Tda 8563 Q
Tda 8563 Q
Tda 8563 Q
DATA SHEET
TDA8563Q
2 × 40 W/2 Ω stereo BTL car radio
power amplifier with diagnostic
facility
Product specification 2001 Feb 21
Supersedes data of 1996 Jan 08
File under Integrated Circuits, IC01
Philips Semiconductors Product specification
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME DESCRIPTION VERSION
TDA8563Q DBS13P plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm) SOT141-6
2001 Feb 21 2
Philips Semiconductors Product specification
BLOCK DIAGRAM
V P1 VP2
handbook, full pagewidth 3 10
1 mute switch Cm
input 1
TDA8563Q
VA 4
output 1A
2.3
kΩ
PROTECTIONS
Load dump
power stage Soar
20.7 kΩ Thermal
Short - circuit
mute switch Cm Reverse polarity
VA 6
30 output 1B
kΩ
2.3
kΩ
power stage
20.7 kΩ VP
11
mode switch
stand-by
switch
stand-by
reference
VA voltage
15 kΩ
x1
mute DIAGNOSTIC 12 diagnostic
switch INTERFACE output
15 kΩ
mute
reference
voltage
13 mute switch Cm
input 2
9
VA output 2B
2.3
kΩ
power stage
20.7 kΩ
mute switch Cm
VA 7
output 2A
30
kΩ
2.3
kΩ
input
reference power stage
voltage 20.7 kΩ
2 5 8
GND1 GND2 MLB664
ground (signal)
power ground (substrate)
2001 Feb 21 3
Philips Semiconductors Product specification
SYMBOL PIN DESCRIPTION The TDA8563Q contains two identical amplifiers and can
be used for bridge applications. The gain of each amplifier
IN 1 1 input 1
is fixed at 26 dB. Special features of the device are as
GND(S) 2 signal ground follows.
VP1 3 supply voltage 1
OUT 1A 4 output 1A Mode select switch (pin 11)
GND1 5 power ground 1 • Standby: low supply current
OUT 1B 6 output 1B • Mute: input signal suppressed
OUT 2A 7 output 2A • Operating: normal on condition.
GND2 8 power ground 2 Since this pin has a very low input current (<40 µA), a low
OUT 2B 9 output 2B cost supply switch can be applied.
VP2 10 supply voltage 2 To avoid switch-on plops, it is advised to keep the amplifier
MODE 11 mode switch input in the mute mode during ≥100 ms (charging of the input
VDIAG 12 diagnostic output capacitors at pin 1 and pin 13).
IN 2 13 input 2 This can be achieved by:
• Microprocessor control
• External timing circuit (see Fig.7).
OUT 2A 7 TDA8563Q
GND2 8
OUT 2B 9
MGA721
handbook, halfpageVO
VP2 10
0
MODE 11
V DIAG 12
V12
IN 2 13
VP
MLB665
0
t
2001 Feb 21 4
Philips Semiconductors Product specification
t
short-circuit over the load
V12
20 ms
VP
t
50 µs
2001 Feb 21 5
Philips Semiconductors Product specification
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VP supply voltage
operating − 18 V
non-operating − 30 V
load dump protection during 50 ms; tr ≥ 2.5 ms − 45 V
Vpsc AC and DC short-circuit safe voltage − 18 V
Vrp reverse polarity − 6 V
IOSM non-repetitive peak output current − 10 A
IORM repetitive peak output current − 7.5 A
Ptot total power dissipation − 60 W
Tstg storage temperature −55 +150 °C
Tamb ambient temperature −40 +85 °C
Tvj virtual junction temperature − 150 °C
THERMAL CHARACTERISTICS
output 1 output 2
handbook, halfpage
virtual junction
0.2 K/W
MBA624
case
2001 Feb 21 6
Philips Semiconductors Product specification
DC CHARACTERISTICS
VP = 14.4 V; Tamb = 25 °C; measured in Fig.6; unless otherwise specified.
Notes
1. The circuit is DC adjusted at VP = 6 to 18 V and AC operating at VP = 8.5 to 18 V.
2. At 18 V < VP < 30 V the DC output voltage ≤1⁄2VP.
2001 Feb 21 7
Philips Semiconductors Product specification
AC CHARACTERISTICS
VP = 14.4 V; RL = 2 Ω; f = 1 kHz; Tamb = 25 °C; measured in Fig.6; unless otherwise specified.
Notes
1. Dynamic distortion detector active.
2. Frequency response externally fixed.
3. Vripple = Vripple(max) = 2 V (p-p); Rs = 0 Ω.
4. B = 20 Hz to 20 kHz; Rs = 0 Ω.
5. B = 20 Hz to 20 kHz; Rs = 10 kΩ.
6. B = 20 Hz to 20 kHz; independent of Rs.
7. Po = 25 W; Rs = 10 kΩ.
8. Vi = Vi(max) = 1 V (RMS).
2001 Feb 21 8
Philips Semiconductors Product specification
AC CHARACTERISTICS
VP = 14.4 V; RL = 4 Ω; f = 1 kHz; Tamb = 25 °C; measured in Fig.6; unless otherwise specified.
