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    APDL Code For Thermal Analysis of PCB

    Uploaded by

    ASIM RIAZ
    This document defines a thermomechanical analysis simulation in ANSYS. It specifies the geometry, assigns material properties to different regions, applies boundary conditions and a temperature load, performs the analysis, and post-processes results including stress along defined paths. Rectangular areas made of four materials are modeled. Elastic properties, thermal expansion coefficients and regions are defined. Symmetry and fixed boundary conditions are applied. Temperature is increased and stresses are plotted on paths.

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    © All Rights Reserved
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    APDL Code For Thermal Analysis of PCB

    Uploaded by

    ASIM RIAZ
    86 views3 pages
    This document defines a thermomechanical analysis simulation in ANSYS. It specifies the geometry, assigns material properties to different regions, applies boundary conditions and a temperature load, performs the analysis, and post-processes results including stress along defined paths. Rectangular areas made of four materials are modeled. Elastic properties, thermal expansion coefficients and regions are defined. Symmetry and fixed boundary conditions are applied. Temperature is increased and stresses are plotted on paths.

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    ANSYS

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    APDL code for thermal analysis of pcb

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    This document defines a thermomechanical analysis simulation in ANSYS. It specifies the geometry, assigns material properties to different regions, applies boundary conditions and a temperature load, performs the analysis, and post-processes results including stress along defined paths. Rectangular areas made of four materials are modeled. Elastic properties, thermal expansion coefficients and regions are defined. Symmetry and fixed boundary conditions are applied. Temperature is increased and stresses are plotted on paths.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    86 views3 pages

    APDL Code For Thermal Analysis of PCB

    Uploaded by

    ASIM RIAZ
    This document defines a thermomechanical analysis simulation in ANSYS. It specifies the geometry, assigns material properties to different regions, applies boundary conditions and a temperature load, performs the analysis, and post-processes results including stress along defined paths. Rectangular areas made of four materials are modeled. Elastic properties, thermal expansion coefficients and regions are defined. Symmetry and fixed boundary conditions are applied. Temperature is increased and stresses are plotted on paths.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
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    This tutorial demonstrates how to perform a thermomechanical analysis using ANSYS to analyze stress in a multi-material structure subjected to a temperature change. Four materials were modeled representing a substrate, die attach, silicon, and molding compound with different elastic moduli and coefficients of thermal expansion defined.

    Four materials were modeled in the analysis: a substrate with an elastic modulus of 22 GPa, die attach with 7.4 GPa, silicon with 163 GPa, and molding compound with 15 GPa. Each material was defined with a Poisson's ratio and coefficient of thermal expansion.

    Rectangular areas were defined to represent different materials. A mapped mesh was applied and material properties were assigned based on element selection. Displacement boundary conditions were applied on the bottom and left edges to constrain the model. A uniform temperature of 30C was then applied.

    !!! Reverse Video !!!

    /RGB,INDEX,100,100,100, 0
    /RGB,INDEX, 80, 80, 80,13
    /RGB,INDEX, 60, 60, 60,14
    /RGB,INDEX, 0, 0, 0,15
    /REPLOT

    FINISH
    /CLEAR
    /FILNAME,Tutorial 8.3
    /TITLE, Thermomechanical Analysis
    /PREP7

    !!! Element properties !!!


    ! Set element type to PLANE182
    ! Set element behavior to plane strain

    !!! Material properties !!!


    ! Material 1 - Substrate
    MP, EX, 1, 22E9 ! Elastic modulus of material #1 is 22e9
    MP, PRXY, 1, 0.39 ! Poisson's ratio of material #1 is 0.39
    MP, ALPX, 1, 18E-6 ! Coeff. thermal expansion of mat #1 is 18e-6

    ! Material 2 - Die-attach
    MP, EX, 2, 7.4E9 ! Elastic modulus of material #2 is 7.4e9
    MP, PRXY, 2, 0.4 ! Poisson's ratio of material #2 is 0.4
    MP, ALPX, 2, 52E-6 ! Coeff. thermal expansion of mat #2 is 52e-6

    ! Material 3 - Silicon
    MP, EX, 3, 163E9 ! Elastic modulus of material #3 is 163e9
    MP, PRXY, 3, 0.278 ! Poisson's ratio of material #3 is 0.278
    MP, ALPX, 3, 2.6E-6 ! Coeff. thermal expansion of mat #3 is 2.6e-6

    ! Material 4 - Molding Compound


    MP, EX, 4, 15E9 ! Elastic modulus of material #4 is 15e9
    MP, PRXY, 4, 0.25 ! Poisson's ratio of material #4 is 0.25
    MP, ALPX, 4, 16E-6 ! Coeff. thermal expansion of mat #4 is 16e-6

    !!! Geometry !!!


