfer rate for asynchronous communication. Note however that the
Receiver will in this case only use half the number of samples (reduced from 16 to 8) for
data sampling and clock recovery, and therefore a more accurate baud rate setting and
system clock are required when this mode is used. For the Transmitter, there are no
downsides.
External Clock External clocking is used by the synchronous slave modes of operation. The description
in this section refers to Figure 83 for details.
External clock input from the XCKn pin is sampled by a synchronization register to mini-
mize the chance of meta-stability. The output from the synchronization register must
then pass through an edge detector before it can be used by the Transmitter and
Receiver. This process introduces a two CPU clock period delay and therefore the max-
imum external XCKn clock frequency is limited by the following equation:
f OSC
f XCK < -----------
4
Note that fosc depends on the stability of the system clock source. It is therefore recom-
mended to add some margin to avoid possible loss of data due to frequency variations.
Synchronous Clock Operation When synchronous mode is used (UMSELn = 1), the XCKn pin will be used as either
clock input (Slave) or clock output (Master). The dependency between the clock edges
and data sampling or data change is the same. The basic principle is that data input (on
RxDn) is sampled at the opposite XCKn clock edge of the edge the data output (TxDn)
is changed.
UCPOL = 1 XCK
RxD / TxD
Sample
UCPOL = 0 XCK
RxD / TxD
Sample
The UCPOLn bit UCRSC selects which XCKn clock edge is used for data sampling and
which is used for data change. As Figure 84 shows, when UCPOLn is zero the data will
be changed at rising XCKn edge and sampled at falling XCKn edge. If UCPOLn is set,
the data will be changed at falling XCKn edge and sampled at rising XCKn edge.
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Frame Formats A serial frame is defined to be one character of data bits with synchronization bits (start
and stop bits), and optionally a parity bit for error checking. The USART accepts all 30
combinations of the following as valid frame formats:
• 1 start bit
• 5, 6, 7, 8, or 9 data bits
• no, even or odd parity bit
• 1 or 2 stop bits
A frame starts with the start bit followed by the least significant data bit. Then the next
data bits, up to a total of nine, are succeeding, ending with the most significant bit. If
enabled, the parity bit is inserted after the data bits, before the stop bits. When a com-
plete frame is transmitted, it can be directly followed by a new frame, or the
communication line can be set to an idle (high) state. Figure 85 illustrates the possible
combinations of the frame formats. Bits inside brackets are optional.
(IDLE) St 0 1 2 3 4 [5] [6] [7] [8] [P] Sp1 [Sp2] (St / IDLE)
Parity Bit Calculation The parity bit is calculated by doing an exclusive-or of all the data bits. If odd parity is
used, the result of the exclusive or is inverted. The parity bit is located between the last
data bit and first stop bit of a serial frame. The relation between the parity bit and data
bits is as follows::
P even = d n – 1 ⊕ … ⊕ d 3 ⊕ d 2 ⊕ d 1 ⊕ d 0 ⊕ 0
P odd = d n – 1 ⊕ … ⊕ d 3 ⊕ d 2 ⊕ d 1 ⊕ d 0 ⊕ 1
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USART Initialization The USART has to be initialized before any communication can take place. The initial-
ization process normally consists of setting the baud rate, setting frame format and
enabling the Transmitter or the Receiver depending on the usage. For interrupt driven
USART operation, the Global Interrupt Flag should be cleared (and interrupts globally
disabled) when doing the initialization.
Before doing a re-initialization with changed baud rate or frame format, be sure that
there are no ongoing transmissions during the period the registers are changed. The
TXCn Flag can be used to check that the Transmitter has completed all transfers, and
the RXC Flag can be used to check that there are no unread data in the receive buffer.
Note that the TXCn Flag must be cleared before each transmission (before UDRn is
written) if it is used for this purpose.
The following simple USART initialization code examples show one assembly and one
C function that are equal in functionality. The examples assume asynchronous opera-
tion using polling (no interrupts enabled) and a fixed frame format. The baud rate is
given as a function parameter. For the assembly code, the baud rate parameter is
assumed to be stored in the r17:r16 Registers.
Assembly Code Example(1)
USART_Init:
; Set baud rate
out UBRRnH, r17
out UBRRnL, r16
; Enable receiver and transmitter
ldi r16, (1<<RXENn)|(1<<TXENn)
out UCSRnB,r16
; Set frame format: 8data, 2stop bit
ldi r16, (1<<USBSn)|(3<<UCSZn0)
out UCSRnC,r16
ret
C Code Example(1)
#define FOSC 1843200// Clock Speed
#define BAUD 9600
#define (MYUBRR FOSC/16/BAUD-1)
void main( void )
{...
USART_Init ( MYUBRR );
...} // main
void USART_Init( unsigned int ubrr){
/* Set baud rate */
UBRRH = (unsigned char)(ubrr>>8);
UBRRL = (unsigned char)ubrr;
/* Enable receiver and transmitter */
UCSRB = (1<<RXEN)|(1<<TXEN);
/* Set frame format: 8data, 2stop bit */
UCSRC = (1<<USBS)|(3<<UCSZ0);
} // USART_Init
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More advanced initialization routines can be made that include frame format as parame-
ters, disable interrupts and so on. However, many applications use a fixed setting of the
baud and control registers, and for these types of applications the initialization code can
be placed directly in the main routine, or be combined with initialization code for other
I/O modules.
Data Transmission – The The USART Transmitter is enabled by setting the Transmit Enable (TXEN) bit in the
USART Transmitter UCSRnB Register. When the Transmitter is enabled, the normal port operation of the
TxDn pin is overridden by the USART and given the function as the Transmitter’s serial
output. The baud rate, mode of operation and frame format must be set up once before
doing any transmissions. If synchronous operation is used, the clock on the XCKn pin
will be overridden and used as transmission clock.
Sending Frames with 5 to 8 A data transmission is initiated by loading the transmit buffer with the data to be trans-
Data Bit mitted. The CPU can load the transmit buffer by writing to the UDRn I/O location. The
buffered data in the transmit buffer will be moved to the Shift Register when the Shift
Register is ready to send a new frame. The Shift Register is loaded with new data if it is
in idle state (no ongoing transmission) or immediately after the last stop bit of the previ-
ous frame is transmitted. When the Shift Register is loaded with new data, it will transfer
one complete frame at the rate given by the Baud Register, U2Xn bit or by XCKn
depending on mode of operation.
The following code examples show a simple USART transmit function based on polling
of the Data Register Empty (UDREn) Flag. When using frames with less than eight bits,
the most significant bits written to the UDRn are ignored. The USART has to be initial-
ized before the function can be used. For the assembly code, the data to be sent is
assumed to be stored in Register R16
C Code Example(1)
void USART_Transmit( unsigned char data )
{
/* Wait for empty transmit buffer */
while ( !( UCSRnA & (1<<UDREn)) )
;
/* Put data into buffer, sends the data */
UDRn = data;
}
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Sending Frames with 9 Data If 9-bit characters are used (UCSZn = 7), the ninth bit must be written to the TXB8 bit in
Bit UCSRnB before the low byte of the character is written to UDRn. The following code
examples show a transmit function that handles 9-bit characters. For the assembly
code, the data to be sent is assumed to be stored in registers R17:R16.
C Code Example(1)(2)
void USART_Transmit( unsigned int data )
{
/* Wait for empty transmit buffer */
while ( !( UCSRnA & (1<<UDREn))) )
;
/* Copy 9th bit to TXB8 */
UCSRnB &= ~(1<<TXB8);
if ( data & 0x0100 )
UCSRnB |= (1<<TXB8);
/* Put data into buffer, sends the data */
UDRn = data;
}
Notes: 1. These transmit functions are written to be general functions. They can be optimized if
the contents of the UCSRnB is static. For example, only the TXB8 bit of the UCSRnB
Register is used after initialization.
2. See “About Code Examples” on page 9.
The ninth bit can be used for indicating an address frame when using multi processor
communication mode or for other protocol handling as for example synchronization.
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Transmitter Flags and The USART Transmitter has two flags that indicate its state: USART Data Register
Interrupts Empty (UDREn) and Transmit Complete (TXCn). Both flags can be used for generating
interrupts.
The Data Register Empty (UDREn) Flag indicates whether the transmit buffer is ready to
receive new data. This bit is set when the transmit buffer is empty, and cleared when the
transmit buffer contains data to be transmitted that has not yet been moved into the Shift
Register. For compatibility with future devices, always write this bit to zero when writing
the UCSRnA Register.
When the Data Register Empty Interrupt Enable (UDRIEn) bit in UCSRnB is written to
one, the USART Data Register Empty Interrupt will be executed as long as UDREn is
set (provided that global interrupts are enabled). UDREn is cleared by writing UDRn.
When interrupt-driven data transmission is used, the Data Register Empty interrupt rou-
tine must either write new data to UDRn in order to clear UDREn or disable the Data
Register Empty interrupt, otherwise a new interrupt will occur once the interrupt routine
terminates.
The Transmit Complete (TXCn) Flag bit is set one when the entire frame in the Transmit
Shift Register has been shifted out and there are no new data currently present in the
transmit buffer. The TXCn Flag bit is automatically cleared when a transmit complete
interrupt is executed, or it can be cleared by writing a one to its bit location. The TXCn
Flag is useful in half-duplex communication interfaces (like the RS-485 standard), where
a transmitting application must enter receive mode and free the communication bus
immediately after completing the transmission.
When the Transmit Compete Interrupt Enable (TXCIEn) bit in UCSRnB is set, the
USART Transmit Complete Interrupt will be executed when the TXCn Flag becomes set
(provided that global interrupts are enabled). When the transmit complete interrupt is
used, the interrupt handling routine does not have to clear the TXCn Flag, this is done
automatically when the interrupt is executed.
Parity Generator The Parity Generator calculates the parity bit for the serial frame data. When parity bit is
enabled (UPMn1 = 1), the transmitter control logic inserts the parity bit between the last
data bit and the first stop bit of the frame that is sent.
Disabling the Transmitter The disabling of the Transmitter (setting the TXEN to zero) will not become effective
until ongoing and pending transmissions are completed, i.e., when the Transmit Shift
Register and Transmit Buffer Register do not contain data to be transmitted. When dis-
abled, the Transmitter will no longer override the TxDn pin.
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Data Reception – The The USART Receiver is enabled by writing the Receive Enable (RXENn) bit in the
USART Receiver UCSRnB Register to one. When the Receiver is enabled, the normal pin operation of
the RxDn pin is overridden by the USART and given the function as the Receiver’s serial
input. The baud rate, mode of operation and frame format must be set up once before
any serial reception can be done. If synchronous operation is used, the clock on the
XCKn pin will be used as transfer clock.
Receiving Frames with 5 to 8 The Receiver starts data reception when it detects a valid start bit. Each bit that follows
Data Bits the start bit will be sampled at the baud rate or XCKn clock, and shifted into the Receive
Shift Register until the first stop bit of a frame is received. A second stop bit will be
ignored by the Receiver. When the first stop bit is received, i.e., a complete serial frame
is present in the Receive Shift Register, the contents of the Shift Register will be moved
into the receive buffer. The receive buffer can then be read by reading the UDRn I/O
location.
The following code example shows a simple USART receive function based on polling
of the Receive Complete (RXCn) Flag. When using frames with less than eight bits the
most significant bits of the data read from the UDRn will be masked to zero. The USART
has to be initialized before the function can be used.
C Code Example(1)
unsigned char USART_Receive( void )
{
/* Wait for data to be received */
while ( !(UCSRnA & (1<<RXCn)) )
;
/* Get and return received data from buffer */
return UDRn;
}
Receiving Frames with 9 Data If 9-bit characters are used (UCSZn=7) the ninth bit must be read from the RXB8n bit in
Bits UCSRnB before reading the low bits from the UDRn. This rule applies to the FEn,
DORn and UPEn Status Flags as well. Read status from UCSRnA, then data from
UDRn. Reading the UDRn I/O location will change the state of the receive buffer FIFO
and consequently the TXB8n, FEn, DORn and UPEn bits, which all are stored in the
FIFO, will change.
The following code example shows a simple USART receive function that handles both
nine bit characters and the status bits.
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Assembly Code Example(1)
USART_Receive:
; Wait for data to be received
sbis UCSRnA, RXCn
rjmp USART_Receive
; Get status and 9th bit, then data from buffer
in r18, UCSRnA
in r17, UCSRnB
in r16, UDRn
; If error, return -1
andi r18,(1<<FEn)|(1<<DORn)|(1<<UPEn)
breq USART_ReceiveNoError
ldi r17, HIGH(-1)
ldi r16, LOW(-1)
USART_ReceiveNoError:
; Filter the 9th bit, then return
lsr r17
andi r17, 0x01
ret
C Code Example(1)
unsigned int USART_Receive( void )
{
unsigned char status, resh, resl;
/* Wait for data to be received */
while ( !(UCSRnA & (1<<RXCn)) )
;
/* Get status and 9th bit, then data */
/* from buffer */
status = UCSRnA;
resh = UCSRnB;
resl = UDRn;
/* If error, return -1 */
if ( status & (1<<FEn)|(1<<DORn)|(1<<UPEn) )
return -1;
/* Filter the 9th bit, then return */
resh = (resh >> 1) & 0x01;
return ((resh << 8) | resl);
}
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Receive Compete Flag and The USART Receiver has one flag that indicates the Receiver state.
Interrupt
The Receive Complete (RXCn) Flag indicates if there are unread data present in the
receive buffer. This flag is one when unread data exist in the receive buffer, and zero
when the receive buffer is empty (i.e., does not contain any unread data). If the Receiver
is disabled (RXENn = 0), the receive buffer will be flushed and consequently the RXCn
bit will become zero.
When the Receive Complete Interrupt Enable (RXCIEn) in UCSRnB is set, the USART
Receive Complete interrupt will be executed as long as the RXCn Flag is set (provided
that global interrupts are enabled). When interrupt-driven data reception is used, the
receive complete routine must read the received data from UDRn in order to clear the
RXCn Flag, otherwise a new interrupt will occur once the interrupt routine terminates.
Receiver Error Flags The USART Receiver has three Error Flags: Frame Error (FEn), Data OverRun (DORn)
and Parity Error (UPEn). All can be accessed by reading UCSRnA. Common for the
Error Flags is that they are located in the receive buffer together with the frame for which
they indicate the error status. Due to the buffering of the Error Flags, the UCSRnA must
be read before the receive buffer (UDRn), since reading the UDRn I/O location changes
the buffer read location. Another equality for the Error Flags is that they can not be
altered by software doing a write to the flag location. However, all flags must be set to
zero when the UCSRnA is written for upward compatibility of future USART implementa-
tions. None of the Error Flags can generate interrupts.
The Frame Error (FEn) Flag indicates the state of the first stop bit of the next readable
frame stored in the receive buffer. The FEn Flag is zero when the stop bit was correctly
read (as one), and the FEn Flag will be one when the stop bit was incorrect (zero). This
flag can be used for detecting out-of-sync conditions, detecting break conditions and
protocol handling. The FEn Flag is not affected by the setting of the USBSn bit in UCS-
RnC since the Receiver ignores all, except for the first, stop bits. For compatibility with
future devices, always set this bit to zero when writing to UCSRnA.
The Data OverRun (DORn) Flag indicates data loss due to a receiver buffer full condi-
tion. A Data OverRun occurs when the receive buffer is full (two characters), it is a new
character waiting in the Receive Shift Register, and a new start bit is detected. If the
DORn Flag is set there was one or more serial frame lost between the frame last read
from UDRn, and the next frame read from UDRn. For compatibility with future devices,
always write this bit to zero when writing to UCSRnA. The DORn Flag is cleared when
the frame received was successfully moved from the Shift Register to the receive buffer.
The Parity Error (UPEn) Flag indicates that the next frame in the receive buffer had a
Parity Error when received. If Parity Check is not enabled the UPEn bit will always be
read zero. For compatibility with future devices, always set this bit to zero when writing
to UCSRnA. For more details see “Parity Bit Calculation” on page 214 and “Parity
Checker” on page 221.
Parity Checker The Parity Checker is active when the high USART Parity mode (UPMn1) bit is set.
Type of Parity Check to be performed (odd or even) is selected by the UPMn0 bit. When
enabled, the Parity Checker calculates the parity of the data bits in incoming frames and
compares the result with the parity bit from the serial frame. The result of the check is
stored in the receive buffer together with the received data and stop bits. The Parity
Error (UPEn) Flag can then be read by software to check if the frame had a Parity Error.
The UPEn bit is set if the next character that can be read from the receive buffer had a
Parity Error when received and the Parity Checking was enabled at that point (UPMn1 =
1). This bit is valid until the receive buffer (UDRn) is read.
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Disabling the Receiver In contrast to the Transmitter, disabling of the Receiver will be immediate. Data from
ongoing receptions will therefore be lost. When disabled (i.e., the RXENn is set to zero)
the Receiver will no longer override the normal function of the RxDn port pin. The
Receiver buffer FIFO will be flushed when the Receiver is disabled. Remaining data in
the buffer will be lost
Flushing the Receive Buffer The receiver buffer FIFO will be flushed when the Receiver is disabled, i.e., the buffer
will be emptied of its contents. Unread data will be lost. If the buffer has to be flushed
during normal operation, due to for instance an error condition, read the UDRn I/O loca-
tion until the RXCn Flag is cleared. The following code example shows how to flush the
receive buffer.
C Code Example(1)
void USART_Flush( void )
{
unsigned char dummy;
while ( UCSRnA & (1<<RXCn) ) dummy = UDRn;
}
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Asynchronous Data The USART includes a clock recovery and a data recovery unit for handling asynchro-
Reception nous data reception. The clock recovery logic is used for synchronizing the internally
generated baud rate clock to the incoming asynchronous serial frames at the RxDn pin.
The data recovery logic samples and low pass filters each incoming bit, thereby improv-
ing the noise immunity of the Receiver. The asynchronous reception operational range
depends on the accuracy of the internal baud rate clock, the rate of the incoming
frames, and the frame size in number of bits.
Asynchronous Clock The clock recovery logic synchronizes internal clock to the incoming serial frames. Fig-
Recovery ure 86 illustrates the sampling process of the start bit of an incoming frame. The sample
rate is 16 times the baud rate for Normal mode, and eight times the baud rate for Double
Speed mode. The horizontal arrows illustrate the synchronization variation due to the
sampling process. Note the larger time variation when using the Double Speed mode
(U2Xn = 1) of operation. Samples denoted zero are samples done when the RxDn line
is idle (i.e., no communication activity).
Sample
(U2X = 0) 0 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 1 2 3
Sample
(U2X = 1) 0 1 2 3 4 5 6 7 8 1 2
When the clock recovery logic detects a high (idle) to low (start) transition on the RxDn
line, the start bit detection sequence is initiated. Let sample 1 denote the first zero-sam-
ple as shown in the figure. The clock recovery logic then uses samples 8, 9, and 10 for
Normal mode, and samples 4, 5, and 6 for Double Speed mode (indicated with sample
numbers inside boxes on the figure), to decide if a valid start bit is received. If two or
more of these three samples have logical high levels (the majority wins), the start bit is
rejected as a noise spike and the Receiver starts looking for the next high to low-transi-
tion. If however, a valid start bit is detected, the clock recovery logic is synchronized and
the data recovery can begin. The synchronization process is repeated for each start bit.
Asynchronous Data Recovery When the receiver clock is synchronized to the start bit, the data recovery can begin.
The data recovery unit uses a state machine that has 16 states for each bit in Normal
mode and eight states for each bit in Double Speed mode. Figure 87 shows the sam-
pling of the data bits and the parity bit. Each of the samples is given a number that is
equal to the state of the recovery unit.
RxD BIT n
Sample
(U2X = 0) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 1
Sample
(U2X = 1) 1 2 3 4 5 6 7 8 1
The decision of the logic level of the received bit is taken by doing a majority voting of
the logic value to the three samples in the center of the received bit. The center samples
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are emphasized on the figure by having the sample number inside boxes. The majority
voting process is done as follows: If two or all three samples have high levels, the
received bit is registered to be a logic 1. If two or all three samples have low levels, the
received bit is registered to be a logic 0. This majority voting process acts as a low pass
filter for the incoming signal on the RxDn pin. The recovery process is then repeated
until a complete frame is received. Including the first stop bit. Note that the Receiver only
uses the first stop bit of a frame.
Figure 88 shows the sampling of the stop bit and the earliest possible beginning of the
start bit of the next frame.
Figure 88. Stop Bit Sampling and Next Start Bit Sampling
Sample
(U2X = 0) 1 2 3 4 5 6 7 8 9 10 0/1 0/1 0/1
Sample
(U2X = 1) 1 2 3 4 5 6 0/1
The same majority voting is done to the stop bit as done for the other bits in the frame. If
the stop bit is registered to have a logic 0 value, the Frame Error (FEn) Flag will be set.
A new high to low transition indicating the start bit of a new frame can come right after
the last of the bits used for majority voting. For Normal Speed mode, the first low level
sample can be at point marked (A) in Figure 88. For Double Speed mode the first low
level must be delayed to (B). (C) marks a stop bit of full length. The early start bit detec-
tion influences the operational range of the Receiver.
Asynchronous Operational The operational range of the Receiver is dependent on the mismatch between the
Range received bit rate and the internally generated baud rate. If the Transmitter is sending
frames at too fast or too slow bit rates, or the internally generated baud rate of the
Receiver does not have a similar (see Table 102) base frequency, the Receiver will not
be able to synchronize the frames to the start bit.
The following equations can be used to calculate the ratio of the incoming data rate and
internal receiver baud rate.
( D + 1 )S
R slow = ------------------------------------------ ( D + 2 )S
- R fast = -----------------------------------
S – 1 + D ⋅ S + SF ( D + 1 )S + S M
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Table 102 and Table 103 list the maximum receiver baud rate error that can be toler-
ated. Note that Normal Speed mode has higher toleration of baud rate variations.
Table 102. Recommended Maximum Receiver Baud Rate Error for Normal Speed
Mode (U2Xn = 0)
D Recommended Max
# (Data+Parity Bit) Rslow (%) Rfast (%) Max Total Error (%) Receiver Error (%)
5 93.20 106.67 +6.67/-6.8 ± 3.0
6 94.12 105.79 +5.79/-5.88 ± 2.5
7 94.81 105.11 +5.11/-5.19 ± 2.0
8 95.36 104.58 +4.58/-4.54 ± 2.0
9 95.81 104.14 +4.14/-4.19 ± 1.5
10 96.17 103.78 +3.78/-3.83 ± 1.5
Table 103. Recommended Maximum Receiver Baud Rate Error for Double Speed
Mode (U2Xn = 1)
D Recommended Max
# (Data+Parity Bit) Rslow (%) Rfast (%) Max Total Error (%) Receiver Error (%)
5 94.12 105.66 +5.66/-5.88 ± 2.5
6 94.92 104.92 +4.92/-5.08 ± 2.0
7 95.52 104,35 +4.35/-4.48 ± 1.5
8 96.00 103.90 +3.90/-4.00 ± 1.5
9 96.39 103.53 +3.53/-3.61 ± 1.5
10 96.70 103.23 +3.23/-3.30 ± 1.0
The recommendations of the maximum receiver baud rate error was made under the
assumption that the Receiver and Transmitter equally divides the maximum total error.
There are two possible sources for the receivers baud rate error. The Receiver’s system
clock (XTAL) will always have some minor instability over the supply voltage range and
the temperature range. When using a crystal to generate the system clock, this is rarely
a problem, but for a resonator the system clock may differ more than 2% depending of
the resonators tolerance. The second source for the error is more controllable. The baud
rate generator can not always do an exact division of the system frequency to get the
baud rate wanted. In this case an UBRR value that gives an acceptable low error can be
used if possible.
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Multi-processor Setting the Multi-processor Communication mode (MPCMn) bit in UCSRnA enables a
Communication Mode filtering function of incoming frames received by the USART Receiver. Frames that do
not contain address information will be ignored and not put into the receive buffer. This
effectively reduces the number of incoming frames that has to be handled by the CPU,
in a system with multiple MCUs that communicate via the same serial bus. The Trans-
mitter is unaffected by the MPCMn setting, but has to be used differently when it is a
part of a system utilizing the Multi-processor Communication mode.
If the Receiver is set up to receive frames that contain 5 to 8 data bits, then the first stop
bit indicates if the frame contains data or address information. If the Receiver is set up
for frames with nine data bits, then the ninth bit (RXB8n) is used for identifying address
and data frames. When the frame type bit (the first stop or the ninth bit) is one, the frame
contains an address. When the frame type bit is zero the frame is a data frame.
The Multi-processor Communication mode enables several slave MCUs to receive data
from a master MCU. This is done by first decoding an address frame to find out which
MCU has been addressed. If a particular slave MCU has been addressed, it will receive
the following data frames as normal, while the other slave MCUs will ignore the received
frames until another address frame is received.
Using MPCMn For an MCU to act as a master MCU, it can use a 9-bit character frame format (UCSZn
= 7). The ninth bit (TXB8n) must be set when an address frame (TXB8n = 1) or cleared
when a data frame (TXB = 0) is being transmitted. The slave MCUs must in this case be
set to use a 9-bit character frame format.
The following procedure should be used to exchange data in Multi-processor Communi-
cation mode:
1. All Slave MCUs are in Multi-processor Communication mode (MPCMn in UCS-
RnA is set).
2. The Master MCU sends an address frame, and all slaves receive and read this
frame. In the Slave MCUs, the RXCn Flag in UCSRnA will be set as normal.
3. Each Slave MCU reads the UDRn Register and determines if it has been
selected. If so, it clears the MPCMn bit in UCSRnA, otherwise it waits for the next
address byte and keeps the MPCMn setting.
4. The addressed MCU will receive all data frames until a new address frame is
received. The other Slave MCUs, which still have the MPCMn bit set, will ignore
the data frames.
5. When the last data frame is received by the addressed MCU, the addressed
MCU sets the MPCMn bit and waits for a new address frame from master. The
process then repeats from 2.
Using any of the 5- to 8-bit character frame formats is possible, but impractical since the
Receiver must change between using n and n+1 character frame formats. This makes
full-duplex operation difficult since the Transmitter and Receiver uses the same charac-
ter size setting. If 5- to 8-bit character frames are used, the Transmitter must be set to
use two stop bit (USBSn = 1) since the first stop bit is used for indicating the frame type.
Do not use Read-Modify-Write instructions (SBI and CBI) to set or clear the MPCMn bit.
The MPCMn bit shares the same I/O location as the TXCn Flag and this might acciden-
tally be cleared when using SBI or CBI instructions.
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The USART Transmit Data Buffer Register and USART Receive Data Buffer Registers
share the same I/O address referred to as USART Data Register or UDRn. The Trans-
mit Data Buffer Register (TXB) will be the destination for data written to the UDRn
Register location. Reading the UDRn Register location will return the contents of the
Receive Data Buffer Register (RXB).
For 5-, 6-, or 7-bit characters the upper unused bits will be ignored by the Transmitter
and set to zero by the Receiver.
The transmit buffer can only be written when the UDREn Flag in the UCSRnA Register
is set. Data written to UDRn when the UDREn Flag is not set, will be ignored by the
USART Transmitter. When data is written to the transmit buffer, and the Transmitter is
enabled, the Transmitter will load the data into the Transmit Shift Register when the
Shift Register is empty. Then the data will be serially transmitted on the TxDn pin.
The receive buffer consists of a two level FIFO. The FIFO will change its state whenever
the receive buffer is accessed. Due to this behavior of the receive buffer, do not use
Read-Modify-Write instructions (SBI and CBI) on this location. Be careful when using bit
test instructions (SBIC and SBIS), since these also will change the state of the FIFO.
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• Bit 4 – FEn: Frame Error
This bit is set if the next character in the receive buffer had a Frame Error when
received. I.e., when the first stop bit of the next character in the receive buffer is zero.
This bit is valid until the receive buffer (UDRn) is read. The FEn bit is zero when the stop
bit of received data is one. Always set this bit to zero when writing to UCSRnA.
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Note: 1. See “USART in SPI Mode” on page 236 for full description of the Master SPI Mode
(MSPIM) operation
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• Bits 5:4 – UPMn1:0: Parity Mode
These bits enable and set type of parity generation and check. If enabled, the Transmit-
ter will automatically generate and send the parity of the transmitted data bits within
each frame. The Receiver will generate a parity value for the incoming data and com-
pare it to the UPMn setting. If a mismatch is detected, the UPEn Flag in UCSRnA will be
set.
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Examples of Baud Rate For standard crystal and resonator frequencies, the most commonly used baud rates for
Setting asynchronous operation can be generated by using the UBRR settings in Table 109 to
Table 112. UBRR values which yield an actual baud rate differing less than 0.5% from
the target baud rate, are bold in the table. Higher error ratings are acceptable, but the
Receiver will have less noise resistance when the error ratings are high, especially for
large serial frames (see “Asynchronous Operational Range” on page 224). The error
values are calculated using the following equation:
Table 109. Examples of UBRRn Settings for Commonly Used Oscillator Frequencies
fosc = 1.0000 MHz fosc = 1.8432 MHz fosc = 2.0000 MHz
Baud
U2Xn = 0 U2Xn = 1 U2Xn = 0 U2Xn = 1 U2Xn = 0 U2Xn = 1
Rate
(bps) UBRR Error UBRR Error UBRR Error UBRR Error UBRR Error UBRR Error
2400 25 0.2% 51 0.2% 47 0.0% 95 0.0% 51 0.2% 103 0.2%
4800 12 0.2% 25 0.2% 23 0.0% 47 0.0% 25 0.2% 51 0.2%
9600 6 -7.0% 12 0.2% 11 0.0% 23 0.0% 12 0.2% 25 0.2%
14.4k 3 8.5% 8 -3.5% 7 0.0% 15 0.0% 8 -3.5% 16 2.1%
19.2k 2 8.5% 6 -7.0% 5 0.0% 11 0.0% 6 -7.0% 12 0.2%
28.8k 1 8.5% 3 8.5% 3 0.0% 7 0.0% 3 8.5% 8 -3.5%
38.4k 1 -18.6% 2 8.5% 2 0.0% 5 0.0% 2 8.5% 6 -7.0%
57.6k 0 8.5% 1 8.5% 1 0.0% 3 0.0% 1 8.5% 3 8.5%
76.8k – – 1 -18.6% 1 -25.0% 2 0.0% 1 -18.6% 2 8.5%
115.2k – – 0 8.5% 0 0.0% 1 0.0% 0 8.5% 1 8.5%
230.4k – – – – – – 0 0.0% – – – –
250k – – – – – – – – – – 0 0.0%
(1)
Max. 62.5 kbps 125 kbps 115.2 kbps 230.4 kbps 125 kbps 250 kbps
1. UBRR = 0, Error = 0.0%
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Table 110. Examples of UBRRn Settings for Commonly Used Oscillator Frequencies (Continued)
fosc = 3.6864 MHz fosc = 4.0000 MHz fosc = 7.3728 MHz
Baud
U2Xn = 0 U2Xn = 1 U2Xn = 0 U2Xn = 1 U2Xn = 0 U2Xn = 1
Rate
(bps) UBRR Error UBRR Error UBRR Error UBRR Error UBRR Error UBRR Error
2400 95 0.0% 191 0.0% 103 0.2% 207 0.2% 191 0.0% 383 0.0%
4800 47 0.0% 95 0.0% 51 0.2% 103 0.2% 95 0.0% 191 0.0%
9600 23 0.0% 47 0.0% 25 0.2% 51 0.2% 47 0.0% 95 0.0%
14.4k 15 0.0% 31 0.0% 16 2.1% 34 -0.8% 31 0.0% 63 0.0%
19.2k 11 0.0% 23 0.0% 12 0.2% 25 0.2% 23 0.0% 47 0.0%
28.8k 7 0.0% 15 0.0% 8 -3.5% 16 2.1% 15 0.0% 31 0.0%
38.4k 5 0.0% 11 0.0% 6 -7.0% 12 0.2% 11 0.0% 23 0.0%
57.6k 3 0.0% 7 0.0% 3 8.5% 8 -3.5% 7 0.0% 15 0.0%
76.8k 2 0.0% 5 0.0% 2 8.5% 6 -7.0% 5 0.0% 11 0.0%
115.2k 1 0.0% 3 0.0% 1 8.5% 3 8.5% 3 0.0% 7 0.0%
230.4k 0 0.0% 1 0.0% 0 8.5% 1 8.5% 1 0.0% 3 0.0%
250k 0 -7.8% 1 -7.8% 0 0.0% 1 0.0% 1 -7.8% 3 -7.8%
0.5M – – 0 -7.8% – – 0 0.0% 0 -7.8% 1 -7.8%
1M – – – – – – – – – – 0 -7.8%
(1)
Max. 230.4 kbps 460.8 kbps 250 kbps 0.5 Mbps 460.8 kbps 921.6 kbps
1. UBRR = 0, Error = 0.0%
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Table 111. Examples of UBRRn Settings for Commonly Used Oscillator Frequencies (Continued)
fosc = 8.0000 MHz fosc = 11.0592 MHz fosc = 14.7456 MHz
Baud
U2Xn = 0 U2Xn = 1 U2Xn = 0 U2Xn = 1 U2Xn = 0 U2Xn = 1
Rate
(bps) UBRR Error UBRR Error UBRR Error UBRR Error UBRR Error UBRR Error
2400 207 0.2% 416 -0.1% 287 0.0% 575 0.0% 383 0.0% 767 0.0%
4800 103 0.2% 207 0.2% 143 0.0% 287 0.0% 191 0.0% 383 0.0%
9600 51 0.2% 103 0.2% 71 0.0% 143 0.0% 95 0.0% 191 0.0%
14.4k 34 -0.8% 68 0.6% 47 0.0% 95 0.0% 63 0.0% 127 0.0%
19.2k 25 0.2% 51 0.2% 35 0.0% 71 0.0% 47 0.0% 95 0.0%
28.8k 16 2.1% 34 -0.8% 23 0.0% 47 0.0% 31 0.0% 63 0.0%
38.4k 12 0.2% 25 0.2% 17 0.0% 35 0.0% 23 0.0% 47 0.0%
57.6k 8 -3.5% 16 2.1% 11 0.0% 23 0.0% 15 0.0% 31 0.0%
76.8k 6 -7.0% 12 0.2% 8 0.0% 17 0.0% 11 0.0% 23 0.0%
115.2k 3 8.5% 8 -3.5% 5 0.0% 11 0.0% 7 0.0% 15 0.0%
230.4k 1 8.5% 3 8.5% 2 0.0% 5 0.0% 3 0.0% 7 0.0%
250k 1 0.0% 3 0.0% 2 -7.8% 5 -7.8% 3 -7.8% 6 5.3%
0.5M 0 0.0% 1 0.0% – – 2 -7.8% 1 -7.8% 3 -7.8%
1M – – 0 0.0% – – – – 0 -7.8% 1 -7.8%
(1)
Max. 0.5 Mbps 1 Mbps 691.2 kbps 1.3824 Mbps 921.6 kbps 1.8432 Mbps
1. UBRR = 0, Error = 0.0%
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Table 112. Examples of UBRRn Settings for Commonly Used Oscillator Frequencies (Continued)
fosc = 16.0000 MHz fosc = 18.4320 MHz fosc = 20.0000 MHz
Baud
U2Xn = 0 U2Xn = 1 U2Xn = 0 U2Xn = 1 U2Xn = 0 U2Xn = 1
Rate
(bps) UBRR Error UBRR Error UBRR Error UBRR Error UBRR Error UBRR Error
2400 416 -0.1% 832 0.0% 479 0.0% 959 0.0% 520 0.0% 1041 0.0%
4800 207 0.2% 416 -0.1% 239 0.0% 479 0.0% 259 0.2% 520 0.0%
9600 103 0.2% 207 0.2% 119 0.0% 239 0.0% 129 0.2% 259 0.2%
14.4k 68 0.6% 138 -0.1% 79 0.0% 159 0.0% 86 -0.2% 173 -0.2%
19.2k 51 0.2% 103 0.2% 59 0.0% 119 0.0% 64 0.2% 129 0.2%
28.8k 34 -0.8% 68 0.6% 39 0.0% 79 0.0% 42 0.9% 86 -0.2%
38.4k 25 0.2% 51 0.2% 29 0.0% 59 0.0% 32 -1.4% 64 0.2%
57.6k 16 2.1% 34 -0.8% 19 0.0% 39 0.0% 21 -1.4% 42 0.9%
76.8k 12 0.2% 25 0.2% 14 0.0% 29 0.0% 15 1.7% 32 -1.4%
115.2k 8 -3.5% 16 2.1% 9 0.0% 19 0.0% 10 -1.4% 21 -1.4%
230.4k 3 8.5% 8 -3.5% 4 0.0% 9 0.0% 4 8.5% 10 -1.4%
250k 3 0.0% 7 0.0% 4 -7.8% 8 2.4% 4 0.0% 9 0.0%
0.5M 1 0.0% 3 0.0% – – 4 -7.8% – – 4 0.0%
1M 0 0.0% 1 0.0% – – – – – – – –
(1)
Max. 1 Mbps 2 Mbps 1.152 Mbps 2.304 Mbps 1.25 Mbps 2.5 Mbps
1. UBRR = 0, Error = 0.0%
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USART in SPI Mode The Universal Synchronous and Asynchronous serial Receiver and Transmitter
(USART) can be set to a master SPI compliant mode of operation. The Master SPI
Mode (MSPIM) has the following features:
• Full Duplex, Three-wire Synchronous Data Transfer
• Master Operation
• Supports all four SPI Modes of Operation (Mode 0, 1, 2, and 3)
• LSB First or MSB First Data Transfer (Configurable Data Order)
• Queued Operation (Double Buffered)
• High Resolution Baud Rate Generator
• High Speed Operation (fXCKmax = fCK/2)
• Flexible Interrupt Generation
Overview Setting both UMSELn1:0 bits to one enables the USART in MSPIM logic. In this mode of
operation the SPI master control logic takes direct control over the USART resources.
