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This document provides a summary of high-speed digital design techniques. It covers topics such as frequency and time, transmission lines, ground planes, terminations, vias, power systems, connectors, ribbon cables, clock distribution, and clock oscillators. The intended audience is engineers designing high-speed digital circuits and systems. Key concepts discussed include propagation delay, crosstalk, impedance matching, rise time, jitter, termination, decoupling, and signal integrity. Examples and calculations are provided to illustrate techniques for minimizing these effects and optimizing circuit performance.

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Prasad Mhsm
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45 views5 pages

Toc

This document provides a summary of high-speed digital design techniques. It covers topics such as frequency and time, transmission lines, ground planes, terminations, vias, power systems, connectors, ribbon cables, clock distribution, and clock oscillators. The intended audience is engineers designing high-speed digital circuits and systems. Key concepts discussed include propagation delay, crosstalk, impedance matching, rise time, jitter, termination, decoupling, and signal integrity. Examples and calculations are provided to illustrate techniques for minimizing these effects and optimizing circuit performance.

Uploaded by

Prasad Mhsm
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Download as PDF, TXT or read online on Scribd
You are on page 1/ 5

HIGH-SPEED

DIGITAL DESIGN
A Handbook of Black Magic

HOWARD W. JOHNSON, PH .D.


Signal Consulting, Inc.

MARTIN GRAHAM, PH .D.


University of California at Berkeley

Forbook and bookstore information

http ://wwwphptr.com

Prentice
Hall

Prentice Hall PTR, Upper Saddle River, New Jersey 07458


Preface ix
1 Fundamentals 1
1 .1 Frequency and Time 1
1 .2 Time and Distance 6
1 .3 Lumped Versus Distributed Systems 7
1.4 A Note About 3 dB and RMS Frequencies 8
1.5 Four Kinds of Reactance 10
1.6 Ordinary Capacitance 11
1 .7 Ordinary Inductance 17
1 .8 A Better Method for Estimating Decay Time 22
1 .9 Mutual Capacitance 25
1 .10 Mutual Inductance 29
2 High-Speed Properties of Logic Gates 37
2.1 Historical Development of a Very Old Digital
Technology 37
2.2 Power 39
2.3 Speed 59
2.4 Packaging 66
3 Measurement Techniques 83
3 .1 Rise Time and Bandwidth of Oscilloscope Probes 83
3.2 Self-inductance of a Probe Ground Loop 86
3.3 Spurious Signal Pickup from Probe Ground Loops 92
3.4 How Probes Load Down a Circuit 95
3.5 Special Probing Fixtures 98
3 .6 Avoiding Pickup from Probe Shield Currents 104
3 .7 Viewing a Serial Data Transmission System 108
3 .8 Slowing Down the System Clock 110
3 .9 Observing Crosstalk 111
3.10 Measuring Operating Margins 113
3.11 Observing Metastable States 120
4 Transmission Lines 133
4.1 Shortcomings of Ordinary Point-to-Point Wiring 133
4.2 Infinite Uniform Transmission Line 140
4.3 Effects of Source and Load Impedance 160
4.4 Special Transmission Line Cases 167
4.5 Line Impedance and Propagation Delay 178
5 Ground Planes and Layer Stacking 189
5 .1 High-Speed Current Follows the Path of Least Inductance 189
5 .2 Crosstalk in Solid Ground Planes 191
5 .3 Crosstalk in Slotted Ground Planes 194
5 .4 Crosstalk in Cross-Hatched Ground Planes 197
5 .5 Crosstalk with Power and Ground Fingers 199
5.6 Guard Traces 201
5.7 Near-End and Far-End Crosstalk 204
5.8 How to Stack Printed Circuit Board Layers 212
6 Terminations 223
6.1 End Terminators 223
6.2 Source Terminators 231
6.3 Middle Terminators 235
6.4 AC Biasing for End Terminators 236
6.5 Resistor Selection 239
6.6 Crosstalk in Terminators 244
7 Vias 249
7.1 Mechanical Properties of Vias 249
7.2 Capacitance of Vias 257
7.3 Inductance of Vias 258
7.4 Return Current and Its Relation to Vias 260
Contents

8 Power Systems 263


8 .1 Providing a Stable Voltage Reference 263
8 .2 Distributing Uniform Voltage 268
8 .3 Everyday Distribution Problems 279
8 .4 Choosing a Bypass Capacitor 281
9 Connectors 295
9.1 Mutual Inductance-How Connectors Create
Crosstalk 295
9.2 Series Inductance-How Connectors Create EMI 300
9.3 Parasitic Capacitance-Using Connectors on a
Multidrop Bus 305
9.4 Measuring Coupling in a Connector 309
9.5 Continuity of Ground Underneath a Connector 312
9.6 Fixing EMI Problems with External Connections 314
9.7 Special Connectors for High-Speed Applications 316
9.8 Differential Signaling Through a Connector 319
9.9 Power Handling Features of Connectors 321
10 Ribbon Cables 323
10.1 Ribbon Cable Signal Propagation 324
10.2 Ribbon Cable Crosstalk 329
10.3 Ribbon Cable Connectors 336
10.4 Ribbon Cable EMI 338

11 Clock Distribution 341


11 .1 Timing Margin 341
11 .2 Clock Skew 343
11 .3 Using Low-Impedance Drivers 346
11 .4 Using Low-Impedance Clock Distribution Lines 348
11 .5 Source Termination of Multiple Clock Lines 350
11 .6 Controlling Crosstalk on Clock Lines 352
11 .7 Delay Adjustments 353
11 .8 Differential Distribution 360
11 .9 Clock Signal Duty Cycle 361
11 .10 Canceling Parasitic Capacitance of a Clock
Repeater 362
11 .11 Decoupling Clock Receivers from the Clock Bus 364

12 Clock Oscillators 367


12.1 Using Canned Clock Oscillators 367
12.2 Clock Jitter 376
Vill

Collected References 385


A Points to Remember 389
B Calculation of Rise Time 399
C MathCad Formulas 409
Index 441

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