plus

Esec 2100 xP
The Fastest 12” Epoxy Die Bonder

The revolutionary Phi-Y pick-and-place produces a quantum Future Proof Equipment

leap in speed, with an increasing standard accuracy of 20 μm.
Optionally, the accuracy can even be improved, down to 15 μm.
Minimal distances between pick and bond positions coupled with
the stiff symmetrical bondhead and vibration compensation provide
the shortest settling times imaginable, which ultimately lead to the
plus
unsurpassed speed of the Die Bonder Esec 2100 xP .

MEMS

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Process Quality for Highest Yield At
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Die

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÷Standard accuracy 20 μm

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÷Optional 15 μm accuracy (at highest speed)

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÷Fastest Time to Yield
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÷Highest uptime ronics

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÷Flexible platform for all epoxy packages Co m
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DOUBLE
YhS PATTERN
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2nd GENERATION
VISION SYSTEM

CLEAN HIGH PRECISION

MACHINE BONDING

STRIP THICKNESS
COMPENSATION

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 www.besi.com - [email protected]

Double YhS Pattern Clean Machine

÷ Good quality at double process speed
÷Good ÷ ISO class 5 (class 100) inside machine
÷ISO
÷÷Better
Better tailing characteristics ÷÷Reduces
Reduces airborne particle through laminar flow
÷÷Best
Best suitable for medium sized rectangular dice ÷÷Specially
Specially designed for CIS

2nd Generation Vision System High Precision Bonding

÷÷Good
Good image quality with improved signal to ÷÷Improved
Improved placement accuracy by optimizing
noise ratio dynamics, Pick & Place Z-axis guides and bearings
÷÷Reduced
Reduced image transfer time ÷÷Standard
Standard pickup tools for high precision mode
÷÷Better
Better recognition with new image sensor ÷÷Position
Position auto correction at dispense and bond
÷÷Optionally
Optionally available

Strip Thickness Compensation

÷ Strip thickness based Z-height correction
÷Strip
÷÷Excellent
Excellent bond line thickness control
÷÷No
No UPH impact and easy setup
÷÷Optionally
Optionally available

Machine Dimensions Wafer and Die Dimensions Process

÷Footprint: WxDxH: 1785 x 1448 x 1400 mm ÷ Wafer size: 4” - 12”
÷Wafer ÷ Bond force: 0.2 - 50 N
÷Bond
÷Weight: approx. 1400 kg ÷÷Frame
Frame size: 8” - 12” ÷÷Bond
Bond rotation 360°
÷÷Die
Die size: 0.5 - 20 mm ÷÷Heating
Heating at bond for WBC & Simple WBL
Supply Requirements
÷÷Die
Die thickness: > 0.75 mm
÷Voltage: 208 - 230 VAC (@ 47 - 63 Hz) Accuracy / Productivity
÷Power rating: 800 - 1.100 VA Leadframe Size ÷ >2 mm: 20 μm / 0.2° (3 ı)
÷>2
÷Compressed air: min. 5.2 bar ÷ Width: 9 - 84 mm (100 mm opt.)
÷Width: >2 mm: 15 μm / 0.2° (3 ı) (option)
÷÷>2
÷Vacuum: min. -0.75 bar ÷÷Length:
Length: 90 - 300 mm 0.5 - 2 mm: 20 μm / 0.5° (3 ı)
÷÷0.5
÷Nitrogen blow: 1.8 - 6 bar ÷÷Thickness:
Thickness: 0.1 - 2.5 mm ÷÷MTBF:
MTBF: > 200h