1626LM R5 (1) .0 Technical Handbook Draft2 PDF

Alcatel-Lucent 1626LM
1626 LIGHT MANAGER | RELEASE 5.0

MUTIL REACH DWDM PLATFORM
TECHNICAL HANDBOOK
3AL 75131 AAAA

FEBRUARY, 2008
DRAFT#2
Alcatel, Lucent, Alcatel-Lucent and the Alcatel-Lucent logo are trademarks of Alcatel-Lucent. All other trademarks are the property of their respective owners..
The information presented is subject to change without notice. Alcatel-Lucent assumes no responsibility for inaccuracies contained herein.
Copyright © 2007 Alcatel-Lucent. All Rights Reserved.

Contents
About this document

Purpose ....................................................................................................................................................... xv
Intended audience ....................................................................................................................................... xv
Supported systems ...................................................................................................................................... xv
Prerequisite knowledge .............................................................................................................................. xv
Safety information ...................................................................................................................................... xv
How to use this document ......................................................................................................................... xvi
Related documentation .............................................................................................................................. xvi
Related training ......................................................................................................................................... xvi
Technical support ....................................................................................................................................... xvi
How to order ............................................................................................................................................. xvii
How to comment ...................................................................................................................................... xvii
1 Product Configurations & Environment General Overview
Introduction to the equipment ................................................................................................................... 1-1
Equipment Basic Configurations ............................................................................................................... 1-6
50 GHz Grid Supported Configurations
Line Terminal (LT) .................................................................................................................................... 1-9
Line Repeater (LR) .................................................................................................................................. 1-12
Optical Reconfigurable Add & Drop Multiplexer (R-OADM) ............................................................... 1-12
Optical Tunable Add & Drop Multiplexer (T-OADM)- Grade 2 ............................................................ 1-14
Optical Tunable Add & Drop Multiplexer (T-OADM) - Grade 3 or Y node .......................................... 1-16
Optical Add & Drop Multiplexer (OADM) repeater (OR) ..................................................................... 1-19
100 GHz grid supported configurations

Line Terminal .......................................................................................................................................... 1-26
Line Repeater (LR) .................................................................................................................................. 1-28
Optical Add and Drop Multiplexer (OADM) .......................................................................................... 1-28
50 and 100 GHz grid supported configurations

Line Terminal (LT) .................................................................................................................................. 1-30
Line Repeater (LR) .................................................................................................................................. 1-31
Optical Add and Drop Multiplexer (OADM) .......................................................................................... 1-31
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Multiplexing & Amplification Configurations

MUX/DMUX Configurations ................................................................................................................. 1-33
Amplification Configurations .................................................................................................................. 1-37
Upgrade configurations
Upgrading legacy equipment ................................................................................................................... 1-43
Line Terminal (LT) .................................................................................................................................. 1-43
Network architectures
Point to point links .................................................................................................................................. 1-49
(Multi)point-to-multipoint links .............................................................................................................. 1-49
Linear (multipoint to multipoint) links ................................................................................................... 1-50
Ring (multipoint to multipoint) networks ............................................................................................... 1-50
Host systems (ADM..) ............................................................................................................................. 1-51
Protection scenario .................................................................................................................................. 1-53
2 Physical configuration
Rack design ............................................................................................................................................... 2-2
1626 LM physical generic shelf configuration

1626 LM generic empty shelf ................................................................................................................... 2-3
1626 LM Compact Shelf ........................................................................................................................... 2-8
1626 LM main and expansion shelves (recommended) configurations
T-OADM Complete Rack View Example ............................................................................................... 2-11
T-OADM Line Shelf per OTS Example .................................................................................................. 2-12
T-OADM Transponder Shelf per OTS Example ..................................................................................... 2-14
Line Terminal Configuration ................................................................................................................... 2-16
OADM Configuration ............................................................................................................................. 2-22
1626 LM Part list ..................................................................................................................................... 2-27
Equipment connections ........................................................................................................................... 2-40
Units front view

Release 5.0 Board LED ........................................................................................................................... 2-46
Release 5.0 Board Faceplates .................................................................................................................. 2-47
The Legacy Boards .................................................................................................................................. 2-49
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Contents
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3 Functional Description
Optics
The Optical Signal Process ........................................................................................................................3-2
Transmission Rates/Mode and Standard Compliance ...............................................................................3-3
The Optical Channels ................................................................................................................................3-4
Optical Supervision .................................................................................................................................3-14
Protection .................................................................................................................................................3-17
Performance Monitoring
Performance Monitoring Points on transmission boards .........................................................................3-20
Transmission Frame
Introduction ..............................................................................................................................................3-28
Wavelength division multiplexing ...........................................................................................................3-28
Optical channel transport unit (OTUk) description .................................................................................3-31
Loopbacks
TRBC & TRBD Loopbacks .....................................................................................................................3-32
2xGBE_FC & ETHC Loopbacks ............................................................................................................3-34
Equipment Control
Equipment Controller function ................................................................................................................3-36
Management buses/interfaces ..................................................................................................................3-37
Example of control interfaces scheme .....................................................................................................3-40
Power supply
Functional description .............................................................................................................................3-41
Operation & Management Services

Housekeeping ...........................................................................................................................................3-44
Rack Alarm Management ........................................................................................................................3-44
Ventilation ................................................................................................................................................3-48
Remote Inventory .....................................................................................................................................3-49
4 Technical specifications
1626 LM system characteristics ................................................................................................................4-1
Safety requirements and mechanism .........................................................................................................4-8
Boards interfaces characteristics ..............................................................................................................4-17
Alarm characteristics ...............................................................................................................................4-53
Power supply characteristics ....................................................................................................................4-56
Mechanical characteristics .......................................................................................................................4-58
Environmental characteristics ..................................................................................................................4-60
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5 Dismantling & recycling

WEEE general information ....................................................................................................................... 5-1
How to disassembly equipment ................................................................................................................. 5-2
ECO declaration ...................................................................................................................................... 5-27
A Safety Norms & Equipment Labels

First aid for electric shock ........................................................................................................................ A-2
Safety Rules ............................................................................................................................................. A-4
Labels affixed to the equipment ............................................................................................................. A-15
Part Number and Change Status identification ...................................................................................... A-19
General Maintenance Rules ................................................................................................................... A-29
B Abbreviations
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About this document

2-1 Generic Shelf Boards ................................................................................................................... 2-4
2-2 Compact Shelf Boards .................................................................................................................. 2-8
2-3 T-OADM Capacity/number of shelves and racks ...................................................................... 2-11
2-4 T-OADM / 10 Gbps Transponder Shelf Organization ............................................................... 2-15
2-5 1626 LM boards and unit list ..................................................................................................... 2-27
2-6 OADC LED ................................................................................................................................ 2-46
2-7 TDMX and WMAN LED .......................................................................................................... 2-46
2-8 TRBD4312 LED ........................................................................................................................ 2-47
3-1 Optical Signal Process .................................................................................................................. 3-2
3-2 Transponder and Concentrator Transmission Rates/Mode .......................................................... 3-3
3-3 Transponder and Concentrator Standard Compliance ................................................................. 3-4
3-4 Nominal frequencies allocation plan in C-Band for long haul applications (50GHz grid) ......... 3-5
3-5 Frequencies allocation plan in C-Band for Metropolitan applications (100GHz grid) .............. 3-10
3-6 Frequencies plan for Metropolitan applications (50 and 100GHz mixed grid) ......................... 3-12
3-7 Boards and supported Performance Monitoring Points ............................................................. 3-21
3-8 RS counters default threshold data values .................................................................................. 3-27
3-9 OCH counters default threshold data values .............................................................................. 3-27
3-10 Front Panel LEDs severity meaning ........................................................................................... 3-46
4-1 AEL at 980 and 1480 nm for Hazard Levels 1 and 1M ............................................................. 4-11
4-2 ALCT1010 wavelengths list ....................................................................................................... 4-41
4-3 Relation between Alarm severity terminology displayed onC.T./O.S. and alarm severity
terminology used for the ESCT leds and ETSI market racks (TRU). 4-54
4-4 Environmental Operating Conditions[1] .................................................................................... 4-64
4-5 Transportation climatic .............................................................................................................. 4-68
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5-1 List of hazardous materials and components present in the equipment ..................................... 5-24

A-1 IEC 950 -Table 16: Overtemperature limits ...............................................................................A-12
A-2 Label references .........................................................................................................................A-15
A-3 Example of ANV Part Number + ICS evolution .......................................................................A-19
B Abbreviations
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List of figures
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About this document

1-1 Example of 1626 LM configurations in a WDM line .................................................................. 1-4
1-2 Example of WDM line ................................................................................................................. 1-6
1-3 1626 LM Line Terminal configuration, 50 GHz grid ................................................................. 1-10
1-4 Line Terminal - Long Haul - 50 GHz grid ................................................................................. 1-11
1-5 1626 LM Line Repeater configuration ....................................................................................... 1-12
1-6 R-OADM Configuration Example ............................................................................................. 1-13
1-7 T-OADM Grade 2 Configuration Example ................................................................................ 1-15
1-8 T-OADM Grade 3 Configuration Example ................................................................................ 1-18
1-9 1626 LM OADM configuration on a 50 GHz grid .................................................................... 1-20
1-10 Long Haul Optical Add and Drop Multiplexer Repeater, 50 GHz grid ..................................... 1-21
1-11 1626 LM back-to-back terminal configuration .......................................................................... 1-24
1-12 Long Haul Back-to-Back Terminal, 50 GHz Grid ..................................................................... 1-25
1-13 1626 LM line terminal configuration on a 100GHz grid ........................................................... 1-27
1-14 Regional Line Terminal, 100 GHz grid ...................................................................................... 1-28
1-15 1626 LM OADM / back to back configuration on a 100 GHz grid ........................................... 1-29
1-16 Line terminal configuration on a 50 and 100GHz mixed grid + 2 stages amplifier ................... 1-31
1-17 OADM configuration on a 50 and 100GHz mixed grid + 2 stages amplifier ............................ 1-32
1-18 MUX and DMUX functions of an 8 channels Line Terminal .................................................... 1-33
1-19 MUX and DMUX functions of a 12 channels Line Terminal .................................................... 1-34
1-20 MUX and DMUX functions of a 32 channels Line Terminal .................................................... 1-34
1-21 MUX and DMUX functions of an 8 channels OADM .............................................................. 1-35
1-22 MUX and DMUX functions of a 32 channels back-to-back terminal ....................................... 1-36
1-23 Generic unidirectional block scheme of a 2-stage amplifier with interstage access .................. 1-38
1-24 Generic bidirectional block scheme of a 2-stage amplifier ........................................................ 1-38
1-25 Optical amplification in back-to-back / OADM configuration (bidirectional) .......................... 1-39
1-26 Optical amplification in back-to-back / OADM configuration (unidirectional) ........................ 1-40
1-27 Optical amplification in Line Repeater configuration ................................................................ 1-41
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1-28 Optical amplification in Line Terminal configuration ............................................................... 1-41

1-29 Generic example of LT configuration in point-to-point application .......................................... 1-44
1-30 Upgrade of the 1640 WM based on TCS401 in line terminal configuration ............................. 1-45
1-31 Upgrade of the 1640 WM based on MDX in line terminal configuration ................................. 1-46
1-32 1686 WM system upgrade with 1626 LM transponders in Line Terminal configuration ......... 1-47
1-33 1686 WM system upgrade with the 1626 LM mux/demux scheme in LT configuration .......... 1-48
1-34 The 1626 LM in point-to-point links ......................................................................................... 1-49
1-35 The 1626 LM in linear (multipoint-to-multipoint) links ............................................................ 1-50
1-36 The 1626 LM in ring (multipoint-to-multipoint) networks ....................................................... 1-51
1-37 Connection to host equipment ................................................................................................... 1-52
1-38 Optical channel protection in linear links .................................................................................. 1-54
1-39 Optical SNCP protection scheme: with back-to-back terminals or OADM .............................. 1-55
1-40 Optical protection way of working ............................................................................................ 1-55
2-1 Rack organization ........................................................................................................................ 2-2
2-2 Shelf dimensions and slots numbering ........................................................................................ 2-4
2-3 Compact Shelf Dimensions and Slot numbering ......................................................................... 2-8
2-4 T-OADM Complete Rack Example ........................................................................................... 2-11
2-5 T-OADM Line Shelf for OTS 1 Example .................................................................................. 2-12
2-6 T-OADM Line Shelf for OTS 2 Example .................................................................................. 2-13
2-7 T-OADM Line Shelf for OTS 3 Exampe ................................................................................... 2-13
2-8 T-OADM Transponder Shelf Example (8 first channels) .......................................................... 2-14
2-9 T-OADM Transponder Shelf Example (From 9th to 72nd channel) ......................................... 2-14
2-10 Example of master shelf configuration in Line Terminal application (50GHz grid) ................. 2-16
2-11 Example of a slave/transponder shelf configuration (50GHz grid) ........................................... 2-17
2-12 Example of transponder shelf configuration .............................................................................. 2-18
2-13 Example of transponder shelf with TRBD and ETHC optically connected .............................. 2-19
2-14 Example of tributary shelf with TRBD and ETHC electrically connected ............................... 2-20
2-15 Example of tributary shelf configuration with twelve ETHC .................................................... 2-21
2-16 Example of master shelf in OADM configuration ..................................................................... 2-22
2-17 Example of master shelf in OADM configuration (upgradable to 23 dBm, 50GHz grid) ......... 2-23
2-18 LT on 100GHz grid: master shelf configuration, one LOFA per direction (Unidirectional) ..... 2-24
2-19 LT on 100GHz grid: master shelf configuration, one LOFA (Bidirectional amplifier) ............. 2-25
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2-20 OADM on 100GHz grid: master shelf configuration with vertical amplifiers .......................... 2-26
2-21 OADM on 100GHz grid: master shelf configuration with horizontal amplifiers ...................... 2-27
2-22 Double MU optical connector .................................................................................................... 2-41
2-23 Example of intra-shelf links (10Base-T interface) ..................................................................... 2-43
2-24 Release 5.0 Board Faceplates ..................................................................................................... 2-48
2-25 TRBD1111, TRBD1121, TRBD1131 boards front panel .......................................................... 2-50
2-26 TRBD1191 board front panel ..................................................................................................... 2-51
2-27 TRBC1111 board front panel ..................................................................................................... 2-52
2-28 2xGE_FC board front panel ....................................................................................................... 2-53
2-29 ETHC1000 board front panel ..................................................................................................... 2-54
2-30 SFP optical module .................................................................................................................... 2-55
2-31 XFP optical module .................................................................................................................... 2-56
2-32 CMDX1010 board front panel ................................................................................................... 2-57
2-33 BMDX1X00 board front panel .................................................................................................. 2-58
2-34 ALCT1010 front panel ............................................................................................................... 2-59
2-35 OMDX8100_L1_X board front panel ........................................................................................ 2-60
2-36 OMDX8100_xx front panel ....................................................................................................... 2-61
2-37 OMDX4100 front panel ............................................................................................................. 2-62
2-38 OCPU2104 front panel ............................................................................................................... 2-63
2-39 LOFA11xx front panel ............................................................................................................... 2-64
2-40 ESCT2000 front panel ................................................................................................................ 2-65
2-41 OSCU1010 front panel ............................................................................................................... 2-66
2-42 OSCU1011 front panel ............................................................................................................... 2-67
2-43 HSKU1000 and HSKU1100 front panel .................................................................................... 2-68
2-44 RAIU1000 front panel ................................................................................................................ 2-69
2-45 USIB1000 front panel ................................................................................................................ 2-70
2-46 PSUP1000 front panel ................................................................................................................ 2-71
2-47 FANS1000 front panel ............................................................................................................... 2-72
3-1 Remote supervision through OSC .............................................................................................. 3-14
3-2 OSCU Implementation in OADM Configuration ...................................................................... 3-15
3-3 OSNCP: supported configurations ............................................................................................. 3-17
3-4 Transponder sub-system in O-SNCP configuration ................................................................... 3-17
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3-5 O-SNCP: shelf configuration examples ..................................................................................... 3-19

3-6 TRBD, TRBC: example of possible monitored sections ........................................................... 3-22
3-7 2xGE_FC: example of possible monitored sections .................................................................. 3-23
3-8 ETHC1000: example of possible monitored sections ................................................................ 3-23
3-9 Optical Transport Hierarchy (OTH) frame structure ................................................................. 3-30
3-10 Multiplexing of four ODU1 into a ODU2 ................................................................................. 3-30
3-11 G.709/Y.1331 - OTUk frame structure ...................................................................................... 3-31
3-12 TRBD Loop-backs ..................................................................................................................... 3-33
3-13 TRBC1111 Loopbacks ............................................................................................................... 3-34
3-14 Loopbacks configuration of 2xGE_FC ...................................................................................... 3-34
3-15 Loopbacks configuration of ETHC1000 .................................................................................... 3-35
3-16 Controller sub-system ................................................................................................................ 3-39
3-17 Example of control interfaces scheme ....................................................................................... 3-40
3-18 1626 LM - equipment power supply scheme ............................................................................. 3-43
3-19 Electrical links between RAIU cards and TRU ......................................................................... 3-47
3-20 Fan shelf description and Rack partitioning .............................................................................. 3-48
3-21 Remote Inventory sub-system .................................................................................................... 3-50
4-1 AEL for Class 1 between 1500 nm and 1800 nm ...................................................................... 4-10
4-2 AEL for Class 1M between 1500 nm and 1800 nm ................................................................... 4-11
4-3 Example of line failure between two LRs with unidirectional amplifiers ................................. 4-14
4-4 Example of line failure between a LR and a LT with unidirectional amplifiers ........................ 4-15
4-5 Example of line failure between a LR and a LT with bidirectional amplifiers .......................... 4-15
4-6 Climatogram for Class 3.2: Partly temperature controlled locations ......................................... 4-63
4-7 Climatogram for Class 1.2: not temperature controlled storage location .................................. 4-66

5-1 Subrack front and rear view ......................................................................................................... 5-3
5-2 Handle removing and disassembly .............................................................................................. 5-4
5-3 Rear cover removing .................................................................................................................... 5-5
5-4 Back Panel removing ................................................................................................................... 5-6
5-5 Upper and lower guides plane removing ..................................................................................... 5-7
5-6 Side wall removing ...................................................................................................................... 5-8
5-7 Optical fiber duct, guides and contact spring removing ............................................................ 5-10
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5-8 Side coverplate removal ............................................................................................................. 5-11

5-9 Levers removal ........................................................................................................................... 5-12
5-10 Optical connectors support removal ........................................................................................... 5-13
5-11 Side coverplate and contact spring removal ............................................................................... 5-15
5-12 Internal connectors removal ....................................................................................................... 5-17
5-13 Dissipator removal ..................................................................................................................... 5-18
5-14 Modules removal from dissipator .............................................................................................. 5-19
5-15 Daughter board removal ............................................................................................................. 5-20
5-16 Gold connector removal ............................................................................................................. 5-21
5-17 Internal cables removal .............................................................................................................. 5-22
5-18 Connector metal support removal .............................................................................................. 5-23

A-1 Subrack label ............................................................................................................................. A-17
A-2 Labels on units with standard cover plate, with two extraction handles ................................... A-18
A-3 Internal label for Printed Board Assembly ................................................................................ A-21
A-4 Back panel internal label ........................................................................................................... A-22
A-5 Labels on units with one top extraction handle ......................................................................... A-23
A-6 Labels on units without extraction handle ................................................................................ A-24
A-7 XFP and SFP modules label ...................................................................................................... A-25
A-8 Label identifying Unit, Optical assembly, Shelf, Back panel ................................................... A-26
A-9 External label for unit identification (unit with two ejectors): P/N ........................................... A-26
A-10 External label for unit/shelf identification - unit with ejector(s): CLEI code ........................... A-26
A-11 Label for Optical module XFP extended .................................................................................. A-27
A-12 XFP module label ...................................................................................................................... A-27
A-13 SFP module label ...................................................................................................................... A-28
A-14 CE label ..................................................................................................................................... A-28
A-15 WEEE label ............................................................................................................................... A-28
A-16 China RoHS label ...................................................................................................................... A-29
B Abbreviations
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List of figures
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Purpose
The 1626 LM Technical Handbook presents a detailed overview of applications, planning,
and technical specifications for the 1626 LM product.
Intended audience
Network planners, analysts, managers, and engineers comprise the primary audience for
the Technical Handbook. However, the Alcatel-Lucent Account Team as well as anyone
who needs information about the features, applications, operation, and engineering, of the
1626 LM will find this document useful.
Supported systems
This document covers the features of 1626 LM Release 5.0.
Prerequisite knowledge
This document assumes that readers have the following required skills:
• Basic principles of optical telecommunication transmission
• Common optical telecommunication and system terminology
• Telecommunications test set operations
• Local operational and functional procedures
• Personal computer (PC) operation, common PC terminology, and navigational tasks in
a Windows-style user interface
Safety information
For safety information, please refer to Appendix A in this document.
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About this document
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How to use this document

The technical handbook is divided into the following topics as described in the table
below:
About this Document Contains general information as preliminary
information, safety recommendations,
handbook scope, history, related documents.
Product Configurations & Environment Covers all the equipment’s general
General Overview configurations including its application in the
telecommunication network.
Physical Configuration Describes equipment components, and provides
part lists with denomination, part numbers. Unit
front view illustrations are also provided.
Functional Description Gives a general description of the main
functions delivered by the product.
Technical Specifications Gives the technical characteristics of the
product equipment. Refers to norms and
standard references.
Dismantling & Recycling Provide information for subrack/units
dismantling and recycling. It also lists
hazardous materials and waste code.
Appendices Provide general information on safety and
maintenance rules and other identification labels
sticked on the hardware pieces.
Abbreviations Abbreviations used in this document and their
meanings are listed in this section
Related documentation
Alcatel-Lucent also provides the following documents to help you plan, install, and
operate your 1626 LM equipment:
• 1626 LM Installation Handbook - 3AL 75131 CAAA
• 1626 LM Turn-On and Commissioning Handbook - 3AL 75131 DAAA
• 1626 LM Operator Handbook - 3AL 75131 BAAA
• 1626 LM Maintenance and Troubleshooting Handbook - 3AL 75131 EAAA
Related training
Alcatel-Lucent University provides courses to train telecommunication technicians in
installation, operations, and maintenance personnel. Contact Alcatel-Lucent at1-888-582-
3688 to enroll in training classes.
Technical support
For technical support, contact your local customer support team. Reach them via the web
at http://alcatel-lucent.com/support or through the telephone number listed under the
Technical Assistance Center menu at https://support.lucent.com/portal/olcsHome.do.
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How to order
To order Alcatel-Lucent documents, use the following website:
https://support.lucent.com/portal/olcsHome.do
How to comment
You can send your feedback to your local Alcatel-Lucent Technical Assistance Center at
https://support.lucent.com/portal/olcsHome.do. Your feedback will be forwarded to the
appropriate documentation team for evaluation and action, as appropriate. Be sure to cite
the relevant information such as product name, document title, document ID, release, issue
number, date, page number, etc. in your feedback.
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1 Product Configurations
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& Environment General
Overview
Introduction to the equipment

The Alcatel-Lucent 1626 Light Manager (1626 LM in the following) is the platform of
Dense Wavelength Division Multiplexing (DWDM) Multi Reach systems for Regional,
National, Pan-continental Networks.
The Alcatel-Lucent 1626 LM addresses terrestrial applications from Metro-Core (few
hundreds of kilometers) to Ultra Long-Haul (up to 4500 km) and unrepeatered submarine
applications (400 Km single span), from average capacity for regional networks up to
large capacity for pan-continental networks.
The Alcatel-Lucent 1626 LM is designed to address efficiently green field applications for
new networks and links as well as to upgrade legacy platforms without traffic
interruption. Carriers can keep their installed DWDM base and increase its capacity by
loading new wavelengths from the 1626 LM. This provides to carriers a state-of-art
technology and advanced features without wasting the investment previously granted.
System capacity
The Alcatel-Lucent 1626 LM provides a modular transmission capacity on a single optical
fiber by multiplexing:
• up to 96 channels, 10 Gbps rate, 50 GHz grid in the Extended C-band (1530 nm -
1568.6 nm)
• up to 32 channels, 10 Gbps rate, 100 GHz grid, in the standard C-band ( 1529.55 nm -
1561.42 nm).
System structure
The Alcatel-Lucent 1626 LM architecture is based on an universal or a compact shelf that
can be configured in different ways to support a variety of applications. The main building
blocks (interfaces, mux/demux, optical amplifiers, protection boards, ...) can be allocated
in the shelves in a very flexible way. As a result the footprint and the cost of the system
configuration is optimized.
The system structure is based on transponders, mux/demux and optical amplifiers. The
transponders are connected to optical Muxes/Demuxes which generate the main DWDM
signal (combined signal) and launch it in the fibre by means of optical amplifiers.
The Alcatel-Lucent 1626 LM supports the following main categories of 3R transponders:
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3AL 75131 AAAA 1 -1
Product Configurations & Environment General Overview Introduction to the equipment
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• Tributary Direct transponders with 10 Gbps and 40 Gbps line rates, optimized for Very
Long Haul applications, G. 709 compliant
• 4x2.5Gbps Tributary Concentrator with 10 Gbps line rate, optimized for Very Long
Haul applications, G. 709 compliant
• 2 x Gbe/FC aggregator with 2.5 Gbps line rate, SFP interface.
In accordance with ITU-T Rec. G.709, UNI signals at 2.488/9.95/10.31/39.813 Gbps are
supported by the client side interface of the transponder platform. Completion of G.709
support is insured via software or firmware upgrades.
Details of supported client rates and types is delivered in Chapter 3, “Tributary sub-
system” on page 3-10 and Chapter 5, “Tributaries optical characteristics” on page 5-19.
The Alcatel-Lucent 1626 LM Line Terminal or Optical Add Drop NE (Fixed)
configurations consist of modular Mux/Demux architectures.
Three main Mux/Demux architectures are supported depending on the target grid and
application:
• 50 GHz based architecture supporting up to 96
• 100 GHz based architecture supporting up to 32 chs
• 100 GHz and 50 GHz mixed architecture supporting up to 48 chs.
The 50 GHz grid architecture is based on sub-bands that can be equipped with up to 8
channels. The system capacity can be scaled up to a maximum of 12 bands for a total
capacity of 96 channels. Release 5.0 supports Tunable and Reconfigurable OADM
architectures (T and R-OADM). They deliver a fully configurable flexibility to access any
wavelength in any site in point-to-point, ring or meshed networks.
capacity of 32 channels. They deliver the full flexibility to access any wavelength in any
site in point-to-point, ring or meshed networks.
The 100 GHz and 50 GHz mixed architecture is based on sub-bands that can be equipped
with up to 8 channels. Up to 16 channels are supported into the 100 GHz grid sub-bands
and up to further 32 channels can be supported into the 50 GHz sub-bands for a total
capacity of up to 48 channels. They deliver the fully flexibility to access any wavelength in
any site in point-to-point, ring or meshed networks.
Details on system configuration are delivered in Chapter 3, “Functional description” on
page 3-1.
The Alcatel-Lucent 1626 LM supports Line Optical Fiber Amplifiers (LOFA) in Line
Terminal, OADM and Line Repeater sites. Line Optical Fiber Amplifiers are based on
Erbium Doped Fiber Amplifier (EDFA) technology and they are designed to amplify the
aggregate/line signal, in the extended C-band.
Band Optical Fiber Amplifiers (BOFA) Band Optical Fiber Amplifiers are designed to
amplify one band (8-ch).
Other main features
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• G.709/G.798 Optical Layer Management

• Future proof platform moving from pre-OTN system to OTN thanks to the G.709
transponders and concentrators
• Gradual G.709 feature support through simple SW upgrades
• Same Transponder HW delivering both UNI and NNI B&W interfaces toward the
client side
• Enhanced FEC algorithm on colored 10 Gbps interface to boost span reach
• Ingress and egress PM and TCA based on B1; Ingress and egress J0 non-intrusive
monitoring
• L1 and L2 PM on ETHC board, on both client and line sides
• L1 PM on TRBC/TRBD and 2xGE_FC, client side
• PM and TCA at transmission section level based on FEC corrected/uncorrected errors
• Full transparent concentration functionality for TRBC/TRBD boards.
• Transparency functionality for ETHC boards with respect to MAC frame integrity.
• G.709 maintenance signal (Generic-AIS)
• G.709 Generic Communication Channels managed inside the WDM line providing
2Mbps clear channel per 10 Gbps transmitted channel.
• In-service upgrade of already installed DWDM links and of legacy DWDM platforms
The Alcatel-Lucent 1626 LM supports optimized configuration to upgrade legacy
platforms (more details in 3AL 94720 AAAA (REL.1.0), 3AL 94799 AAAA, (rel.1.2)
technical handbooks). This allows to provide new features on legacy platforms in an
easy and traffic hitless way. Single shelf configuration hosting different types of
tributaries is supported to optimize the upgrade of the legacy networks.
• Multiple configurations and multiple network architectures
The 1626 LM can be configured as
• Line terminal (LT)
• Line repeater (LR)
• Tunable and Reconfigurable Add & Drop Multiplexer (T/R OADM)
• Optical Add & Drop Multiplexer (OADM)
These basic configurations address all the different optical network applications. It
covers both point-to-point and point-to-multipoint applications in mesh contexts as
well as in ring scenarios.
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Figure 1-1 Example of 1626 LM configurations in a WDM line

• Flexible and scalable architecture
The 1626 LM design allows to begin with a partially equipped configuration (e.g.: 8
channels) that can be progressively upgraded as the traffic demand grows, with a 8 or 4
chs channels mux/demux granularity. In particular, from the initial configuration, the
transmission capacity can be increased without interrupting the existing traffic.
• Unsurpassed platform density
Up to 16 x 10Gbps optical channels in a single shelf, up to 48 x 10Gbps optical
channels in a single rack. Up to 88x10Gbps system or up to 352x2.5 Gbps interfaces
are supported in only two racks.
• Traffic Flexibility via Optical & Drop functionality.
The Alcatel-Lucent 1626 LM R5.0 provides the add/drop capability by means of
• Channel OADM for 50 GHz compatible architecture providing
– Add/drop up to 100% of the transported capacity
– Independent management of each single channel
– Optical pass-thru (no regeneration) of all the channels that are not extracted.
• Band OADM for 50 GHz compatible architecture providing
– add/drop up to 100% of the traffic
– Optimized architecture for improved OADM cascadability
– Optical pass thru (no regeneration) of all the bands that are not extracted
• Time multiplexing functionality
The Alcatel-Lucent 1626 LM supports fully transparent G.709 compliant multiplexing
of four 2.5Gbps/OTU-1 input signals into one 10 Gbps wavelength. Fully transparent
multiplexing is achieved via the G.709 defined mapping of four ODU-1 into one
ODU-2.
Multiplexing functionality of GbE input client rates is also supported by the 1626 LM
as direct mapping of nine GbE input signals into a 10 Gbps signal and of two GbE/FC
inputs into a 2.5Gbps signal.
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• Full C band tunable laser

The Alcatel-Lucent 1626 LM supports full C-band tunable laser functionality on 10
and 40 Gbps interfaces. This is delivering not only important cost saving in managing
the spare parts, but also a major reduction of the logistical issues associated to network
upgrade planning.
• Raman amplification
Extension of achievable span performances is possible thru Raman amplification. This
is especially useful to mitigate the penalty associated to the presence of very long
spans in a link. Raman amplification is supported thru the interconnection to a
dedicated Raman shelf.
• SFP (up to 2.5 Gbps) and XFP (10 Gbps) pluggable optics
They are optical transceivers that enable to customize the transponder user interface in
a very flexible way. The 1626 LM supports pluggable SFP standard compliant optics
for the client interfaces of 4x2.5Gbps Tributary Concentrator and ETHC1000 and for
the client and line interfaces of 2xGE_FC. XFP optics are supported by TRBD1191
(client side) and ETHC1000 (line side).
• 1+1 Bidirectional Optical Protection.
The 1+1 optical protection provides complete protection of the optical path, including
cable, amplifiers, mux/demux and transponders. High reliability is obtained by
redundancy of the transmission HW. The additional following protection types are
planned in future releases:
• 1:1 OMS protection, devoted to the protection of both the cable cuts and Line
amplifier failures
• 1:N bidirectional OCH protection
• Supervision
In order to supervise all the NEs along a WDM path an optional Optical Supervisory
Channel (OSC) @ 4864 Kbps, is inserted in a 1510nm out-of-band wavelength and
added to the aggregate signal. The OSC channel for Data Communication Channel
(DCC) is 2 Mbs.
• Multishelf configurations
Multishelf configuration management to support large capacity networks.
Configurations of two racks with up to six shelves are supported in current release.
Upgrade to even wider configuration in coming releases.
• Automatic laser control
This feature facilitates the loading of the system with a few number of modulated
channels or to compensate for the loss of some modulated channels
• Management Interfaces
The Alcatel-Lucent 1626 LM is fully managed by the Alcatel-Lucent 1350 Network
Management System, common to all members of the optical family for comprehensive
monitoring, supervision and control of the overall network.
The Alcatel-Lucent 1350 network management system comprises the Alcatel-Lucent
1353NM and 1354RM.
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3AL 75131 AAAA 1-5
Product Configurations & Environment General Overview Equipment Basic Configurations
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• User Interfaces for various overhead for data channels and orders wires using are
provided:
• on OSCU
– an audio (phone) interface
• on USIB
– 2 x 64 kbps digital channel (E1 west and E1 east),
– a phone extension connection (to interconnect two different links)
• on TRBD and TRBC
– a 2Mbps digital channel, a G.703 interface on RJ45 connector
• CPE: two types of CPE configurations can be supported by the 1626 LM
• a 8-channels multiplexed subsystem able to perform a first traffic aggregation step in
sites far from the system terminals (in a future release)
• a remote tributary shelf delivering up to a maximum of 16 single channel outputs
• Firmware download
In-service upgrade providing an automatic firmware update of the slave boards after
each software update. Firmware download is not-traffic affecting.
Equipment Basic Configurations

The 1626 LM design, allows the following basic configurations of the equipment:
• line terminal (LT)and line repeater (LR)
• Tunable and Reconfigurable Optical Add & Drop Multiplexer (T/R OADM)
• Optical Add & Drop Multiplexer (OADM)
Figure 1-2 Example of WDM line

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Different configurations are available depending on the addressed application and grid.
Configurations are reported into three subsections addressing the applicable grid schemes:
• 50 GHz grid supported configurations
• 100 GHz grid supported configurations
• 50 and 100 GHz mixed grid supported configurations
In the next paragraphs/figures
• OMDXn100 stands for Optical Multiplexer and Demultiplexer supporting the 100
GHz grid. It supports up to 8 wavelengths multiplexing and demultiplexing.
Additional upgrades port maybe present depending on the OMDX version (see codes
in Table 2-1, “1626 LM boards and units list1626 LM explanatory notes” (p. 2-20) for
more details). The parameter n can be 4 or 8 depending on the number of maximum
multiplexed channels:
• OMDX4100 is a 4:1 channel multiplexer & demultiplexer 100 GHz grid compliant
unit
• OMDX8100 is a 8:1 channel multiplexer & demultiplexer 100 GHz grid compliant
unit.
• CMDX stands for Channel Mux/Demux (8:1/1:8 mux/demux). It supports up to 8
wavelengths multiplexing and demultiplexing in the 50 GHz grid.
• BMDX stands for Band Mux/Demux (BMDX1000) in line terminal and back-to-back
terminal configuration or Band OADM (BMDX1100) in OADM configuration
compliant to the 50 GHz grid
• the BMDX1000 supports up to 8 wavelengths per band but not does not allow the band
pass-thru (in back-to-back configuration) functionality
• the BMDX1100 supports up to 7 wavelengths per band and allows the full transparent
pass-thru at band level
• LOFA stands for Line Optical Fiber Amplifier, designed to amplify the aggregate
signal (all the extended C-band)
• OSCU stands for Optical Supervisory Channel Unit, allowing the NE management:
OSC is extracted (inside LOFA) from the aggregate signal before entering the pre-
amplifier and then added after the optical amplification of the aggregate signal,
allowing to remotely manage the NE also in case of optical amplifier failure. The
added/dropped signal is coming from/sent to OSCU communicating with ESCT.
• TPD stands for transponders. It includes different categories of supported 3R
interfaces as TRBD, TRBC and 2xGE_FC (with DWDM SFPs). If 2xGE_FC if
equipped with B&W SFP, line side, it has to be connected to one of the TRBC clients.
Line side, ETHC1000 can be provided only with a B&W XFP, hence it has to be
connected to a TRBD
In the next block schemes, only Tributary Direct Transponders with one 10Gbps B&W
client signal and one colored 10Gbps signal, are taken into account.
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The Tributary Concentrator, TRBC (with 4 x 2.5Gbps B&W client interfaces and a
colored 10Gbps one) and the 2xGE_FC (with 2 x GbE or FC B&W client interfaces and a
colored 2.5 Gbps one) are also available, but they are not shown in the following figures,
for simplicity reasons.
In the following are detailed the various configurations.
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Product Configurations & Environment General Overview Line Terminal (LT)
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50 GHz Grid Supported Configurations

In this section the system configuration supporting the 50 GHz grid applications are
detailed.
capacity of 96 channels. Current release supports terminal configuration as well as Band
and T/R OADM architectures.
They deliver a full configurable flexibility to access any wavelength in any site in point to
point-to-point, ring or meshed networks.
Line Terminal (LT)

In Line Terminal configuration (LT), the 1626 LM connects to an optical fibre DWDM
line:
• up to 96 x 10Gbps B&W client signals, using TRBD
• 384 x 2.5Gbps B&W client signals, using TRBC
• 192 x GbE B&W client signals, using 2xGE_FC
Mixed tributary configuration are allowed.
Up to 96 colored WDM signals (12 bands) are multiplexed in the line/aggregate
signal.
The fully equipped LT configuration is requiring three racks.
In the LT configuration the equipment is placed at both ends of point-to-point links. The
schematic representation of the LT configuration is reported in Figure 1-3, “1626 LM Line
Terminal configuration, 50 GHz grid” (p. 1-10) It is consisting of the following:
• line amplifiers (LOFA), with the extraction/insertion of the OSC before/after the
double-stage amplifier
• up to twelve CMDX and one BMDX1000 providing the 1626 LM mux/demux scheme
• transponders (TPD)
• ALCT allowing system loading (optional board)
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3AL 75131 AAAA 1-9
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• OSCU providing NE(s) supervision
Figure 1-3 1626 LM Line Terminal configuration, 50 GHz grid

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Example of a Long Haul Line Terminal (50 GHz grid)
Figure 1-4 Line Terminal - Long Haul - 50 GHz grid

In Line Terminal configuration, up to 96 channels on a 50GHz grid, can be sent to the line.
The used BMDX is the BMDX1000 (band mux/demux).
When the Line Terminal is used in links with Band-OADM, up to 7 channels per band are
available. Moreover the BMDX1100 can also be used, instead of the BMDX1000.
ALCT is used to facilitate the loading of the system. The ALCT band is specified
according to the link design (default is B5). Typically one board is used in LT (but a higher
number may be used), in order to substitute the relevant missing CMDX(s). In case of 12
bands installed, no ALCT is needed.
The line terminal also supports a specific configuration for unrepeatered applications,
based on three preamplifiers and one booster.
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3AL 75131 AAAA 1-11
Product Configurations & Environment General Overview Line Repeater (LR)
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Line Repeater (LR)

The 1626 LM in Line Repeater is a bi-directional NE configuration supporting optical
amplifiers and no transponder nor MUX/DEMUX functionality.
The Line Repeater consists of two optical double-stage in-line amplifiers (LOFA)
providing a bi-directional wide band amplification in order to boost the optical power of
the aggregate WDM signal avoiding any optical to electrical conversion.
In Figure 1-5 a schematic block diagram is representing the Line Repeater configuration.
Figure 1-5 1626 LM Line Repeater configuration
Optical Reconfigurable Add & Drop Multiplexer (R-OADM)

R-OADM is a configuration that brings the capability to add and drop one or more
wavelength to/from the aggregate signal in both directions.
Up to 100% of the traffic may be added/dropped for a total of 96 channels. (88 channels if
ALCT is present).
Each channel of the R-OADM may be in any of the 5 following states:
• Express
The channel is transmitted from one line to the other
• Add_drop_1
The channel from direction one is dropped and the same channel is added to direction
one.
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• Add_drop_2
The channel from direction two is dropped and the same channel is added to direction
two.
• Add_Drop_1&2
The channel is added and dropped for both directions.
• Blocked
The channel is blocked. There is no transmission whatever the channel state is.
At anytime the R-OADM operator is able to modify the state of any channel via a
Graphical User Interface. If the channel is in express state, the operator is able modify its
attenuation in order to perform power gain equalization.
The following figure illustrates a R-OADM configuration.
Figure 1-6 R-OADM Configuration Example
As illustrated in Line Figure 1-6 the R-OADM consists in the following :

