Thermal Analysis of Pin Fin With Different Shape Forms Using ANSYS PDF
Thermal Analysis of Pin Fin With Different Shape Forms Using ANSYS PDF
Thermal Analysis of Pin Fin With Different Shape Forms Using ANSYS PDF
Abstract:
Pin fins are most commonly used in heat exchanging microelectronic devices such as computer CPU heat sinks, and semiconductor
devices power transistors and optoelectronic devices such as lasers and light emitting diodes (LEDs). The objective of this study is to
examine the effects of the fin shape of the heat sink on the thermal performance. The various types of Perforation on pin fin are used
for effective heat transfer rate under constant heat flux condition. Cooling is done by forced convection utilizing fan. Air-based
cooling technologies have been widely employed for thermal management of electronics. For low power CPUs, aluminium heat sinks
are often capable of dissipating the heat. If better performance is required, copper heat sink may be used for higher heat sink
performance, but aluminium is used because of its lower weight and lower cost than copper. This numerical simulation is
accomplished by 3D modeling and analysis using CATIA and ANSYS, 12.0. This will help in finding out the new fin topologies with
heat transfer characteristics that will do better than conventional plane fin. The main goal is to increase the heat transfer rate through
the fin surface and to decrease material cost. The effect of different shape forms of pin fins on the overall performance of the heat sink
studied in this paper.
Keywords: pin fin apparatus, perforated pin fin, fin efficiency, fin effectiveness.
1. INTRODUCTION that the rectangular shaped extended surfaces shows the high
rate of heat transfer when compared to other extensions at same
The design of heat sink device is predicated upon optimizing the length. Kang Hiechan[4], has made many experiments to find
opposite demands of thermal dissipation rate. Rapid the fin efficiency and concluded that the efficiency of fin is
development in manufacturing technology and consumer useful when the value of NTU is zero otherwise the fin
demands has driven the electronic technology towards increasing efficiency is high when the NTU is high and is used in air
the functionality and compactness of the components. The conditioning systems. Shivdas S Kharche[5], explained that the
miniaturization of electronics results in higher rate of power when a notch is provided on the surface of fin with a rectangular
dissipation per unit volume. Thus effective thermal management shape the fin supports for much heat transfer and compared the
becomes ever more critical to maintain the operation temperature heat transfer rate of fins by changing the material from
which would ensure the efficiency and reliability of the Aluminum to copper and found that copper shows much heat
electronic components [1]. Pin fins are widely used to enhance transfer value than aluminum. Sandhya Mirapalli[6], had made
forced convection heat transfer across various industries, finding a conclusion that for a triangular fin when the length is increased
application in turbine blade trailing edges, electronics cooling, the heatflow percentage also increases at constant base
and broadly for compact heat exchange. Increasing temperature compared to rectangular fin. I.Lakshmi Anusha[7],
miniaturization of high speed multifunctional electronics concluded that total weight of the system made of splayed pin
demands ever more stringent thermal management [2]. The fins can be reduced to the minimum level by using the advanced
present work investigates analyses the use of perforated pin fins composite materials like polyphenylene sulphide (PPS), carbon
to enhance the rate of heat transfer in these devices. In particular, foam, graphite epoxy at the same thermal inputs. Zhang, H.S[8],
the effects of the number of perforations and the diameter of resulted that a fabric heat sink temperature distribution is so
perforation on each pin are studied. nearer to common pin fin heat sink but the temperature decreases
in axial direction by increasing the pin fin length. Sampath S
2. LITERATURE SURVEY S[9], compared the temperature distribution of a cylindrical
element at various points is carried out by providing the thermal
Most studies that have demonstrated the beneficial conductivity and heat transfer coefficient and with prescribed
effects of perforations on the rate of heat transfer in pin fin boundary conditions and analyzed with the help of simulation
arrays have used only a single perforation per pin. The logical software and DOT NET software[12] and the results are almost
extremis of this parameter is the metallic foam-like porous pins. equal expect at the middle of the specimen it is just deviated.
Indeed, numerical simulations, e.g. by Pradeep singh[3], stated Amol B. Dhumne[10], resulted that to achieve high thermal
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performance the cylindrical perforated pin fins are used they 6. Results
leads to high heat transfer than the cylindrical pin fins. M. P.
Shah[11], compared the study of cylindrical pin fin was done by 4.3.1 ENGINEERING DATA
changing the material conductivity and heat transfer coefficient Use the Engineering data cell with Mechanical systems or the
for copper ,AA1100,AA2011 materials[13] and concluded that Engineering data component system to define or access material
the heat transfer rate increases when thermal conductivity of models for use in an analysis. Double click the engineering data
material increases. cell, or right mouse click and choose EDIT from the context
menu to display the engineering data workspace to define
3. ANSYS material data. For more information see engineering data.
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shown in the bottom left side box. The properties of the material
and the solid can be changed based on the results that are to be
attained. The meshing can be generated by right mouse click on
the mesh option in the left side toolbox Click on the generate
mesh option. The system takes a few seconds to generate the
required mesh.
4.3.3 MODEL/MESH:
The Model cell in the Mechanical application analysis systems
or the Mechanical model component system is associated with
the Model branch in the Mechanical application and affects the
definition of the geometry, coordinate systems, connections and
mesh branches of the model definition.
The Mesh cell in the Steady State Thermal analysis systems or
the Mesh component system is used to create a mesh using the
Meshing application. It can also be used to import an existing
mesh file.
