KLM8G1GEND B031 Samsung
KLM8G1GEND B031 Samsung
KLM8G1GEND B031 Samsung
Preliminary
Samsung e·MMC Product family
e.MMC 5.0 Specification compatibility
datasheet
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-1-
SAMSUNG CONFIDENTIAL
Preliminary Rev. 0.6
0.6 1. Product 8GB, 64GB are added. Jul. 27, 2014 Preliminary S.M.Lee
SAMSUNG e·MMC is an embedded MMC solution designed in a BGA package form. e·MMC operation is identical to a MMC device and therefore is a
simple read and write to memory using MMC protocol v5.0 which is a industry standard.
e·MMC consists of NAND flash and a MMC controller. 3V supply voltage is required for the NAND area (VDDF or VCC) whereas 1.8V or 3V dual supply
voltage (VDD or VCCQ) is supported for the MMC controller. SAMSUNG e•MMC supports 200MHz DDR – up to 400MBps with bus widths of 8 bit in order
to improve sequential bandwidth, especially sequential read performance.
There are several advantages of using e·MMC. It is easy to use as the MMC interface allows easy integration with any microprocessor with MMC host.
Any revision or amendment of NAND is invisible to the host as the embedded MMC controller insulates NAND technology from the host. This leads to
faster product development as well as faster times to market.
The embedded flash management software or FTL(Flash Transition Layer) of e·MMC manages Wear Leveling, Bad Block Management and ECC. The
FTL supports all features of the Samsung NAND flash and achieves optimal performance.
SAMSUNG e·MMC supports features of eMMC5.0 which are defined in JEDEC Standard
- Supported Features : Packed command, Cache, Discard, Sanitize, Power Off Notification, Data Tag,
Partition types, Context ID, Real Time Clock, Dynamic Device Capacity, HS200
Full backward compatibility with previous MultiMediaCard system specification (1bit data bus, multi-e·MMC systems)
Power : Interface power → VDD(VCCQ) (1.70V ~ 1.95V or 2.7V ~ 3.6V) , Memory power → VDDF(VCC) (2.7V ~ 3.6V)
B2 DAT3
DNU DNU DNU DNU DNU DNU DNU
B3 DAT4
B4 DAT5 DNU DNU DNU
B5 DAT6 1 2 3 4 5 6 7 8 9 10 11 12 13 14
B6 DAT7 A DAT0 DAT1 DAT2 Vss RFU
M4 VDD
D
N4 VDD
E RFU VDDF Vss RFU RFU RFU
P3 VDD
F VDDF RFU
P5 VDD
E6 VDDF G RFU Vss RFU
Data
F5 VDDF H Strobe Vss
C2 VDDI
L
M5 CMD
M VDD CMD CLK
H5 Data Strobe
N Vss VDD Vss
M6 CLK
J5 VSS P VDD Vss VDD Vss RFU RFU
C4 VSS
DNU DNU DNU DNU DNU DNU DNU
E7 VSS
DNU DNU DNU
G5 VSS DNU DNU DNU DNU
H10 VSS
K8 VSS
N2 VSS
N5 VSS
P4 VSS
P6 VSS
Figure 1. 153-FBGA
(Datum A)
#A1
A
B
(Datum B) C
0.50
D
0.50 x 13 = 6.50
E
13.00±0.10
13.00±0.10
13.00±0.10
F
G
H
J
K
3.25
L
M
N
P
153-0.30±0.05 0.50
3.25
0.2 M AB
0.22±0.05
0.70±0.10
(Datum A)
#A1
A
B
(Datum B) C
0.50
D
0.50 x 13 = 6.50
E
13.00±0.10
13.00±0.10
13.00±0.10
F
G
H
J
K
3.25
L
M
N
P
153-0.30±0.05 0.50
3.25
0.2 M AB
0.22±0.05
0.90±0.10
TOP VIEW BOTTOM VIEW
VDDF
VDD
NOTE:
1) It is being discussed in JEDEC and is not confirmed yet. It can be modified according to JEDEC standard in the future.
NOTE:
1) Current eMMC standard defined by JEDEC supports up to 0x06 for EXT_CSD_REV value, 0x07 is additionally assigned to support e.MMC5.0 product.
NOTE:
1) It is being discussed in JEDEC and is not confirmed yet. It can be modified according to JEDEC standard in the future.
The User Data Area can be divided into four General Purpose Area Partitions and User Data Area partition. Each of the General Purpose Area partitions
and a section of User Data Area partition can be configured as enhanced partition.
Boot Partition size & RPMB Partition Size are set by the following command sequence :
[Table 7] Setting sequence of Boot Area Partition size and RPMB Area Partition size
Function Command Description
Partition Size Change Mode CMD62(0xEFAC62EC) Enter the Partition Size Change Mode
Partition Size Set Mode CMD62(0x00CBAEA7) Partition Size setting mode
Set Boot Partition Size CMD62(BOOT_SIZE_MULT) Boot Partition Size value
RPMB Partition Size value
Set RPMB Partition Size CMD62(RPMB_SIZE_MULT)
F/W Re-Partition is executed in this step.