• Line amplifiers (LOFA)
Extract/insert of the OSC supervision channel before/after the double stage amplifier.
• 2 WMAN1100 (one for each direction)
Provides reconfigurability.
• Up to 22 CMDX1010
11 per direction, 1 band is reserved by ALCT, as default B5.
• 2 BMDX1000
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Product Configurations & Environment General Overview Optical Tunable Add & Drop Multiplexer (T-OADM)- Grade
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2
............................................................................................................................................................................................................................................................
• Transponders
• ALCT (optional)
Enables system loading (optional board).
• OSCU
Provides supervision.
Optical Tunable Add & Drop Multiplexer (T-OADM)- Grade 2

T-OADM is a configuration that brings the capability to add and drop one or more
wavelength to/from the aggregate signal for both directions.
Up to 100% of the traffic may be added/dropped for a total of 96 channels. (93 if ALCT is
present)
For T-OADM configuration, for each Add & Drop channel, the operator is able to choose
the transponder to perform the Add & Drop. As a consequence, in such configuration all
transponders are able to transmit/receive all of the 96 possible channels.
Each channel of the T-OADM configuration may be in any of the 5 following states:
• Express
The channel is transmitted from one line to the other
• Add_drop_1
The channel from direction one is dropped and the same channel is added to direction
one.
• Add_Drop_2
The channel from direction two is dropped and the same channel is added to direction
two.
• Add_Drop_1&2
The channel is added and dropped for both directions.
• Blocked
The channel is blocked. There is no transmission whatever the channel state is.
At anytime the T-OADM operator is able to modify the state of any channel via a
Graphical Usier Interface. If the channel is in express state, the operator is able modify its
attenuation in order to perform power gain equalization.
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2
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The following figure illustrates a T-OADM configuration.
Figure 1-7 T-OADM Grade 2 Configuration Example
As illustrated in Line Figure 1-7 T-OADM configuration consists in the following:

• On the drop path:
• 2 OADC1102 (or OCNC boards)
Split the express and the drop path.
• 2 OADC1100
Split low cost channels from amplified channels.
• 2 TDMX1180 (one per direction)
Provide with tuneability forth 8 first low cost channels.
• 2 OADC1300 (one per direction, optional)
Increase the number of available amplified channels.
• Up to 16 LOFA (8 per direction, optional)
Amplify additional channels.
• Up to 16 TDMX1180 (8 per direction, optional)
Provide with tuneability for amplified channels.
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Product Configurations & Environment General Overview Optical Tunable Add & Drop Multiplexer (T-OADM) - Grade
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3 or Y node
............................................................................................................................................................................................................................................................
• On the add path:

• 2 OADC1750 (one per direction)
Multiplex low cost channels.
• Up to 16 OADC1750 (8 per direction, optional)
Multiplex amplified channels.
• 2 OADC1300 (one more per direction, optional)
• 4 LOFA (2 per direction, optional)
• 2 WMAN13174 (one per direction)
Provides with reconfigurability and tuneability.
Add ALC channel.
• ALCT
Enables system loading (optional).
• ·Transponders
• OSCU
Provides supervision.
Optical Tunable Add & Drop Multiplexer (T-OADM) - Grade 3 or

Y node
Contrary to other OADM configurations, the Y node is connected to 3 lines in 3 different
directions. A Y node configuration may be used as connection point if the network is
neither ring nor point to point connection type.
Up to 100% of the transit traffic may be added/dropped for a total of 96 channels. (93 if
ALCT is present)
For T-OADM configuration, for each Add & Drop channel, the operator is able to choose
the transponder to perform the Add & Drop. As a consequence, in such configuration all
transponders are able to transmit/receive all of the 96 possible channels.
Y node configuration brings the capability to add and drop one or more wavelengths
to/from the aggregate signal in any of the three directions. It provides to the ability to
establish a connection for any wavelength from one to any of the other two directions.
Thus each channel of the Y node configuration may be in one or more of the following
states:
• Express_XY
The channel is transmitted from direction X to direction Y (and from direction Y to
direction X)
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• Add_drop_X
The channel from direction X is dropped and the same channel is added to direction X.
• Blocked_X
The channel from line X is blocked. There is no transmission whatever the channel
state is.
At anytime the Y node operator is able to modify the state of any channel via a Graphical
Usier Interface. If the channel is in express state, the operator is able modify its attenuation
in order to perform power gain equalization.
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3 or Y node
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The following figure illustrates a T-OADM configuration.
Figure 1-8 T-OADM Grade 3 Configuration Example
As illustrated in Line Figure 1-8 Y node configuration consists in the following:

• On the drop path:
• 3 OCNC (one per direction)
Splits the express and the drop path.
Splits low cost channels from amplified channels.
• 3 TDMX1180 (one per direction)
Provides with tuneability forth 8 first low cost channels.
Increase the number of available amplified channels.
• Up to 24 LOFA (8 per direction, optional)
• Up to 24 TDMX1180 (8 per direction, optional)
Provide tuneability for amplified channels.
• On the add path:
Multiplex low cost channels.
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Product Configurations & Environment General Overview Optical Add & Drop Multiplexer (OADM) repeater (OR)
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• Up to 24 OADC1750 (8 per direction, optional)

• 3 OADC1300 (one more per direction, optional)
• 6 LOFA (2 per direction, optional)
• 3 WMAN13174 (one per direction)
Provide with reconfigurability and tuneability.
Add ALC channel.
• ALCT
Enables system loading (optional)
• Transponders
• 2 OSCU
Provide supervision.
Optical Add & Drop Multiplexer (OADM) repeater (OR)

The OADM repeater is a NE configuration that brings the capabilities to add and drop one
or more wavelengths to/from the aggregate signal in one or both directions.
The OADM NE configuration is implemented in linear and ring based networks.
Up to 100% of the transit traffic can be added/dropped for a total of a maximum 77
wavelengths (11 bands equipped at 7 channels). All the bands that are not extracted are
transparently transmitted without the need of any optical/electrical regeneration (bands are
in optical pass-through). The fully equipped OADM configuration allowing to add and
drop up to 100% of the transit traffic is requiring four racks.
The schematic representation of the OADM configuration is reported in Figure 1-9, “1626
LM OADM configuration on a 50 GHz grid” (p. 1-20). The OADM is consisting of the
following:
• line amplifiers (LOFA), with the extraction/insertion of the OSC before/after the
double-stage amplifier
• up to 22 CMDX (11 per direction, 1 band is reserved by ALCT, as default B5) and 2
BMDX1100 (1 per direction) providing the 1626 LM mux/demux scheme
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• OSCU providing NE(s) supervision.
Figure 1-9 1626 LM OADM configuration on a 50 GHz grid

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Example of a Long Haul Optical Add and Drop Multiplexer Repeater, 50 GHz grid
Figure 1-10 Long Haul Optical Add and Drop Multiplexer Repeater, 50 GHz grid
In OADM repeater configuration, up to 11 wavelength bands per direction can be sent to
the line (1 band is occupied by ALCT).
A maximum of 77 channels (11 bands) can be sent/received to/from the line, per each side
(it is mandatory to keep one band for the ALCT in an OADM, to protect the transmission)
A 7-wavelength at 50 GHz granularity per band, is used per band.
These wavelength are: 195900 (1530.33nm); 195500 (1533.46nm); 195100 (1536.61nm);
194700 (1539.76nm); 194300 (1542.93nm); 193900 (1546.12nm); 193500 (1549.31nm);
193100 (1552.52nm); 192700 (1555.74nm); 192300 (1558.98nm); 191900 (1562.23nm);
191500 (1565.49nm).
Up to 100% of the wavelengths can be added/dropped. The non-added/dropped channels
are in complete pass-through and reamplified.
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ALCT is used to ensure a protection of the added/dropped channels against a line failure
affecting the pass-through. It also facilitates the loading of the system. The ALCT band is
specified according to the link design . Typically two boards are used in OADM (but a
higher number may be used), in order to substitute the relevant missing CMDXs (2
ALCTs have always to be plugged in OADM).
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Back to back terminal

When all the DWDM line channels are added and dropped or electrically regenerated, the
1626 LM is a back-to-back terminal or a hub node.
The Back To Back terminal is a particular case of the OADM configuration without any
optical pass thru channels.
The NE configuration is implemented in linear and ring based networks.
Up to 96 channels/wavelengths (12 bands) can be added/dropped or regenerated in a
BTB configuration. A typical fully equipped configuration is requiring five racks.
The schematic representation of the BTB configuration is reported in Figure 1-11, “1626
LM back-to-back terminal configuration” (p. 1-24). It is consisting of:
• line amplifiers (LOFA), with the extraction (resp. insertion) of the OSC before/after
the double-stage amplifier
• up to 24 CMDX (12 per direction, 1 band may be reserved by ALCT) and 2
BMDX1100 (1 per direction) providing the 1626 LM mux/demux scheme
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Figure 1-11 1626 LM back-to-back terminal configuration

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Example of a Long Haul Back-to-Back Terminal, 50 GHz Grid
Figure 1-12 Long Haul Back-to-Back Terminal, 50 GHz Grid
?????????
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3AL 75131 AAAA 1-25
Product Configurations & Environment General Overview Line Terminal
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100 GHz grid supported configurations

In this section the system configurations supporting the 100 GHz grid applications are
detailed.
The 100 GHz grid architecture is based on sub-bands that can be equipped up to 8
channels.
The system capacity can be scaled up to a maximum of 4 bands (L1, L2, S1, S2) for a total
capacity of 32 channels. Release 4.0A supports Line Terminal configuration as well as
OADM architecture with single wavelength granularity capability.
They deliver the full flexibility to access any wavelength in any site in point to point, ring
or meshed networks.
Line Terminal
In Line Terminal configuration (LT), the 1626 LM connects
• up to 32 x 10 B&W client signals, using TRBD
• up to 128 x 2.5Gbps B&W client signals, using TRBC
• up to 64 x GbE B&W client signals, using 2xGE_FC.
Mixed tributary configurations are allowed.
Up to 32 colored WDM signals are multiplexed in the line/aggregate signal.
The fully equipped LT configuration is requiring a single rack.
schematic representation of the LT configuration is reported in Figure 1-13, “1626 LM
line terminal configuration on a 100GHz grid” (p. 1-27). It is consisting of
• one or two line amplifier boards (LOFA), with the extraction/insertion of the OSC
before/after the double-stage amplifier
• up to 4 OMDX providing the 1626 LM mux/demux scheme
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1 - 26 3AL 75131 AAAA
Product Configurations & Environment General Overview Line Terminal
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Figure 1-13 1626 LM line terminal configuration on a 100GHz grid
Example of a Regional Line Terminal, 100 GHz grid
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3AL 75131 AAAA 1-27
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Figure 1-14 Regional Line Terminal, 100 GHz grid
Line Repeater (LR)

Refer to Chapter 1, “Line Repeater (LR)” on page 1-12.
Optical Add and Drop Multiplexer (OADM)

The OADM repeater is a NE configuration that brings the capabilities to add and drop one
or more wavelengths to/from the aggregate signal in one or both directions.
wavelengths. All the wavelengths or bands that are not extracted are transparently
transmitted without the need of any optical/electrical regeneration (wavelengths or bands
are in optical pass-through). The fully equipped OADM configuration allowing to add and
drop up to 100% of the transit traffic is requiring two racks.
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1 - 28 3AL 75131 AAAA
Product Configurations & Environment General Overview Optical Add and Drop Multiplexer (OADM)
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............................................................................................................................................................................................................................................................
The schematic representation of the OADM configuration is reported in Figure 1-15,

“1626 LM OADM / back to back configuration on a 100 GHz grid” (p. 1-29)
The OADM is consisting of
• up to four line amplifier boards (LOFA), with the extraction/insertion of the OSC
• up to 8 OMDX providing the 1626 LM mux/demux scheme
Figure 1-15 1626 LM OADM / back to back configuration on a 100 GHz grid
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3AL 75131 AAAA 1-29
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50 and 100 GHz grid supported

configurations
The 100 GHz and 50 GHz mixed architecture is based on sub-bands that can be equipped
up to 8 channels.
Up to 16 channels are supported into the 100 GHz grid sub-bands and up to further 32
channels can be supported in the 50 GHz sub-bands for a total capacity of up to 48
channels.
Line Terminal configuration as well as OADM architectures are supproted. They deliver
the full flexibility to access any wavelength in any site in point to point-to-point, ring or
meshed networks.
Line Terminal (LT)

In Line Terminal configuration (LT), the 1626 LM connects to an optical fibre DWDM
line
• up to 48 x 10 Gbps B&W client signals, using TRBD
• up to 192 x 2.5Gbps B&W client signals, using TRBC
• up to 96 x GbE B&W client signals, using 2xGE_FC.
Mixed tributary configurations are allowed.
Up to 48 colored WDM signals are multiplexed in the line/aggregate signal.
The fully equipped LT configuration is requiring two racks.
schematic representation of the LT configuration is reported in Figure 1-3, “1626 LM Line
Terminal configuration, 50 GHz grid” (p. 1-10). It is consisting of:
• up to 2 OMDX, up to 4 CMDX and one BMDX1000 providing the 1626 LM
mux/demux scheme
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Figure 1-16 Line terminal configuration on a 50 and 100GHz mixed grid + 2 stages
amplifier
Line Repeater (LR)

Refer to Chapter 1, “Line Repeater (LR)” on page 1-12.
Optical Add and Drop Multiplexer (OADM)

The OADM is a NE configuration that brings the capabilities to add and drop one or more
wavelengths to/from the aggregate signal in one or both directions.
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3AL 75131 AAAA 1-31
Product Configurations & Environment General Overview Optical Add and Drop Multiplexer (OADM)
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............................................................................................................................................................................................................................................................

wavelengths. All the wavelengths or bands that are not extracted are transparently
transmitted without the need of any optical/electrical regeneration (wavelengths or bands
are in optical pass-through). The fully equipped OADM configuration allowing to add and
drop up to 100% of the transit traffic is requiring two racks.
The schematic representation of the OADM configuration is reported in Figure 1-17,
“OADM configuration on a 50 and 100GHz mixed grid + 2 stages amplifier” (p. 1-32).
The OADM is consisting of:
• up to 4 OMDX, up to 8 CMDX and two BMDX providing the mux/demux scheme
• OSCU providing NE(s) supervision
Figure 1-17 OADM configuration on a 50 and 100GHz mixed grid + 2 stages

amplifier
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1 - 32 3AL 75131 AAAA
Product Configurations & Environment General Overview MUX/DMUX Configurations
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Multiplexing & Amplification Configurations
MUX/DMUX Configurations
Example of MUX and DMUX functions
Line Terminal configurations
In a 4 or 8-channels Line Terminal, multiplexing and demultiplexing are performed in one
step. The extra input of the MUX and the extra output of the DMUX are not connected.
Figure 1-18 MUX and DMUX functions of an 8 channels Line Terminal

In a 12 or 16-channel Line Terminal, multiplexing and demultiplexing are performed in
two steps. The example of Figure 1-19, “MUX and DMUX functions of a 12 channels
Line Terminal” (p. 1-34)shows how to cascade 2 MUXes and 2 DMUXes to obtain a 12-
channels Line Terminal.
The extra input of the first MUX is not connected. The 4-channel aggregate signal output
of the first MUX is connected to the extra input of the second MUX.
The extra output of the first DMUX is connected to the 4 channels aggregate signal input
of the second DMUX. The extra output of the second DMUX is not connected.
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3AL 75131 AAAA 1-33
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Figure 1-19 MUX and DMUX functions of a 12 channels Line Terminal

In a 24 or 32-channels Line Terminal, multiplexing and demultiplexing are performed in
three steps. The example of Chapter 1, “MUX and DMUX functions of a 32 channels Line
Terminal” shows how the 2:1 expansion MUX multiplexes the 16-channels in long band
and 16-channels in short band.
Figure 1-20 MUX and DMUX functions of a 32 channels Line Terminal

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OADM configurations
The example of Figure 1-21, “MUX and DMUX functions of an 8 channels OADM”
(p. 1-35) is an 8-channels OADM. 8 channels are dropped and added on both east and
west lines. In this configuration, the extra output of each DMUX is connected to the extra
input of the MUX of the opposite transmission direction. This allows to place the other 24
channels in pass through.
Figure 1-21 MUX and DMUX functions of an 8 channels OADM

The same configuration is available with 1, 2, 4 and 8-channels (n-channels). In this case,
the number of aggregate channels available in pass through is 32 - n.
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3AL 75131 AAAA 1-35
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The example of Chapter 1, “MUX and DMUX functions of a 32 channels back-to-back

terminal” is a 32-channels back-to-back terminal. In this configuration, there no is pass
through traffic, the 1626LM is like a hub-node.
Figure 1-22 MUX and DMUX functions of a 32 channels back-to-back terminal
Pass-through
Optical pass-through can be performed at the expansion and extra level.
It is also possible to perform non-regenerative optical pass-through at the channel level in
case the design and the performances allow it.
Loading plan for 100 GHz grid mux/demux subsystem

Refer to Chapter 3-1, Table 3-5 Frequencies allocation plan in C-Band for Metropolitan
applications (100GHz grid)on page 3-10 for the frequency allocation plan.
Band sequence (all fiber types)
• L1 Band, S2 Band, L2 Band, S1 Band
Channel sequence inside each band
• from the most internal channel (i.e. the closest to 1545nm) to the most external
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Product Configurations & Environment General Overview Amplification Configurations
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Amplification Configurations
The amplifiers used are LOFA11xx: they are EDFA (Erbium Doped Fiber Amplifier)
aggregate amplifiers able to amplify all the Extended C-band.
Optical Amplifiers are based on a two-stage optical gain block which provides optical
access between the two stages (interstage), used to insert a passive DCU (either DCF or
any other technologies); if no DCU is used, an attenuator may be installed or the VOA
may be tuned to perform the inter-stage loss.
The LOFA serves as
• in-line amplifier when it is used in a regenerator capacity
• terminal pre-amplifier when it is used as the front-end of an optical receiver
• post-amplifier (booster) when it boosts the output signal of a laser transmitter.
LOFA1110 and LOFA1120 provide up to 20 dBm output power without external pump
module.
These two boards also provide connection to an external pump module to increase the
output power up to 23 dBm (future release).
LOFA1111 and LOFA1121 provide up to 17 dBm output power. These boards do not have
a connection for upgrades with an external pump module.
The 1510 nm OSC wavelength is extracted from the aggregate signal at the input of the
first stage of the amplifier and it is added to the aggregate signal at the output of the
second stage.
LOFA contains an internal VOA in order to optimize the gain flatness during the system
lifetime and to avoid non-linear effects in DCF that can fill the interstage.
It is also able to automatically tune its VOA and its 1st stage output power.
LOFAs in unidirectional configuration
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3AL 75131 AAAA 1-37
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Figure 1-23 Generic unidirectional block scheme of a 2-stage amplifier with

interstage access
LOFA11X1 has a floating VOA. By default in unidirectional configuration it is connected
immediately after the first stage as shown in Figure 1-23, “Generic unidirectional block
scheme of a 2-stage amplifier with interstage access” (p. 1-38)If needed it could also be
connected before the first stage.
LOFAs in bidirectional configuration

This configuration can be used in LT, Back to Back and OADM NEs. It is available only
on LOFA1111 and LOFA1121.
Figure 1-24 Generic bidirectional block scheme of a 2-stage amplifier

By default in bidirectional configuration the floating VOA should be connected
immediately before the first stage as shown in Figure 1-24, “Generic bidirectional block
scheme of a 2-stage amplifier” (p. 1-38).
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LOFAs configuration examples

In any configuration allowed the added/dropped OSC channel has to be sent to the
supervision function, performed by the OSCU1010 board.
Figure 1-25 Optical amplification in back-to-back / OADM configuration

(bidirectional)
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3AL 75131 AAAA 1-39
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Figure 1-26 Optical amplification in back-to-back / OADM configuration

(unidirectional)
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See Figure 1-27, “Optical amplification in Line Repeater configuration” (p. 1-41).
A Line Repeater is made up of two LOFAs in In-Line Amplifier configuration.
If no DCU are used, an attenuator may be installed or the VOA may be tuned to perform
the inter-stage loss.
Figure 1-27 Optical amplification in Line Repeater configuration
Figure 1-28 Optical amplification in Line Terminal configuration

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3AL 75131 AAAA 1-41
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1 - 42 3AL 75131 AAAA
Product Configurations & Environment General Overview Upgrading legacy equipment
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Upgrade configurations
Upgrading legacy equipment

The following paragraphs refer to
• 1640 WM existing links upgrade with 1626 LM mux/demux scheme and/or
transponders
• 1686 WM existing links upgrade with 1626 LM mux/demux scheme and/or
transponders
Note that
• the mux/demux scheme, according to the configuration, can be made up of both the
1626 LM and 1640 WM/1686 WM mux/demux
• supervision (OSC) and line amplifiers (booster+preamplifier) belong to the 1640 WM
or 1686 WM.
• WLA is the 1686 WM transponder, TRB is the 1640 WM transponder, TPD is the
1626 LM transponder (TRBD, TRBC)
The OSC allows the NE management: it is extracted from the aggregate signal before
entering the pre-amplifier and then added after the optical amplification of the aggregate
signal. This gives the benefit to remotely manage the NE also in case of optical amplifier
failure.
Line Terminal (LT)

In Line Terminal configuration (LT), the 1626 LM connects, according to the system
architecture,
• up to 80 x 10Gbps B&W client signals, using TRBD or
• 320 x 2.5Gbps B&W client signals, using TRBC
to an optical fibre DWDM line. Mixed configuration are allowed.
The LT is placed at the ends of point-to-point links.
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3AL 75131 AAAA 1-43
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Figure 1-29 Generic example of LT configuration in point-to-point application
Line terminal equipment built-up of 1626 LM and 1640 WM

In the following is given a brief description of the two different 1640 WM mux/demux
schemes
• the TCS scheme is based on 3 mux/demux stages (only the B&W to WDM direction is
described):
• the first one is able to multiplex (or de-multiplex because the boards are bi-directional)
up to 8 channels on a 200GHz grid (function supported by the TCS1xx, TCS302 and
TCS401 boards)
• the second one can mix up to 5 aggregate signals of 8 channels to reach 40
wavelengths on a 100GHz grid (supported by the TCS302, Off-grid channels, and
TCS401, On grid channels);
• the third one combines the two resulting aggregate signals of 40 channels at 100GHz
to have one DWDM signal of 80 channels at 50GHz in C band (function provided by
the TCS401 board).
• The MDX multiplexing architecture is based on two mux / demux stages
• the first one is able to multiplex (or de-multiplex because the boards are bi-directional)
up to 40 channels on a 100GHz grid; this function is supported by the MDX3x2 (On
grid channels) and MDX3x3 (Off-grid channels).
• the second one interleaves the two resulting aggregate signals of 40 channels at
100GHz to have one DWDM signal of 80 channels at 50GHz in C band (by means of
the MDX4x1 board).
Existing 1640 WM links upgrade with 1626 LM boards.

Figure 1-30, “Upgrade of the 1640 WM based on TCS401 in line terminal configuration”
(p. 1-45) shows the upgrade scheme with the TCS401 mux/demux scheme.
Upgrade of 1640WM with TCS301 is not supported. Replacement of TCS301 with
TCS401 is a precondition to upgrade the configuration with 1626 LM tributaries.
The upgrade is allowed only when only when less than 40 channels of the 1640 WM
system are installed. Whatever the actual number “N" of installed channels (v 40), all the
remaining 80-“N" channels can be added with 1626 LM transponders (TRBD, TRBC) +
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Mux/Demux (CMDX, BMDX).

The 1626 LM aggregate signal is connected to the unused input/output port of the 2:1
combiner/1:2 splitter of the TCS401 board.
The upgrade configuration connecting directly the 1626 LM tributaries with the TCS
boards is not allowed.
Figure 1-30 Upgrade of the 1640 WM based on TCS401 in line terminal

configuration
Figure 1-31, “Upgrade of the 1640 WM based on MDX in line terminal configuration”
(p. 1-46) shows the upgrade scheme with the MDX4x1 mux/demux scheme.
Whatever the actual number “N" of installed channels the remaining 80-“N" channels can
be filled with 1626 LM transponders directly connected to the MDX3xx boards of the
1640 WM mux/demux scheme.
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3AL 75131 AAAA 1-45
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It is not allowed to upgrade an already installed 1640 WM system (with MDX4x1 and
MDX3x2 boards) with the 1626 LM mux/demux scheme (instead of MDX3x3)
connected to the MDX4x1 board.
Figure 1-31 Upgrade of the 1640 WM based on MDX in line terminal configuration
Line terminal equipment built-up of 1626 LM and 1686 WM

Hereinafter, a brief description of the 1686 WM mux/demux scheme is given.
It is based on two mux/demux stages
• the first one is made up of two OMDX boards, able to multiplex (or de-multiplex,
because the boards are bidirectional) up to 16 chs each (one in red band, the other one
in blue band) on a 100GHz grid
• the second one multiplexes the two resulting aggregate signals of 16 channels at
100GHz each to have one DWDM signal of 32 channels at 100GHz in C band (by
means of the expansion board).
Existing 1686 WM links upgrade with 1626 LM boards
Two cases of upgrade are allowed:
• 1626 LM mux-demux connected to 1686 WM EXP board
• 1626 LM transponders (TRBD, TRBC) directly connected to 1686 WM mux/demux.
Figure 1-32, “1686 WM system upgrade with 1626 LM transponders in Line Terminal
configuration” (p. 1-47) shows the upgrade scheme with the 1626 LM transponders
directly connected to the 1686 WM mux/demux.
This configuration allows to multiplex/demultiplex up to 32 channels to/from the DWDM
line.
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This upgrade is always possible, whatever the actual number “N" of installed channels.
The remaining 32-“N" channels can be filled with 1626 LM transponders directly
connected to the OMDX16 boards of the 1686 WM mux/demux scheme.
Figure 1-32 1686 WM system upgrade with 1626 LM transponders in Line Terminal
configuration
Figure 1-33, “1686 WM system upgrade with the 1626 LM mux/demux scheme in LT
configuration” (p. 1-48) shows the 1686 WM upgrade scheme with the 1626 LM
mux/demux scheme connected to the expansion board of the 1686 WM.
This configuration is possible when only one 1686 WM Mux/Demux is installed (up to 16
chs), allowing the connection of the 1626 LM mux/demux to the unused port of the 1686
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3AL 75131 AAAA 1-47
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WM EXP board. Hence it is possible to increase the channels number to more than 32
filling the available band with 50GHz spaced chs. The maximum supported configuration
is 52 wavelengths by upgrading the red band with up to 36 x 1626 LM channels.
Figure 1-33 1686 WM system upgrade with the 1626 LM mux/demux scheme in LT
configuration
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1 - 48 3AL 75131 AAAA
Product Configurations & Environment General Overview Point to point links
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Network architectures
The following architectures are foreseen:
• point-to-point
• (multi)point-to-multipoint, both in linear, ring and meshed topologies
Point to point links

Point-to-point links can be performed by means of the following NE configurations
• line terminal, located at each end of the link, that multiplexes/de-multiplexes the
tributary signals
• line repeater, that amplifies the aggregate signal without the need of optical to
electrical conversion
Figure 1-34 The 1626 LM in point-to-point links
(Multi)point-to-multipoint links
(Multi)point-to-multipoint links can be performed by means of some of the following
configurations
• line terminal, located at each end of the link, that multiplexes/de-multiplexes the
tributary signals
• line repeater, that amplifies the aggregate signal without the need of optical to
electrical conversion
• OADM repeater, able to add/drop a part (up to 100%) of the traffic
• Back-to-back terminal, able to add/drop up to 100% of the aggregate signal.
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3AL 75131 AAAA 1-49
Product Configurations & Environment General Overview Linear (multipoint to multipoint) links
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Linear (multipoint to multipoint) links

As shown in Figure 1-35 line terminal, line repeater and OADM repeater configuration
can be used to establish linear (multipoint to multipoint) links.
Figure 1-35 The 1626 LM in linear (multipoint-to-multipoint) links
Ring (multipoint to multipoint) networks

Ring networks can be established by means of the back-to-back terminal, OADM repeater
and line repeater configurations.
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Product Configurations & Environment General Overview Host systems (ADM..)
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Figure 1-36 The 1626 LM in ring (multipoint-to-multipoint) networks
Host systems (ADM..)

Host systems can be all data equipment whose optical output signals have a bit-rate
between 100 Mbps and 10 Gbps. They can be:
• SDH/SONET equipment (STM-1/OC-3, STM-4/OC-12, STM-16/OC-48, STM-
64/OC-192)
• IP routers
• GbE, FC, 2FC, FICON, ESCON equipment
• 10GBEthernet WAN, 10 GBEthernet LAN equipment.
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3AL 75131 AAAA 1-51
Product Configurations & Environment General Overview Host systems (ADM..)
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10Gbps SDH/ Tx Rx TRBD1111 Tx Rx96

SONET TRBD1121
CLIENT SYSTEM Rx Tx TRBD1191 Rx Tx96
10Gbps B&W 10Gbps
COLORED SIGNAL
10GBE WAN Tx Rx TRBD1111 Tx Rx5

TRBD1121
10Gbps B&W 10Gbps
COLORED SIGNAL
10 GBE LAN Tx Rx TRBD1131 Tx Rx4

10Gbps B&W 11Gps
COLORED SIGNAL
Tx1 Rx1
Tx Rx Tx Rx3
GbE Rx1 Tx1
CLIENT ETHC1000 TRBD1191
Tx9 Rx9
SYSTEMS Rx Tx Rx Tx3
Rx9 Tx9 10Gps
1.25Gbps B&W 10Gbps B&W
COLORED
SIGNAL
Tx1 Rx1
GbE/FC Rx1 Tx1 Tx Rx2
CLIENT 2xGE_FC
Tx2 Rx2 Rx Tx2
SYSTEMS Rx2 Tx2 2.5Gps
1.0625Gbps / 1.25Gbps B&W COLORED SIGNAL
Tx
Tx1 Rx1 Rx
GbE/FC Rx1 Tx1
CLIENT 2xGE_FC Tx Rx4 AGGREGATE
Tx2 Rx2 MULTIPLEXED
SYSTEMS Rx2 Rx Tx4
Tx2 2.5Gbps B&W SIGNAL
(UP TO 96 λ)
2.5Gbps Tx Rx3
SDH/SONET
CLIENT SYSTEM Rx Tx3
2.5Gbps B&W
STM1/4, OC3/12,
FC/ESCON/ Tx Rx4 TRBC
GBE/FICON
CLIENT SYSTEM Rx Tx4 Tx Rx1
UP TO FOUR Rx Tx1
10Gbps
4 x ANY Tx Rx2
COLORED SIGNAL
STM1/4, OC3/12, Rx Tx2
FC/ESCON/ 2.5Gbps B&W
Tx Rx1
GBE/FICON
CLIENT SYSTEM Rx Tx1
STM1/4, OC3/12, 1696MS MUX/

FC/ESCON/ Tx Rx4 DEMUX
GBE/FICON
CLIENT SYSTEM Rx Tx4 Tx Rx1 SCHEME
UP TO FOUR 4 x ANY Rx Tx1
2.5Gbps B&W
STM1/4, OC3/12, Tx Rx1
FC/ESCON/
GBE/FICON Rx Tx1
CLIENT SYSTEM 1626LM
Figure 1-37 Connection to host equipment

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Product Configurations & Environment General Overview Protection scenario
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Protection scenario
In 1626 LM the optical protections are managed by means of dedicated protection coupler
boards integrated into the 1626 LM universal shelf. The 1626 LM is able to provide to a
generic host tributary system both linear and ring optical channel (OCh) protections. In
previous releases an additional (1660 OCP) equipment supported this kind of
configuration and 1626 LM in current release is supporting the interworking with 1660
OCP equipment.
Optical Channel (OCh) protection
The channel protection is provided with the Optical SNCP (O-SNCP) performed by means
of the OCPU2104 and transponders (TRBD, TRBC).
The tributary signal is bridged over two different lines (working and protecting line). In
this way the signal is delivered towards two different paths. At the receiver side the
selection between the two diversely routed signals is performed. The protection switching
is triggered by the following switching criteria: LOS, OTU-LOF, OTU-LOM, OTU-TIM,
ODU-AIS, Generic-AIS.
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This kind of protection can be used on two different topologies: linear links and ring
topologies, as shown in Figure 1-38 and Figure 1-39, “Optical SNCP protection scheme:
with back-to-back terminals or OADM” (p. 1-55)respectively.
Figure 1-38 Optical channel protection in linear links

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Figure 1-39 Optical SNCP protection scheme: with back-to-back terminals or OADM
The split and select functions are optically performed, by means of passive optical
couplers and splitters.
The selection is done by shutting-down the user Tx corresponding to the path in failure
and activating the protecting one (see Figure 1-40).
Figure 1-40 Optical protection way of working

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3AL 75131 AAAA 1-55
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The 1626 LM has been designed to offer a record size integration to meet the challenging
requirements of the backbone environment.
A fully loaded 1626LM system with 96 channels (Line Terminal configuration on a
50GHz grid) is housed by three standard ETSI racks.
A fully loaded 1626LM system with 32 channels (Line Terminal configuration on a
100GHz grid) is housed by one standard ETSI rack.
The 1626 LM employs a common shelf type for the different network elements.
The NE composition, when the 1626 LM R.1.X is used with 1640 WM or 1686 WM line
sections, is described in release 1.0 and release 1.2 technical handbooks, code 3AL 94720
AAAA and 3AL 94799 AAAA and it will not be considered in this document.
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3AL 75131 AAAA 2 -1
Physical configuration Rack design
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Rack design
The 1626 LM mechanical design allows to put up to three shelves in current release.
Up to six racks are managed.
It is compatible with the following mechanical standard
• 2200 mm high ETSI rack.
The depth is compliant with the 300 mm deep ETSI racks.
Figure 2-1 Rack organization

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Physical configuration 1626 LM generic empty shelf
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1626 LM physical generic shelf

configuration
The 1626 LM shelf is made up by an empty shelf and the boards and units installed in it.
In current release, the 1626 LM system is composed by
• one mandatory master shelf
• up to five slave/expansion shelves, according to the configuration type.
The board composition determines the shelf type: master or slave.
1626 LM generic empty shelf

The shelf is divided in 41 slots. The logical slot numbers are shown in Figure 2-2, “Shelf
dimensions and slots numbering” (p. 2-4)
Six different mechanics are available for the 1626 LM boards:
• 20 mm width, small height; this mechanic fits into slots 21, 22, 39 and 40
• 20 mm width, medium height; this mechanic fits into slots 1, 2, 19 and 20
• 25 mm width, small height; this mechanic fits into slots 23 to 38
• 25 mm width, medium height; this mechanic fits into slots 3 to 18
• 25 mm width, tall height; this mechanic takes two slots: one 25mm wide, medium
height slot plus one 25mm wide, small height one which is under it. Thus, it fits in
slots 3 plus 23, 4 plus 24 to 18 plus 38. The relevant units use the connector from the
medium height slot to communicate with the SC
• double width, tall height; this mechanic takes four slots: two adjacent 25 mm wide,
medium height slots plus the two 25mm wide, small height ones which are under
them. I.e. it can fit in slots 5, 6, 25, 26. The units which have this mechanics use the
connector from the left medium height slot (slot 5 in the above example) to
communicate with the SC.
• triple width, tall height; this mechanic takes six slots: three adjacent 25 mm wide,
medium height slots plus the three 25mm wide, small height ones which are under
them. I.e. it can fit in slots 5, 6, 7, 25, 26 27.
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Figure 2-2 Shelf dimensions and slots numbering
Generic shelf boards

The following table lists the boards that the generic shelf can host and their related slots.
Table 2-1 Generic Shelf Boards
Slot Numbers Acceptable boards

1 • ESCT2000
2 • CMDX10xx
• OMDX8xxx
• OMDX4100
• BOFA 1000, BOFA 2000
• OADC1750 and OADC 1300
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3-18 • TRBD11xx
• TRBD12xx
• MCC3x_x
• ETHC1000
• 2xGBE_FC
• BMDX1xxx
• CMDX10xx
• OMDX8xxx
• OMDX4100
• OCPU2104
• BOFA 1000, BOFA 2000
• LOFA11xx
• EMPM1
• OSCU10xx in master shelf only
• WMAN1100 (Takes 3 slots. As a consequence,
not in slots 17,18).
• WMAN3x74 (Takes 4 slots. As a consequence,
not in slots 16, 17, 18)
• TDMX1180 (Takes 4 slots. As a consequence,
19 • CMDX10xx
• OMDX8xxx
• OMDX4100
• BOFA 1000, BOFA 2000
20 • CMDX10xx
• OMDX8xxx
• OMDX4100
• BOFA 1000, BOFA 2000
21 • PSUP1000
22 • HSKU1000
• RAIU1000
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3-18 • TRBD11xx
• TRBD12xx
• MCC3x_x
• ETHC1000
• 2xGBE_FC
• BMDX1xxx
• CMDX10xx
• OMDX8xxx
• OMDX4100
• OCPU2104
• BOFA 1000, BOFA 2000
• LOFA11xx
• EMPM1
• OSCU10xx in master shelf only
• WMAN1100 (Takes 3 slots. As a consequence,
not in slots 17,18).
• WMAN3x74 (Takes 4 slots. As a consequence,
• TDMX1180 (Takes 4 slots. As a consequence,
19 • CMDX10xx
• OMDX8xxx
• OMDX4100
• BOFA 1000, BOFA 2000
20 • CMDX10xx
• OMDX8xxx
• OMDX4100
• BOFA 1000, BOFA 2000
21 • PSUP1000
22 • HSKU1000
• RAIU1000
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23-38 • HSKU1100
• USIB1000
• RAIU100
• OADC0104, 1100, 1102, 1101
• OCNC1230 and 1240
• LC-OSC in master shelf only
• USIB1000 in master shelf only
39 RAIU1000
USKU1000
40 PSUP1000
41 FANS1000 and 2000
Important! All the board location constraints are detailed into the
To discover 1626 LM recommended configurations, refer to 1626 LM main and

expansion shelves (recommended) configurations, 2-10
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Physical configuration 1626 LM Compact Shelf
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1626 LM Compact Shelf

The following figure illustrates the compact shelf dimensions and slot numbering.
Figure 2-3 Compact Shelf Dimensions and Slot numbering
Compact shelf boards

The following table lists the boards that the compact shelf can host and their related slots.
Table 2-2 Compact Shelf Boards

1 • ESCT2000 in master shelf
• ILINK in secondary shelf
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2 to 5 • TRBD11xx
• MCC3x_x
• ETHC1000
• 2xGBE_FC
• BMDX1xxx
• CMDX10xx
• OMDX8xxx
• OMDX4100
• OCPU2104
• BOFA 1000, BOFA 2000
• LOFA11xx
• EMPM1
• OSCU10xx in slot 2 and slot 4 only
6 • MCC3x_x
• ALCT1010
• CMDX10xx
• OMDX8xxx
• OCPU2104
• BOFA 1000, BOFA 2000
• LOFA11xx
• OSCU10xx in slot 2 and slot 4 only
• ILINK in master shelf only.
7 • HSKU1100
• RAIU1100
• USIB1000
8 • HSKU1100
• RAIU1100
• LC-OSC
9 • HSKU1100
• RAIU1100
• USIB1000
10 • HSKU1100
• RAIU1100
• LC-OSC
11 and 12 • PSUP1000 in master shelf only
• Adaptor board in secondary shelf only
13 FANS2000
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1626 LM main and expansion shelves

(recommended) configurations
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Physical configuration T-OADM Complete Rack View Example
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T-OADM Complete Rack View Example

The complete rack view example relates illustrtes a T-OADM grade 3 (Y node)
configuration, 10 Gbps rate, unprotected, which can support up to 72 channels.
In the illustration, one color is used per OTS:
The following color symbolizes... the following direction

Pink East
Blue West
Yellow North
Figure 2-4 T-OADM Complete Rack Example
Each OTS is represented by one color. As illustrated, it is strongly recommended not to

mix OTS in racks and subracks. This organization brings a clear position of each
function/direction and makes easier the implementation and the operation.
Note: Channel upgrades are not performed according to the usual way. You will not
proceed by addition of single shelf/rack. In this specific context, will require 3 racks
for 3 shelves at once.
The following table summarizes the capacity of a T-OADM grade 3 (Y node)
configuration, 10 Gbps rate, unprotected, in comparison with shelves/racks number.
Table 2-3 T-OADM Capacity/number of shelves and racks
T-OADM Capacity Number of Shelves and Racks