These resources include the transmitter and receiver shift register and buffers, and the
baud rate generator. The parity generator and checker, the data and clock recovery
logic, and the RX and TX control logic is disabled. The USART RX and TX control logic
is replaced by a common SPI transfer control logic. However, the pin control logic and
interrupt generation logic is identical in both modes of operation.
The I/O register locations are the same in both modes. However, some of the functional-
ity of the control registers changes when using MSPIM.
USART MSPIM vs. SPI The AVR USART in MSPIM mode is fully compatible with the AVR SPI regarding:
• Master mode timing diagram.
• The UCPOLn bit functionality is identical to the SPI CPOL bit.
• The UCPHAn bit functionality is identical to the SPI CPHA bit.
• The UDORDn bit functionality is identical to the SPI DORD bit.
However, since the USART in MSPIM mode reuses the USART resources, the use of
the USART in MSPIM mode is somewhat different compared to the SPI. In addition to
differences of the control register bits, and that only master operation is supported by
the USART in MSPIM mode, the following features differ between the two modules:
• The USART in MSPIM mode includes (double) buffering of the transmitter. The SPI
has no buffer.
• The USART in MSPIM mode receiver includes an additional buffer level.
• The SPI WCOL (Write Collision) bit is not included in USART in MSPIM mode.
• The SPI double speed mode (SPI2X) bit is not included. However, the same effect is
achieved by setting UBRRn accordingly.
• Interrupt timing is not compatible.
• Pin control differs due to the master only operation of the USART in MSPIM mode.
A comparison of the USART in MSPIM mode and the SPI pins is shown in Table 116 on
page 244
Clock Generation The Clock Generation logic generates the base clock for the Transmitter and Receiver.
For USART MSPIM mode of operation only internal clock generation (i.e. master opera-
tion) is supported. The Data Direction Register for the XCKn pin (DDR_XCKn) must
therefore be set to one (i.e. as output) for the USART in MSPIM to operate correctly.
Preferably the DDR_XCKn should be set up before the USART in MSPIM is enabled
(i.e. TXENn and RXENn bit set to one).
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The internal clock generation used in MSPIM mode is identical to the USART synchro-
nous master mode. The baud rate or UBRRn setting can therefore be calculated using
the same equations, see Table 113:
Table 113. Equations for Calculating Baud Rate Register Setting
Equation for Calculating Baud Equation for Calculating
Operating Mode Rate(1) UBRRn Value
Synchronous Master
mode
f OSC f OSC
BAUD = --------------------------------------
- -–1
UBRRn = -------------------
2 ( UBRRn + 1 ) 2BAUD
Note: 1. The baud rate is defined to be the transfer rate in bit per second (bps)
BAUD Baud rate (in bits per second, bps)
fOSC System Oscillator clock frequency
UBRRn Contents of the UBRRnH and UBRRnL Registers, (0-4095)
SPI Data Modes and There are four combinations of XCKn (SCK) phase and polarity with respect to serial
Timing data, which are determined by control bits UCPHAn and UCPOLn. The data transfer
timing diagrams are shown in Figure 89. Data bits are shifted out and latched in on
opposite edges of the XCKn signal, ensuring sufficient time for data signals to stabilize.
The UCPOLn and UCPHAn functionality is summarized in Table 114. Note that chang-
ing the setting of any of these bits will corrupt all ongoing communication for both the
Receiver and Transmitter.
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Figure 89. UCPHAn and UCPOLn data transfer timing diagrams.
UCPOL=0 UCPOL=1
UCPHA=1
XCK XCK
Frame Formats A serial frame for the MSPIM is defined to be one character of 8 data bits. The USART
in MSPIM mode has two valid frame formats:
• 8-bit data with MSB first
• 8-bit data with LSB first
A frame starts with the least or most significant data bit. Then the next data bits, up to a
total of eight, are succeeding, ending with the most or least significant bit accordingly.
When a complete frame is transmitted, a new frame can directly follow it, or the commu-
nication line can be set to an idle (high) state.
The UDORDn bit in UCSRnC sets the frame format used by the USART in MSPIM
mode. The Receiver and Transmitter use the same setting. Note that changing the set-
ting of any of these bits will corrupt all ongoing communication for both the Receiver and
Transmitter.
16-bit data transfer can be achieved by writing two data bytes to UDRn. A UART trans-
mit complete interrupt will then signal that the 16-bit value has been shifted out.
USART MSPIM Initialization The USART in MSPIM mode has to be initialized before any communication can take
place. The initialization process normally consists of setting the baud rate, setting mas-
ter mode of operation (by setting DDR_XCKn to one), setting frame format and enabling
the Transmitter and the Receiver. Only the transmitter can operate independently. For
interrupt driven USART operation, the Global Interrupt Flag should be cleared (and thus
interrupts globally disabled) when doing the initialization.
Note: To ensure immediate initialization of the XCKn output the baud-rate register (UBRRn)
must be zero at the time the transmitter is enabled. Contrary to the normal mode USART
operation the UBRRn must then be written to the desired value after the transmitter is
enabled, but before the first transmission is started. Setting UBRRn to zero before
enabling the transmitter is not necessary if the initialization is done immediately after a
reset since UBRRn is reset to zero.
Before doing a re-initialization with changed baud rate, data mode, or frame format, be
sure that there is no ongoing transmissions during the period the registers are changed.
The TXCn Flag can be used to check that the Transmitter has completed all transfers,
and the RXCn Flag can be used to check that there are no unread data in the receive
buffer. Note that the TXCn Flag must be cleared before each transmission (before
UDRn is written) if it is used for this purpose.
The following simple USART initialization code examples show one assembly and one
C function that are equal in functionality. The examples assume polling (no interrupts
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enabled). The baud rate is given as a function parameter. For the assembly code, the
baud rate parameter is assumed to be stored in the r17:r16 registers.
C Code Example(1)
void USART_Init( unsigned int baud )
{
UBRRn = 0;
/* Setting the XCKn port pin as output, enables master mode. */
XCKn_DDR |= (1<<XCKn);
/* Set MSPI mode of operation and SPI data mode 0. */
UCSRnC = (1<<UMSELn1)|(1<<UMSELn0)|(0<<UCPHAn)|(0<<UCPOLn);
/* Enable receiver and transmitter. */
UCSRnB = (1<<RXENn)|(1<<TXENn);
/* Set baud rate. */
/* IMPORTANT: The Baud Rate must be set after the transmitter is enabled
*/
UBRRn = baud;
}
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Data Transfer Using the USART in MSPI mode requires the Transmitter to be enabled, i.e. the TXENn
bit in the UCSRnB register is set to one. When the Transmitter is enabled, the normal
port operation of the TxDn pin is overridden and given the function as the Transmitter's
serial output. Enabling the receiver is optional and is done by setting the RXENn bit in
the UCSRnB register to one. When the receiver is enabled, the normal pin operation of
the RxDn pin is overridden and given the function as the Receiver's serial input. The
XCKn will in both cases be used as the transfer clock.
After initialization the USART is ready for doing data transfers. A data transfer is initiated
by writing to the UDRn I/O location. This is the case for both sending and receiving data
since the transmitter controls the transfer clock. The data written to UDRn is moved from
the transmit buffer to the shift register when the shift register is ready to send a new
frame.
Note: To keep the input buffer in sync with the number of data bytes transmitted, the UDRn reg-
ister must be read once for each byte transmitted. The input buffer operation is identical
to normal USART mode, i.e. if an overflow occurs the character last received will be lost,
not the first data in the buffer. This means that if four bytes are transferred, byte 1 first,
then byte 2, 3, and 4, and the UDRn is not read before all transfers are completed, then
byte 3 to be received will be lost, and not byte 1.
The following code examples show a simple USART in MSPIM mode transfer function
based on polling of the Data Register Empty (UDREn) Flag and the Receive Complete
(RXCn) Flag. The USART has to be initialized before the function can be used. For the
assembly code, the data to be sent is assumed to be stored in Register R16 and the
data received will be available in the same register (R16) after the function returns.
The function simply waits for the transmit buffer to be empty by checking the UDREn
Flag, before loading it with new data to be transmitted. The function then waits for data
to be present in the receive buffer by checking the RXCn Flag, before reading the buffer
and returning the value.
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C Code Example(1)
unsigned char USART_Receive( void )
{
/* Wait for empty transmit buffer */
while ( !( UCSRnA & (1<<UDREn)) );
/* Put data into buffer, sends the data */
UDRn = data;
/* Wait for data to be received */
while ( !(UCSRnA & (1<<RXCn)) );
/* Get and return received data from buffer */
return UDRn;
}
Transmitter and Receiver The RXCn, TXCn, and UDREn flags and corresponding interrupts in USART in MSPIM
Flags and Interrupts mode are identical in function to the normal USART operation. However, the receiver
error status flags (FE, DOR, and PE) are not in use and is always read as zero.
Disabling the Transmitter or The disabling of the transmitter or receiver in USART in MSPIM mode is identical in
Receiver function to the normal USART operation.
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USART MSPIM Register The following section describes the registers used for SPI operation using the USART.
Description
UDRn – USART MSPIM I/O The function and bit description of the USART data register (UDRn) in MSPI mode is
Data Register identical to normal USART operation. See “UDRn – USART I/O Data Register n” on
page 227.
Bit 7 6 5 4 3 2 1 0
Control and Status Register n
RXCn TXCn UDREn - - - - - UCSRnA
A
Read/Write R/W R/W R/W R R R R R
Initial Value 0 0 0 0 0 1 1 0
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UCSRnC – USART MSPIM
Bit 7 6 5 4 3 2 1 0
Control and Status Register n
UMSELn1 UMSELn0 - - - UDORDn UCPHAn UCPOLn UCSRnC
C
Read/Write R/W R/W R R R R/W R/W R/W
Initial Value 0 0 0 0 0 1 1 0
UBRRnL and UBRRnH – The function and bit description of the baud rate registers in MSPI mode is identical to
USART MSPIM Baud Rate normal USART operation. See “UBRRnL and UBRRnH – USART Baud Rate Registers”
Registers on page 231.
Table 116. Comparison of USART in MSPIM mode and SPI pins.
USART_MSPIM SPI Comment
TxDn MOSI Master Out only
RxDn MISO Master In only
XCKn SCK (Functionally identical)
(N/A) SS Not supported by USART in MSPIM
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Features • Simple yet Powerful and Flexible Communication Interface, only two Bus Lines needed
• Both Master and Slave Operation Supported
• Device can Operate as Transmitter or Receiver
• 7-bit Address Space Allows up to 128 Different Slave Addresses
• Multi-master Arbitration Support
• Up to 400 kHz Data Transfer Speed
• Slew-rate Limited Output Drivers
• Noise Suppression Circuitry Rejects Spikes on Bus Lines
• Fully Programmable Slave Address with General Call Support
• Address Recognition Causes Wake-up When AVR is in Sleep Mode
2-wire Serial Interface The 2-wire Serial Interface (TWI) is ideally suited for typical microcontroller applications.
Bus Definition The TWI protocol allows the systems designer to interconnect up to 128 different
devices using only two bi-directional bus lines, one for clock (SCL) and one for data
(SDA). The only external hardware needed to implement the bus is a single pull-up
resistor for each of the TWI bus lines. All devices connected to the bus have individual
addresses, and mechanisms for resolving bus contention are inherent in the TWI
protocol.
SDA
SCL
TWI Terminology The following definitions are frequently encountered in this section.
The Power Reduction TWI bit, PRTWI bit in “PRR0 – Power Reduction Register 0” on
page 55 must be written to zero to enable the 2-wire Serial Interface.
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Electrical Interconnection As depicted in Figure 90, both bus lines are connected to the positive supply voltage
through pull-up resistors. The bus drivers of all TWI-compliant devices are open-drain or
open-collector. This implements a wired-AND function which is essential to the opera-
tion of the interface. A low level on a TWI bus line is generated when one or more TWI
devices output a zero. A high level is output when all TWI devices trim-state their out-
puts, allowing the pull-up resistors to pull the line high. Note that all AVR devices
connected to the TWI bus must be powered in order to allow any bus operation.
The number of devices that can be connected to the bus is only limited by the bus
capacitance limit of 400 pF and the 7-bit slave address space. A detailed specification of
the electrical characteristics of the TWI is given in “SPI Timing Characteristics” on page
380. Two different sets of specifications are presented there, one relevant for bus
speeds below 100 kHz, and one valid for bus speeds up to 400 kHz.
Transferring Bits Each data bit transferred on the TWI bus is accompanied by a pulse on the clock line.
The level of the data line must be stable when the clock line is high. The only exception
to this rule is for generating start and stop conditions.
SDA
SCL
Data Change
START and STOP Conditions The Master initiates and terminates a data transmission. The transmission is initiated
when the Master issues a START condition on the bus, and it is terminated when the
Master issues a STOP condition. Between a START and a STOP condition, the bus is
considered busy, and no other master should try to seize control of the bus. A special
case occurs when a new START condition is issued between a START and STOP con-
dition. This is referred to as a REPEATED START condition, and is used when the
Master wishes to initiate a new transfer without relinquishing control of the bus. After a
REPEATED START, the bus is considered busy until the next STOP. This is identical to
the START behavior, and therefore START is used to describe both START and
REPEATED START for the remainder of this datasheet, unless otherwise noted. As
depicted below, START and STOP conditions are signalled by changing the level of the
SDA line when the SCL line is high.
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SDA
SCL
Address Packet Format All address packets transmitted on the TWI bus are 9 bits long, consisting of 7 address
bits, one READ/WRITE control bit and an acknowledge bit. If the READ/WRITE bit is
set, a read operation is to be performed, otherwise a write operation should be per-
formed. When a Slave recognizes that it is being addressed, it should acknowledge by
pulling SDA low in the ninth SCL (ACK) cycle. If the addressed Slave is busy, or for
some other reason can not service the Master’s request, the SDA line should be left
high in the ACK clock cycle. The Master can then transmit a STOP condition, or a
REPEATED START condition to initiate a new transmission. An address packet consist-
ing of a slave address and a READ or a WRITE bit is called SLA+R or SLA+W,
respectively.
The MSB of the address byte is transmitted first. Slave addresses can freely be allo-
cated by the designer, but the address 0000 000 is reserved for a general call.
When a general call is issued, all slaves should respond by pulling the SDA line low in
the ACK cycle. A general call is used when a Master wishes to transmit the same mes-
sage to several slaves in the system. When the general call address followed by a Write
bit is transmitted on the bus, all slaves set up to acknowledge the general call will pull
the SDA line low in the ack cycle. The following data packets will then be received by all
the slaves that acknowledged the general call. Note that transmitting the general call
address followed by a Read bit is meaningless, as this would cause contention if several
slaves started transmitting different data.
All addresses of the format 1111 xxx should be reserved for future purposes.
SDA
SCL
1 2 7 8 9
START
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Data Packet Format All data packets transmitted on the TWI bus are nine bits long, consisting of one data
byte and an acknowledge bit. During a data transfer, the Master generates the clock and
the START and STOP conditions, while the Receiver is responsible for acknowledging
the reception. An Acknowledge (ACK) is signalled by the Receiver pulling the SDA line
low during the ninth SCL cycle. If the Receiver leaves the SDA line high, a NACK is sig-
nalled. When the Receiver has received the last byte, or for some reason cannot receive
any more bytes, it should inform the Transmitter by sending a NACK after the final byte.
The MSB of the data byte is transmitted first.
SDA from
Transmitter
SDA from
Receiver
SCL from
Master
1 2 7 8 9
STOP, REPEATED
SLA+R/W Data Byte START or Next
Data Byte
Combining Address and Data A transmission basically consists of a START condition, a SLA+R/W, one or more data
Packets into a Transmission packets and a STOP condition. An empty message, consisting of a START followed by
a STOP condition, is illegal. Note that the Wired-ANDing of the SCL line can be used to
implement handshaking between the Master and the Slave. The Slave can extend the
SCL low period by pulling the SCL line low. This is useful if the clock speed set up by the
Master is too fast for the Slave, or the Slave needs extra time for processing between
the data transmissions. The Slave extending the SCL low period will not affect the SCL
high period, which is determined by the Master. As a consequence, the Slave can
reduce the TWI data transfer speed by prolonging the SCL duty cycle.
Figure 95 shows a typical data transmission. Note that several data bytes can be trans-
mitted between the SLA+R/W and the STOP condition, depending on the software
protocol implemented by the application software.
Addr MSB Addr LSB R/W ACK Data MSB Data LSB ACK
SDA
SCL
1 2 7 8 9 1 2 7 8 9
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Multi-master Bus The TWI protocol allows bus systems with several masters. Special concerns have
Systems, Arbitration and been taken in order to ensure that transmissions will proceed as normal, even if two or
Synchronization more masters initiate a transmission at the same time. Two problems arise in multi-mas-
ter systems:
• An algorithm must be implemented allowing only one of the masters to complete the
transmission. All other masters should cease transmission when they discover that
they have lost the selection process. This selection process is called arbitration.
When a contending master discovers that it has lost the arbitration process, it
should immediately switch to Slave mode to check whether it is being addressed by
the winning master. The fact that multiple masters have started transmission at the
same time should not be detectable to the slaves, i.e. the data being transferred on
the bus must not be corrupted.
• Different masters may use different SCL frequencies. A scheme must be devised to
synchronize the serial clocks from all masters, in order to let the transmission
proceed in a lockstep fashion. This will facilitate the arbitration process.
The wired-ANDing of the bus lines is used to solve both these problems. The serial
clocks from all masters will be wired-ANDed, yielding a combined clock with a high
period equal to the one from the Master with the shortest high period. The low period of
the combined clock is equal to the low period of the Master with the longest low period.
Note that all masters listen to the SCL line, effectively starting to count their SCL high
and low time-out periods when the combined SCL line goes high or low, respectively.
SCL from
Master A
SCL from
Master B
SCL Bus
Line
TBlow TBhigh
Arbitration is carried out by all masters continuously monitoring the SDA line after out-
putting data. If the value read from the SDA line does not match the value the Master
had output, it has lost the arbitration. Note that a Master can only lose arbitration when it
outputs a high SDA value while another Master outputs a low value. The losing Master
should immediately go to Slave mode, checking if it is being addressed by the winning
Master. The SDA line should be left high, but losing masters are allowed to generate a
clock signal until the end of the current data or address packet. Arbitration will continue
until only one Master remains, and this may take many bits. If several masters are trying
to address the same Slave, arbitration will continue into the data packet.
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Figure 97. Arbitration Between Two Masters
START Master A Loses
Arbitration, SDAA SDA
SDA from
Master A
SDA from
Master B
SDA Line
Synchronized
SCL Line
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Overview of the TWI The TWI module is comprised of several submodules, as shown in Figure 98. All regis-
Module ters drawn in a thick line are accessible through the AVR data bus.
SCL SDA
Slew-rate Spike Slew-rate Spike
Control Filter Control Filter
TWI Unit
Address Register Status Register Control Register
(TWAR) (TWSR) (TWCR)
SCL and SDA Pins These pins interface the AVR TWI with the rest of the MCU system. The output drivers
contain a slew-rate limiter in order to conform to the TWI specification. The input stages
contain a spike suppression unit removing spikes shorter than 50 ns. Note that the inter-
nal pull-ups in the AVR pads can be enabled by setting the PORT bits corresponding to
the SCL and SDA pins, as explained in the I/O Port section. The internal pull-ups can in
some systems eliminate the need for external ones.
Bit Rate Generator Unit This unit controls the period of SCL when operating in a Master mode. The SCL period
is controlled by settings in the TWI Bit Rate Register (TWBR) and the Prescaler bits in
the TWI Status Register (TWSR). Slave operation does not depend on Bit Rate or Pres-
caler settings, but the CPU clock frequency in the Slave must be at least 16 times higher
than the SCL frequency. Note that slaves may prolong the SCL low period, thereby
reducing the average TWI bus clock period. The SCL frequency is generated according
to the following equation:
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CPU Clock frequency
SCL frequency = -----------------------------------------------------------
TWPS
16 + 2(TWBR) ⋅ 4
Bus Interface Unit This unit contains the Data and Address Shift Register (TWDR), a START/STOP Con-
troller and Arbitration detection hardware. The TWDR contains the address or data
bytes to be transmitted, or the address or data bytes received. In addition to the 8-bit
TWDR, the Bus Interface Unit also contains a register containing the (N)ACK bit to be
transmitted or received. This (N)ACK Register is not directly accessible by the applica-
tion software. However, when receiving, it can be set or cleared by manipulating the
TWI Control Register (TWCR). When in Transmitter mode, the value of the received
(N)ACK bit can be determined by the value in the TWSR.
The START/STOP Controller is responsible for generation and detection of START,
REPEATED START, and STOP conditions. The START/STOP controller is able to
detect START and STOP conditions even when the AVR MCU is in one of the sleep
modes, enabling the MCU to wake up if addressed by a Master.
If the TWI has initiated a transmission as Master, the Arbitration Detection hardware
continuously monitors the transmission trying to determine if arbitration is in process. If
the TWI has lost an arbitration, the Control Unit is informed. Correct action can then be
taken and appropriate status codes generated.
Address Match Unit The Address Match unit checks if received address bytes match the seven-bit address
in the TWI Address Register (TWAR). If the TWI General Call Recognition Enable
(TWGCE) bit in the TWAR is written to one, all incoming address bits will also be com-
pared against the General Call address. Upon an address match, the Control Unit is
informed, allowing correct action to be taken. The TWI may or may not acknowledge its
address, depending on settings in the TWCR. The Address Match unit is able to com-
pare addresses even when the AVR MCU is in sleep mode, enabling the MCU to wake
up if addressed by a Master. If another interrupt (e.g., INT0) occurs during TWI Power-
down address match and wakes up the CPU, the TWI aborts operation and return to it’s
idle state. If this cause any problems, ensure that TWI Address Match is the only
enabled interrupt when entering Power-down.
Control Unit The Control unit monitors the TWI bus and generates responses corresponding to set-
tings in the TWI Control Register (TWCR). When an event requiring the attention of the
application occurs on the TWI bus, the TWI Interrupt Flag (TWINT) is asserted. In the
next clock cycle, the TWI Status Register (TWSR) is updated with a status code identify-
ing the event. The TWSR only contains relevant status information when the TWI
Interrupt Flag is asserted. At all other times, the TWSR contains a special status code
indicating that no relevant status information is available. As long as the TWINT Flag is
set, the SCL line is held low. This allows the application software to complete its tasks
before allowing the TWI transmission to continue.
The TWINT Flag is set in the following situations:
• After the TWI has transmitted a START/REPEATED START condition.
• After the TWI has transmitted SLA+R/W.
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Using the TWI The AVR TWI is byte-oriented and interrupt based. Interrupts are issued after all bus
events, like reception of a byte or transmission of a START condition. Because the TWI
is interrupt-based, the application software is free to carry on other operations during a
TWI byte transfer. Note that the TWI Interrupt Enable (TWIE) bit in TWCR together with
the Global Interrupt Enable bit in SREG allow the application to decide whether or not
assertion of the TWINT Flag should generate an interrupt request. If the TWIE bit is
cleared, the application must poll the TWINT Flag in order to detect actions on the TWI
bus.
When the TWINT Flag is asserted, the TWI has finished an operation and awaits appli-
cation response. In this case, the TWI Status Register (TWSR) contains a value
indicating the current state of the TWI bus. The application software can then decide
how the TWI should behave in the next TWI bus cycle by manipulating the TWCR and
TWDR Registers.
Figure 99 is a simple example of how the application can interface to the TWI hardware.
In this example, a Master wishes to transmit a single data byte to a Slave. This descrip-
tion is quite abstract, a more detailed explanation follows later in this section. A simple
code example implementing the desired behavior is also presented.
Indicates
4. TWINT set.
Hardware
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TWINT bit in TWCR is set. Immediately after the application has cleared TWINT,
the TWI will initiate transmission of the START condition.
2. When the START condition has been transmitted, the TWINT Flag in TWCR is
set, and TWSR is updated with a status code indicating that the START condition
has successfully been sent.
3. The application software should now examine the value of TWSR, to make sure
that the START condition was successfully transmitted. If TWSR indicates other-
wise, the application software might take some special action, like calling an
error routine. Assuming that the status code is as expected, the application must
load SLA+W into TWDR. Remember that TWDR is used both for address and
data. After TWDR has been loaded with the desired SLA+W, a specific value
must be written to TWCR, instructing the TWI hardware to transmit the SLA+W
present in TWDR. Which value to write is described later on. However, it is
important that the TWINT bit is set in the value written. Writing a one to TWINT
clears the flag. The TWI will not start any operation as long as the TWINT bit in
TWCR is set. Immediately after the application has cleared TWINT, the TWI will
initiate transmission of the address packet.
4. When the address packet has been transmitted, the TWINT Flag in TWCR is set,
and TWSR is updated with a status code indicating that the address packet has
successfully been sent. The status code will also reflect whether a Slave
acknowledged the packet or not.
5. The application software should now examine the value of TWSR, to make sure
that the address packet was successfully transmitted, and that the value of the
ACK bit was as expected. If TWSR indicates otherwise, the application software
might take some special action, like calling an error routine. Assuming that the
status code is as expected, the application must load a data packet into TWDR.
Subsequently, a specific value must be written to TWCR, instructing the TWI
hardware to transmit the data packet present in TWDR. Which value to write is
described later on. However, it is important that the TWINT bit is set in the value
written. Writing a one to TWINT clears the flag. The TWI will not start any opera-
tion as long as the TWINT bit in TWCR is set. Immediately after the application
has cleared TWINT, the TWI will initiate transmission of the data packet.
6. When the data packet has been transmitted, the TWINT Flag in TWCR is set,
and TWSR is updated with a status code indicating that the data packet has suc-
cessfully been sent. The status code will also reflect whether a Slave
acknowledged the packet or not.
7. The application software should now examine the value of TWSR, to make sure
that the data packet was successfully transmitted, and that the value of the ACK
bit was as expected. If TWSR indicates otherwise, the application software might
take some special action, like calling an error routine. Assuming that the status
code is as expected, the application must write a specific value to TWCR,
instructing the TWI hardware to transmit a STOP condition. Which value to write
is described later on. However, it is important that the TWINT bit is set in the
value written. Writing a one to TWINT clears the flag. The TWI will not start any
operation as long as the TWINT bit in TWCR is set. Immediately after the appli-
cation has cleared TWINT, the TWI will initiate transmission of the STOP
condition. Note that TWINT is NOT set after a STOP condition has been sent.
Even though this example is simple, it shows the principles involved in all TWI transmis-
sions. These can be summarized as follows:
• When the TWI has finished an operation and expects application response, the
TWINT Flag is set. The SCL line is pulled low until TWINT is cleared.
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• When the TWINT Flag is set, the user must update all TWI Registers with the value
relevant for the next TWI bus cycle. As an example, TWDR must be loaded with the
value to be transmitted in the next bus cycle.
• After all TWI Register updates and other pending application software tasks have
been completed, TWCR is written. When writing TWCR, the TWINT bit should be
set. Writing a one to TWINT clears the flag. The TWI will then commence executing
whatever operation was specified by the TWCR setting.
In the following an assembly and C implementation of the example is given. Note that
the code below assumes that several definitions have been made, for example by using
include-files.
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Transmission Modes The TWI can operate in one of four major modes. These are named Master Transmitter
(MT), Master Receiver (MR), Slave Transmitter (ST) and Slave Receiver (SR). Several
of these modes can be used in the same application. As an example, the TWI can use
MT mode to write data into a TWI EEPROM, MR mode to read the data back from the
EEPROM. If other masters are present in the system, some of these might transmit data
to the TWI, and then SR mode would be used. It is the application software that decides
which modes are legal.
The following sections describe each of these modes. Possible status codes are
described along with figures detailing data transmission in each of the modes. These fig-
ures contain the following abbreviations:
S: START condition
Rs: REPEATED START condition
R: Read bit (high level at SDA)
W: Write bit (low level at SDA)
A: Acknowledge bit (low level at SDA)
A: Not acknowledge bit (high level at SDA)
Data: 8-bit data byte
P: STOP condition
SLA: Slave Address
In Figure 101 to Figure 107, circles are used to indicate that the TWINT Flag is set. The
numbers in the circles show the status code held in TWSR, with the prescaler bits
masked to zero. At these points, actions must be taken by the application to continue or
complete the TWI transfer. The TWI transfer is suspended until the TWINT Flag is
cleared by software.
When the TWINT Flag is set, the status code in TWSR is used to determine the appro-
priate software action. For each status code, the required software action and details of
the following serial transfer are given in Table 118 to Table 121. Note that the prescaler
bits are masked to zero in these tables.
Master Transmitter Mode In the Master Transmitter mode, a number of data bytes are transmitted to a Slave
Receiver (see Figure 100). In order to enter a Master mode, a START condition must be
transmitted. The format of the following address packet determines whether Master
Transmitter or Master Receiver mode is to be entered. If SLA+W is transmitted, MT
mode is entered, if SLA+R is transmitted, MR mode is entered. All the status codes
mentioned in this section assume that the prescaler bits are zero or are masked to zero.
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Device 1 Device 2
MASTER SLAVE Device 3 ........ Device n R1 R2
TRANSMITTER RECEIVER
SDA
SCL
TWEN must be set to enable the 2-wire Serial Interface, TWSTA must be written to one
to transmit a START condition and TWINT must be written to one to clear the TWINT
Flag. The TWI will then test the 2-wire Serial Bus and generate a START condition as
soon as the bus becomes free. After a START condition has been transmitted, the
TWINT Flag is set by hardware, and the status code in TWSR will be 0x08 (see Table
118). In order to enter MT mode, SLA+W must be transmitted. This is done by writing
SLA+W to TWDR. Thereafter the TWINT bit should be cleared (by writing it to one) to
continue the transfer. This is accomplished by writing the following value to TWCR:
TWCR TWINT TWEA TWSTA TWSTO TWWC TWEN – TWIE
value 1 X 0 0 X 1 0 X
When SLA+W have been transmitted and an acknowledgement bit has been received,
TWINT is set again and a number of status codes in TWSR are possible. Possible sta-
tus codes in Master mode are 0x18, 0x20, or 0x38. The appropriate action to be taken
for each of these status codes is detailed in Table 118.
When SLA+W has been successfully transmitted, a data packet should be transmitted.
This is done by writing the data byte to TWDR. TWDR must only be written when
TWINT is high. If not, the access will be discarded, and the Write Collision bit (TWWC)
will be set in the TWCR Register. After updating TWDR, the TWINT bit should be
cleared (by writing it to one) to continue the transfer. This is accomplished by writing the
following value to TWCR:
TWCR TWINT TWEA TWSTA TWSTO TWWC TWEN – TWIE
value 1 X 0 0 X 1 0 X
This scheme is repeated until the last byte has been sent and the transfer is ended by
generating a STOP condition or a repeated START condition. A STOP condition is gen-
erated by writing the following value to TWCR:
TWCR TWINT TWEA TWSTA TWSTO TWWC TWEN – TWIE
value 1 X 0 1 X 1 0 X
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After a repeated START condition (state 0x10) the 2-wire Serial Interface can access
the same Slave again, or a new Slave without transmitting a STOP condition. Repeated
START enables the Master to switch between Slaves, Master Transmitter mode and
Master Receiver mode without losing control of the bus.
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Successfull
transmission S SLA W A DATA A P
to a slave
receiver
Next transfer
started with a RS SLA W
repeated start
condition
$10
Not acknowledge R
received after the A P
slave address
$20
MR
Not acknowledge
received after a data A P
byte
$30
$38 $38
To corresponding
$68 $78 $B0 states in slave mode
Master Receiver Mode In the Master Receiver mode, a number of data bytes are received from a Slave Trans-
mitter (Slave see Figure 102). In order to enter a Master mode, a START condition must
be transmitted. The format of the following address packet determines whether Master
Transmitter or Master Receiver mode is to be entered. If SLA+W is transmitted, MT
mode is entered, if SLA+R is transmitted, MR mode is entered. All the status codes
mentioned in this section assume that the prescaler bits are zero or are masked to zero.
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Figure 102. Data Transfer in Master Receiver Mode
VCC
Device 1 Device 2
MASTER SLAVE Device 3 ........ Device n R1 R2
RECEIVER TRANSMITTER
SDA
SCL
TWEN must be written to one to enable the 2-wire Serial Interface, TWSTA must be
written to one to transmit a START condition and TWINT must be set to clear the TWINT
Flag. The TWI will then test the 2-wire Serial Bus and generate a START condition as
soon as the bus becomes free. After a START condition has been transmitted, the
TWINT Flag is set by hardware, and the status code in TWSR will be 0x08 (See Table
118). In order to enter MR mode, SLA+R must be transmitted. This is done by writing
SLA+R to TWDR. Thereafter the TWINT bit should be cleared (by writing it to one) to
continue the transfer. This is accomplished by writing the following value to TWCR:
TWCR TWINT TWEA TWSTA TWSTO TWWC TWEN – TWIE
value 1 X 0 0 X 1 0 X
When SLA+R have been transmitted and an acknowledgement bit has been received,
TWINT is set again and a number of status codes in TWSR are possible. Possible sta-
tus codes in Master mode are 0x38, 0x40, or 0x48. The appropriate action to be taken
for each of these status codes is detailed in Table 119. Received data can be read from
the TWDR Register when the TWINT Flag is set high by hardware. This scheme is
repeated until the last byte has been received. After the last byte has been received, the
MR should inform the ST by sending a NACK after the last received data byte. The
transfer is ended by generating a STOP condition or a repeated START condition. A
STOP condition is generated by writing the following value to TWCR:
TWCR TWINT TWEA TWSTA TWSTO TWWC TWEN – TWIE
value 1 X 0 1 X 1 0 X
After a repeated START condition (state 0x10) the 2-wire Serial Interface can access
the same Slave again, or a new Slave without transmitting a STOP condition. Repeated
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START enables the Master to switch between Slaves, Master Transmitter mode and
Master Receiver mode without losing control over the bus.
0x48 SLA+R has been transmitted; No TWDR action or 1 0 1 X Repeated START will be transmitted
NOT ACK has been received No TWDR action or 0 1 1 X STOP condition will be transmitted and TWSTO Flag will
be reset
No TWDR action 1 1 1 X STOP condition followed by a START condition will be
transmitted and TWSTO Flag will be reset
0x50 Data byte has been received; Read data byte or 0 0 1 0 Data byte will be received and NOT ACK will be
ACK has been returned returned
Read data byte 0 0 1 1 Data byte will be received and ACK will be returned
0x58 Data byte has been received; Read data byte or 1 0 1 X Repeated START will be transmitted
NOT ACK has been returned Read data byte or 0 1 1 X STOP condition will be transmitted and TWSTO Flag will
be reset
Read data byte 1 1 1 X STOP condition followed by a START condition will be
transmitted and TWSTO Flag will be reset
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Figure 103. Formats and States in the Master Receiver Mode
MR
Successfull
reception S SLA R A DATA A DATA A P
from a slave
receiver
Next transfer
started with a RS SLA R
repeated start
condition
$10
Not acknowledge W
received after the A P
slave address
$48
MT
Arbitration lost in slave Other master Other master
address or data byte A or A continues A continues
$38 $38
To corresponding
$68 $78 $B0 states in slave mode
Slave Receiver Mode In the Slave Receiver mode, a number of data bytes are received from a Master Trans-
mitter (see Figure 104). All the status codes mentioned in this section assume that the
prescaler bits are zero or are masked to zero.
