IPC-4552

ASSOCIATION CONNECTING
ELECTRONICS INDUSTRIES ®

Specification for
Electroless Nickel/
Immersion Gold (ENIG)
Plating for Printed
Circuit Boards

Developed by the Plating Processes Subcommittee (4-14) of the

Fabrication Processes Committee (4-10) of IPC

November 6, 2002

Users of this standard are encouraged to participate in the

development of future revisions.

Contact:

IPC
2215 Sanders Road
Northbrook, Illinois
60062-6135
Tel 847 509.9700
Fax 847 509.9798
IPC-4552 October 2002

Table of Contents
1 SCOPE ....................................................................... 1 APPENDIX 2 Process Sequence ................................ 7
1.1 Scope ................................................................... 1
APPENDIX 3 Qualification of ENIG Process
1.2 Description .......................................................... 1 by the Board Supplier .......................... 8
1.2.1 Phosphorus/Boron Content ................................. 1
APPENDIX 4 Recommendation For Thickness
1.3 Objective ............................................................. 1 Measurement ......................................... 9
1.4 Performance Functions ....................................... 2
APPENDIX 5 Standard Developments Efforts
1.4.1 Solderability ........................................................ 2 of Electroless Nickel Immersion
Gold ...................................................... 10
1.4.2 Contact Surface .................................................. 2
1.4.2.1 Membrane Switches ........................................... 2 Figures
1.4.2.2 Metallic Dome Contacts ..................................... 2 Figure 3-1 Uniform Plating ................................................. 3
1.4.3 EMI Shielding .................................................... 2 Figure 3-2 Extraneous Plating or Nickel Foot .................... 3
1.4.4 Conductive (Replacement for Solder) Figure 3-3 Edge Pull Back ................................................. 4
and/or Anisotropic Adhesive Interface .............. 2
Figure 3-4 Skip Plating ....................................................... 4
1.4.5 Connectors .......................................................... 2 Figure 4-1 IPC-2221 Test Speciman M, Surface Mount
1.4.5.1 Press Fit .............................................................. 2 Solderability Testing, mm [in] ............................ 5
1.4.5.2 Edge Tab ............................................................. 2 Figure 1 Results from Gold Thickness Survey ............. 11
1.4.6 Aluminum Wire Bonding ................................... 2 Figure 2 Results from Nickel Thickness Survey ........... 12
Figure 3 Comparison of Gold Thickness Values
2 APPLICABLE DOCUMENTS ................................... 2 by XRF Machine Type .................................... 14
2.1 IPC ...................................................................... 2 Figure 4 Comparison of Gold Plating Thickness
Variation by Vendor for Similar Bath Life
2.2 ASTM International (ASTM) ............................ 2
Conditions ....................................................... 15
2.3 Defense Standardization Program ...................... 2 Figure 5 Comparison of Nickel Plating Thickness
2.4 Telcordia Technologies, Inc. .............................. 2 Variation by Vendor for Similar Bath Life
Conditions ....................................................... 16
2.5 International Organization for
Standardization (ISO) ......................................... 2 Figure 6 Wetting Times as a Function of Plating
Dwell Times for Vendor D, 90 Days Old ........ 17
3 REQUIREMENTS ...................................................... 3 Figure 7 Wetting Times as a Function of Plating
3.1 Visual .................................................................. 3 Dwell Times for Vendor D, 90 Days Old ........ 18
Figure 9 Wetting Balance Data for Vendor D Post
3.2 Finish Thickness ................................................. 3
18 Hours 85/85 Conditioning .......................... 20
3.2.1 Electroless Nickel Thickness ............................. 3 Figure 10 Comparison of One Microinch Gold
3.2.2 Immersion Gold Thickness ................................ 3 Deposit Tested at 8 Months Shelf Life
vs as Received and 85/85 .............................. 21
3.3 Porosity ............................................................... 3
Figure 11 Comparison of One Microinch Gold
3.4 Adhesion ............................................................. 3 Deposit after Various Storage Times/
3.5 Solderability ........................................................ 3 Conditions ....................................................... 21
3.6 Cleanliness .......................................................... 4 Figure 12 Contact Resistance Data for Vendor D
for Interlocking Square Contacts .................... 22
3.7 Chemical Resistance ........................................... 4
Figure 13 Contact Resistance Data for Vendor C
3.8 High Frequency Signal Loss .............................. 4 for Interlocking Square Contacts .................... 23
Figure 14 Comparison of Gold Thickness by Vendor
4 QUALITY ASSURANCE PROVISIONS ................... 4 for the Interlocking Square Contact Test ........ 24
4.1 Qualification ........................................................ 4 Figure 15 Interlocking Square Contact Test Coupon ...... 25
4.1.1 Sample Test Coupons ......................................... 5
Tables
4.2 Acceptance Tests ................................................ 5
4.3 Quality Conformance Testing ............................ 5 Table 3-1 Requirements of Electroless Nickel Immersion
Gold Plating ......................................................... 1
APPENDIX 1 Chemical Definitions ............................ 6 Table 4-1 Qualification Test Coupons ................................. 5