8 channels 6 shelves / 3 racks
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Physical configuration T-OADM Line Shelf per OTS Example
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T-OADM Line Shelf per OTS Example

In the illustrations, one color is used per OTS:
The following color the following direction...
symbolizes...
Pink East
Blue West
Yellow North
The following tables calls your attention on the following:

If board type is... then
10 Gbps transponder only • Slots 15,16,17 & 18 are empty if less than 8 Add & Drop
channels.
• Slots 17 & 18 are empty if the number of Add & Drop
channels is 9 to 40.
• All slots (15 to 18) are used for more than 40 Add & Drop
channels.
40 Gbps transponder only • Slots 17 & 18 are empty if the number of Add & Drop
channels is 1 to 32.
• All slots (15 to 18) are used for more than 32 Add & Drop
channels.
OADC1300 An OADC1300 is plugged in slot 18 only if one of the 2 “1 to
8 coupler” is used.
Figure 2-5 T-OADM Line Shelf for OTS 1 Example

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Physical configuration T-OADM Line Shelf per OTS Example
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Figure 2-6 T-OADM Line Shelf for OTS 2 Example
Figure 2-7 T-OADM Line Shelf for OTS 3 Exampe
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Physical configuration T-OADM Transponder Shelf per OTS Example
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T-OADM Transponder Shelf per OTS Example

The followinf illustrates transponder shelves for one OTS of a T-OADM grade 3
configuration.
Figure 2-8 T-OADM Transponder Shelf Example (8 first channels)
Figure 2-9 T-OADM Transponder Shelf Example (From 9th to 72nd channel)
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Physical configuration T-OADM Transponder Shelf per OTS Example
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Good To Know
• For a 72 channels configuration, 9 transponder shelves are required per direction.
• In case of a configuration with 8 channels, the amplifier is optional. It becomes
mandatory as soon as you insert a 9th channel.
The following table summarizes the 10 Gbps transponder shelf organization for T-OADM
grade 3 configuration, depending on the number of channels.
Table 2-4 T-OADM / 10 Gbps Transponder Shelf Organization
Number of channels Transponder Shelf Organization

From channel 1 to 8 • 8 TRBC or TRBD
• 1 TDMX 1180 for Drop channels
• 1 OADC1750 for Add channels
From channel 9 to 72 • 8 TRBC or TRBD
• 1 TDMX 1180 for Drop channels
• 1 LOFA
• 1 OADC1750 for Add channels
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Physical configuration Line Terminal Configuration
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Line Terminal Configuration
Figure 2-10 Example of master shelf configuration in Line Terminal application

(50GHz grid)
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Figure 2-11 Example of a slave/transponder shelf configuration (50GHz grid)
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Figure 2-12 Example of transponder shelf configuration

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Figure 2-13 Example of transponder shelf with TRBD and ETHC optically connected
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Figure 2-14 Example of tributary shelf with TRBD and ETHC electrically connected
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Figure 2-15 Example of tributary shelf configuration with twelve ETHC
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Physical configuration OADM Configuration
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OADM Configuration
Figure 2-16 Example of master shelf in OADM configuration

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Figure 2-17 Example of master shelf in OADM configuration (upgradable to 23 dBm,

50GHz grid)
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Figure 2-18 LT on 100GHz grid: master shelf configuration, one LOFA per direction
(Unidirectional)
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Figure 2-19 LT on 100GHz grid: master shelf configuration, one LOFA

(Bidirectional amplifier)
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Figure 2-20 OADM on 100GHz grid: master shelf configuration with vertical
amplifiers
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Physical configuration 1626 LM Part list
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Figure 2-21 OADM on 100GHz grid: master shelf configuration with horizontal
amplifiers
1626 LM Part list

Table 2-5, “1626 LM boards and unit list” (p. 2-27) lists hardware and software
component of the 1626 LM.
In this table, you will find the following information:
• Item Name
• Part numbers
Table 2-5 1626 LM boards and unit list
Board & Unit Name ANV Part#

Software Package
SWP-1626LM R5.0 8DG16894AAAA
Alcatel Lucent Software Licenses
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SWL-Photonics VERS "B" WDM LP 3AL75119AAAA
SWL-Photonics VERS "B" TDM LP 3AL75120AAAA
SWL-Photonics VERS "B" UPG WDM L 3AL75121AAAA
SWL-Photonics VERS "B" UPG TDM L 3AL75122AAAA
SWL-RCT 1626LM LICENCE FEE 3AL94777AAAA
Old Alcatel Lucent Software Licenses
SWL-1626LM versA WDM LP 3AL94514AAAA
SWL-1626LM vers."A" TDM LP 3AL94518AAAA
Software - Miscelaneous
SWP - RAMAN BOARDS R.1.0 MAINTENANCE 8DG16877AAAA
SWP-Raman boards R.1.0 8DG16938AAAA
Installation Kits
KIT - LINE CABLING KIT REGIONAL 3AG26013ABAA
KIT-OADM LINE CABLING KIT 3AG26014AAAA
CMDX AND OMDX CABLING KIT (16 CABLES) 3AL94756AAAA
CMDX AND OMDX CABLING KIT OSNCP 3AL94756BAAA
BMDX CABLING KIT (3 CABLES) 3AL94757AAAA
KIT-OADM BAND CABLING KIT 3AL94758ABAA
INTER SHELF CABLING 2ND SHELF (4 CABLES) 3AL94759BAAA
INTER SHELF CABLING 3RD SHELF (4 CABLES) 3AL94759CAAA
KIT-1640 UPGRADE SC/SC ADAPT. 3AL94771AAAA
1626LM OPTINEX INSTALLATION KIT 3AL94773AAAA
RACK AND SHELF NUMBER SETTING KIT 3AL94902AAAA
INST. KIT IN ETSI RACK 1640WM 3AL94912AAAA
KIT-ANSI 23" INSTALLAT KIT 8DG16571AAAA
KIT-DCU INSTALLAT KIT for ANSI 2 8DG16572AAAA
KIT - WMAN & PGE CABLING KIT 8DG16581AAAA
OSNCP TRBD CABLING KIT 8DG16693AAAA
OSNCP TRBC CABLING KIT 8DG16693BAAA
RAMAN CABLING KIT 8DG16731AAAA
Installation Equipment
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THINLAN TERMINATION MALE BNC 50 OHM 1AB006420037
T BNC CONNECTOR 1AB006670016
CIRCUIT BREAKER 20 A 1AB162710007
CIRCUIT BREAKER 25 A 1AB162710008
OPTO JUMPER SMF MU/PC-SC/PC L=3M 1AB167540010
JUMPER MPO/MPO RIBBON CABLE 10MT 1AB168060034
JUMPER SMF MU/PC-MU/PC 390MM 1AB182400005
JUMPER SM MU/MU C.2MM LSZH 490MM 1AB182400040
JUMPER SM MU/MU CABLE 2MM 770MM 1AB182400041
OPTO JUMPER SM MU/MU LSZH 2.1M 1AB182400051
JARRETIERE OPTIQUE SM MU/MU 2.5M/20 1AB182400052
JUMPER SM MU/MU 2MM LSZH 220CM 1AB182400054
JUMPER SM MU/MU 2MM LSZH 290CM 1AB182400059
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MU/SPC-LC/SPC,SMF,200CM LENGTH 1AB185770011
JUMPER MU/PC-LC/PC SM L=700MM 1AB185770013
JUMPER MU/PC-LC/PC SM L=950MM 1AB185770014
JUMPER MU/PC-LC/PC SM L=1,4MT 1AB185770015
JUMPER MPX - 8SC STRAIGHT FANOUT 1AB204550001
OPTO ATTEN. MU/PC 1DB PLUG TYPE 1AB204800001
OPTO ATTEN. MU/PC 3DB PLU TYPE 1AB204800003
5DB MU ATTENUATOR 1AB204800005
OPTO ATTEN. MU/PC 8DB PULG TYPE 1AB204800008
CONN. BOX 24 PORT MU/UPC-MPO/APC 1AB216900001
LEFT FIBER STORAGE + 8 SC 1AD018570011
RIGHT FIBER STORAGE + 8 SC 1AD018570012
REMOVAL TOOL MU PLUG_IN ATTENUATORS 1AD038600002
TELEPHONE HANDSET 1AF00398AAAA
HOUSEKEEPING CABLE RAMAN 3AL94484AAAA
POWER SUPPLY CABLE RAMAN 3AL94500AAAA
JUMPER 2.1MM E2000 L=30M RAMAN 3AL94504AAAA
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JUMPER 2.1MM E2000 L=100M RAMAN 3AL94504ABAA
AIR FILTER RAMAN 3AL94515AAAA
CHAIN ALARM CABLE 3AL94740AAAA
LAN CABLE 3AL94752AAAA
HSKU1000 CABLE 3AL94768AAAA
HSKU 1100 CABLE 3AL94768ABAA
KIT-CABLE DUCT 3AL94888AAAA
MA-OPTICAL SUPPORT ASSEMBLED 3AL94942AAAA
ESCT2000 RJ45 CONNECTION CABLE 3AL94943AAAA
8 TRBD USER CONNEC./UPPER SHELF 3AL94990AAAA
8 TRBD USER CONNEC./MIDDLE SHELF 3AL94991AAAA
8 TRBD USER CONNEC./BOTTOM SHELF 3AL94992AAAA
8 TRBC USER CONNEC./UPPER SHELF 3AL94993AAAA
8 TRBC USER CONNEC./MIDDLE SHELF 3AL94994AAAA
8 TRBC USER CONNEC./BOTTOM SHELF 3AL94995AAAA
ATTENUATOR MANAGER 3AN44793AAAA
EXTRACTOR 3AN50032AAAA
Multiplexers
OMDX8100_L1_X 3AG26009AAAB
OMDX8100_L1 3AG26009BAAB
OMDX8100_L2 3AG26009BBAB
OMDX8100_S1 3AG26009BCAB
OMDX8100_S2 3AG26009BDAB
OMDX4100_CH30-33 3AG26009CAAB
OMDX4100_CH35-38 3AG26009CBAB
OMDX4100_CH20-23 3AG26009CCAB
OMDX4100_CH25-28 3AG26009CDAB
OMDX4100_CH52-55 3AG26009CEAB
OMDX4100_CH57-60 3AG26009CFAB
OMDX4100_CH42-4 3AG26009CGAB
OMDX4100_CH47-50 3AG26009CHAB
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ALCT1010 B2 1534.65NM 3AL94639ABAB
ALCT1010 B3 1537.80NM 3AL94639ACAB
ALCT1010 B4 1540.95NM 3AL94639ADAB
ALCT1010 B5 1544.13NM 3AL94639AEAB
ALCT1010 B6 1547.32NM 3AL94639AFAB
ALCT1010 B7 1550.52NM 3AL94639AGAB
ALCT1010 B8 1553.74NM 3AL94639AHAB
ALCT1010 B9 1556.96NM 3AL94639ALAB
ALCT1010 B10 1560.20NM 3AL94639AMAB
ALCT1010 B11 1563.46NM 3AL94639ANAB
ALCT1010 B12 1566.73NM 3AL94639APAB
BMDX1000 1:12 OLTE BAND MUX/DEMUX 3AL95504AAAA
BMDX1100 1:12 OADM BAND MUX/DEMUX 3AL95504ABAA
CMDX1010 1:8 B1 CH MUX/DEMUX 3AL95507AAAA
CMDX1010 1:8 B2 CH MUX/DEMUX 3AL95507ABAA
CMDX1010 1:8 B3 CH MUX/DEMUX 3AL95507ACAA
CMDX1010 1:8 B4 CH MUX/DEMUX 3AL95507ADAA
CMDX1010 1:8 B5 CH MUX/DEMUX 3AL95507AEAA
CMDX1010 1:8 B6 CH MUX/DEMUX 3AL95507AFAA
CMDX1010 1:8 B7 CH MUX/DEMUX 3AL95507AGAA
CMDX1010 1:8 B8 CH MUX/DEMUX 3AL95507AHAA
CMDX1010 1:8 B9 CH MUX/DEMUX 3AL95507AJAA
CMDX1010 1:8 B10 CH MUX/DEMUX 3AL95507AKA
CMDX1010 1:8 B11 CH MUX/DEMUX 3AL95507ALAA
CMDX1010 1:8 B12 CH MUX/DEMUX 3AL95507AMAA
Optical Compensation Devices
LOW LOSS SMF C + BAND DCM 3 KM - MU 1AB210830001
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NEW DCM E-LEAF 25 KM 1AB234480001
ENHANCED DCM E-LEAF 75 KM 1AB239330001
Optical Amplifiers
LOFA 1111 - OPTICAL AMPLIFIER 22/9 (17DBM) 3AG26018AAAB
LOFA 1121 - OPTICAL AMPLIFIER 28/9 (17DBM) 3AG26019AAAB
LOFA1110 - OPTICAL AMPLIFIER 22/9 (20 DBM) 3AL94211AAAB
LOFA1120 - OPTICAL AMPLIFIER 28/9 (20 DBM) 3AL94212AAAB
RAMAN AMPLIFIER 2 PUMPS - RMPM1200 3AL95800AAAA
RAMAN AMPLIFIER 3 PUMPS - RMPM1300 3AL95801AAAA
EMPM1000 - 23 DBM PUMP 8DG16591AAAA
Racks
BASIC RACK W TRU 3AL35049AAAA
OPT.RACK TRU&DOOR 3AL37952AAAB
OPT.RACK WITH TRU 3AN44815AAAB
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Subracks and Common parts
8GB FLASH CARD 1AB147830035
PSUP1000 POWER SUPPLY 3AL94247AAAA
NEW ESCT2000 EQUIPMENT AND SHELF 3AL94248BAAA
CONTROLLER
OSCU1010 - OPTICAL SUPERVISORY CHANNEL 3AL94249AAAB
(1510NM)
OSCU1010 - UNREPEATERED APPLICATION 3AL94249ABAA
OSCU1011 - ONE SIDE OPT SUPERV CHANNEL 3AL94249BAAB
(1510NM)
OSCU1010 - OPTICAL SUPERVISORY CHANNEL 3AL94249CAAB
(1510NM) - FROM R.3.0A5
OSCU1010 - UNREPEATERED APPLICATION - FROM 3AL94249DBAA
R.3.0A5
OSCU1011 - ONE SIDE OPT SUPERV CHANNEL 3AL94249EAAB
(1510NM) - FROM R.3.0A5
FANS1000 3AL94251AAAA
USIB1000 3AL94252AAAA
HSKU1000 HOUSEKEEPING UNIT 3AL94253AAAA
HSKU1100 HOUSEKEEPING UNIT - LOWER SLOTS 3AL94253ABAA
ESCT1000 128MB EQUIPMENT AND SHELF 3AL94304ABAA
CONTROLLER
RAIU1000 RACK ALARM INTERFACE UNIT 3AL94305AAAA
BLNK 2000 20MM MEDIUM DUMMY 3AL94476AAAA
BLNK1000 - 20MM SMALL DUMMY UPPER ETSI 3AL94478AAAA
BLNK 3100 25MM FULL DUMMY 3AL94480AAAA
1626LM SHELF 3AL94511AAAA
FAN UNIT PROTECTION (ETSI) 3AL94613AAAA
BOARD MECHANICAL ADAPTER 20MM/20MM 3AL94814AAAA
BLNK3100 - 25 MM FULL DUMMY ETSI 3AL94881AAAA
BLNK2000 - 20 MM MEDIUM DUMMY ETSI 3AL94882AAAA
BLNK1000 20MM SMALL DUMMY LOWER 3AL94883AAAA
MA-DUMMY 265_25 W/O HANDLES 3AL94950AAAA
AIR DEFLECTOR WITH NOISE REDUCTION 3AL94984AAAA
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2 - 34 3AL 75131 AAAA
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21" D.C.U.ASSEMBLED SUPPORT 3AN44747AAAA
FANS COMPACT SHELF 8DG16494AAAA
1626LM COMPACT SHELF 8DG16495AAAA
NEW AIR DEFLECTOR (EXCEEDING CLASS 3.2 DUST) 8DG16605AAAA
DUST FILTER FOR NEW AIR DEFLECTOR 8DG16694AAAA
DUST FILTER FOR NEW AIR DEFLECTOR 8DG16694ABAA
162XLM FIBER DUCT 8DG16802AAAA
1626LM SHELF COVER WITH NEW COMPANY NAME 8DG82559AAAA
AND LOGO
Reconfigurable DWDM Boards
OADC1300 - 1:8 DROP COUPLER 3AG26009DAAA
OADC1750 - 1:8 DROP COUPLER + 2X1:4 ADD 3AG26009EAAA
COUPLER
WMAN 1100 - BLOCKER 3AL94220ABAB
OADC1102 3AL94736ABAA
OADC1101 3AL94736ACAA
OADC1100 - 1:2 DROP COUPLER 3AL94736ADAA
OADC0104 - ALCT ADD COUPLER 3AL94736AEAA
OCNC1230 - DEGREE 3 CONNECTION COUPLER 3AL94736BAAA
OCNC1240 - DEGREE 4 CONNECTION COUPLER 3AL94736CAAA
WMAN3174 - WSS FOR ADD PORTS 8DG16489AAAA
TDMX1180 - WSS FOR TUNEABLE DEMULTIPLEXER 8DG16816AAAA
SFP/XFP Modules
OPTO TRX 1.25GBE SFP-ZX 1AB187280028
OPTO TRX SFP 1.25GBE LX DDM 1AB187280031
OPTO TRX SFP 1.25GBE SX DDM 1AB187280033
OPTO-TRX SFP FC/2FC MM W/ DDM 1AB187280037
OPTO-TRX SFP FC/2FC SM W/ DDM 1AB187280038
OPTO TRX SFP 1.25GBE ZX DDM 1AB187280042
OPTO TRX SFP L-16.2 1AB196370003
OPTO TRX SFP L-16.1 1AB196370004
OPTO TRX SFP I-16.1 DDM 1AB196370005
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3AL 75131 AAAA 2-35
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OPTO TRX SFP S-16.1 DDM 1AB196370006
OPTO TRX SFP S-16.1 ANYRATE DDM 1AB196370007
OPTO TRX SFP L-16.1 DDM -5/+80 1AB196370008
OPTO TRX SFP L-16.2 DDM -5/+80 1AB196370009
XFP I-64.1/10GBE BASE L 1AB214540001
XFP 10GBE BASE S (UP TO 10.3 GBS) 1AB214540002
XFP S64-2B/10GBE BASE E 1AB217280001
OPTO TRX SFP DWDM CH600 1AB231410003

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OPTO-BIDI-XCVR*1.31um 1AB350870001
OPTO-BIDI-XCVR*1.49um 1AB350870002
Switching Protection
OCPU1104 3AL94736AAAA
DUAL OCPU 2104 - 1+1 PROTECTION 3AL95529BCAA
Test Services
ACI-1626LM FAT STANDARD 3AL94623AAAA
ACI-1626LM DIR.SHIP.STANDARD 3AL94734AAAA
ACI-1626LM DIR.SHIP.EXTRA TEST 3AL94734ABAA
ACI-1626LM DIR.SHIP.EXTRA TEMP. 3AL94734ACA
ACI-1626LM DIR.SHIP.EXTRA TIME 3AL94734ADAA
Tributaries
12XGBETH (ETHC1000) 3AL94970AAAA
MCC30 LH 192.0 THZ /SFP 3AL94982AAAC
MCC30 LH 192.1 THZ /SFP 3AL94982ABAC
MCC30 LH 192.2 THZ /SFP 3AL94982ACAC
MCC30 LH 192.3 THZ /SFP 3AL94982ADAC
MCC30 LH 192.5 THZ /SFP 3AL94982AEAC
MCC30 LH 192.6 THZ /SFP 3AL94982AFAC
MCC30 LH 192.7 THZ /SFP 3AL94982AGAC
MCC30 LH 192.8 THZ /SFP 3AL94982AHAC
MCC30 LH 193.0 THZ /SFP 3AL94982ALAC
MCC30 LH 193.1 THZ /SFP 3AL94982AMAC
MCC30 LH 193.2 THZ /SFP 3AL94982ANAC
MCC30 LH 193.3 THZ /SFP 3AL94982APAC
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3AL 75131 AAAA 2-37
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MCC30 LH 193.5 THZ /SFP 3AL94982AQAC
MCC30 LH 193.6 THZ /SFP 3AL94982ARAC
MCC30 LH 193.7 THZ /SFP 3AL94982ASAC
MCC30 LH 193.8 THZ /SFP 3AL94982ATAC
MCC30 LH 194.2 THZ /SFP 3AL94982BAAC
MCC30 LH 194.3 THZ /SFP 3AL94982BBAC
MCC30 LH 194.4 THZ /SFP 3AL94982BCAC
MCC30 LH 194.5 THZ /SFP 3AL94982BDAC
MCC30 LH 194.7 THZ /SFP 3AL94982BEAC
MCC30 LH 194.8 THZ /SFP 3AL94982BFAC
MCC30 LH 194.9 THZ /SFP 3AL94982BGAC
MCC30 LH 195.0 THZ /SFP 3AL94982BHAC
MCC30 LH 195.2 THZ /SFP 3AL94982BLAC
MCC30 LH 195.3 THZ /SFP 3AL94982BMAC
MCC30 LH 195.4 THZ /SFP 3AL94982BNAC
MCC30 LH 195.5 THZ /SFP 3AL94982BPAC
MCC30 LH 195.7 THZ /SFP 3AL94982BQAC
MCC30 LH 195.8 THZ /SFP 3AL94982BRAC
MCC30 LH 195.9 THZ /SFP 3AL94982BSAC
MCC30 LH 196.0 THZ /SFP 3AL94982BTAC
MCC30 LH 192.4 THZ /SFP 3AL94982CAAC
MCC30 LH 192.9 THZ /SFP 3AL94982CBAC
MCC30 LH 193.4 THZ /SFP 3AL94982CCAC
MCC30 LH 194.6 THZ /SFP 3AL94982CDAC
MCC30 LH 195.1 THZ /SFP 3AL94982CEAC
MCC30 LH 195.6 THZ /SFP 3AL94982CFAC
2XGBETH_FC 3AL97800BAAA
Tributaries - Full Band
TRBD1111 /I-64.1 STD 3AL94207ABAC
TRBD1121 /S-64.2 STD 3AL94207ACAC
TRBD1131 /10BASE-LR STD 3AL94207AEAC
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TRBD1111 /I-64.1 ENH 3AL94207DBAC
TRBD1121 /S-64.2 ENH 3AL94207DCAC
TRBD1131 /10GBASE-LR ENH 3AL94207DEAC
TRBD1111 /I-64.1 3AL94207EBAC
TRBD1121 /S-64.2 3AL94207ECAC
TRBC1111 4X2.5GB /SFP STD 3AL94452ABAB
TRBC1111 4X2.5GB /SFP ENH 3AL94452DBAB
TRBC1111 4X2.5GB /SFP 3AL94452EAAB
TRBD4312 - C BAND - PSBT 8DG80616AAAA
TRBD4412 - C BAND - DPSK O 8DG80616ABAA
TRBD4412 - C BAND - DPSK E 8DG80616ACAA
TRBD1191 /XFP UNIVERSA 8DG82531AAAA
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3AL 75131 AAAA 2-39
Physical configuration Equipment connections
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............................................................................................................................................................................................................................................................
Equipment connections
The external connections of the 1626 LM may fall into the following categories:
• optical
• management
• maintenance
• power supply
• user interfaces.
All the equipment connection are detailed in the Installation Handbook.
The next section, Chapter 2, “Units front view” on page 2-45 presents the front view of all
the cards, where the connection points can be identified.
In the following, some general indication and reference to the relevant front view are
given.
Optical connections
MU/SPC connectors
See Figure 2-22, “Double MU optical connector” (p. 2-41) The optical connections are
made with double MU/PC connectors on:
• TRBD1111, TRBD1121, TRBD1131 either on Client or WDM interface, TRBD1191
on WDM interface, see Figure 2-25, “TRBD1111, TRBD1121, TRBD1131 boards
front panel” (p. 2-50)
• TRBC boards, on WDM interface, see Figure 2-27, “TRBC1111 board front panel”
(p. 2-52)
• CMDX boards, see Figure 2-32, “CMDX1010 board front panel” (p. 2-57)
• BMDX boards, see Figure 2-33, “BMDX1X00 board front panel” (p. 2-58)
• ALCT boards, see Figure 2-34, “ALCT1010 front panel” (p. 2-59)
• OMDX boards, see Figure 2-35, “OMDX8100_L1_X board front panel” (p. 2-60),
Figure 2-36, “OMDX8100_xx front panel” (p. 2-61), and Figure 2-37, “OMDX4100
front panel” (p. 2-62)
• LOFA boards, see Figure 2-39, “LOFA11xx front panel” (p. 2-64).
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Figure 2-22 Double MU optical connector

The optical connections are made with simple MU/PC connectors on:
• OSCU boards, see Figure 2-41, “OSCU1010 front panel” (p. 2-66) and Figure 2-42,
“OSCU1011 front panel” (p. 2-67)
• OCPU boards, see Figure 2-38, “OCPU2104 front panel” (p. 2-63)
LC/PC connectors
Refer to Figure 2-30, “SFP optical module” (p. 2-55) and Figure 2-31, “XFP optical
module” (p. 2-56).
The optical connections are made with LC/PC connectors on all the SFP modules plugged
on:
• TRBC1111 boards, client side, see Figure 2-27, “TRBC1111 board front panel”
(p. 2-52)
• 2xGE_FC boards, either on Client or WDM interfaces, see Figure 2-28, “2xGE_FC
board front panel” (p. 2-53)
• ETHC1000 boards, on Client interfaces, see Figure 2-29, “ETHC1000 board front
panel” (p. 2-54).
The optical connections are made with LC/PC connectors on all the XFP modules plugged
on:
• ETHC1000 boards, on WDM interface, see Figure 2-29, “ETHC1000 board front
panel” (p. 2-54)
• TRBD1191 on client interface, see Figure 2-25, “TRBD1111, TRBD1121,
TRBD1131 boards front panel” (p. 2-50).
Management and maintenance connections
NMS Interface
It is the Q3 interface toward the Network Management System (NMS). It is a 10 / 100
Mbps Ethernet interface provided by two RJ45 connectors (10/100 Base-T interface),
located on the ESCT front panel.
See Figure 2-40, “ESCT2000 front panel” (p. 2-65).
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3AL 75131 AAAA 2-41
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Craft Terminal Interface

It is the Q3 interface toward the Craft Terminal. It is a 38.4Kbps serial RS232 interface
provided by the 9-pin SUB-D female connector, located on the ESCT front panel.
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Inter-shelf link
Inter-shelf link (IS-LINK) allow the communication between the EC and all the SCs of the
NE. It is a 100Mbps Ethernet bus, allowing the communication between EC and SCs
located in separate shelves (communication between EC and the local SC is performed on
a local serial bus named ISSB).
The connections can be performed by means of RJ45 connectors, located on the ESCT
front panel.
Using RJ45 connectors (10Base-T interface) each shelf is connected to the adjacent one
(bus topology). Figure 2-23, “Example of intra-shelf links (10Base-T interface)” (p. 2-43)
shows the topology.
In master shelf only, the above RJ45 connector can be connected to the 1353NM.
Figure 2-40, “ESCT2000 front panel” (p. 2-65) shows the ESCT front panel.
Figure 2-23 Example of intra-shelf links (10Base-T interface)

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3AL 75131 AAAA 2-43
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Rack Alarm Interface

Two front panel connectors are available on the RAIU1000 board.
These two interfaces are:
• a 9 pins SUB-D female connector
• in master shelf it provides the interface with the TRU
• in slave shelf it can be connected either with the TRU (point-to-point connection) or
with the RJ11 connector of another RAIU1000 board, located in the above shelf (intra-
shelf or chain connection)
• a RJ11 connector, which allows intra-shelf (chain) connection. It has to be connected
with the 9-pin SUB-D connector of the RAIU1000 located in the shelf below.
See Figure 2-44, “RAIU1000 front panel” (p. 2-69).
Housekeeping
The housekeeping alarm signals are available on the front panel connector of the
HSKU1x00 board. It is a 25 pin SUB-D Female connector.
See Figure 2-43, “HSKU1000 and HSKU1100 front panel” (p. 2-68).
DBG interface connector

It is the interface toward debug tool, available for each EC and SC. It is a 38.4Kbps
interface with a 8-pin RJ45 connectors, on the front-panel of the ESCT2000 board (factory
tests).
DL interface
It is the Direct Link, to connect USB key or disk, available on the front panel of the
ESCT2000.
Power supply connections

Power supply voltage is distributed to the shelves on a 3 pin SUB-D connector, located on
the front panel of each PSUP1000.
See Figure 2-46, “PSUP1000 front panel” (p. 2-71).
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2 - 44 3AL 75131 AAAA
Physical configuration Overview
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............................................................................................................................................................................................................................................................
Units front view

Overview
Purpose
This chapter describes the faceplates and related LED of all boards involved in 1626 LM
configurations.
Refer to this chapter if you want to know how to understand the behavior of a board when
you perform a visual checking
Contents
This chapter covers the following:
Release 5.0 Board LED 2-49
The Legacy Boards 2-49
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3AL 75131 AAAA 2-45
Physical configuration Release 5.0 Board LED
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Release 5.0 Board LED

The following tables describe the LED for each release 5.0 board.
Table 2-6 OADC LED
OADC LED Description

MAB Yellow LED is on when there is a signal failure at
one or more OADC inputs
DAB Yellow LED is on when there is a signal failure at
splitter input.
• LED off: the board is plugged, but not
configured.
• LED is green: the board is plugged, configured
and without any failure.
• LED is red: HW failure, power supply failure or
communication failure.
• LED is yellow: Firmware download on
progress. Do not extract the board.
Table 2-7 TDMX and WMAN LED
TDMX and WMAN LED Description

PWR • LED is green: the board is power supplied.
• LED is red: one of the internal 48V power
supply is failed or switched off (board is starting
up or is not configured).
ABI Yellow LED is on when there is a signal failure at
TDMX input.
Yellow LED is on when channel configuration is not
ABB consistant or when power attenuation is not
adequate.
Yellow LED is on when there is a monitoring
ABM
problem.
configured.
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2 - 46 3AL 75131 AAAA
Physical configuration Release 5.0 Board Faceplates
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Table 2-8 TRBD4312 LED
TRBD4312 LED Description

PWR • LED is green: the board is power supplied.
• LED is red: one of the internal 48V power
supply is failed or switched off (board is starting
up or is not configured).
RxA Led is yellow when at least one of the following
alarms is detected in the egress direction (WDM-
>B&W): LOS, OTU2_LOM, Generic-AIS.
Led is yellow when at least one of the following
alarms is detected in the ingress direction (B&W-
TxA
>WDM): LOS , Wavelength Deviation, Output
Power Degraded.
Led is yellow when the board is in transition state.
OOS This is typically the case when board initialisation is
on progress.
configured.
Release 5.0 Board Faceplates

The following figure illustrates the release 5.0 board faceplates. DRAFT
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3AL 75131 AAAA 2-47
Physical configuration Release 5.0 Board Faceplates
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Figure 2-24 Release 5.0 Board Faceplates

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2 - 48 3AL 75131 AAAA
Physical configuration The Legacy Boards
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............................................................................................................................................................................................................................................................
The Legacy Boards

Overview
Purpose
This section gives an illustration of all the faceplates of boards which have been released
prior release 5.0.
Contents
This section covers the following::
Figure 2-25 TRBD1111, TRBD1121, TRBD1131 boards front panel 2-50
Figure 2-26 TRBD1191 board front panel 2-51
Figure 2-27 TRBC1111 board front panel 2-52
Figure 2-28 2xGE_FC board front panel 2-53
Figure 2-29 ETHC1000 board front panel 2-54
Figure 2-30 SFP optical module 2-55
Figure 2-31 XFP optical module 2-56
Figure 2-32 CMDX1010 board front panel 2-57
Figure 2-33 BMDX1X00 board front panel 2-58
Figure 2-34 ALCT1010 front panel 2-59
Figure 2-35 OMDX8100_L1_X board front panel 2-60
Figure 2-36 OMDX8100_xx front panel 2-61
Figure 2-37 OMDX4100 front panel 2-62
Figure 2-38 OCPU2104 front panel 2-63
Figure 2-39 LOFA11xx front panel 2-64
Figure 2-40 ESCT2000 front panel 2-65
Figure 2-41 OSCU1010 front panel 2-66
Figure 2-42 OSCU1011 front panel 2-67
Figure 2-43 HSKU1000 and HSKU1100 front panel 2-68
Figure 2-44 RAIU1000 front panel 2-69
Figure 2-45 USIB1000 front panel 2-70
Figure 2-46 PSUP1000 front panel 2-71
Figure 2-47 FANS1000 front panel 2-72

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3AL 75131 AAAA 2-49
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Figure 2-25 TRBD1111, TRBD1121, TRBD1131 boards front panel

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2 - 50 3AL 75131 AAAA
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Figure 2-26 TRBD1191 board front panel

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3AL 75131 AAAA 2-51
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Figure 2-27 TRBC1111 board front panel

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Figure 2-28 2xGE_FC board front panel

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3AL 75131 AAAA 2-53
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Figure 2-29 ETHC1000 board front panel

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2 - 54 3AL 75131 AAAA
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Figure 2-30 SFP optical module

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3AL 75131 AAAA 2-55
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Figure 2-31 XFP optical module

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2 - 56 3AL 75131 AAAA
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Figure 2-32 CMDX1010 board front panel DRAFT
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3AL 75131 AAAA 2-57
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Figure 2-33 BMDX1X00 board front panel

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2 - 58 3AL 75131 AAAA
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Figure 2-34 ALCT1010 front panel DRAFT
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Figure 2-35 OMDX8100_L1_X board front panel

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Figure 2-36 OMDX8100_xx front panel

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3AL 75131 AAAA 2-61
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Figure 2-37 OMDX4100 front panel

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Figure 2-38 OCPU2104 front panel

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3AL 75131 AAAA 2-63
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Figure 2-39 LOFA11xx front panel

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Figure 2-40 ESCT2000 front panel

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3AL 75131 AAAA 2-65
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Figure 2-41 OSCU1010 front panel

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Figure 2-42 OSCU1011 front panel DRAFT
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3AL 75131 AAAA 2-67
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Figure 2-43 HSKU1000 and HSKU1100 front panel

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2 - 68 3AL 75131 AAAA
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Figure 2-44 RAIU1000 front panel

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3AL 75131 AAAA 2-69
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Figure 2-45 USIB1000 front panel

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2 - 70 3AL 75131 AAAA
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Figure 2-46 PSUP1000 front panel
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3AL 75131 AAAA 2-71
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Figure 2-47 FANS1000 front panel

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2 - 72 3AL 75131 AAAA
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1. Overview
2.
3. Purpose
4.
5. This chapter describes the main function delivered by the 1626 LM.
6.
7. Contents
8. This chapter covers the following functions:
9.
10.
11. Optics 3-2
12.
13. Optical Supervision 3-14
14. Protection 3-17
15.
Performance Monitoring 3-20
16.
17. Transmission Frame 3-28
18. Loopbacks 3-32
19.
20. Equipment Control 3-36
21. Power supply 3-41
22.
Operation & Management Services 3-44
23.
24.
25.
26.
27.
28.
29.
30.
31.
32.
33.
34.
35.
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3AL 75131 AAAA 3 -1
Functional Description The Optical Signal Process
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Optics 1.
2.
3.
This section describes:
4.
• the main characteristics of the entities involved in: 5.
• the optical signal process, 6.
• the 1626 LM operation management services. 7.
8.
• the optical channels used for the various application.
9.
10.
11.
The Optical Signal Process 12.
13.
The optical signal is processed according to a bidirectional communication mode as 14.
described in the following table. 15.
16.
Table 3-1 Optical Signal Process 17.
18.
Step Process / Function Boards involved Comments 19.
1 User/Client signal conversion Concentrators (if required): TRBC and TRBD provides with 20.
into WDM signal enhanced FEC. 21.
• ETHC1000
22.
• 2xGE_FC
23.
Transponders: 24.
• TRBC 25.
• TRBD 26.
2 Optical Multiplexing • CMDX • The 50 Ghz grid
27.
multiplexer/demultiplexer is 28.
• BMDX
based on OMDX combined with 29.
• OMDX
BMDX (up to 12:1 input/output). 30.
• The 100 Ghz grid 31.
multiplexer/demultiplexer is 32.
based on OMDX (OMDX4100 33.
and 8100) to address the regional 34.
applications.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
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3-2 3AL 75131 AAAA
Functional Description Transmission Rates/Mode and Standard Compliance
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............................................................................................................................................................................................................................................................
1. Step Process / Function Boards involved Comments

2.
3. 3 Amplification LOFA • The amplification takes place
4. after step 2 before signal
transmission along the optical
5. fiber.
6.
• If required, DCU module
7. (Dispersion Compensation Unit)
8. can be inserted in LOFA mid-
9. stage or between cascaded LOFA
10. toprovide long distance
11. transmission without signal
12. penalty.
13. • Optical Supervisory Channel
(OSC) provided by OSCU board
14.
is added at the LOFA
15. input/output. It enables to
16. supervise all the NE along the
17. WDM path. OSCU interfaces
18. with the controller board via back
19. panel connection. OSCU delivers
20. a voice digital channel at 64 kbps.
21. 4 WDM Transmission - -
22.
4 Optical Demultiplexing Refer to step 2 -
23.
24. 6 WDM signal conversion into Refer to step 1 -
25. User/Client signal
26.
27.
28.
29.
30. Transmission Rates/Mode and Standard Compliance
31.
32. Table 3-2 Transponder and Concentrator Transmission Rates/Mode
33.
34. Transponders / User/Client WDM Line Transmision Mode
35. Concentrators Bit Rate (Gbps) Bit rate (Gbps)
36. TRBD1xyz 9.953 10.709 (G.709) UNI
37. (STM-64 / OC-192 /
38. 10 GbE WAN)
39.
10.709 (G.709) 10.709 (G.709) NNI
40.
41. 10.31 (10 GbE WAN) 11.0957 Proprietary UNI
42. 10.519 (10 Gb FC) 11.317 Proprietary UNI
43.
44. TRBD4312
45.
46.
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3AL 75131 AAAA 3-3
Functional Description The Optical Channels
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Transponders / User/Client WDM Line Transmision Mode 1.

Concentrators Bit Rate (Gbps) Bit rate (Gbps) 2.
3.
TRBC Up to 4x2.48 10.709 UNI / NNI
4.
(STM-16 / OC-64)
5.
Up to 4x2.66 (G.709) 10.709 6.
2xGBE_FC Up to 2x1.256 2.48 GFP-T mapping 7.
(GbE LAN) (STM-16 / OC-48) 8.
9.
Up to 2x1.0625 2.48 GFP-T mapping 10.
(Gb FC) (STM-16 / OC-48)
11.
ETHC Up to 9x1.25 (GbE) 9.953 - 12.
(10 GbE WAN) 13.
14.
Table 3-3 Transponder and Concentrator Standard Compliance 15.
Transponders / Concentrators Standard Compliance
16.
17.
TRBC / TRBD (User/Client Signal) • ITU-T G.691, I-64.1 (VSR signals) 18.
• ITU-T G.693, VSR2000-2R1 (VSR signals) 19.
• Bellcore GR253-CORE SR1 (VSR signals) 20.
• ITU-T G.691 (S-64.2b signals) 21.
• ITU-T G.957 (STM-16 / OC-48) 22.
• ITU-T G.959.1 ((L-64.2 signals) 23.
• IEE 802.3ac-2002 (10 GbE WAN / LAN) 24.
25.
TRBC / TRBD (WDM Signal) ITU-T 694.1
26.
2xGbE (User/Client Signals) IEE 802.3 27.
2xGbE (WDM Signals) • ITU-T G.957-c for STM-16
28.
29.
• ITU-T G.704 for GFP-T
30.
ETHC (User/Client Signals) IEE 802.3 31.
ETHC (WDM Signals) IEE 802.3ac-2002 (10 GbE WAN) 32.
33.
34.
35.
36.
37.
The Optical Channels 38.
39.
Depending on the mux/demux scheme used, the 1626 LM transmits: 40.
• up to 96 channels on a 50GHz grid, in the Extended C-band 41.
• up to 32 channels on a 100GHz grid, in the C-band. 42.
43.
• up to 48 channels on a mixed 50 and 100GHz grid, in the C-band. 44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3-4 3AL 75131 AAAA
DRAFT
............................................................................................................................................................................................................................................................
1. The following tables gives the nominal ferquency allocation plan for each transmission
2. type.
3.
4. Table 3-4 Nominal frequencies allocation plan in C-Band for long haul applications
5. (50GHz grid)
6. Central frequency Channel
7. Band (THz) Number Central wavelength (nm)
8.
Band 1 195.900 195900 1530,33
9.
10. 195.850 195850 1530,72
11. 195.800 195800 1531,11
12.
13. 195.750 195750 1531,50
14. 195.700 195700 1531,90
15.
195.650 195650 1532,29
16.
17. 195.600 195600 1532,68
18. 195,550 195550 1533,07
19.
20. Band 2 195.500 195500 1533,46
21. 195.450 195450 1533,86
22.
195.400 195400 1534,25
23.
24. 195.350 195350 1534,64
25. 195.300 195300 1535,03
26.
27. 195.250 195250 1535,43
28. 195.200 195200 1535,82
29.
195,150 195150 1536,21
30.
31. Band 3 195.100 195100 1536,61
32. 195.050 195050 1537,00
33.
34. 195.000 195000 1537,39
35. 194.950 194950 1537,79
36.
194.900 194900 1538,18
37.
38. 194.850 194850 1538,58
39. 194.800 194800 1538,97
40.
41. 194.750 194750 1539,37
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 3-5
DRAFT
............................................................................................................................................................................................................................................................
Central frequency Channel 1.