Device 1 Device 2
SLAVE MASTER Device 3 ........ Device n R1 R2
RECEIVER TRANSMITTER
SDA
SCL
To initiate the Slave Receiver mode, TWAR and TWCR must be initialized as follows:
TWAR TWA6 TWA5 TWA4 TWA3 TWA2 TWA1 TWA0 TWGCE
value Device’s Own Slave Address
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The upper 7 bits are the address to which the 2-wire Serial Interface will respond when
addressed by a Master. If the LSB is set, the TWI will respond to the general call
address (0x00), otherwise it will ignore the general call address.
TWCR TWINT TWEA TWSTA TWSTO TWWC TWEN – TWIE
value 0 1 0 0 0 1 0 X
TWEN must be written to one to enable the TWI. The TWEA bit must be written to one
to enable the acknowledgement of the device’s own slave address or the general call
address. TWSTA and TWSTO must be written to zero.
When TWAR and TWCR have been initialized, the TWI waits until it is addressed by its
own slave address (or the general call address if enabled) followed by the data direction
bit. If the direction bit is “0” (write), the TWI will operate in SR mode, otherwise ST mode
is entered. After its own slave address and the write bit have been received, the TWINT
Flag is set and a valid status code can be read from TWSR. The status code is used to
determine the appropriate software action. The appropriate action to be taken for each
status code is detailed in Table 120. The Slave Receiver mode may also be entered if
arbitration is lost while the TWI is in the Master mode (see states 0x68 and 0x78).
If the TWEA bit is reset during a transfer, the TWI will return a “Not Acknowledge” (“1”)
to SDA after the next received data byte. This can be used to indicate that the Slave is
not able to receive any more bytes. While TWEA is zero, the TWI does not acknowledge
its own slave address. However, the 2-wire Serial Bus is still monitored and address rec-
ognition may resume at any time by setting TWEA. This implies that the TWEA bit may
be used to temporarily isolate the TWI from the 2-wire Serial Bus.
In all sleep modes other than Idle mode, the clock system to the TWI is turned off. If the
TWEA bit is set, the interface can still acknowledge its own slave address or the general
call address by using the 2-wire Serial Bus clock as a clock source. The part will then
wake up from sleep and the TWI will hold the SCL clock low during the wake up and
until the TWINT Flag is cleared (by writing it to one). Further data reception will be car-
ried out as normal, with the AVR clocks running as normal. Observe that if the AVR is
set up with a long start-up time, the SCL line may be held low for a long time, blocking
other data transmissions.
Note that the 2-wire Serial Interface Data Register – TWDR does not reflect the last byte
present on the bus when waking up from these Sleep modes.
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Table 120. Status Codes for Slave Receiver Mode
Status Code Application Software Response
(TWSR) Status of the 2-wire Serial Bus and To TWCR
Prescaler Bits 2-wire Serial Interface Hardware To/from TWDR
are 0 STA STO TWINT TWEA Next Action Taken by TWI Hardware
0x60 Own SLA+W has been received; No TWDR action or X 0 1 0 Data byte will be received and NOT ACK will be
ACK has been returned returned
No TWDR action X 0 1 1 Data byte will be received and ACK will be returned
0x68 Arbitration lost in SLA+R/W as No TWDR action or X 0 1 0 Data byte will be received and NOT ACK will be
Master; own SLA+W has been returned
received; ACK has been returned No TWDR action X 0 1 1 Data byte will be received and ACK will be returned
0x70 General call address has been No TWDR action or X 0 1 0 Data byte will be received and NOT ACK will be
received; ACK has been returned returned
No TWDR action X 0 1 1 Data byte will be received and ACK will be returned
0x78 Arbitration lost in SLA+R/W as No TWDR action or X 0 1 0 Data byte will be received and NOT ACK will be
Master; General call address has returned
been received; ACK has been No TWDR action X 0 1 1 Data byte will be received and ACK will be returned
returned
0x80 Previously addressed with own Read data byte or X 0 1 0 Data byte will be received and NOT ACK will be
SLA+W; data has been received; returned
ACK has been returned Read data byte X 0 1 1 Data byte will be received and ACK will be returned
0x88 Previously addressed with own Read data byte or 0 0 1 0 Switched to the not addressed Slave mode;
SLA+W; data has been received; no recognition of own SLA or GCA
NOT ACK has been returned Read data byte or 0 0 1 1 Switched to the not addressed Slave mode;
own SLA will be recognized;
GCA will be recognized if TWGCE = “1”
Read data byte or 1 0 1 0 Switched to the not addressed Slave mode;
no recognition of own SLA or GCA;
a START condition will be transmitted when the bus
becomes free
Read data byte 1 0 1 1 Switched to the not addressed Slave mode;
own SLA will be recognized;
GCA will be recognized if TWGCE = “1”;
a START condition will be transmitted when the bus
becomes free
0x90 Previously addressed with Read data byte or X 0 1 0 Data byte will be received and NOT ACK will be
general call; data has been re- returned
ceived; ACK has been returned Read data byte X 0 1 1 Data byte will be received and ACK will be returned
0x98 Previously addressed with Read data byte or 0 0 1 0 Switched to the not addressed Slave mode;
general call; data has been no recognition of own SLA or GCA
received; NOT ACK has been Read data byte or 0 0 1 1 Switched to the not addressed Slave mode;
returned own SLA will be recognized;
GCA will be recognized if TWGCE = “1”
Read data byte or 1 0 1 0 Switched to the not addressed Slave mode;
no recognition of own SLA or GCA;
a START condition will be transmitted when the bus
becomes free
Read data byte 1 0 1 1 Switched to the not addressed Slave mode;
own SLA will be recognized;
GCA will be recognized if TWGCE = “1”;
a START condition will be transmitted when the bus
becomes free
0xA0 A STOP condition or repeated No action 0 0 1 0 Switched to the not addressed Slave mode;
START condition has been no recognition of own SLA or GCA
received while still addressed as 0 0 1 1 Switched to the not addressed Slave mode;
Slave own SLA will be recognized;
GCA will be recognized if TWGCE = “1”
1 0 1 0 Switched to the not addressed Slave mode;
no recognition of own SLA or GCA;
a START condition will be transmitted when the bus
becomes free
1 0 1 1 Switched to the not addressed Slave mode;
own SLA will be recognized;
GCA will be recognized if TWGCE = “1”;
a START condition will be transmitted when the bus
becomes free
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$68
$98
$78
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Slave Transmitter Mode In the Slave Transmitter mode, a number of data bytes are transmitted to a Master
Receiver (see Figure 106). All the status codes mentioned in this section assume that
the prescaler bits are zero or are masked to zero.
Device 1 Device 2
SLAVE MASTER Device 3 ........ Device n R1 R2
TRANSMITTER RECEIVER
SDA
SCL
To initiate the Slave Transmitter mode, TWAR and TWCR must be initialized as follows:
TWAR TWA6 TWA5 TWA4 TWA3 TWA2 TWA1 TWA0 TWGCE
value Device’s Own Slave Address
The upper seven bits are the address to which the 2-wire Serial Interface will respond
when addressed by a Master. If the LSB is set, the TWI will respond to the general call
address (0x00), otherwise it will ignore the general call address.
TWCR TWINT TWEA TWSTA TWSTO TWWC TWEN – TWIE
value 0 1 0 0 0 1 0 X
TWEN must be written to one to enable the TWI. The TWEA bit must be written to one
to enable the acknowledgement of the device’s own slave address or the general call
address. TWSTA and TWSTO must be written to zero.
When TWAR and TWCR have been initialized, the TWI waits until it is addressed by its
own slave address (or the general call address if enabled) followed by the data direction
bit. If the direction bit is “1” (read), the TWI will operate in ST mode, otherwise SR mode
is entered. After its own slave address and the write bit have been received, the TWINT
Flag is set and a valid status code can be read from TWSR. The status code is used to
determine the appropriate software action. The appropriate action to be taken for each
status code is detailed in Table 121. The Slave Transmitter mode may also be entered if
arbitration is lost while the TWI is in the Master mode (see state 0xB0).
If the TWEA bit is written to zero during a transfer, the TWI will transmit the last byte of
the transfer. State 0xC0 or state 0xC8 will be entered, depending on whether the Master
Receiver transmits a NACK or ACK after the final byte. The TWI is switched to the not
addressed Slave mode, and will ignore the Master if it continues the transfer. Thus the
Master Receiver receives all “1” as serial data. State 0xC8 is entered if the Master
demands additional data bytes (by transmitting ACK), even though the Slave has trans-
mitted the last byte (TWEA zero and expecting NACK from the Master).
While TWEA is zero, the TWI does not respond to its own slave address. However, the
2-wire Serial Bus is still monitored and address recognition may resume at any time by
setting TWEA. This implies that the TWEA bit may be used to temporarily isolate the
TWI from the 2-wire Serial Bus.
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In all sleep modes other than Idle mode, the clock system to the TWI is turned off. If the
TWEA bit is set, the interface can still acknowledge its own slave address or the general
call address by using the 2-wire Serial Bus clock as a clock source. The part will then
wake up from sleep and the TWI will hold the SCL clock will low during the wake up and
until the TWINT Flag is cleared (by writing it to one). Further data transmission will be
carried out as normal, with the AVR clocks running as normal. Observe that if the AVR is
set up with a long start-up time, the SCL line may be held low for a long time, blocking
other data transmissions.
Note that the 2-wire Serial Interface Data Register – TWDR does not reflect the last byte
present on the bus when waking up from these sleep modes.
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Figure 107. Formats and States in the Slave Transmitter Mode
Reception of the own
slave address and one or S SLA R A DATA A DATA A P or S
more data bytes
$B0
$C8
Miscellaneous States There are two status codes that do not correspond to a defined TWI state, see Table
122.
Status 0xF8 indicates that no relevant information is available because the TWINT Flag
is not set. This occurs between other states, and when the TWI is not involved in a serial
transfer.
Status 0x00 indicates that a bus error has occurred during a 2-wire Serial Bus transfer.
A bus error occurs when a START or STOP condition occurs at an illegal position in the
format frame. Examples of such illegal positions are during the serial transfer of an
address byte, a data byte, or an acknowledge bit. When a bus error occurs, TWINT is
set. To recover from a bus error, the TWSTO Flag must set and TWINT must be cleared
by writing a logic one to it. This causes the TWI to enter the not addressed Slave mode
and to clear the TWSTO Flag (no other bits in TWCR are affected). The SDA and SCL
lines are released, and no STOP condition is transmitted.
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Combining Several TWI In some cases, several TWI modes must be combined in order to complete the desired
Modes action. Consider for example reading data from a serial EEPROM. Typically, such a
transfer involves the following steps:
1. The transfer must be initiated.
2. The EEPROM must be instructed what location should be read.
3. The reading must be performed.
4. The transfer must be finished.
Note that data is transmitted both from Master to Slave and vice versa. The Master must
instruct the Slave what location it wants to read, requiring the use of the MT mode. Sub-
sequently, data must be read from the Slave, implying the use of the MR mode. Thus,
the transfer direction must be changed. The Master must keep control of the bus during
all these steps, and the steps should be carried out as an atomical operation. If this prin-
ciple is violated in a multimaster system, another Master can alter the data pointer in the
EEPROM between steps 2 and 3, and the Master will read the wrong data location.
Such a change in transfer direction is accomplished by transmitting a REPEATED
START between the transmission of the address byte and reception of the data. After a
REPEATED START, the Master keeps ownership of the bus. The following figure shows
the flow in this transfer.
Multi-master Systems If multiple masters are connected to the same bus, transmissions may be initiated simul-
and Arbitration taneously by one or more of them. The TWI standard ensures that such situations are
handled in such a way that one of the masters will be allowed to proceed with the trans-
fer, and that no data will be lost in the process. An example of an arbitration situation is
depicted below, where two masters are trying to transmit data to a Slave Receiver.
SDA
SCL
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• Two or more masters are performing identical communication with the same Slave.
In this case, neither the Slave nor any of the masters will know about the bus
contention.
• Two or more masters are accessing the same Slave with different data or direction
bit. In this case, arbitration will occur, either in the READ/WRITE bit or in the data
bits. The masters trying to output a one on SDA while another Master outputs a zero
will lose the arbitration. Losing masters will switch to not addressed Slave mode or
wait until the bus is free and transmit a new START condition, depending on
application software action.
• Two or more masters are accessing different slaves. In this case, arbitration will
occur in the SLA bits. Masters trying to output a one on SDA while another Master
outputs a zero will lose the arbitration. Masters losing arbitration in SLA will switch to
Slave mode to check if they are being addressed by the winning Master. If
addressed, they will switch to SR or ST mode, depending on the value of the
READ/WRITE bit. If they are not being addressed, they will switch to not addressed
Slave mode or wait until the bus is free and transmit a new START condition,
depending on application software action.
This is summarized in Figure 110. Possible status values are given in circles.
Own No 38 TWI bus will be released and not addressed slave mode will be entered
Address / General Call
A START condition will be transmitted when the bus becomes free
received
Yes
Direction
Write 68/78 Data byte will be received and NOT ACK will be returned
Data byte will be received and ACK will be returned
Read Last data byte will be transmitted and NOT ACK should be received
B0 Data byte will be transmitted and ACK should be received
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Register Description
The TWCR is used to control the operation of the TWI. It is used to enable the TWI, to
initiate a Master access by applying a START condition to the bus, to generate a
Receiver acknowledge, to generate a stop condition, and to control halting of the bus
while the data to be written to the bus are written to the TWDR. It also indicates a write
collision if data is attempted written to TWDR while the register is inaccessible.
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until a STOP condition is detected, and then generates a new START condition to claim
the bus Master status. TWSTA must be cleared by software when the START condition
has been transmitted.
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To calculate bit rates, see “Bit Rate Generator Unit” on page 251. The value of
TWPS1:0 is used in the equation.
In Transmit mode, TWDR contains the next byte to be transmitted. In Receive mode, the
TWDR contains the last byte received. It is writable while the TWI is not in the process of
shifting a byte. This occurs when the TWI Interrupt Flag (TWINT) is set by hardware.
Note that the Data Register cannot be initialized by the user before the first interrupt
occurs. The data in TWDR remains stable as long as TWINT is set. While data is shifted
out, data on the bus is simultaneously shifted in. TWDR always contains the last byte
present on the bus, except after a wake up from a sleep mode by the TWI interrupt. In
this case, the contents of TWDR is undefined. In the case of a lost bus arbitration, no
data is lost in the transition from Master to Slave. Handling of the ACK bit is controlled
automatically by the TWI logic, the CPU cannot access the ACK bit directly.
The TWAR should be loaded with the 7-bit Slave address (in the seven most significant
bits of TWAR) to which the TWI will respond when programmed as a Slave Transmitter
or Receiver, and not needed in the Master modes. In multimaster systems, TWAR must
be set in masters which can be addressed as Slaves by other Masters.
The LSB of TWAR is used to enable recognition of the general call address (0x00).
There is an associated address comparator that looks for the slave address (or general
call address if enabled) in the received serial address. If a match is found, an interrupt
request is generated.
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• Bit 0 – TWGCE: TWI General Call Recognition Enable Bit
If set, this bit enables the recognition of a General Call given over the 2-wire Serial Bus.
TWAR0
Address
Address Match
Bit 0
TWAMR0
Address Bit Comparator 0
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AC – Analog Comparator
The Analog Comparator compares the input values on the positive pin AIN0 and nega-
tive pin AIN1. When the voltage on the positive pin AIN0 is higher than the voltage on
the negative pin AIN1, the Analog Comparator output, ACO, is set. The comparator’s
output can be set to trigger the Timer/Counter1 Input Capture function. In addition, the
comparator can trigger a separate interrupt, exclusive to the Analog Comparator. The
user can select Interrupt triggering on comparator output rise, fall or toggle. A block dia-
gram of the comparator and its surrounding logic is shown in Figure 112.
The Power Reduction ADC bit, PRADC, in “PRR0 – Power Reduction Register 0” on
page 55 must be disabled by writing a logical zero to be able to use the ADC input MUX.
ACBG
ACME
ADEN
ADC MULTIPLEXER
OUTPUT (1)
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Analog Comparator It is possible to select any of the ADC15:0 pins to replace the negative input to the Ana-
Multiplexed Input log Comparator. The ADC multiplexer is used to select this input, and consequently, the
ADC must be switched off to utilize this feature. If the Analog Comparator Multiplexer
Enable bit (ACME in ADCSRB) is set and the ADC is switched off (ADEN in ADCSRA is
zero), MUX5 and MUX2:0 in ADMUX select the input pin to replace the negative input to
the Analog Comparator, as shown in Table 124. If ACME is cleared or ADEN is set,
AIN1 is applied to the negative input to the Analog Comparator.
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Register Description
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• Bit 2 – ACIC: Analog Comparator Input Capture Enable
When written logic one, this bit enables the input capture function in Timer/Counter1 to
be triggered by the Analog Comparator. The comparator output is in this case directly
connected to the input capture front-end logic, making the comparator utilize the noise
canceler and edge select features of the Timer/Counter1 Input Capture interrupt. When
written logic zero, no connection between the Analog Comparator and the input capture
function exists. To make the comparator trigger the Timer/Counter1 Input Capture inter-
rupt, the ICIE1 bit in the Timer Interrupt Mask Register (TIMSK1) must be set.
When changing the ACIS1/ACIS0 bits, the Analog Comparator Interrupt must be dis-
abled by clearing its Interrupt Enable bit in the ACSR Register. Otherwise an interrupt
can occur when the bits are changed.
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Figure 113. Analog to Digital Converter Block Schematic
ADC CONVERSION
COMPLETE IRQ
INTERRUPT
FLAGS
ADTS[2:0]
8-BIT DATABUS
ADIE
ADIF
15 0
ADC MULTIPLEXER ADC CTRL & STATUS ADC CTRL & STATUS ADC DATA REGISTER
SELECT (ADMUX) REGISTER B (ADCSRB) REGISTER A (ADCSRA) (ADCH/ADCL)
ADLAR
ADPS[2:0]
MUX[5]
ADIF
REFS[1:0]
MUX[4:0]
ADEN
ADSC
ADFR
ADC[9:0]
TRIGGER
SELECT
START
MUX DECODER PRESCALER
CHANNEL SELECTION
INTERNAL
REFERENCE
(1.1V/2.56V)
+
SAMPLE & HOLD
COMPARATOR
ADC[2:0]
-
ADC[10:8]
+ GAIN
AMPLIFIER
ADC[15:0]
ADC
BANDGAP (1.1V)
REFERENCE
MULTIPLEXER
OUTPUT
GND
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Operation The ADC converts an analog input voltage to a 10-bit digital value through successive
approximation. The minimum value represents GND and the maximum value represents
the voltage on the AREF pin minus 1 LSB. Optionally, AVCC or an internal 1.1V or
2.56V reference voltage may be connected to the AREF pin by writing to the REFSn bits
in the ADMUX Register. The internal voltage reference may thus be decoupled by an
external capacitor at the AREF pin to improve noise immunity.
The analog input channel is selected by writing to the MUX bits in ADMUX and ADC-
SRB. Any of the ADC input pins, as well as GND and a fixed bandgap voltage reference,
can be selected as single ended inputs to the ADC. A selection of ADC input pins can be
selected as positive and negative inputs to the differential amplifier.
If differential channels are selected, the voltage difference between the selected input
channel pair then becomes the analog input to the ADC. If single ended channels are
used, the amplifier is bypassed altogether.
The ADC is enabled by setting the ADC Enable bit, ADEN in ADCSRA. Voltage refer-
ence and input channel selections will not go into effect until ADEN is set. The ADC
does not consume power when ADEN is cleared, so it is recommended to switch off the
ADC before entering power saving sleep modes.
The ADC generates a 10-bit result which is presented in the ADC Data Registers,
ADCH and ADCL. By default, the result is presented right adjusted, but can optionally
be presented left adjusted by setting the ADLAR bit in ADMUX.
If the result is left adjusted and no more than 8-bit precision is required, it is sufficient to
read ADCH. Otherwise, ADCL must be read first, then ADCH, to ensure that the content
of the Data Registers belongs to the same conversion. Once ADCL is read, ADC access
to Data Registers is blocked. This means that if ADCL has been read, and a conversion
completes before ADCH is read, neither register is updated and the result from the con-
version is lost. When ADCH is read, ADC access to the ADCH and ADCL Registers is
re-enabled.
The ADC has its own interrupt which can be triggered when a conversion completes.
When ADC access to the Data Registers is prohibited between reading of ADCH and
ADCL, the interrupt will trigger even if the result is lost.
Starting a Conversion A single conversion is started by writing a logical one to the ADC Start Conversion bit,
ADSC. This bit stays high as long as the conversion is in progress and will be cleared by
hardware when the conversion is completed. If a different data channel is selected while
a conversion is in progress, the ADC will finish the current conversion before performing
the channel change.
Alternatively, a conversion can be triggered automatically by various sources. Auto Trig-
gering is enabled by setting the ADC Auto Trigger Enable bit, ADATE in ADCSRA. The
trigger source is selected by setting the ADC Trigger Select bits, ADTS in ADCSRB
(See description of the ADTS bits for a list of the trigger sources). When a positive edge
occurs on the selected trigger signal, the ADC prescaler is reset and a conversion is
started. This provides a method of starting conversions at fixed intervals. If the trigger
signal still is set when the conversion completes, a new conversion will not be started. If
another positive edge occurs on the trigger signal during conversion, the edge will be
ignored. Note that an Interrupt Flag will be set even if the specific interrupt is disabled or
the Global Interrupt Enable bit in SREG is cleared. A conversion can thus be triggered
without causing an interrupt. However, the Interrupt Flag must be cleared in order to trig-
ger a new conversion at the next interrupt event.
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Figure 114. ADC Auto Trigger Logic
ADTS[2:0]
PRESCALER
START CLKADC
ADIF ADATE
SOURCE 1
. CONVERSION
. LOGIC
.
. EDGE
SOURCE n DETECTOR
ADSC
Using the ADC Interrupt Flag as a trigger source makes the ADC start a new conversion
as soon as the ongoing conversion has finished. The ADC then operates in Free Run-
ning mode, constantly sampling and updating the ADC Data Register. The first
conversion must be started by writing a logical one to the ADSC bit in ADCSRA. In this
mode the ADC will perform successive conversions independently of whether the ADC
Interrupt Flag, ADIF is cleared or not.
If Auto Triggering is enabled, single conversions can be started by writing ADSC in
ADCSRA to one. ADSC can also be used to determine if a conversion is in progress.
The ADSC bit will be read as one during a conversion, independently of how the conver-
sion was started.
ADPS0
ADPS1
ADPS2
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setting the ADEN bit in ADCSRA. The prescaler keeps running for as long as the ADEN
bit is set, and is continuously reset when ADEN is low.
When initiating a single ended conversion by setting the ADSC bit in ADCSRA, the con-
version starts at the following rising edge of the ADC clock cycle.
A normal conversion takes 13 ADC clock cycles. The first conversion after the ADC is
switched on (ADEN in ADCSRA is set) takes 25 ADC clock cycles in order to initialize
the analog circuitry.
When the bandgap reference voltage is used as input to the ADC, it will take a certain
time for the voltage to stabilize. If not stabilized, the first value read after the first conver-
sion may be wrong.
The actual sample-and-hold takes place 1.5 ADC clock cycles after the start of a normal
conversion and 13.5 ADC clock cycles after the start of an first conversion. When a con-
version is complete, the result is written to the ADC Data Registers, and ADIF is set. In
Single Conversion mode, ADSC is cleared simultaneously. The software may then set
ADSC again, and a new conversion will be initiated on the first rising ADC clock edge.
When Auto Triggering is used, the prescaler is reset when the trigger event occurs. This
assures a fixed delay from the trigger event to the start of conversion. In this mode, the
sample-and-hold takes place two ADC clock cycles after the rising edge on the trigger
source signal. Three additional CPU clock cycles are used for synchronization logic.
In Free Running mode, a new conversion will be started immediately after the conver-
sion completes, while ADSC remains high. For a summary of conversion times, see
Table 126.
Figure 116. ADC Timing Diagram, First Conversion (Single Conversion Mode)
Next
First Conversion Conversion
Cycle Number 1 2 12 13 14 15 16 17 18 19 20 21 22 23 24 25 1 2 3
ADC Clock
ADEN
ADSC
ADIF
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Figure 117. ADC Timing Diagram, Single Conversion
One Conversion Next Conversion
Cycle Number 1 2 3 4 5 6 7 8 9 10 11 12 13 1 2 3
ADC Clock
ADSC
ADIF
Cycle Number 1 2 3 4 5 6 7 8 9 10 11 12 13 1 2
ADC Clock
Trigger
Source
ADATE
ADIF
11 12 13 1 2 3 4
Cycle Number
ADC Clock
ADSC
ADIF
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Differential Channels When using differential channels, certain aspects of the conversion need to be taken
into consideration.
Differential conversions are synchronized to the internal clock CKADC2 equal to half the
ADC clock. This synchronization is done automatically by the ADC interface in such a
way that the sample-and-hold occurs at a specific phase of CKADC2. A conversion initi-
ated by the user (i.e., all single conversions, and the first free running conversion) when
CKADC2 is low will take the same amount of time as a single ended conversion (13 ADC
clock cycles from the next prescaled clock cycle). A conversion initiated by the user
when CKADC2 is high will take 14 ADC clock cycles due to the synchronization mecha-
nism. In Free Running mode, a new conversion is initiated immediately after the
previous conversion completes, and since CKADC2 is high at this time, all automatically
started (i.e., all but the first) Free Running conversions will take 14 ADC clock cycles.
If differential channels are used and conversions are started by Auto Triggering, the
ADC must be switched off between conversions. When Auto Triggering is used, the
ADC prescaler is reset before the conversion is started. Since the stage is dependent of
a stable ADC clock prior to the conversion, this conversion will not be valid. By disabling
and then re-enabling the ADC between each conversion (writing ADEN in ADCSRA to
“0” then to “1”), only extended conversions are performed. The result from the extended
conversions will be valid. See “Prescaling and Conversion Timing” on page 282 for tim-
ing details.
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Changing Channel or The MUXn and REFS1:0 bits in the ADMUX Register are single buffered through a tem-
Reference Selection porary register to which the CPU has random access. This ensures that the channels
and reference selection only takes place at a safe point during the conversion. The
channel and reference selection is continuously updated until a conversion is started.
Once the conversion starts, the channel and reference selection is locked to ensure a
sufficient sampling time for the ADC. Continuous updating resumes in the last ADC
clock cycle before the conversion completes (ADIF in ADCSRA is set). Note that the
conversion starts on the following rising ADC clock edge after ADSC is written. The user
is thus advised not to write new channel or reference selection values to ADMUX until
one ADC clock cycle after ADSC is written.
If Auto Triggering is used, the exact time of the triggering event can be indeterministic.
Special care must be taken when updating the ADMUX Register, in order to control
which conversion will be affected by the new settings.
If both ADATE and ADEN is written to one, an interrupt event can occur at any time. If
the ADMUX Register is changed in this period, the user cannot tell if the next conversion
is based on the old or the new settings. ADMUX can be safely updated in the following
ways:
1. When ADATE or ADEN is cleared.
2. During conversion, minimum one ADC clock cycle after the trigger event.
3. After a conversion, before the Interrupt Flag used as trigger source is
cleared.
When updating ADMUX in one of these conditions, the new settings will affect the next
ADC conversion.
Special care should be taken when changing differential channels. Once a differential
channel has been selected, the stage may take as much as 125 µs to stabilize to the
new value. Thus conversions should not be started within the first 125 µs after selecting
a new differential channel. Alternatively, conversion results obtained within this period
should be discarded.
The same settling time should be observed for the first differential conversion after
changing ADC reference (by changing the REFS1:0 bits in ADMUX).
ADC Input Channels When changing channel selections, the user should observe the following guidelines to
ensure that the correct channel is selected:
In Single Conversion mode, always select the channel before starting the conversion.
The channel selection may be changed one ADC clock cycle after writing one to ADSC.
However, the simplest method is to wait for the conversion to complete before changing
the channel selection.
In Free Running mode, always select the channel before starting the first conversion.
The channel selection may be changed one ADC clock cycle after writing one to ADSC.
However, the simplest method is to wait for the first conversion to complete, and then
change the channel selection. Since the next conversion has already started automati-
cally, the next result will reflect the previous channel selection. Subsequent conversions
will reflect the new channel selection.
When switching to a differential gain channel, the first conversion result may have a
poor accuracy due to the required settling time for the automatic offset cancellation cir-
cuitry. The user should preferably disregard the first conversion result.
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ADC Voltage Reference The reference voltage for the ADC (VREF) indicates the conversion range for the ADC.
Single ended channels that exceed VREF will result in codes close to 0x3FF. VREF can be
selected as either AVCC, internal 1.1V reference, internal 2.56V reference or external
AREF pin.
AVCC is connected to the ADC through a passive switch. The internal 1.1V reference is
generated from the internal bandgap reference (VBG) through an internal amplifier. In
either case, the external AREF pin is directly connected to the ADC, and the reference
voltage can be made more immune to noise by connecting a capacitor between the
AREF pin and ground. VREF can also be measured at the AREF pin with a high impedant
voltmeter. Note that VREF is a high impedant source, and only a capacitive load should
be connected in a system. The Internal 2.56V reference is generated from the 1.1V
reference.
If the user has a fixed voltage source connected to the AREF pin, the user may not use
the other reference voltage options in the application, as they will be shorted to the
external voltage. If no external voltage is applied to the AREF pin, the user may switch
between AVCC, 1.1V and 2.56V as reference selection. The first ADC conversion result
after switching reference voltage source may be inaccurate, and the user is advised to
discard this result.
If differential channels are used, the selected reference should not be closer to AVCC
than indicated in “ADC Characteristics – Preliminary Data” on page 382.
ADC Noise Canceler The ADC features a noise canceler that enables conversion during sleep mode to
reduce noise induced from the CPU core and other I/O peripherals. The noise canceler
can be used with ADC Noise Reduction and Idle mode. To make use of this feature, the
following procedure should be used:
1. Make sure that the ADC is enabled and is not busy converting. Single Con-
version mode must be selected and the ADC conversion complete interrupt
must be enabled.
2. Enter ADC Noise Reduction mode (or Idle mode). The ADC will start a con-
version once the CPU has been halted.
3. If no other interrupts occur before the ADC conversion completes, the ADC
interrupt will wake up the CPU and execute the ADC Conversion Complete
interrupt routine. If another interrupt wakes up the CPU before the ADC con-
version is complete, that interrupt will be executed, and an ADC Conversion
Complete interrupt request will be generated when the ADC conversion
completes. The CPU will remain in active mode until a new sleep command
is executed.
Note that the ADC will not be automatically turned off when entering other sleep modes
than Idle mode and ADC Noise Reduction mode. The user is advised to write zero to
ADEN before entering such sleep modes to avoid excessive power consumption.
If the ADC is enabled in such sleep modes and the user wants to perform differential
conversions, the user is advised to switch the ADC off and on after waking up from
sleep to prompt an extended conversion to get a valid result.
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Analog Input Circuitry The analog input circuitry for single ended channels is illustrated in Figure 120. An ana-
log source applied to ADCn is subjected to the pin capacitance and input leakage of that
pin, regardless of whether that channel is selected as input for the ADC. When the chan-
nel is selected, the source must drive the S/H capacitor through the series resistance
(combined resistance in the input path).
The ADC is optimized for analog signals with an output impedance of approximately
10 kΩ or less. If such a source is used, the sampling time will be negligible. If a source
with higher impedance is used, the sampling time will depend on how long time the
source needs to charge the S/H capacitor, which can vary widely. The user is recom-
mended to only use low impedant sources with slowly varying signals, since this
minimizes the required charge transfer to the S/H capacitor.
Signal components higher than the Nyquist frequency (fADC/2) should not be present for
either kind of channels, to avoid distortion from unpredictable signal convolution. The
user is advised to remove high frequency components with a low-pass filter before
applying the signals as inputs to the ADC.
IIH
ADCn
1..100 kΩ
CS/H= 14 pF
IIL
VCC/2
Analog Noise Canceling Digital circuitry inside and outside the device generates EMI which might affect the
Techniques accuracy of analog measurements. If conversion accuracy is critical, the noise level can
be reduced by applying the following techniques:
1. Keep analog signal paths as short as possible. Make sure analog tracks run
over the ground plane, and keep them well away from high-speed switching
digital tracks.
2. The AVCC pin on the device should be connected to the digital VCC supply
voltage via an LC network as shown in Figure 121.
3. Use the ADC noise canceler function to reduce induced noise from the CPU.
4. If any ADC port pins are used as digital outputs, it is essential that these do
not switch while a conversion is in progress.
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PA0 51
VCC
52
GND 53
(ADC7) PF7 54
(ADC6) PF6 55
(ADC5) PF5 56
(ADC4) PF4 57
(ADC3) PF3 58
(ADC2) PF2 59
(ADC1) PF1 60
(ADC0) PF0 61
10υΗ
AREF 62
GND
63
AVCC
64
100nF
1
Ground Plane
PG5
Figure 122. ADC Power Connections, ATmega640/1280/2560
PJ7 79
VCC 80
GND 81
(ADC15/PCINT23) PK7 82
(ADC14/PCINT22) PK6 83
(ADC13/PCINT21) PK5 84
(ADC12/PCINT20) PK4 85
(ADC11/PCINT19) PK3 86
(ADC10/PCINT18) PK2 87
(ADC9/PCINT17) PK1 88
(ADC8/PCINT16) PK0 89
(ADC7/TDI) PF7 90
(ADC6/TDO) PF6 91
(ADC5/TMS) PF5 92
(ADC4/TCK) PF4 93
(ADC3) PF3 94
(ADC2) PF2 95
(ADC1) PF1 96
(ADC0) PF0 97
10υΗ
AREF 98
GND 99
AVCC 100
100nF
Ground Plane
(OC0B) PG5
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Offset Compensation The stage has a built-in offset cancellation circuitry that nulls the offset of differential
Schemes measurements as much as possible. The remaining offset in the analog path can be
measured directly by selecting the same channel for both differential inputs. This offset
residue can be then subtracted in software from the measurement results. Using this
kind of software based offset correction, offset on any channel can be reduced below
one LSB.
ADC Accuracy Definitions An n-bit single-ended ADC converts a voltage linearly between GND and VREF in 2n
steps (LSBs). The lowest code is read as 0, and the highest code is read as 2n-1.
Several parameters describe the deviation from the ideal behavior:
• Offset: The deviation of the first transition (0x000 to 0x001) compared to the ideal
transition (at 0.5 LSB). Ideal value: 0 LSB.
Ideal ADC
Actual ADC
Offset
Error
VREF Input Voltage
• Gain Error: After adjusting for offset, the Gain Error is found as the deviation of the
last transition (0x3FE to 0x3FF) compared to the ideal transition (at 1.5 LSB below
maximum). Ideal value: 0 LSB
Ideal ADC
Actual ADC
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• Integral Non-linearity (INL): After adjusting for offset and gain error, the INL is the
maximum deviation of an actual transition compared to an ideal transition for any
code. Ideal value: 0 LSB.
INL
Ideal ADC
Actual ADC
• Differential Non-linearity (DNL): The maximum deviation of the actual code width
(the interval between two adjacent transitions) from the ideal code width (1 LSB).
Ideal value: 0 LSB.
1 LSB
DNL
0x000
• Quantization Error: Due to the quantization of the input voltage into a finite number
of codes, a range of input voltages (1 LSB wide) will code to the same value. Always
± 0.5 LSB.
• Absolute Accuracy: The maximum deviation of an actual (unadjusted) transition
compared to an ideal transition for any code. This is the compound effect of offset,
gain error, differential error, non-linearity, and quantization error. Ideal value: ± 0.5
LSB.
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ADC Conversion Result
After the conversion is complete (ADIF is high), the conversion result can be found in
the ADC Result Registers (ADCL, ADCH).