2001 Feb 21 9
Philips Semiconductors Product specification
mode switch VP
14.4 V
handbook, full pagewidth
100 2200
nF µF
11 3 10
470 nF
1
input 1
4
30 RL
kΩ
VP
2
ground (signal) TDA8563Q 10 kΩ (1)
12 diagnostic
output
reference
voltage
470 nF
13
input 2 9
30
kΩ RL
5 8
MLB666
(1) To avoid high energy switching pulses which can feedback to the inputs it is advisable to ensure that the value of the resistor at pin 12 is ≥10 kΩ.
2001 Feb 21 10
Philips Semiconductors Product specification
Diagnostic output
Special care must be taken in the printed-circuit board
layout to separate pin 12 from pin 1 and pin 13, to
minimize the crosstalk between the diagnostic output and
VP the inputs.
handbook, halfpage
MLB667
10 2
handbook, full pagewidth
THD
(%)
10
(1)
10 1
(2)
(3)
10 2
10 2 10 1 1 10 Po (W) 10 2
(1) f = 10 kHz.
(2) f = 1 Hz.
(3) f = 100 Hz.
2001 Feb 21 11
Philips Semiconductors Product specification
MGA905
70
handbook,
P full pagewidth
o
(W)
60
50 (1)
40
(2)
30
(3)
20
10
0
8 10 12 14 16 VP (V) 18
MLB668
33
handbook, full pagewidth
Po
(W)
31
29
27
25
23
10 10 2 10 3 10 4 f (Hz) 10 5
2001 Feb 21 12
Philips Semiconductors Product specification
MLB669
1
handbook, full pagewidth
THD
(%)
10 1
(1)
(2)
(3)
10 2
10 10 2 10 3 10 4 f (Hz) 10 5
(1) Po = 0.1 W.
(2) Po = 1 W.
(3) Po = 10 W.
MLB670
50
handbook, full pagewidth
SVRR
(dB)
60
(1)
(2)
70
80
10 10 2 10 3 10 4 f (Hz) 10 5
(1) On condition.
(2) Mute condition.
2001 Feb 21 13
Philips Semiconductors Product specification
MLB671
40
handbook, full pagewidth
α cs
(dB)
50
60
70
10 10 2 10 3 10 4 f (Hz) 10 5
MGA909
150
handbook, full pagewidth
Iq
(mA)
130
110
90
70
50
8 10 12 14 16 VP (V) 18
2001 Feb 21 14
Philips Semiconductors Product specification
PACKAGE OUTLINE
DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm) SOT141-6
non-concave
Dh
x
Eh
d A2
j E
L3
L Q
c v M
1 13
Z e1 w M m e2
bp
e
0 5 10 mm
scale
17.0 4.6 0.75 0.48 24.0 20.0 12.2 6 3.4 12.4 2.4 2.1 2.00
mm 10 3.4 1.7 5.08 4.3 0.8 0.25 0.03
15.5 4.4 0.60 0.38 23.6 19.6 11.8 3.1 11.0 1.6 1.8 1.45
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
97-12-16
SOT141-6
99-12-17
2001 Feb 21 15
Philips Semiconductors Product specification
Suitability of through-hole mount IC packages for dipping and wave soldering methods
SOLDERING METHOD
PACKAGE
DIPPING WAVE
DBS, DIP, HDIP, SDIP, SIL suitable suitable(1)
Note
1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
2001 Feb 21 16
Philips Semiconductors Product specification
PRODUCT
DATA SHEET STATUS DEFINITIONS (1)
STATUS
Objective specification Development This data sheet contains the design target or goal specifications for
product development. Specification may change in any manner without
notice.
Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be
published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.
Product specification Production This data sheet contains final specifications. Philips Semiconductors
reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
Note
1. Please consult the most recently issued data sheet before initiating or completing a design.
DEFINITIONS DISCLAIMERS
Short-form specification The data in a short-form Life support applications These products are not
specification is extracted from a full data sheet with the designed for use in life support appliances, devices, or
same type number and title. For detailed information see systems where malfunction of these products can
the relevant data sheet or data handbook. reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
Limiting values definition Limiting values given are in
for use in such applications do so at their own risk and
accordance with the Absolute Maximum Rating System
agree to fully indemnify Philips Semiconductors for any
(IEC 60134). Stress above one or more of the limiting
damages resulting from such application.
values may cause permanent damage to the device.
These are stress ratings only and operation of the device Right to make changes Philips Semiconductors
at these or at any other conditions above those given in the reserves the right to make changes, without notice, in the
Characteristics sections of the specification is not implied. products, including circuits, standard cells, and/or
Exposure to limiting values for extended periods may software, described or contained herein in order to
affect device reliability. improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
Application information Applications that are
the use of any of these products, conveys no licence or title
described herein for any of these products are for
under any patent, copyright, or mask work right to these
illustrative purposes only. Philips Semiconductors make
products, and makes no representations or warranties that
no representation or warranty that such applications will be
these products are free from patent, copyright, or mask
suitable for the specified use without further testing or
work right infringement, unless otherwise specified.
modification.
2001 Feb 21 17
Philips Semiconductors Product specification
NOTES
2001 Feb 21 18
Philips Semiconductors Product specification
NOTES
2001 Feb 21 19
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Printed in The Netherlands 753503/03/pp20 Date of release: 2001 Feb 21 Document order number: 9397 750 07882