Band (THz) Number Central wavelength (nm) 2.
3.
Band 4 194.700 194700 1539,76
4.
194.650 194650 1540,16 5.
194.600 194600 1540,55
6.
7.
194.550 194550 1540,95 8.
194.500 194500 1541,35 9.
10.
194.450 194450 1541,74
11.
194.400 194400 1542,14 12.
194.350 194350 1542,54
13.
14.
Band 5 194.300 194300 1542,93 15.
194.250 194250 1543,33 16.
17.
194.200 194200 1543,73
18.
194.150 194150 1544,13 19.
194.100 194100 1544,52
20.
21.
194.050 194050 1544,92 22.
194.000 194000 1545,32 23.
24.
193.950 193950 1545,72
25.
Band 6 193.900 193900 1546,12 26.
193.850 193850 1546,52
27.
28.
193.800 193800 1546,91 29.
193.750 193750 1547,31 30.
31.
193.700 193700 1547,71
32.
193.650 193650 1548,11 33.
193.600 193600 1548,51
34.
35.
193.550 193550 1548,91 36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3-6 3AL 75131 AAAA
DRAFT
............................................................................................................................................................................................................................................................

3.
4. Band 7 193.500 193500 1549,31
5. 193.450 193450 1549,71
6.
193.400 193400 1550,11
7.
8. 193.350 193350 1550,51
9. 193.300 193300 1550,92
10.
11. 193.250 193250 1551,32
12. 193.200 193200 1551,72
13.
193.150 193150 1552,12
14.
15. Band 8 193.100 193100 1552,52
16. 193.050 193050 1552,92
17.
18. 193.000 193000 1553,33
19. 192.950 192950 1553,73
20.
192.900 192900 1554,13
21.
22. 192.850 192850 1554,53
23. 192.800 192800 1554,94
24.
25. 192.750 192750 1555,34
26. Band 9 192.700 192700 1555,74
27.
192.650 192650 1556,15
28.
29. 192.600 192600 1556,55
30. 192.550 192550 1556,96
31.
32. 192.500 192500 1557,36
33. 192.450 192450 1557,77
34.
192.400 192400 1558,17
35.
36. 192.350 192350 1558,58
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 3-7
DRAFT
............................................................................................................................................................................................................................................................
Central frequency Channel 1.

3.
Band 10 192.300 192300 1558,98
4.
192.250 192250 1559,39 5.
192.200 192200 1559,79
6.
7.
192.150 192150 1560,20 8.
192.100 192100 1560,60 9.
10.
192.050 192050 1561,01
11.
192.000 192000 1561,42 12.
191.950 191950 1561,82
13.
14.
Band 11 191.900 191900 1562,23 15.
191.850 191850 1562,64 16.
17.
191.800 191800 1563,04
18.
191.750 191750 1563,45 19.
191.700 191700 1563,86
20.
21.
191.650 196550 1554,27 22.
191.600 191600 1564,68 23.
24.
191.550 191550 1565,08
25.
Band 12 191.500 191500 1565,49 26.
191.450 191450 1565,39
27.
28.
191.400 191400 1566,31 29.
191.350 191350 1566,72 30.
31.
191.300 191300 1567,13
32.
191.250 191250 1567,54 33.
191.200 191200 1567,95
34.
35.
191.150 191150 1568,36 36.
37.
Note 38.
Band sequence (both G.652 and G.655 fiber) 39.
40.
• Band 6, Band 7, Band 8, Band 4, Band 9, Band 3, Band 2, Band 10, Band 5, Band 1,
41.
Band 11, Band 12
42.
• ALC in B5 until the band is loaded, then turned off. 43.
Channel sequence inside each band 44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3-8 3AL 75131 AAAA
DRAFT
............................................................................................................................................................................................................................................................
1. • G.652: from the most internal channel (i.e. the closest to 1546nm) to the most external,
2. with 50GHz spacing
3. • G.655, designed for 100GHz spacing: from the most internal to the most external, with
4. 100GHz spacing
5.
• G.655, designed for 50GHz spacing: from the most internal to the most external,
6.
starting with 100GHz spacing, then passing to 50GHz spacing (after loading at
7.
100GHz is complete).
8.
9. Links without OADMs
10. • ALC can be turned off after 32 channels (100GHz loading) or 64 (50GHz loading).
11.
12. Links with OADMs
13. • ALC cannot be removed if the traffic add/dropped at an OADM needs to be protected:
14. Band 5 is generally reserved for ALCT insertion
15. Maximum number of channels: 7 x 11bands = 77.
16.
17.
18.
19.
20.
21.
22.
23.
24.
25.
26.
27.
28.
29.
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 3-9
DRAFT
............................................................................................................................................................................................................................................................
Table 3-5 Frequencies allocation plan in C-Band for Metropolitan applications 1.

(100GHz grid) 2.
3.
Central frequency Channel
5.
S1 Band 196.000 196900 1529.55 6.
195.900 195900 1530,33 7.
8.
195.800 195800 1531,11
9.
195.700 195700 1531,90 10.
195.500 195500 1533,46 11.
12.
195.400 195400 1534,25 13.
195.300 195300 1535,03 14.
15.
195.200 195200 1535,82
16.
S2 Band 195.000 195000 1537,39 17.
194.900 194900 1538,18 18.
19.
194.800 194800 1538,97 20.
194.700 194700 1539,76 21.
22.
194.500 194500 1541,35
23.
194.400 194400 1542,14 24.
194.300 194300 1542,93 25.
26.
194.200 194200 1543,73 27.
L1 Band 193.800 193800 1546,91 28.
29.
193.700 193700 1547,71
30.
193.600 193600 1548,51 31.
193.500 193500 1549,31 32.
33.
193.300 193300 1550,92 34.
193.200 193200 1551,72 35.
36.
193.100 193100 1552,52
37.
193.000 193000 1553,33 38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3 - 10 3AL 75131 AAAA
DRAFT
............................................................................................................................................................................................................................................................

3.
4. L2 Band 192.800 192800 1554,94
5. 192.700 192700 1555,74
6.
192.600 192600 1556,55
7.
8. 192.500 192500 1557,36
9. 192.300 192300 1558,98
10.
11. 192.200 192200 1559,79
12. 192.100 192100 1560,60
13.
192.000 192000 1561,42
14.
15.
16.
17.
18.
19.
20.
21.
22.
23.
24.
25.
26.
27.
28.
29.
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 3-11
DRAFT
............................................................................................................................................................................................................................................................
Table 3-6 Frequencies plan for Metropolitan applications (50 and 100GHz mixed 1.
grid) 2.
3.
Central frequency Channel
5.
Band 1 195.900 195900 1530,33 6.
195.850 195850 1530,72 7.
8.
195.800 195800 1531,11
9.
195.750 195750 1531,50 10.
195.700 195700 1531,90 11.
12.
195.650 195650 1532,29 13.
195.600 195600 1532,68 14.
15.
195,550 195550 1533,07
16.
Band 2 195.500 195500 1533,46 17.
195.450 195450 1533,86 18.
19.
195.400 195400 1534,25 20.
195.350 195350 1534,64 21.
22.
195.300 195300 1535,03
23.
195.250 195250 1535,43 24.
195.200 195200 1535,82 25.
26.
195,150 195150 1536,21 27.
Band 3 195.100 195100 1536,61 28.
29.
195.050 195050 1537,00
30.
195.000 195000 1537,39 31.
194.950 194950 1537,79 32.
33.
194.900 194900 1538,18 34.
194.850 194850 1538,58 35.
36.
194.800 194800 1538,97
37.
194.750 194750 1539,37 38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3 - 12 3AL 75131 AAAA
DRAFT
............................................................................................................................................................................................................................................................

3.
4. Band 4 194.700 194700 1539,76
5. 194.650 194650 1540,16
6.
194.600 194600 1540,55
7.
8. 194.550 194550 1540,95
9. 194.500 194500 1541,35
10.
11. 194.450 194450 1541,74
12. 194.400 194400 1542,14
13.
194.350 194350 1542,54
14.
15. L1 Band 193.800 193800 1546,91
16. 193.700 193700 1547,71
17.
18. 193.600 193600 1548,51
19. 193.500 193500 1549,31
20.
193.300 193300 1550,92
21.
22. 193.200 193200 1551,72
23. 193.100 193100 1552,52
24.
25. 193.000 193000 1553,33
26. L2 Band 192.800 192800 1554,94
27.
192.700 192700 1555,74
28.
29. 192.600 192600 1556,55
30. 192.500 192500 1557,36
31.
32. 192.300 192300 1558,98
33. 192.200 192200 1559,79
34.
192.100 192100 1560,60
35.
36. 192.000 192000 1561,42
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 3-13
Functional Description Optical Supervision
DRAFT
............................................................................................................................................................................................................................................................
Optical Supervision 1.
2.
The optional out-of-band Optical Supervisory Channel allows the supervision of all the 3.
NEs along the WDM path; moreover it gives some order-wires (data channel and voice 4.
channel) to the users. 5.
From current release this function is managed by 1626 LM equipment, by means of 6.
the OSCU1010 supervision unit. This board provides two optical transmitters and two 7.
optical receivers to enable to supervise two directions. 8.
9.
Remotely, from a Craft Terminal or 1353 SH, it is possible to access the status of a distant 10.
NE and send commands to it by means of the OSC. 11.
It is an optical channel containing the communication protocol with the ESCT2000 board 12.
in the 12 DCC (Data Communication Channel) bytes extracted from the OSC. 13.
It is added/dropped in each NE along the transmission line, providing a communication 14.
link within the system. In this way the external DCN, necessary to connect the WDM 15.
system to the NMS, can reach any NE, receiving the supervision information concerning 16.
the whole transmission path through the OSC. 17.
18.
19.
20.
CT/N
NE NE 21.
22.
23.
24.
25.
OSC OSC 26.
generation generation 27.
28.
29.
Figure 3-1 Remote supervision through OSC
30.
The OSC is transported over a 1510 nm extra-band wavelength with a 4.864 bit rate being 31.
the result of the multiplexing of two 2.048 Mbps streams: the 2 Mbps supervision frame 32.
for embedded DCC and an additional 2 Mbps Data Channel reserved for future use (not 33.
available in current release). 34.
The supervision channel is 35.
36.
• added to the aggregate optical signal at the output of the terminal equipment, after the
37.
booster (input of the WDM line),
38.
• terminated in each OADM, back-to-back terminal or repeater (extracted before the 39.
preamplifier/1st stage amplifier, from the optical signal received from the line, and 40.
added after the booster/2nd stage amplifier, to the optical signal transmitted to the line) 41.
• dropped from the received optical signal at the input of the terminal, before the 42.
preamplifier (output of the WDM line). 43.
44.
The optical supervisory channel conveys a supervision frame that contains all the
45.
information for
46.
DRAFT
............................................................................................................................................................................................................................................................
3 - 14 3AL 75131 AAAA
DRAFT
............................................................................................................................................................................................................................................................
1. • distant NE management (Line Terminal, OADM, back-to-back or Line Repeater)

2. • remote user-access from any site to all other sites,
3.
• auxiliary channels for data transmission (64 kbps Engineering Order Wire)
4.
5. • voice phone channels.
6. Two kinds of calls can be placed on the voice phone channel: point-to-point call and
7. conference call.
8.
9. The following figure illustrates the OSCU implementation in an OADM configuration.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
21.
22.
23.
24.
25.
26.
27.
28.
29.
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
Figure 3-2 OSCU Implementation in OADM Configuration
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 3-15
DRAFT
............................................................................................................................................................................................................................................................
At first, the 4Mbps signal on a 1510 nm wavelength, is extracted from the optical 1.
aggregate signal with an optical filter, in amplifier or mux/demux board. Then it is 2.
received by the OSCU board and electrically demultiplexed in two 2 Mbps streams: the 2 3.
Mbps OSC stream and the additional 2 Mbps stream. 4.
The additional 2 Mbps stream is sent to the USIB board through back panel links to be 5.
dropped to the client. 6.
The 64 Kbps E2 byte carrying the voice channel, is dropped towards the board front panel 7.
on which a telephone handset is plugged. 8.
9.
The DCCs are sent with the entire 32 bytes frame through back panel TDM links to the 10.
ESCT board located in slot #1. The FPGA extracts the DCC bytes and stores them in 11.
registers. Al the processing are performed by the microprocessor. 12.
In the reverse way, the microprocessor generates the information to be sent, gives it to the 13.
FPGA that builds the 32 bytes frame. This frame is sent to the OSCU board through TDM 14.
links. 15.
The OSCU board fills the 64 kb/s E2 voice channel. 16.
It fills the 2Mbps with the stream coming from the USIB. Then it multiplexes the 2 Mbps 17.
supervisory channel with the additional 2 Mbps stream. The laser emits the 4 Mbps OSC 18.
frame that is multiplexed through an optical filter in an amplifier board (LOFA) or 19.
Mux/Demux (BMDX). 20.
21.
22.
23.
24.
25.
26.
27.
28.
29.
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3 - 16 3AL 75131 AAAA
Functional Description Protection
DRAFT
............................................................................................................................................................................................................................................................
1. Protection
2.
3. In the 1626 LM, the optical protection (channel protection) is provided with the Optical
4. SNCP (O-SNCP) performed by means of a dedicated protection coupler (OCPU2104) and
5. transponders (TRBD and TRBC, in current release).
6.
7. OCPU2104 provides O-SNCP for TRBD and TRBC clients. 2 clients are 1+1 protected,
8. by means of 2 optical couplers and splitters, as shown in Figure 3-3, “OSNCP: supported
9. configurations” (p. 3-17). It is a medium height board.
10. .
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
21.
22.
23. Figure 3-3 OSNCP: supported configurations
24.
25.
26.
27.
28.
29.
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40. Figure 3-4 Transponder sub-system in O-SNCP configuration
41. The tributary signal is bridged over two different lines (working and protecting line). In
42. this way the signal is delivered towards two different paths. At the receiver side the
43. selection between the two diversely routed signals is performed. The protection switching
44. is triggered by the following switching criteria: LOS, OTU-LOF, OTU-LOM, OTU-TIM,
45. ODU-AIS, Generic-AIS.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 3-17
DRAFT
............................................................................................................................................................................................................................................................
The split and select functions are optically performed, by means of passive optical 1.
couplers and splitters, hosted in the OCPUx104 board). 2.
The selection is done by shutting-down the user Tx corresponding to the path in failure 3.
thus activating the protecting one (an example is given in Figure 1-22, “Optical protection 4.
way of working” (p. 1-30)). 5.
6.
This kind of protection can be used on two different topologies: linear links and ring 7.
topologies, as shown in Figure 1-20, “Optical channel protection in linear links” (p. 1-29) 8.
and Figure 1-21, “Optical SNCP protection scheme: with back-to-back terminals or 9.
OADM” (p. 1-30), respectively. 10.
In the following is detailed the O-SNCP way of working: 11.
12.
• two transponders/boards (main and protecting) exchange information, via dedicated
13.
backplane links, on the quality of the signal that they have to deliver at the client B&W
14.
interface
15.
• the two transponders arbitrate between them with the target of choosing the best 16.
signal, and decide the transponder that has to shutdown the BW laser, and the one that 17.
has to activate it 18.
• the inputs of the two B&W interfaces of the transponders are connected (via optical 19.
cables) to the outputs of a 50/50 splitter 20.
• the outputs of the two B&W interfaces of the transponders are connected (via optical 21.
cables) to the inputs of a coupler; since only one B&W laser is active at a given time, a 22.
switch is in fact realized by shutting down the current active laser and activating the 23.
current inactive laser 24.
25.
• the working and the protecting transponder must be allocated in adjacent twin slots
26.
(slots 3-4, 5-6, ..but not 4-5) to perform the protection switch. Figure 3-5, “O-SNCP:
27.
shelf configuration examples” (p. 3-19) shows slot relationship between OCPU2104
28.
and TRBD/C.
29.
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3 - 18 3AL 75131 AAAA
DRAFT
............................................................................................................................................................................................................................................................
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
21.
22.
23.
24.
25.
26.
27.
28.
29. Figure 3-5 O-SNCP: shelf configuration examples
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 3-19
Functional Description Performance Monitoring Points on transmission boards
DRAFT
............................................................................................................................................................................................................................................................
Performance Monitoring 1.
2.
3.
Performance Monitoring is a function which provides the operator with the ability to
4.
constantly monitor the quality of the signal flowing through his WDM network. This
5.
function is available at selected Performance Monitoring Points, it is performed through
6.
an accumulation of information during fixed time windows (granularity periods: 15min or
7.
24h) and it provides consistent information to the management interface (end-to-end
8.
monitoring).
9.
When PM is activated, for each PM Point, the following processes are automatically 10.
performed 11.
• Continuous monitoring by transmission boards of the quality of the signal flowing 12.
through the PM Point and generation of raw PM information, known as 1s PM 13.
primitives (1s stands for 1 second) 14.
15.
• Correlation between 1s PM primitives by the system, with periodic collection of 1s
16.
PM primitives and accumulation of corresponding PM counters (PM events) during
17.
the current monitoring period.
18.
N.B. PM primitives are raw information, internally used, but not made available at
19.
NMS; PM counters are the significant values resulting of correlations between PM
20.
primitives. These values are made available to the NMS.
21.
• Generation of PM current data related to the current monitoring period (15min / 24h), 22.
based on PM counters accumulated during the current monitoring period 23.
• Comparison of PM counters of the current monitoring period with related PM 24.
Threshold profile (TCA) 25.
• Generation of PM history data, with storing of PM information related to past 15min / 26.
24h periods 27.
28.
From the management interface, it is possible to manage PM data (clear PM counters, 29.
activate or deactivate Performance Monitoring...) and PM Thresholds (profile 30.
assignment/modification...).The latter is used to generate Threshold Crossed Alarms 31.
(TCA). 32.
33.
34.
Performance Monitoring Points on transmission boards 35.
36.
37.
PM Points are characterized by the following parameters:
38.
• monitored side, which can be: 39.
• Egress if monitoring is performed on information received from WDM side (WDM -- 40.
> BW) 41.
• Ingress if monitoring is performed on information received from B&W side (B&W --> 42.
WDM) 43.
44.
• monitored end, which can be: 45.
• Near End if monitoring is related to the quality of the received signal 46.
DRAFT
............................................................................................................................................................................................................................................................
3 - 20 3AL 75131 AAAA
DRAFT
............................................................................................................................................................................................................................................................
1. • monitored layer, which can be:

2. • on TRBD
3.
– FEC at 10Gbps based on FEC decoder info (Corrected Errors, Uncorrected
4.
Blocks)
5.
6. – SDH10G based on information (B1 byte) contained in SDH Regenerator Section
7. 10G overhead and specific ETSI processing
8. • on TRBC
9. – FEC at 10Gbps based on FEC decoder info (Corrected Errors, Uncorrected
10. Blocks)
11.
12. – SDH2.5G based on information (B1 byte) contained in SDH Regenerator Section
13. 2.5G overhead and specific ETSI processing
14. • on 2xGE_FC
15. – Layer 1 GbE PM (client side), based on 8B/10B coding (either on GbE or FC
16. signals)
17.
– SDH2.5G based on information (B1 byte) contained in SDH Regenerator Section
18.
10G overhead and specific ETSI processing
19.
20. • on ETHC1000
21. – Layer 1 GbE PM (client side), based on 8B/10B coding
22. – Layer 2 (User/Client and WDM line sides)
23.
– SDH10G based on information (B1 byte) contained in SDH Regenerator Section
24.
2.5G overhead and specific ETSI processing
25.
26. For each PM Point it is possible to activate monitoring with 15min or 24h (or both at the
27. same time) granularity. The following table summarizes the combination of monitored
28. side/end/layer, supported in current release.
29.
30. Table 3-7 Boards and supported Performance Monitoring Points
31.
32.
33. PM Point 1626 LM ETSI
34. Near end egress FEC PM at 10 Gbps TRBC and TRBD
35.
Near end egress B1 PM at 10 Gbps (STM-64) TRBD, ETHC1000
36.
37. Near end ingress B1 PM at 10 Gbps (STM64) TRBD, ETHC1000
38. Near end egress B1 PM at 2.5 Gbps (STM16) TRBC and 2xGE_FC
39.
40. Near end ingress B1 PM at 2.5 Gbps (STM16) TRBC and 2xGE_FC
41. Near end egress Layer 1 10 GbE PM TRBD1191, only if 10GbE
42. LAN
43.
Near end ingress Layer 1 10 GbE PM TRBD1191, only if 10GbE
44.
LAN
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 3-21
DRAFT
............................................................................................................................................................................................................................................................
PM Point 1626 LM ETSI 1.

2.
Near end egress Layer 1 GbE PM 2xGE_FC and ETHC1000 3.
Near end ingress Layer 1 GbE PM 2xGE_FC and ETHC1000 4.
5.
Near end egress Layer 2 ETHC1000
6.
7.
1626 LM PM working mode
8.
The Performance Monitoring sub-system performs the end-to-end quality-of-service 9.
monitoring of each individual wavelength, all along its path. Performance monitoring is 10.
available: 11.
• CLIENT side, at the User Rx access in order to monitor the client incoming (near end) 12.
signal; in this case 13.
• for TRBD and TRBC: PM (SDH type) is based on B1 and Threshold Crossing Alarm 14.
based on B1 errors count 15.
16.
• for 2xGE_FC, ETHC1000: PM (GbE type) is based on Layer 1 counters (8B/10B) 17.
• for TRBD1191 (if 10 GbE LAN only): PM (10 GbE type) is based on Layer 1 counters 18.
(64B/66B) 19.
• for ETHC1000: PM (GbE type) is based on Layer 1 counters 20.
21.
• Line/WDM side, at the WDM Rx access in order to monitor the Line/WDM incoming
22.
(near end) signal and its transmission through the WDM network; in this case PM and
23.
Threshold Crossing Alarm are based on
24.
• for TRBD and TRBC: FEC corrected/uncorrected errors 25.
• for 2xGE_FC and ETHC1000: Layer 1 PM (SDH type PM) 26.
27.
28.
29.
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
Figure 3-6 TRBD, TRBC: example of possible monitored sections
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3 - 22 3AL 75131 AAAA
DRAFT
............................................................................................................................................................................................................................................................
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13. Figure 3-7 2xGE_FC: example of possible monitored sections
14.
15.
16.
17.
18.
19.
20.
21.
22.
23.
24.
25.
26.
27. Figure 3-8 ETHC1000: example of possible monitored sections
28. As already stated, the system monitors 1s PM primitives and then generates PM counters,
29. briefly described in the following.
30.
PM counters (PM events) accumulation by the Shelf Controller for 15min/24h granularity
31.
period
32.
33. Starting from 1s PM primitives collected with the polling mechanism, SC evaluates
34. corresponding PM counters (also known in standards as PM events) increments, that are
35. accumulated over the current monitoring period to which they are related (15min or
36. 24hours) for PM purposes (Current Data generation).
37. The performance monitoring is supported at the following layers:
38.
39. • SDH Regenerator Section (RS) layer, both for STM-16 (2.5 Gbps) and STM-64/10
40. GbE WAN signals
41. • FEC layer, for 10 Gbps signals
42. • layer 1 Ethernet PM, for 1.250 Gbps (GbE) and 1.0625 Gbps (FC) signals
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 3-23
DRAFT
............................................................................................................................................................................................................................................................
For the SDH-RS layer, the following performance counters are supported: 1.
• ES (Erroneous Second): Count of seconds with at least one B1 code violation or with 2.
at least one RS defect 3.
4.
• SES (Severely Erroneous Second): Count of seconds which contains more than 2400
5.
(approximately > 30%) B1 code violation, or at least one RS defect. A SES is also
6.
counted as an ES
7.
• BBE (Background Block Error): Count of B1 code violations which occur outside a 8.
SES. 9.
10.
For the FEC layer at 10Gbps, the following performance counters are supported: 11.
• BEC (Background Error Corrected): count of FEC corrected errors that occurred 12.
outside a SCS (result is divided by 512 for display reasons) 13.
• SCS (Severely Corrected Seconds): count of seconds with a FEC layer defect or at 14.
least one FEC uncorrected block or more than 33 538 048 FEC corrected errors (this 15.
corresponds to a rate of FEC corrected errors per second higher than approximately 16.
3E-3) 17.
18.
• BBU (Background Block Uncorrected): count of FEC uncorrected blocks that
19.
occurred outside a SUS
20.
• SUS (Severely Uncorrected Seconds): count of seconds in which a FEC layer defect 21.
occurred or in which more than 33 538 048 FEC blocks were uncorrected (this 22.
corresponds to a rate of FEC uncorrected blocks per second higher than approximately 23.
3E-3) 24.
• CS (Corrected Seconds): counter not used; fixed value = 0. 25.
• US (Uncorrected Seconds): counter not used; fixed value = 0. 26.
27.
For the Ethernet layer 1 at 1.25Gbps (GbE) or 1.0625Gbps (Fiber Channel), the 28.
following performance counters are supported (per each port): 29.
30.
• based on 8B/10B coding structure of the Ethernet frame, two types of errors are
31.
detected:
32.
• RDE (Running Disparity Error) 33.
• IW (Invalid Word) 34.
• these RDE and IW errors occurring in 1s are accumulated in a 16 bits counter, called 35.
ICG (Invalid Code Group) 36.
37.
• based on ICG and LOS/LOF detection, the following performance counters are
38.
supported
39.
• ES: at least one ICG or one LOS or LOF or unit missing within the second 40.
• SES: at least 10000 ICG (corresponds to a BER <10E-5) or one LOS or LOF or unit 41.
missing 42.
• BBE: ICG occurring outside a SES 43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3 - 24 3AL 75131 AAAA
DRAFT
............................................................................................................................................................................................................................................................
1. For the Ethernet Layer 2 (1 and 10 Gbps), the following performance counters are
2. supported (per each port):
3. • TRCF: Total Received Correct Frames
4. TRCF counts the number of valid frames received by each Ethernet port.
5. TRCF sums the number of received unicast, multicast and broadcast frames.
6.
• TRCO: Total Received Correct Octets
7. TRCO counts the number of valid bytes received by each Ethernet port.
8.
• TRSEF: Total Received Service Errored Frames
9. TRSEF counts the number of errored frames received by each Ethernet port.
10.
• TTF: Total Transmitted Frames
11. TTF counts the number of frames transmitted by each Ethernet port.
12. TTF sums the number of transmitted unicast, multicast and broadcast frames.
13. • TTO: Total Transmitted Octets
14. TTO counts the number of bytes transmitted by each Ethernet port.
15.
• TDF: Total Dropped Frames
16.
TDF counts the number of frames dropped by each Ethernet port.
17.
18. Unavailable Time
19.
20. A period of unavailable time (UAT) shall begin when 10 consecutive SES (or SUS) events
21. have been detected. These 10 seconds are considered to be part of the available time.
22. The UAS counter shall accumulate over the monitoring period (it shall be reset at the end
23. of the monitoring period) the number of seconds of unavailable time.
24.
Performance monitoring event counting for ES, SES, BBE shall be inhibited during
25.
unavailable time.
26.
27. An alarm UAT shall be raised at the detection of a period of unavailable time and cleared
28. at the detection of a new period of available time, whatever the monitoring period.
29.
30.
31. PM current data management
32.
Performance Monitoring on a given PM Point can be activated on either 15-minute or 24-
33.
hour (or both at the same time) granularity.
34.
35.
36. During a monitoring period, PM information (counters, elapsed time, etc.) is continuously
37. updated and can be managed from management interface. At the end of the monitoring
38. period, the content of PM current data (counters, elapsed time, etc.) is stored into history
39. data, the current data is reset and a new monitoring period begins. Up to sixteen 15min and
40. one 24h history data are stored in the NE.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 3-25
DRAFT
............................................................................................................................................................................................................................................................
Threshold Crossing Alarms (TCA) 1.

15min and 24h PM counters are compared to provisionable thresholds, in order to 2.
generate TCA. 3.
TCA on 15min PM counters are raised/cleared according to a Dual Level Threshold 4.
Crossing mechanism while TCA on 24h PM counters are raised according to a Single 5.
Level Threshold Crossing mechanism: 6.
7.
• Single Level Threshold Crossing: a threshold level is associated to each counter of an
8.
activated PM point; TCA is raised each time the threshold is crossed by any counter,
9.
during an accumulation period (a single level TCA is implicitly cleared at the
10.
beginning of each monitored period)
11.
• Dual Level Threshold Crossing: two threshold levels are associated to each counter of 12.
an activated PM point: the Set and the Reset ones. TCA is generated each time the Set 13.
(high) threshold is crossed during an accumulation period. TCA is reset (clear) at the 14.
end of a subsequent accumulation period in which the counter that generated TCA is 15.
lower than or equal to the Reset (low) value. 16.
17.
18.
19.
20.
21.
22.
23.
24.
25.
26.
27.
28.
29.
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3 - 26 3AL 75131 AAAA
DRAFT
............................................................................................................................................................................................................................................................
1. Default thresholds for QoS alarms

2. The default values of set and reset thresholds are given in the following tables.
3.
4. Table 3-8 RS counters default threshold data values
5.
6.
7. 15 min Set 15min Reset
8. Threshold Threshold
9.
Threshold Data Id BBE ES SES BBE ES SES
10.
11. 3 RS Counters 15min 24000 50 10 200 5 0
12.
13.
24 hours Threshold
14.
15. Threshold Data Id BBE ES SES
16. 2 - RS Counters 24h 36000 150 15
17.
18.
19.
20. Table 3-9 OCH counters default threshold data values
21.
22.
23. 15 min Set Threshold 15 min Reset Threshold
24.
Threshold Data BB BE SU BB
25. Id U C US CS S SCS U BEC US CS SUS SCS
26.
27. 9 - OCH Counters 1 213 0 0 10 10 0 8 0 0 0 0
28. 15min
29.
30. 24 hours Threshold
31.
32. Threshold Data BB BE SU
33. Id U C US CS S SCS
34. 8 - OCH Counters 1 218 0 0 300 300
35. 24h
36.
37. Alarms
38.
For TCA, the ASAP mechanism to set the alarm severity is not used. In order to set the
39.
alarm severity the reference object is Threshold Data, in which the alarm severity can be
40.
configured setting the severity Indication field of the counter Threshold Attribute List
41.
attribute. The default severity is Warning for all the TCA.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 3-27
Functional Description Introduction
DRAFT
............................................................................................................................................................................................................................................................
Transmission Frame 1.
2.
3.
The G.709 standard offers a considerable quantity of service channels in the OverHead
4.
(OH) bytes of the frame. These bytes are used for section maintenance (frame alignment,
5.
network management operations, auxiliary communications,..).
6.
For reader's convenience, the structure of some WDM frames is shown in the following
7.
pages; in particular will be further detailed the structure to the digital domain structures.
8.
Reference specifications: G.709. 9.
10.
11.
12.
Introduction 13.
14.
In the following is briefly described the G.709 frame construction (Optical Transport 15.
Hierarchy - OTH), in client to WDM direction. 16.
This paragraph is mainly dedicated to the adaptation of the 10 Gbps B&W client signals 17.
(SDH/SONET...), into the WDM colored signals. A brief description of the 2.5 Gbps 18.
B&W client signals is also given, in particular on the multiplexing structure to have the 19.
10Gbps WDM signal. 20.
The UNI interface is thus considered, client side. 21.
In case of NNI, the input signals to the system is OTUk; thus, this is the starting level in 22.
the structure (no OPUk and ODUk adaptation has to be performed). 23.
24.
Refer to Figure 3-9, “Optical Transport Hierarchy (OTH) frame structure” (p. 3-30). The 25.
client signal or an Optical channel Data unit / Tributary Unit Group is mapped into the 26.
OPUk. The OPUk is mapped into an ODUk and the ODUk is mapped into an OTUk. The 27.
OTUk is mapped into an Optical Channel (OCh). In the next paragraph, an explanation of 28.
these mapping will be provided. 29.
The OCh is an information structure consisting of the OCh payload with a certain 30.
bandwidth and non-associated overhead for the optical channel management. The OCh 31.
transports a digital client signal between 3R regeneration points. 32.
The OCh is then modulated onto an Optical Channel Carrier (OCC), representing a 33.
tributary slot within the OTM. The OCC consists of the OCC Payload, assigned to a 34.
wavelength/frequency of the WDM group, and OCC Overhead, that is transported within 35.
the OTM Overhead Signal (OOS) structure. 36.
37.
38.
Wavelength division multiplexing 39.
40.
41.
Up to n OCCs are multiplexed into the Optical Multiplex Section (OMS) using
42.
wavelength division multiplexing. The characteristic information of the OMS consists of
43.
OMS payload and OMS overhead. The OMS overhead is transported within the OOS
44.
structure.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3 - 28 3AL 75131 AAAA
Functional Description Wavelength division multiplexing
DRAFT
............................................................................................................................................................................................................................................................
1. The Optical Physical Section of order n (OPSn) is a network layer providing functionality
2. for transmission of a multi-wavelength optical signal on optical media of various types
3. (e.g. G.652, G.653 and G.655 fibre).
4. It combines the transport functionality of the OMS and OTS layer networks without their
5. supervisory information.
6.
7. The characteristic information of the Optical Transmission Section (OTS) consists of OTS
8. payload and OTS overhead. The OTS OverHead is added to the payload to create an OTM;
9. It includes information for maintenance and operational functions to support OTS. The
10. OTS overhead information is contained within the OOS structure and it is terminated
11. where the OTM is assembled and disassembled.
12.
The Optical Transport Module (OTMn) is the information structure that is transported
13.
across the Optical Network. The OTM consists of up to n multiplexed optical channels and
14.
an OTM overhead signal (OOS) to support the non-associated overhead. It is the structure
15.
used to support OTS layer connections in the OTN.
16.
The Optical Supervisory Channel (OSC) is the physical carrier outside the amplifier band
17.
providing the transport of the OTM overhead signal; it is multiplexed into the OTM using
18.
wavelength division multiplexing.
19.
20.
21.
22.
23.
24.
25.
26.
27.
28.
29.
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 3-29
Functional Description Wavelength division multiplexing
DRAFT
............................................................................................................................................................................................................................................................
Figure 3-9 Optical Transport Hierarchy (OTH) frame structure 1.