For single ended conversion, the result is
V IN ⋅ 1024
ADC = --------------------------
V REF
where VIN is the voltage on the selected input pin and VREF the selected voltage refer-
ence (see Table 128 on page 294 and Table 129 on page 295). 0x000 represents
analog ground, and 0x3FF represents the selected reference voltage minus one LSB.
If differential channels are used, the result is
where VPOS is the voltage on the positive input pin, VNEG the voltage on the negative
input pin, and VREF the selected voltage reference. The result is presented in two’s com-
plement form, from 0x200 (-512d) through 0x1FF (+511d). Note that if the user wants to
perform a quick polarity check of the result, it is sufficient to read the MSB of the result
(ADC9 in ADCH). If the bit is one, the result is negative, and if this bit is zero, the result
is positive. Figure 127 shows the decoding of the differential input range.
Table 127 shows the resulting output codes if the differential input channel pair (ADCn -
ADCm) is selected with a gain of GAIN and a reference voltage of VREF.
Output Code
0x1FF
0x000
0x200
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Example:
ADMUX = 0xFB (ADC3 - ADC2, 10x gain, 2.56V reference, left adjusted result)
Voltage on ADC3 is 300 mV, voltage on ADC2 is 500 mV.
ADCR = 512 * 10 * (300 - 500) / 2560 = -400 = 0x270.
ADCL will thus read 0x00, and ADCH will read 0x9C. Writing zero to ADLAR right
adjusts the result: ADCL = 0x70, ADCH = 0x02.
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Register Description
Note: 1. If 10x or 200x gain is selected, only 2.56 V should be used as Internal Voltage Refer-
ence. For differential conversion, only 1.1V cannot be used as internal voltage
reference.
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Table 129. Input Channel Selections (Continued)
Single Ended Positive Differential Negative Differential
MUX5:0 Input Input Input Gain
011010 ADC2 ADC2 1x
011011 ADC3 ADC2 1x
N/A
011100 ADC4 ADC2 1x
011101 ADC5 ADC2 1x
011110 1.1V (VBG)
N/A
011111 0V (GND)
100000 ADC8
100001 ADC9
100010 ADC10
100011 ADC11
N/A
100100 ADC12
100101 ADC13
100110 ADC14
100111 ADC15
(1)
101000 ADC8 ADC8 10x
(1)
101001 ADC9 ADC8 10x
101010(1) ADC8 ADC8 200x
(1)
101011 ADC9 ADC8 200x
(1)
101100 ADC10 ADC10 10x
(1)
101101 ADC11 ADC10 10x
101110(1) ADC10 ADC10 200x
101111(1) ADC11 ADC10 200x
110000 ADC8 ADC9 1x
110001 ADC9 ADC9 1x
110010 N/A ADC10 ADC9 1x
110011 ADC11 ADC9 1x
110100 ADC12 ADC9 1x
110101 ADC13 ADC9 1x
110110 ADC14 ADC9 1x
110111 ADC15 ADC9 1x
111000 ADC8 ADC10 1x
111001 ADC9 ADC10 1x
111010 ADC10 ADC10 1x
111011 ADC11 ADC10 1x
111100 ADC12 ADC10 1x
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Table 130. ADC Prescaler Selections
ADPS2 ADPS1 ADPS0 Division Factor
0 0 0 2
0 0 1 2
0 1 0 4
0 1 1 8
1 0 0 16
1 0 1 32
1 1 0 64
1 1 1 128
ADLAR = 0
Bit 15 14 13 12 11 10 9 8
(0x79) – – – – – – ADC9 ADC8 ADCH
(0x78) ADC7 ADC6 ADC5 ADC4 ADC3 ADC2 ADC1 ADC0 ADCL
7 6 5 4 3 2 1 0
Read/Write R R R R R R R R
R R R R R R R R
Initial Value 0 0 0 0 0 0 0 0
0 0 0 0 0 0 0 0
ADLAR = 1
Bit 15 14 13 12 11 10 9 8
(0x79) ADC9 ADC8 ADC7 ADC6 ADC5 ADC4 ADC3 ADC2 ADCH
(0x78) ADC1 ADC0 – – – – – – ADCL
7 6 5 4 3 2 1 0
Read/Write R R R R R R R R
R R R R R R R R
Initial Value 0 0 0 0 0 0 0 0
0 0 0 0 0 0 0 0
When an ADC conversion is complete, the result is found in these two registers. If differ-
ential channels are used, the result is presented in two’s complement form.
When ADCL is read, the ADC Data Register is not updated until ADCH is read. Conse-
quently, if the result is left adjusted and no more than 8-bit precision (7 bit + sign bit for
differential input channels) is required, it is sufficient to read ADCH. Otherwise, ADCL
must be read first, then ADCH.
The ADLAR bit in ADMUX, and the MUXn bits in ADMUX affect the way the result is
read from the registers. If ADLAR is set, the result is left adjusted. If ADLAR is cleared
(default), the result is right adjusted.
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Note: Free running mode cannot be used for differential channels. (See chapter “Differential
Channels” on page 285)
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DIDR0 – Digital Input Disable
Bit 7 6 5 4 3 2 1 0
Register 0
(0x7E) ADC7D ADC6D ADC5D ADC4D ADC3D ADC2D ADC1D ADC0D DIDR0
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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Overview The AVR IEEE std. 1149.1 compliant JTAG interface can be used for
• Testing PCBs by using the JTAG Boundary-scan capability
• Programming the non-volatile memories, Fuses and Lock bits
• On-chip debugging
A brief description is given in the following sections. Detailed descriptions for Program-
ming via the JTAG interface, and using the Boundary-scan Chain can be found in the
sections “Programming via the JTAG Interface” on page 361 and “IEEE 1149.1 (JTAG)
Boundary-scan” on page 308, respectively. The On-chip Debug support is considered
being private JTAG instructions, and distributed within ATMEL and to selected third
party vendors only.
Figure 128 shows a block diagram of the JTAG interface and the On-chip Debug sys-
tem. The TAP Controller is a state machine controlled by the TCK and TMS signals. The
TAP Controller selects either the JTAG Instruction Register or one of several Data Reg-
isters as the scan chain (Shift Register) between the TDI – input and TDO – output. The
Instruction Register holds JTAG instructions controlling the behavior of a Data Register.
The ID-Register, Bypass Register, and the Boundary-scan Chain are the Data Registers
used for board-level testing. The JTAG Programming Interface (actually consisting of
several physical and virtual Data Registers) is used for serial programming via the JTAG
interface. The Internal Scan Chain and Break Point Scan Chain are used for On-chip
debugging only.
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Figure 128. Block Diagram
I/O PORT 0
DEVICE BOUNDARY
TDI
JTAG PROGRAMMING
TDO TAP INTERFACE
TCK CONTROLLER
TMS
AVR CPU
INTERNAL
FLASH Address SCAN PC
INSTRUCTION MEMORY Data CHAIN Instruction
REGISTER
ID
REGISTER BREAKPOINT
UNIT
M FLOW CONTROL
U BYPASS
UNIT
X REGISTER DIGITAL
ANALOG
PERIPHERAL Analog inputs
PERIPHERIAL
UNITS
UNITS
BREAKPOINT
SCAN CHAIN
JTAG / AVR CORE
COMMUNICATION
ADDRESS INTERFACE
DECODER OCD STATUS
AND CONTROL
I/O PORT n
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TAP - Test Access Port The JTAG interface is accessed through four of the AVR’s pins. In JTAG terminology,
these pins constitute the Test Access Port – TAP. These pins are:
• TMS: Test mode select. This pin is used for navigating through the TAP-controller
state machine.
• TCK: Test Clock. JTAG operation is synchronous to TCK.
• TDI: Test Data In. Serial input data to be shifted in to the Instruction Register or Data
Register (Scan Chains).
• TDO: Test Data Out. Serial output data from Instruction Register or Data Register.
The IEEE std. 1149.1 also specifies an optional TAP signal; TRST – Test ReSeT –
which is not provided.
When the JTAGEN Fuse is unprogrammed, these four TAP pins are normal port pins,
and the TAP controller is in reset. When programmed, the input TAP signals are inter-
nally pulled high and the JTAG is enabled for Boundary-scan and programming. The
device is shipped with this fuse programmed.
For the On-chip Debug system, in addition to the JTAG interface pins, the RESET pin is
monitored by the debugger to be able to detect external reset sources. The debugger
can also pull the RESET pin low to reset the whole system, assuming only open collec-
tors on the reset line are used in the application.
1 Test-Logic-Reset
0 1 1 1
Run-Test/Idle Select-DR Scan Select-IR Scan
0 0
1 1
Capture-DR Capture-IR
0 0
Shift-DR 0 Shift-IR 0
1 1
1 1
Exit1-DR Exit1-IR
0 0
Pause-DR 0 Pause-IR 0
1 1
0 0
Exit2-DR Exit2-IR
1 1
Update-DR Update-IR
1 0 1 0
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TAP Controller The TAP controller is a 16-state finite state machine that controls the operation of the
Boundary-scan circuitry, JTAG programming circuitry, or On-chip Debug system. The
state transitions depicted in Figure 129 depend on the signal present on TMS (shown
adjacent to each state transition) at the time of the rising edge at TCK. The initial state
after a Power-on Reset is Test-Logic-Reset.
As a definition in this document, the LSB is shifted in and out first for all Shift Registers.
Assuming Run-Test/Idle is the present state, a typical scenario for using the JTAG inter-
face is:
• At the TMS input, apply the sequence 1, 1, 0, 0 at the rising edges of TCK to enter
the Shift Instruction Register – Shift-IR state. While in this state, shift the four bits of
the JTAG instructions into the JTAG Instruction Register from the TDI input at the
rising edge of TCK. The TMS input must be held low during input of the 3 LSBs in
order to remain in the Shift-IR state. The MSB of the instruction is shifted in when
this state is left by setting TMS high. While the instruction is shifted in from the TDI
pin, the captured IR-state 0x01 is shifted out on the TDO pin. The JTAG Instruction
selects a particular Data Register as path between TDI and TDO and controls the
circuitry surrounding the selected Data Register.
• Apply the TMS sequence 1, 1, 0 to re-enter the Run-Test/Idle state. The instruction
is latched onto the parallel output from the Shift Register path in the Update-IR
state. The Exit-IR, Pause-IR, and Exit2-IR states are only used for navigating the
state machine.
• At the TMS input, apply the sequence 1, 0, 0 at the rising edges of TCK to enter the
Shift Data Register – Shift-DR state. While in this state, upload the selected Data
Register (selected by the present JTAG instruction in the JTAG Instruction Register)
from the TDI input at the rising edge of TCK. In order to remain in the Shift-DR state,
the TMS input must be held low during input of all bits except the MSB. The MSB of
the data is shifted in when this state is left by setting TMS high. While the Data
Register is shifted in from the TDI pin, the parallel inputs to the Data Register
captured in the Capture-DR state is shifted out on the TDO pin.
• Apply the TMS sequence 1, 1, 0 to re-enter the Run-Test/Idle state. If the selected
Data Register has a latched parallel-output, the latching takes place in the Update-
DR state. The Exit-DR, Pause-DR, and Exit2-DR states are only used for navigating
the state machine.
As shown in the state diagram, the Run-Test/Idle state need not be entered between
selecting JTAG instruction and using Data Registers, and some JTAG instructions may
select certain functions to be performed in the Run-Test/Idle, making it unsuitable as an
Idle state.
Note: Independent of the initial state of the TAP Controller, the Test-Logic-Reset state can
always be entered by holding TMS high for five TCK clock periods.
For detailed information on the JTAG specification, refer to the literature listed in “Bibli-
ography” on page 306.
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Using the Boundary- A complete description of the Boundary-scan capabilities are given in the section “IEEE
scan Chain 1149.1 (JTAG) Boundary-scan” on page 308.
Using the On-chip Debug As shown in Figure 128, the hardware support for On-chip Debugging consists mainly of
System • A scan chain on the interface between the internal AVR CPU and the internal
peripheral units.
• Break Point unit.
• Communication interface between the CPU and JTAG system.
All read or modify/write operations needed for implementing the Debugger are done by
applying AVR instructions via the internal AVR CPU Scan Chain. The CPU sends the
result to an I/O memory mapped location which is part of the communication interface
between the CPU and the JTAG system.
The Break Point Unit implements Break on Change of Program Flow, Single Step
Break, two Program Memory Break Points, and two combined Break Points. Together,
the four Break Points can be configured as either:
• 4 single Program Memory Break Points.
• 3 Single Program Memory Break Point + 1 single Data Memory Break Point.
• 2 single Program Memory Break Points + 2 single Data Memory Break Points.
• 2 single Program Memory Break Points + 1 Program Memory Break Point with mask
(“range Break Point”).
• 2 single Program Memory Break Points + 1 Data Memory Break Point with mask
(“range Break Point”).
A debugger, like the AVR Studio, may however use one or more of these resources for
its internal purpose, leaving less flexibility to the end-user.
A list of the On-chip Debug specific JTAG instructions is given in “On-chip Debug Spe-
cific JTAG Instructions” on page 306.
The JTAGEN Fuse must be programmed to enable the JTAG Test Access Port. In addi-
tion, the OCDEN Fuse must be programmed and no Lock bits must be set for the On-
chip debug system to work. As a security feature, the On-chip debug system is disabled
when either of the LB1 or LB2 Lock bits are set. Otherwise, the On-chip debug system
would have provided a back-door into a secured device.
The AVR Studio enables the user to fully control execution of programs on an AVR
device with On-chip Debug capability, AVR In-Circuit Emulator, or the built-in AVR
Instruction Set Simulator. AVR Studio® supports source level execution of Assembly
programs assembled with Atmel Corporation’s AVR Assembler and C programs com-
piled with third party vendors’ compilers.
AVR Studio runs under Microsoft® Windows® 95/98/2000 and Microsoft Windows NT®.
For a full description of the AVR Studio, please refer to the AVR Studio User Guide.
Only highlights are presented in this document.
All necessary execution commands are available in AVR Studio, both on source level
and on disassembly level. The user can execute the program, single step through the
code either by tracing into or stepping over functions, step out of functions, place the
cursor on a statement and execute until the statement is reached, stop the execution,
and reset the execution target. In addition, the user can have an unlimited number of
code Break Points (using the BREAK instruction) and up to two data memory Break
Points, alternatively combined as a mask (range) Break Point.
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On-chip Debug Specific The On-chip debug support is considered being private JTAG instructions, and distrib-
JTAG Instructions uted within ATMEL and to selected third party vendors only. Instruction opcodes are
listed for reference.
PRIVATE0; 0x8 Private JTAG instruction for accessing On-chip debug system.
PRIVATE1; 0x9 Private JTAG instruction for accessing On-chip debug system.
PRIVATE2; 0xA Private JTAG instruction for accessing On-chip debug system.
PRIVATE3; 0xB Private JTAG instruction for accessing On-chip debug system.
Using the JTAG Programming of AVR parts via JTAG is performed via the 4-pin JTAG port, TCK, TMS,
Programming TDI, and TDO. These are the only pins that need to be controlled/observed to perform
Capabilities JTAG programming (in addition to power pins). It is not required to apply 12V externally.
The JTAGEN Fuse must be programmed and the JTD bit in the MCUCR Register must
be cleared to enable the JTAG Test Access Port.
The JTAG programming capability supports:
• Flash programming and verifying.
• EEPROM programming and verifying.
• Fuse programming and verifying.
• Lock bit programming and verifying.
The Lock bit security is exactly as in parallel programming mode. If the Lock bits LB1 or
LB2 are programmed, the OCDEN Fuse cannot be programmed unless first doing a
chip erase. This is a security feature that ensures no back-door exists for reading out the
content of a secured device.
The details on programming through the JTAG interface and programming specific
JTAG instructions are given in the section “Programming via the JTAG Interface” on
page 361.
Bibliography For more information about general Boundary-scan, the following literature can be
consulted:
• IEEE: IEEE Std. 1149.1-1990. IEEE Standard Test Access Port and Boundary-scan
Architecture, IEEE, 1993.
• Colin Maunder: The Board Designers Guide to Testable Logic Circuits, Addison-
Wesley, 1992.
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The OCDR Register provides a communication channel from the running program in the
microcontroller to the debugger. The CPU can transfer a byte to the debugger by writing
to this location. At the same time, an internal flag; I/O Debug Register Dirty – IDRD – is
set to indicate to the debugger that the register has been written. When the CPU reads
the OCDR Register the 7 LSB will be from the OCDR Register, while the MSB is the
IDRD bit. The debugger clears the IDRD bit when it has read the information.
In some AVR devices, this register is shared with a standard I/O location. In this case,
the OCDR Register can only be accessed if the OCDEN Fuse is programmed, and the
debugger enables access to the OCDR Register. In all other cases, the standard I/O
location is accessed.
Refer to the debugger documentation for further information on how to use this register.
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IEEE 1149.1 (JTAG)
Boundary-scan
System Overview The Boundary-scan chain has the capability of driving and observing the logic levels on
the digital I/O pins, as well as the boundary between digital and analog logic for analog
circuitry having off-chip connections. At system level, all ICs having JTAG capabilities
are connected serially by the TDI/TDO signals to form a long Shift Register. An external
controller sets up the devices to drive values at their output pins, and observe the input
values received from other devices. The controller compares the received data with the
expected result. In this way, Boundary-scan provides a mechanism for testing intercon-
nections and integrity of components on Printed Circuits Boards by using the four TAP
signals only.
The four IEEE 1149.1 defined mandatory JTAG instructions IDCODE, BYPASS, SAM-
PLE/PRELOAD, and EXTEST, as well as the AVR specific public JTAG instruction
AVR_RESET can be used for testing the Printed Circuit Board. Initial scanning of the
Data Register path will show the ID-Code of the device, since IDCODE is the default
JTAG instruction. It may be desirable to have the AVR device in reset during test mode.
If not reset, inputs to the device may be determined by the scan operations, and the
internal software may be in an undetermined state when exiting the test mode. Entering
reset, the outputs of any port pin will instantly enter the high impedance state, making
the HIGHZ instruction redundant. If needed, the BYPASS instruction can be issued to
make the shortest possible scan chain through the device. The device can be set in the
reset state either by pulling the external RESET pin low, or issuing the AVR_RESET
instruction with appropriate setting of the Reset Data Register.
The EXTEST instruction is used for sampling external pins and loading output pins with
data. The data from the output latch will be driven out on the pins as soon as the
EXTEST instruction is loaded into the JTAG IR-Register. Therefore, the SAMPLE/PRE-
LOAD should also be used for setting initial values to the scan ring, to avoid damaging
the board when issuing the EXTEST instruction for the first time. SAMPLE/PRELOAD
can also be used for taking a snapshot of the external pins during normal operation of
the part.
The JTAGEN Fuse must be programmed and the JTD bit in the I/O Register MCUCR
must be cleared to enable the JTAG Test Access Port.
When using the JTAG interface for Boundary-scan, using a JTAG TCK clock frequency
higher than the internal chip frequency is possible. The chip clock is not required to run.
Data Registers The Data Registers relevant for Boundary-scan operations are:
• Bypass Register
• Device Identification Register
• Reset Register
• Boundary-scan Chain
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Bypass Register The Bypass Register consists of a single Shift Register stage. When the Bypass Regis-
ter is selected as path between TDI and TDO, the register is reset to 0 when leaving the
Capture-DR controller state. The Bypass Register can be used to shorten the scan
chain on a system when the other devices are to be tested.
Device Identification Register Figure 130 shows the structure of the Device Identification Register.
MSB LSB
Bit 31 28 27 12 11 1 0
Version Version is a 4-bit number identifying the revision of the component. The JTAG version
number follows the revision of the device. Revision A is 0x0, revision B is 0x1 and so on.
Part Number The part number is a 16-bit code identifying the component. The JTAG Part Number for
ATmega640/1280/1281/2560/2561 is listed in Table 154 on page 345.
Manufacturer ID The Manufacturer ID is a 11-bit code identifying the manufacturer. The JTAG manufac-
turer ID for ATMEL is listed in Table 154 on page 345.
Reset Register The Reset Register is a test Data Register used to reset the part. Since the AVR tri-
states Port Pins when reset, the Reset Register can also replace the function of the
unimplemented optional JTAG instruction HIGHZ.
A high value in the Reset Register corresponds to pulling the external Reset low. The
part is reset as long as there is a high value present in the Reset Register. Depending
on the fuse settings for the clock options, the part will remain reset for a reset time-out
period (see “Clock Sources” on page 39) after releasing the Reset Register. The output
from this Data Register is not latched, so the reset will take place immediately, as shown
in Figure 131.
ClockDR · AVR_RESET
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Boundary-scan Chain The Boundary-scan Chain has the capability of driving and observing the logic levels on
the digital I/O pins, as well as the boundary between digital and analog logic for analog
circuitry having off-chip connections.
See “Boundary-scan Chain” on page 311 for a complete description.
Boundary-scan Specific The Instruction Register is 4-bit wide, supporting up to 16 instructions. Listed below are
JTAG Instructions the JTAG instructions useful for Boundary-scan operation. Note that the optional HIGHZ
instruction is not implemented, but all outputs with tri-state capability can be set in high-
impedant state by using the AVR_RESET instruction, since the initial state for all port
pins is tri-state.
As a definition in this datasheet, the LSB is shifted in and out first for all Shift Registers.
The OPCODE for each instruction is shown behind the instruction name in hex format.
The text describes which Data Register is selected as path between TDI and TDO for
each instruction.
EXTEST; 0x0 Mandatory JTAG instruction for selecting the Boundary-scan Chain as Data Register for
testing circuitry external to the AVR package. For port-pins, Pull-up Disable, Output
Control, Output Data, and Input Data are all accessible in the scan chain. For Analog cir-
cuits having off-chip connections, the interface between the analog and the digital logic
is in the scan chain. The contents of the latched outputs of the Boundary-scan chain is
driven out as soon as the JTAG IR-Register is loaded with the EXTEST instruction.
The active states are:
• Capture-DR: Data on the external pins are sampled into the Boundary-scan Chain.
• Shift-DR: The Internal Scan Chain is shifted by the TCK input.
• Update-DR: Data from the scan chain is applied to output pins.
IDCODE; 0x1 Optional JTAG instruction selecting the 32 bit ID-Register as Data Register. The ID-
Register consists of a version number, a device number and the manufacturer code
chosen by JEDEC. This is the default instruction after power-up.
The active states are:
• Capture-DR: Data in the IDCODE Register is sampled into the Boundary-scan
Chain.
• Shift-DR: The IDCODE scan chain is shifted by the TCK input.
SAMPLE_PRELOAD; 0x2 Mandatory JTAG instruction for pre-loading the output latches and taking a snap-shot of
the input/output pins without affecting the system operation. However, the output latches
are not connected to the pins. The Boundary-scan Chain is selected as Data Register.
The active states are:
• Capture-DR: Data on the external pins are sampled into the Boundary-scan Chain.
• Shift-DR: The Boundary-scan Chain is shifted by the TCK input.
• Update-DR: Data from the Boundary-scan chain is applied to the output latches.
However, the output latches are not connected to the pins.
AVR_RESET; 0xC The AVR specific public JTAG instruction for forcing the AVR device into the Reset
mode or releasing the JTAG reset source. The TAP controller is not reset by this instruc-
tion. The one bit Reset Register is selected as Data Register. Note that the reset will be
active as long as there is a logic “one” in the Reset Chain. The output from this chain is
not latched.
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BYPASS; 0xF Mandatory JTAG instruction selecting the Bypass Register for Data Register.
The active states are:
• Capture-DR: Loads a logic “0” into the Bypass Register.
• Shift-DR: The Bypass Register cell between TDI and TDO is shifted.
Boundary-scan Chain The Boundary-scan chain has the capability of driving and observing the logic levels on
the digital I/O pins, as well as the boundary between digital and analog logic for analog
circuitry having off-chip connection.
Scanning the Digital Port Pins Figure 132 shows the Boundary-scan Cell for a bi-directional port pin. The pull-up func-
tion is disabled during Boundary-scan when the JTAG IC contains EXTEST or
SAMPLE_PRELOAD. The cell consists of a bi-directional pin cell that combines the
three signals Output Control - OCxn, Output Data - ODxn, and Input Data - IDxn, into
only a two-stage Shift Register. The port and pin indexes are not used in the following
description
The Boundary-scan logic is not included in the figures in the datasheet. Figure 133
shows a simple digital port pin as described in the section “I/O-Ports” on page 83. The
Boundary-scan details from Figure 132 replaces the dashed box in Figure 133.
When no alternate port function is present, the Input Data - ID - corresponds to the
PINxn Register value (but ID has no synchronizer), Output Data corresponds to the
PORT Register, Output Control corresponds to the Data Direction - DD Register, and
the Pull-up Enable - PUExn - corresponds to logic expression PUD · DDxn · PORTxn.
Digital alternate port functions are connected outside the dotted box in Figure 133 to
make the scan chain read the actual pin value. For analog function, there is a direct con-
nection from the external pin to the analog circuit. There is no scan chain on the
interface between the digital and the analog circuitry, but some digital control signal to
analog circuitry are turned off to avoid driving contention on the pads.
When JTAG IR contains EXTEST or SAMPLE_PRELOAD the clock is not sent out on
the port pins even if the CKOUT fuse is programmed. Even though the clock is output
when the JTAG IR contains SAMPLE_PRELOAD, the clock is not sampled by the
boundary scan.
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Figure 132. Boundary-scan Cell for Bi-directional Port Pin with Pull-up Function.
ShiftDR To Next Cell EXTEST Vcc
FF1 LD1 0
0
D Q D Q 1
1
G
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PUExn PUD
Q D
DDxn
Q CLR
WDx
RESET
OCxn
RDx
DATA BUS
Pxn Q D
ODxn PORTxn
Q CLR
IDxn WRx
RESET
SLEEP RRx
SYNCHRONIZER
RPx
D Q D Q
PINxn
L Q Q
CLK I/O
Scanning the RESET Pin The RESET pin accepts 5V active low logic for standard reset operation, and 12V active
high logic for High Voltage Parallel programming. An observe-only cell as shown in Fig-
ure 134 is inserted for the 5V reset signal.
FF1
0
D Q
1
From ClockDR
Previous
Cell
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Boundary-scan Related
Register in I/O Memory
MCUCR – MCU Control The MCU Control Register contains control bits for general MCU functions.
Register
Bit 7 6 5 4 3 2 1 0
0x35 (0x55) JTD – – PUD – – IVSEL IVCE MCUCR
Read/Write R/W R R R/W R R R/W R/W
Initial Value 0 0 0 0 0 0 0 0
MCUSR – MCU Status The MCU Status Register provides information on which reset source caused an MCU
Register reset.
Bit 7 6 5 4 3 2 1 0
0x34 (0x54) – – – JTRF WDRF BORF EXTRF PORF MCUSR
Read/Write R R R R/W R/W R/W R/W R/W
Initial Value 0 0 0 See Bit Description
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ATmega640/1280/1281/25 Table 132 shows the Scan order between TDI and TDO when the Boundary-scan chain
60/2561 Boundary-scan is selected as data path. Bit 0 is the LSB; the first bit scanned in, and the first bit
Order scanned out. The scan order follows the pin-out order as far as possible. Therefore, the
bits of Port A and Port K is scanned in the opposite bit order of the other ports. Excep-
tions from the rules are the Scan chains for the analog circuits, which constitute the
most significant bits of the scan chain regardless of which physical pin they are con-
nected to. In Figure 132, PXn. Data corresponds to FF0, PXn. Control corresponds to
FF1, PXn. Bit 4, 5, 6 and 7 of Port F is not in the scan chain, since these pins constitute
the TAP pins when the JTAG is enabled.
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Table 132. ATmega640/1280/2560 Boundary-scan Order (Continued)
Bit Number Signal Name Module
140 PH3.Data
139 PH3.Control
138 PH4.Data
137 PH4.Control
136 PH5.Data
135 PH5.Control
134 PH6.Data
133 PH6.Control
132 PB0.Data Port B
131 PB0.Control
130 PB1.Data
129 PB1.Control
128 PB2.Data
127 PB2.Control
126 PB3.Data
125 PB3.Control
124 PB4.Data
123 PB4.Control
122 PB5.Data
121 PB5.Control
120 PB6.Data
119 PB6.Control
118 PB7.Data
117 PB7.Control
116 PH7.Data Port H
115 PH7.Control
114 PG3.Data Port G
113 PG3.Control
112 PG4.Data
111 PG4.Control
110 RSTT Reset Logic (Observe Only)
109 PL0.Data Port L
108 PL0.Control
107 PL1.Data
106 PL1.Control
105 PL2.Data
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Table 132. ATmega640/1280/2560 Boundary-scan Order (Continued)
Bit Number Signal Name Module
68 PC2.Control
67 PC3.Data
66 PC3.Control
65 PC4.Data
64 PC4.Control
63 PC5.Data
62 PC5.Control
61 PC6.Data
60 PC6.Control
59 PC7.Data
58 PC7.Control
57 PJ0.Data Port J
56 PJ0.Control
55 PJ1.Data
54 PJ1.Control
53 PJ2.Data
52 PJ2.Control
51 PJ3.Data
50 PJ3.Control
49 PJ4.Data
48 PJ4.Control
47 PJ5.Data
46 PJ5.Control
45 PJ6.Data
44 PJ6.Control
43 PG2.Data Port G
42 PG2.Control
41 PA7.Data Port A
40 PA7.Control
39 PA6.Data
38 PA6.Control
37 PA5.Data
36 PA5.Control
35 PA4.Data
34 PA4.Control
33 PA3.Data
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Table 133. ATmega1281/2561 Boundary-scan Order
Bit Number Signal Name Module
100 PG5.Data Port G
99 PG5.Control
98 PE0.Data Port E
97 PE0.Control
96 PE1.Data
95 PE1.Control
94 PE2.Data
93 PE2.Control
92 PE3.Data
91 PE3.Control
90 PE4.Data
89 PE4.Control
88 PE5.Data
87 PE5.Control
86 PE6.Data
85 PE6.Control
84 PE7.Data
83 PE7.Control
82 PB0.Data Port B
81 PB0.Control
80 PB1.Data
79 PB1.Control
78 PB2.Data
77 PB2.Control
76 PB3.Data
75 PB3.Control
74 PB4.Data
73 PB4.Control
72 PB5.Data
71 PB5.Control
70 PB6.Data
69 PB6.Control
68 PB7.Data
67 PB7.Control
66 PG3.Data Port G
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Table 133. ATmega1281/2561 Boundary-scan Order (Continued)
Bit Number Signal Name Module
29 PC6.Data
28 PC6.Control
27 PC7.Data
26 PC7.Control
25 PG2.Data Port G
24 PG2.Control
23 PA7.Data Port A
22 PA7.Control
21 PA6.Data
20 PA6.Control
19 PA5.Data
18 PA5.Control
17 PA4.Data
16 PA4.Control
15 PA3.Data
14 PA3.Control
13 PA2.Data
12 PA2.Control
11 PA1.Data
10 PA1.Control
9 PA0.Data
8 PA0.Control
7 PF3.Data Port F
6 PF3.Control
5 PF2.Data
4 PF2.Control
3 PF1.Data
2 PF1.Control
1 PF0.Data
0 PF0.Control
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Application and Boot The Flash memory is organized in two main sections, the Application section and the
Loader Flash Sections Boot Loader section (see Figure 136). The size of the different sections is configured by
the BOOTSZ Fuses as shown in Table 140 on page 335 and Figure 136. These two
sections can have different level of protection since they have different sets of Lock bits.
Application Section The Application section is the section of the Flash that is used for storing the application
code. The protection level for the Application section can be selected by the application
Boot Lock bits (Boot Lock bits 0), see Table 135 on page 327. The Application section
can never store any Boot Loader code since the SPM instruction is disabled when exe-
cuted from the Application section.
BLS – Boot Loader Section While the Application section is used for storing the application code, the The Boot
Loader software must be located in the BLS since the SPM instruction can initiate a pro-
gramming when executing from the BLS only. The SPM instruction can access the
entire Flash, including the BLS itself. The protection level for the Boot Loader section
can be selected by the Boot Loader Lock bits (Boot Lock bits 1), see Table 136 on page
327.
Read-While-Write and No Whether the CPU supports Read-While-Write or if the CPU is halted during a Boot
Read-While-Write Flash Loader software update is dependent on which address that is being programmed. In
Sections addition to the two sections that are configurable by the BOOTSZ Fuses as described
above, the Flash is also divided into two fixed sections, the Read-While-Write (RWW)
section and the No Read-While-Write (NRWW) section. The limit between the RWW-
and NRWW sections is given in Table 134 and Figure 135 on page 325. The main differ-
ence between the two sections is:
• When erasing or writing a page located inside the RWW section, the NRWW section
can be read during the operation.
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• When erasing or writing a page located inside the NRWW section, the CPU is halted
during the entire operation.
Note that the user software can never read any code that is located inside the RWW
section during a Boot Loader software operation. The syntax “Read-While-Write sec-
tion” refers to which section that is being programmed (erased or written), not which
section that actually is being read during a Boot Loader software update.
RWW – Read-While-Write If a Boot Loader software update is programming a page inside the RWW section, it is
Section possible to read code from the Flash, but only code that is located in the NRWW sec-
tion. During an on-going programming, the software must ensure that the RWW section
never is being read. If the user software is trying to read code that is located inside the
RWW section (i.e., by load program memory, call, or jump instructions or an interrupt)
during programming, the software might end up in an unknown state. To avoid this, the
interrupts should either be disabled or moved to the Boot Loader section. The Boot
Loader section is always located in the NRWW section. The RWW Section Busy bit
(RWWSB) in the Store Program Memory Control and Status Register (SPMCSR) will be
read as logical one as long as the RWW section is blocked for reading. After a program-
ming is completed, the RWWSB must be cleared by software before reading code
located in the RWW section. See “SPMCSR – Store Program Memory Control and Sta-
tus Register” on page 340. for details on how to clear RWWSB.
NRWW – No Read-While-Write The code located in the NRWW section can be read when the Boot Loader software is
Section updating a page in the RWW section. When the Boot Loader code updates the NRWW
section, the CPU is halted during the entire Page Erase or Page Write operation.
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ATmega640/1280/1281/2560/2561
Read-While-Write
(RWW) Section
Z-pointer
Addresses NRWW
Z-pointer Section
Addresses RWW No Read-While-Write
Section (NRWW) Section
CPU is Halted
During the Operation
Code Located in
NRWW Section
Can be Read During
the Operation
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Figure 136. Memory Sections
Program Memory Program Memory
BOOTSZ = '11' BOOTSZ = '10'
0x0000 0x0000
Read-While-Write Section
Read-While-Write Section
Application Flash Section Application Flash Section
No Read-While-Write Section
No Read-While-Write Section
End RWW End RWW
Start NRWW Start NRWW
End Application
End Application Start Boot Loader
Start Boot Loader Boot Loader Flash Section
Boot Loader Flash Section
Flashend Flashend
Read-While-Write Section
Application Flash Section Application Flash Section
No Read-While-Write Section
End RWW
Start NRWW Start NRWW, Start Boot Loader
Application Flash Section
End Application
Boot Loader Flash Section
Start Boot Loader
Boot Loader Flash Section
Flashend Flashend
Note: 1. The parameters in the figure above are given in Table 140 on page 335.
Boot Loader Lock Bits If no Boot Loader capability is needed, the entire Flash is available for application code.
The Boot Loader has two separate sets of Boot Lock bits which can be set indepen-
dently. This gives the user a unique flexibility to select different levels of protection.
The user can select:
• To protect the entire Flash from a software update by the MCU.
• To protect only the Boot Loader Flash section from a software update by the MCU.
• To protect only the Application Flash section from a software update by the MCU.
• Allow software update in the entire Flash.
See Table 135 and Table 136 for further details. The Boot Lock bits can be set in soft-
ware and in Serial or Parallel Programming mode, but they can be cleared by a Chip
Erase command only. The general Write Lock (Lock Bit mode 2) does not control the
programming of the Flash memory by SPM instruction. Similarly, the general
Read/Write Lock (Lock Bit mode 1) does not control reading nor writing by
(E)LPM/SPM, if it is attempted.
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Table 136. Boot Lock Bit1 Protection Modes (Boot Loader Section)(1)
BLB1 Mode BLB12 BLB11 Protection
1 1 1 No restrictions for SPM or (E)LPM accessing the Boot
Loader section.
2 1 0 SPM is not allowed to write to the Boot Loader section.
