Micropower Undervoltage Sensing Circuits: Semiconductor Technical Data
Micropower Undervoltage Sensing Circuits: Semiconductor Technical Data
Micropower Undervoltage Sensing Circuits: Semiconductor Technical Data
MICROPOWER
The MC34164 series are undervoltage sensing circuits specifically UNDERVOLTAGE
designed for use as reset controllers in portable microprocessor based
SENSING CIRCUITS
systems where extended battery life is required. These devices offer the
designer an economical solution for low voltage detection with a single SEMICONDUCTOR
external resistor. The MC34164 series features a bandgap reference, a TECHNICAL DATA
comparator with precise thresholds and built–in hysteresis to prevent erratic
reset operation, an open collector reset output capable of sinking in excess
of 6.0 mA, and guaranteed operation down to 1.0 V input with extremely low
standby current. These devices are packaged in 3–pin TO–226AA, 8–pin
SO–8 and Micro–8 surface mount packages.
P SUFFIX
Applications include direct monitoring of the 3.0 or 5.0 V MPU/logic power PLASTIC PACKAGE
supply used in appliance, automotive, consumer, and industrial equipment. CASE 29 Pin 1. Reset
• Temperature Compensated Reference (TO–226AA) 2. Input
3. Ground
• Monitors 3.0 V (MC34164–3) or 5.0 V (MC34164–5) Power Supplies 1
2
3
• Precise Comparator Thresholds Guaranteed Over Temperature
• Comparator Hysteresis Prevents Erratic Reset
• Reset Output Capable of Sinking in Excess of 6.0 mA
D SUFFIX
• Internal Clamp Diode for Discharging Delay Capacitor PLASTIC PACKAGE 8
ORDERING INFORMATION
Operating
Device Temperature Range Package
MC34164D–3
1.2 Vref SO–8
MC34164D–5
MC34164DM–3
TA = 0° to +70°C Micro–8
MC34164DM–5
Gnd 3 (4) MC34164P–3
TO–226AA
= Sink Only MC34164P–5
Positive True Logic MC33164D–3
SO–8
MC33164D–5
Pin numbers adjacent to terminals are for the 3–pin TO–226AA package. MC33164DM–3
Pin numbers in parenthesis are for the 8–lead packages. TA = –40° to +125°C Micro–8
MC33164DM–5
MC33164P–3
This device contains 28 active transistors. TO–226AA
MC33164P–5
Motorola, Inc. 1996 Rev 1
MOTOROLA ANALOG IC DEVICE DATA 1
MC34164 MC33164
MAXIMUM RATINGS
Rating Symbol Value Unit
Power Input Supply Voltage Vin –1.0 to 12 V
Reset Output Voltage VO –1.0 to 12 V
Reset Output Sink Current ISink Internally mA
Limited
RESET OUTPUT
Output Sink Saturation VOL V
(Vin = 2.4 V, ISink = 1.0 mA) – 0.14 0.4
(Vin = 1.0 V, ISink = 0.25 mA) – 0.1 0.3
Output Sink Current (Vin, Reset = 2.4 V) ISink 6.0 12 30 mA
Output Off–State Leakage IR(leak) µA
(Vin, Reset = 3.0 V) – 0.02 0.5
(Vin, Reset = 10 V) – 0.02 1.0
Clamp Diode Forward Voltage, Pin 1 to 2 (IF = 5.0 mA) VF 6.0 0.9 1.2 V
TOTAL DEVICE
Operating Input Voltage Range Vin 1.0 to 10 – – V
Quiescent Input Current Iin µA
Vin = 3.0 V – 9.0 15
Vin = 6.0 V – 24 40
NOTES: 1. Maximum package power dissipation limits must be observed.
2. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
3. Tlow = 0°C for MC34164 Thigh = + 70°C for MC34164
3. Tlow = – 40°C for MC33164 Thigh = + 85°C for MC33164
RESET OUTPUT
Output Sink Saturation VOL V
(Vin = 4.0 V, ISink = 1.0 mA) – 0.14 0.4
(Vin = 1.0 V, ISink = 0.25 mA) – 0.1 0.3
Output Sink Current (Vin, Reset = 4.0 V) ISink 7.0 20 50 mA
Output Off–State Leakage IR(leak) µA
(Vin, Reset = 5.0 V) – 0.02 0.5
(Vin, Reset = 10 V) – 0.02 2.0
Clamp Diode Forward Voltage, Pin 1 to 2 (IF = 5.0 mA) VF 0.6 0.9 1.2 V
TOTAL DEVICE
Operating Input Voltage Range Vin 1.0 to 10 – – V
Quiescent Input Current Iin µA
Vin = 5.0 V – 12 20
Vin = 10 V – 32 50
NOTES: 2. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
3. Tlow = 0°C for MC34164 Thigh = + 70°C for MC34164
3. Tlow = – 40°C for MC33164 Thigh = + 85°C for MC33164
RL = 82 k to Vin RL = 82 k to Vin
8.0 8.0
VO , OUTPUT VOLTAGE (V)
TA = 25°C TA = 25°C
6.0 6.0
4.0 4.0
2.0 2.0
0 0
0 2.0 4.0 6.0 8.0 10 0 2.0 4.0 6.0 8.0 10
Vin, INPUT VOLTAGE (V) Vin, INPUT VOLTAGE (V)
4.0 4.0
V O , OUTPUT VOLTAGE (V)
2.0 2.0
1.0 1.0
RL = 82 k to Vin RL = 82 k to Vin
TA = 25°C TA = 25°C
0 0
2.62 2.66 2.70 2.74 2.78 4.22 4.26 4.30 4.34 4.38
Vin, INPUT VOLTAGE (V) Vin, INPUT VOLTAGE (V)
2.68 4.28
2.60 4.20
– 50 – 25 0 25 50 75 100 125 – 50 – 25 0 25 50 75 100 125
TA, AMBIENT TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C)
TA = 25°C
40 40
I in, INPUT CURRENT ( µA)
TA = 25°C
30 30
TA = 0°C
20 20
TA = 70°C TA = 0°C
TA = 70°C
10 10
0 0
0 2.0 4.0 6.0 8.0 10 0 2.0 4.0 6.0 8.0 10
Vin, INPUT VOLTAGE (V) Vin, INPUT VOLTAGE (V)
TA = 0°C TA = 0°C
1.0 1.0
TA = 70°C TA = 70°C
0 0
0 4.0 8.0 12 16 20 0 4.0 8.0 12 16 20
VSink, SINK CURRENT (mA) ISink, SINK CURRENT (mA)
Figure 11. Clamp Diode Forward Current Figure 12. Reset Delay Time
versus Voltage (MC3X164–5 Shown)
32
Vin = 5.0 V to 4.0 V
Reset RL = 43 k
I F , FORWARD CURRENT (mA)
Vin = 0 V TA = 25°C
24 90%
TA = 25°C
Vin
5.0 V
16
4.0 V
Vin 43k
5.0V
8.0 4.0V Reset
10
%
Ref
0
0 0.4 0.8 1.2 1.6 5.0 µs/DIV
VF , FORWARD VOLTAGE (V)
2 (2) R
Power Reset Microprocessor
Supply
1 (1) Circuit
CDLY
1.2 Vref 1
tDLY = RCDLY In ǒ1 – Vth(MPU) Ǔ
3 (4) Vin
A time delayed reset can be accomplished with the addition of CDLY. For systems with extremely fast power
supply rise times (< 500 ns) it is recommended that the RCDLY time constant be greater than 5.0 µs. Vth(MPU) is
the microprocessor reset input threshold.