Refer to Figure 3-10, “Multiplexing of four ODU1 into a ODU2” (p. 3-30) where is 2.
mainly presented the multiplexing of four ODU1 signals into the OPU2 signal. The 3.
multiplexing structure is compliant to the ITU-T G.709/Y.1331 recommendation. 4.
Each (of four) B&W client signal is mapped into the OPU1. The OPU1 is mapped into an 5.
ODU1. 6.
An ODU1 signal is extended with frame alignment overhead and asynchronously mapped 7.
into the Optical channel Data Tributary Unit 1 into 2 (ODTU12), using the justification 8.
overhead (JOH). 9.
The four ODTU12 signals are time division multiplexed (bit interleaving) into the Optical 10.
channel Data unit Tributary Unit Group 2 (ODTUG2), after which this signal is mapped 11.
into the OPU2. 12.
The OPU2 is then mapped into an ODU2 and the ODU2 is mapped into an OTU2. 13.
14.
The four incoming signals can be fully asynchronous. The stuffing overheads are inserted 15.
in order that the client signal (e.g. STM16) is fully transparently transmitted. 16.
17.
18.
19.
20.
21.
22.
23.
24.
25.
26.
27.
28.
29.
30.
31.
32.
33.
34.
35.
36.
Figure 3-10 Multiplexing of four ODU1 into a ODU2 37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3 - 30 3AL 75131 AAAA
Functional Description Optical channel transport unit (OTUk) description
DRAFT
............................................................................................................................................................................................................................................................
1. Optical channel transport unit (OTUk) description

2.
3. The OTUk conditions the ODUk for transport over an optical channel network connection.
4. The OTUk frame structure is completely standardized.
5. The OTUk (k = 1,2,3) frame structure is based on the ODUk frame structure and extends it
6. with a forward error correction (FEC) as shown in Figure 3-11, “G.709/Y.1331 - OTUk
7. frame structure” (p. 3-31).
8. 256 columns are added to the ODUk frame for the FEC and the reserved overhead bytes in
9. row 1.
10. Columns 1 to 7 are dedicated to the Frame Alignment overhead.
11. Columns 8 to 14 of the ODUk overhead are used for OTUk specific overhead, resulting in
12. an octet-based block frame structure with four rows and 4080 columns. The MSB in each
13. byte is bit 1, the LSB is bit 8. The bit rates of the OTUk signals are defined below:
14.
15. • OTU1 = 2.666 057 Gbps
16. • OTU2 = 10.709 225 316 Gbps
17. • OTU3 = 43.018 413 559 Gbps
18.
The OTUk forward error correction (FEC) contains the FEC codes (RS or Enhanced FEC
19.
or BCH).
20.
If no FEC is used, fixed stuffing bytes (all-0s pattern) are to be used.
21.
The transmission order of the bits in the OTUk frame is left to right, top to bottom, and
22.
MSB to LSB.
23.
24.
25.
26.
27.
28.
29.
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40. Figure 3-11 G.709/Y.1331 - OTUk frame structure
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 3-31
Functional Description TRBC & TRBD Loopbacks
DRAFT
............................................................................................................................................................................................................................................................
Loopbacks 1.
2.
3.
Loopbacks are performed for troubleshooting purposes to identify faults in the
4.
transmission path with the help of an external test device. The external test device is used
5.
to compare the outgoing and returning signals. The result of the loopback is shown on the
6.
external test device.
7.
You can create a «loopback and continue» test at the user interface of ETHC, 2xGBE_FC 8.
or TRBC/TRBD boards. 9.
10.
Important! You cannot create a loopback on both user and line sides at the same 11.
time. 12.
13.
14.
15.
16.
TRBC & TRBD Loopbacks 17.
18.
Loopbacks are available at the user interface on all TRBDs and TRBC111. 19.
20.
The following loop-back functions shall be available:
21.
• B&W line loop & continue: the client signal received on the B&W interface is copied 22.
and sent back through the B&W emitter. This signal is also transmitted as usual to the 23.
WDM interface. 24.
25.
26.
27.
28.
29.
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3 - 32 3AL 75131 AAAA
Functional Description TRBC & TRBD Loopbacks
DRAFT
............................................................................................................................................................................................................................................................
1. • WDM line loop & continue: the signal received on the WDM interface is copied and
2. sent back through the WDM emitter. It is also transmitted to the B&W interface.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
21.
22.
23.
24.
25.
26. Figure 3-12 TRBD Loop-backs
27.
28.
29.
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 3-33
Functional Description 2xGBE_FC & ETHC Loopbacks
DRAFT
............................................................................................................................................................................................................................................................
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
21.
Figure 3-13 TRBC1111 Loopbacks 22.
23.
24.
25.
26.
2xGBE_FC & ETHC Loopbacks 27.
28.
For 2xGBE_FC boards, the following loopbacks are available: 29.
• on user side, loop-and-continue 30.
31.
• on line side, loop-and-continue. 32.
33.
34.
35.
36.
37.
38.
39.
40.
Figure 3-14 Loopbacks configuration of 2xGE_FC
41.
42.
For ETHC boards, the following loopbacks are available: 43.
44.
• on user side, loop-and-cut: it performs a loop at PCS level
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3 - 34 3AL 75131 AAAA
Functional Description 2xGBE_FC & ETHC Loopbacks
DRAFT
............................................................................................................................................................................................................................................................
1. • on line side, loop-and-continue: it performs a line loop after the PCS block.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11. Figure 3-15 Loopbacks configuration of ETHC1000
12.
13.
14.
15.
16.
17.
18.
19.
20.
21.
22.
23.
24.
25.
26.
27.
28.
29.
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 3-35
Functional Description Equipment Controller function
DRAFT
............................................................................................................................................................................................................................................................
Equipment Control 1.
2.
3.
Equipment Controller manages Shelf Controllers.
4.
There is one active Equipment Controller in each node and one active Shelf Controller in
5.
each shelf.
6.
The ESCT2000 (Equipment and Shelf Controller) is the hardware platform designed to 7.
support the Equipment Controller (EC) function and the Shelf Controller (SC) function. 8.
The ESCT2000 board is in charge of the internal management of the node. It dispatches 9.
controls received by management system to the appropriate board, check consistency 10.
between expected configuration and the actual one and finally reports alarms, performance 11.
counters and measurements. 12.
When the board is located in the master shelf, both functionalities are operational and 13.
active. 14.
15.
When the board is located in slave shelves, only the SC functionality is provided. 16.
The 20 Gb hard disk must be plugged only in the ESCT2000 board plugged in the master 17.
shelf. 18.
19.
Note 20.
21.
To work properly, the control function needs to know some mandatory information that
22.
XTID1000 (eXTended ID 1000) is able to provide. There is one eXTended ID unit per
23.
1626 LM shelf in slot 27..
24.
25.
The eXTended ID1000 unit is an hardware extension of the back panel. Its configuration 26.
must be done before the system starts up and cannot be modified without a user manual 27.
intervention. 28.
29.
The following parameters are provided by the XTID1000: 30.
31.
• EQUIPMENT_TYPE (1626 LM)
32.
• SHELF_ID, which locates the shelf in the NE configuration 33.
(For master shelf, SHELF_ID = X0000001) 34.
35.
36.
37.
Equipment Controller function 38.
39.
The EC supports the Q3/TL1 Network Management agent and the VHM (Virtual 40.
Hardware Machine). 41.
It provides the HW resources (physical interfaces) and the SW functionalities (protocol 42.
stack) required for the communication between NE and Management system (OS, craft 43.
terminal, etc.). 44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3 - 36 3AL 75131 AAAA
Functional Description Management buses/interfaces
DRAFT
............................................................................................................................................................................................................................................................
1. The EC function can be split into several domains, corresponding to the main functions
2. performed:
3. • equipment - equipment type, release, address, authorized NMS addresses, rack
4. description
5.
• Fault Management - Alarm Severity Assignment Profiles (ASAP), Alarms correlations
6.
7. • Performance Monitoring - history storage of 15 Minutes and 24hour PM data
8. (provided by SC) in order to provide them to Network Management
9. • Software - software version management, software activation, software download
10. • Support - Filtering, logging and forwarding of events and alarms received by SCs
11.
12. • Routing and Addressing - OSI/IP routing capability configuration
13. • Security - access control.
14. The Database which contains the NE configuration is saved in the pluggable hard disk.
15.
16. SC provides the resources to support the SW functions related to the physical machine
17. control and management and configuration provisioning.
18. In a shelf all the boards are connected to the SC via the SPI or ISPB (for PM collection on
19. ETHC1000 board) bus allowing the SC processor to collect the control information of the
20. boards (e.g.: alarms collection, remote inventory and data EEPROM reading).
21. The SC function can be split into several domains, corresponding to the main tasks
22. • Equipment - Detection of card presence with direct hardware link, Collection of
23. remote inventory, Check that card present in slots are the expected ones, Check
24. firmware version of the boards, Dispatching of provisioning requests received by EC
25. to boards
26.
27. • Performance Monitoring - Collection of one-second primitives used for elaboration of
28. PM counters (15Min and 24 hours) which are then sent to EC, Collection of analog
29. measurements (if any)
30. • Fault Management - Monitoring of faults: local SC faults, boards faults (equipment,
31. communication, transmission), threshold crossing alarms
32. • Software - firmware download (via HW config bus on ETHC1000).
33.
34.
35.
36. Management buses/interfaces
37.
38. F interface: available from the EC function, CT is Q3/TL1 (supported in future release)
39. interface for the connection to a local Craft Terminal. It is a 38.4 kbit/s serial RS232
40. interface with a DB9 connector.
41.
NMS Interface: available from the EC function, NMS is the Q3/TL1 (supported in future
42.
release) interface toward Network Management System (NMS). It is a 10 / 100 Mbps
43.
Ethernet interface (10 Base-T) with RJ45 connectors.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 3-37
DRAFT
............................................................................................................................................................................................................................................................
IS-LINK is inter-shelf link, used to realize the communication between the EC and all the 1.
SCs. It is a 100 Mbps Ethernet bus (10BaseT interface) between EC and SCs located in 2.
separated shelves 3.
In master shelf, front panel IS-LINK port is connected to EC processor (EC data to local 4.
SC are carried over ISSB bus). 5.
In each slave shelf, front panel IS-LINK is connected to SC processor. 6.
7.
ISSB: it is a local serial bus allowing communication between EC and the local SC (future 8.
use). 9.
Push Buttons interface, used to 10.
11.
• test LEDs: pushing this button on ESCT supporting EC functionality lights the LEDs
12.
of all the units of all the shelves of the NE but not on Top Rack Unit. All the possible
13.
colors of a LED are lit on whatever the previous state of the LED when this button is
14.
pressed.
15.
Nothing happens if ESCT only supports SC functionality (since this button is managed
16.
by EC)
17.
• reset ESCT board 18.
• cut off the alarms. 19.
RA (Remote Alarms) interface: it is dedicated to send commands toward the rack to light 20.
up the relevant lamps. 21.
22.
23.
24.
25.
26.
27.
28.
29.
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
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3 - 38 3AL 75131 AAAA
DRAFT
............................................................................................................................................................................................................................................................
1. HK (HouseKeeping) interface: it allows the user to manage some electrical relays and
2. opto-couplers through CT/NMS (1353 NM) in order to remotely command some devices
3. external to the 1626 LM NE.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
21.
22.
23.
24.
25.
26.
27.
28.
29.
30.
31.
32.
33.
34.
Figure 3-16 Controller sub-system
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 3-39
Functional Description Example of control interfaces scheme
DRAFT
............................................................................................................................................................................................................................................................
Example of control interfaces scheme 1.

2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
21.
22.
23.
24.
25.
26.
27.
28.
29.
30.
31.
32.
33.
34.
35.
Figure 3-17 Example of control interfaces scheme 36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3 - 40 3AL 75131 AAAA
Functional Description Functional description
DRAFT
............................................................................................................................................................................................................................................................
1.
2.
Power supply
3.
4. The powering architecture is distributed: two PSUP1000 (Power SUPply unit) cards are in
5. charge of feeding, in 1+1 protection mode, all the other cards hosted in the shelf. Each
6. card is able to provide from the main powering, by means an internal DC/DC converter,
7. the required power supply.
8. The main purposes are:
9. • Supply and distribute -48V/-60V filtered and protected voltage to all the boards
10. housed in each 1626 LM shelf
11.
• Supply and distribute +3.7V and +5.4V protected voltages to SPIDER circuitry in all
12.
the boards
13.
14. • Give alarms on fault battery and voltages loss.
15.
16.
17.
18. Functional description
19.
20. Each Subrack receives powering from two DC supplies compliant with ETSI standard
21. ETS 300 132-2, for nominal -48V or -60V supplies. Each of the two DC supplies is
22. protected at the top of the rack by appropriate circuit breakers prior to being fed to each
23. subrack within the rack.
24. Each of the two supplies (-48V_A and -48V_B) feed one of the two PSUP1000 plugged in
25. each subrack.
26. The PSUP1000 units provide the necessary filtering and surge suppression of the -48V or
27. -60V input DC supply, prior to distributing the power supply to the units within the
28. subrack.
29.
The filtered -48V/-60V supply is fed from each power supply unit to the backplane, the
30.
power rails are then combined using sharing diodes on each card supplied with the -48V/-
31.
60V power supply.
32.
Under normal operating conditions the load required by the unit from the -48V/-60V
33.
supply is shared approximately equally between the two PSUP1000 inputs.
34.
At the -48V/-60V input interface of each unit, appropriate fuses shall be used to protect
35.
the card.
36.
37. The normal input voltage range of the power supply module is either:
38. • - 40,5 V t - 48 V t - 57,0 V
39.
• - 50,0 V t - 60 V t - 72,0 V.
40.
41. A battery return path to each of the two -48V/-60V supplies from the units to the power
42. supplies is provided.
43.
44. On each PSUP1000 unit, a 3.7V (V3A & V3B) power rail and a 5.4V (V5A & V5B)
45. power rail are derived from its filtered -48V/-60V power supply and from the filtered -
46. 48V/-60V of the other PSUP1000. The 3.7V and 5.4V power rails are then distributed to
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 3-41
DRAFT
............................................................................................................................................................................................................................................................
all cards in slots 1 to 49 of the subrack. 1.

The 3.7V power rails (V3A & V3B) are combined (using diodes) in the unit to provide a 2.
single 3.3V power supply, that will be fused within the unit. This is to prevent a fault
3.
condition of this power rail within the unit from causing a fault condition on the backplane
4.
V3A/B power supply rail to the other units. 5.
The same occurs for the 5.4V power rails (V5A & V5B), providing a 5.0V power supply. 6.
Figure 3-18, “1626 LM - equipment power supply scheme” (p. 3-43) shows the equipment 7.
power supply scheme. 8.
9.
Abnormal service range 10.
11.
The 1626 LM equipment operating at -48 V is not damaged if subjected to the following 12.
voltage range: 0 V to -40,5 V and -57 V to -60 V. 13.
When the equipment operates at -60 V, is not damaged if subjected to the following 14.
voltage range: 0 V to -50 V and -72 V to -75 V. 15.
16.
17.
18.
19.
20.
21.
22.
23.
24.
25.
26.
27.
28.
29.
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3 - 42 3AL 75131 AAAA
DRAFT
............................................................................................................................................................................................................................................................
1. Therefore, the equipment accepting either a -48V or -60V power supply input is able to
2. operate within specification over the voltage range of -40.5 to -72.0V and will not suffer
3. any damage when subjected to an input voltage in the range of 0V to -40.5V and -72.0V to
4. -75.0V.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
21.
22.
23.
24.
25.
26.
27.
28.
29.
30.
31.
32.
33. Figure 3-18 1626 LM - equipment power supply scheme
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 3-43
Functional Description Housekeeping
DRAFT
............................................................................................................................................................................................................................................................
Operation & Management Services 1.

2.
3.
4.
Housekeeping 5.
6.
7.
The 1626 LM system is able to interface iwith user's environment and/or another 1626 LM
8.
system to build up maintenance operations by means of the HSKU (House Keeping unit).
9.
Its main purpose is to send and receive data from/to master cards via SPI bus, and from/to
10.
the user or another 1626 LM system throughout protected I/O interface.
11.
The HSKU1000 allows the user to manage some electrical relays and opto-couplers 12.
through the Craft/SH in order to command remotely some devices external to the 1626 13.
LM. The user is thus able to 14.
• be informed of the status of the input opto-couplers 15.
• remotely change the state of the output relays. 16.
17.
Each HSKU1000 board provides 8 output relays and 8 input opto-couplers. 18.
The status of the OUT relays can be managed (Open/Close) through the SW separately for 19.
each relay. The IN opto-couplers status can be raised by the board to the SW separately for 20.
each opto-coupler. 21.
As regards the opto-couplers, the Shelf Controller poll them (IN1 to IN8) regularly, and 22.
then this information is immediately transferred to the Equipment Controller and notified 23.
to the management interface. 24.
25.
26.
27.
28.
Rack Alarm Management 29.
30.
31.
The Rack Alarm Interface Unit (RAIU) monitors the rack alarms to light On or Off the
32.
lamps of the top rack unit.
33.
Each shelf of all the racks (master and secondary shelf) is equipped with one RAIU1000
34.
board which collects information on the alarms raised in the shelf.
35.
This unit exchanges the alarm signals between the ESCT or the Alarm Bus (FANS and
36.
PSUP alarms) and the TRU.
37.
These alarms are analyzed either by the ESCT board or directly by the Alarm card
38.
(RAIU1000). In function of the emergency of these alarms, the ESCT generates signals to
39.
turn on LEDs on the or TRU and so to alert users.
40.
41.
The RAIU of the slave shelf only takes into account:
42.
• the alarms raised by the fan modules or by the power supply units of the shelf via the 43.
ALARM bus 44.
• the information sent by the RAIU board of the below shelf when present. 45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3 - 44 3AL 75131 AAAA
Functional Description Rack Alarm Management
DRAFT
............................................................................................................................................................................................................................................................
1. The RAIU board of the master shelf collects signals:

2. • from the ESCT via the SPI bus
3.
• from the EC via the URG, NURG and UP signals
4.
5. • directly from the fan modules and from the power supply units of the shelf via the
6. ALARM bus
7. • from the RAIU board of the shelf below.
8.
The RAIU board located in master rack is connected to the top rack unit, as shown on
9.
Figure 3-19, “Electrical links between RAIU cards and TRU” (p. 3-47). Inter shelf
10.
communication between RAIU boards is managed via an external cable on the front panel.
11.
12. Main RAIU1000 functionalities:
13. • management of four output alarm signals to be sent to the TRU: CRI_AL, MAJ_AL,
14. MIN_AL and RACK_AL;
15.
• back panel connection to/from the ESCT board via the SPI bus for alarm commands
16.
(CMD_CRI, CMD_MAJ, CMD_MIN, CMD_RACK) or inhibition (INH_CRI,
17.
INH_MAJ, INH_MIN, INH_RACK);
18.
19. • back panel connection from the ESCT board via the URG/NURG/UP wires;
20. • back panel connection from the 3 FAN modules and the 2 PSUP slots via the ALARM
21. bus (1 more wire reserved for future used).
22. • two connectors are located on the front plate of the RAIU1000 with the following
23. target
24.
• DB9 connector has to be connected either with the TRU or another RAIU board (on
25.
RJ11)
26.
27. • RJ11 connector has to be connected with another RAIU board (on DB9).
28. Note that the alarms of the URG/NURG/UP wires and of the ALARM bus (FANS and
29. PSUP) are made available on the SPIDER, so that the SC can read them by the SPI bus
30. and take them into account in its alarm synthesis to raise the appropriate command
31. (CMD_CRI, CMD_MAJ, CMD_MIN, CMD_RACK).
32. It is possible to stop (inhibit) an alarm, sending the appropriated INH data to the Alarm
33. card. So only the related commanded LED is turned off. If another alarm is detected by the
34. ESCT, the appropriated signal can be sent to the Alarm card which could command the
35. linked LED excepted if it was inhibited LED.
36.
37. Alarm management
38.
The back panel wires (URG / NURG / UP and the ALARM bus) are sent to a first logic
39.
sub-unit whose four output signals are connected to an OR logic module, which uses also
40.
as input signals four signals from the SPIDER to determine the status of each one of the
41.
four relays used to command the rack lamps
42.
43. • URG / NURG / ATTD, with TRU using.
44. If the RAIU boards of a rack are linked together, the four signals coming from another
45. RAIU are also taken into account.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 3-45
DRAFT
............................................................................................................................................................................................................................................................
The four alarm signals sent to pilot the relays, are based on the following logics:
1.
• CRI_AL On, if CMD_CRI or URG 2.
3.
• MAJ_AL On, if CMD_MAJ or UP or at least 2 FANs in failure
4.
• MIN_AL On, if CMD_MIN or NURG or 1 FAN in failure 5.
• RACK_AL On, if CMD_RACK or PRM_AL or SEC_AL (or FAN_AL, not managed 6.
in 1626 LM). 7.
8.
Generally speaking, a critical, major or urgent alarm is traffic affecting.
9.
10.
11.
Table 3-10 Front Panel LEDs severity meaning
12.
13.
14.
Severity LED color Meaning 15.
CRITICAL URGENT RED Critical/urgent alarm: immediate corrective action is 16.
required 17.
18.
MAJOR Major/urgent alarm: urgent corrective action is required
19.
MINOR NOT RED Minor/not urgent alarm: corrective action should be 20.
URGENT planned in order to prevent more serious fault. 21.
ATTENDED WARNING YELLOW Rack Alarm: Indication of an existing fault. 22.
Further diagnosis should be made. 23.
24.
Interconnection with TRU 25.
26.
In current release, the 1626 LM is used with
27.
• the Top Rack Unit (TRU), in ETSI market 28.
The RAIU board interfaces the TRU. 29.
30.
Three types of cables are defined to be used with the RAIU:
31.
• to interconnect with another RAIU, a DB9 - RJ11 cable is needed 32.
• to interconnect with the TRU, a DB9 - DB25 cable is needed. 33.
34.
Interworking with the TRU
35.
The RAIU boards can be chained as described previously, or can be directly connected to 36.
the TRU which has four DB25 connectors, as shown in Figure 3-19, “Electrical links 37.
between RAIU cards and TRU” (p. 3-47). 38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3 - 46 3AL 75131 AAAA
DRAFT
............................................................................................................................................................................................................................................................
1. The RAIU board manages the three leds of a TRU: URG (urgent) alarm, NURG (non
2. urgent) alarm and ATTD (attended) alarm.
3. N.B. The TRU does not send information to the RAIU board.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
21.
22.
23.
24.
25.
26.
27.
28.
29.
30.
31.
32.
33.
34.
35.
36.
Figure 3-19 Electrical links between RAIU cards and TRU
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 3-47
Functional Description Ventilation
DRAFT
............................................................................................................................................................................................................................................................
Ventilation 1.
2.
Fans are located at the bottom of each shelf (slot 41) of a rack with in addition an air filter 3.
just below, as shown in Figure 3-20, “Fan shelf description and Rack partitioning” 4.
(p. 3-48). 5.
The FANS are monitored via the SPI bus and some direct wires are sent to the HSKU and 6.
the RAIU boards to monitor a possible failure of the cooling system. 7.
The maximum power dissipation per shelf is 640 W. 8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
21.
22.
23.
24.
25.
Figure 3-20 Fan shelf description and Rack partitioning 26.
The main target of the FANS1000 drawer is to avoid overheating and possible board 27.
damages. 28.
For each FAN module, some HW parameters are monitored to raise board alarms such as 29.
the 48V power supply failure, the fuse or the rotation speed. 30.
They are then collected by the Alarms Logic to raise an HW failure of the FANS1000 unit 31.
to the SPIDER and also an individual alarm for each FAN module on a dedicated back 32.
panel wire (BUS_AL#i), used by the RAIU or the HSKU to monitor a failure of the 33.
cooling system. 34.
35.
The TEMP_W_x_y (where x_y can be 1_7 or 8_13 or 14_20) represents the external 36.
control of each FAN module rotation speed, by the boards associated to this module. In 37.
fact, the boards of a group share the same back panel wire to control the rotation speed of 38.
the corresponding FAN module: if the temperature of one of the boards exceeds a given 39.
threshold, the board sends a command to the FAN module to increase its rotation speed. 40.
41.
POWER SUPPLY. Two +48V power supplies are generated by DC/DC converters from 2 42.
external batteries, providing supply redundancy. 43.
The 2 batteries from back-panel can vary from 36V to 72V. On the board the two 48V 44.
voltages (48V_A, 48V_B) are coupled together by a diode and the battery with the 45.
maximum voltage is selected. 46.
DRAFT
............................................................................................................................................................................................................................................................
3 - 48 3AL 75131 AAAA
Functional Description Remote Inventory
DRAFT
............................................................................................................................................................................................................................................................
1. The card includes fuses in the 48V supply.

2. The 48V voltages are then filtered on the Power Supply part of the board and then
3. forwarded to DC/DC converters to provide 2 regulated voltages 48V_1 and 48V_2. Two
4. voltages are generated for security.
5. The output of each DC/DC converter is connected to a comparator on the Monitoring
6. Block which generates an alarm (sent to the SPIDER) if the voltage is under 43V.
7. All components on the card are powered from the 48V supply, with the exception of the
8. SPIDER device which is supplied via the external backplane 3.3V supply.
9.
10.
11.
12.
13. Remote Inventory
14.
15. See Figure 3-21, “Remote Inventory sub-system” (p. 3-50). The Remote Inventory
16. function permits the operator to retrieve information about any card present on the
17. equipment.
18.
19. The available information is: construction date, code number, maker name, board
20. identification, etc.
21. The Remote Inventory information is stored within a dedicated EEPROM present on all
22. boards.
23.
24.
25.
26.
27.
28.
29.
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 3-49
Functional Description Remote Inventory
DRAFT
............................................................................................................................................................................................................................................................
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
21.
22.
23.
24.
25.
26.
27.
28.
29.
Figure 3-21 Remote Inventory sub-system 30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3 - 50 3AL 75131 AAAA
DRAFT
1. 1626 LM system characteristics
2.
3. Main system characteristics
4.
5.
6. General
7.
8. Optical bit rate, client side 9.9532 Gbps (UNI) - TRBD1111, TRBD1121, TRBD1191
9. (B&W) 10.709 Gbps (NNI) - TRBD1111, TRBD1121, TRBD1191
10. (future release)
11. 10.3125 Gbps (UNI) - TRBD1131, TRBD1191
12. 39.813 Gbps (UNI) - TRBD4312
13.
2.488 Gbps (UNI) - TRBC1111
14.
15. 2.488 Gbps (STM-16) - 2xGE_FC
16. 2.666 Gbps (NNI) - TRBC1111 (future release)
17. 1.250 Gbps (GbE) - 2xGE_FC, ETHC1000
18. 1.0625 Gbps (FC) - 2xGE_FC
19.
20. Optical bit rate, WDM side 10.709 Gbps for TRBD1111, TRBD1121, TRBD1191,
TRBC1111
21.
22. 11.095728 Gbps for TRBD1131 and TRBD1191
23. 43.018 Gbps for TRBD4312
24. 2.488 Gbps for 2xGE_FC
25.
Type of optical fiber G.652, G.655, G.652 for tight links
26.
27. Central frequencies and see Table 3-1, “Frequencies plan for Metropolitan applications
28. wavelengths (50 and 100GHz mixed grid)” (p. 3-16) for Metropolitan
29. applications
30. see Table 3-2, “Nominal frequencies allocation plan in C-Band
31. for long haul applications (50GHz grid)” (p. 3-23) for Long Haul
32. applications (50 GHz grid)
33. see Table 3-3, “Frequencies allocation plan in C-Band for
34. Metropolitan applications (100GHz grid)” (p. 3-33) for Regional
35. applications (100 GHz grid)
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 4 -1
Technical specifications 1626 LM system characteristics
DRAFT
............................................................................................................................................................................................................................................................
Application types Line Terminal (LT), Line Repeater (LR), Regenerative Back-to- 1.
Back Terminal (BT), T-OADM, R-OADM, T/R-OADM 2.
3.
Interfaces types Electrical interfaces: Analog audio interf. G.712, 64Kbps G.703 4.
(EOW), 2Mbps G.703 (user channels), RS-232 at 38.4 Kbps (CT
5.
interface), USB 1.1 (CT interface, for future release), Ethernet
6.
10Base-T at 100 Mbps (NMS interface), Ethernet 10Base-T at
100 Mbps (IS-LINK interface), RS-232 at 38.4 Kbps (debugger
7.
interface) 8.
9.
Optical interfaces: all the client and WDM interfaces above
10.
listed
11.
System dimensions 12.
Maximum number of racks in 3 13.
Line 14.
Terminal configuration 15.
16.
Maximum number of racks in 6
17.
OADM/Back-to-Back
configuration
18.
19.
Add-Drop features 20.
Connectivity 0-100% add-drop capability 21.
22.
23.
24.
25.
26.
27.
28.
29.
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
4-2 3AL 75131 AAAA
DRAFT
............................................................................................................................................................................................................................................................
1. Protections
2.
3. Network protections Optical SNCP, performed via OCPU2104
4. Equipment optical protections 1+1TRBD and TRBC, performed via OCPU2104
5.
Powering protections 1+1Power Supply Card
6.
7. Management interfaces
8. Functions provided Q3 interf with PC (CT/Remote CT), 1353NM and 1354RM
9. NMS (on terminal)
10.
Station alarms
11.
12. Equipment Alarm status (indicated by the front cover LEDs)
13. Visual indications for card fail.
14. Management interfaces Q3 to connect a Local or Remote Equipment Craft Terminal (RS
15. supported: 232 interface at 38.4Kbps and, for future release, USB1.1)
16.
Q3 to connect the OS 1353NM (100 Mbps 10Base-T Ethernet
17. Interface)
18.
19.
20.
21. Local interface: Craft Interface (PC) RS232 SUB-D 9pin, PC compatible at 38.4
22. Kbps. Mini USB 1.1 for future release
23. Remote interface: Craft Interface (PC) RS232 SUB-D 9pin, PC compatible at 38.4
24. Kbps and mini USB 1.1 for future release. It
25. handles up to 32 NEs via DCC
26. Remote interface: Transmission ITU-T G.773 10Base-T
27. Management Network
28. (TMN) interface
29.
Protocol Q3
30.
Stack/Information
31.
Model messages
32.
33.
34.
35. Operation processes (management interfaces functions)
36. Configuration and Equipment, Units, Add-Drop, Alarms status, Maintenance memory
37. provisioning for all the equipment events
38.
Software download It is made locally as well as remotely on non volatile memories
39.
without traffic interruption
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 4-3
DRAFT
............................................................................................................................................................................................................................................................
Performance monitoring TRBD/C client side, 2xGE_FC and ETHC, line side: based on B1 1.
and Threshold Crossing Alarm based on B1 errors count, ingress and 2.
egress (SDH/SONET), according to G.806, G.8201, G.709. 3.
TRBD/C, WDM side: based on FEC corrected/uncorrected errors.
4.
2xGE_FC and ETHC, client side: Layer 1 Ethernet PM, based on the 5.
8B/10B coding structure of the Ethernet frame, according to Tables 6.
36-1 and 36-2 of the 802.3 standard (2005 ed. section 3). 7.
8.
Remote Inventory At rack, subrack and board level
9.
Unit and equipment Through Remote Inventory: Company id, Unit type, Unit part 10.
acknowledgement number, Software part number, CLEI code, Manufacturing Plant, 11.
Date Identifier, Date of construction... For details, refer to the 12.
operator's handbook 13.
Security Password, operator profile, back up for programs and data 14.
15.
16.
17.
18.
19.
20.
21.
22.
23.
24.
25.
26.
27.
28.
29.
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
4-4 3AL 75131 AAAA
DRAFT
............................................................................................................................................................................................................................................................
1. Housekeeping (HSKU)
2.
3. Number of housekeeping 8 inputs and 8 outputs
4. accesses
5. Connector SUB-D 25 pins
6.
Output HSKU signals By electronic relay contacts connected to the common out
7.
8. Max. guaranteed current 100 mA
9. through IN relay with closed
10. condition
11. Voltage between OUTn and <2.5 V
12. common OUT with closed
13. condition
14.
Resistance of the closed relay <300 mOhms
15. with closed condition
16.
17. Voltage between OUT and <72 V
18. common with open condition
19. Input HSKU signals By opto-couplers connected to the common GND (GNDP)
20.
maximum forward current 30 mA
21.
22. maximum voltage applied 3 V (without resistor)
23. between INn and GNDP
24. N.B. If the user wants to connect -48V power supply, he has to put a resistor of a value higher than
25. 1500
26. Ohms, 1.5 W to have a current equal to 30mA.
27.
Optical Supervisory Channel (OSC) characteristics
28.
29. See “Optical Supervisory
30. Channel Unit (OSCU101x)
31. optical characteristics”
32. (p. 4-52).
33. Clock characteristics
34.
External clock is not required
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 4-5
DRAFT
............................................................................................................................................................................................................................................................
Applicable standards 1.
2.
ITU-T G.709 Interfaces for the Optical Transport Network (OTN) 3.
ITU-T G.798 Characteristics of optical transport network hierarchy equipment 4.
functional blocks 5.
6.
ITU-T G.691 Optical interfaces for single channel STM-64, STM-256 systems and
other SDH systems with optical amplifiers
7.
8.
ITU-T G.692 Optical interfaces for multichannel systems with optical amplifiers 9.
ITU-T G.693 Optical interfaces for intra-office systems 10.
11.
ITU-T G.694.1 Spectral grids for WDM applications: DWDM wavelength grid
12.
ITU-T G.872 Architecture of optical transport networks 13.
ITU-T G.957 Optical interfaces for equipment and systems relating to the
14.
synchronous digital hierarchy 15.
16.
ITU-T G.959.1 Optical transport network physical layer interfaces 17.
G.7710 Common equipment management function requirements 18.
19.
G874.1 Optical Transport Network (OTN) protocol-neutral management
20.
information model for the network element view
21.
ITU-T G.664 Optical safety procedures and requirements for optical transport 22.
systems 23.
ITU-T G.825 The control of jitter and wander within digital networks which are 24.
based on the synchronous digital hierarchy (SDH) 25.
26.
ITU-T G.8251 The control of jitter and wander within the optical transport network
27.
(OTN)
28.
IEEE 802.3 Ethernet standard 29.
IEEE. 802.1Q (Annex D) VLAN bridge 30.
31.
G7041/Y13013 GFP 32.
IEC60825-1 and IEC60825-2 Optical safety 33.
34.
The nominal frequencies allocation plan in Extended C-Band is shown in 35.
• Table 3-1, “Frequencies plan for Metropolitan applications (50 and 100GHz mixed 36.
grid)” (p. 3-16) for Metropolitan applications (50 and 100GHz mixed grid) 37.
• Table 3-2, “Nominal frequencies allocation plan in C-Band for long haul applications 38.
(50GHz grid)” (p. 3-23) for Long Haul applications on a 50 GHz grid 39.
40.
• Table 3-3, “Frequencies allocation plan in C-Band for Metropolitan applications
41.
(100GHz grid)” (p. 3-33) for Regional applications on a 100 GHz grid
42.
The loading plan for Long Haul applications is shown in “Loading plan for 50 GHz grid 43.
mux/demux subsystem” (p. 3-22). 44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
4-6 3AL 75131 AAAA
DRAFT
............................................................................................................................................................................................................................................................
1. The loading plan for Regional applications is shown in “Loading plan for 100 GHz grid
2. mux/demux subsystem” (p. 3-32).
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
21.
22.
23.
24.
25.
26.
27.
28.
29.
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 4-7
Technical specifications Safety requirements and mechanism
DRAFT
............................................................................................................................................................................................................................................................
Safety requirements and mechanism 1.

2.
Electrical safety 3.
4.
5.
Safety status of the connections with TNV (Telecommunication Network Voltage) for Remote alarms, 6.
other equipment Housekeeping, Rack lamps (RM) and tributary connections if 7.
K20 protected. 8.
SELV (Safety Extra Low Voltage) for all the other.
9.
10.
11.
Electrical Safety compliance with standardized Norms
12.
Compliancy to Safety Norms is declared in that the equipment satisfies standardized 13.
Norms: 14.
• IEC 60950-1 ed. 2001 15.
• EN 60950-1 ed. 2001 16.
17.
Electrical Safety Labelling 18.
19.
The labels reproduced in “Electrical Safety: Labelling” (p. A-5) are affixed during factory
20.
settings.
21.
22.
Electrical Safety instructions
23.
The safety instructions for proper assembly, maintenance and safe use including clear 24.
warning concerning precautions to avoid possible exposure to hazardous voltages, are 25.
reported in “Safety Rules” (p. A-3) and more specifically in “Electrical safety: general 26.
rules” (p. A-5). 27.
28.
29.
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
4-8 3AL 75131 AAAA
DRAFT
............................................................................................................................................................................................................................................................
1. Optical safety
2.
3. Optical Safety compliance with European Norms
4. Compliancy to Optical Safety Norms is declared in that the equipment satisfies
5. standardized Norms:
6.
• EN 60825-1 ed.1994 + A11 ed.1996 + A2 ed.2001
7.
8. • IEC 60825-1 ed.1993 + A2 ed. 2001 (1999)
9. • EN 60825-2 ed.2000
10. • IEC 60825-2 ed.2000
11.
12. Hazard Level classification and standards
13.
The classification refers to the IEC 60825 Standard (with amendments 1 & 2).
14.
This recommendation defines 4 HAZARD LEVELs for optical fiber applications in third
15.
window (1500 - 1800 nm):
16.
17. • HAZARD LEVEL 1, for optical power below +10mW (10dBm)
18. • HAZARD LEVEL 1M, for optical power in [10mW; 136mW] (10dBm to 21,3dBm)
19. • HAZARD LEVEL 3B, for optical power in [136mW; 500mW] (21,3dBm to 27dBm)
20.
• HAZARD LEVEL 4, for optical power higher than 500mW (>27dBm).
21.
22. G.664 standard defines the optical safety mechanisms:
23. • Automatic Laser Shutdown (ALS): Procedure to automatically shutdown the output
24. power of laser transmitters and to avoid exposure to hazardous levels
25.
• Automatic Power ShutDown (APSD): Procedure to automatically shutdown the output
26.
power of optical amplifiers to avoid exposure to hazardous levels.
27.
28. This recommendation defines also the following areas for laser application installation
29. • Unrestricted Area (location where access to the transmission equipment is accessible
30. to the public). APSD mandatory if accessible optical power could exceed hazard level
31. 1 AEL (Accessible Emission Limit)
32.
• Restricted Area (location that is normally inaccessible by the general public but that
33.
is accessible to personnel that may not have laser safety training).
34.
APSD mandatory if accessible optical power could exceed hazard level 1M AEL
35.
(Accessible Emission Limit) or if optical power can exceed class1 from connector
36.
37. • Controlled Area (location that is inaccessible except to authorized personnel with
38. appropriate laser safety training).
39. APSD mandatory if accessible optical power could exceed hazard level 1M from
40. connector and hazard level 3B AEL (Accessible Emission Limit) from a failed fiber.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 4-9
DRAFT
............................................................................................................................................................................................................................................................
In any case of failure, the overall FIT rate of all the mechanisms inside the system that are 1.
involved in the APSD procedure which is triggered by this failure, does not exceed 500 2.
FITs. 3.
In normal operating conditions (no failure), the system matches HAZARD LEVEL 1M 4.
criteria. 5.
During the restart mechanism, the system matches HAZARD LEVEL 1M criteria. 6.
7.
So according to IEC 60825 recommendation, the 1626 LM equipment is classified as 8.
HAZARD LEVEL 1M 9.
10.
The OSC alone is classified as
11.
HAZARD LEVEL 1 12.
The following figures give the AELs of class 1 and class 1M. In other words, it gives the 13.
maximum power that can be reached to remain in Class 1 or in Class 1M ; the integration 14.
duration is 100 sec. 15.
16.
17.
18.
19.
20.
21.
22.
23.
24.
25.
26.
27.
28.
29.
30.
31.
32.
33.
34.
35.
36.
Figure 4-1 AEL for Class 1 between 1500 nm and 1800 nm 37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
4 - 10 3AL 75131 AAAA
DRAFT
............................................................................................................................................................................................................................................................
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
21. Figure 4-2 AEL for Class 1M between 1500 nm and 1800 nm
22.
23.
24. Table 4-1 AEL at 980 and 1480 nm for Hazard Levels 1 and 1M
25.
26.
27. Hazard Level1 Accessible Hazard Level1M Accessible Emission
28. Wavelength Emission Limit Limit
29.
30. 980 nm 1.42 mW or 1.52 dBm 2.66 mW or 4.25 dBm
31. 1480 nm 10 mW or 10 dBm 115 mW or 20.6 dBm
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 4-11
DRAFT
............................................................................................................................................................................................................................................................
Optical safety labelling 1.

The labelling of the optical sources is compliant with the requirements of the IEC 60825 2.
Standard. 3.
4.
The labels reported below are put during factory settings. The labels are affixed on all 5.
front covers that protect optical connectors located on the front side plate of all the units 6.
involved in optical transmission. 7.
In the following, some examples of labelling are reported. 8.
9.
The optical interfaces which have HAZARD LEVEL 1, carry the following explanatory
10.
label
11.
12.
13.
14.
15.
16.
17.
18.
The following label indicates the presence of a LASER beam. 19.
20.
If the laser is a Hazard Level 1 product, this label is not compulsory.
21.
If the laser is a Hazard Level 1M product or upper, this label is compulsory. 22.
23.
24.
25.
26.
27.
28.
29.
30.
31.
32.
Example of EXPLANATORY label. 33.
The optical interfaces which have HAZARD LEVEL 1M according to IEC 60825-1 34.
rd
(2001), IEC 60825-2 (2000) and ITU-T Rec. G.664 standards and operate at 3 window, 35.
carry the following explanatory label 36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
4 - 12 3AL 75131 AAAA
DRAFT
............................................................................................................................................................................................................................................................
1. Aperture and fiber connectors

2. The locations of apertures and fibre connectors are reported on topographical drawings of
3. units front view and access cards front view in paragraph “Units front view” (p. 2-49).
4.
5. Engineering design features
6.
In normal operating conditions, unless intentional handling, the laser radiation is never
7.
accessible.
8.
9. The laser beam is launched in optical fibre through an appropriate connector that totally
10. shuts up the laser radiation. Moreover a plastic cover is fitted upon optical connectors by
11. means of screws.
12.
13. Optical Safety instructions
14. The safety instructions for proper assembly, maintenance and safe use including clear
15. warning concerning precautions to avoid possible exposure to hazardous laser radiation,
16. are reported on “Safety Rules” (p. A-3) and more specifically in “Harmful Optical
17. Signals” (p. A-6).
18.
19. APSD procedure
20.
The APSD complies with IEC 60825 1 and 2 and ITU-T G.664 recommendations.
21.
22.
Additional shutdown procedure
23.
24. A specific CT (USM) command allows to shutdown the LOFA1 gain blocks.
25.
26.
27.
28.
29.
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 4-13
DRAFT
............................................................................................................................................................................................................................................................
Generic APSD rules 1.

The purpose of the following rules is to comply with the requirements of eye safety and to 2.
protect equipment against overshooting. 3.
4.
The proposed implementation complies with safety standards subject to the 5.
Terminal if housed in a Restricted Area 6.
7.
8.
APSD example: line failure between two LRs with unidirectional amplifiers 9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
21.
22.
23.
24.
25.
26.
Figure 4-3 Example of line failure between two LRs with unidirectional amplifiers 27.
Let us consider the right NE (the same actions occur in the left NE as soon as it detects the 28.
LOS consecutive to the APSD procedure in the right NE) 29.
30.
1. The top right amplifier detects a LOS
31.
2. It shuts down its first stage (overshoots protection) 32.
3. The previous amplifier exists but is located in an other NE so the top right amplifier 33.
has to shut down the other amplifier of the right NE: the top right amplifier writes a SD 34.
command on its APSD back panel link. 35.
4. As software knows how amplifiers are connected, it has configured (during installation 36.
phase) the down right amplifier to read the APSD back panel link written by the top 37.
right amplifier. As a consequence, the down right amplifier receives the SD command 38.
sent by the top right amplifier. 39.
5. The down right amplifier shuts down. 40.
6. The low amplifier of the left NE detects a LOS, the same procedure as the one already 41.
described for the right NE applies. 42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
4 - 14 3AL 75131 AAAA
DRAFT
............................................................................................................................................................................................................................................................
1. APSD example: line failure between a LR and a LT with unidirectional amplifiers

2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16. Figure 4-4 Example of line failure between a LR and a LT with unidirectional
17. amplifiers
18.
The APSD procedure is the same of the one described in previous section “APSD
19.
example: line failure between two LRs with unidirectional amplifiers” (p. 4-14).
20.
21.
APSD example: line failure between two LTs with bidirectional amplifiers
22.
23.
24.
25.
26.
27.
28.
29.
30.
31.
32.
33.
34.
35.
36. Figure 4-5 Example of line failure between a LR and a LT with bidirectional
37. amplifiers
38. Let us consider the right NE (the same actions occur in the left NE as soon as it detects the
39. LOS consecutive to the APSD procedure in the right NE)
40.
7. The top amplifier (Stage 1) detects a LOS
41.
42. 8. The previous amplifier exists but is located in an other NE so the Stage 1 amplifier has
43. to shut down the Stage 2 of the right NE: the Stage 1 amplifier writes a SD command
on its APSD back panel link.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 4-15
DRAFT
............................................................................................................................................................................................................................................................
9. As software knows how amplifiers are connected, it has configured (during installation 1.
phase) the down amplifier (Stage 2) to read the APSD back panel link written by the 2.
top amplifier (Stage 1). As a consequence, the down amplifier receives the SD 3.
command sent by the top amplifier. 4.
10. The down amplifier shuts down. 5.
11. The low amplifier (Stage 1) of the left NE detects a LOS, the same procedure as the 6.
one already described for the right NE applies. 7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
21.
22.
23.
24.
25.
26.
27.
28.
29.
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
4 - 16 3AL 75131 AAAA
Technical specifications Boards interfaces characteristics
DRAFT
............................................................................................................................................................................................................................................................
1. Boards interfaces characteristics

2.
3. TDMX1180 optical characteristics
4.
5.
6. Optical Characteristics of the TDMX1180 Unit
7.
8. Common Specifications
9. 96 channels, 50 GHz grid in C+ Band
10.
One input port
11.
12. Up to 8 output port with one single tunable channel per output port
13. Fiber Type Single-Mode (SMF)
14.
15. Connector Type MU/SPC
16. Return Loss 45 dB (40 dB Min.)
17.
18. Channel Parameters Input Port to Output Port Blocked Channel
19. [email protected] dB +/- 12.5 GHz +/- 12.5 GHz
20. [email protected] dB +/- 15.0 GHz +/- 15.0 GHz
21.
22. Insertion Loss at Minimum 6.7 dB (7.0 dB Max.) -
23. Attenuation
24. Attenuation Accuracy +/- 0.50 dB -
25.
Attenuation Stability over 24 hrs +/- 0.30 dB -
26.
27. Riple 0.20 dB -
28. PDL 0.35 dB -
29.
30. Rejection 40.0 dB -
31. Extinction Ratio - 40 dB
32.
Channel Transition 3 sec. Max. response time 3 sec. Max. response time
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 4-17
DRAFT
............................................................................................................................................................................................................................................................
WMAN3174 Optical Characteristics 1.