3 0 0 SPM is not allowed to write to the Boot Loader section,
and (E)LPM executing from the Application section is not
allowed to read from the Boot Loader section. If Interrupt
Vectors are placed in the Application section, interrupts
are disabled while executing from the Boot Loader section.
4 0 1 (E)LPM executing from the Application section is not
allowed to read from the Boot Loader section. If Interrupt
Vectors are placed in the Application section, interrupts
are disabled while executing from the Boot Loader section.
Entering the Boot Loader Entering the Boot Loader takes place by a jump or call from the application program.
Program This may be initiated by a trigger such as a command received via USART, or SPI inter-
face. Alternatively, the Boot Reset Fuse can be programmed so that the Reset Vector is
pointing to the Boot Flash start address after a reset. In this case, the Boot Loader is
started after a reset. After the application code is loaded, the program can start execut-
ing the application code. Note that the fuses cannot be changed by the MCU itself. This
means that once the Boot Reset Fuse is programmed, the Reset Vector will always
point to the Boot Loader Reset and the fuse can only be changed through the serial or
parallel programming interface.
Table 137. Boot Reset Fuse(1)
BOOTRST Reset Address
1 Reset Vector = Application Reset (address 0x0000)
0 Reset Vector = Boot Loader Reset (see Table 140 on page 335)
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Addressing the Flash The Z-pointer is used to address the SPM commands. The Z pointer consists of the Z-
During Self- registers ZL and ZH in the register file, and RAMPZ in the I/O space. The number of bits
Programming actually used is implementation dependent. Note that the RAMPZ register is only imple-
mented when the program space is larger than 64K bytes.
Bit 23 22 21 20 19 18 17 16
15 14 13 12 11 10 9 8
RAMPZ RAMPZ7 RAMPZ6 RAMPZ5 RAMPZ4 RAMPZ3 RAMPZ2 RAMPZ1 RAMPZ0
ZH (R31) Z15 Z14 Z13 Z12 Z11 Z10 Z9 Z8
ZL (R30) Z7 Z6 Z5 Z4 Z3 Z2 Z1 Z0
7 6 5 4 3 2 1 0
Since the Flash is organized in pages (see Table 155 on page 345), the Program
Counter can be treated as having two different sections. One section, consisting of the
least significant bits, is addressing the words within a page, while the most significant
bits are addressing the pages. This is shown in Figure 137. Note that the Page Erase
and Page Write operations are addressed independently. Therefore it is of major impor-
tance that the Boot Loader software addresses the same page in both the Page Erase
and Page Write operation. Once a programming operation is initiated, the address is
latched and the Z-pointer can be used for other operations.
The (E)LPM instruction use the Z-pointer to store the address. Since this instruction
addresses the Flash byte-by-byte, also bit Z0 of the Z-pointer is used.
PCMSB PAGEMSB
PROGRAM
PCPAGE PCWORD
COUNTER
01
02
PAGEEND
Note: 1. The different variables used in Figure 137 are listed in Table 142 on page 335.
Self-Programming the The program memory is updated in a page by page fashion. Before programming a
Flash page with the data stored in the temporary page buffer, the page must be erased. The
temporary page buffer is filled one word at a time using SPM and the buffer can be filled
either before the Page Erase command or between a Page Erase and a Page Write
operation:
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Performing Page Erase by To execute Page Erase, set up the address in the Z-pointer, write “X0000011” to
SPM SPMCSR and execute SPM within four clock cycles after writing SPMCSR. The data in
R1 and R0 is ignored. The page address must be written to PCPAGE in the Z-register.
Other bits in the Z-pointer will be ignored during this operation.
• Page Erase to the RWW section: The NRWW section can be read during the Page
Erase.
• Page Erase to the NRWW section: The CPU is halted during the operation.
Filling the Temporary Buffer To write an instruction word, set up the address in the Z-pointer and data in R1:R0, write
(Page Loading) “00000001” to SPMCSR and execute SPM within four clock cycles after writing
SPMCSR. The content of PCWORD in the Z-register is used to address the data in the
temporary buffer. The temporary buffer will auto-erase after a Page Write operation or
by writing the RWWSRE bit in SPMCSR. It is also erased after a system reset. Note that
it is not possible to write more than one time to each address without erasing the tempo-
rary buffer.
If the EEPROM is written in the middle of an SPM Page Load operation, all data loaded
is still buffered.
Performing a Page Write To execute Page Write, set up the address in the Z-pointer, write “X0000101” to
SPMCSR and execute SPM within four clock cycles after writing SPMCSR. The data in
R1 and R0 is ignored. The page address must be written to PCPAGE. Other bits in the
Z-pointer must be written to zero during this operation.
• Page Write to the RWW section: The NRWW section can be read during the Page
Write.
• Page Write to the NRWW section: The CPU is halted during the operation.
Using the SPM Interrupt If the SPM interrupt is enabled, the SPM interrupt will generate a constant interrupt
when the SPMEN bit in SPMCSR is cleared. This means that the interrupt can be used
instead of polling the SPMCSR Register in software. When using the SPM interrupt, the
Interrupt Vectors should be moved to the BLS section to avoid that an interrupt is
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accessing the RWW section when it is blocked for reading. How to move the interrupts
is described in “Interrupts” on page 69.
Consideration While Updating Special care must be taken if the user allows the Boot Loader section to be updated by
BLS leaving Boot Lock bit11 unprogrammed. An accidental write to the Boot Loader itself can
corrupt the entire Boot Loader, and further software updates might be impossible. If it is
not necessary to change the Boot Loader software itself, it is recommended to program
the Boot Lock bit11 to protect the Boot Loader software from any internal software
changes.
Prevent Reading the RWW During Self-Programming (either Page Erase or Page Write), the RWW section is
Section During Self- always blocked for reading. The user software itself must prevent that this section is
Programming addressed during the self programming operation. The RWWSB in the SPMCSR will be
set as long as the RWW section is busy. During Self-Programming the Interrupt Vector
table should be moved to the BLS as described in “Interrupts” on page 69, or the inter-
rupts must be disabled. Before addressing the RWW section after the programming is
completed, the user software must clear the RWWSB by writing the RWWSRE. See
“Simple Assembly Code Example for a Boot Loader” on page 333 for an example.
Setting the Boot Loader Lock To set the Boot Loader Lock bits and general Lock bits, write the desired data to R0,
Bits by SPM write “X0001001” to SPMCSR and execute SPM within four clock cycles after writing
SPMCSR.
Bit 7 6 5 4 3 2 1 0
R0 1 1 BLB12 BLB11 BLB02 BLB01 LB2 LB1
See Table 135 and Table 136 for how the different settings of the Boot Loader bits affect
the Flash access.
If bits 5:0 in R0 are cleared (zero), the corresponding Lock bit will be programmed if an
SPM instruction is executed within four cycles after BLBSET and SPMEN are set in
SPMCSR. The Z-pointer is don’t care during this operation, but for future compatibility it
is recommended to load the Z-pointer with 0x0001 (same as used for reading the lOck
bits). For future compatibility it is also recommended to set bits 7 and 6 in R0 to “1” when
writing the Lock bits. When programming the Lock bits the entire Flash can be read dur-
ing the operation.
EEPROM Write Prevents Note that an EEPROM write operation will block all software programming to Flash.
Writing to SPMCSR Reading the Fuses and Lock bits from software will also be prevented during the
EEPROM write operation. It is recommended that the user checks the status bit (EEPE)
in the EECR Register and verifies that the bit is cleared before writing to the SPMCSR
Register.
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Reading the Fuse and Lock It is possible to read both the Fuse and Lock bits from software. To read the Lock bits,
Bits from Software load the Z-pointer with 0x0001 and set the BLBSET and SPMEN bits in SPMCSR.
When an (E)LPM instruction is executed within three CPU cycles after the BLBSET and
SPMEN bits are set in SPMCSR, the value of the Lock bits will be loaded in the destina-
tion register. The BLBSET and SPMEN bits will auto-clear upon completion of reading
the Lock bits or if no (E)LPM instruction is executed within three CPU cycles or no SPM
instruction is executed within four CPU cycles. When BLBSET and SPMEN are cleared,
(E)LPM will work as described in the Instruction set Manual.
Bit 7 6 5 4 3 2 1 0
Rd – – BLB12 BLB11 BLB02 BLB01 LB2 LB1
The algorithm for reading the Fuse Low byte is similar to the one described above for
reading the Lock bits. To read the Fuse Low byte, load the Z-pointer with 0x0000 and
set the BLBSET and SPMEN bits in SPMCSR. When an (E)LPM instruction is executed
within three cycles after the BLBSET and SPMEN bits are set in the SPMCSR, the value
of the Fuse Low byte (FLB) will be loaded in the destination register as shown below.
Refer to Table 153 on page 344 for a detailed description and mapping of the Fuse Low
byte.
Bit 7 6 5 4 3 2 1 0
Rd FLB7 FLB6 FLB5 FLB4 FLB3 FLB2 FLB1 FLB0
Similarly, when reading the Fuse High byte, load 0x0003 in the Z-pointer. When an
(E)LPM instruction is executed within three cycles after the BLBSET and SPMEN bits
are set in the SPMCSR, the value of the Fuse High byte (FHB) will be loaded in the des-
tination register as shown below. Refer to Table 152 on page 344 for detailed
description and mapping of the Fuse High byte.
Bit 7 6 5 4 3 2 1 0
Rd FHB7 FHB6 FHB5 FHB4 FHB3 FHB2 FHB1 FHB0
When reading the Extended Fuse byte, load 0x0002 in the Z-pointer. When an (E)LPM
instruction is executed within three cycles after the BLBSET and SPMEN bits are set in
the SPMCSR, the value of the Extended Fuse byte (EFB) will be loaded in the destina-
tion register as shown below. Refer to Table 151 on page 343 for detailed description
and mapping of the Extended Fuse byte.
Bit 7 6 5 4 3 2 1 0
Rd – – – – – EFB2 EFB1 EFB0
Fuse and Lock bits that are programmed, will be read as zero. Fuse and Lock bits that
are unprogrammed, will be read as one.
Reading the Signature Row To read the Signature Row from software, load the Z-pointer with the signature byte
from Software address given in Table 138 on page 332 and set the SIGRD and SPMEN bits in
SPMCSR. When an LPM instruction is executed within three CPU cycles after the
SIGRD and SPMEN bits are set in SPMCSR, the signature byte value will be loaded in
the destination register. The SIGRD and SPMEN bits will auto-clear upon completion of
reading the Signature Row Lock bits or if no LPM instruction is executed within three
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CPU cycles. When SIGRD and SPMEN are cleared, LPM will work as described in the
Instruction set Manual.
Preventing Flash Corruption During periods of low VCC, the Flash program can be corrupted because the supply volt-
age is too low for the CPU and the Flash to operate properly. These issues are the same
as for board level systems using the Flash, and the same design solutions should be
applied.
A Flash program corruption can be caused by two situations when the voltage is too low.
First, a regular write sequence to the Flash requires a minimum voltage to operate cor-
rectly. Secondly, the CPU itself can execute instructions incorrectly, if the supply voltage
for executing instructions is too low.
Flash corruption can easily be avoided by following these design recommendations (one
is sufficient):
1. If there is no need for a Boot Loader update in the system, program the Boot
Loader Lock bits to prevent any Boot Loader software updates.
2. Keep the AVR RESET active (low) during periods of insufficient power supply
voltage. This can be done by enabling the internal Brown-out Detector (BOD) if
the operating voltage matches the detection level. If not, an external low VCC
reset protection circuit can be used. If a reset occurs while a write operation is in
progress, the write operation will be completed provided that the power supply
voltage is sufficient.
3. Keep the AVR core in Power-down sleep mode during periods of low VCC. This
will prevent the CPU from attempting to decode and execute instructions, effec-
tively protecting the SPMCSR Register and thus the Flash from unintentional
writes.
Programming Time for Flash The calibrated RC Oscillator is used to time Flash accesses. Table 139 shows the typi-
when Using SPM cal programming time for Flash accesses from the CPU.
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Simple Assembly Code ;-the routine writes one page of data from RAM to Flash
Example for a Boot Loader ; the first data location in RAM is pointed to by the Y pointer
; the first data location in Flash is pointed to by the Z-pointer
;-error handling is not included
;-the routine must be placed inside the Boot space
; (at least the Do_spm sub routine). Only code inside NRWW section
can
; be read during Self-Programming (Page Erase and Page Write).
;-registers used: r0, r1, temp1 (r16), temp2 (r17), looplo (r24),
; loophi (r25), spmcrval (r20)
; storing and restoring of registers is not included in the routine
; register usage can be optimized at the expense of code size
;-It is assumed that either the interrupt table is moved to the
Boot
; loader section or that the interrupts are disabled.
.equ PAGESIZEB = PAGESIZE*2 ;PAGESIZEB is page size in BYTES, not
words
.org SMALLBOOTSTART
Write_page:
; Page Erase
ldi spmcrval, (1<<PGERS) | (1<<SPMEN)
call Do_spm
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sbiw loophi:looplo, 1 ;use subi for PAGESIZEB<=256
brne Rdloop
Do_spm:
; check for previous SPM complete
Wait_spm:
in temp1, SPMCSR
sbrc temp1, SPMEN
rjmp Wait_spm
; input: spmcrval determines SPM action
; disable interrupts if enabled, store status
in temp2, SREG
cli
; check that no EEPROM write access is present
Wait_ee:
sbic EECR, EEPE
rjmp Wait_ee
; SPM timed sequence
out SPMCSR, spmcrval
spm
; restore SREG (to enable interrupts if originally enabled)
out SREG, temp2
ret
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ATmega640 Boot Loader In Table 140 through Table 142, the parameters used in the description of the Self-Pro-
Parameters gramming are given.
Flash Section
Boot Loader
Appli-cation
BOOTSZ1
BOOTSZ0
Boot Size
Section)
Section
Pages
512 0x0000 - 0x7E00 -
1 1 4 0x7DFF 0x7E00
words 0x7DFF 0x7FFF
1024 0x0000 - 0x7C00 -
1 0 8 0x7BFF 0x7C00
words 0x7BFF 0x7FFF
2048 0x0000 - 0x7800 -
0 1 16 0x77FF 0x7800
words 0x77FF 0x7FFF
4096 0x0000 - 0x7000 -
0 0 32 0x6FFF 0x7000
words 0x6FFF 0x7FFF
Note: 1. The different BOOTSZ Fuse configurations are shown in Figure 136.
Note: 1. For details about these two section, see “NRWW – No Read-While-Write Section” on
page 324 and “RWW – Read-While-Write Section” on page 324.
Table 142. Explanation of different variables used in Figure 137 and the mapping to the
Z-pointer, ATmega640
Corresponding
Variable Z-value(2) Description(1)
PCMSB 14 Most significant bit in the Program
Counter. (The Program Counter is 15 bits
PC[14:0])
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Table 142. Explanation of different variables used in Figure 137 and the mapping to the
Z-pointer, ATmega640
Corresponding
Variable Z-value(2) Description(1)
PAGEMSB 6 Most significant bit which is used to
address the words within one page (128
words in a page requires seven bits PC
[6:0]).
ZPCMSB Z15 Bit in Z-pointer that is mapped to PCMSB.
Because Z0 is not used, the ZPCMSB
equals PCMSB + 1.
ZPAGEMS Z7 Bit in Z-pointer that is mapped to PCMSB.
B Because Z0 is not used, the ZPAGEMSB
equals PAGEMSB + 1.
PCPAGE PC[14:7] Z15:Z8 Program Counter page address: Page
select, for Page Erase and Page Write
PCWORD PC[6:0] Z7:Z1 Program Counter word address: Word
select, for filling temporary buffer (must be
zero during Page Write operation)
Notes: 1. Z0: should be zero for all SPM commands, byte select for the (E)LPM instruction.
2. See “Addressing the Flash During Self-Programming” on page 328 for details about
the use of Z-pointer during Self-Programming.
ATmega1280/1281 Boot In Table 143 through Table 144, the parameters used in the description of the Self-Pro-
Loader Parameters gramming are given.
Flash Section
Boot Loader
Appli-cation
BOOTSZ1
BOOTSZ0
Boot Size
Section)
Section
Pages
Note: 1. The different BOOTSZ Fuse configurations are shown in Figure 136.
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Note: 1. For details about these two section, see “NRWW – No Read-While-Write Section” on
page 324 and “RWW – Read-While-Write Section” on page 324.
Table 145. Explanation of different variables used in Figure 137 and the mapping to the
Z-pointer, ATmega1280/1281
Corresponding
Variable Z-value(2) Description(1)
PCMSB 15 Most significant bit in the Program Counter.
(The Program Counter is 16 bits PC[15:0])
PAGEMSB 6 Most significant bit which is used to address the
words within one page (128 words in a page
requires seven bits PC [6:0]).
ZPCMSB Z16(3) Bit in Z-pointer that is mapped to PCMSB.
Because Z0 is not used, the ZPCMSB equals
PCMSB + 1.
ZPAGEMSB Z7 Bit in Z-pointer that is mapped to PCMSB.
Because Z0 is not used, the ZPAGEMSB
equals PAGEMSB + 1.
PCPAGE PC[15:7] Z16(3):Z8 Program Counter page address: Page select,
for Page Erase and Page Write
PCWORD PC[6:0] Z7:Z1 Program Counter word address: Word select,
for filling temporary buffer (must be zero during
Page Write operation)
Notes: 1. Z0: should be zero for all SPM commands, byte select for the (E)LPM instruction.
2. See “Addressing the Flash During Self-Programming” on page 328 for details about
the use of Z-pointer during Self-Programming.
3. The Z-register is only 16 bits wide. Bit 16 is located in the RAMPZ register in the I/O
map.
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ATmega2560/2561 Boot In Table 146 through Table 148, the parameters used in the description of the Self-Pro-
Loader Parameters gramming are given.
Flash Section
Boot Loader
Appli-cation
BOOTSZ1
BOOTSZ0
Boot Size
Section)
Section
Pages
512 0x00000 - 0x1FE00 -
1 1 4 0x1FDFF 0x1FE00
words 0x1FDFF 0x1FFFF
1024 0x00000 - 0x1FC00 -
1 0 8 0x1FBFF 0x1FC00
words 0x1FBFF 0x1FFFF
2048 0x00000 - 0x1F800 -
0 1 16 0x1F7FF 0x1F800
words 0x1F7FF 0x1FFFF
4096 0x00000 - 0x1F000 -
0 0 32 0x1EFFF 0x1F000
words 0x1EFFF 0x1FFFF
Note: 1. The different BOOTSZ Fuse configurations are shown in Figure 136.
Note: 1. For details about these two section, see “NRWW – No Read-While-Write Section” on
page 324 and “RWW – Read-While-Write Section” on page 324.
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Table 148. Explanation of different variables used in Figure 137 and the mapping to the
Z-pointer, ATmega2560/2561
Corresponding
Variable Z-value(2) Description(1)
PCMSB 16 Most significant bit in the Program Counter.
(The Program Counter is 17 bits PC[16:0])
PAGEMSB 6 Most significant bit which is used to address the
words within one page (128 words in a page
requires seven bits PC [6:0]).
ZPCMSB Z17:Z16(3) Bit in Z-pointer that is mapped to PCMSB.
Because Z0 is not used, the ZPCMSB equals
PCMSB + 1.
ZPAGEMSB Z7 Bit in Z-pointer that is mapped to PCMSB.
Because Z0 is not used, the ZPAGEMSB
equals PAGEMSB + 1.
PCPAGE PC[16:7] Z17(3):Z8 Program Counter page address: Page select,
for Page Erase and Page Write
PCWORD PC[6:0] Z7:Z1 Program Counter word address: Word select,
for filling temporary buffer (must be zero during
Page Write operation)
Notes: 1. Z0: should be zero for all SPM commands, byte select for the (E)LPM instruction.
2. See “Addressing the Flash During Self-Programming” on page 328 for details about
the use of Z-pointer during Self-Programming.
3. The Z-register is only 16 bits wide. Bit 16 is located in the RAMPZ register in the I/O
map.
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Register Description
SPMCSR – Store Program The Store Program Memory Control and Status Register contains the control bits
Memory Control and Status needed to control the Boot Loader operations.
Register
Bit 7 6 5 4 3 2 1 0
0x37 (0x57) SPMIE RWWSB SIGRD RWWSRE BLBSET PGWRT PGERS SPMEN SPMCSR
Read/Write R/W R R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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Memory
Programming
Program And Data The ATmega640/1280/1281/2560/2561 provides six Lock bits which can be left unpro-
Memory Lock Bits grammed (“1”) or can be programmed (“0”) to obtain the additional features listed in
Table 150. The Lock bits can only be erased to “1” with the Chip Erase command.
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Fuse Bits The ATmega640/1280/1281/2560/2561 has three Fuse bytes. Table 151 - Table 153
describe briefly the functionality of all the fuses and how they are mapped into the Fuse
bytes. Note that the fuses are read as logical zero, “0”, if they are programmed.
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Table 152. Fuse High Byte
Fuse High Byte Bit No Description Default Value
1 (unprogrammed, OCD
OCDEN(4) 7
Enable OCD disabled)
0 (programmed, JTAG
JTAGEN 6
Enable JTAG enabled)
Enable Serial Program and Data 0 (programmed, SPI prog.
SPIEN(1) 5
Downloading enabled)
WDTON(3) 4 Watchdog Timer always on 1 (unprogrammed)
EEPROM memory is preserved 1 (unprogrammed,
EESAVE 3
through the Chip Erase EEPROM not preserved)
Select Boot Size (see Table 157
BOOTSZ1 2
for details) 0 (programmed)(2)
Select Boot Size (see Table 157
BOOTSZ0 1
for details) 0 (programmed)(2)
BOOTRST 0 Select Reset Vector 1 (unprogrammed)
Note: 1. The SPIEN Fuse is not accessible in serial programming mode.
2. The default value of BOOTSZ1:0 results in maximum Boot Size. See Table 140 on
page 335 for details.
3. See “WDTCSR – Watchdog Timer Control Register” on page 66 for details.
4. Never ship a product with the OCDEN Fuse programmed regardless of the setting of
Lock bits and JTAGEN Fuse. A programmed OCDEN Fuse enables some parts of the
clock system to be running in all sleep modes. This may increase the power
consumption.
Table 153. Fuse Low Byte
Fuse Low Byte Bit No Description Default Value
(4)
CKDIV8 7 Divide clock by 8 0 (programmed)
(3)
CKOUT 6 Clock output 1 (unprogrammed)
SUT1 5 Select start-up time 1 (unprogrammed)(1)
SUT0 4 Select start-up time 0 (programmed)(1)
CKSEL3 3 Select Clock source 0 (programmed)(2)
CKSEL2 2 Select Clock source 0 (programmed)(2)
CKSEL1 1 Select Clock source 1 (unprogrammed)(2)
CKSEL0 0 Select Clock source 0 (programmed)(2)
Note: 1. The default value of SUT1:0 results in maximum start-up time for the default clock
source. See Table 26 on page 58 for details.
2. The default setting of CKSEL3:0 results in internal RC Oscillator @ 8 MHz. See
Table 10 on page 39 for details.
3. The CKOUT Fuse allow the system clock to be output on PORTE7. See “Clock Out-
put Buffer” on page 46 for details.
4. See “System Clock Prescaler” on page 47 for details.
The status of the Fuse bits is not affected by Chip Erase. Note that the Fuse bits are
locked if Lock bit1 (LB1) is programmed. Program the Fuse bits before programming the
Lock bits.
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Latching of Fuses The fuse values are latched when the device enters programming mode and changes of
the fuse values will have no effect until the part leaves Programming mode. This does
not apply to the EESAVE Fuse which will take effect once it is programmed. The fuses
are also latched on Power-up in Normal mode.
Signature Bytes All Atmel microcontrollers have a three-byte signature code which identifies the device.
This code can be read in both serial and parallel mode, also when the device is locked.
The three bytes reside in a separate address space. For the
ATmega640/1280/1281/2560/2561 the signature bytes are given in Table 154.
Calibration Byte The ATmega640/1280/1281/2560/2561 has a byte calibration value for the internal RC
Oscillator. This byte resides in the high byte of address 0x000 in the signature address
space. During reset, this byte is automatically written into the OSCCAL Register to
ensure correct frequency of the calibrated RC Oscillator.
Page Size
Table 155. No. of Words in a Page and No. of Pages in the Flash
No. of
Flash Size Page Size PCWORD Pages PCPAGE PCMSB
128K words (256K bytes) 128 words PC[6:0] 1024 PC[16:7] 16
Table 156. No. of Words in a Page and No. of Pages in the EEPROM
No. of
EEPROM Size Page Size PCWORD Pages PCPAGE EEAMSB
4K bytes 8 bytes EEA[2:0] 512 EEA[11:3] 11
Signal Names In this section, some pins of the ATmega640/1280/1281/2560/2561 are referenced by
signal names describing their functionality during parallel programming, see Figure 138
and Table 157. Pins not described in the following table are referenced by pin names.
The XA1/XA0 pins determine the action executed when the XTAL1 pin is given a posi-
tive pulse. The bit coding is shown in Table 160.
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When pulsing WR or OE, the command loaded determines the action executed. The dif-
ferent commands are shown in Table 161.
XA1 PD6
PAGEL PD7
+12 V RESET
BS2 PA0
XTAL1
GND
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Parallel Programming
Enter Programming Mode The following algorithm puts the device in parallel programming mode:
1. Apply 4.5 - 5.5V between VCC and GND.
2. Set RESET to “0” and toggle XTAL1 at least six times.
3. Set the Prog_enable pins listed in Table 159 on page 347 to “0000” and wait at
least 100 ns.
4. Apply 11.5 - 12.5V to RESET. Any activity on Prog_enable pins within 100 ns
after +12V has been applied to RESET, will cause the device to fail entering pro-
gramming mode.
5. Wait at least 50 µs before sending a new command.
Considerations for Efficient The loaded command and address are retained in the device during programming. For
Programming efficient programming, the following should be considered.
• The command needs only be loaded once when writing or reading multiple memory
locations.
• Skip writing the data value 0xFF, that is the contents of the entire EEPROM (unless
the EESAVE Fuse is programmed) and Flash after a Chip Erase.
• Address high byte needs only be loaded before programming or reading a new 256
word window in Flash or 256 byte EEPROM. This consideration also applies to
Signature bytes reading.
Chip Erase The Chip Erase will erase the Flash and EEPROM(1) memories plus Lock bits. The Lock
bits are not reset until the program memory has been completely erased. The Fuse bits
are not changed. A Chip Erase must be performed before the Flash and/or EEPROM
are reprogrammed.
Note: 1. The EEPRPOM memory is preserved during Chip Erase if the EESAVE Fuse is
programmed.
Load Command “Chip Erase”
1. Set XA1, XA0 to “10”. This enables command loading.
2. Set BS1 to “0”.
3. Set DATA to “1000 0000”. This is the command for Chip Erase.
4. Give XTAL1 a positive pulse. This loads the command.
5. Give WR a negative pulse. This starts the Chip Erase. RDY/BSY goes low.
6. Wait until RDY/BSY goes high before loading a new command.
Programming the Flash The Flash is organized in pages, see Table 155 on page 345. When programming the
Flash, the program data is latched into a page buffer. This allows one page of program
data to be programmed simultaneously. The following procedure describes how to pro-
gram the entire Flash memory:
A. Load Command “Write Flash”
1. Set XA1, XA0 to “10”. This enables command loading.
2. Set BS1 to “0”.
3. Set DATA to “0001 0000”. This is the command for Write Flash.
4. Give XTAL1 a positive pulse. This loads the command.
B. Load Address Low byte (Address bits 7:0)
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1. 1. Set XA1, XA0 to “10”. This enables command loading.
2. Set DATA to “0000 0000”. This is the command for No Operation.
3. Give XTAL1 a positive pulse. This loads the command, and the internal write sig-
nals are reset.
01
02
PAGEEND
Note: 1. PCPAGE and PCWORD are listed in Table 155 on page 345.
A B C D E B C D E G H I
0x10 ADDR. LOW DATA LOW DATA HIGH XX ADDR. LOW DATA LOW DATA HIGH XX ADDR. HIGH ADDR. EXT.H XX
DATA
XA1
XA0
BS1
BS2
XTAL1
WR
RDY/BSY
RESET +12V
OE
PAGEL
Note: 1. “XX” is don’t care. The letters refer to the programming description above.
Programming the EEPROM The EEPROM is organized in pages, see Table 156 on page 345. When programming
the EEPROM, the program data is latched into a page buffer. This allows one page of
data to be programmed simultaneously. The programming algorithm for the EEPROM
data memory is as follows (refer to “Programming the Flash” on page 348 for details on
Command, Address and Data loading):
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ATmega640/1280/1281/2560/2561
A G B C E B C E L
0x11 ADDR. HIGH ADDR. LOW DATA XX ADDR. LOW DATA XX
DATA
XA1
XA0
BS1
XTAL1
WR
RDY/BSY
RESET +12V
OE
PAGEL
BS2
Reading the Flash The algorithm for reading the Flash memory is as follows (refer to “Programming the
Flash” on page 348 for details on Command and Address loading):
1. A: Load Command “0000 0010”.
2. H: Load Address Extended Byte (0x00- 0xFF).
3. G: Load Address High Byte (0x00 - 0xFF).
4. B: Load Address Low Byte (0x00 - 0xFF).
5. Set OE to “0”, and BS1 to “0”. The Flash word low byte can now be read at DATA.
6. Set BS to “1”. The Flash word high byte can now be read at DATA.
7. Set OE to “1”.
Reading the EEPROM The algorithm for reading the EEPROM memory is as follows (refer to “Programming the
Flash” on page 348 for details on Command and Address loading):
1. A: Load Command “0000 0011”.
2. G: Load Address High Byte (0x00 - 0xFF).
3. B: Load Address Low Byte (0x00 - 0xFF).
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4. Set OE to “0”, and BS1 to “0”. The EEPROM Data byte can now be read at
DATA.
5. Set OE to “1”.
Programming the Fuse Low The algorithm for programming the Fuse Low bits is as follows (refer to “Programming
Bits the Flash” on page 348 for details on Command and Data loading):
1. A: Load Command “0100 0000”.
2. C: Load Data Low Byte. Bit n = “0” programs and bit n = “1” erases the Fuse bit.
3. Give WR a negative pulse and wait for RDY/BSY to go high.
Programming the Fuse High The algorithm for programming the Fuse High bits is as follows (refer to “Programming
Bits the Flash” on page 348 for details on Command and Data loading):
1. A: Load Command “0100 0000”.
2. C: Load Data Low Byte. Bit n = “0” programs and bit n = “1” erases the Fuse bit.
3. Set BS2, BS1 to “01”. This selects high data byte.
4. Give WR a negative pulse and wait for RDY/BSY to go high.
5. Set BS2, BS1 to “00”. This selects low data byte.
Programming the Extended The algorithm for programming the Extended Fuse bits is as follows (refer to “Program-
Fuse Bits ming the Flash” on page 348 for details on Command and Data loading):
1. 1. A: Load Command “0100 0000”.
2. 2. C: Load Data Low Byte. Bit n = “0” programs and bit n = “1” erases the Fuse
bit.
3. 3. Set BS2, BS1 to “10”. This selects extended data byte.
4. 4. Give WR a negative pulse and wait for RDY/BSY to go high.
5. 5. Set BS2, BS1 to “00”. This selects low data byte.
A C A C A C
0x40 DATA XX 0x40 DATA XX 0x40 DATA XX
DATA
XA1
XA0
BS1
BS2
XTAL1
WR
RDY/BSY
RESET +12V
OE
PAGEL
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Programming the Lock Bits The algorithm for programming the Lock bits is as follows (refer to “Programming the
Flash” on page 348 for details on Command and Data loading):
1. A: Load Command “0010 0000”.
2. C: Load Data Low Byte. Bit n = “0” programs the Lock bit. If LB mode 3 is pro-
grammed (LB1 and LB2 is programmed), it is not possible to program the Boot
Lock bits by any External Programming mode.
3. Give WR a negative pulse and wait for RDY/BSY to go high.
The Lock bits can only be cleared by executing Chip Erase.
Reading the Fuse and Lock The algorithm for reading the Fuse and Lock bits is as follows (refer to “Programming
Bits the Flash” on page 348 for details on Command loading):
1. A: Load Command “0000 0100”.
2. Set OE to “0”, and BS2, BS1 to “00”. The status of the Fuse Low bits can now be
read at DATA (“0” means programmed).
3. Set OE to “0”, and BS2, BS1 to “11”. The status of the Fuse High bits can now be
read at DATA (“0” means programmed).
4. Set OE to “0”, and BS2, BS1 to “10”. The status of the Extended Fuse bits can
now be read at DATA (“0” means programmed).
5. Set OE to “0”, and BS2, BS1 to “01”. The status of the Lock bits can now be read
at DATA (“0” means programmed).
6. Set OE to “1”.
Figure 143. Mapping Between BS1, BS2 and the Fuse and Lock Bits During Read
0
Extended Fuse Byte 1
DATA
BS2
Lock Bits 0
1
BS1
Fuse High Byte 1
BS2
Reading the Signature Bytes The algorithm for reading the Signature bytes is as follows (refer to “Programming the
Flash” on page 348 for details on Command and Address loading):
1. A: Load Command “0000 1000”.
2. B: Load Address Low Byte (0x00 - 0x02).
3. Set OE to “0”, and BS to “0”. The selected Signature byte can now be read at
DATA.
4. Set OE to “1”.
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Reading the Calibration Byte The algorithm for reading the Calibration byte is as follows (refer to “Programming the
Flash” on page 348 for details on Command and Address loading):
1. A: Load Command “0000 1000”.
2. B: Load Address Low Byte, 0x00.
3. Set OE to “0”, and BS1 to “1”. The Calibration byte can now be read at DATA.
4. Set OE to “1”.
Parallel Programming Figure 144. Parallel Programming Timing, Including some General Timing
Characteristics Requirements
tXLWL
tXHXL
XTAL1
tDVXH tXLDX
Data & Contol
(DATA, XA0/1, BS1, BS2)
tBVPH tPLBX t BVWL
tWLBX
PAGEL tPHPL
tWLWH
WR tPLWL
WLRL
RDY/BSY
tWLRH
t XLXH tXLPH
tPLXH
XTAL1
BS1
PAGEL
DATA ADDR0 (Low Byte) DATA (Low Byte) DATA (High Byte) ADDR1 (Low Byte)
XA0
XA1
Note: 1. The timing requirements shown in Figure 144 (i.e., tDVXH, tXHXL, and tXLDX) also apply
to loading operation.
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Figure 146. Parallel Programming Timing, Reading Sequence (within the Same Page)
with Timing Requirements(1)
LOAD ADDRESS READ DATA READ DATA LOAD ADDRESS
(LOW BYTE) (LOW BYTE) (HIGH BYTE) (LOW BYTE)
tXLOL
XTAL1
tBVDV
BS1
tOLDV
OE
tOHDZ
DATA ADDR0 (Low Byte) DATA (Low Byte) DATA (High Byte) ADDR1 (Low Byte)
XA0
XA1
Note: 1. The timing requirements shown in Figure 144 (i.e., tDVXH, tXHXL, and tXLDX) also apply
to reading operation.
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Table 162. Parallel Programming Characteristics, VCC = 5V ± 10% (Continued)
Symbol Parameter Min Typ Max Units
tBVDV BS1 Valid to DATA valid 0 250 ns
tOLDV OE Low to DATA Valid 250 ns
tOHDZ OE High to DATA Tri-stated 250 ns
Notes: 1. tWLRH is valid for the Write Flash, Write EEPROM, Write Fuse bits and Write Lock
bits commands.
2. tWLRH_CE is valid for the Chip Erase command.
Serial Downloading Both the Flash and EEPROM memory arrays can be programmed using a serial pro-
gramming bus while RESET is pulled to GND. The serial programming interface
consists of pins SCK, PDI (input) and PDO (output). After RESET is set low, the Pro-
gramming Enable instruction needs to be executed first before program/erase
operations can be executed. NOTE, in Table 163 on page 356, the pin mapping for
serial programming is listed. Not all packages use the SPI pins dedicated for the internal
Serial Peripheral Interface - SPI.
+1.8 - 5.5V
VCC
+1.8 - 5.5V(2)
PDI
AVCC
PDO
SCK
XTAL1
RESET
GND
Notes: 1. If the device is clocked by the internal Oscillator, it is no need to connect a clock
source to the XTAL1 pin.