EDIT:
Launches the appropriate Model or Mesh application (the
mechanical application, meshing etc).
4.3.4 SETUP:
Use the Setup cell to launch the appropriate application for that
system. You will define your loads, boundary conditions, and
otherwise configure your analysis in the application. The data
from the application will then be incorporated in the project in
ansys workbench, including connections between systems. For
the mechanical application systems, you will see the following
setup options, in addition to the common options.
EDIT:
Now the generated model has to be meshed in order to get Launches the mechanical application with the geometry loaded
appropriate results. The left side box outline is having options and with cells mapped to their respective tree locations in the
mainly geometry, mesh, steady state thermal etc. The material mechanical applications. In this module the boundary conditions
can be again selected at the geometry option. The aluminium are to be defined. We are considering the steady state thermal
material will be available at the geometry. The boundary analysis in which the temperature values are to be specified for
conditions can be given according to the required analysis. Now the thermal analysis There are two types of boundary conditions
right click on the geometry to get an option called part. Now in this thermal analysis. First one is the temperature boundary
click on the part so that the required material can be selected as condition and the second one is the convection boundary
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condition. Now right mouse click on the steady state thermal
option which is available in the left side toolbox. Click on insert
and then select the temperature.
IMPORT SOLUTION:
Displays the open dialog, where you can specify the solver
results file to load. When the results file is loaded, the system
will display only the solution cell and the results cell.
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After inserting temperature, right click on it and select evaluate defining the path, insert temperature from the solution option
all results. The temperature distribution is shown from the source available in the left side toolbox. Right mouse click on the
to the tip of the fin. The minimum temperature at the end temperature and then select evaluate all results. The required
indicates the heat transfer rate that has been taken place. The path will be generated as shown in the graphic window below.
temperature of the fin decreases if the heat transfer increases.
4.3.6 RESULTS:
After the evaluation of temperature distribution along the length
of the fin, a path can be defined to analyze the variation in the
temperature from source to the free end of the fin. Hence to
define the path, construction geometry is to be considered. Now
right mouse click on the model and then click insert. There select
the construction geometry option. 5. TEMPERATURE DISTRIBUTION FOR DIFFERENT
MATERIALS
Now in this graphic window, the required path can be defined Figure.1. Temperature Distribution for Copper
based on the given boundary conditions. Click on construction
geometry, then select the path option. Here we require a path
from the source to the free end of the fin. After the selection of
path, the graphic window shows options where the required path
can be defined.
We need to define the path based on two points i.e., the source
and the end of the fin. Now select the first point at the source
and then click apply. Again select second point at the free end of
the pin fin and then click apply. To generate the required path,
we have to insert temperature in the solution option. After Figure.3. Temperature Distribution for Brass
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Figure.4. Temperature Distribution for Stainless Steel Figure.7. Temperature Distribution for plane solid
500
Thermal Conductivity w/m-k
400
300
200
100
0
copper aluminium brass stainless
steel
Figure.8. Temperature varying along length of plane solid
Different materials
6.2 SOLID WITH PERPENDICULAR HOLES (S2)
Figure.5. Thermal conductivity of different materials
From the above temperature distribution analysis of different
materials copper have highest heat sink performance than the
other materials, but aluminium heat sinks are often capable of
dissipating the heat, because of its lower weight and lower cost
than copper.
ALUMINIUM:
AluminIum is a chemical element in the group with symbol Al
and its atomic number is 13.It is a silvery white, soft,
nonmagnetic, ductile metal. AluminIum is the third most
abundant element (after oxygen and silicon).The chief ore of
Aluminum is Bauxite. Its low density, excellent corrosion
Figure.9. Cad model for solid with perpendicular holes (P.H)
resistance, good thermal and electrical conductivity etc are the
Description of Solid:
other good properties. In the present work an Aluminium pin fin
of diameter 12 mm and the length of 135 mm is used.
Length = 135mm
Diameter = 12mm
6. RESULTS AND DISCUSSIONS
Diameter for perpendicular holes = 3mm
6.1 PURE SOLID (S1)
No. of Perpendicular Holes = 4
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6.4 SOLID WITH PERPENDICULAR HOLES AND
THROUGH WHOLE OF ONE BY TWO LENGTH (S4)
Figure.15. Cad model for solid with P.H and axial hole of
one by two length.
Description of Solid:
Length = 135mm
Diameter = 12mm
Diameter of the Perpendicular Holes = 3mm
No. of perpendicular holes = 4
Length of the Through Hole = 67.5mm
Figure.12. Cad model for solid with P.H and axial hole of one
Diameter of the Through Hole = 6mm
by third length.
Description of Solid:
Length = 135mm
Diameter = 12mm
Diameter of the Perpendicular holes = 3mm
No. of Perpendicular Holes = 4
Length of the Through Hole = 45mm
Diameter of the Through Hole = 6mm
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Table 1: Heat transfer coefficient and Heat transfer rate for various pin fin configurations
Heat transfer
Velocity of air Heat transfer rate Maximum Temp.
Profile Heat Input (watts) coefficient, h
(m/s) 2 (watts) (oC)
(w/m k)
Plane solid 80 0.914 28.32 8.32 105
Solid with P.H 80 0.914 28.328 s8.40 103.8
Solid with P.H and
A.H of one by 80 0.914 28.334 9.12 102.6
third length
Solid with P.H and
A.H of one by two 80 0.914 28.428 9.89 101.2
length
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