2.
3.
Optical Characteristics of the WMAN3174 Unit 4.
Common Specifications 5.
6.
96 channels, 50 GHz grid in C+ Band 7.
Up to 3 Express ports 8.
9.
Up to 4 Add ports
10.
Fiber Type Single-Mode (SMF) 11.
Connector Type MU/SPC
12.
13.
Return Loss 45 dB (40 dB Min.) 14.
Channel Parameters Express Channels Add Channels Blocked Channels 15.
16.
[email protected] dB +/- 12.5 GHz for 50 GHz channels 17.
18.
[email protected] dB +/- 15 GHz for 50 GHz channels 19.
20.
Insertion Loss at Minimum 7.7 dB 7.1 dB -
21.
Attenuation (8.1 dB Max) (7.5 db Max.) 22.
23.
Attenuation Accuracy +/- 0.5 dB +/- 0.5 dB - 24.
Attenuation Stability over 24 hrs +/- 0.3 dB +/- 0.3 dB - 25.
26.
Riple 0.20 dB 0.20 dB -
27.
PDL 0.35 dB 0.35 dB - 28.
Rejection 40.0 dB 40.0 dB - 29.
30.
Extinction Ratio - - 40.0 dB 31.
Channel Transition 3 sec Max. response time 32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
4 - 18 3AL 75131 AAAA
DRAFT
............................................................................................................................................................................................................................................................
1. Tributaries optical characteristics

2.
3. TRibutary Direct Transponder TRBD4312
4.
5.
6. Optical Characteristics of the Client / B&W Interface of the TRBD4312 Unit
7. Common Specification of the Client / B&W Interfaces
8.
9. Client / B&W Interface Bit Rate 39.813 Gbps - UNI
10. Client / B&W STM-256, OC-768 and other 39.813 Gbps signals
11.
User Interface Standards ITU–T G.693 ; VSR2000-3R2 ; VSR2000-3R3 ; VSR2000-
12. 3R5
13.
14. Wavelength Range Compliant with User Interface standards
15. Fiber Type Single-Mode (SMF)
16.
Connector Type MU/LC/SPC
17.
18. Client / B&W Interface. - Transmitter Specification
19. Wavelength Peak 0 < Output Power < 3 dBm (EOL)
20.
21. Spectral Bandwidth (-3 dB) Not specified
22. Spectral Bandwidth (-20 dB) 1 nm
23.
Side Mode Suppression Ratio 30 dB Min.
24.
(SMSR)
25.
26. Client / B&W Interface - Receiver Specification
27. Min. Sensitivity @ BER = 10-12 -8 dBm (BOL)
28.
29. Min. Overload @ BER = 10-12 +4 dBm (BOL)
30. Signal Clock Deviation without +/- 100 ppm
31. Errors
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 4-19
DRAFT
............................................................................................................................................................................................................................................................
1.
2.
Optical Characteristics of the WDM Interface of the TRBD4312 Unit
3.
Common Specification of the WDM Interfaces 4.
Wavelength Specification ITU-T G.694-1, 50 GHz grid
5.
6.
Modulation Format PSBT 7.
Modulator Type LiNb03 Mach-Zehnder 8.
9.
Wavelength Frequency Range 191.15 THz to 195.9 THz, 50 GHz grid
10.
Wavelength Tunability Over the whole Extended C Band 11.
Wavelength Stability +/- 2.5 GHz (EOL) / (Power and Frequency)
12.
13.
WDM Interface Bit Rate 43.018 Gbps 14.
Fiber Type SMF 15.
16.
Connector Type MU/SPC
17.
WDM Interface. - Transmitter Specification 18.
Wavelength Peak Average Output Power < -2 dBm (EOL after VOA)
19.
20.
Spectral Bandwidth (-3 dB) 22 GHz Max. 21.
Spectral Bandwidth (-20 dB) Not specified 22.
23.
Side Mode Suppression Ratio 40 dB Min.
24.
(SMSR)
25.
WDM Interface - Receiver Specification 26.
Input Power -17 dBm < Input Power < 5 dBm 27.
28.
29.
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
4 - 20 3AL 75131 AAAA
DRAFT
............................................................................................................................................................................................................................................................
1. TRiButary Direct transponders TRBD11x1 characteristics (x=1, 2, 3)

2.
3.
4. Optical characteristics of the Client/B&W interface of the TRBD11x1 units (x=1, 2, 3)
5. Common specification of the Client optical interfaces
6.
7. Client (B&W) interface bit rate 9.9532 Gbps ± 20 ppm - UNI
8. (IN/OUT) 10.709 Gbps ± 20 ppm - NNI
9. 10.3125 Gbps ± 100 ppm - UNI (10 GBE LAN)
10.
Client signals (UNI) 10 GB Ethernet LAN for TRBD1131
11.
12. STM-64 (SDH), OC-192 (SONET), 10 GB Ethernet WAN,
13. other 9.9532 Gbps signals (e.g. PRBS) for the other TRBDs
14. Wavelength range 1290 -> 1330 nm for TRBD1111
15. 1530 -> 1568 nm for TRBD1121
16.
1260 -> 1355 nm for TRBD1131
17.
18. User interface type ITU–T G.691 I-64.1; ITU–T G.693 VSR 2000 for
19. TRBD1111
20. ITU–T G.691 S-64.2b for TRBD1121
21. IEE 802.3 10GBASE-LR for TRBD1131
22.
23. Fiber type Single-mode (SMF)
24. Connector type MU/SPC
25.
B&W interf. - Transmitter I-64.1 S-64.2b 10GBASE-LR
26. specification (TRBD1111) (TRBD1121) (TRBD1131)
27.
28. Mean output power -6 dBm -> -1 dBm -1 dBm -> +2 +0.5dBm
29. dBm
30. Minimum extinction ratio min: 6 dB min.: 8.2 dB min: 3.5 dB
31.
Maximum -20dBm width 1 nm - -
32.
33. Side mode suppression ratio - - 30 dB
34. B&W interface - Receiver
35. specification I-64.1 S-64.2b 10GBASE-LR
36.
Sensitivity @ BER = 10-12 min: -11 dBm min: -14 dBm -
37.
38. Sensitivity under stressed conditions - - min: -10.3 dBm
39. Overload @ BER = 10-12 min: -1 dBm min: -1 dBm + 0.5 dB
40.
41. Dispersion accommodation max: 6.6 ps/nm max: 800 ps/nm -
42. Receiver reflectance max: - 27 dB max: - 27 dB max: - 12 dB
43.
Supported optical path penalty max: 1 dB max: 2 dB -
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 4-21
DRAFT
............................................................................................................................................................................................................................................................
1.
2.
Optical characteristics of the WDM interface of the TRBD11x1 units (x=1, 2, 3) 3.
WDM interface - Common specification 4.
5.
Wavelength specification ITU-T G.694.1, 50 GHz channel spacing
6.
Modulation format NRZ 7.
Wavelength tunability over the whole extended C-band for all TRBDs 8.
9.
Wavelength range 1530,33 nm -> 1568,36 nm 10.
Frequency range 195,900 THz -> 191,150 THz (± 1.5 GHz) 11.
12.
WDM interface bit rate (IN/OUT) 11.095728 Gbps ± 20 ppm for TRBD1131
13.
10.709225 Gbps ± 20 ppm for the other 14.
TRBDs
15.
Fiber type Single-mode (SMF) 16.
Connector type MU/SPC
17.
18.
WDM interface - Transmitter specification TRBD1111, TRBD1121, TRBD1131 19.
Output power -24 dBm -> +1.0 dBm 20.
21.
Minimum extinction ratio 13 dB
22.
Output power step, over the above specified 0.5 dB 23.
range 24.
Output power setting accuracy -0.25dB -> +0.25 dB 25.
26.
Output power stability over life and temperature -0.5dB -> +0.5dB 27.
Output power when the frequency is not locked max -42 dBm 28.
or the board is not in service 29.
30.
WDM interface - Receiver specification TRBD1111, TRBD1121, TRBD1131
31.
Input optical power -21.2 dBm -> +2.0 dBm 32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
4 - 22 3AL 75131 AAAA
DRAFT
............................................................................................................................................................................................................................................................
1. TRiButary Direct transponders TRBD1191 characteristics

2.
3.
4. Optical characteristics of the Client/B&W interface of the TRBD1191 unit
5. Fiber type 9/125 μm Single-mode (SMF)
6.
50/125 μm Multi-mode (MMF)
7.
8. 62.5/125 μm Multi-mode (MMF)
9. Connector type LC/PC on XFP module; the client interface is an XFP
10. module
11.
Bit rate, client side (according to the 9.9532 Gbps ±20ppm - UNI: STM-64/OC-192/10GBE
12.
B&W XFP module plugged on user WAN
13. side)
14. 10.709225 Gbps ±20ppm - NNI
15. 10.3125 Gbps ± 100ppm - UNI: 10 GBE LAN
16. User interface type (according to the ITU–T G.691 I-64.1; ITU–T G.693 VSR 2000
17. B&W XFP module plugged on user ITU–T G.691 S-64.2b
18. side)
19. ITU–T G.959.1 L-64.2
20. IEE 802.3 10GBASE-SR, 10GBASE-SW
21. IEE 802.3 10GBASE-LR, 10GBASE-LW
22. IEE 802.3 10GBASE-ER, 10GBASE-EW
23.
24. Wavelength range 1st window for 10GBASE-S
25. 2nd window for I-64.1 and 10GBASE-L
26. 3rd window for S-64.2b, P1L1-2D2 (L-64.2), 10GBASE-
27. E
28. Refer to “B&W XFP modules optical characteristics”
29. (p. 4-32) for XFP details
30.
Other user interface characteristics Refer to “B&W XFP modules optical characteristics”
31.
(p. 4-32).
32.
33. Optical characteristics of the WDM interface of the TRBD1191 unit
34. The same of the other TRBDs, refer to “TRiButary Direct transponders TRBD11x1 characteristics
35. (x=1, 2, 3)” (p. 4-21).
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 4-23
DRAFT
............................................................................................................................................................................................................................................................
TRiButary Concentrator (TRBC1111) characteristics 1.

2.
3.
Optical characteristics of the Client/B&W interfaces of the TRBC1111 unit 4.
Common specification of the Client optical interfaces 5.
6.
Client (B&W) interface bit rate (IN/OUT), 2.488 Gbps ± 20 ppm - UNI 7.
on SFP module 2.666 Gbps ± 20 ppm - NNI (OTU-1) 8.
Client signals (UNI) STM-16 (SDH) 9.
10.
OC-48 (SONET)
11.
User interface type (on SFP module) I-16.1 12.
S-16.1 13.
L-16.1 14.
15.
L-16.2
16.
Wavelength range 2nd window for I-16.1, S-16.1 and L-16.1 17.
(Refer to “B&W SFP modules optical 3rd window for L-16.2. 18.
characteristics” (p. 4-28) for details.) 19.
20.
Fiber type 9/125 μm Single-mode (SMF)
21.
Connector type LC/SPC on SFP module 22.
Other user interface characteristics Refer to “B&W SFP modules optical 23.
characteristics” (p. 4-28). 24.
25.
Optical characteristics of the WDM interface of the TRBC1111 unit
26.
WDM interface - Common specification 27.
Wavelength specification ITU-T G.694.1, 50 GHz channel spacing
28.
29.
Modulation format NRZ 30.
Wavelength tunability over the whole C-Band 31.
32.
Wavelength range 1530.33 nm -> 1568,36 nm nm
33.
Frequency range 195.900 THz -> 191.950 THz (± 1.5 GHz) 34.
WDM interface bit rate (IN/OUT) 10.709225 Gbps ± 20 ppm
35.
36.
Connector type MU/SPC 38.
39.
WDM interface - Transmitter specification
40.
Output power -24 dBm -> +1 dBm 41.
Minimum extinction ratio 13 dB
42.
43.
Output power step, over the above specified 0.5 dB 44.
range 45.
46.
DRAFT
............................................................................................................................................................................................................................................................
4 - 24 3AL 75131 AAAA
DRAFT
............................................................................................................................................................................................................................................................
1. Output power drift accuracy min: -0.25 dB; max : +0.25 dB

2.
3. Output power stability over life and temperature min:-0.5dB; max:+0.5dB
4. Output power when the frequency is not locked max -42 dBm
5. or the board is not in service
6.
WDM interface - Receiver specification
7.
8. Input optical power -21.2 dBm -> +2.0 dBm
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
21.
22.
23.
24.
25.
26.
27.
28.
29.
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 4-25
DRAFT
............................................................................................................................................................................................................................................................
2xGE_FC characteristics 1.
2.
3.
Optical characteristics of the interfaces of the 2GE_FC unit 4.
Common specification, for both User and Line sides 5.
6.
Fiber type 9/125 μm SMF 7.
50/125 μm MMF 8.
62.5/125 μm MMF 9.
10.
Connector type LC/PC on SFP modules. All the interfaces (either
11.
client or line) are SFP modules
12.
Wavelength range 1st window for GbE-SX 13.
(For details refer to “B&W SFP modules 3rd window for L-16.2 14.
optical characteristics” (p. 4-28) and Table , 15.
3rd window for DWDM (1529.55 -> 1561.42 nm),
“DWDM SFP modules optical characteristics” 16.
according to ITU-T G.694.1, 100GHz channel
(p. 4-31)).
spacing 17.
2nd window for all the others B&W SFPs 18.
19.
Optical interface specification, User side 20.
Bit rate, client side all the bit rates are 3R; 21.
1.250 Gbps: Gigabit Ethernet 22.
23.
1.0625 Gbps: Fiber Channel
24.
Interface type GbE-SX, GbE-LX, FC-LX 25.
(For details refer to “B&W SFP modules 26.
optical characteristics” (p. 4-28)). 27.
Other Interfaces characteristics See “B&W SFP modules optical characteristics” 28.
(p. 4-28). 29.
30.
Optical interface specification, Line side
31.
Bit rate, Line/aggregate side all the bit rates are 3R; 32.
2.488320 Gbps: STM-16/OC-48 33.
34.
Interface type I-16.1, S-16.1, L-16.2
35.
(For details refer to “B&W SFP modules DWDM interface for long haul (APD detector):
optical characteristics” (p. 4-28) and “DWDM
36.
DWAxxx 37.
SFP modules optical characteristics”
(p. 4-31)). 38.
39.
Other Interfaces characteristics See “B&W SFP modules optical characteristics” 40.
(p. 4-28) and “DWDM SFP modules optical
41.
characteristics” (p. 4-31).
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
4 - 26 3AL 75131 AAAA
DRAFT
............................................................................................................................................................................................................................................................
1. ETHC1000 characteristics
2.
3.
4. Optical interfaces specification
5. Common specification, for both User and Line sides
6.
7. Fiber type 9/125 μm SMF
8. 50/125 μm MMF
9. 62.5/125 μm MMF
10.
Connector type LC/PC (on SFP and XFP modules).
11.
Client interfaces are SFP modules
12.
Line interfaces are XFP modules
13.
14. Wavelength range 1st window for GbE-SX
15. (For details refer to “B&W SFP modules optical 3rd window for 10GbE Base-E
16. characteristics” (p. 4-28), “DWDM SFP
2nd window for all the others B&W SFP/XFP
17. modules optical characteristics” (p. 4-31), and
“B&W XFP modules optical characteristics”
18.
(p. 4-32)).
19.
20. Optical interface specification, User side
21. Bit rate, client side all the bit rates are 3R;
22.
1.250 Gbps: Gigabit Ethernet
23.
24. Interface type GbE-SX, GbE-LX
25. (For details refer to “B&W SFP modules optical
26. characteristics” (p. 4-28)).
27. Other Interfaces characteristics (SFPs) See “B&W SFP modules optical characteristics”
28. (p. 4-28).
29.
Optical interface specification, Line side
30.
31. Bit rate, Line side all the bit rates are 3R;
32. 9.9532 Gbps: 10 GbE WAN
33.
Interface type I-64.1, 10GBE BASE-LW
34.
(For details refer to “B&W XFP modules optical S-64.2b, 10GBE BASE-EW
35. characteristics” (p. 4-32)).
36.
37. Other Interfaces characteristics (XFP) See “B&W XFP modules optical characteristics”
38. (p. 4-32).
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 4-27
DRAFT
............................................................................................................................................................................................................................................................
B&W SFP modules optical characteristics 1.

2.
3.
STM-16 SFP module type I-16.1 S-16.1 Unit 4.
Addressed wavelength 1270 -> 1360 1270 -> 1360 nm 5.
6.
Min. launched power -10 -5 dBm 7.
Max launched power -3 0 dBm 8.
9.
Allowed bit rates 2.48832 2.125 ; 2.48832 Gbp
10.
s
11.
Min. extinction ratio 8.2 8.2 dB 12.
Spectr Max -20dB NA 1 nm 13.
al bandwidth 14.
width 15.
Max. RMS width 4 NA nm
16.
Minimum SMSR NA 30 dB 17.
Max chromatic disp. -12 -> +12 -100 -> +100 ps/n
18.
m 19.
20.
Min sensitivity, @BER=1E-10 -18 -18 dBm 21.
Minimum overload -3 0 dBm 22.
23.
Max optic. path penalty 1 1 dB
24.
Max receiver reflect. 27 27 dB 25.
Optical connector / Fiber type LC / SMF LC / SMF 26.
27.
Acronym / interface type I-16.1DDM / I-16.1 S-16.1DDM / S-16.1 28.
Equipped on TRBC1111 / 2xGE_FC TRBC1111 / 2xGE_FC 29.
30.
31.
32.
STM-16 SFP module type L-16.1 L-16.2 Unit
33.
36.
Max launched power +3 +3 dBm 37.
Allowed bit rates 2.48832 2.48832 Gbp 38.
s 39.
Min. extinction ratio 8.2 8.2 dB
40.
41.
Spectral Max. -20dB 1 1 nm 42.
width bandwidth 43.
Max. RMS width NA NA nm 44.
45.
Minimum SMSR 30 30 dB
46.
DRAFT
............................................................................................................................................................................................................................................................
4 - 28 3AL 75131 AAAA
DRAFT
............................................................................................................................................................................................................................................................
1. Max chromatic disp. (ps/nm) -250 -> +250 +1600 ps/n

2. m
3.
4. Minimum sensitivity, @ BER=1E-10 -27 -28 dBm
5. Minimum overload -8 -8 dBm
6.
7.
8. Max receiver reflect. 27 27 dB
9. Optical connector (Tx/Rx) / Fiber LC / SMF LC / SMF
10. type
11.
12. Acronym / interface type L-16.1DDM / L-16.1 L-16.2DDM / L-16.2
13. Equipped on TRBC1111 TRBC1111 / 2xGE_FC
14.
15. 1.25 GbE SFP module type 1000BASE-SX 1000BASE-LX/LH 1000BASE-ZX Unit
16. Addressed wavelength 820 -> 860 1270 -> 1355 1540->1570 nm
17.
18. Min. launched power -9.5 -11 0 dBm
19. Max launched power -4 -3 +5 dBm
20.
Allowed bit rates 1.25 1.25 1.25 Gbps
21.
22. Min. extinction ratio 9 9 9 dB
23. Spectra Max. -20dB NA NA 1 nm
24. l width bandwidth
25.
26. Max. RMS width 0.85 4 NA nm
27. Minimum SMSR NA NA 30 dB
28.
Max chromatic dispersion - - 1200 ps/n
29.
m
30.
31. Min sensitivity, @BER=1E-12 -17 -19 -24 dBm
32. Minimum overload 0 -3 0 dB
33.
34. Max optic. path penalty - - 2 dB
35. Max receiver reflect. 12 12 12
36.
Optical connector / Fiber type LC / MMF LC / SMF LC / SMF
37.
38. Acronym / Interface type 1GbESXDDM / 1GbELXDDM / 1GbEZXDDM
39. 1000BASE-S 1000BASE-L / 1000BASE-Z
40. Equipped on 2xGE_FC / 2xGE_FC / 2xGE_FC /
41. ETHC1000 ETHC1000 ETHC1000
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 4-29
DRAFT
............................................................................................................................................................................................................................................................
FC SFP module type 1FC, 2FC 850 nm 1FC, 2FC 1310 nm Unit 1.
2.
Addressed wavelength 830 –> 860 1265 -> 1370 nm 3.
Min. launched power -10 -9.5 dBm 4.
5.
Max launched power -3 -3 dBm
6.
Allowed bit rates 1.0625 Gbps; 2.125 Gbps Gbps 7.
Min. extinction ratio 9 9 dB 8.
9.
Spectra Max. -20dB NA NA nm 10.
l width bandwidth 11.
Max. RMS width 0.85 see NOTE 1 nm 12.
13.
Minimum SMSR NA NA dB
14.
Max chromatic disp. - - ps/n 15.
m 16.
Minimum sensitivity with 1.0625 Gbps = –17 -20 dBm 17.
fiber, @ BER=1E-12 2.125 Gbps = –15
18.
19.
Minimum overload 0 -3 dBm 20.
Max optic. path penalty - - dB 21.
22.
Max receiver reflect. 12 12 dB
23.
Optical connector / Fiber type LC / SMF LC / SMF 24.
Acronym / Interface type FC/2FCmm / FC/2FCmm FC/2FCsm / FC/2FCsm
25.
26.
Equipped on 2xGE_FC 2xGE_FC 27.
Note: See figure 18 and figure 19 of the “Physical interfaces FC-PI-2 Rev. 30, 2002" (FC/2FC 28.
standard) 29.
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
4 - 30 3AL 75131 AAAA
DRAFT
............................................................................................................................................................................................................................................................
1. DWDM SFP modules optical characteristics

2.
3.
4. DWDM SFP module type APD DWDM Unit
5. Addressed wavelength 1527,99 -> 1563,86 nm
6.
7. Min. launched power 0 dBm
8. Max launched power +4 dBm
9.
Maximum wavelength deviation +/- 100 pm
10.
EOL
11.
12. Allowed bit rates 0.1 -> 2.666 Gbp
13. s
14. Min. extinction ratio 8.2 dB
15.
16. Max -20dB bandwidth 0.5 nm
17. Minimum SMSR 30 dB
18.
Max chromatic disp. 1800 / 2400 (see Note 1) ps/n
19. m
20.
21. Min. sensitivity, @BER=1E-10 -28 dBm
22. Minimum sensitivity @ 1310nm -20 dBm
23.
Minimum overload -8 dBm
24.
25. Max optic. path penalty 2 / 3 depending on dispersion (See Note dB
26. 1)
27. Max receiver reflect. 27 dB
28.
29. Optical connector / Fiber type LC / SMF
30. Acronym / interface type DWA200 -> DWA600 / APD DWDM
31.
Equipped on 2xGE_FC
32.
33. Note: 2 dB path penalty corresponds to a dispersion of 1800 ps/nm/km, 3 dB to 2400 ps/nm/km.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 4-31
DRAFT
............................................................................................................................................................................................................................................................
B&W XFP modules optical characteristics 1.

2.
3.
10 Gbps XFP module type I-64.1/10GbE Base-L S-642b/10GbE Base-E Unit 4.
XFP P/N 1AB214540001 1AB217280001 5.
6.
9.
Max launched power -1 +2 dBm
10.
Allowed bit rates 9.95328 ; 10.3125 ; 10.709 Gbps 11.
Min. extinction ratio 6 8.2 dB 12.
13.
Spectral width: max. -20dB 1 0.25 nm 14.
bandwidth 15.
Minimum SMSR 30 30 dB 16.
17.
Max chromatic disp. 60 800 ps/n
m
18.
19.
Minimum sensitivity @ -11 -14 dBm 20.
BER=1E-12 21.
Minimum overload 0.5 -1 dBm 22.
23.
24.
Max receiver reflect. 14 27 dB 25.
Optical connector (Tx/Rx) LC LC 26.
27.
Fiber type SMF SMF 28.
Acronym / Interface type XI641 / I-64.1/10GBASE- XS642 / S-64.2b/10GBASE- 29.
L E 30.
31.
Equipped on TRBD1191/ETHC1000 TRBD1191/ETHC1000
32.
10 Gbps XFP module type 10GbE Base-S P1L1-2D2 (L-64.2) Unit 33.
XFP P/N 1AB214540002 1AB217280002 34.
35.
Min. launched power -7.3 0 dBm 37.
38.
Max launched power -1.0 +4.0 dBm
39.
Allowed bit rates 9.95328 ; 10.3125 9.95328 ; 10.3125 ; 10.709 Gbps 40.
Min. extinction ratio 3.0 9.0 dB 41.
42.
Spectral width: max. -20dB see table 52.8 of IEEE 0.25 nm 43.
bandwidth 802.3 standard
44.
Minimum SMSR - 30 dB 45.
46.
DRAFT
............................................................................................................................................................................................................................................................
4 - 32 3AL 75131 AAAA
DRAFT
............................................................................................................................................................................................................................................................
1. Max chromatic disp. - 1600 ps/n

2. m
3.
4. Minimum sensitivity @ -9.9 -24 dBm
5. BER=1E-12
6. Stressed sensitivity -7.5 - dBm
7.
Minimum overload -2.0 -7 dBm
8.
9. Max optic. path penalty - 2 dB
10. Max receiver reflect. 12 27 dB
11.
12. Optical connector (Tx/Rx) LC LC
13. Fiber type 50/125 μm MMF SMF
14. 62.5/125 μm MMF
15.
16. Acronym / Interface type X10GBASES / XP1L12D2/P1L1-2D2 (L-
10GBASE-S 64.2)
17.
18. Equipped on TRBD1191 TRBD1191
19.
20.
21.
22.
23.
24.
25.
26.
27.
28.
29.
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 4-33
DRAFT
............................................................................................................................................................................................................................................................
Multiplexers / demultiplexers optical characteristics 1.

2.
8:1 and 1:8 Channel Mux / DemultipleXer (CMDX1010) optical characteristics 3.
4.
5.
CMDX1010 optical interfaces specification 6.
CMDX Common 7.
specification Comments 8.
9.
Application type Long Haul, on a 50 GHz grid
10.
Nominal Channel See wavelength allocation table (Table 3-2, 11.
Centre frequencies “Nominal frequencies allocation plan in C-Band 12.
for long haul applications (50GHz grid)” 13.
(p. 3-23)) 14.
16.
17.
CMX parameters 18.
(multiplexing side) minimum typical maximum units Comments 19.
Channel Passband 44 44 GHz Centered on the 20.
frequencies specified in 21.
Table 3-2, “Nominal 22.
frequencies allocation plan 23.
in C-Band for long haul 24.
applications (50GHz 25.
grid)” (p. 3-23) 26.
Insertion loss 5.0 6.8 8.2 dB Across all channel centres 27.
28.
CMX input power -27 15 dBm At one input
29.
CMX output power -32 19 dBm At combined output 30.
31.
32.
CDX parameters 33.
(demultiplexing side) minimum typical maximum units Comments 34.
35.
Channel Passband 20 20 GHz Centered on the frequencies
36.
specified in Table 3-2, “Nominal
frequencies allocation plan in C-
37.
Band for long haul applications 38.
(50GHz grid)” (p. 3-23) 39.
40.
Insertion loss 5.0 6.4 7.3 dB Across all channel centres 41.
CDX input power -5 15 dBm 42.
43.
44.
45.
46.
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4 - 34 3AL 75131 AAAA
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1. 12:1 and 1:12 Band Multiplexer/ DemultipleXer (BMDX1000) optical characteristics

2.
3.
4. BMDX1000 optical interfaces specification
5. BMDX1000 Common specification Comments
6.
7. Application type Long Haul, on a 50 GHz grid
9.
10.
11. Muxed/Demuxed channels see Table 3-2, “Nominal
12. frequencies allocation plan in
13. C-Band for long haul
14. applications (50GHz grid)”
15. (p. 3-23)
16. maxi
17. mini typi mu unit
18. BMDX1000 parameters mum cal m s Comments
19. Nominal centre frequencies (υ 192.3125; 191.7125; THz See also Table 4-3,
20. nom) 192.1125; 192.5125; “Multiplexed/demultiplexed
21. 192.9125; 193.3125; channels by BMDX1000 (50GHz)
22. 193.7125; 194.1125; and band centre frequency”
23. 194.5125; 194.9125; (p. 4-35)
24. 195.3125; 195.7125;
25. Clear Passband - 212.5 GHz With respect to the band nominal
26. 212.5 centre frequency
27.
28.
29.
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 4-35
DRAFT
............................................................................................................................................................................................................................................................
12:1 and 1:12 Band Mux/DemuX for Band OADM (BMDX1100) optical characteristics 1.
2.
3.
BMDX1100 optical interfaces specification 4.
BMDX1100 Common specification Comments 5.
6.
Application type Long Haul, on a 50 GHz grid 7.
9.
10.
BMDX1100 parameters minimum maximum units Comments 11.
Nominal centre frequencies (υ 191.3; 191.7; 192.1; THz See also Table 4-4, 12.
nom) 192.5; 192.9; 193.3; “Multiplexed/demultiplexed 13.
193.7; 194.1; 194.5; channels by BMDX1000 14.
194.9; 195.3; 195.7 (50GHz) and band centre 15.
frequency” (p. 4-38) 16.
17.
Clear Passband -160 +160 GHz With respect to the band
nominal centre frequency (υ
18.
nom) 19.
20.
Refer to Table 3-2, “Nominal frequencies allocation plan in 21.
C-Band for long haul applications (50GHz grid)” (p. 3-23)
22.
Muxed/Demuxed channels for the channel/wavelength/frequency relationship
23.
Band 1 195850; 195800; 195750; 195700; 195650; 195600; 195550 24.
Band 2 195450; 195400; 195350; 195300; 195250; 195200; 195150 25.
26.
Band 3 195050; 195000; 194950; 194900; 194850; 194800; 194750 27.
Band 4 194650; 194600; 194550; 194500; 194450; 194400; 194350 28.
29.
Band 5 194250; 194200; 194150; 194100; 194050; 194000; 193950
30.
Band 6 193850; 193800; 193750; 193700; 193650; 193600; 193550 31.
Band 7 193450; 193400; 193350; 193300; 193250; 193200; 193150 32.
33.
Band 8 193050; 193000; 192950; 192900; 192850; 192800; 192750 34.
Band 9 192650; 192600; 192550; 192500; 192450; 192400; 192350 35.
36.
Band 10 192250; 192200; 192150; 192100; 192050; 192000; 191950
37.
Band 11 191850; 191800; 191750; 191700; 191650; 191600; 191550 38.
Band 12 191450; 191400; 191350; 191300; 191250; 191200; 191150 39.
40.
41.
42.
43.
44.
45.
46.
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4 - 36 3AL 75131 AAAA
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1. OADC Family Optical Characteristics

2.
3.
4. Optical characteristics of OADC units
5. OADC0104 OADC1100 OADC1102 OADC1300 OADC1750
6.
7. General Specifications
8. Application 10/90 Optical 50/50 70/30 8:1 Optical Two 4:1
9. Add Coupler Add&Drop Add&Drop Add Coupler Optical Add
10. for ALC Coupler for Coupler for and 1:8 Drop Coupler and
11. channel in T- Metropolitan Long-Haul R- Splitter for one 1:8 Drop
12. OADM nodes R-OADM and OADM nodes Long-Haul T- Splitter for
13. TR-OADM OADM nodes Long-Haul T-
14. nodes OADM nodes
15. Fiber Type SMF SMF SMF SMF SMF
16.
Connector Type MU MU MU MU MU
17.
18. Express Channel / From RX IN (Pre-ampli) to RX OUT (Express)
19. Insertion Loss at - 3.9 dB 6.3 dB - -
20. Min. Attenuation 4.4 db Max. 7 dB Max.
21.
22. Attenuation - +/- 0.3 dB +/- 0.5 dB - -
23. Accuracy
24. Attenuation Stability - +/- 0.2 dB +/- 0.3 dB - -
25. over 24 hrs
26. Riple - 0.2 dB 0.2 dB - -
27.
28. PDL - 0.2 dB 0.35 dB - -
29. Express Channel / From TX IN to TX OUT (Booster)
30.
Insertion Loss at 1.8 dB 3.0 dB 6.5 dB - -
31.
Min. Attenuation 2.3 dB Max. 4.4 dB Max. 7.4 db Max.
32.
33. Attenuation 0.2 dB +/- 0.3 dB +/- 0.5 dB - -
34. Accuracy
35. Attenuation Stability +/- 0.3 dB +/- 0.2 dB +/- 0.3 dB - -
36. over 24 hrs
37.
Riple 0.2 dB 0.2 dB 0.2 dB - -
38.
39. PDL 0.2 dB 0.2 dB 0.35 dB - -
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 4-37
DRAFT
............................................................................................................................................................................................................................................................
1.
2.
Optical characteristics of OADC units (Cont...) 3.
OADC0104 OADC1100 OADC1102 OADC1300 OADC1750 4.
5.
Add Channel / From TX IN (Add) to TX OUT (Booster) Add Channel Add Channel
from from 6.
Transponders Transponders 7.
(4x1 side) (8x1 side) 8.
9.
Insertion Loss at 10.8 dB 3.9 dB 3.0 dB 10.6 dB 7.3 dB
Min. Attenuation 1.9 dB Max. 4.4 dB Max. 3.6 dB Max. 11.2 db Max. 8.0 dB Max.
10.
11.
Attenuation +/- 0.8 dB +/- 0.3 dB +/- 0.5 dB - - 12.
Accuracy 13.
Attenuation Stability +/- 0.4 dB +/- 0.2 dB +/- 0.3 dB +/- 0.5 dB +/- 0.3 dB 14.
over 24 hrs 15.
16.
Riple 0.3 dB 0.2 dB 0.2 dB 0.4 dB 0.3 dB
17.
PDL 0.4 dB 0.2 dB 0.35 dB 0.2 dB 0.15 dB 18.
Dropped Channel / From RX IN to RX OUT (Drop) 19.
20.
Insertion Loss at - 3.0 dB 2.7 dB 10.6 dB 10.6 dB 21.
Min. Attenuation 4.4 dB Max. 3.3 dB Max. 11.2 db Max. 11.2 db Max.
22.
Attenuation - +/- 0.3 dB +/- 0.5 dB - - 23.
Accuracy 24.
Attenuation Stability - +/- 0.2 dB +/- 0.3 dB +/- 0.5 dB +/- 0.5 dB 25.
over 24 hrs 26.
27.
Riple - 0.2 dB 0.2 dB 0.4 dB 0.4 dB 28.
PDL - 0.2 dB 0.35 dB 0.2 dB 0.2 dB 29.
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
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1. OCNC Optical characteristics

2.
3.
4. Optical characteristics of OCNC units
5. OCNC 1230 OCNC 1240
6.
7. General Specifications
8. Application 30/70 Optical Coupler 30/70 Optical Coupler
9. followed by a 50/50 Optical followed by a 1/3 Optical
10. Coupler for Y nodes Coupler for X nodes
11.
Fiber Type SMF SMF
12.
13. Connector Type MU MU
14. Bandwidth C+ Band C+ Band
15.
16. Dropped Channel / From RX IN to RX OUT (Drop)
17. Insertion Loss at 2.8 dB 2.8 dB
18. Min. Attenuation 3.4 dB Max. 3.4 dB Max.
19. Attenuation +/- 0.3 dB +/- 0.3 dB
20. Accuracy
21.
22. Attenuation Stability +/- 0.2 dB +/- 0.2 dB
23. over 24 hrs
24. Riple 0.2 dB 0.2 dB
25.
PDL 0.2 dB 0.2 dB
26.
27. Transmitted Channel / From RX IN to RX OUT
28. Insertion Loss at 9.4 dB 11.2 dB
29. Min. Attenuation 10.2 dB Max. 12.1 dB Max.
30.
Attenuation +/- 0.6 dB +/- 0.6 dB
31.
Accuracy
32.
33. Attenuation Stability +/- 0.3 dB +/- 0.3 dB
34. over 24 hrs
35. Riple +/- 0.4 dB +/- 0.4 dB
36.
37. PDL +/- 0.3 dB +/- 0.3 dB
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 4-39
DRAFT
............................................................................................................................................................................................................................................................
1.
2.
Optical characteristics of OCNC units (Cont...) 3.
OCNC 1230 OCNC 1240 4.
5.
Monitoring Channel / From RX IN to RX OUT (Monitoring)
6.
Insertion Loss at 21 dB 21 dB 7.
Min. Attenuation 22 dB Max. 22 dB Max. 8.
Attenuation +/- 0.6 dB +/- 0.6 dB 9.
Accuracy 10.
11.
Attenuation Stability +/- 0.5 dB +/- 0.5 dB
12.
over 24 hrs
13.
Riple 0.4 dB 0.4 dB 14.
PDL 0.4 dB 0.4 dB 15.
16.
17.
18.
19.
20.
21.
22.
23.
24.
25.
26.
27.
28.
29.
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
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4 - 40 3AL 75131 AAAA
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1. Automatic Laser Control (ALCT1010) optical characteristics

2.
3.
4. ALCT1010 optical interfaces specification
6.
8. Maximum optical output power 11 dBm (as min. value)
9.
Minimum optical output power -14 dBm (as max. value)
10.
11.
Table 4-2 ALCT1010 wavelengths list
12.
13.
14.
15. BAND # ALCT frequency
16. 2 195.35 THz
17.
3 194.95 THz
18.
19. 4 194.55 THz
20. 5 194.15 THz
21.
22. 6 193.75 THz
23. 7 193.35 THz
24.
8 192.95 THz
25.
26. 9 192.55 THz
27. 10 192.15 THz
28.
29. 11 191.75 THz
30. 12 191.35 THz
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 4-41
DRAFT
............................................................................................................................................................................................................................................................
OMDX8100_L1_X optical characteristics 1.

2.
3.
OMDX8100_L1_X optical interfaces specification 4.
Common specification Comments 5.
6.
Application type Regional, on a 100 GHz grid 7.
9.
10.
Tributary channels frequencies refer to Table 3-3, The OMDX8100_L1_X is 11.
and wavelengths “Frequencies allocation plan in composed of: 12.
C-Band for Metropolitan • one 8 channels L1 band 13.
applications (100GHz grid)” DWDM optical MUX, 14.
(p. 3-33), as regards the L1 • one LB and SB aggregate 15.
band signals expansion MUX, 16.
• one 8 channels L1 band 17.
DWDM optical DEMUX , 18.
• one LB and SB aggregate 19.
signals expansion DEMUX. 20.
Expansion port isolation 15 dB max 21.
22.
Polarization dependent loss 0.25 dB max within the channel passband
23.
Polarization mode dispersion 0.15 ps max within the channel passband 24.
Return Loss 45 dB min including connectors, ports 25.
terminated 26.
27.
MUX parameters Comments 28.
Insertion Loss: 29.
30.
Single channel 5.3 dB max
31.
Extra Band 3.0 dB max across all channel centres 32.
Expansion 2.2 dB max 33.
34.
Net bandwidth @ -0.5 dB 0.25 nm with respect to the band nominal 35.
centre frequency (υ nom)
36.
Net bandwidth @ -3.0 dB 0.3 nm with respect to the band nominal 37.
centre frequency (υ nom) 38.
Adjacent channel isolation 15 dB with respect to the band nominal 39.
41.
Non-Adjacent channel 30 dB with respect to the band nominal 42.
isolation centre frequency (υ nom)
43.
DEMUX parameters Comments 44.
Insertion Loss:
45.
46.
DRAFT
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4 - 42 3AL 75131 AAAA
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1. Single channel 4.75 dB max

2.
3. Extra Band 3.0 dB max across all channel centres
4. Expansion 1.7 dB max
5.
Net bandwidth @ -0.5 dB 0.25 nm with respect to the band nominal
6.
7.
8. Net bandwidth @ -3.0 dB 0.3 nm with respect to the band nominal
9. centre frequency (υ nom)
10. Adjacent channel isolation 25 dB with respect to the band nominal
12.
Non-Adjacent channel 35 dB with respect to the band nominal
13.
isolation centre frequency (υ nom)
14.
15. Directivity 50 dB including connectors
16. Input power -42 -> +25 dBm
17.
18. Channel insertion loss ripple 1 dB within nominal centre frequency
19. @1dB
20.
21.
22.
23.
24.
25.
26.
27.
28.
29.
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 4-43
DRAFT
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OMDX8100_XX (XX = L1 / L2 / S1 / S2) optical characteristics 1.