2. VCC - 0.3V < AVCC < VCC + 0.3V, however, AVCC should always be within 1.8 - 5.5V
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When programming the EEPROM, an auto-erase cycle is built into the self-timed pro-
gramming operation (in the Serial mode ONLY) and there is no need to first execute the
Chip Erase instruction. The Chip Erase operation turns the content of every memory
location in both the Program and EEPROM arrays into 0xFF.
Depending on CKSEL Fuses, a valid clock must be present. The minimum low and high
periods for the serial clock (SCK) input are defined as follows:
Low:> 2 CPU clock cycles for fck < 12 MHz, 3 CPU clock cycles for fck >= 12 MHz
High:> 2 CPU clock cycles for fck < 12 MHz, 3 CPU clock cycles for fck >= 12 MHz
Serial Programming When writing serial data to the ATmega640/1280/1281/2560/2561, data is clocked on
Algorithm the rising edge of SCK.
When reading data from the ATmega640/1280/1281/2560/2561, data is clocked on the
falling edge of SCK. See Figure 149 for timing details.
To program and verify the ATmega640/1280/1281/2560/2561 in the serial programming
mode, the following sequence is recommended (See four byte instruction formats in
Table 165 on page 359):
1. Power-up sequence:
Apply power between VCC and GND while RESET and SCK are set to “0”. In
some systems, the programmer can not guarantee that SCK is held low during
power-up. In this case, RESET must be given a positive pulse of at least two
CPU clock cycles duration after SCK has been set to “0”.
2. Wait for at least 20 ms and enable serial programming by sending the Program-
ming Enable serial instruction to pin PDI.
3. The serial programming instructions will not work if the communication is out of
synchronization. When in sync. the second byte (0x53), will echo back when
issuing the third byte of the Programming Enable instruction. Whether the echo
is correct or not, all four bytes of the instruction must be transmitted. If the 0x53
did not echo back, give RESET a positive pulse and issue a new Programming
Enable command.
4. The Flash is programmed one page at a time. The memory page is loaded one
byte at a time by supplying the 7 LSB of the address and data together with the
Load Program Memory Page instruction. To ensure correct loading of the page,
the data low byte must be loaded before data high byte is applied for a given
address. The Program Memory Page is stored by loading the Write Program
Memory Page instruction with the address lines 15:8. Before issuing this com-
mand, make sure the instruction Load Extended Address Byte has been used to
define the MSB of the address. The extended address byte is stored until the
command is re-issued, i.e., the command needs only be issued for the first page,
and when crossing the 64KWord boundary. If polling (RDY/BSY) is not used, the
user must wait at least tWD_FLASH before issuing the next page. (See Table 164.)
Accessing the serial programming interface before the Flash write operation
completes can result in incorrect programming.
5. The EEPROM array is programmed one byte at a time by supplying the address
and data together with the appropriate Write instruction. An EEPROM memory
location is first automatically erased before new data is written. If polling is not
used, the user must wait at least tWD_EEPROM before issuing the next byte. (See
Table 164.) In a chip erased device, no 0xFFs in the data file(s) need to be
programmed.
6. Any memory location can be verified by using the Read instruction which returns
the content at the selected address at serial output PDO. When reading the
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Flash memory, use the instruction Load Extended Address Byte to define the
upper address byte, which is not included in the Read Program Memory instruc-
tion. The extended address byte is stored until the command is re-issued, i.e.,
the command needs only be issued for the first page, and when crossing the
64KWord boundary.
7. At the end of the programming session, RESET can be set high to commence
normal operation.
8. Power-off sequence (if needed):
Set RESET to “1”.
Turn VCC power off.
Table 164. Minimum Wait Delay Before Writing the Next Flash or EEPROM Location
Symbol Minimum Wait Delay
tWD_FLASH 4.5 ms
tWD_EEPROM 9.0 ms
tWD_ERASE 9.0 ms
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Serial Programming Table 165 on page 359 and Figure 148 on page 360 describes the Instruction set.
Instruction set
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If the LSB in RDY/BSY data byte out is ‘1’, a programming operation is still pending.
Wait until this bit returns ‘0’ before the next instruction is carried out.
Within the same page, the low data byte must be loaded prior to the high data byte.
After data is loaded to the page buffer, program the EEPROM page, see Figure 148 on
page 360.
Page Buffer
Page Offset
Page 0
Page 1
Page 2
Page Number
Page N-1
Program Memory/
EEPROM Memory
Serial Programming For characteristics of the Serial Programming module see “SPI Timing Characteristics”
Characteristics on page 380.
SAMPLE
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Programming via the Programming through the JTAG interface requires control of the four JTAG specific
JTAG Interface pins: TCK, TMS, TDI, and TDO. Control of the reset and clock pins is not required.
To be able to use the JTAG interface, the JTAGEN Fuse must be programmed. The
device is default shipped with the fuse programmed. In addition, the JTD bit in MCUCR
must be cleared. Alternatively, if the JTD bit is set, the external reset can be forced low.
Then, the JTD bit will be cleared after two chip clocks, and the JTAG pins are available
for programming. This provides a means of using the JTAG pins as normal port pins in
Running mode while still allowing In-System Programming via the JTAG interface. Note
that this technique can not be used when using the JTAG pins for Boundary-scan or On-
chip Debug. In these cases the JTAG pins must be dedicated for this purpose.
During programming the clock frequency of the TCK Input must be less than the maxi-
mum frequency of the chip. The System Clock Prescaler can not be used to divide the
TCK Clock Input into a sufficiently low frequency.
As a definition in this datasheet, the LSB is shifted in and out first of all Shift Registers.
Programming Specific JTAG The Instruction Register is 4-bit wide, supporting up to 16 instructions. The JTAG
Instructions instructions useful for programming are listed below.
The OPCODE for each instruction is shown behind the instruction name in hex format.
The text describes which Data Register is selected as path between TDI and TDO for
each instruction.
The Run-Test/Idle state of the TAP controller is used to generate internal clocks. It can
also be used as an idle state between JTAG sequences. The state machine sequence
for changing the instruction word is shown in Figure 150.
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Figure 150. State Machine Sequence for Changing the Instruction Word
1 Test-Logic-Reset
0 1 1 1
Run-Test/Idle Select-DR Scan Select-IR Scan
0 0
1 1
Capture-DR Capture-IR
0 0
Shift-DR 0 Shift-IR 0
1 1
1 1
Exit1-DR Exit1-IR
0 0
Pause-DR 0 Pause-IR 0
1 1
0 0
Exit2-DR Exit2-IR
1 1
Update-DR Update-IR
1 0 1 0
AVR_RESET (0xC) The AVR specific public JTAG instruction for setting the AVR device in the Reset mode
or taking the device out from the Reset mode. The TAP controller is not reset by this
instruction. The one bit Reset Register is selected as Data Register. Note that the reset
will be active as long as there is a logic “one” in the Reset Chain. The output from this
chain is not latched.
The active states are:
• Shift-DR: The Reset Register is shifted by the TCK input.
PROG_ENABLE (0x4) The AVR specific public JTAG instruction for enabling programming via the JTAG port.
The 16-bit Programming Enable Register is selected as Data Register. The active states
are the following:
• Shift-DR: The programming enable signature is shifted into the Data Register.
• Update-DR: The programming enable signature is compared to the correct value,
and Programming mode is entered if the signature is valid.
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PROG_COMMANDS (0x5) The AVR specific public JTAG instruction for entering programming commands via the
JTAG port. The 15-bit Programming Command Register is selected as Data Register.
The active states are the following:
• Capture-DR: The result of the previous command is loaded into the Data Register.
• Shift-DR: The Data Register is shifted by the TCK input, shifting out the result of the
previous command and shifting in the new command.
• Update-DR: The programming command is applied to the Flash inputs
• Run-Test/Idle: One clock cycle is generated, executing the applied command
PROG_PAGELOAD (0x6) The AVR specific public JTAG instruction to directly load the Flash data page via the
JTAG port. An 8-bit Flash Data Byte Register is selected as the Data Register. This is
physically the 8 LSBs of the Programming Command Register. The active states are the
following:
• Shift-DR: The Flash Data Byte Register is shifted by the TCK input.
• Update-DR: The content of the Flash Data Byte Register is copied into a temporary
register. A write sequence is initiated that within 11 TCK cycles loads the content of
the temporary register into the Flash page buffer. The AVR automatically alternates
between writing the low and the high byte for each new Update-DR state, starting
with the low byte for the first Update-DR encountered after entering the
PROG_PAGELOAD command. The Program Counter is pre-incremented before
writing the low byte, except for the first written byte. This ensures that the first data is
written to the address set up by PROG_COMMANDS, and loading the last location
in the page buffer does not make the program counter increment into the next page.
PROG_PAGEREAD (0x7) The AVR specific public JTAG instruction to directly capture the Flash content via the
JTAG port. An 8-bit Flash Data Byte Register is selected as the Data Register. This is
physically the 8 LSBs of the Programming Command Register. The active states are the
following:
• Capture-DR: The content of the selected Flash byte is captured into the Flash Data
Byte Register. The AVR automatically alternates between reading the low and the
high byte for each new Capture-DR state, starting with the low byte for the first
Capture-DR encountered after entering the PROG_PAGEREAD command. The
Program Counter is post-incremented after reading each high byte, including the
first read byte. This ensures that the first data is captured from the first address set
up by PROG_COMMANDS, and reading the last location in the page makes the
program counter increment into the next page.
• Shift-DR: The Flash Data Byte Register is shifted by the TCK input.
Data Registers The Data Registers are selected by the JTAG instruction registers described in section
“Programming Specific JTAG Instructions” on page 361. The Data Registers relevant for
programming operations are:
• Reset Register
• Programming Enable Register
• Programming Command Register
• Flash Data Byte Register
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Reset Register The Reset Register is a Test Data Register used to reset the part during programming. It
is required to reset the part before entering Programming mode.
A high value in the Reset Register corresponds to pulling the external reset low. The
part is reset as long as there is a high value present in the Reset Register. Depending
on the Fuse settings for the clock options, the part will remain reset for a Reset Time-out
period (refer to “Clock Sources” on page 39) after releasing the Reset Register. The out-
put from this Data Register is not latched, so the reset will take place immediately, as
shown in Figure 131 on page 309.
Programming Enable Register The Programming Enable Register is a 16-bit register. The contents of this register is
compared to the programming enable signature, binary code
0b1010_0011_0111_0000. When the contents of the register is equal to the program-
ming enable signature, programming via the JTAG port is enabled. The register is reset
to 0 on Power-on Reset, and should always be reset when leaving Programming mode.
0xA370
D
A
T
= D Q Programming Enable
TDO
Programming Command The Programming Command Register is a 15-bit register. This register is used to seri-
Register ally shift in programming commands, and to serially shift out the result of the previous
command, if any. The JTAG Programming Instruction Set is shown in Table 166. The
state sequence when shifting in the programming commands is illustrated in Figure 153.
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S
T
R
O
B
E
S
Flash
EEPROM
A
Fuses
D
D
Lock Bits
R
E
S
S
/
D
A
T
A
TDO
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Table 166. JTAG Programming Instruction
Set a = address high bits, b = address low bits, c = address extended bits, H = 0 - Low byte, 1 - High Byte, o = data out, i = data in, x =
don’t care
Instruction TDI Sequence TDO Sequence Notes
1a. Chip Erase 0100011_10000000 xxxxxxx_xxxxxxxx
0110001_10000000 xxxxxxx_xxxxxxxx
0110011_10000000 xxxxxxx_xxxxxxxx
0110011_10000000 xxxxxxx_xxxxxxxx
1b. Poll for Chip Erase Complete 0110011_10000000 xxxxxox_xxxxxxxx (2)
2a. Enter Flash Write 0100011_00010000 xxxxxxx_xxxxxxxx
2b. Load Address Extended High Byte 0001011_cccccccc xxxxxxx_xxxxxxxx (10)
2c. Load Address High Byte 0000111_aaaaaaaa xxxxxxx_xxxxxxxx
2d. Load Address Low Byte 0000011_bbbbbbbb xxxxxxx_xxxxxxxx
2e. Load Data Low Byte 0010011_iiiiiiii xxxxxxx_xxxxxxxx
2f. Load Data High Byte 0010111_iiiiiiii xxxxxxx_xxxxxxxx
2g. Latch Data 0110111_00000000 xxxxxxx_xxxxxxxx (1)
1110111_00000000 xxxxxxx_xxxxxxxx
0110111_00000000 xxxxxxx_xxxxxxxx
2h. Write Flash Page 0110111_00000000 xxxxxxx_xxxxxxxx (1)
0110101_00000000 xxxxxxx_xxxxxxxx
0110111_00000000 xxxxxxx_xxxxxxxx
0110111_00000000 xxxxxxx_xxxxxxxx
2i. Poll for Page Write Complete 0110111_00000000 xxxxxox_xxxxxxxx (2)
3a. Enter Flash Read 0100011_00000010 xxxxxxx_xxxxxxxx
3b. Load Address Extended High Byte 0001011_cccccccc xxxxxxx_xxxxxxxx (10)
3c. Load Address High Byte 0000111_aaaaaaaa xxxxxxx_xxxxxxxx
3d. Load Address Low Byte 0000011_bbbbbbbb xxxxxxx_xxxxxxxx
3e. Read Data Low and High Byte 0110010_00000000 xxxxxxx_xxxxxxxx
0110110_00000000 xxxxxxx_oooooooo Low byte
0110111_00000000 xxxxxxx_oooooooo High byte
4a. Enter EEPROM Write 0100011_00010001 xxxxxxx_xxxxxxxx
4b. Load Address High Byte 0000111_aaaaaaaa xxxxxxx_xxxxxxxx (10)
4c. Load Address Low Byte 0000011_bbbbbbbb xxxxxxx_xxxxxxxx
4d. Load Data Byte 0010011_iiiiiiii xxxxxxx_xxxxxxxx
4e. Latch Data 0110111_00000000 xxxxxxx_xxxxxxxx (1)
1110111_00000000 xxxxxxx_xxxxxxxx
0110111_00000000 xxxxxxx_xxxxxxxx
4f. Write EEPROM Page 0110011_00000000 xxxxxxx_xxxxxxxx (1)
0110001_00000000 xxxxxxx_xxxxxxxx
0110011_00000000 xxxxxxx_xxxxxxxx
0110011_00000000 xxxxxxx_xxxxxxxx
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Table 166. JTAG Programming Instruction (Continued)
Set (Continued) a = address high bits, b = address low bits, c = address extended bits, H = 0 - Low byte, 1 - High Byte, o = data out, i
= data in, x = don’t care
Instruction TDI Sequence TDO Sequence Notes
(8)
8d. Read Fuse Low Byte 0110010_00000000 xxxxxxx_xxxxxxxx
0110011_00000000 xxxxxxx_oooooooo
8e. Read Lock Bits(9) 0110110_00000000 xxxxxxx_xxxxxxxx (5)
0110111_00000000 xxxxxxx_xxoooooo
8f. Read Fuses and Lock Bits 0111010_00000000 xxxxxxx_xxxxxxxx (5)
0111110_00000000 xxxxxxx_oooooooo Fuse Ext. byte
0110010_00000000 xxxxxxx_oooooooo Fuse High byte
0110110_00000000 xxxxxxx_oooooooo Fuse Low byte
0110111_00000000 xxxxxxx_oooooooo Lock bits
9a. Enter Signature Byte Read 0100011_00001000 xxxxxxx_xxxxxxxx
9b. Load Address Byte 0000011_bbbbbbbb xxxxxxx_xxxxxxxx
9c. Read Signature Byte 0110010_00000000 xxxxxxx_xxxxxxxx
0110011_00000000 xxxxxxx_oooooooo
10a. Enter Calibration Byte Read 0100011_00001000 xxxxxxx_xxxxxxxx
10b. Load Address Byte 0000011_bbbbbbbb xxxxxxx_xxxxxxxx
10c. Read Calibration Byte 0110110_00000000 xxxxxxx_xxxxxxxx
0110111_00000000 xxxxxxx_oooooooo
11a. Load No Operation Command 0100011_00000000 xxxxxxx_xxxxxxxx
0110011_00000000 xxxxxxx_xxxxxxxx
Notes: 1. This command sequence is not required if the seven MSB are correctly set by the previous command sequence (which is
normally the case).
2. Repeat until o = “1”.
3. Set bits to “0” to program the corresponding Fuse, “1” to unprogram the Fuse.
4. Set bits to “0” to program the corresponding Lock bit, “1” to leave the Lock bit unchanged.
5. “0” = programmed, “1” = unprogrammed.
6. The bit mapping for Fuses Extended byte is listed in Table 151 on page 343
7. The bit mapping for Fuses High byte is listed in Table 152 on page 344
8. The bit mapping for Fuses Low byte is listed in Table 153 on page 344
9. The bit mapping for Lock bits byte is listed in Table 149 on page 342
10. Address bits exceeding PCMSB and EEAMSB (Table 155 and Table 156) are don’t care
11. All TDI and TDO sequences are represented by binary digits (0b...).
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Figure 153. State Machine Sequence for Changing/Reading the Data Word
1 Test-Logic-Reset
0 1 1 1
Run-Test/Idle Select-DR Scan Select-IR Scan
0 0
1 1
Capture-DR Capture-IR
0 0
Shift-DR 0 Shift-IR 0
1 1
1 1
Exit1-DR Exit1-IR
0 0
Pause-DR 0 Pause-IR 0
1 1
0 0
Exit2-DR Exit2-IR
1 1
Update-DR Update-IR
1 0 1 0
Flash Data Byte Register The Flash Data Byte Register provides an efficient way to load the entire Flash page
buffer before executing Page Write, or to read out/verify the content of the Flash. A state
machine sets up the control signals to the Flash and senses the strobe signals from the
Flash, thus only the data words need to be shifted in/out.
The Flash Data Byte Register actually consists of the 8-bit scan chain and a 8-bit tempo-
rary register. During page load, the Update-DR state copies the content of the scan
chain over to the temporary register and initiates a write sequence that within 11 TCK
cycles loads the content of the temporary register into the Flash page buffer. The AVR
automatically alternates between writing the low and the high byte for each new Update-
DR state, starting with the low byte for the first Update-DR encountered after entering
the PROG_PAGELOAD command. The Program Counter is pre-incremented before
writing the low byte, except for the first written byte. This ensures that the first data is
written to the address set up by PROG_COMMANDS, and loading the last location in
the page buffer does not make the Program Counter increment into the next page.
During Page Read, the content of the selected Flash byte is captured into the Flash
Data Byte Register during the Capture-DR state. The AVR automatically alternates
between reading the low and the high byte for each new Capture-DR state, starting with
the low byte for the first Capture-DR encountered after entering the PROG_PAGEREAD
command. The Program Counter is post-incremented after reading each high byte,
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including the first read byte. This ensures that the first data is captured from the first
address set up by PROG_COMMANDS, and reading the last location in the page
makes the program counter increment into the next page.
STROBES
State
Machine
TDI
ADDRESS
Flash
EEPROM
Fuses
Lock Bits
D
A
T
A
TDO
The state machine controlling the Flash Data Byte Register is clocked by TCK. During
normal operation in which eight bits are shifted for each Flash byte, the clock cycles
needed to navigate through the TAP controller automatically feeds the state machine for
the Flash Data Byte Register with sufficient number of clock pulses to complete its oper-
ation transparently for the user. However, if too few bits are shifted between each
Update-DR state during page load, the TAP controller should stay in the Run-Test/Idle
state for some TCK cycles to ensure that there are at least 11 TCK cycles between each
Update-DR state.
Programming Algorithm All references below of type “1a”, “1b”, and so on, refer to Table 166.
Entering Programming Mode 1. Enter JTAG instruction AVR_RESET and shift 1 in the Reset Register.
2. Enter instruction PROG_ENABLE and shift 0b1010_0011_0111_0000 in the
Programming Enable Register.
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Programming the Flash Before programming the Flash a Chip Erase must be performed, see “Performing Chip
Erase” on page 370.
1. Enter JTAG instruction PROG_COMMANDS.
2. Enable Flash write using programming instruction 2a.
3. Load address Extended High byte using programming instruction 2b.
4. Load address High byte using programming instruction 2c.
5. Load address Low byte using programming instruction 2d.
6. Load data using programming instructions 2e, 2f and 2g.
7. Repeat steps 5 and 6 for all instruction words in the page.
8. Write the page using programming instruction 2h.
9. Poll for Flash write complete using programming instruction 2i, or wait for tWLRH
(refer to Table 162 on page 355).
10. Repeat steps 3 to 9 until all data have been programmed.
A more efficient data transfer can be achieved using the PROG_PAGELOAD
instruction:
1. Enter JTAG instruction PROG_COMMANDS.
2. Enable Flash write using programming instruction 2a.
3. Load the page address using programming instructions 2b, 2c and 2d.
PCWORD (refer to Table 155 on page 345) is used to address within one page
and must be written as 0.
4. Enter JTAG instruction PROG_PAGELOAD.
5. Load the entire page by shifting in all instruction words in the page byte-by-byte,
starting with the LSB of the first instruction in the page and ending with the MSB
of the last instruction in the page. Use Update-DR to copy the contents of the
Flash Data Byte Register into the Flash page location and to auto-increment the
Program Counter before each new word.
6. Enter JTAG instruction PROG_COMMANDS.
7. Write the page using programming instruction 2h.
8. Poll for Flash write complete using programming instruction 2i, or wait for tWLRH
(refer to Table 162 on page 355).
9. Repeat steps 3 to 8 until all data have been programmed.
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5. Read the entire page (or Flash) by shifting out all instruction words in the page
(or Flash), starting with the LSB of the first instruction in the page (Flash) and
ending with the MSB of the last instruction in the page (Flash). The Capture-DR
state both captures the data from the Flash, and also auto-increments the pro-
gram counter after each word is read. Note that Capture-DR comes before the
shift-DR state. Hence, the first byte which is shifted out contains valid data.
6. Enter JTAG instruction PROG_COMMANDS.
7. Repeat steps 3 to 6 until all data have been read.
Programming the EEPROM Before programming the EEPROM a Chip Erase must be performed, see “Performing
Chip Erase” on page 370.
1. Enter JTAG instruction PROG_COMMANDS.
2. Enable EEPROM write using programming instruction 4a.
3. Load address High byte using programming instruction 4b.
4. Load address Low byte using programming instruction 4c.
5. Load data using programming instructions 4d and 4e.
6. Repeat steps 4 and 5 for all data bytes in the page.
7. Write the data using programming instruction 4f.
8. Poll for EEPROM write complete using programming instruction 4g, or wait for
tWLRH (refer to Table 162 on page 355).
9. Repeat steps 3 to 8 until all data have been programmed.
Note that the PROG_PAGELOAD instruction can not be used when programming the
EEPROM.
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Electrical Characteristics
DC Characteristics
TA = -40°C to 85°C, VCC = 1.8V to 5.5V (unless otherwise noted)
Symbol Parameter Condition Min.(5) Typ. Max.(5) Units
(1)
Input Low Voltage,Except VCC = 1.8V - 2.4V -0.5 0.2VCC
VIL V
XTAL1 and Reset pin VCC = 2.4V - 5.5V -0.5 0.3VCC(1)
Input Low Voltage,
VIL1 VCC = 1.8V - 5.5V -0.5 0.1VCC(1) V
XTAL1 pin
Input Low Voltage,
VIL2 VCC = 1.8V - 5.5V -0.5 0.1VCC(1) V
RESET pin
Input High Voltage,
VCC = 1.8V - 2.4V 0.7VCC(2) VCC + 0.5
VIH Except XTAL1 and V
VCC = 2.4V - 5.5V 0.6VCC(2) VCC + 0.5
RESET pins
Input High Voltage, VCC = 1.8V - 2.4V 0.8VCC(2) VCC + 0.5
VIH1 V
XTAL1 pin VCC = 2.4V - 5.5V 0.7VCC(2) VCC + 0.5
Input High Voltage,
VIH2 VCC = 1.8V - 5.5V 0.9VCC(2) VCC + 0.5 V
RESET pin
Output Low Voltage(3), IOL = 20 mA, VCC = 5V 0.9
VOL V
Except RESET pin IOL = 10 mA, VCC = 3V 0.6
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4)The sum of all IOH, for ports E0-E7, G5 should not exceed 100 mA.
5)The sum of all IOH, for ports F0-F7, K0-K7 should not exceed 100 mA.
If IOH exceeds the test condition, VOH may exceed the related specification. Pins are not guaranteed to source current
greater than the listed test condition.
5. All DC Characteristics contained in this datasheet are based on simulation and characterization of other AVR microcontrol-
lers manufactured in the same process technology. These values are preliminary values representing design targets, and
will be updated after characterization of actual silicon
6. Values with “PRR1 – Power Reduction Register 1” enabled (0xFF).
V IH1
V IL1
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Maximum speed vs. VCC Maximum frequency is depending on VCC. As shown in Figure 156 trough Figure 159,
the Maximum Frequency vs. V CC curve is linear between 1.8V < V CC < 2.7V and
between 2.7V < VCC < 4.5V.
8 MHz
Figure 157. Maximum Frequency vs. VCC when only using No-Read-While-Write Sec-
tion(1), ATmega2560V/ATmega2561V
8 MHz
2 MHz
Note: 1. When only using the Read-While-Write Section of the program memory, a higher
speed can be achieved at low voltage, see “Read-While-Write and No Read-While-
Write Flash Sections” on page 323 for addresses.
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16 MHz Figure 158. Maximum Frequency vs. VCC, ATmega640/ATmega1280/ATmega1281
16 MHz
8 MHz
Safe Operating Area
16 MHz
4.5V 5.5V
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ATmega640/1280/1281/2560/2561
Bus free time between a STOP and START fSCL ≤ 100 kHz 4.7 – µs
tBUF
condition fSCL > 100 kHz 1.3 – µs
Notes: 1. In ATmega640/1280/1281/2560/2561, this parameter is characterized and not 100% tested.
2. Required only for fSCL > 100 kHz.
3. Cb = capacitance of one bus line in pF.
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4. fCK = CPU clock frequency
5. This requirement applies to all ATmega640/1280/1281/2560/2561 2-wire Serial Interface operation. Other devices con-
nected to the 2-wire Serial Bus need only obey the general fSCL requirement.
6. The actual low period generated by the ATmega640/1280/1281/2560/2561 2-wire Serial Interface is (1/fSCL - 2/fCK), thus
fCK must be greater than 6 MHz for the low time requirement to be strictly met at fSCL = 100 kHz.
7. The actual low period generated by the ATmega640/1280/1281/2560/2561 2-wire Serial Interface is (1/fSCL - 2/fCK), thus
the low time requirement will not be strictly met for fSCL > 308 kHz when fCK = 8 MHz. Still,
ATmega640/1280/1281/2560/2561 devices connected to the bus may communicate at full speed (400 kHz) with other
ATmega640/1280/1281/2560/2561 devices, as well as any other device with a proper tLOW acceptance margin.
tLOW tLOW
SCL
tSU;STA tHD;STA tHD;DAT tSU;DAT
tSU;STO
SDA
tBUF
SPI Timing See Figure 161 and Figure 162 for details.
Characteristics Table 169. SPI Timing Parameters
Description Mode Min Typ Max
1 SCK period Master See Table 100
2 SCK high/low Master 50% duty cycle
3 Rise/Fall time Master TBD
4 Setup Master 10
5 Hold Master 10
6 Out to SCK Master 0.5 • tsck
7 SCK to out Master 10
8 SCK to out high Master 10
9 SS low to out Slave 15
ns
10 SCK period Slave 4 • tck
11 SCK high/low(1) Slave 2 • tck
12 Rise/Fall time Slave TBD
13 Setup Slave 10
14 Hold Slave tck
15 SCK to out Slave 15
16 SCK to SS high Slave 20
17 SS high to tri-state Slave 10
18 SS low to SCK Slave 20
Note: 1. In SPI Programming mode the minimum SCK high/low period is:
- 2 tCLCL for fCK < 12 MHz
- 3 tCLCL for fCK > 12 MHz
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ATmega640/1280/1281/2560/2561
SCK
(CPOL = 0)
2 2
SCK
(CPOL = 1)
4 5 3
MISO
MSB ... LSB
(Data Input)
7 8
MOSI
MSB ... LSB
(Data Output)
SS
10 16
9
SCK
(CPOL = 0)
11 11
SCK
(CPOL = 1)
13 14 12
MOSI
MSB ... LSB
(Data Input)
15 17
MISO
MSB ... LSB X
(Data Output)
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ADC Characteristics – Preliminary Data
Table 170. ADC Characteristics, Singel Ended Channels
Symbol Parameter Condition Min(1) Typ(1) Max(1) Units
Resolution Single Ended Conversion 10 Bits
Single Ended Conversion
2.25
VREF = 4V, VCC = 4V, 2.5 LSB
(2)
CLKADC= 200 kHz
Single Ended Conversion
VREF = 4V, VCC = 4V, 3 LSB
CLKADC = 1 MHz
Absolute accuracy (Including
INL, DNL, quantization error, Single Ended Conversion
gain and offset error) VREF = 4V, VCC = 4V,
2 LSB
CLKADC = 200 kHz
Noise Reduction Mode
Single Ended Conversion
VREF = 4V, VCC = 4V, 3
LSB
CLKADC = 1 MHz (2.75)
Noise Reduction Mode
Single Ended Conversion 1.25
Integral Non-Linearity (INL) VREF = 4V, VCC = 4V, LSB
(1.0)
CLKADC = 200 kHz
Single Ended Conversion
0.5
Differential Non-Linearity (DNL) VREF = 4V, VCC = 4V, LSB
(0.25)
CLKADC = 200 kHz
Single Ended Conversion
2
Gain Error VREF = 4V, VCC = 4V, LSB
(1.75)
CLKADC= 200 kHz
Single Ended Conversion
-2
Offset Error VREF = 4V, VCC = 4V, LSB
(-1.75)
CLKADC = 200 kHz
Conversion Time Free Running Conversion 13 260 µs
Clock Frequency Single Ended Conversion 50 1000 kHz
AVCC Analog Supply Voltage VCC - 0.3 VCC + 0.3 V
VREF Reference Voltage 1.0 AVCC V
VIN Input Voltage GND VREF V
Input Bandwidth 38,5 kHz
VINT1 Internal Voltage Reference 1.1V 1.0 1.1 1.2 V
VINT2 Internal Voltage Reference 2.56V 2.4 2.56 2.8 V
RREF Reference Input Resistance 32 kΩ
RAIN Analog Input Resistance 100 MΩ
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Table 171. ADC Characteristics, Differential Channels (Continued)
Symbol Parameter Condition Min(1) Typ(1) Max(1) Units
AVCC Analog Supply Voltage VCC - 0.3 VCC + 0.3 V
VREF Reference Voltage 2.7(2.0) AVCC - 0.5 V
VIN Input Voltage GND VCC V
VDIFF Input Differential Voltage -VREF/Gain VREF/Gain V
ADC Conversion Output -511 511 LSB
Input Bandwidth 4 kHz
VINT Internal Voltage Reference 2.3 2.56 2.8 V
RREF Reference Input Resistance 32 kΩ
RAIN Analog Input Resistance 100 MΩ
Note: 1. Values are guidelines only.
384 ATmega640/1280/1281/2560/2561
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Table 174. External Data Memory Characteristics, 4.5 - 5.5 Volts, 1 Cycle Wait-state
8 MHz Oscillator Variable Oscillator
Symbol Parameter Min Max Min Max Unit
0 1/tCLCL Oscillator Frequency 0.0 16 MHz
10 tRLDV Read Low to Data Valid 200 2.0tCLCL-50 ns
12 tRLRH RD Pulse Width 240 2.0tCLCL-10 ns
15 tDVWH Data Valid to WR High 240 2.0tCLCL ns
16 tWLWH WR Pulse Width 240 2.0tCLCL-10 ns
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Table 175. External Data Memory Characteristics, 4.5 - 5.5 Volts, SRWn1 = 1, SRWn0 = 0
4 MHz Oscillator Variable Oscillator
Symbol Parameter Min Max Min Max Unit
0 1/tCLCL Oscillator Frequency 0.0 16 MHz
10 tRLDV Read Low to Data Valid 325 3.0tCLCL-50 ns
12 tRLRH RD Pulse Width 365 3.0tCLCL-10 ns
15 tDVWH Data Valid to WR High 375 3.0tCLCL ns
16 tWLWH WR Pulse Width 365 3.0tCLCL-10 ns
Table 176. External Data Memory Characteristics, 4.5 - 5.5 Volts, SRWn1 = 1, SRWn0 = 1
4 MHz Oscillator Variable Oscillator
Symbol Parameter Min Max Min Max Unit
0 1/tCLCL Oscillator Frequency 0.0 16 MHz
10 tRLDV Read Low to Data Valid 325 3.0tCLCL-50 ns
12 tRLRH RD Pulse Width 365 3.0tCLCL-10 ns
14 tWHDX Data Hold After WR High 240 2.0tCLCL-10 ns
15 tDVWH Data Valid to WR High 375 3.0tCLCL ns
16 tWLWH WR Pulse Width 365 3.0tCLCL-10 ns
Table 177. External Data Memory Characteristics, 2.7 - 5.5 Volts, No Wait-state
4 MHz Oscillator Variable Oscillator
Symbol Parameter Min Max Min Max Unit
0 1/tCLCL Oscillator Frequency 0.0 8 MHz
1 tLHLL ALE Pulse Width 235 tCLCL-15 ns
2 tAVLL Address Valid A to ALE Low 115 0.5tCLCL-10(1) ns
Address Hold After ALE Low,
5 5
3a tLLAX_ST write access ns
Address Hold after ALE Low,
5 5
3b tLLAX_LD read access ns
(1)
4 tAVLLC Address Valid C to ALE Low 115 0.5tCLCL-10 ns
5 tAVRL Address Valid to RD Low 235 1.0tCLCL-15 ns
6 tAVWL Address Valid to WR Low 235 1.0tCLCL-15 ns
(2) (2)
7 tLLWL ALE Low to WR Low 115 130 0.5tCLCL-10 0.5tCLCL+5 ns
(2) (2)
8 tLLRL ALE Low to RD Low 115 130 0.5tCLCL-10 0.5tCLCL+5 ns
9 tDVRH Data Setup to RD High 45 45 ns
10 tRLDV Read Low to Data Valid 190 1.0tCLCL-60 ns
11 tRHDX Data Hold After RD High 0 0 ns
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Table 177. External Data Memory Characteristics, 2.7 - 5.5 Volts, No Wait-state (Continued)
4 MHz Oscillator Variable Oscillator
Symbol Parameter Min Max Min Max Unit
12 tRLRH RD Pulse Width 235 1.0tCLCL-15 ns
(1)
13 tDVWL Data Setup to WR Low 105 0.5tCLCL-20 ns
14 tWHDX Data Hold After WR High 235 1.0tCLCL-15 ns
15 tDVWH Data Valid to WR High 250 1.0tCLCL ns
16 tWLWH WR Pulse Width 235 1.0tCLCL-15 ns
Notes: 1. This assumes 50% clock duty cycle. The half period is actually the high time of the external clock, XTAL1.
2. This assumes 50% clock duty cycle. The half period is actually the low time of the external clock, XTAL1.
Table 178. External Data Memory Characteristics, 2.7 - 5.5 Volts, SRWn1 = 0, SRWn0 = 1
4 MHz Oscillator Variable Oscillator
Symbol Parameter Min Max Min Max Unit
0 1/tCLCL Oscillator Frequency 0.0 8 MHz
10 tRLDV Read Low to Data Valid 440 2.0tCLCL-60 ns
12 tRLRH RD Pulse Width 485 2.0tCLCL-15 ns
15 tDVWH Data Valid to WR High 500 2.0tCLCL ns
16 tWLWH WR Pulse Width 485 2.0tCLCL-15 ns
Table 179. External Data Memory Characteristics, 2.7 - 5.5 Volts, SRWn1 = 1, SRWn0 = 0
4 MHz Oscillator Variable Oscillator
Symbol Parameter Min Max Min Max Unit
0 1/tCLCL Oscillator Frequency 0.0 8 MHz
10 tRLDV Read Low to Data Valid 690 3.0tCLCL-60 ns
12 tRLRH RD Pulse Width 735 3.0tCLCL-15 ns
15 tDVWH Data Valid to WR High 750 3.0tCLCL ns
16 tWLWH WR Pulse Width 735 3.0tCLCL-15 ns
Table 180. External Data Memory Characteristics, 2.7 - 5.5 Volts, SRWn1 = 1, SRWn0 = 1
4 MHz Oscillator Variable Oscillator
Symbol Parameter Min Max Min Max Unit
0 1/tCLCL Oscillator Frequency 0.0 8 MHz
10 tRLDV Read Low to Data Valid 690 3.0tCLCL-60 ns
12 tRLRH RD Pulse Width 735 3.0tCLCL-15 ns
14 tWHDX Data Hold After WR High 485 2.0tCLCL-15 ns
15 tDVWH Data Valid to WR High 750 3.0tCLCL ns
16 tWLWH WR Pulse Width 735 3.0tCLCL-15 ns
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Figure 163. External Memory Timing (SRWn1 = 0, SRWn0 = 0
T1 T2 T3 T4
ALE
4 7
Write
14
6 16
WR
3b 9 11
Read
5 10
8 12
RD
ALE
4 7
Write
14
6 16
WR
3b 9 11
Read
5 10
8 12
RD
388 ATmega640/1280/1281/2560/2561
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ATmega640/1280/1281/2560/2561
ALE
4 7
15
2 3a 13
Write
14
6 16
WR
3b 9 11
Read
5 10
8 12
RD
ALE
4 7
15
2 3a 13
Write
14
6 16
WR
3b 9 11
Read
5 10
8 12
RD
The ALE pulse in the last period (T4-T7) is only present if the next instruction accesses the RAM
(internal or external).
