EE-606:
Lecture 38: Modern MOSFET
Muhammad Ashraful Alam
Electrical and Computer Engineering
Purdue University
West Lafayette, IN USA
Fall 2007
NCN
www.nanohub.org
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topic map
Equilibrium DC Small Large Circuits
signal Signal
Diode
Schottky
BJT/HBT
MOS-
FET
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outline
Short channel effect
µ Cox
Control of threshold voltage
ID = (VG − Vth )
* 2
Mobility enhancement
Lch
Conclusion
REF: Chapter 19, SDF
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short channel effect: Vth roll-off
Vth
Channel length
QB qN AWT
Vth = 2φF − = 2φF +
Cox Cox
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short channel effect: punch-through
ln(ID) Short channel
Longer channel
VG
Recall similar problem with bipolar transistor
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physics of short channel effect
L L
L’ L’
QB , Long QB , Short
Vth , L = 2φF − Vth , Short = 2φF −
Cox
Cox
QB , long → − qN AWT − qN A × Z × WT
L + L'
QB , Short = 2
Z×L
QB , Long QB , short L + L'
∆Vth = − 1 − = −qN AWT
Cox QB , Long 2L
−qN AWT L '+ L
= 1−
Cox 2 L
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short channel effect
L − L'
2
(rJ + WS ) = W + rJ +
2
T
2
2
2WT L
L ' = L − 2rJ 1 + − 1
r
J rJ
L’
Ws
−qN AWT L '+ L
∆Vth = 1 − 2 L WT
Cox
−qN AWT rJ 2WT
= 1 + − 1
Cox L rJ
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how to make Vth roll-off small …
qN AWT rJ 2WT
Lmin = 1 + − 1
Cox α rJ
Vth !Shallow junction and geometry of transistors
laser annealing of junctions, FINFETs
! Reduced substrate doping NA
Consider WT and junction breakdown
!Thinner gate oxides
Consider tunneling current
! Higher gate dielectric
Consider bulk traps
Lmin Lch
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outline
Short channel effect
Control of threshold voltage
Mobility enhancement
Conclusion
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solution: ultra-thin body SOI
VG
t ox
EF
t Si
VG
NA
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solutions: silicon on insulator
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Example: FINFET, OmegaFET, X-FET
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quantization and control of fin-width
ε2 h2 n 2π 2
εn =
2m *t Si2
ε1
EC EG′ = EG + ε1 + ε1h
E(eV)
EF
ε1h EV
ε 2h Band-gap widening
Fluctuation in thickness
ε 3h
t Si
x
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how to make Vth roll-off small …
qN AWT rJ 2WT
Lc = 1 + − 1
Cox α rJ
(as small as possible)
Vth Shallow junction and geometry of transistors
laser annealing of junctions, FINFETs
Reduced substrate doping NA
Consider WT and junction breakdown
Thinner gate oxides
Consider tunneling current
Higher gate dielectric
Lch Consider bulk traps
Lc
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variability in Vth at low doping
QB qN DWT
Vth = 2φF − = 2φF −
Cox Cox
From IBM Journal of Res. And Tech.
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variability in threshold voltage
QB qN AWT
Vth = 2φF − = 2φF −
Cox Cox
µ Cox
ID = (VG − Vth* ) 2
Lch
If every transistor has different
Vth,and therefore different current,
circuit design becomes difficult
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Vth control by substrate bias
QB
Vth = ψ s − =ψ s + B ψ s
Cox
ψ s = 2φF
ψ s = 2φF − VBS
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Vth control by metal work-function
High-k/metal gate MOSFET
Vacuum level
qVbi
qχs
EC
qΦm
EF
Qi = Cox (VG − Vth ) EV
QB
Vth = −VFB + ψ s −
Cox qVbi = ( χ + Eg − ∆ p ) − Φ M
= qVFB
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how to make Vth roll-off small …
qN AWT rJ 2WT
Lc = 1+ − 1
κ oxε 0 α rJ
x0
Shallow junction
Vth laser annealing of junctions
Higher substrate doping NA
Consider WT and junction breakdown
Thinner gate oxides
Consider tunneling current
Higher gate dielectric
Consider bulk traps
Lc Lch
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tunneling current
ni2 − qVG β
J T = Qi (VG ) − e υth T ( E )
NA
ITRS
EC
T
EF
EG
EV
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how to make Vth roll-off small …
qN AWT rJ 2WT
Lc = 1+ − 1
κ oxε 0 α rJ
x0
High-k/metal gate MOSFET
Shallow junction and geometry of transistors
laser annealing of junctions, FINFET
Substrate doping NA
Consider WT and junction breakdown
Thinner gate oxides
Consider tunneling current
Higher gate dielectric
Consider bulk traps
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advantages of high-k dielectric …
High-k/metal gate MOSFET
qN AWT rJ 2WT µ Cox
Lc = 1+ − 1 ID = (VG − Vth* ) 2
κ oxε 0 α rJ
Lch
x0
Thicker oxide (x0) for same capacitance … … ensures the drive-current is not reduced
, but tunneling current is suppressed.
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outline
Short channel effect
Control of threshold voltage
µ Cox
ID = (VG − Vth )* 2
Mobility enhancement Lch
Conclusion
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Ge for PMOS, Si for NMOS
Takagi, TED 52, p.367, 2005
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basics of strain ..
Compressive biaxial strain
Enhances mobility
in the channel …
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biaxial strain to enhance mobilty
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biaxial strain to enhance mobilty
Adapted from Chang et. al, IEDM 2005.
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Uniaxial strain to enhance mobilty
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summary
1) Short channel effect is a serious concern for
MOSFET scaling.
2) Many novel solutions at the material, device, circuit
level have been proposed to reduce short channel
effect.
3) The success of these efforts are now reflected in
effective MOSFET channel lengths of 30 nm.
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