2.
3.
OMDX8100_XX optical interfaces specification 4.
6.
9.
10.
Tributary channels frequencies Refer to “Description” The OMDX8100 is composed 11.
and wavelengths (p. 4-45) and Table 3-3, of: 12.
“Frequencies allocation plan in • one 8 channels DWDM 13.
C-Band for Metropolitan optical MUX, 14.
applications (100GHz grid)” • one 8 channels DWDM 15.
(p. 3-33) optical DEMUX. 16.
Four boards are available, 17.
covering the 32 channels 18.
available on the 100 GHz grid 19.
End-to-end single channel 7.65 dB max 20.
insertion loss 21.
22.
Polarization dependent loss 0.30 dB max within the channel passband
23.
Return Loss 40 dB min including connectors, ports
25.
terminated 26.
27.
Insertion Loss: 29.
30.
31.
Extra Band 2.4 dB max across all channel centres 32.
Net bandwidth @ -0.5 dB 45 GHz with respect to the band nominal 33.
35.
37.
Channel passband 44 GHz 38.
Input power -27 -> +15 dB at one tributary input
39.
40.
Output power -32 -> +19 dB at multiplexed output 41.
43.
Insertion Loss:
44.
Single channel 4.15 dB max 45.
46.
DRAFT
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4 - 44 3AL 75131 AAAA
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1. Extra Band 2.4 dB max across all channel centres

2.
3. Net bandwidth @ -0.5 dB 20 GHz with respect to the band nominal
7.
Adjacent channel isolation 23 dB with respect to the band nominal
9.
10. Non-Adjacent channel 30 dB with respect to the band nominal
11. isolation centre frequency (υ nom)
12. Directivity 40 dB including connectors
13.
Input power -25-> +15 dB at one tributary input
14.
15.
16.
17.
18.
19.
20.
21.
22.
23.
24.
25.
26.
27.
28.
29.
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
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3AL 75131 AAAA 4-45
DRAFT
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OMDX4100_chXX-XX optical characteristics 1.

2.
3.
OMDX4100_chXX-XX optical interfaces specification (XX-SAX = from 20-23 to 57-60) 4.
6.
9.
10.
Tributary channels frequencies Refer to. “Description” The OMDX4100 is composed of: 11.
and wavelengths (p. 4-48) and Table 3-3, • one 4 channels DWDM 12.
“Frequencies allocation plan optical MUX, 13.
in C-Band for Metropolitan • one 4 channels DWDM 14.
applications (100GHz grid)” optical DEMUX. 15.
(p. 3-33)
Eight boards are available, 16.
covering the 32 channels 17.
available on the 100 GHz grid 18.
End-to-end single channel 7.4 dB max 19.
insertion loss 20.
21.
Polarization dependent loss 0.30 dB max within the channel passband 22.
24.
Return Loss 40 dB min including connectors, ports
terminated
25.
26.
Insertion Loss: 28.
29.
30.
Extra Band 2 dB max across all channel centres 31.
Net bandwidth @ -0.5 dB 45 GHz with respect to the band nominal
32.
34.
Channel passband 44 GHz 37.
38.
Input power -27 -> +15 dB at one tributary input
39.
Output power -32 -> +19 dB at multiplexed output 40.
42.
Insertion Loss: 43.
Single channel 3.65 dB max 44.
45.
Extra Band 1.4 dB max across all channel centres
46.
DRAFT
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4 - 46 3AL 75131 AAAA
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3.
6. Adjacent channel isolation 23 dB with respect to the band nominal
8. Non-Adjacent channel 30 dB with respect to the band nominal
9. isolation centre frequency (υ nom)
10.
11. Input power -25-> +15 dB at one tributary input
12.
13.
14.
15.
16.
17.
18.
19.
20.
21.
22.
23.
24.
25.
26.
27.
28.
29.
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
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3AL 75131 AAAA 4-47
DRAFT
............................................................................................................................................................................................................................................................
LOFA11x0 optical characteristics 1.

2.
3.
LOFA1110, LOFA1120 optical interfaces specification 4.
LOFA Common specification 5.
6.
9.
Wavelength range 1530.33 -> 1568.57 nm
10.
Wavelength range - OSC port 1500 -> 1520 nm 11.
unit 12.
LOFA11x0 optical ports minimum maximum s 13.
14.
first stage input power -40 +5 dBm
15.
first stage output power +1 +17 dBm 16.
second stage input power -20 +18 dBm
17.
18.
second stage output power +6 +23 dBm 19.
OSC output (extraction) level -50 -6 dBm 20.
21.
OSC input (insertion) level +2 +4 dBm
22.
first stage input power monitoring -51 -14 dBm 23.
first stage output power monitoring -23 -4 dBm
24.
25.
second stage input power monitoring -23 +4 dBm 26.
second stage output power monitoring -17 0 dBm 27.
28.
Tuning step 0.5 dB
29.
Absolute tuning accuracy -0.45 +0.45 dB 30.
Relative tuning accuracy -0.3 +0.3 dB
31.
32.
Maximum EOL output power without EMPM +20 dBm 33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
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4 - 48 3AL 75131 AAAA
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1. LOFA11x1 optical characteristics

2.
3.
4. LOFA1111, LOFA1121 optical interfaces specification
5. Common specification
6.
9.
Wavelength range 1529.1 -> 1561.8 nm
10.
11. Wavelength range - OSC port 1500 -> 1520 nm
12. LOFA11x1 optical ports
13.
14. Floating VOA input -38 -> +17 dBm
15. Floating VOA output -39 -> +17 dBm
16.
1st stage input power -38 -> +5 dBm
17.
18. 1st stage output power -2 -> +12 dBm
19. 2nd stage input power -20 -> +18 dBm
20.
21. 2nd stage output power +2 -> +17 dBm
22. OSC output (extraction) level -50 -> -6 dBm
23.
OSC input (insertion) level +2 -> +4 dBm
24.
25. 1st stage input power monitoring -51 -> -14 dBm
26. 1st stage output power monitoring -23 -> -4 dBm
27.
28. 2nd stage input power monitoring -23 -> +4 dBm
29. 2nd stage output power monitoring -17 -> 0 dBm
30.
Bidirection
31.
Bidirectional al (stage 2
32. Unidirectional (stage 1 only) only)
33.
34. Output power (LOFA11x1) 17 dBm 12 dBm 17 dBm
35. Input power LOFA11 -4.5 dBm -4.5 dBm +3.0 dBm
36. 11 -10.5 dBm -10.5 dBm +3.0 dBm
37. LOFA11
38. 21
39.
1st stage Output power (LOFA11x1) +12 dBm NA NA
40.
41. Delta G LOFA11 2.2 dBm (w/ a 9 4.5 dBm 2.0 dBm
42. 11 dB midstage)
43. LOFA11 2.2 dBm (w/ a 9 5.0 dBm 2.0 dBm
44. 21 dB midstage)
45.
46.
DRAFT
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3AL 75131 AAAA 4-49
DRAFT
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Noise figure LOFA11 7.3 @[Pin - 5.5 @[Pin - 8.5 @Pin 1.

11 6;Pin] 6;Pin] 2.
3.
8.0 6.0
@[Pin;Pin+3] @[Pin;Pin+6]
4.
5.
LOFA11 6.5 @[Pin - 5.5 @[Pin - 8.5 @Pin 6.
21 6;Pin] 6;Pin] 7.
7.0 6.0 8.
@[Pin;Pin+3] @[Pin;Pin+6] 9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
21.
22.
23.
24.
25.
26.
27.
28.
29.
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
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4 - 50 3AL 75131 AAAA
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1. OCPU2104 optical characteristics

2.
3.
4. Optical characteristics of the Client/B&W interfaces of the OCPU2104 unit
5. Parameter / Function Comment
6.
7. Application type Long Haul, on a 50 GHz grid
8. Operating wavelength range 1 1290 -> 1330 nm (2nd window), ITU-T G.691 S-64.2b
9.
Operating wavelength range 2 1530 -> 1565 nm (3rd window), ITU-T G.693 VSR2000
10.
2R1
11.
14.
15. Insertion Loss 50% 2.7 -> 3.9 dB Including connectors
16. Insertion Loss 50% 2.7 -> 3.9 dB Including connectors
17.
Input Return Loss 30 dB
18.
19. Client #1 input to splitter #1 client receive levels
20. Splitter #1 output to Main trib #1 min. = input level - 3.9 dB
21.
22. Splitter #1 output to Spare trib #1 min. = input level - 3.9 dB
23. Client #2 input to splitter #2 client receive levels
24.
Splitter #2 output to Main trib #2 min. = input level - 3.9 dB
25.
26. Splitter #2 output to Spare trib #2 min. = input level - 3.9 dB
27. Coupler #1 input from Main trib #1 client transmit levels
28.
29. Coupler #1 input from Spare trib #1 client transmit levels
30. Coupler #1 output to Client #1 min. = input level - 3.9 dB
31.
Coupler #2 input from Main trib #2 client transmit levels
32.
33. Coupler #2 input from Spare trib #2 client transmit levels
34. Coupler #2 output to Client #2 min. = input level - 3.9 dB
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 4-51
DRAFT
............................................................................................................................................................................................................................................................
Optical Supervisory Channel Unit (OSCU101x) optical characteristics 1.

2.
3.
OSCU101x optical characteristics 4.
Common specification 5.
6.
Number of OSC (SPV) ports OSCU1010 = 2, for Line Terminal and OADM 7.
applications 8.
OSCU1011 = 1, for Line Terminal applications 9.
Nominal bit rate 4 864 kbps (default configuration) => 10.
2Mbps for LAPD (OSC) + 2 Mbps for user channels 11.
(UDC) 12.
13.
Fiber type Single-mode (SMF)
14.
Wavelength 1510 ± 5 nm 16.
17.
18.
19.
20.
21.
22.
23.
24.
25.
26.
27.
28.
29.
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
4 - 52 3AL 75131 AAAA
Technical specifications Alarm characteristics
DRAFT
............................................................................................................................................................................................................................................................
1. Alarm characteristics
2.
3. Units Alarms:
4.
5. Each port card or access card of the equipment is provided with a bicolor (green/red) or
6. three-color (green/yellow/red) LED ( ) on the front coverplate.
7. This LED indicates:
8.
• when red, internal failure
9.
10. • when green, in service unit
11. • when yellow, board in firmware download state (only for TRBD, TRBC, 2XGE_FC,
12. ETHC1000, CMDX, BMDX, ALCT, LOFA, OSCU).
13. Centralized Equipment Alarms:
14.
15. All the alarms detected on the units are collected by the ESCT2000 unit which will
16. deliver centralized optical indications (by means of LEDs on its front coverplate).
17. Specifically:
18. • Red LED “URG“: detection of an URGENT (MAJOR OR CRITICAL) alarm
19. • Red LED "NUR": detection of a NOT URGENT (MINOR) alarm
20.
• Yellow LED "ATD": alarm condition ATTENDED
21.
22. Refer to “Units front view” (p. 2-49), where the front view of each unit and the LED
23. locations are illustrated.
24.
25. Note: On the Craft Terminal (C.T.) and on the Operation System (O.S.) application
26. the URGENT (URG), NOT URGENT (NURG) and WARNING alarms are named in a
27. different way; the relation between this two terminology is explained in Table 4-3,
28. “Relation between Alarm severity terminology displayed onC.T./O.S. and alarm
29. severity terminology used for the ESCT leds and ETSI market racks (TRU).” (p. 4-54).
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 4-53
DRAFT
............................................................................................................................................................................................................................................................
Table 4-3 Relation between Alarm severity terminology displayed onC.T./O.S. and 1.
alarm severity terminology used for the ESCT leds and ETSI market 2.
racks (TRU). 3.
4.
5.
Alarm severity terminology on C.T. and Alarm severity terminology used for ESCT 6.
O.S. leds and for TRU in the rack 7.
CRITICAL or MAJOR URG 8.
9.
MINOR NURG
10.
ATTENDED ATTD 11.
12.
Rack Alarms:
13.
Some equipment alarms are carried to a connector and used to light-up alarm rack-lamps. 14.
Rack alarms are physically available on the RAIU board connectors. 15.
16.
17.
TRU Front Panel LEDs (ETSI) 18.
Marking Description Led color
19.
20.
URG Urgent alarm input from one of the shelves in the rack RED 21.
ON if the RAIU raises the Critical or the Major alarm 22.
NURG Non urgent alarm input from one of the shelves in the rack RED 23.
ON if the RAIU raises the Minor alarm. 24.
25.
ATTD Attended: acknowledged URG/NURG alarms after an alarm cut off YELLOW
by the operator (ACO push button on the ESCT front panel).
26.
27.
SIG PRES Signal presence (power ON) GREEN 28.
29.
The TRU has four front panel leds: Urgent, Non Urgent, Attended, Signal Presence. Those
30.
leds are managed by the RAIU boards of a rack, except for the last one which indicates
31.
that the power is ON. The TRU has four DB25 connectors so that the RAIU boards of a
32.
rack can be either linked together or directly connected to the TRU.
33.
In NEs composed of more than one rack, the TRU of the master rack shows both the HW
34.
alarms of the rack and the summary of the NE alarms. The TRU LEDs in secondary racks
35.
only show the HW failures of the rack (from the FANS or the power supplies).
36.
HouseKeeping Alarms/Commands: 37.
A set of housekeeping contacts are available, located on the 25-pole connector of the 38.
housekeeping board. 39.
40.
Alarm Attending: 41.
The detected units alarm condition can be stored through the ACO (Alarms Cut Off) push- 42.
button on the ESCT unit (Attended). 43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
4 - 54 3AL 75131 AAAA
DRAFT
............................................................................................................................................................................................................................................................
1. This operation will turn OFF the general red LED “URG" and will light up the “ATD"
2. yellow LED on the ESCT unit (Attended); the attended command is also sent to the rack
3. lamps (if present) through the RAIU board.
4.
Trouble-shooting:
5.
6. This equipment has been designed to dialog with a Personal Computer (PC) for service,
7. activation and trouble-shooting purpose.
8. Trouble-shooting procedure for the equipment and details of the alarms for each card and
9. relevant indications are described in the Operator's Handbook.
10.
11. Connection with the PC is achieved through the 9-pole connector (F interface) on the
12. ESCT board.
13. The unit can be connected to an Operation System associated to the Transmission
14. Management Network in order to execute operations similar to those carried out by the
15. PC.
16.
Characteristics of the cited rack alarms and Housekeeping contacts interface (EM type)
17.
are included in “1626 LM system characteristics” (p. 4-1).
18.
19.
20.
21.
22.
23.
24.
25.
26.
27.
28.
29.
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 4-55
Technical specifications Power supply characteristics
DRAFT
............................................................................................................................................................................................................................................................
Power supply characteristics 1.

2.
3.
4.
Input Voltage range (from station batteries) - 40,5 V < - 48 V < - 57,0 V 5.
- 57,0 V < - 60 V < - 72,0 V 6.
7.
Power supply output voltages towards units 48/60 V filtered
8.
+ 3.7 V (by DC/DC conv)
9.
+ 5.4 V (by DC/DC conv) 10.
The PSUP takes a 48V/60V battery supply and filters it before making it available on the backplane. 11.
It then uses the redundant (filtered) 48V supplies to power the on board 3.7V and 5.4V supplies. The 12.
unit also uses the 3.7V supply (either from the on board converter, or if failed from the backplane) to 13.
power its SPIder. The maximum current drawn from these power rails shall not exceed the following 14.
requirement 15.
Power supply interface according to ETS EN 300132-2 16.
17.
Power consumption 18.
19.
This product is designed for low power consumption. Developing new components with 20.
very high integration density and low voltage supply leads to a significant reduction of 21.
power consumption. 22.
Depending on the number and type of I/F ports, the power consumption may vary in a 23.
wide range. 24.
25.
26.
Estimated max 1626 LM shelf power 900W - a fully equipped expansion shelf with 16 27.
consumption transponders 28.
29.
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
4 - 56 3AL 75131 AAAA
Technical specifications Power supply characteristics
DRAFT
............................................................................................................................................................................................................................................................
1. Maximum power consumption of the boards and units

2.
3.
4. Unit Maximum power consumption [W]
5. TRBD4312 TDB
6.
7. TRBD1111, TRBD1131, ETHC1000 35
8. TRBD1121 38
9.
TRBD1191 48
10.
11. TRBC1111 39
12. 2xGE_FC 14
13.
14. BMDX1x00 7
15. CMDX1010 22
16.
ALCT1010 10
17.
18. OMDX8100 4
19. OMDX4100 3
20.
21. LOFA11x0 20
22. LOFA1111 20
23.
LOFA1121 13
24.
25. OCPU2104 2
26. ESCT2000 20
27.
28. OSCU1010 15
29. OSCU1011 11
30.
RAIU1000, HSKU1x00, USIB1000 2
31.
32. PSUP1000 10
33. FANS1000 55
34. (when the three FAN modules are at high
35. rotation speed)
36.
37. FANS2000 TDB
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 4-57
Technical specifications Mechanical characteristics
DRAFT
............................................................................................................................................................................................................................................................
Mechanical characteristics 1.
2.
3.
Rack mechanical compatibility ETSI ETS/E3, Optinex compatible
4.
1626 LM subrack size 466 mm H x 532 mm W x 288 mm D (w/ front panel) 5.
Board size there are four types of board: 6.
7.
354 mm Height x 213 mm Deep x 25 mm Width
8.
265 mm Height x 213 mm Deep x 20 mm Width 9.
12.
Rack size 2200 mm Height x 600 mm Width x 300 mm Deep
13.
1626MS Subrack weight 14 Kg for an empty shelf and 14.
47 Kg for a fully populated expansion shelf with 16 TRBDs, 15.
2 CMDXs, 2 PSUPs, 1 ESCT and 1 RAIU 16.
17.
Cooling Fans located at the bottom of the shelf 18.
Rack cabling Vertical between rack and subrack front access 19.
20.
Electrical Connectors SUB-D 3-pole connector: power supply
21.
SUB-D 25-pole connector: housekeeping interface
SUB-D 9-pole connector: F and RAIU interfaces
22.
23.
mini USB connector: F interface
24.
RJ45 (2x): Q interface for NMS connection 25.
RJ45 (2x): 10Base-T interface for intra-shelf connection 26.
RJ45: RS-232 debugger interface 27.
RJ45: 2Mbps user interface on TRBD/TRBC 28.
RJ45: 2x64Kbps user interface on USIB1000 29.
30.
RJ11: analog audio interface on USIB1000
31.
RJ11: RAIU interface
32.
Back-to-back installation Yes 33.
Boards dimension 34.
35.
TRBD11X1, TRBC1111, 354mm height x 213mm depth x 25mm width 36.
ETHC1000, BMDX1x00
37.
2xGE_FC, ALCT1010, 265mm height x 213mm depth x 20mm width 38.
CMDX1010, LOFA11xx, 39.
ESCT2000, OSCU101x, 40.
OMDXxxxx, OCPU2104 41.
RAIU1000, HSKU1100, 73mm height x 213mm depth x 20mm width 42.
PSUP1000, USIB1000 43.
44.
HSKU1000 73mm height x 213mm depth x 25mm width
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
4 - 58 3AL 75131 AAAA
Technical specifications Mechanical characteristics
DRAFT
............................................................................................................................................................................................................................................................
1. Boards weight
2.
3. TRBD11x1 1.85 Kg max.
4. TRBC1111 1.6 Kg
5.
2xGE_FC 0.85 Kg
6.
7. ETHC1000 1.05 Kg
8. CMDX1010 0.9 Kg
9.
10. BMDX1x00 1.2 Kg
11. ALCT1010 0.9 Kg
12.
OMDX8100 1.01 Kg
13.
14. OMDX4100 1.01 Kg
15. LOFA11x0 1.2 Kg
16.
17. OCPU2104 0.28 Kg
18. ESCT2000 1.03 Kg
19.
OSCU101x 0.97 Kg
20.
21. RAIU1000 0.14 Kg
22. HSKU1x00 0.15 Kg
23.
24. USIB1000 0,17 Kg
25. PSUP1000 0.3 Kg
26.
27.
28.
29.
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 4-59
Technical specifications Environmental characteristics
DRAFT
............................................................................................................................................................................................................................................................
Environmental characteristics 1.
2.
Main environmental aspects of Alcatel-Lucent products are: 3.
4.
• energy consumption during manufacturing and use,
5.
• materials harmfulness and recycleability, 6.
• emissions to air, water or soil related to the manufacturing and the use of the product, 7.
• electromagnetic (EM) emissions, 8.
9.
• value recovery at the product end of life. 10.
The 1626 LM is designed to be compliant to ETSI standards. 11.
12.
The technical data of this chapter are referred to ITU-T Recommendations and ETSI
13.
Standards.
14.
15.
Electromagnetic Compatibility (EMC)
16.
The CE markings printed on the product denote compliancy with the following Directives: 17.
• 89/336/EEC of May 3rd, 1989 (EMC Directives), amended 18.
– by the 92/31/EEC Directive issued on April 28th, 1992 19.
20.
– by the 93/68/EEC Directive issued on July 22nd, 1993
21.
22.
Compliancy to the above Directives is declared, when the equipment is installed as for the 23.
manufacturer handbooks, according to the following European Norms: 24.
25.
• EN 300 386 (V1.3.2), environment “Telecommunication center" 26.
27.
28.
WARNING
29.
This is a class A product of EN 55022. In domestic, residential and light industry 30.
environments, this product may cause radio interference in which case the user may be 31.
required to take adequate measures. 32.
33.
Electromagnetic Compatibility (EMC) requirements 34.
All units when mounted in the appropriate subrack meet the EMC requirements as 35.
outlined in the ETSI specification EN 300 386 (V1.3.2 - required for CE marking) which 36.
covers equipment used within the telecommunication centre environment. 37.
38.
The units when mounted in subracks, meet the requirements for enclosure, signal lines,
39.
DC power ports and radiated magnetic field emission.
40.
The units, however, are not required to meet these requirements when not mounted in a 41.
subrack. 42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
4 - 60 3AL 75131 AAAA
DRAFT
............................................................................................................................................................................................................................................................
1. In addition to the requirements of EN 300 386 specification, the equipment meets the
2. additional requirements of ES 201 468 ("Additional Electro Magnetic Compatibility
3. (EMC) requirements for Telecommunications Equipment for Enhanced Availability of
4. Service in Specific Conditions“).
5.
EMI/EMC condition are described in “Electromagnetic Compatibility (EMC condition)”
6.
(p. A-10).
7.
8.
Waste from Electrical and Electronic Equipment (WEEE)
9.
10. The marking printed on the subrack (refer to Figure A-1, “Subrack label” (p. A-15) on and
11. Table A-2, “Label references” (p. A-13)) denotes compliancy with the Directive
12. 2002/96/EC On Waste of Electrical and Electronic Equipment.
13.
14.
15.
16.
17.
18.
19.
The general principle is the producer responsibility in the management of the products he
20.
puts on the market when discarded by the owner. The producer responsibility now covers
21.
the end of life of the products sold.
22.
23. The European directive is effective in a country once transposed. The starting date for the
24. producer responsibility for the European text is 13th August 2005.
25. All Alcatel-Lucent products fall under in Category 3 of Annex 1A of the WEEE directive
26. (Directive 2002/96/ EC) i.e. "IT and Telecommunication equipment" under item "other
27. products transmitting sound, images or other information by telecommunications."
28.
29. Alcatel-Lucent products fall under WEEE directive name: "Other product or equipment
30. of transmitting sound, images or other information by telecommunications" in Annex 1B.
31. This mark will not cause any responsibility as all responsibilities will be defined by
32. contract.
33.
34. Acoustical noise
35.
The acoustical noise level of the product complies with:
36.
37. • ETS 300 753, environment “Telecommunication equipment rooms unattended"
38. The measurements have been performed according to the standard ISO 3745.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 4-61
DRAFT
............................................................................................................................................................................................................................................................
Climatic for operating conditions 1.

The Equipment meets the requirements of ETSI Stand. with use of fans housed in an 2.
external subrack. 3.
4.
The functionality of the 1626 LM Equipment, Vs. Temperature, is in compliance with: 5.
ETS 300 019-1-3 :1992 , class 3.2. 6.
7.
Class 3.2 : Partly temperature-controlled locations.
8.
(see climatogram on Figure 4-6, “Climatogram for Class 3.2: Partly temperature
9.
controlled locations” (p. 4-63))
10.
Class 3.2: partly Temperature controlled locations
11.
12.
This applies to locations: 13.
• where installed equipment may be exposed to solar radiation and heat radiation. They 14.
may also be exposed to movements of the surrounding air due to draughts in buildings, 15.
e.g. through open windows. They may be subjected to condensed water and to water 16.
from sources other than rain and icing. They are not subjected to precipitation; 17.
• where mould growth or attacks by animals, except termites, may occur; 18.
19.
• with normal levels of contaminants experienced in urban areas with industrial
20.
activities scattered over the whole area and/or with heavy traffic;
21.
• In close proximity to sources of sand or dust; 22.
• with vibration of low significance, e.g. for products fastened to light supporting 23.
structures subjected to negligible vibrations. 24.
25.
The conditions of this class may be found in:
26.
• entrances and staircases of buildings; 27.
• garages; 28.
• cellars; 29.
30.
• certain workshops;
31.
• buildings in factories and industrial process plants; 32.
• unattended equipment stations; 33.
• certain telecommunication buildings; 34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
4 - 62 3AL 75131 AAAA
DRAFT
............................................................................................................................................................................................................................................................
1. • ordinary storage rooms for frost resistant products and farm buildings, etc.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
29
20.
21.
22.
23.
24.
25.
26.
27.
28.
29.
30.
31.
32.
33.
34.
35.
36.
5 95
37.
38.
39.
40.
41.
42. Figure 4-6 Climatogram for Class 3.2: Partly temperature controlled locations
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 4-63
DRAFT
............................................................................................................................................................................................................................................................
The equipment operates within its specified performance limits over the range specified in 1.
the climatogram for this environmental class (Figure 4-6, “Climatogram for Class 3.2: 2.
Partly temperature controlled locations” (p. 4-63)). 3.
The equipment thus also operates within its specified performance limits over the 4.
temperature and humidity range. Thus an increase in the specified upper temperature limit 5.
to +50 ºC from +45 ºC as specified in EN 300 019-1-3 for Class 3.2. 6.
7.
The applicable extreme external operating conditions are summarized in Table 4-4, 8.
“Environmental Operating Conditions[1]” (p. 4-64). A description of the applicable 9.
operating conditions for both the ETSI requirements are described below. 10.
11.
12.
Table 4-4 Environmental Operating Conditions[1] 13.
14.
15.
Parameter Operational Limits 16.
17.
Low Air Temperature -5 ºC [2]
18.
[2]
High Air Temperature +50 ºC 19.
Low Relative Humidity 5% RH 20.
21.
High Relative Humidity 95% RH 22.
Rate of Change of Temperature 0.5 ºC/min. 23.
24.
Air Temperature Rise Over Unit Operational TBD
max [3]
25.
26.
[1]
Temperatures specified are ambient temperatures external to the equipment, air 27.
temperature rises across the subracks within the rack may result in component surface 28.
temperatures being 20 ºC above the external air temperature. 29.
[2]
Temperature range extended to +50ºC to cover the requirements of EN 300 019-1-3 30.
Class 3.2. 31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
4 - 64 3AL 75131 AAAA
DRAFT
............................................................................................................................................................................................................................................................
1. Storage
2. The units are un-powered and packed in a “ready to ship” condition prior to being
3. subjected to the following storage conditions. The packaging procedures and materials
4. used have to be representative of those used for the final delivered product. The delivered
5. product is: equipped racks, equipped subracks and individual units, unit design is
6. compatible with all of these.
7.
8. The 1626 LM equipment meets the following requirements Vs. Storage:
9. ETS 300 019-1-1: 1992, class 1.2
10.
Class 1.2: weather protected, not temper. controlled storage location.
11.
12. This class applies to weather protected storage having neither temperature nor humidity
13. control. The location may have openings directly to the open air, i.e., it may be only partly
14. weatherproofed. The climatogram is shown on Figure 4-7, “Climatogram for Class 1.2:
15. not temperature controlled storage location” (p. 4-66).
16. This class applies to storage locations:
17.
• where equipment may be exposed to solar radiation and temporarily to heat radiation:
18.
They may also be exposed to movements of the surrounding air due to draughts, e.g.
19.
through doors, windows or other openings. They may be subjected to condensed
20.
water, dripping water and to icing. They may also be subjected to limited wind-driven
21.
precipitation including snow;
22.
23. • where mould growth or attacks by animals, except termites, may occur;
24. • with normal levels of contaminants experienced in urban areas with industrial
25. activities scattered over the whole area, ad/or with heavy traffic;
26. • in areas with sources of sand or dust, including urban areas;
27.
28. • with vibration of low significance and insignificant shock.
29. The conditions of this class may occur in:
30. • unattended buildings;
31.
• some entrances of buildings;
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 4-65
DRAFT
............................................................................................................................................................................................................................................................
• some garages and shacks. 1.

2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
29 17.
18.
19.
20.
21.
22.
23.
24.
25.
26.
27.
28.
29.
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
Figure 4-7 Climatogram for Class 1.2: not temperature controlled storage location 41.
42.
43.
44.
45.
46.
DRAFT
............................................................................................................................................................................................................................................................
4 - 66 3AL 75131 AAAA
DRAFT
............................................................................................................................................................................................................................................................
1. Transportation
2. The units are un-powered and packed in a “ready to ship” condition prior to being
3. subjected to the following transportation conditions. The packaging procedures and
4. materials used have to be representative of those used for the final delivered product. The
5. delivered product is: equipped racks, equipped subracks and individual units, unit design
6. is compatible with all of these.
7.
8. The 1626 LM equipment meets the following requirements Vs. transportation:
9.
10. ETS 300 019-1-2: 1992, class 2.2
11.
12.
Class 2.2: Careful transportation (see Table 4-5, “Transportation climatic”
13.
(p. 4-68)).
14.
15. This class applies to transportation where special cars has been taken e.g. with respect to
16. low temperature and handling.
17. Class 2.2 covers the condition of class 2.1. In addition class 2.2 includes transportation in
18. all types of lorries and trailers in areas with well-developed road system.
19.
20. It also includes transportation by ship and by train specially designed, shock-reducing
21. buffers. Manual loading and unloading of to 20 Kg is included.
22. Extension of extreme low temperature during transportation is permitted for the 1626 LM
23. equipment in its standard packing:
24.
AT -40° C for 72 Hours maximum
25.
26. without damaging the Optical interfaces.
27.
28.
29.
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
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Table 4-5 Transportation climatic 1.

2.
3.
Environmental parameter Unit 2.1 and 2.2 2.3 4.
5.
(A) low temperature air °C - 25 - 40
6.
(B) high temperature, air in unventilated °C + 70 + 70 7.
enclosures (NOTE 1) 8.
(C) high temperature, air in ventilated enclosures °C + 40 + 40 9.
or outdoor air (NOTE 2) 10.
11.
(D) change of temperature air/air (NOTE 3) °C -25 / +30 -40 / +30
12.
(E) change of temperature air/water (NOTE 3) °C +40 / +5 +40 / +5 13.
(F) relative humidity, not combined with rapid % 95 95 14.
temperature changes 15.
°C +40 +45
16.
(G) relative humidity, combined with rapid % 95 95 17.
temperature changes air/air, at high relative 18.
humidity (NOTE 3, 6) 19.
°C -25 / +30 -40 / +30
20.
(H) absolute humidity, combined with rapid g/m3 60 60 21.
temperature changes: air/air at high water 22.
content (NOTE 4)
°C +70 / +15 +70 / +15 23.
24.
(I) low air pressure KPa 70 70
25.
(J) change of air pressure KPa/min no no 26.
(K) movement of the surrounding medium, air m/s 20 20 27.
28.
(L) precipitation rain mm/min 6 (NOTE 7) 6 29.
(M) radiation, solar W/m2 1120 1120 30.
31.
(N) radiation, heat W/m2 600 600
32.
(O) water from sources other than rain (NOTE m/s 1 (NOTE 7) 1 33.
5) 34.
(P) wetness none conditions of wet surfaces 35.
36.
Notes to Table 4-5: 37.
1. The high temperature of the surfaces of a product may be influenced by both the surrounding 38.
air temperature, given here, and the solar radiation through a window or another opening. 39.
2. The high temperature of the surface of a product is influenced by the surrounding air 40.
temperature, given here, and the solar radiation defined below. 41.
3. A direct transfer of the product between the two given temperature is presumed. 42.
4. The product is assumed to be subjected to a rapid decrease of temperature only (no rapid 43.
increase). The figures of water content apply to temperatures down to the dew-point; at lower 44.
45.
46.
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1. temperatures the relative humidity is assumed to be approximately 100%.

2. 5. The figure indicates the velocity of water and not the height of water accumulated.
3. 6. Occurrence of condensation.
4. 7. For short duration only.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
21.
22.
23.
24.
25.
26.
27.
28.
29.
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
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1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
21.
22.
23.
24.
25.
26.
27.
28.
29.
30.
31.
32.
33.
34.
35.
36.
37.
38.
39.
40.
41.
42.
43.
44.
45.
46.
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4 - 70 3AL 75131 AAAA
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WEEE general information
According to the European directive (2002/96/EC) Waste Electric and Electronic
Equipment, from August 13th 2005 the "producer" of the equipment being sold, unless
otherwise specified in the contract with the Customer, is responsible for collecting and
treating Electrical and Electronic Equipment.
Equipment put on the market after August 13th 2005 have a label (refer to Table A-2,
“Label references” (p. A-13)) affixed on the product. The presence of the black label
indicates the product has been put on the market after August 13th 2005.
The use of the crossed-out wheeled bin symbol indicates that this product is
subject to separate collection and is not to be treated as general household
waste.
The separate collection of this equipment at the end of its lifetime is organized and
managed by the producer. Please contact the producer or his authorized representative for
information concerning the disposal of your equipment.
The separate collection and recycling of waste equipment at the time of disposal
contribute to avoid possible negative effects on the environment and on human health.
In next paragraphs is given a description example of how to disassemble an equipment; the

same principle can be applied to all the subracks and units composing the equipment.
The unit chosen for disassembly is one of the most complex.