RH Test Data
Iin VH ∆Vth RH RL
2 (2) Vin (mV) (mV) (Ω) (kΩ)
RL
Power
Microprocessor 60 0 0 43
Supply
1 (1) Reset Circuit 103 1.0 100 10
123 1.0 100 6.8
160 1.0 100 4.3
155 2.2 220 10
4.3 RH 199 2.2 220 6.8
1.2 Vref VH ≈ + 0.06
RL 280 2.2 220 4.3
262 4.7 470 10
MC3X164–5 3 (4) ∆Vth(lower) ≈ 10 RH x 10 – 6 306 4.7 470 8.2
where: RH ≤ 1.0 kΩ 357 4.7 470 6.8
421 4.7 470 5.6
43 kΩ ≥ RL ≥ 4.3 kΩ
530 4.7 470 4.3
Comparator hysteresis can be increased with the addition of resistor RH. The hysteresis equation has been simplified and does not account for the change of input current
Iin as Vin crosses the comparator threshold (Figure 8). An increase of the lower threshold ∆Vth(lower) will be observed due to Iin which is typically 10 µA at 4.3 V. The
equations are accurate to ±10% with RH less than 1.0 kΩ and RL between 4.3 kΩ and 43 kΩ.
Figure 15. Voltage Monitor Figure 16. Solar Powered Battery Charger
1.0 k 2 (2)
2 (2)
Power
Supply 1 (1)
1 (1)
Solar
Cells
1.2 Vref
1.2 Vref
3 (4)
3 (4)
Figure 17. MOSFET Low Voltage Gate Drive Protection Using the MC3X164–5
VCC
RL
270 MTP3055EL
4.3V
2 (2)
1 (1)
3 (4) MC3X164–5
OUTLINE DIMENSIONS
P SUFFIX
PLASTIC PACKAGE
CASE 29–04
NOTES:
A (TO–226AA) 1. DIMENSIONING AND TOLERANCING PER ANSI
B
ISSUE AD Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
R IS UNCONTROLLED.
4. DIMENSION F APPLIES BETWEEN P AND L.
P DIMENSION D AND J APPLY BETWEEN L AND K
L MINIMUM. LEAD DIMENSION IS UNCONTROLLED
F IN P AND BEYOND DIMENSION K MINIMUM.
SEATING
PLANE K INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 0.175 0.205 4.45 5.20
B 0.170 0.210 4.32 5.33
C 0.125 0.165 3.18 4.19
X X D D 0.016 0.022 0.41 0.55
G F 0.016 0.019 0.41 0.48
G 0.045 0.055 1.15 1.39
H J H 0.095 0.105 2.42 2.66
J 0.015 0.020 0.39 0.50
V C K 0.500 ––– 12.70 –––
L 0.250 ––– 6.35 –––
SECTION X–X N 0.080 0.105 2.04 2.66
1 N P ––– 0.100 ––– 2.54
R 0.115 ––– 2.93 –––
N V 0.135 ––– 3.43 –––
D SUFFIX
PLASTIC PACKAGE
CASE 751–05
(SO–8)
ISSUE P
NOTES:
1. DIMENSIONS A AND B ARE DATUMS AND T IS A
–A– DATUM SURFACE.
M
Y14.5M, 1982.
8 5
J 3. DIMENSIONS ARE IN MILLIMETER.
M
PROTRUSION.
X 45 _
–B–
4X
G MILLIMETERS
DIM MIN MAX
M_ A 4.80 5.00
B 3.80 4.00
C 1.35 1.75
D 0.35 0.49
C
–T–
F
8X
K 0.10 0.25
0.25 (0.010) M T B S A S M 0_ 7_
P 5.80 6.20
R 0.25 0.50
OUTLINE DIMENSIONS
DM SUFFIX
PLASTIC PACKAGE
CASE 846A–02
(Micro–8)
–A– ISSUE B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
K –B– PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION D DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PIN 1 ID PER SIDE.
G
D 8 PL MILLIMETERS INCHES
0.08 (0.003) M T B S A S DIM MIN MAX MIN MAX
A 2.90 3.10 0.114 0.122
B 2.90 3.10 0.114 0.122
C ––– 1.10 ––– 0.043
D 0.25 0.40 0.010 0.016
SEATING
–T– PLANE G 0.65 BSC 0.026 BSC
H 0.05 0.15 0.002 0.006
0.038 (0.0015) C J 0.13 0.23 0.005 0.009
K 4.75 5.05 0.187 0.199
L 0.40 0.70 0.016 0.028
J L
H
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*MC34164/D*
8 ◊ MOTOROLA ANALOG IC DEVICE DATA
MC34164/D
This datasheet has been download from:
www.datasheetcatalog.com