iv
October 2002 IPC-4552

Specification for Electroless Nickel/Immersion

Gold (ENIG) Plating for Printed Circuit Boards

1 SCOPE 1.2.1 Phosphorus/Boron Content Phosphorus or boron

containing reducing agents are used for the reduction of the
1.1 Scope This specification sets the requirements for
electroless nickel during the deposition process. Phospho-
the use of Electroless Nickel/Immersion Gold (ENIG) as a
rus or boron is thus incorporated in the nickel deposit. The
surface finish for printed circuit boards. This specification
level of these co-deposited elements should be controlled
is intended to set requirements for ENIG deposit thick-
within the specified process limit. Variation of phosphorus
nesses based on performance criteria. It is intended for use
or boron level, outside the specified process limits, may
by supplier, printed circuit manufacturer, electronics manu-
have adverse effects on the solderability of the finish.
facturing services (EMS) and original equipment manufac-
turer (OEM).
1.3 Objective This specification sets the requirements
1.2 Description ENIG is an electroless nickel layer specific to ENIG as a surface finish (see Table 3-1 for a
capped with a thin layer of immersion gold. It is a multi- summary of these requirements). As other finishes require
functional surface finish, applicable to soldering, aluminum specifications, they will be addressed by the IPC Plating
wire bonding, press fit connections, and as a contact sur- Processes Subcommittee as part of the IPC-4550 specifica-
face. The immersion gold protects the underlying nickel tion family. As this and other applicable specifications are
from oxidation/passivation over its intended life. However, under continuous review, the subcommittee will add appro-
this layer is not totally impervious and it will not pass the priate amendments and make necessary revisions to these
requirements of a ‘classic’ porosity test. documents.

Table 3-1 Requirements of Electroless Nickel Immersion Gold Plating

Requirement
Tests Test Method Paragraph Class 1 Class 2 Class 3
General
Uniform plating and complete
Visual Visual 3.1
coverage of surface to be plated.
3 to 6 µm
Electroless Nickel Thickness APPENDIX 4 3.2.1
[118.1 to 236.2 µin]
0.05 µm minimum
Immersion Gold Thickness APPENDIX 4 0
[1.97 µin minimum]
Porosity N/A 3.3 N/A
Physical
IPC-TM-650
Adhesion/Tape Test 3.4 No evidence of plating removed.
TM 2.4.1
Meet solderabiltiy requirements of Category 3
Solderability J-STD-003 3.5
durability with six months shelf life.
Chemical
ASTM B-733-97
(Reference Only; Supplier Dependent -
Phosphorous/Boron Content & ASTM 1.2.1
No Testing Required)
B607-91 (1998)
Chemical Resistance N/A 3.7 N/A
Electrical
(1)
High Frequency Signal Loss 3.8 TBD
(1)
Contact Resistance 1.4.2 TBD
Environmental
IPC-TM-650
Cleanliness 3.6 Max. 1.56 µg/cm2
TM 2.3.25
(1) An appropriate IPC-TM-650 test method used to generate data for this electrical property is not available at the time of this writing.