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ECE/ME/IE 485 Fall 2010: 0.02 N/M (Assume That The Spring Constants Are

This homework assignment involves calculating the capacitance and electrostatic force of a transverse comb drive MEMS device, repeating the calculations for a longitudinal comb drive, and proposing a two-mask, two-layer polysilicon process flow to fabricate a 3-link polysilicon chain structure attached at the outer links.

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Ivan Avramov
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44 views2 pages

ECE/ME/IE 485 Fall 2010: 0.02 N/M (Assume That The Spring Constants Are

This homework assignment involves calculating the capacitance and electrostatic force of a transverse comb drive MEMS device, repeating the calculations for a longitudinal comb drive, and proposing a two-mask, two-layer polysilicon process flow to fabricate a 3-link polysilicon chain structure attached at the outer links.

Uploaded by

Ivan Avramov
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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ECE/ME/IE 485

Fall 2010

HW #3

1. As shown in the following figure, five sets of fingers are engaged with their comb fingers
with a width of l0 = 5 µm. The thickness of the movable fingers is t = 10µm. The initial
value of g = 15 µm and the initial value of d = 1 µm. L = 30 µm. The spring constants
for the suspension beams are k1= k2 = 0.02 N/m (assume that the spring constants are
uniform for both horizontal and vertical directions). Ignore the fringe capacitance.

anchor anchor

Axis of motion l0
k1 k2

+
V_ L

a) Determine the capacitance for this transverse comb drive device.


b) Calculate the electrostatic force on a capacitor (disregard the force due to the beams)
for V = 50 V.

2. Repeat the above problem if the device was to operate in longitudinal direction
(axis of motion in vertical direction).
3. Describe a fabrication process flow for making a MEMS chain structure shown
below out of polysilicon. The chain should have 3 links, and be attached to the
wafer surface for the outer two links. Use 2 layers of polysilicon, and 2 layers of
sacrificial SiO2.
Show: a. Design of photomask (top view) for process steps that require a
photomask. b. Cross section diagram for each fabrication step like Fig. 11.11 in
the Liu book.

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