• The section on “How to disassembly equipment” (p. 5-2) describes the equipment
disassembly; in detail:
– “Tools necessary for disassembly” (p. 5-2) lists the tools necessary for disassembly
– “Subrack disassembly” (p. 5-2) describes the subrack disassembly
– “Unit disassembly” (p. 5-11) describes the unit disassembly
– “Hazardous materials and components” (p. 5-24) describes the procedure to apply
in order to manage Hazardous materials and components (example battery)
• “ECO declaration” (p. 5-27) reports the ECO declaration info.
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3AL 75131 AAAA 5 -1
Dismantling & recycling How to disassembly equipment
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How to disassembly equipment

This equipment is designed for easy disassembly, by using screws and rivets for
mechanical assembly of subracks and modules. The variety of screw types is minimized.
Tools necessary for subrack and units disassembly are reported in “Tools necessary for
disassembly” (p. 5-2).
The disassembly process depends on the respective recycling methods and can be derived
from the delivered assembly instructions of the product.
These guidelines are not mandatory.
They are given in order to optimize the disassembling process and material recovery as
whole.
Tools necessary for disassembly

The following tools are necessary for unit disassembly:
• # T9 TORX screw driver
• # T20 TORX screw driver
• Cross-head screwdriver
• Wrench #
• Scissors
• Protection gloves
Subrack disassembly
Figure 5-1, “Subrack front and rear view” (p. 5-3) shows an example of subrack.
The same rules can be applied to the specific equipment to be dismantled.
In order to disassemble the subrack first remove the boards eventually present, included
termination bus.
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5-2 3AL 75131 AAAA
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SUBRACK FRONT VIEW SUBRACK REAR VIEW
Figure 5-1 Subrack front and rear view
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3AL 75131 AAAA 5-3
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Procedure:
• Remove the two screws (A) in order to disassemble the handle as reported in
Figure 5-2, “Handle removing and disassembly” (p. 5-4).
• Repeat the same procedure on the other handle.
• Separate the two plastic blocks of the handle as reported in Figure 5-2, “Handle
removing and disassembly” (p. 5-4).
plastic block
plastic block
Figure 5-2 Handle removing and disassembly

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• Unscrew all the screws present on rear cover as shown in Figure 5-3, “Rear cover
removing” (p. 5-5) (dashed lines).
• Remove the rear cover in order to access the subrack Back Panel.
Figure 5-3 Rear cover removing

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3AL 75131 AAAA 5-5
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............................................................................................................................................................................................................................................................
• Unscrew all the screws fastening the Back Panel to the mechanical structure of the
subrack as indicated in Figure 5-4, “Back Panel removing” (p. 5-6) (dashed line).
• Remove the Back Panel from the subrack mechanical structure.
Figure 5-4 Back Panel removing

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5-6 3AL 75131 AAAA
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• Remove the upper and lower guides from the subrack access area by unscrewing the
relevant screws as indicated in Figure 5-5, “Upper and lower guides plane removing”
(p. 5-7).
Upper and Lower guides

ACCESS AREA
BASIC AREA
Figure 5-5 Upper and lower guides plane removing

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3AL 75131 AAAA 5-7
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• Remove the side wall by unscrewing the relevant screw as indicated in Figure 5-6,
“Side wall removing” (p. 5-8).
• Remove the two contact springs from the side wall as indicated in Figure 5-7, “Optical
fiber duct, guides and contact spring removing” (p. 5-10) (refer to “Hazardous
materials and components” (p. 5-24) for info about hazardous parts dismantling).
Figure 5-6 Side wall removing

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• Remove the two guides of the “basic area" and the two optical fiber ducts by pulling
them out as indicated in Figure 5-7, “Optical fiber duct, guides and contact spring
removing” (p. 5-10).
• Unscrew all the screws present on the other “side wall" in order to complete the
subrack disassembly.
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3AL 75131 AAAA 5-9
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Optical fiber duct

Optical fiber duct
guides guides
contact spring
contact spring
Figure 5-7 Optical fiber duct, guides and contact spring removing
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5 - 10 3AL 75131 AAAA
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Unit disassembly
Procedure:
• Remove the two screws (A) from the side coverplate as indicated in Figure 5-8, “Side
coverplate removal” (p. 5-11).
Figure 5-8 Side coverplate removal

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3AL 75131 AAAA 5-11
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• Remove the screws (B) that fix the two levers and subsequently pull out them from the
front plate as indicated in Figure 5-9, “Levers removal” (p. 5-12).
Figure 5-9 Levers removal

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• Unscrew and extract the two optical connectors (C) as indicated Figure 5-10, “Optical
connectors support removal” (p. 5-13).
• Remove the screw (D) fixing the connectors support as indicated in Figure 5-10,
“Optical connectors support removal” (p. 5-13).
• Rotate the connectors support (E) and pull it sideways to remove as indicated
Figure 5-10, “Optical connectors support removal” (p. 5-13).
D
C
Figure 5-10 Optical connectors support removal

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3AL 75131 AAAA 5-13
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............................................................................................................................................................................................................................................................
• Remove the two screws (F) from the side coverplate as indicated in Figure 5-11, “Side
coverplate and contact spring removal” (p. 5-15).
• Extract from the top the contact spring (G) as indicated in Figure 5-11, “Side
coverplate and contact spring removal” (p. 5-15) (refer to “Hazardous materials and
components” (p. 5-24) for info about hazardous parts dismantling).
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• Extract the fibers from the cavity (H) as indicated in Figure 5-11, “Side coverplate and
contact spring removal” (p. 5-15).
F
G
Figure 5-11 Side coverplate and contact spring removal

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3AL 75131 AAAA 5-15
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• Disconnect the two flat cables (M) as indicated in Figure 5-12, “Internal connectors
removal” (p. 5-17).
• Unscrew (L) connectors with the aid of a wrench as indicated Figure 5-12, “Internal
connectors removal” (p. 5-17).
• Remove the fibers (N) from supports pulling them out Figure 5-12, “Internal
connectors removal” (p. 5-17).
• Remove the two screws (O) on the other side of the board that fixes the dissipator to
the Printed Circuit Board (PCB) as indicated in Figure 5-13, “Dissipator removal”
(p. 5-18).
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............................................................................................................................................................................................................................................................
• The dissipator can now be removed (refer to Figure 5-14, “Modules removal from
dissipator” (p. 5-19)).
L L L L L
M L
N
N
Figure 5-12 Internal connectors removal

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3AL 75131 AAAA 5-17
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Figure 5-13 Dissipator removal

• Remove the screws (P) from dissipator as indicated in Figure 5-14, “Modules removal
from dissipator” (p. 5-19).
• Now the two modules on the other side of the dissipator are free to be removed (refer
to Figure 5-16, “Gold connector removal” (p. 5-21));
Pay attention during modules removal because of white conductive paste (refer
to “Hazardous materials and components” (p. 5-24) for info about hazardous
parts dismantling).
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• Remove the plastic part (X) in Figure 5-15, “Daughter board removal” (p. 5-20) by
unscrewing the screw present on the rear side of the dissipator.
P P
P
P
P
P P
P
Figure 5-14 Modules removal from dissipator
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3AL 75131 AAAA 5-19
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• Remove the screws (Q) and (R) that fix the daughter board and pull it out from the
mother board (refer to Figure 5-15, “Daughter board removal” (p. 5-20)).
MOTHER BOARD R
DAUGHTER BOARD
Q
Q
Figure 5-15 Daughter board removal

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5 - 20 3AL 75131 AAAA
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• Cut away gold connector (S) from daughter board (refer to Figure 5-16, “Gold
connector removal” (p. 5-21))
Figure 5-16 Gold connector removal

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3AL 75131 AAAA 5-21
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............................................................................................................................................................................................................................................................
• Remove all internal cables as indicated in Figure 5-17, “Internal cables removal”
(p. 5-22). To remove cables it is enough to pull them out from their support.
Figure 5-17 Internal cables removal

• Remove screws (T) that fix the metal support to the mother board as indicated in
Figure 5-18, “Connector metal support removal” (p. 5-23).
• Remove the metal support.
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5 - 22 3AL 75131 AAAA
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• Cut away the gold connector (U) from mother board.
Metal support
Figure 5-18 Connector metal support removal

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3AL 75131 AAAA 5-23
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Hazardous materials and components

Table 5-1, “List of hazardous materials and components present in the equipment”
(p. 5-24) lists the presence or not of hazardous substance/components.
Note: The system cabling is designed for reduced halogen content. All the traffic cabling
is fully PVC free.
Table 5-1 List of hazardous materials and components present in the equipment
Materials/substances Presence Where

Materials or substances of interest for Dismantling & Recycling
(end of life information for treatment facilities)
Batteries NO ---
(Mercury/NiCad/Lithium/Other)
Parts containing Mercury NO ---
(if above specified level)
Parts containing Cadmium NO ---
(if above specified level)
Capacitors with PCB's NO ---
Capacitors with substances of concern + NO ---
height > 25 mm, diameter > 25 mm or
proportionately similar volume
Gas discharge lamps NO ---
Mercury containing Backlighting lamps NO ---
Plastic containing brominated flame NO ---
retardants other than in Printed Circuit
Assemblies
Liquid Crystal Displays with a surface NO ---
greater than 100 cm2
Asbestos NO ---
Refractory ceramic fibres NO ---
Batteries NO ---
(Mercury/NiCad/Lithium/Other)
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Thermal conductive paste YES In all units where dissipators are present
a withe thermal conductive paste is used
in between mechanical parts.
An example is depicted in Figure 5-15,
“Daughter board removal” (p. 5-20).
Note: protective plastic gloves must be
used in order to avoid contact between
hands and thermal conductive paste.
Pay attention to avoid contact of thermal
conductive paste with eyes.
Radio-active substances NO
Beryllium Oxide NO
Other forms of Beryllium YES Refer to Figure 5-7, “Optical fiber duct,
guides and contact spring removing”
(p. 5-10) and Figure 5-11, “Side
coverplate and contact spring removal”
(p. 5-15) point G.
Note: Copper-beryllium contact spring
must be separated from other material
and must be fused in a specific regulated
environment.
Parts containing elements under pressure NO ---
Parts containing Liquids NO ---
Parts containing Gas NO ---
Mechanical springs (springs used for NO ---
fixation of mechanical parts under force)
Gasses which fall under specific NO ---
regulation (CFCs, HCFCs, ....)
Polychlorinated biphenyls (PCB), NO ---
polychlorinated terphenyls (PCT) or
PCN
Other materials or substances
Ago colorants NO ---
Short chain Chloroparaffins NO ---
Lead or lead compounds NO ---
Hexavalent chromium compounds NO ---
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TBT and TBTO NO ---
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5 - 26 3AL 75131 AAAA
Dismantling & recycling ECO declaration
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ECO declaration
The Alcatel-Lucent 1626 Light Manager is a global 3rd generation DWDM transmission
platform addressing Long Haul (LH) and Ultra Long Haul (ULH) terrestrial applications
and unrepeatered submarine systems.
This product complements and extends Alcatel-Lucent's highly successful range of
Regional and Long Haul DWDM products to achieve lower costs and superior system
performance.
The 1626 Light Manager helps service providers lower the overall transmission cost per
bit in the core of the network by minimizing CAPEX and optimizing OPEX.
Key features
• Best-in-class footprint
• Lower power consumption
• Greater span performance
• Seamless upgrade using the Optical Network Extender Shelf to grow the network
• Cost optimized transponders
• Ease of use with new channel balancing feature
• Integrated submarine and terrestrial platform
• Fully managed by the Alcatel-Lucent 1350 management suite
Moreover refer to Chapter 5, “1626 LM system characteristics” on page 5-1.
Weight and Dimensional Characteristics

Refer to Chapter 5, “Mechanical characteristics” on page 5-58.
EXTENSION OF SYSTEM LIFETIME

The product is designed to ensure an outstanding quality of service through very high
traffic transmission, connection and protection performances and minimum service
interruption.
The life utility is at least 5 years. This means that maintenance will be assured for at least
5 years.
The system architecture facilitates future extendability and upgradability:
• On-site configuration changes as e.g. extension of the node traffic capacity without
recabling of interconnections
• Implementation of new features and functionalities by remote Software download
The terms and conditions of warranty, service availability and spare parts availability are
individually agreed between Alcatel-Lucent and the Customer and are part of the relevant
contractual commitments.
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3AL 75131 AAAA 5-27
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POWER CONSUMPTION
Refer to Chapter 5, “Power supply characteristics” on page 5-56.
RADIO FREQUENCY EMISSION

Regarding compliance with radio frequency emission requirements refer to Chapter 5,
“Electromagnetic Compatibility (EMC)” on page 5-60.
ACOUSTICAL NOISE
Refer to Chapter 5, “Acoustical noise” on page 5-61.
MATERIALS
Refer to “List of hazardous materials and components present in the equipment” (p. 5-24)
for details.
DISASSEMBLY
Refer to paragraph “How to disassembly equipment” (p. 5-2).
BATTERIES
The product requires no backup batteries.
PACKAGING
The packaging of this Alcatel-Lucent equipment complies with the directive 94/62/EEC
concerning packaging and packaging waste. Depending on the means of transportation the
racks are packed in a cardboard or wooden box, which can easily be recycled after use.
Environmentally harmful materials are not used for packaging. The packaging materials
are marked according to ISO 11 469. If required by the Customer and agreed by both
parties, Alcatel-Lucent can take care of the proper disposal of all packaging materials.
For details refer to the “Installation Handbook".
TAKE BACK INFORMATION

On request of customers, Alcatel-Lucent can take care of the take back of depreciated
equipment and of the ecological safe and appropriate disposal under conditions to be
agreed.
For that purpose, Alcatel-Lucent co-operates with qualified companies.
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DOCUMENTATION
In order to reduce paper consumption for Customer Documentation, Alcatel-Lucent
delivers the Generic Customer Documentation on a CD-ROM. The CD-ROM contains
interactive HW Descriptions, SW Descriptions, Functional Descriptions, Maintenance
Manuals and User Guides. This allows the operator to put the documentation on a server
accessible by all relevant people in the organization without any additional paper copies.
Additionally more specific documentations as e.g. information about products and
solutions, services and support, training events etc. will be provided by means of Alcatel-
Lucent website accessible by all customers. This will allow distribution of up-to-date
information very quickly and without wasting natural resources.
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5 - 30 3AL 75131 AAAA
A Safety Norms &
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Equipment Labels
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3AL 75131 AAAA A -1
Safety Norms & Equipment Labels First aid for electric shock
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First aid for electric shock

Do not touch the patient with bare hands until the circuit has been opened.
Open the circuit by switching off the line switches. If that is not possible, protect yourself
with dry material and free the patient from the conductor.
ARTIFICIAL RESPIRATION
It is important to start mouth to mouth resuscitation at once and seek medical help
immediately.
TREATMENT OF BURNS
This treatment should be used after the patient has regained consciousness. It can also be
employed while the artificial respiration is being applied (in this case there should be at
least two persons present).
CAUTION:
• Do not attempt to remove his clothing from the burnt parts;
• Apply dry gauze on the burns;
• Do not apply ointments or other oily substances.
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A-2 3AL 75131 AAAA
Safety Norms & Equipment Labels First aid for electric shock
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3AL 75131 AAAA A-3
Safety Norms & Equipment Labels Safety Rules
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Safety Rules
General Safety Rule 1
When the equipment is in service, nobody is authorized to access to the components
protected with cover plate shields.

In case of absolute necessity, only Service Personnel or Technical Assistance is authorized
to access the components of an equipment in service.
It is meant by Service Personnel or Technical Assistance, any personnel which has
adequate technical knowledge and necessary experience:
• to be aware of the danger that he might find in carrying out an operation,
• to take the necessary actions to reduce danger to minimum for him and for others.
The Service Personnel can only replace the faulty units with spare parts.
The Service Personnel is not allowed to repair, therefore the access to unspecified parts is
not permitted.

The required keys and/or tools to access dangerous high voltage areas must be restricted to
Service personnel only.

• Do not use any inflammable substance or substances which could alter markings and
inscriptions when cleaning the external parts of the equipment.
• It is recommended to use a slightly damp cloth.

• Before to work on optical connections, carefully observe the faceplate warning labels.
• If necessary, switch off the power station units.

• Do not touch the pins of an unplugged cable for the R/M interface connector. A TNV-
2 (battery) voltage can be present.
• Remove rings, watches, and other metal jewelry before to work with primary circuits.
• Be extremely careful to avoid shorting power input terminals.
DANGER: Possibility of personal injury. Short circuiting, low–

voltage, dc circuits can cause severe arcing that can result in
burns and/or eye damage.
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A-4 3AL 75131 AAAA
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............................................................................................................................................................................................................................................................

If the safety protection features fail, SWITCH THE POWER OFF.
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Labels Indicating Danger, Forbiddance, Command

It is of utmost importance to follow the instructions printed on the labels affixed to the
units and assemblies.
The labels are fully compliant with International Norms ISO 3846-1984. The symbols or
statements are enclosed in geometric shapes: ISO 3864-1984.
CONTAINS A SYMBOL STATEMENT.

INDICATES PROHIBITION: WHITE BACKGROUND WITH
RED RIM, BLACK SYMBOL OR STATEMENT.
CONTAINS A SYMBOL.
INDICATES WARNING OR DANGER: BLUE BACKGROUND,
WHITE SYMBOL OR STATEMENT
CONTAINS INFORMATION OR INSTRUCTION STATEMENT.

YELLOW BACKGROUND, BLACK RIM AND STATEMENT
The labels have been affixed to indicate a dangerous condition. They may contain any
standard-known symbol or any statement necessary to safeguard users and service
personnel against the most common ones, specifically:
• dangerous electrical voltages
• harmful optical signals
• risk of explosion
• moving mechanical parts
• heat-radiating mechanical parts
Pay attention to the information stated in the following, and proceed as instructed
The symbols presented in Appendix A, “Dangerous Electrical Voltages”

through Appendix A, “Heat-radiating Mechanical Parts: labelling and safety
instructions” are all the possible symbols that could be present on Alcatel-
Lucent equipment, but are not all necessarily present on the equipment this handbook
refers to.
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Dangerous Electrical Voltages
Electrical Safety: Labelling

The following warning label is affixed next to dangerous voltages (>42.4 Vp; >60 Vdc).
If it is a Class 1 equipment connected to mains, then the label associated to it will state that
the equipment will have to be grounded before connecting it to the power supply voltage,
e.g.:
WARNING!
Ground protect the equipment
before connecting it to mains
Make sure that power has been cut
off before disconnecting ground
protection.
Electrical safety: general rules

DANGER! Possibility of personal injury: carefully observe the specific
procedures for installation / turn-up and commissioning / maintenance of equipment parts
where a.c. or d.c. power is present, described in the relevant installation / turn-up and
commissioning / maintenance documents and the following general rules:
1. Personal injury can be caused by -48 V dc (or by 220 V ac if envisaged in the
equipment). Avoid touching powered terminals with any exposed part of your body.
2. Short-circuiting, low–voltage, low–impedance, dc circuits can cause severe arcing that
can result in burns and/or eye damage. Remove rings, watches, and other metal jewelry
before working with primary circuits. Exercise caution to avoid shorting power input
terminals.
Electrical safety: equipment specific data

Refer to Chapter 5, “Electrical safety” on page 5-8.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA A-7
DRAFT
............................................................................................................................................................................................................................................................
Harmful Optical Signals
Optical Safety: Labelling

If the assembly or unit is fitted with a LASER, the labels must comply with the IEC
60825-1 and -2 International Norms.
The symbol indicates the presence of a LASER beam. Danger level is stated within a
rectangular label:
If the laser is a Hazard Level 1 product, the label depicting the symbol within a triangle is
not compulsory.
The rectangular shaped label bears all the information needed, i.e.:
• LASER class
• Power emitted
• Wave length
• Ref. Norm
• Precautionary measures taken depend on LASER class
DRAFT
............................................................................................................................................................................................................................................................
A-8 3AL 75131 AAAA
DRAFT
............................................................................................................................................................................................................................................................
• Indications given on openings, panels and safety interlockers
Optical safety: general rules

On handling optical equipment or units or cables always check that laser labels are
properly affixed and that the system complies with applicable optical standards.
DANGER! Possibility of eyes damage: invisible infrared radiations emitted

by the fiber optic transmitters can cause eyes damages. Carefully observe the specific
procedures for installation / turn-up and commissioning / maintenance of units containing
laser devices or cables transporting optical signals, described in the relevant installation /
turn-up and commissioning / maintenance documents and the following general rules:
1. Laser radiation is not visible by the naked eye or with laser safety glasses. Although it
cannot be seen, laser radiation may be present.
2. Never look directly into an unterminated fiber optic connector or into a broken optical
fiber cable, unless it is absolutely known that no laser radiation is present.
3. Never look at an optical fiber splice, cable or connector, unless it is absolutely known
that no laser radiation is present.
4. All optical connectors, terminating either fibers and transmitters/receivers, are
provided with protective covers that must always be used, as soon as possible, when
any optical link is disconnected for installation/test/maintenance purposes or whatever
operation.
5. Never look directly into an unterminated fiber optic connector or into a broken optical
fiber cable by means of magnifiers/microscopes, unless it is absolutely known that no
laser radiation is present. A magnifier/microscope greatly increases the damage hazard
to the eyes.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA A-9
DRAFT
............................................................................................................................................................................................................................................................
6. Never point an unterminated optical fiber splice, cable or connector to other persons,
unless it is absolutely known that no laser radiation is present.
7. Always remove electrical power from near and far optical transmitters before
disconnecting optical links between the transmitter and the receiver.
8. Wearing of laser safety goggles or eyes shields is recommended for every person
working on optical devices, whenever the above listed rules cannot be followed.
Optical safety: equipment specific data

Refer to paragraph Chapter 5, “Optical Safety compliance with European Norms” on page
5-9.
Risks of Explosions: labelling and safety instructions

This risk is present when batteries are used, and it is signalled by the following label:
Therefore, slits or apertures are made to let air circulate freely and allow dangerous gasses
to downflow (battery-emitted hydrogen). A 417-IEC-5641 Norm. compliant label is
affixed next to it indicating that the openings must not be covered up.
DRAFT
............................................................................................................................................................................................................................................................
A - 10 3AL 75131 AAAA
DRAFT
............................................................................................................................................................................................................................................................
Moving Mechanical Parts: labelling and safety instructions

The following warning label is affixed next to fans or other moving mechanical parts:
Before carrying out any maintenance operation see that all the moving mechanical parts
have been stopped.
Heat-radiating Mechanical Parts: labelling and safety instructions

The presence of heat-radiating mechanical parts is indicated by the following warning
label in compliancy with IEC 417 Norm, Fig.5041:
As stated by IEC 950 Norm, mechanical parts which carry the above pictured label and
that could be touched, have maximum overtemperature as described in the following table.
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA A-11
DRAFT
............................................................................................................................................................................................................................................................
Table A-1 IEC 950 -Table 16: Overtemperature limits
Operator-accessible parts Maximum overtemperature (°C )

Metal Glass, Plastic,
porcelain rubber
Handle knob, etc., held or touched 35 45 60
for short periods
Handles, knobs, etc., regularly held 30 40 50
Outer surface of the equipment that 45 55 70
can be touched
Inner surface of the equipment that 45 55 70
can be touched
DANGER! Possibility of personal injury: carefully observe the specific

procedures for installation / turn-up and commissioning / maintenance of equipment parts
where heat-radiating mechanical parts are present, described in the relevant installation /
turn-up and commissioning / maintenance documents and the following general rule:
9. Personal injury can be caused by heat. Avoid touching powered terminals with any
exposed part of your body.
Electromagnetic Compatibility (EMC condition)

The equipment's EMC norms depend on the type of installation being carried out (cable
termination, grounding etc.,) and on the operating conditions (equipment, setting options
of the electrical/electronic units, presence of dummy covers, etc.).
• Before starting any installation, turn-up & commissioning, operation and maintenance
work refer to the relevant Handbook and chapters.
• The norms set down to guarantee EMC compatibility, are distinguished inside this
handbook by the symbol and term:
• ATTENTION
• EMC NORMS:
For EMC norms refer to Chapter 5, “Electromagnetic Compatibility (EMC)” on page 5-

60.
General Norms - Installation

• All connections (towards the external source of the equipment) made with shielded
cables use only cables and connectors suggested in this Handbook or in the relevant
Plant Documentation, or those specified in the Customer's "Installation Norms." (or
similar documents)
DRAFT
............................................................................................................................................................................................................................................................
A - 12 3AL 75131 AAAA
DRAFT
............................................................................................................................................................................................................................................................
• Shielded cables must be suitably terminated

• Install filters outside the equipment as required
• Ground connect the equipment utilizing a conductor with proper dia. and impedance
• Mount shields (if utilized), previously positioned during the installation phase, but not
before having cleaned and degreased it.
• Before inserting the shielded unit proceed to clean and degrease all peripheral surfaces
(contact springs and connection points, etc.)
• Screw fasten the units to the subrack.
• To correctly install EMC compatible equipment follow the instructions given.
General Norms - Turn-up & Commissioning, Operation

• Preset the electrical units as required to guarantee EMC compatibility
• Check that the equipment is operating with all the shields properly positioned (dummy
covers, ESD connector protections, etc.)
• To properly use EMC compatible equipment observe the information given
General Norms - Maintenance

• Before inserting the shielded unit, which will replace the faulty or modified unit,
proceed to clean and degrease all peripheral surfaces (contact springs and connection
points, etc.)
• Clean the dummy covers of the spare units as well.
• Screw fasten the units to the subrack.
Electrostatic Dischargers (ESD)

Before removing the ESD protections from the monitors, connectors etc., observe the
precautionary measures stated. Make sure that the ESD protections have been replaced
and after having terminated the maintenance and monitoring operations.
Most electronic devices are sensitive to electrostatic dischargers, to this concern the
following warning labels have been affixed.
Observe the precautionary measures stated when having to touch the electronic parts
during the installation/maintenance phases.
Workers are supplied with antistatic protection devices consisting of:
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA A-13
DRAFT
............................................................................................................................................................................................................................................................
ELASTICIZED BAND COILED CORD
• an elasticized band worn around the wrist

• a coiled cord connected to the elasticized band and to the stud on the subrack.
Suggestions, notes and cautions

Suggestions and special notes are marked by the following symbol:
Suggestion or note....
Cautions to avoid possible equipment damage are marked by the following
symbol:
TITLE...
(caution to avoid equipment damage)
statement....
DRAFT
............................................................................................................................................................................................................................................................
A - 14 3AL 75131 AAAA
Safety Norms & Equipment Labels Labels affixed to the equipment
DRAFT
............................................................................................................................................................................................................................................................
Labels affixed to the equipment

This chapter indicates the positions and the information contained on the identification
and serial labels affixed to the equipment.
Figure A-1, “Subrack label” (p. A-17) through Figure A-7, “XFP and SFP modules label”
(p. A-25) illustrate the most common positions of the labels on the units, modules and
subracks.
Figure A-8, “Label identifying Unit, Optical assembly, Shelf, Back panel” (p. A-26)
through Figure A-16, “China RoHS label” (p. A-29) illustrate the information (e.g.,
identification and serial No.) printed on the labels.
The table below relates the ref. numbers stated on the figures to the labels used.
Labelling depicted hereafter is for indicative purposes and could be changed
without any notice.
Table A-2 Label references
Ref. No. Name of Label

1 Label identifying PBA (Printed Board Assembly) - Internal labelling.
Refer to Figure A-3, “Internal label for Printed Board Assembly” (p. A-21)
2 Label identifying Unit, Optical assembly, Shelf, back panel.
Refer to Figure A-8, “Label identifying Unit, Optical assembly, Shelf, Back
panel” (p. A-26)
3 External label for unit identification - units with two ejectors: part number.
Refer to Figure A-9, “External label for unit identification (unit with two
ejectors): P/N” (p. A-26)
4 External label for unit and shelf identification - units with ejector(s): CLEI code.
Refer to Figure A-10, “External label for unit/shelf identification - unit with
ejector(s): CLEI code” (p. A-26)
4 Labelling for units with one top ejector.
Refer to Figure A-5, “Labels on units with one top extraction handle” (p. A-23)
and Figure A-10, “External label for unit/shelf identification - unit with
ejector(s): CLEI code” (p. A-26)
5 Labelling for units without ejector.
Refer to Figure A-6, “Labels on units without extraction handle” (p. A-24)
6 XFP EXTENDED optical module label. Refer to Figure A-11, “Label for Optical
module XFP extended” (p. A-27)
7 XFP optical module label. Refer to Figure A-12, “XFP module label” (p. A-27)
8 SFP Optical module label. Refer to Figure A-13, “SFP module label” (p. A-28)
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA A-15
DRAFT
............................................................................................................................................................................................................................................................
Ref. No. Name of Label

9 Label identifying compliancy with CE, WEEE and China RoHS Directives.
Refer to Figure A-14, Figure A-15 and Figure A-16 on page A-28
On contract basis, customized labels can be affixed to the equipment.

Standard labels can be affixed to any position on the equipment, as required by the
Customer.
Note, however, specific customer agreements ultimately influence label placement.
DRAFT
............................................................................................................................................................................................................................................................
A - 16 3AL 75131 AAAA
DRAFT
............................................................................................................................................................................................................................................................
2 4
NOTE: The above reference numbers are detailed on Table A-2, “Label references”
(p. A-15).
Figure A-1 Subrack label
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA A-17
DRAFT
............................................................................................................................................................................................................................................................
xxxxxxxxx
xxxxxx
2
ABC
xxxxxxxxx
3
xxxxxx
(p. A-15).
Figure A-2 Labels on units with standard cover plate, with two extraction handles
DRAFT
............................................................................................................................................................................................................................................................
A - 18 3AL 75131 AAAA
Safety Norms & Equipment Labels Part Number and Change Status identification
DRAFT
............................................................................................................................................................................................................................................................
Part Number and Change Status identification

Each unit or sub-unit is distinguished by:
• a Part Number: ANV P/N (xxx.xxxxx xxyy) (NOTE)
The last two ANV–P/N letters (yy, in the following stated as 'suffix') stand for a
"feasible alternative", they might differentiate two units even though still functionally
compatible.
For example: the units having P/Ns "3AL-34065-AAAA" and "3AL-34065-AABA"
are functionally compatible and, as regards the hardware settings, the hardware
settings paragraph (described hereafter) is applicable for both.
• a design & production series (change status): ICS,
The following table shows an example of evolution of "ANV P/N + ICS"
Table A-3 Example of ANV Part Number + ICS evolution
ANV CODE
P/N ICS
3AL 34422 AA AA 01
3AL 34422 AA AB 01
3AL 34422 AA AC 01
Note: The P/Ns used in this example have no correspondence with those of the
actual equipment part list!
In this example you can see that the production series is identified by the 'suffix + ICS'
in the ANV code.
Some of the possible positions of the labels indicating the unit's P/Ns and CS-ICS are
illustrated in Appendix A, “Labels affixed to the equipment” on page A-13.
As the Customer may have to manage many units of the same type (same Part Number)
but with different ICS, each hardware settings paragraph describes with possible different
parts the different setting options, according to all the possible P/N + ICSs. For this
purpose, when more than one setting versions are present, a table at the beginning of
the paragraph indicates the part to be used according to the corresponding 'suffix + ICS',
taking into account that:
– a change of the production series does not necessarily imply a change in the setting
options;
– a change of the ANV P/N suffix does not imply a handbook change;
– the SUFFIX and ICS must be meant as:
– from specified SUFFIX or ICS (included)
– to next SUFFIX or ICS (excluded) if listed
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA A-19
DRAFT
............................................................................................................................................................................................................................................................
EXAMPLE
Note: The P/Ns used in this example have no correspondence with those of the
actual equipment part list!
Taking into account the same unit of Table A-3, “Example of ANV Part Number + ICS
evolution” (p. A-19):
Supposing that the setting options valid for CS=01 are equal to those for CS=02, but
change for CS=03, the table at the beginning of the document 3AL 34422 AAAA
MSZZQ will be:
Part in the paragraph ANV P/N

FROM SUFFIX FROM ICS
1 --AA 01
2 --AC 01
If you have the unit identified by one of this identification data:
ANV CODE
P/N ICS
3AL 34422 AAAA 01
3AL 34422 AAAB 01
you will use the Part 1 of the paragraph for 3AL 34422 AAAA
If you have the unit identified by one of this identification data:
ANV CODE
P/N ICS
3AL 34422 AAAC 01
3AL 34422 AAAD 01
you will use Part 2 of the paragraph for 3AL 34422 AAAA
DRAFT
............................................................................................................................................................................................................................................................
A - 20 3AL 75131 AAAA
DRAFT
............................................................................................................................................................................................................................................................
NB.1 = The label is present on the p.b.a. component side

(p. A-15).
Figure A-3 Internal label for Printed Board Assembly

DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA A-21
DRAFT
............................................................................................................................................................................................................................................................
NB. 1 = The label is present on p.b.a. components side or rear side on the empty spaces.
(p. A-15).
Figure A-4 Back panel internal label

DRAFT
............................................................................................................................................................................................................................................................
A - 22 3AL 75131 AAAA
DRAFT
............................................................................................................................................................................................................................................................
The commercial code (10 digits) is silk-screened printing on the front panel label.
The position and size is defined in design phase.
(p. A-15).
Figure A-5 Labels on units with one top extraction handle

DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA A-23
DRAFT
............................................................................................................................................................................................................................................................
The commercial code (10 digits) is silk-screened printing on the front panel label.
The position and size is defined in design phase.
(p. A-15).
Figure A-6 Labels on units without extraction handle

DRAFT
............................................................................................................................................................................................................................................................
A - 24 3AL 75131 AAAA
DRAFT
............................................................................................................................................................................................................................................................
(p. A-15).
Figure A-7 XFP and SFP modules label

DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA A-25
DRAFT
............................................................................................................................................................................................................................................................
Figure A-8 Label identifying Unit, Optical assembly, Shelf, Back panel
Figure A-9 External label for unit identification (unit with two ejectors): P/N
Figure A-10 External label for unit/shelf identification - unit with ejector(s): CLEI
code
DRAFT
............................................................................................................................................................................................................................................................
A - 26 3AL 75131 AAAA
DRAFT
............................................................................................................................................................................................................................................................
Figure A-11 Label for Optical module XFP extended
Figure A-12 XFP module label

DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA A-27
DRAFT
............................................................................................................................................................................................................................................................
Figure A-13 SFP module label
Figure A-14 CE label
Figure A-15 WEEE label

DRAFT
............................................................................................................................................................................................................................................................
A - 28 3AL 75131 AAAA
Safety Norms & Equipment Labels General Maintenance Rules
DRAFT
............................................................................................................................................................................................................................................................
Figure A-16 China RoHS label
WARNING
CE, WEEE and China RoHS symbols can be in the same label or in different position of
the equipment.
General Maintenance Rules

General Maintenance Safety Rule 1
• Clean and degrease all peripheral surfaces (contact springs and connection points, etc.)
of shielded unit before insertion for replacement.
• Clean the dummy covers of the spare units as well.

Use the elasticized band (around the wrist) and the coiled cord joined connected with the
ground rack when you manipulate the equipment. This will reduce the risk of damage for
the electrostatic sensitive devices.

• Screw bolt the units to the subrack.
• Check that the equipment shields are positioned properly (dummy covers, ESD
connector protections, etc.).
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA A-29
Safety Norms & Equipment Labels General Maintenance Rules
DRAFT
............................................................................................................................................................................................................................................................
DRAFT
............................................................................................................................................................................................................................................................
A - 30 3AL 75131 AAAA
B Abbreviations
DRAFT
ABBREVIATION MEANING
A/D Add and Drop functionality
AFI Authority and Format Identifier
AIS Alarm Indication Signal
ALS Automatic Laser Shutdown
AMS proprietary Alcatel Maintenance Signal; there are
two types of AMS: AMSs (for legacy submarine
equipment) and AMSt (for legacy terrestrial
equipment)
APA Automatic Pre-emphasis Adjustment
APD Avalanche Photo Detector (photodiode
technology)
APS Automatic Protection switching
APSD Automatic Power ShutDown
AS Alarm Surveillance
ASAP Alarm Severity Assignment Profile
ASIC Application Specific Integrated Circuit
ATTD ATTendeD (Alarm storing)
BER Bit Error Rate
B&W Black and White
BOL Beginning of Life
CBR Constant Bit Rate
CDR Clock and Data Recovery CD-ROM Compact
Disk Read Only Memory
Ch Channel
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA B -1
Abbreviations
DRAFT
............................................................................................................................................................................................................................................................
CID Card IDentifier

CLEI Common Language Equipment Identification
Client-AIS proprietary Alcatel Maintenance Signal, defined
as a G.709 frame with all-ones in the OPU-
Payload and 0x8F code in the OPU payload-type
CLNP Connection Less Network Protocol
CPE Costumer Premises Equipment
CT Craft Terminal
DC_DC DC/DC Converter
DCC Data Communication Channel
DCN Data Communication network
DCU Dispersion Compensating Unit
DDM Digital Diagnostic Monitoring
DEMUX Demultiplexing
DTMF Dual Tone Modulation Frequency
DTV Decision Threshold voltage
DV Digital Video
DWDM Dense Wavelength Division Multiplex
EAM Electro Absorption Modulator
EC Equipment Controller
ECC Embedded Channel Communication
ECID Enhanced Card IDentifier
ECMA Standardizing information and communication
system (Formerly "European Computer
Manufacturers Association")
ECT Equipment Craft Terminal
ECID Extended Card IDentity
EDFA Erbium Doped Fiber Amplifier
EEPROM Electrically Erasable Programmable Read Only
Memory
EMC Electromagnetic compatibility
EMI Electromagnetic Interference
EML Equipment Management Layer
EOL End Of Life
DRAFT
............................................................................................................................................................................................................................................................
B-2 3AL 75131 AAAA
Abbreviations
DRAFT
............................................................................................................................................................................................................................................................
EOW Engineering Order Wire

ESC Equipment and Shelf Controller
ESD Electrostatic Discharges
ETSI European Telecommunication Standard Institute
EXP Expansion
FC Fiber Channel
FDI Forward Defect Indication
FEC Forward Error Correction
FPGA Field Programmable Gate Array
GbE Gigabit Ethernet
GCC Generic Communication Channel
HDLC High Level Data Link Control
HK House Keeping
HW Hardware
HWF Hardware Failure
IEC International Electrotechnical Commission
I/F Interface
ILM Integrated Laser Modulator
ILOS Input Loss Of Signal
IND INDeterminate
I/O Input/Output
IP Internet Protocol
IS-IS Intermediate System-to-Intermediate System
ISO International Standard Organization
ISPB Intra Shelf Parallel Bus
ISSB Intra Shelf Serial Bus
ITU_T International Telecommunication Union -
Telecommunication
LAN Local Area Network
LAPD Link Access Protocol D
LH Long Haul
LOF Loss Of Frame
LOS Loss Of Signal
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA B-3
Abbreviations
DRAFT
............................................................................................................................................................................................................................................................
LED Light Emitting Diode

LM Light Manager
LR Line Repeater
LSD Laser ShutDown
LT Line Terminal
MAC Medium Access Control
MMF Multi Mode Fiber
MS Multiplex Section
MZ Mach-Zehnder
NE Network Element
NDC Negative Dispersion Chromatic
NES Network Element Synthesis
NML Network Management Layer
NMS Network Management System
NNI Node Network Interface
NSAP Network Service Access Point
NTP Network Time Protocol
NURG Not URGent
OAC Optical Amplifier Card
OADM Optical Add and Drop Multiplexer
OBC On Board Controller
OCH Optical Channel
OH OverHead
OCHA Optical Channel Adaptation
ODU Optical channel Data Unit
OGPI Optical Generic Physical Interface
OMS Optical Multiplex Section
OMSA Optical Multiplex Section Adaptation
OPC Optical Protection Card
OS Operation System
OSC Optical Supervisory Channel
OSMC Optical Spectrum Monitoring Control
DRAFT
............................................................................................................................................................................................................................................................
B-4 3AL 75131 AAAA
Abbreviations
DRAFT
............................................................................................................................................................................................................................................................
O-SNCP Optical Sub-Network Connection Protection

OSNR Optical Signal Noise Ratio
OSPI Optical Generic Physical Interface
OTN Optical Transport Network
OTS Optical Transmission Section
OTU Optical channel Transport Unit
PDH Plesiochronous Digital Hierarchy
PDU Power Distribution Unit
PGE Programmable Gain Equalization
PIN Positive - Intrinsic - Negative (photodiode
technology)
PM Performance Monitoring
PMA Physical Medium Attachment
PMD Physical Medium Dependent
PVID Port Virtual IDentifier
Q3 Interface with Q3 Protocol
QECC interface with Q protocol for Embedded Control
Channel
QoS Quality of Service
RAM Random Access Memory
RDI Remote Defect Indication
RECT REmote Craft Terminal
RI Remote Inventory
RMGII Reduced Gigabit Media Independent Interface
R-OADM Reconfigurable Optical Add and Drop
Multiplexer
RPO Receiver Parameter Optimization
RS Regenerator Section
RS-AIS proprietary Alcatel Maintenance Signal, defined
as a SDH RS frame, with all ones except Frame
Alignment Word and B1 parity
RSOH Regenerator Section Overhead
RUM Replaceable Unit Missing
RUP Replaceable Unit Problem
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA B-5
Abbreviations
DRAFT
............................................................................................................................................................................................................................................................
RUTM Replaceable Unit Type Mismatch

RX Receiver
SAPI Source Dress Point Identifier
SBS Stimulated Brillouin Scattering
SLTE Submarine Line Terminal Equipment
SCP Serial Communication Problem
SD ShutDown
SDH Synchronous Digital Hierarchy
SFP Small Form Factor Pluggable
SMF Single Mode Fiber
SMSR Side Mode Suppression Ratio
SNCP Sub-Network Connection Protection
SPI Serial Peripheral Interface
SPV SuPerVision
SSF Server Signal Failure
SW Software
SWDL Software DownLoad
TCA Threshold Crossed Alarm
TCP Transmission Control Protocol
TCP/IP Transmission Control Protocol/Internet Protocol
TDM Time Division Multiplexing
TDF Total Dropped Frames
TIM Trace Identifier Mismatch
TimActDis TIM consequent actions disabled
TMN Telecommunication Management Network
TPD Transponder
TRCF Total Received Correct Frame
TRCO Total Received Correct Octet
TRSEF Total Received Service Errored Frames
(=CRC+alignment errors+undersize+oversize)
TRU Top Rack Unit
TTF Total Transmitted Frames
TTO Total Transmitted Octets
DRAFT
............................................................................................................................................................................................................................................................
B-6 3AL 75131 AAAA
Abbreviations
DRAFT
............................................................................................................................................................................................................................................................
TX Transmitter
UDC User Data Channel
UIC User Interface Card
ULH Ultra Long Haul
UNI User Node Interface
UR Unrepeatered Systems
URG URGent
USM User Service Manager
VHM Virtual Hardware Machine
VLAN Virtual Local Area Network
VLH Very Long Haul
VOA Variable Optical Attenuator
VSR Very Short Reach
WAN Wide Area Network
WIS Wan Interface Sublayer
WDM Wavelength Division Multiplexing
DRAFT
............................................................................................................................................................................................................................................................
3AL 75131 AAAA B-7
Abbreviations
DRAFT
............................................................................................................................................................................................................................................................
DRAFT
............................................................................................................................................................................................................................................................
B-8 3AL 75131 AAAA

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Alcatel-Lucent 1626LM

1626 LIGHT MANAGER | RELEASE 5.0

3AL 75131 AAAA

Copyright © 2007 Alcatel-Lucent. All Rights Reserved.

About this document

100 GHz grid supported configurations

50 and 100 GHz grid supported configurations

Multiplexing & Amplification Configurations

1626 LM physical generic shelf configuration

Units front view

Operation & Management Services

5 Dismantling & recycling

A Safety Norms & Equipment Labels

1 Product Configurations & Environment General Overview

5 Dismantling & recycling

A Safety Norms & Equipment Labels

1 Product Configurations & Environment General Overview

1-28 Optical amplification in Line Terminal configuration ............................................................... 1-41

3-5 O-SNCP: shelf configuration examples ..................................................................................... 3-19

5 Dismantling & recycling

5-8 Side coverplate removal ............................................................................................................. 5-11

A Safety Norms & Equipment Labels

How to use this document

Introduction to the equipment

• G.709/G.798 Optical Layer Management

Figure 1-1 Example of 1626 LM configurations in a WDM line

• Full C band tunable laser

Equipment Basic Configurations

Figure 1-2 Example of WDM line

50 GHz Grid Supported Configurations

Line Terminal (LT)

• OSCU providing NE(s) supervision

Figure 1-3 1626 LM Line Terminal configuration, 50 GHz grid

Example of a Long Haul Line Terminal (50 GHz grid)

Figure 1-4 Line Terminal - Long Haul - 50 GHz grid

Line Repeater (LR)

Figure 1-5 1626 LM Line Repeater configuration

Optical Reconfigurable Add & Drop Multiplexer (R-OADM)

Figure 1-6 R-OADM Configuration Example

As illustrated in Line Figure 1-6 the R-OADM consists in the following :

Optical Tunable Add & Drop Multiplexer (T-OADM)- Grade 2

The following figure illustrates a T-OADM configuration.

Figure 1-7 T-OADM Grade 2 Configuration Example

As illustrated in Line Figure 1-7 T-OADM configuration consists in the following:

• On the add path:

Optical Tunable Add & Drop Multiplexer (T-OADM) - Grade 3 or

The following figure illustrates a T-OADM configuration.

Figure 1-8 T-OADM Grade 3 Configuration Example

As illustrated in Line Figure 1-8 Y node configuration consists in the following:

• Up to 24 OADC1750 (8 per direction, optional)

Optical Add & Drop Multiplexer (OADM) repeater (OR)

• OSCU providing NE(s) supervision.

Figure 1-9 1626 LM OADM configuration on a 50 GHz grid

Back to back terminal

• OSCU providing NE(s) supervision.

Figure 1-11 1626 LM back-to-back terminal configuration

Example of a Long Haul Back-to-Back Terminal, 50 GHz Grid

Figure 1-12 Long Haul Back-to-Back Terminal, 50 GHz Grid

100 GHz grid supported configurations