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Typical Characteristics
The following charts show typical behavior. These figures are not tested during manu-
facturing. All current consumption measurements are performed with all I/O pins
configured as inputs and with internal pull-ups enabled. A sine wave generator with rail-
to-rail output is used as clock source.
All Active- and Idle current consumption measurements are done with all bits in the PRR
registers set and thus, the corresponding I/O modules are turned off. Also the Analog
Comparator is disabled during these measurements. Table 181 on page 395 and Table
182 on page 396 show the additional current consumption compared to ICC Active and
ICC Idle for every I/O module controlled by the Power Reduction Register. See “When
the SM2:0 bits are 111 and an external crystal/resonator clock option is selected, the
SLEEP instruction makes the MCU enter Extended Standby mode. This mode is identi-
cal to Power-save mode with the exception that the Oscillator is kept running. From
Extended Standby mode, the device wakes up in six clock cycles.Power Reduction
Register” on page 52 for details.
The power consumption in Power-down mode is independent of clock selection.
The current consumption is a function of several factors such as: operating voltage,
operating frequency, loading of I/O pins, switching rate of I/O pins, code executed and
ambient temperature. The dominating factors are operating voltage and frequency.
The current drawn from capacitive loaded pins may be estimated (for one pin) as
CL*VCC*f where CL = load capacitance, VCC = operating voltage and f = average switch-
ing frequency of I/O pin.
The parts are characterized at frequencies higher than test limits. Parts are not guaran-
teed to function properly at frequencies higher than the ordering code indicates.
The difference between current consumption in Power-down mode with Watchdog
Timer enabled and Power-down mode with Watchdog Timer disabled represents the dif-
ferential current drawn by the Watchdog Timer.
Active Supply Current Figure 167. Active Supply Current vs. frequency (0.1 - 1.0 MHz)
2 5.5V
5.0V
1,5 4.5V
ICC (m A)
4.0V
1 3.3V
2.7V
0,5 1.8V
0
0 0,1 0,2 0,3 0,4 0,5 0,6 0,7 0,8 0,9 1
Frequency (MHz)
390 ATmega640/1280/1281/2560/2561
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ATmega640/1280/1281/2560/2561
15
ICC (m A)
4.0V
10
3.3V
2.7V
5
1.8V
0
0 2 4 6 8 10 12 14 16
Frequency (MHz)
Figure 169. Active Supply Current vs. VCC (Internal RC Oscillator, 8 MHz)
ACTIVE SUPPLY CURRENT vs. VCC
INTERNAL RC OSCILLATOR, 8 MHz
14
85˚C
12 25˚C
-40˚C
10
ICC (mA)
0
1,5 2 2,5 3 3,5 4 4,5 5 5,5
VCC (V)
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Figure 170. Active Supply Current vs. VCC (Internal RC Oscillator, 1 MHz)
ACTIVE SUPPLY CURRENT vs. VCC
INTERNAL RC OSCILLATOR, 1 MHz
2,5
-40˚C
85˚C
2 25˚C
1,5
ICC (mA) 1
0,5
0
1,5 2 2,5 3 3,5 4 4,5 5 5,5
VCC (V)
Figure 171. Active Supply Current vs. VCC (Internal RC Oscillator, 128 kHz)
ACTIVE SUPPLY CURRENT vs. VCC
INTERNAL RC OSCILLATOR, 128 kHz
0,7
0,6
-40˚C
0,5
ICC (mA)
0,4
25˚C
0,3
85˚C
0,2
0,1
0
1,5 2 2,5 3 3,5 4 4,5 5 5,5
VCC (V)
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ATmega640/1280/1281/2560/2561
Idle Supply Current Figure 172. Idle Supply Current vs. Low Frequency (0.1 - 1.0 MHz)
IDLE SUPPLY CURRENT vs. LOW FREQUENCY
0.1 - 1.0 MHz
0,6
5.5V
0,5
5.0V
0,4
4.5V
ICC (mA)
4.0V
0,3
3.3V
0,2 2.7V
1.8V
0,1
0
0 0,1 0,2 0,3 0,4 0,5 0,6 0,7 0,8 0,9 1
Frequency (MHz)
7
5.5V
6
5.0V
5
4.5V
ICC (mA)
4.0V
3
2
3.3V
1
2.7V
1.8V
0
0 2 4 6 8 10 12 14 16
Frequency (MHz)
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Figure 174. Idle Supply Current vs. VCC (Internal RC Oscillator, 8 MHz)
2,5
ICC (mA)
2
1,5
0,5
0
1,5 2 2,5 3 3,5 4 4,5 5 5,5
VCC (V)
Figure 175. Idle Supply Current vs. VCC (Internal RC Oscillator, 1 MHz)
IDLE SUPPLY CURRENT vs. VCC
INTERNAL RC OSCILLATOR, 1 MHz
0,9
-40˚C
0,8
0,7
85˚C
0,6 25˚C
ICC (mA)
0,5
0,4
0,3
0,2
0,1
0
1,5 2 2,5 3 3,5 4 4,5 5 5,5
VCC (V)
394 ATmega640/1280/1281/2560/2561
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ATmega640/1280/1281/2560/2561
Figure 176. Idle Supply Current vs. VCC (Internal RC Oscillator, 128 KHz)I
IDLE SUPPLY CURRENT vs. VCC
INTERNAL RC OSCILLATOR, 128 kHz
0,3
-40˚C
0,25
0,2
ICC (mA)
0,15 25˚C
85˚C
0,1
0,05
0
1,5 2 2,5 3 3,5 4 4,5 5 5,5
VCC (V)
Supply Current of IO The tables and formulas below can be used to calculate the additional current consump-
modules tion for the different I/O modules in Active and Idle mode. The enabling or disabling of
the I/O modules are controlled by the Power Reduction Register. See “When the SM2:0
bits are 111 and an external crystal/resonator clock option is selected, the SLEEP
instruction makes the MCU enter Extended Standby mode. This mode is identical to
Power-save mode with the exception that the Oscillator is kept running. From Extended
Standby mode, the device wakes up in six clock cycles.Power Reduction Register” on
page 52 for details.
Table 181.
Additional Current Consumption for the different I/O modules (absolute values)
PRR bit Typical numbers
VCC = 2V, F = 1MHz VCC = 3V, F = 4MHz VCC = 5V, F = 8MHz
PRUSART3 8.0 uA 51 uA 220 uA
PRUSART2 8.0 uA 51 uA 220 uA
PRUSART1 8.0 uA 51 uA 220 uA
PRUSART0 8.0 uA 51 uA 220 uA
PRTWI 12 uA 75 uA 315 uA
PRTIM5 6.0 uA 39 uA 150 uA
PRTIM4 6.0 uA 39 uA 150 uA
PRTIM3 6.0 uA 39 uA 150 uA
PRTIM2 11 uA 72 uA 300 uA
PRTIM1 6.0 uA 39 uA 150 uA
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Table 181.
Additional Current Consumption for the different I/O modules (absolute values)
PRR bit Typical numbers
VCC = 2V, F = 1MHz VCC = 3V, F = 4MHz VCC = 5V, F = 8MHz
PRTIM0 4.0 uA 24 uA 100 uA
PRSPI 15 uA 95 uA 400 uA
PRADC 12 uA 75 uA 315 uA
Table 182.
Additional Current Consumption (percentage) in Active and Idle mode
Additional Current consumption Additional Current consumption
compared to Active with external compared to Idle with external
PRR bit clock clock
PRUSART3 3.0% 17%
PRUSART2 3.0% 17%
PRUSART1 3.0% 17%
PRUSART0 3.0% 17%
PRTWI 4.4% 24%
PRTIM5 1.8% 10%
PRTIM4 1.8% 10%
PRTIM3 1.8% 10%
PRTIM2 4.3% 23%
PRTIM1 1.8% 10%
PRTIM0 1.5% 8.0%
PRSPI 3.3% 18%
PRADC 4.5% 24%
It is possible to calculate the typical current consumption based on the numbers from
Table 181 for other VCC and frequency settings than listed in Table 182.
Example 1 Calculate the expected current consumption in idle mode with USART0, TIMER1, and
TWI enabled at VCC = 2.0V and F = 1MHz. From Table 182 on page 396, third column,
we see that we need to add 17% for the USART0, 24% for the TWI, and 10% for the
TIMER1 module. Reading from Figure 172 on page 393, we find that the idle current
consumption is ~0,15mA at VCC = 2.0V and F = 1MHz. The total current consumption in
idle mode with USART0, TIMER1, and TWI enabled, gives:
I CC total ≈ 0,15mA • ( 1 + 0,17 + 0,24 + 0,10 ) ≈ 0,227mA
396 ATmega640/1280/1281/2560/2561
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Power-down Supply Figure 177. Power-down Supply Current vs. VCC (Watchdog Timer Disabled)
Current
POWER-DOWN SUPPLY CURRENT vs. VCC
WATCHDOG TIMER DISABLED
4
85˚C
3,5
2,5
ICC (uA)
2
1,5
1 -40˚C
25˚C
0,5
0
1,5 2 2,5 3 3,5 4 4,5 5 5,5
VCC (V)
Figure 178. Power-down Supply Current vs. VCC (Watchdog Timer Enabled)
POWER-DOWN SUPPLY CURRENT vs. VCC
WATCHDOG TIMER ENABLED
12
85˚C
10
-40˚C
8 25˚C
ICC (uA)
0
1,5 2 2,5 3 3,5 4 4,5 5 5,5
VCC (V)
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Power-save Supply Figure 179. Power-save Supply Current vs. VCC (Watchdog Timer Disabled)
Current POWER-SAVE SUPPLY CURRENT vs. VCC
WATCHDOG TIMER DISABLED
4
3,5
25 ˚C
3
2,5
I CC (uA)
2
1,5
0,5
0
1,5 2 2,5 3 3,5 4 4,5 5 5,5
VCC (V)
Figure 180. Power-save Supply Current vs. VCC (Watchdog Timer Enabled)
POWER-SAVE SUPPLY CURRENT vs. V CC
WATCHDOG TIMER ENABLED
9
8 25 ˚C
7
6
I CC (uA)
0
1,5 2 2,5 3 3,5 4 4,5 5 5,5
VCC (V)
398 ATmega640/1280/1281/2560/2561
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ATmega640/1280/1281/2560/2561
Standby Supply Current Figure 181. Standby Supply Current vs. VCC (Watchdog Timer Disabled)
STANDBY SUPPLY CURRENT vs. V CC
WATCHDOG TIMER DISABLED
0,2
6 MHz xtal
0,18 6 MHz res
0,16
ICC (m A)
0,1
2 MHz res
0,08 2 MHz xtal
0,06 1 MHz res
455 kHz res
0,04
0,02
32 kHz xtal
0
1,5 2 2,5 3 3,5 4 4,5 5 5,5
VCC (V)
Pin Pull-up Figure 182. I/O Pin Pull-up Resistor Current vs. Input Voltage (VCC = 1.8 V)
I/O PIN PULL-UP RESISTOR CURRENT vs. INPUT VOLTAGE
VCC = 1.8V
60
50
40
IOP (uA)
30
20
10 25˚C
85˚C
0
-40˚C
0 0,2 0,4 0,6 0,8 1 1,2 1,4 1,6 1,8 2
VOP (V)
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Figure 183. I/O Pin Pull-up Resistor Current vs. Input Voltage (VCC = 2.7 V)
I/O PIN PULL-UP RESISTOR CURRENT vs. INPUT VOLTAGE
VCC = 2.7V
90
80
70
60
IOP (uA)
50
40
30
20
85˚C
10
25˚C
0 -40˚C
0 0,5 1 1,5 2 2,5 3
VOP (V)
Figure 184. I/O Pin Pull-up Resistor Current vs. Input Voltage (VCC = 5V)
140
120
100
IOP (uA)
80
60
40
20 25˚C
85˚C
0 -40˚C
0 1 2 3 4 5 6
VOP (V)
400 ATmega640/1280/1281/2560/2561
2549K–AVR–01/07
ATmega640/1280/1281/2560/2561
Figure 185. Reset Pull-up Resistor Current vs. Reset Pin Voltage (VCC = 1.8 V)
RESET PULL-UP RESISTOR CURRENT vs. RESET PIN VOLTAGE
VCC = 1.8V
40
35
30
25
IRESET(uA)
20
15
10
5 25˚C
-40˚C
0 85˚C
0 0,2 0,4 0,6 0,8 1 1,2 1,4 1,6 1,8 2
VRESET(V)
Figure 186. Reset pull-up Resistor Current vs. Reset Pin Voltage (VCC = 2.7 V)
60
50
IRESET(uA)
40
30
20
10 25˚C
-40˚C
0 85˚C
0 0,5 1 1,5 2 2,5 3
VRESET(V)
401
2549K–AVR–01/07
Figure 187. Reset Pull-up Resistor Current vs. Reset Pin Voltage (VCC = 5 V)
100
80
IRESET(uA)
60
40
20
25˚C
-40˚C
0 85˚C
0 1 2 3 4 5 6
VRESET(V)
Pin Driver Strength Figure 188. I/O Pin output Voltage vs.Sink Current (VCC = 3 V)
I/O PIN OUTPUT VOLTAGE vs. SINK CURRENT
VCC = 3V
1
0,9
85˚C
0,8
0,7
25˚C
0,6
-40˚C
VOL (V)
0,5
0,4
0,3
0,2
0,1
0
0 5 10 15 20 25
IOL (mA)
402 ATmega640/1280/1281/2560/2561
2549K–AVR–01/07
ATmega640/1280/1281/2560/2561
Figure 189. I/O Pin Output Voltage vs. Sink Current (VCC = 5 V)
0,5
25˚C
0,4
-40˚C
VOL (V)
0,3
0,2
0,1
0
0 5 10 15 20 25
IOL (mA)
Figure 190. I/O Pin Output Voltage vs. Source Current (VCC = 3 V)
I/O PIN OUTPUT VOLTAGE vs. SOURCE CURRENT
VCC = 3V
3,5
2,5
-40˚C
25˚C
2
VOH (V)
85˚C
1,5
0,5
0
0 5 10 15 20 25
IOH (mA)
403
2549K–AVR–01/07
Figure 191. I/O Pin Output Voltage vs. Source Current (VCC = 5 V)
I/O PIN OUTPUT VOLTAGE vs. SOURCE CURRENT
VCC = 5V
5,1
4,9
4,8
VOH (V)
4,7
4,6
-40˚C
4,5
25˚C
4,4
85˚C
4,3
0 5 10 15 20 25
IOH (mA)
Pin Threshold and Figure 192. I/O Pin Input Threshold Voltage vs. VCC (VIH, IO Pin Read as “1“)
Hysteresis I/O PIN INPUT THRESHOLD VOLTAGE vs. V CC
VIH, IO PIN READ AS '1'
3,5
-40˚C
3 25˚C
85˚C
2,5
Threshold (V)
1,5
0,5
0
1,5 2 2,5 3 3,5 4 4,5 5 5,5
VCC (V)
404 ATmega640/1280/1281/2560/2561
2549K–AVR–01/07
ATmega640/1280/1281/2560/2561
Figure 193. I/O Pin Input Threshold Voltage vs. VCC (VIL, IO Pin Read as “0“)
I/O PIN INPUT THRESHOLD VOLTAGE vs. VCC
VIL, IO PIN READ AS '0'
2,5
85˚C
25˚C
-40˚C
2
Threshold (V)
1,5
0,5
0
1,5 2 2,5 3 3,5 4 4,5 5 5,5
VCC (V)
0,8
0,7
-40˚C
0,6
InputHyst eresis(mV)
0,5
25˚C
0,4 85˚C
0,3
0,2
0,1
0
1,5 2 2,5 3 3,5 4 4,5 5 5,5
VCC (V)
405
2549K–AVR–01/07
Figure 195. Reset Input Threshold Voltage vs. VCC (VIH, IO Pin Read as “1“)
Threshold (V)
1,5
0,5
0
1,5 2 2,5 3 3,5 4 4,5 5 5,5
VCC (V)
Figure 196. Reset Input Threshold Voltage vs. VCC (VIL, IO Pin Read as “0“)
RESET INPUT THRESHOLD VOLTAGE vs. V CC
VIL, IO PIN READ AS '0'
2,5
85 ˚C
25 ˚C
-40 ˚C
2
Threshold (V)
1,5
0,5
0
1,5 2 2,5 3 3,5 4 4,5 5 5,5
VCC (V)
406 ATmega640/1280/1281/2560/2561
2549K–AVR–01/07
ATmega640/1280/1281/2560/2561
0,7
0,6
Input Hysteresis(mV)
0,5
0,4
0,3
0,2
0,1 -40˚C
25˚C
0 85˚C
1,5 2 2,5 3 3,5 4 4,5 5 5,5
VCC (V)
BOD Threshold and Figure 198. BOD Threshold vs. Temperature (BOD Level is 4.3 V)
Analog Comparator
BOD THRESHOLDS vs. TEMPERATURE
Offset BODLEVELS IS 4.3V
4.4
4.35
Rising Vcc
Threshold (V)
4.3
4.25
Falling Vcc
4.2
-60 -40 -20 0 20 40 60 80 100
Temperature (C)
407
2549K–AVR–01/07
Figure 199. BOD Threshold vs. Temperature (BOD Level is 2.7 V)
Rising Vcc
2.75
Threshold (V)
2.7
Falling Vcc
2.65
2.6
-60 -40 -20 0 20 40 60 80 100
Temperature (C)
1.85
Rising Vcc
Threshol d ( V)
1.8
Fallling Vcc
1.75
1.7
-60 -40 -20 0 20 40 60 80 100
Temperature (C)
408 ATmega640/1280/1281/2560/2561
2549K–AVR–01/07
ATmega640/1280/1281/2560/2561
Internal Oscillator Speed Figure 201. Watchdog Oscillator Frequency vs. VCC
WATCHDOG OSCILLATOR FREQUENCY vs. VCC
128
126
-40˚C
124
25 ˚C
FRC (kHz)
122
120
118
116 85˚C
114
2 2,5 3 3,5 4 4,5 5 5,5
VCC (V)
128
126
124
FRC (kHz)
122
120
2.1V
118
2.7V
3.3V
4.0V
116
5.5V
114
-60 -40 -20 0 20 40 60 80 100
Temperature
409
2549K–AVR–01/07
Figure 203. Calibrated 8 MHz RC Oscillator Frequency vs. VCC
8,3
85˚C
8,2
8,1
25˚C
FRC (MHz)
8
7,9
-40˚C
7,8
7,7
7,6
1,5 2 2,5 3 3,5 4 4,5 5 5,5
VCC (V)
8,5
5.0V
8,4
3.0V
8,3
FRC (MHz)
8,2
8,1
7,9
-60 -40 -20 0 20 40 60 80 100
Temperature
410 ATmega640/1280/1281/2560/2561
2549K–AVR–01/07
ATmega640/1280/1281/2560/2561
16
85˚C
25˚C
14 -40˚C
12
10
FRC (MHz)
8
0
0 16 32 48 64 80 96 112 128 144 160 176 192 208 224 240 256
OSCCAL (X1)
30
85˚C
25 25˚C
-40˚C
20
ICC (uA)
15
10
0
1,5 2 2,5 3 3,5 4 4,5 5 5,5
VCC (V)
411
2549K–AVR–01/07
Figure 207. ADC Current vs. VCC (AREF = AVCC)
ADC CURRENT vs. VCC
AREF = AV CC
350
-40˚C
25˚C
300 85˚C
250
ICC (uA)
200
150
100
50
0
1,5 2 2,5 3 3,5 4 4,5 5 5,5
VCC (V)
250
-40˚C
200 25˚C
85˚C
150
ICC (uA)
100
50
0
1,5 2 2,5 3 3,5 4 4,5 5 5,5
VCC (V)
412 ATmega640/1280/1281/2560/2561
2549K–AVR–01/07
ATmega640/1280/1281/2560/2561
9
-40˚C
8
25˚C
7
85˚C
6
ICC (uA)
5
0
1,5 2 2,5 3 3,5 4 4,5 5 5,5
VCC (V)
100
90 -40˚C
80
25˚C
85˚C
70
60
ICC (uA)
50
40
30
20
10
0
1,5 2 2,5 3 3,5 4 4,5 5 5,5
VCC (V)
413
2549K–AVR–01/07
Figure 211. Programming Current vs. VCC
16
14 -40 ˚C
12
10 25 ˚C
ICC (mA)
8
85 ˚C
6
0
1,5 2 2,5 3 3,5 4 4,5 5 5,5
VCC (V)
Current Consumption in Figure 212. Reset Supply Current vs VCC (0.1 - 1.0 MHz, Excluding Current Through
Reset and Reset The Reset Pull-up)
Pulsewidth RESET SUPPLY CURRENT vs. VCC
0.1 - 1.0 MHz, EXCLUDING CURRENT THROUGH THE RESET PULLUP
0,35
5.5V
0,3
5.0V
0,25
4.5V
ICC (mA)
0,2
4.0V
0,15
3.3V
0,1 2.7V
0,05 1.8V
0
0 0,1 0,2 0,3 0,4 0,5 0,6 0,7 0,8 0,9 1
Frequency (MHz)
414 ATmega640/1280/1281/2560/2561
2549K–AVR–01/07
ATmega640/1280/1281/2560/2561
Figure 213. Reset Supply Current vs. VCC (1 - 16 MHz, Excluding Current Through The
Reset Pull-up)
3,5 5.5V
5.0V
3
4.5V
2,5
ICC (mA) 2
4.0V
1,5
1
3.3V
0,5
2.7V
1.8V
0
0 2 4 6 8 10 12 14 16
Frequency (MHz)
2500
2000
Pulsewidth (ns)
1500
1000
500 85˚C
25˚C
-40˚C
0
1,5 2 2,5 3 3,5 4 4,5 5 5,5
VCC (V)
415
2549K–AVR–01/07
Register Summary
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page
(0x1FF) Reserved - - - - - - - -
... Reserved - - - - - - - -
(0x13F) Reserved
(0x13E) Reserved
(0x13D) Reserved
(0x13C) Reserved
(0x13B) Reserved
(0x13A) Reserved
(0x139) Reserved
(0x138) Reserved
(0x137) Reserved
(0x136) UDR3 USART3 I/O Data Register page 227
(0x135) UBRR3H - - - - USART3 Baud Rate Register High Byte page 231
(0x134) UBRR3L USART3 Baud Rate Register Low Byte page 231
(0x133) Reserved - - - - - - - -
(0x132) UCSR3C UMSEL31 UMSEL30 UPM31 UPM30 USBS3 UCSZ31 UCSZ30 UCPOL3 page 244
(0x131) UCSR3B RXCIE3 TXCIE3 UDRIE3 RXEN3 TXEN3 UCSZ32 RXB83 TXB83 page 243
(0x130) UCSR3A RXC3 TXC3 UDRE3 FE3 DOR3 UPE3 U2X3 MPCM3 page 242
(0x12F) Reserved - - - - - - - -
(0x12E) Reserved - - - - - - - -
(0x12D) OCR5CH Timer/Counter5 - Output Compare Register C High Byte page 167
(0x12C) OCR5CL Timer/Counter5 - Output Compare Register C Low Byte page 167
(0x12B) OCR5BH Timer/Counter5 - Output Compare Register B High Byte page 167
(0x12A) OCR5BL Timer/Counter5 - Output Compare Register B Low Byte page 167
(0x129) OCR5AH Timer/Counter5 - Output Compare Register A High Byte page 167
(0x128) OCR5AL Timer/Counter5 - Output Compare Register A Low Byte page 167
(0x127) ICR5H Timer/Counter5 - Input Capture Register High Byte page 168
(0x126) ICR5L Timer/Counter5 - Input Capture Register Low Byte page 168
(0x125) TCNT5H Timer/Counter5 - Counter Register High Byte page 165
(0x124) TCNT5L Timer/Counter5 - Counter Register Low Byte page 165
(0x123) Reserved - - - - - - - -
(0x122) TCCR5C FOC5A FOC5B FOC5C - - - - - page 164
(0x121) TCCR5B ICNC5 ICES5 - WGM53 WGM52 CS52 CS51 CS50 page 162
(0x120) TCCR5A COM5A1 COM5A0 COM5B1 COM5B0 COM5C1 COM5C0 WGM51 WGM50 page 160
(0x11F) Reserved - - - - - - - -
(0x11E) Reserved - - - - - - - -
(0x11D) Reserved - - - - - - - -
(0x11C) Reserved - - - - - - - -
(0x11B) Reserved - - - - - - - -
(0x11A) Reserved - - - - - - - -
(0x119) Reserved - - - - - - - -
(0x118) Reserved - - - - - - - -
(0x117) Reserved - - - - - - - -
(0x116) Reserved - - - - - - - -
(0x115) Reserved - - - - - - - -
(0x114) Reserved - - - - - - - -
(0x113) Reserved - - - - - - - -
(0x112) Reserved - - - - - - - -
(0x111) Reserved - - - - - - - -
(0x110) Reserved - - - - - - - -
(0x10F) Reserved - - - - - - - -
(0x10E) Reserved - - - - - - - -
(0x10D) Reserved - - - - - - - -
(0x10C) Reserved - - - - - - - -
(0x10B) PORTL PORTL7 PORTL6 PORTL5 PORTL4 PORTL3 PORTL2 PORTL1 PORTL0 page 118
(0x10A) DDRL DDL7 DDL6 DDL5 DDL4 DDL3 DDL2 DDL1 DDL0 page 118
(0x109) PINL PINL7 PINL6 PINL5 PINL4 PINL3 PINL2 PINL1 PINL0 page 118
(0x108) PORTK PORTK7 PORTK6 PORTK5 PORTK4 PORTK3 PORTK2 PORTK1 PORTK0 page 118
(0x107) DDRK DDK7 DDK6 DDK5 DDK4 DDK3 DDK2 DDK1 DDK0 page 118
(0x106) PINK PINK7 PINK6 PINK5 PINK4 PINK3 PINK2 PINK1 PINK0 page 118
(0x105) PORTJ PORTJ7 PORTJ6 PORTJ5 PORTJ4 PORTJ3 PORTJ2 PORTJ1 PORTJ0 page 118
(0x104) DDRJ DDJ7 DDJ6 DDJ5 DDJ4 DDJ3 DDJ2 DDJ1 DDJ0 page 118
(0x103) PINJ PINJ7 PINJ6 PINJ5 PINJ4 PINJ3 PINJ2 PINJ1 PINJ0 page 118
(0x102) PORTH PORTH7 PORTH6 PORTH5 PORTH4 PORTH3 PORTH2 PORTH1 PORTH0 page 117
416 ATmega640/1280/1281/2560/2561
2549K–AVR–01/07
ATmega640/1280/1281/2560/2561
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page
(0x101) DDRH DDH7 DDH6 DDH5 DDH4 DDH3 DDH2 DDH1 DDH0 page 117
(0x100) PINH PINH7 PINH6 PINH5 PINH4 PINH3 PINH2 PINH1 PINH0 page 117
(0xFF) Reserved - - - - - - - -
(0xFE) Reserved - - - - - - - -
(0xFD) Reserved - - - - - - - -
(0xFC) Reserved - - - - - - - -
(0xFB) Reserved - - - - - - - -
(0xFA) Reserved - - - - - - - -
(0xF9) Reserved - - - - - - - -
(0xF8) Reserved - - - - - - - -
(0xF7) Reserved - - - - - - - -
(0xF6) Reserved - - - - - - - -
(0xF5) Reserved - - - - - - - -
(0xF4) Reserved - - - - - - - -
(0xF3) Reserved - - - - - - - -
(0xF2) Reserved - - - - - - - -
(0xF1) Reserved - - - - - - - -
(0xF0) Reserved - - - - - - - -
(0xEF) Reserved - - - - - - - -
(0xEE) Reserved - - - - - - - -
(0xED) Reserved - - - - - - - -
(0xEC) Reserved - - - - - - - -
(0xEB) Reserved - - - - - - -
(0xEA) Reserved - - - - - - - -
(0xE9) Reserved - - - - - - - -
(0xE8) Reserved - - - - - - - -
(0xE7) Reserved - - - - - - -
(0xE6) Reserved - - - - - - - -
(0xE5) Reserved - - - - - - - -
(0xE4) Reserved - - - - - - - -
(0xE3) Reserved - - - - - - -
(0xE2) Reserved - - - - - - - -
(0xE1) Reserved - - - - - - -
(0xE0) Reserved - - - - - - -
(0xDF) Reserved - - - - - - - -
(0xDE) Reserved - - - - - - - -
(0xDD) Reserved - - - - - - -
(0xDC) Reserved - - - - - - - -
(0xDB) Reserved - - - - - - - -
(0xDA) Reserved - - - - - - - -
(0xD9) Reserved - - - - - - -
(0xD8) Reserved - - - - - - - -
(0xD7) Reserved - - - - - - - -
(0xD6) UDR2 USART2 I/O Data Register page 227
(0xD5) UBRR2H - - - - USART2 Baud Rate Register High Byte page 231
(0xD4) UBRR2L USART2 Baud Rate Register Low Byte page 231
(0xD3) Reserved - - - - - - - -
(0xD2) UCSR2C UMSEL21 UMSEL20 UPM21 UPM20 USBS2 UCSZ21 UCSZ20 UCPOL2 page 244
(0xD1) UCSR2B RXCIE2 TXCIE2 UDRIE2 RXEN2 TXEN2 UCSZ22 RXB82 TXB82 page 243
(0xD0) UCSR2A RXC2 TXC2 UDRE2 FE2 DOR2 UPE2 U2X2 MPCM2 page 242
(0xCF) Reserved - - - - - - - -
(0xCE) UDR1 USART1 I/O Data Register page 227
(0xCD) UBRR1H - - - - USART1 Baud Rate Register High Byte page 231
(0xCC) UBRR1L USART1 Baud Rate Register Low Byte page 231
(0xCB) Reserved - - - - - - - -
(0xCA) UCSR1C UMSEL11 UMSEL10 UPM11 UPM10 USBS1 UCSZ11 UCSZ10 UCPOL1 page 244
(0xC9) UCSR1B RXCIE1 TXCIE1 UDRIE1 RXEN1 TXEN1 UCSZ12 RXB81 TXB81 page 243
(0xC8) UCSR1A RXC1 TXC1 UDRE1 FE1 DOR1 UPE1 U2X1 MPCM1 page 242
(0xC7) Reserved - - - - - - - -
(0xC6) UDR0 USART0 I/O Data Register page 227
(0xC5) UBRR0H - - - - USART0 Baud Rate Register High Byte page 231
(0xC4) UBRR0L USART0 Baud Rate Register Low Byte page 231
(0xC3) Reserved - - - - - - - -
(0xC2) UCSR0C UMSEL01 UMSEL00 UPM01 UPM00 USBS0 UCSZ01 UCSZ00 UCPOL0 page 244
(0xC1) UCSR0B RXCIE0 TXCIE0 UDRIE0 RXEN0 TXEN0 UCSZ02 RXB80 TXB80 page 243
(0xC0) UCSR0A RXC0 TXC0 UDRE0 FE0 DOR0 UPE0 U2X0 MPCM0 page 243
417
2549K–AVR–01/07
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page
(0xBF) Reserved - - - - - - - -
(0xBE) Reserved - - - - - - - -
(0xBD) TWAMR TWAM6 TWAM5 TWAM4 TWAM3 TWAM2 TWAM1 TWAM0 - page 274
(0xBC) TWCR TWINT TWEA TWSTA TWSTO TWWC TWEN - TWIE page 271
(0xBB) TWDR 2-wire Serial Interface Data Register page 273
(0xBA) TWAR TWA6 TWA5 TWA4 TWA3 TWA2 TWA1 TWA0 TWGCE page 273
(0xB9) TWSR TWS7 TWS6 TWS5 TWS4 TWS3 - TWPS1 TWPS0 page 272
(0xB8) TWBR 2-wire Serial Interface Bit Rate Register page 271
(0xB7) Reserved - - - - - - - -
(0xB6) ASSR - EXCLK AS2 TCN2UB OCR2AUB OCR2BUB TCR2AUB TCR2BUB page 188
(0xB5) Reserved - - - - - - - -
(0xB4) OCR2B Timer/Counter2 Output Compare Register B page 195
(0xB3) OCR2A Timer/Counter2 Output Compare Register A page 195
(0xB2) TCNT2 Timer/Counter2 (8 Bit) page 195
(0xB1) TCCR2B FOC2A FOC2B - - WGM22 CS22 CS21 CS20 page 194
(0xB0) TCCR2A COM2A1 COM2A0 COM2B1 COM2B0 - - WGM21 WGM20 page 195
(0xAF) Reserved - - - - - - - -
(0xAE) Reserved - - - - - - - -
(0xAD) OCR4CH Timer/Counter4 - Output Compare Register C High Byte page 167
(0xAC) OCR4CL Timer/Counter4 - Output Compare Register C Low Byte page 167
(0xAB) OCR4BH Timer/Counter4 - Output Compare Register B High Byte page 166
(0xAA) OCR4BL Timer/Counter4 - Output Compare Register B Low Byte page 166
(0xA9) OCR4AH Timer/Counter4 - Output Compare Register A High Byte page 166
(0xA8) OCR4AL Timer/Counter4 - Output Compare Register A Low Byte page 166
(0xA7) ICR4H Timer/Counter4 - Input Capture Register High Byte page 168
(0xA6) ICR4L Timer/Counter4 - Input Capture Register Low Byte page 168
(0xA5) TCNT4H Timer/Counter4 - Counter Register High Byte page 165
(0xA4) TCNT4L Timer/Counter4 - Counter Register Low Byte page 165
(0xA3) Reserved - - - - - - - -
(0xA2) TCCR4C FOC4A FOC4B FOC4C - - - - - page 164
(0xA1) TCCR4B ICNC4 ICES4 - WGM43 WGM42 CS42 CS41 CS40 page 162
(0xA0) TCCR4A COM4A1 COM4A0 COM4B1 COM4B0 COM4C1 COM4C0 WGM41 WGM40 page 160
(0x9F) Reserved - - - - - - - -
(0x9E) Reserved - - - - - - - -
(0x9D) OCR3CH Timer/Counter3 - Output Compare Register C High Byte page 166
(0x9C) OCR3CL Timer/Counter3 - Output Compare Register C Low Byte page 166
(0x9B) OCR3BH Timer/Counter3 - Output Compare Register B High Byte page 166
(0x9A) OCR3BL Timer/Counter3 - Output Compare Register B Low Byte page 166
(0x99) OCR3AH Timer/Counter3 - Output Compare Register A High Byte page 166
(0x98) OCR3AL Timer/Counter3 - Output Compare Register A Low Byte page 166
(0x97) ICR3H Timer/Counter3 - Input Capture Register High Byte page 168
(0x96) ICR3L Timer/Counter3 - Input Capture Register Low Byte page 168
(0x95) TCNT3H Timer/Counter3 - Counter Register High Byte page 165
(0x94) TCNT3L Timer/Counter3 - Counter Register Low Byte page 165
(0x93) Reserved - - - - - - - -
(0x92) TCCR3C FOC3A FOC3B FOC3C - - - - - page 164
(0x91) TCCR3B ICNC3 ICES3 - WGM33 WGM32 CS32 CS31 CS30 page 162
(0x90) TCCR3A COM3A1 COM3A0 COM3B1 COM3B0 COM3C1 COM3C0 WGM31 WGM30 page 160
(0x8F) Reserved - - - - - - - -
(0x8E) Reserved - - - - - - - -
(0x8D) OCR1CH Timer/Counter1 - Output Compare Register C High Byte page 166
(0x8C) OCR1CL Timer/Counter1 - Output Compare Register C Low Byte page 166
(0x8B) OCR1BH Timer/Counter1 - Output Compare Register B High Byte page 166
(0x8A) OCR1BL Timer/Counter1 - Output Compare Register B Low Byte page 166
(0x89) OCR1AH Timer/Counter1 - Output Compare Register A High Byte page 166
(0x88) OCR1AL Timer/Counter1 - Output Compare Register A Low Byte page 166
(0x87) ICR1H Timer/Counter1 - Input Capture Register High Byte page 168
(0x86) ICR1L Timer/Counter1 - Input Capture Register Low Byte page 168
(0x85) TCNT1H Timer/Counter1 - Counter Register High Byte page 165
(0x84) TCNT1L Timer/Counter1 - Counter Register Low Byte page 165
(0x83) Reserved - - - - - - - -
(0x82) TCCR1C FOC1A FOC1B FOC1C - - - - - page 164
(0x81) TCCR1B ICNC1 ICES1 - WGM13 WGM12 CS12 CS11 CS10 page 162
(0x80) TCCR1A COM1A1 COM1A0 COM1B1 COM1B0 COM1C1 COM1C0 WGM11 WGM10 page 160
(0x7F) DIDR1 - - - - - - AIN1D AIN0D page 278
(0x7E) DIDR0 ADC7D ADC6D ADC5D ADC4D ADC3D ADC2D ADC1D ADC0D page 300
418 ATmega640/1280/1281/2560/2561
2549K–AVR–01/07
ATmega640/1280/1281/2560/2561
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page
(0x7D) DIDR2 ADC15D ADC14D ADC13D ADC12D ADC11D ADC10D ADC9D ADC8D page 300
(0x7C) ADMUX REFS1 REFS0 ADLAR MUX4 MUX3 MUX2 MUX1 MUX0 page 294
(0x7B) ADCSRB - ACME - - MUX5 ADTS2 ADTS1 ADTS0 page 277,295,,299
(0x7A) ADCSRA ADEN ADSC ADATE ADIF ADIE ADPS2 ADPS1 ADPS0 page 297
(0x79) ADCH ADC Data Register High byte page 298
(0x78) ADCL ADC Data Register Low byte page 298
(0x77) Reserved - - - - - - - -
(0x76) Reserved - - - - - - - -
(0x75) XMCRB XMBK - - - - XMM2 XMM1 XMM0 page 36
(0x74) XMCRA SRE SRL2 SRL1 SRL0 SRW11 SRW10 SRW01 SRW00 page 34
(0x73) TIMSK5 - - ICIE5 - OCIE5C OCIE5B OCIE5A TOIE5 page 169
(0x72) TIMSK4 - - ICIE4 - OCIE4C OCIE4B OCIE4A TOIE4 page 169
(0x71) TIMSK3 - - ICIE3 - OCIE3C OCIE3B OCIE3A TOIE3 page 169
(0x70) TIMSK2 - - - - - OCIE2B OCIE2A TOIE2 page 197
(0x6F) TIMSK1 - - ICIE1 - OCIE1C OCIE1B OCIE1A TOIE1 page 169
(0x6E) TIMSK0 - - - - - OCIE0B OCIE0A TOIE0 page 135
(0x6D) PCMSK2 PCINT23 PCINT22 PCINT21 PCINT20 PCINT19 PCINT18 PCINT17 PCINT16 page 81
(0x6C) PCMSK1 PCINT15 PCINT14 PCINT13 PCINT12 PCINT11 PCINT10 PCINT9 PCINT8 page 81
(0x6B) PCMSK0 PCINT7 PCINT6 PCINT5 PCINT4 PCINT3 PCINT2 PCINT1 PCINT0 page 82
(0x6A) EICRB ISC71 ISC70 ISC61 ISC60 ISC51 ISC50 ISC41 ISC40 page 79
(0x69) EICRA ISC31 ISC30 ISC21 ISC20 ISC11 ISC10 ISC01 ISC00 page 78
(0x68) PCICR - - - - - PCIE2 PCIE1 PCIE0 page 80
(0x67) Reserved - - - - - - - -
(0x66) OSCCAL Oscillator Calibration Register page 48
(0x65) PRR1 - - PRTIM5 PRTIM4 PRTIM3 PRUSART3 PRUSART2 PRUSART1 page 56
(0x64) PRR0 PRTWI PRTIM2 PRTIM0 - PRTIM1 PRSPI PRUSART0 PRADC page 55
(0x63) Reserved - - - - - - - -
(0x62) Reserved - - - - - - - -
(0x61) CLKPR CLKPCE - - - CLKPS3 CLKPS2 CLKPS1 CLKPS0 page 48