    RECTNG, 0, 5e-3, 0, 2E-3 ! Area #1
    RECTNG, 5e-3, 7.5e-3, 0, 2E-3 ! #2
    RECTNG, 7.5e-3, 10e-3, 0, 2E-3 ! #3
    RECTNG, 0, 5e-3, 2E-3, 2.1E-3 ! #4
    RECTNG, 5e-3, 7.5e-3, 2E-3, 2.1E-3 ! #5
    RECTNG, 0, 5e-3, 2.1E-3, 3.1E-3 ! #6
    RECTNG, 5e-3, 7.5e-3, 2.1E-3, 3.1E-3 ! #7
    RECTNG, 0, 5e-3, 3.1E-3, 4.1E-3 ! #8
    RECTNG, 5e-3, 7.5e-3, 3.1E-3, 4.1E-3 ! #9

    ! Glue all areas

    !!! Meshing !!!


    ! Specify mapped meshing to be used
    ! Mesh all areas

    !!! Define Material Regions !!!


    /PNUM,AREAS,1 ! Turn on area numbering
    APLOT ! Plot areas
    ! Select areas associated with molding compound (Areas #14-
    17)
    ESLA,S ! Select elements associated with selected areas
    EMODIF,[...] ! Modify attributes of all selected elements, assigning
    material #4

    ! Select area associated with die-attach (Area #11)


    ESLA,S ! Select elements associated with selected area
    EMODIF,[...] ! Modify attributes of all selected elements, assigning
    material #2

    ! Select area associated with silicon (Area #13)


    ESLA,S ! Select elements associated with selected area
    EMODIF,[...] ! Modify attributes of all selected elements, assigning
    material #3

    ! Select everything

    !!! Boundary conditions !!!


    ! Select nodes at line of symmetry (x=0)
    ! Apply DOF constraint on all selected nodes in x-
    displacement

    ! Reduce selection to bottom-left node (y=0)


    ! Apply DOF constraint on all selected nodes in y-
    displacement

    TUNIF,[...] ! Apply a uniform temperature of 30 (degrees C)

    ! Select everything

    !!! Solution !!!


    ! Enter solution processor
    ! Solve
    ! Exit solution processor

    !!! Postprocessing !!!


    ! Enter postprocessor

    ! Plot Deformed and Undeformed edge


    ! Plot nodal stress in y-direction
    ! Plot nodal stress in xy-plane (shear stress)

    !!! PATHS SECTION (EXTRA CREDIT) !!!


    /EOF ! REMOVE THIS LINE ONCE YOU REACH THIS POINT !
    PATH,V1,[...] ! Create path V1
    PPATH,[...] ! Define point 1 at location (x,y) = (5e-3,4.1e-3)
    PPATH,[...] ! Define point 2 at location (x,y) = (5e-3,0)

    PATH,V2,[...] ! Create path V2


    PPATH,[...] ! Define point 1 at location (x,y) = (2.67e-3,4.1e-3)
    PPATH,[...] ! Define point 2 at location (x,y) = (2.67e-3,0.0)

    PATH,V2 ! Activate (recall) Path V2


    PDEF,SY_V2,[...] ! Map onto path V2 - y-component of stress
    PDEF,SXY_V2,[...] ! Map onto path V2 - xy-component of stress
    PDEF,SEQV_V2,[...] ! Map onto path v2 - von mises (equivalent) stress

    PLPATH,[...] !Plot path v2 items (y-stress, xy-stress, von mises stress)


    ! Repeat for PATH V1
    PATH,V1 ! Activate (recall) Path V1
    PDEF,SY_V1,[...] ! Map onto path V1 - y-component of stress
    PDEF,SXY_V1,[...] ! Map onto path V1 - xy-component of stress
    PDEF,SEQV_V1,[...] ! Map onto path v1 - von mises (equivalent) stress

    PLPATH,[...] !Plot path v1 items (y-stress, xy-stress, von mises stress)

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