(0x60) WDTCSR WDIF WDIE WDP3 WDCE WDE WDP2 WDP1 WDP0 page 66
0x3F (0x5F) SREG I T H S V N Z C page 12
0x3E (0x5E) SPH SP15 SP14 SP13 SP12 SP11 SP10 SP9 SP8 page 14
0x3D (0x5D) SPL SP7 SP6 SP5 SP4 SP3 SP2 SP1 SP0 page 14
0x3C (0x5C) EIND - - - - - - - EIND0 page 15
0x3B (0x5B) RAMPZ - - - - - - RAMPZ1 RAMPZ0 page 15
0x3A (0x5A) Reserved - - - - - - - -
0x39 (0x59) Reserved - - - - - - - -
0x38 (0x58) Reserved - - - - - - - -
0x37 (0x57) SPMCSR SPMIE RWWSB SIGRD RWWSRE BLBSET PGWRT PGERS SPMEN page 340
0x36 (0x56) Reserved - - - - - - - -
0x35 (0x55) MCUCR JTD - - PUD - - IVSEL IVCE page 66,76,115,314
0x34 (0x54) MCUSR - - - JTRF WDRF BORF EXTRF PORF page 314
0x33 (0x53) SMCR - - - - SM2 SM1 SM0 SE page 51
0x32 (0x52) Reserved - - - - - - - -
0x31 (0x51) OCDR OCDR7 OCDR6 OCDR5 OCDR4 OCDR3 OCDR2 OCDR1 OCDR0 page 307
0x30 (0x50) ACSR ACD ACBG ACO ACI ACIE ACIC ACIS1 ACIS0 page 277
0x2F (0x4F) Reserved - - - - - - - -
0x2E (0x4E) SPDR SPI Data Register page 208
0x2D (0x4D) SPSR SPIF WCOL - - - - - SPI2X page 207
0x2C (0x4C) SPCR SPIE SPE DORD MSTR CPOL CPHA SPR1 SPR0 page 206
0x2B (0x4B) GPIOR2 General Purpose I/O Register 2 page 34
0x2A (0x4A) GPIOR1 General Purpose I/O Register 1 page 34
0x29 (0x49) Reserved - - - - - - - -
0x28 (0x48) OCR0B Timer/Counter0 Output Compare Register B page 134
0x27 (0x47) OCR0A Timer/Counter0 Output Compare Register A page 134
0x26 (0x46) TCNT0 Timer/Counter0 (8 Bit) page 134
0x25 (0x45) TCCR0B FOC0A FOC0B - - WGM02 CS02 CS01 CS00 page 133
0x24 (0x44) TCCR0A COM0A1 COM0A0 COM0B1 COM0B0 - - WGM01 WGM00 page 130
0x23 (0x43) GTCCR TSM - - - - - PSRASY PSRSYNC page 173, 198
0x22 (0x42) EEARH - - - - EEPROM Address Register High Byte page 32
0x21 (0x41) EEARL EEPROM Address Register Low Byte page 32
0x20 (0x40) EEDR EEPROM Data Register page 32
0x1F (0x3F) EECR - - EEPM1 EEPM0 EERIE EEMPE EEPE EERE page 32
0x1E (0x3E) GPIOR0 General Purpose I/O Register 0 page 34
0x1D (0x3D) EIMSK INT7 INT6 INT5 INT4 INT3 INT2 INT1 INT0 page 79
0x1C (0x3C) EIFR INTF7 INTF6 INTF5 INTF4 INTF3 INTF2 INTF1 INTF0 page 80
419
2549K–AVR–01/07
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page
0x1B (0x3B) PCIFR - - - - - PCIF2 PCIF1 PCIF0 page 81
0x1A (0x3A) TIFR5 - - ICF5 - OCF5C OCF5B OCF5A TOV5 page 169
0x19 (0x39) TIFR4 - - ICF4 - OCF4C OCF4B OCF4A TOV4 page 170
0x18 (0x38) TIFR3 - - ICF3 - OCF3C OCF3B OCF3A TOV3 page 170
0x17 (0x37) TIFR2 - - - - - OCF2B OCF2A TOV2 page 197
0x16 (0x36) TIFR1 - - ICF1 - OCF1C OCF1B OCF1A TOV1 page 170
0x15 (0x35) TIFR0 - - - - - OCF0B OCF0A TOV0 page 135
0x14 (0x34) PORTG - - PORTG5 PORTG4 PORTG3 PORTG2 PORTG1 PORTG0 page 117
0x13 (0x33) DDRG - - DDG5 DDG4 DDG3 DDG2 DDG1 DDG0 page 117
0x12 (0x32) PING - - PING5 PING4 PING3 PING2 PING1 PING0 page 117
0x11 (0x31) PORTF PORTF7 PORTF6 PORTF5 PORTF4 PORTF3 PORTF2 PORTF1 PORTF0 page 116
0x10 (0x30) DDRF DDF7 DDF6 DDF5 DDF4 DDF3 DDF2 DDF1 DDF0 page 117
0x0F (0x2F) PINF PINF7 PINF6 PINF5 PINF4 PINF3 PINF2 PINF1 PINF0 page 117
0x0E (0x2E) PORTE PORTE7 PORTE6 PORTE5 PORTE4 PORTE3 PORTE2 PORTE1 PORTE0 page 116
0x0D (0x2D) DDRE DDE7 DDE6 DDE5 DDE4 DDE3 DDE2 DDE1 DDE0 page 116
0x0C (0x2C) PINE PINE7 PINE6 PINE5 PINE4 PINE3 PINE2 PINE1 PINE0 page 116
0x0B (0x2B) PORTD PORTD7 PORTD6 PORTD5 PORTD4 PORTD3 PORTD2 PORTD1 PORTD0 page 116
0x0A (0x2A) DDRD DDD7 DDD6 DDD5 DDD4 DDD3 DDD2 DDD1 DDD0 page 116
0x09 (0x29) PIND PIND7 PIND6 PIND5 PIND4 PIND3 PIND2 PIND1 PIND0 page 116
0x08 (0x28) PORTC PORTC7 PORTC6 PORTC5 PORTC4 PORTC3 PORTC2 PORTC1 PORTC0 page 116
0x07 (0x27) DDRC DDC7 DDC6 DDC5 DDC4 DDC3 DDC2 DDC1 DDC0 page 116
0x06 (0x26) PINC PINC7 PINC6 PINC5 PINC4 PINC3 PINC2 PINC1 PINC0 page 116
0x05 (0x25) PORTB PORTB7 PORTB6 PORTB5 PORTB4 PORTB3 PORTB2 PORTB1 PORTB0 page 115
0x04 (0x24) DDRB DDB7 DDB6 DDB5 DDB4 DDB3 DDB2 DDB1 DDB0 page 115
0x03 (0x23) PINB PINB7 PINB6 PINB5 PINB4 PINB3 PINB2 PINB1 PINB0 page 115
0x02 (0x22) PORTA PORTA7 PORTA6 PORTA5 PORTA4 PORTA3 PORTA2 PORTA1 PORTA0 page 115
0x01 (0x21) DDRA DDA7 DDA6 DDA5 DDA4 DDA3 DDA2 DDA1 DDA0 page 115
0x00 (0x20) PINA PINA7 PINA6 PINA5 PINA4 PINA3 PINA2 PINA1 PINA0 page 115
Note: 1. For compatibility with future devices, reserved bits should be written to zero if accessed. Reserved I/O memory addresses
should never be written.
2. I/O registers within the address range $00 - $1F are directly bit-accessible using the SBI and CBI instructions. In these reg-
isters, the value of single bits can be checked by using the SBIS and SBIC instructions.
3. Some of the status flags are cleared by writing a logical one to them. Note that the CBI and SBI instructions will operate on
all bits in the I/O register, writing a one back into any flag read as set, thus clearing the flag. The CBI and SBI instructions
work with registers 0x00 to 0x1F only.
4. When using the I/O specific commands IN and OUT, the I/O addresses $00 - $3F must be used. When addressing I/O regis-
ters as data space using LD and ST instructions, $20 must be added to these addresses. The
ATmega640/1280/1281/2560/2561 is a complex microcontroller with more peripheral units than can be supported within
the 64 location reserved in Opcode for the IN and OUT instructions. For the Extended I/O space from $60 - $1FF in SRAM,
only the ST/STS/STD and LD/LDS/LDD instructions can be used.
420 ATmega640/1280/1281/2560/2561
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ATmega640/1280/1281/2560/2561
421
2549K–AVR–01/07
Mnemonics Operands Description Operation Flags #Clocks
BRVS k Branch if Overflow Flag is Set if (V = 1) then PC ← PC + k + 1 None 1/2
BRVC k Branch if Overflow Flag is Cleared if (V = 0) then PC ← PC + k + 1 None 1/2
BRIE k Branch if Interrupt Enabled if ( I = 1) then PC ← PC + k + 1 None 1/2
BRID k Branch if Interrupt Disabled if ( I = 0) then PC ← PC + k + 1 None 1/2
BIT AND BIT-TEST INSTRUCTIONS
SBI P,b Set Bit in I/O Register I/O(P,b) ← 1 None 2
CBI P,b Clear Bit in I/O Register I/O(P,b) ← 0 None 2
LSL Rd Logical Shift Left Rd(n+1) ← Rd(n), Rd(0) ← 0 Z,C,N,V 1
LSR Rd Logical Shift Right Rd(n) ← Rd(n+1), Rd(7) ← 0 Z,C,N,V 1
ROL Rd Rotate Left Through Carry Rd(0)←C,Rd(n+1)← Rd(n),C←Rd(7) Z,C,N,V 1
ROR Rd Rotate Right Through Carry Rd(7)←C,Rd(n)← Rd(n+1),C←Rd(0) Z,C,N,V 1
ASR Rd Arithmetic Shift Right Rd(n) ← Rd(n+1), n=0..6 Z,C,N,V 1
SWAP Rd Swap Nibbles Rd(3..0)←Rd(7..4),Rd(7..4)←Rd(3..0) None 1
BSET s Flag Set SREG(s) ← 1 SREG(s) 1
BCLR s Flag Clear SREG(s) ← 0 SREG(s) 1
BST Rr, b Bit Store from Register to T T ← Rr(b) T 1
BLD Rd, b Bit load from T to Register Rd(b) ← T None 1
SEC Set Carry C←1 C 1
CLC Clear Carry C←0 C 1
SEN Set Negative Flag N←1 N 1
CLN Clear Negative Flag N←0 N 1
SEZ Set Zero Flag Z←1 Z 1
CLZ Clear Zero Flag Z←0 Z 1
SEI Global Interrupt Enable I←1 I 1
CLI Global Interrupt Disable I←0 I 1
SES Set Signed Test Flag S←1 S 1
CLS Clear Signed Test Flag S←0 S 1
SEV Set Twos Complement Overflow. V←1 V 1
CLV Clear Twos Complement Overflow V←0 V 1
SET Set T in SREG T←1 T 1
CLT Clear T in SREG T←0 T 1
SEH Set Half Carry Flag in SREG H←1 H 1
CLH Clear Half Carry Flag in SREG H←0 H 1
DATA TRANSFER INSTRUCTIONS
MOV Rd, Rr Move Between Registers Rd ← Rr None 1
MOVW Rd, Rr Copy Register Word Rd+1:Rd ← Rr+1:Rr None 1
LDI Rd, K Load Immediate Rd ← K None 1
LD Rd, X Load Indirect Rd ← (X) None 2
LD Rd, X+ Load Indirect and Post-Inc. Rd ← (X), X ← X + 1 None 2
LD Rd, - X Load Indirect and Pre-Dec. X ← X - 1, Rd ← (X) None 2
LD Rd, Y Load Indirect Rd ← (Y) None 2
LD Rd, Y+ Load Indirect and Post-Inc. Rd ← (Y), Y ← Y + 1 None 2
LD Rd, - Y Load Indirect and Pre-Dec. Y ← Y - 1, Rd ← (Y) None 2
LDD Rd,Y+q Load Indirect with Displacement Rd ← (Y + q) None 2
LD Rd, Z Load Indirect Rd ← (Z) None 2
LD Rd, Z+ Load Indirect and Post-Inc. Rd ← (Z), Z ← Z+1 None 2
LD Rd, -Z Load Indirect and Pre-Dec. Z ← Z - 1, Rd ← (Z) None 2
LDD Rd, Z+q Load Indirect with Displacement Rd ← (Z + q) None 2
LDS Rd, k Load Direct from SRAM Rd ← (k) None 2
ST X, Rr Store Indirect (X) ← Rr None 2
ST X+, Rr Store Indirect and Post-Inc. (X) ← Rr, X ← X + 1 None 2
ST - X, Rr Store Indirect and Pre-Dec. X ← X - 1, (X) ← Rr None 2
ST Y, Rr Store Indirect (Y) ← Rr None 2
ST Y+, Rr Store Indirect and Post-Inc. (Y) ← Rr, Y ← Y + 1 None 2
ST - Y, Rr Store Indirect and Pre-Dec. Y ← Y - 1, (Y) ← Rr None 2
STD Y+q,Rr Store Indirect with Displacement (Y + q) ← Rr None 2
ST Z, Rr Store Indirect (Z) ← Rr None 2
ST Z+, Rr Store Indirect and Post-Inc. (Z) ← Rr, Z ← Z + 1 None 2
ST -Z, Rr Store Indirect and Pre-Dec. Z ← Z - 1, (Z) ← Rr None 2
STD Z+q,Rr Store Indirect with Displacement (Z + q) ← Rr None 2
STS k, Rr Store Direct to SRAM (k) ← Rr None 2
LPM Load Program Memory R0 ← (Z) None 3
LPM Rd, Z Load Program Memory Rd ← (Z) None 3
LPM Rd, Z+ Load Program Memory and Post-Inc Rd ← (Z), Z ← Z+1 None 3
ELPM Extended Load Program Memory R0 ← (RAMPZ:Z) None 3
ELPM Rd, Z Extended Load Program Memory Rd ← (RAMPZ:Z) None 3
422 ATmega640/1280/1281/2560/2561
2549K–AVR–01/07
ATmega640/1280/1281/2560/2561
423
2549K–AVR–01/07
Ordering Information
ATmega640
Speed (MHz)(2) Power Supply Ordering Code Package(1)(3) Operation Range
ATmega640V-8AU 100A
8 1.8 - 5.5V Industrial (-40°C to 85°C)
ATmega640V-8CU 100C1
ATmega640-16AU 100A
16 2.7 - 5.5V Industrial (-40°C to 85°C)
ATmega640-16CU 100C1
Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information
and minimum quantities.
2. See “Maximum speed vs. VCC” on page 377.
3. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also
Halide free and fully Green.
Package Type
64A 64-lead, Thin (1.0 mm) Plastic Gull Wing Quad Flat Package (TQFP)
64M2 64-pad, 9 x 9 x 1.0 mm Body, Quad Flat No-lead/Micro Lead Frame Package (QFN/MLF)
100A 100-lead, Thin (1.0 mm) Plastic Gull Wing Quad Flat Package (TQFP)
100C1 100-ball, Chip Ball Grid Array (CBGA)
424 ATmega640/1280/1281/2560/2561
2549K–AVR–01/07
ATmega640/1280/1281/2560/2561
ATmega1281
Speed (MHz)(2) Power Supply Ordering Code Package(1)(3) Operation Range
ATmega1281V-8AU 64A Industrial
8 1.8 - 5.5V
ATmega1281V-8MU 64M2 (-40°C to 85°C)
ATmega1281-16AU 64A Industrial
16 2.7 - 5.5V
ATmega1281-16MU 64M2 (-40°C to 85°C)
Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information
and minimum quantities.
2. See “Maximum speed vs. VCC” on page 377.
3. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also
Halide free and fully Green.
Package Type
64A 64-lead, Thin (1.0 mm) Plastic Gull Wing Quad Flat Package (TQFP)
64M2 64-pad, 9 x 9 x 1.0 mm Body, Quad Flat No-lead/Micro Lead Frame Package (QFN/MLF)
100A 100-lead, Thin (1.0 mm) Plastic Gull Wing Quad Flat Package (TQFP)
100C1 100-ball, Chip Ball Grid Array (CBGA)
425
2549K–AVR–01/07
ATmega1280
Speed (MHz)(2) Power Supply Ordering Code Package(1)(3) Operation Range
ATmega1280V-8AU 100A
8 1.8 - 5.5V Industrial (-40°C to 85°C)
ATmega1280V-8CU 100C1
ATmega1280-16AU 100A
16 2.7 - 5.5V Industrial (-40°C to 85°C)
ATmega1280-16AU 100C1
Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information
and minimum quantities.
2. See “Maximum speed vs. VCC” on page 377.
3. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also
Halide free and fully Green.
Package Type
64A 64-lead, Thin (1.0 mm) Plastic Gull Wing Quad Flat Package (TQFP)
64M2 64-pad, 9 x 9 x 1.0 mm Body, Quad Flat No-lead/Micro Lead Frame Package (QFN/MLF)
100A 100-lead, Thin (1.0 mm) Plastic Gull Wing Quad Flat Package (TQFP)
100C1 100-ball, Chip Ball Grid Array (CBGA)
426 ATmega640/1280/1281/2560/2561
2549K–AVR–01/07
ATmega640/1280/1281/2560/2561
ATmega2561
Speed (MHz)(2) Power Supply Ordering Code Package(1)(3) Operation Range
ATmega2561V-8AU 64A Industrial
8 1.8 - 5.5V
ATmega2561V-8MU 64M2 (-40°C to 85°C)
ATmega2561-16AU 64A Industrial
16 4.5 - 5.5V
ATmega2561-16MU 64M2 (-40°C to 85°C)
Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information
and minimum quantities.
2. See “Maximum speed vs. VCC” on page 377.
3. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also
Halide free and fully Green.
Package Type
64A 64-lead, Thin (1.0 mm) Plastic Gull Wing Quad Flat Package (TQFP)
64M2 64-pad, 9 x 9 x 1.0 mm Body, Quad Flat No-lead/Micro Lead Frame Package (QFN/MLF)
100A 100-lead, Thin (1.0 mm) Plastic Gull Wing Quad Flat Package (TQFP)
100C1 100-ball, Chip Ball Grid Array (CBGA)
427
2549K–AVR–01/07
ATmega2560
Speed (MHz)(2) Power Supply Ordering Code Package(1)(3) Operation Range
ATmega2560V-8AU 100A
8 1.8 - 5.5V Industrial (-40°C to 85°C)
ATmega2560V-8CU 100C1
ATmega2560-16AU 100A
16 4.5 - 5.5V Industrial (-40°C to 85°C)
ATmega2560-16CU 100C1
Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information
and minimum quantities.
2. See “Maximum speed vs. VCC” on page 377.
3. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also
Halide free and fully Green.
Package Type
64A 64-lead, Thin (1.0 mm) Plastic Gull Wing Quad Flat Package (TQFP)
64M2 64-pad, 9 x 9 x 1.0 mm Body, Quad Flat No-lead/Micro Lead Frame Package (QFN/MLF)
100A 100-lead, Thin (1.0 mm) Plastic Gull Wing Quad Flat Package (TQFP)
100C1 100-ball, Chip Ball Grid Array (CBGA)
428 ATmega640/1280/1281/2560/2561
2549K–AVR–01/07
ATmega640/1280/1281/2560/2561
Packaging Information
100A
PIN 1
B
PIN 1 IDENTIFIER
e E1 E
D1
D
C 0˚~7˚
A1 A2 A
L
COMMON DIMENSIONS
(Unit of Measure = mm)
10/5/2001
TITLE DRAWING NO. REV.
2325 Orchard Parkway
100A, 100-lead, 14 x 14 mm Body Size, 1.0 mm Body Thickness,
R San Jose, CA 95131 100A C
0.5 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP)
429
2549K–AVR–01/07
100C1
0.12 Z
Marked A1 Identifier
D SIDE VIEW
TOP VIEW A
A1
Øb
e
A1 Corner
0.90 TYP
10 9 8 7 6 5 4 3 2 1
0.90 TYP B
D
COMMON DIMENSIONS
E (Unit of Measure = mm)
F D1
G
SYMBOL MIN NOM MAX NOTE
e
H A 1.10 – 1.20
I A1 0.30 0.35 0.40
J
D 8.90 9.00 9.10
E1 E 8.90 9.00 9.10
D1 7.10 7.20 7.30
E1 7.10 7.20 7.30
BOTTOM VIEW Øb 0.35 0.40 0.45
e 0.80 TYP
5/25/06
TITLE DRAWING NO. REV.
2325 Orchard Parkway
100C1, 100-ball, 9 x 9 x 1.2 mm Body, Ball Pitch 0.80 mm 100C1 A
R San Jose, CA 95131
Chip Array BGA Package (CBGA)
430 ATmega640/1280/1281/2560/2561
2549K–AVR–01/07
ATmega640/1280/1281/2560/2561
64A
PIN 1
B
PIN 1 IDENTIFIER
e E1 E
D1
D
C 0˚~7˚
A1 A2 A
L
COMMON DIMENSIONS
(Unit of Measure = mm)
10/5/2001
TITLE DRAWING NO. REV.
2325 Orchard Parkway
64A, 64-lead, 14 x 14 mm Body Size, 1.0 mm Body Thickness,
R San Jose, CA 95131 64A B
0.8 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP)
431
2549K–AVR–01/07
64M2
Marked Pin# 1 ID
C SEATING PLANE
A1
TOP VIEW
A
K 0.08 C
L
Pin #1 Corner SIDE VIEW
D2
1 Option A Pin #1
Triangle
2
3 COMMON DIMENSIONS
(Unit of Measure = mm)
432 ATmega640/1280/1281/2560/2561
2549K–AVR–01/07
ATmega640/1280/1281/2560/2561
Errata
ATmega640 rev. A
• Inaccurate ADC conversion in differential mode with 200x gain
• High current consumption in sleep mode
ATmega1280 rev. A
• Inaccurate ADC conversion in differential mode with 200x gain
• High current consumption in sleep mode
433
2549K–AVR–01/07
ATmega1281 rev. A • Inaccurate ADC conversion in differential mode with 200x gain
• High current consumption in sleep mode
ATmega2560 rev. E
No known errata.
ATmega2560 rev. D
Not sampled.
ATmega2560 rev. C
• High current consumption in sleep mode
ATmega2560 rev. B
Not sampled.
434 ATmega640/1280/1281/2560/2561
2549K–AVR–01/07
ATmega640/1280/1281/2560/2561
435
2549K–AVR–01/07
6. EEPROM read from application code does not work in Lock Bit Mode 3
When the Memory Lock Bits LB2 and LB1 are programmed to mode 3, EEPROM
read does not work from the application code.
Problem Fix/Workaround
Do not set Lock Bit Protection Mode 3 when the application code needs to read from
EEPROM.
ATmega2561 rev. E
No known errata.
ATmega2561 rev. D
Not sampled.
ATmega2561 rev. C
• High current consumption in sleep mode
ATmega2561 rev. B
Not sampled.
ATmega2561 rev. A
• Non-Read-While-Write area of flash not functional
• Part does not work under 2.4 Volts
• Incorrect ADC reading in differential mode
• Internal ADC reference has too low value
• IN/OUT instructions may be executed twice when Stack is in external RAM
• EEPROM read from application code does not work in Lock Bit Mode 3
436 ATmega640/1280/1281/2560/2561
2549K–AVR–01/07
ATmega640/1280/1281/2560/2561
6. EEPROM read from application code does not work in Lock Bit Mode 3
When the Memory Lock Bits LB2 and LB1 are programmed to mode 3, EEPROM
read does not work from the application code.
Problem Fix/Workaround
Do not set Lock Bit Protection Mode 3 when the application code needs to read from
EEPROM.
437
2549K–AVR–01/07
Datasheet Revision Please note that the referring page numbers in this section are referring to this docu-
ment.The referring revision in this section are referring to the document revision.
History
Rev. 2549K-01/07
1. Updated Table 1 on page 3.
2. Updated “Pin Descriptions” on page 7.
3. Updated “Stack Pointer” on page 14.
4. Updated “Bit 1 – EEPE: EEPROM Programming Enable” on page 33.
5. Updated Assembly code example in “Watchdog Timer” on page 62.
6: Updated “EIMSK – External Interrupt Mask Register” on page 79.
7. Updated Bit description in “PCIFR – Pin Change Interrupt Flag Register”
on page 81.
8. Updated code example in “USART Initialization” on page 215.
9. Updated Figure 120 on page 288.
10. Updated “DC Characteristics” on page 374.
Rev. 2549J-09/06
1. Updated “Calibrated Internal RC Oscillator” on page 44.
2. Updated code example in “Moving Interrupts Between Application and
Boot Section” on page 74.
3. Updated “Timer/Counter Prescaler” on page 190.
4. Updated “Device Identification Register” on page 309.
5. Updated “Signature Bytes” on page 345.
6. Updated “Instruction Set Summary” on page 421.
Rev. 2549I-07/06
1. Updated Table 74 on page 130, Table 77 on page 131, Table 79 on page
132, Table 82 on page 149, Table 84 on page 161, Table 85 on page 161,
Table 89 on page 191, Table 92 on page 192 and Table 94 on page 193.
2. Updated “Fast PWM Mode” on page 151.
Rev. 2549H-06/06
1. Updated “Calibrated Internal RC Oscillator” on page 44.
2. Updated “OSCCAL – Oscillator Calibration Register” on page 48.
3. Added Table 172 on page 384.
Rev. 2549G-06/06
1. Updated “Features” on page 1.
2. Added Figure 2 on page 3, Table 1 on page 3.
3. Updated “Calibrated Internal RC Oscillator” on page 44.
4. Updated “Power Management and Sleep Modes” on page 50.
5. Updated note for Table 30 on page 67.
6. Updated Figure 121 on page 289 and Figure 122 on page 289.
7. Updated “Setting the Boot Loader Lock Bits by SPM” on page 330.
438 ATmega640/1280/1281/2560/2561
2549K–AVR–01/07
ATmega640/1280/1281/2560/2561
Rev. 2549F-04/06
1. Updated Figure 15 on page 28, Figure 16 on page 29 and Figure 17 on
page 29.
2. Updated Table 88 on page 191 and Table 89 on page 191.
3. Updated Features in “ADC – Analog to Digital Converter” on page 279.
4. Updated “Fuse Bits” on page 343.
Rev. 2549E-04/06
1. Updated “Features” on page 1.
2. Updated Table 27 on page 60.
3. Updated note for Table 27 on page 60.
4. Updated “Bit 6 – ACBG: Analog Comparator Bandgap Select” on page
277.
5. Updated “Prescaling and Conversion Timing” on page 282.
5. Updated “Maximum speed vs. VCC” on page 377.
6. Updated “Ordering Information” on page 424.
Rev. 2549D-12/05
1. Advanced Information Status changed to Preliminary.
2. Changed number of I/O Ports from 51 to 54.
3. Updatet typos in “TCCR0A – Timer/Counter Control Register A” on page
130.
4. Updated Features in “ADC – Analog to Digital Converter” on page 279.
5. Updated Operation in“ADC – Analog to Digital Converter” on page 279
6. Updated Stabilizing Time in “Changing Channel or Reference Selection”
on page 286.
7. Updated Figure 113 on page 280, Figure 121 on page 289, Figure 122 on
page 289.
8. Updated Text in “ADCSRB – ADC Control and Status Register B” on page
295.
9. Updated Note for Table 4 on page 41, Table 51 on page 99, Table 128 on
page 294 and Table 131 on page 299.
10. Updated Table 170 on page 382 and Table 171 on page 383.
11. Updated “Filling the Temporary Buffer (Page Loading)” on page 329.
12. Updated “Typical Characteristics” on page 390.
13. Updated “Packaging Information” on page 429.
14. Updated “Errata” on page 433.
Rev. 2549C-09/05
1. Updated Speed Grade in section “Features” on page 1.
2. Added “Resources” on page 9.
3. Updated “SPI – Serial Peripheral Interface” on page 199. In Slave mode,
low and high period SPI clock must be larger than 2 CPU cycles.
439
2549K–AVR–01/07
4. Updated “Bit Rate Generator Unit” on page 251.
5. Updated “Maximum speed vs. VCC” on page 377.
6. Updated “Ordering Information” on page 424.
7. Updated “Packaging Information” on page 429. Package 64M1 replaced
by 64M2.
8. Updated “Errata” on page 433.
Rev. 2549B-05/05
1. JTAG ID/Signature for ATmega640 updated: 0x9608.
2. Updated Table 43 on page 94.
3. Updated “Serial Programming Instruction set” on page 359.
4. Updated “Errata” on page 433.
Rev. 2549A-03/05
1. Initial version.
440 ATmega640/1280/1281/2560/2561
2549K–AVR–01/07
ATmega640/1280/1281/2560/2561
Pin Configurations............................................................................... 2
Disclaimer ............................................................................................................. 4
Overview............................................................................................... 5
Block Diagram ...................................................................................................... 5
Comparison Between ATmega1281/2561 and ATmega640/1280/2560 .............. 7
Pin Descriptions.................................................................................................... 7
Resources ............................................................................................ 9
i
2549K–AVR–01/07
Power Management and Sleep Modes............................................. 50
Sleep Modes....................................................................................................... 50
Idle Mode ............................................................................................................ 51
ADC Noise Reduction Mode............................................................................... 51
Power-down Mode.............................................................................................. 51
Power-save Mode............................................................................................... 51
Standby Mode..................................................................................................... 52
Extended Standby Mode .................................................................................... 52
Minimizing Power Consumption ......................................................................... 52
Register Description ........................................................................................... 54
System Control
and Reset............................................................................................ 57
Internal Voltage Reference ................................................................................. 61
Watchdog Timer ................................................................................................. 62
Register Description ........................................................................................... 66
Interrupts ............................................................................................ 69
Interrupt Vectors in ATmega640/1280/1281/2560/2561..................................... 69
Reset and Interrupt Vector placement ................................................................ 71
Moving Interrupts Between Application and Boot Section .................................. 74
Register Description ........................................................................................... 76
External Interrupts............................................................................. 77
Pin Change Interrupt Timing............................................................................... 77
Register Description ........................................................................................... 78
I/O-Ports.............................................................................................. 83
Introduction ......................................................................................................... 83
Ports as General Digital I/O ................................................................................ 84
Alternate Port Functions ..................................................................................... 89
Register Description for I/O-Ports..................................................................... 115
ii ATmega640/1280/1281/2560/2561
2549K–AVR–01/07
ATmega640/1280/1281/2560/2561
iii
2549K–AVR–01/07
Overview........................................................................................................... 236
USART MSPIM vs. SPI .................................................................................... 236
Clock Generation .............................................................................................. 236
SPI Data Modes and Timing............................................................................. 237
Frame Formats ................................................................................................. 238
Data Transfer.................................................................................................... 240
USART MSPIM Register Description ............................................................... 242
iv ATmega640/1280/1281/2560/2561
2549K–AVR–01/07
ATmega640/1280/1281/2560/2561
v
2549K–AVR–01/07
Standby Supply Current.................................................................................... 399
Pin Pull-up ........................................................................................................ 399
Pin Driver Strength ........................................................................................... 402
Pin Threshold and Hysteresis........................................................................... 404
BOD Threshold and Analog Comparator Offset ............................................... 407
Internal Oscillator Speed .................................................................................. 409
Current Consumption of Peripheral Units ......................................................... 411
Current Consumption in Reset and Reset Pulsewidth...................................... 414
vi ATmega640/1280/1281/2560/2561
2549K–AVR–01/07
ATmega640/1280/1281/2560/2561
vii
2549K–AVR–01/07
viii ATmega640/1280/1281/2560/2561
2549K–AVR–01/07
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2549K–AVR–01/07