Power Cycle
If the failure is in data programming case, the data is not programmed. And if the failure occurs in data read case, the read data is ‘0x00’.
Max Enhanced User Data Area size is defined as (MAX_ENH_SIZE_MULT x HC_WP_GRP_SIZE x HC_ERASE_GRP_SIZE x 512kBytes)
CLK
DAT[0] 512bytes
S 010 E S +CRC E
Boot terminated
(1)
MIn 8 cloks + 48 clocks = 56 clocks required from
CMD signal high to next MMC command.
(2)
CLK
DAT[0] 512bytes
S 010 E S +CRC
E (3)
Min74
Clocks (1) Boot terminated
required
after
power is (2)
stable to
start boot
command
*(1) Boot ACK Time (2) Boot Data Time (3) CMD1 Time
*CMD0 with argument 0xFFFFFFFA
NOTE:
1) This initialization time includes partition setting, Please refer to INI_TIMEOUT_AP in 6.4 Extended CSD Register.
Normal initialization time (without partition setting) is completed within 1sec
Boot Partition #1  RPMB 4 General Purpose Partitions (GPP) Enhanced User Data Area
1 2 3 4
User Density
* Test / Estimation Condition : Bus width x8, 200MHz DDR, 512KB data transfer, w/o file system overhead
NOTE :
1),4),5) description are same as e.MMC JEDEC standard
2) PRV is composed of the revision count of controller and the revision count of F/W patch
3) A 32 bits unsigned binary integer. (Random Number)
R : Read only
W: One time programmable and not readable.
R/W: One time programmable and readable.
W/E : Multiple writable with value kept after power failure, H/W reset assertion and any CMD0 reset and not readable.
R/W/E: Multiple writable with value kept after power failure, H/W reset assertion and any CMD0 reset and readable.
R/W/C_P: Writable after value cleared by power failure and HW/ rest assertion (the value not cleared by CMD0 reset) and readable.
R/W/E_P: Multiple writable with value reset after power failure, H/W reset assertion and any CMD0 reset and readable.
W/E/_P: Multiple wtitable with value reset after power failure, H/W reset assertion and any CMD0 reset and not readable
Reserved1 1 - [240] -
Power class for 52MHz, DDR at 3.6V PWR_CL_DDR_52_360 1 R [239] 0x00
Power class for 52MHz, DDR at 1.95V PWR_CL_DDR_52_195 1 R [238] 0x00
Power class for 200MHz at Vccq=1.95V, Vcc=3.6V PWR_CL_200_360 1 R [237] 0x00
Power class for 200MHz, at Vccq=1.3V, Vcc=3.6V PWR_CL_200_195 1 R [236] 0x00
Minimum Write Performance for 8bit at 52MHz in
MIN_PERF_DDR_W_8_52 1 R [235] 0x00
DDR mode
Minimum Read Performance for 8bit at 52MHz in
MIN_PERF_DDR_R_8_52 1 R [234] 0x00
DDR mode
Reserved1 1 - [233] -
TRIM Multiplier TRIM_MULT 1 R [232] 0x01
Secure Feature support SEC_FEATURE_SUPPORT 1 R [231] 0x55
Secure Erase Multiplier SEC_ERASE_MULT 1 R [230] 0x1B
Secure TRIM Multiplier SEC_TRIM_MULT 1 R [229] 0x11
Boot information BOOT_INFO 1 R [228] 0x07
Reserved1 1 - [227] -
Boot partition size BOOT_SIZE_MULT 1 R [226] 0x20
Access size ACC_SIZE 1 R [225] 0x07
High-capacity erase unit size HC_ERASE_GRP_SIZE 1 R [224] 0x01
High-capacity erase timeout ERASE_TIMEOUT_MULT 1 R [223] 0x01
Reliable write sector count REL_WR_SEC_C 1 R [222] 0x01
High-capacity write protect group size HC_WP_GRP_SIZE 1 R [221] 0x10
Sleep current (VCC) S_C_VCC 1 R [220] 0x07
Sleep current (VCCQ) S_C_VCCQ 1 R [219] 0x07
PRODUC-
Product state awareness timeout TION_STATE_AWARENESS_- 1 R [218] 0x00
TIMEOUT
Sleep/awake timeout S_A_TIMEOUT 1 R [217] 0x11
Sleep Notification Timeout SLEEP_NOTIFICATION_TIME 1 R [216] 0x07
0xE9 0x1D1 0x3A3 0x0747
Sector Count SEC_COUNT 4 R [215:212]
0000 F000 E000 C000
Reserved1 1 - [211] -
Minimum Write Performance for 8bit at
MIN_PERF_W_8_52 1 R [210] 0x00
52MHz
Minimum Read Performance for 8bit at
MIN_PERF_R_8_52 1 R [209] 0x00
52MHz
Minimum Write Performance for 8bit at
MIN_PERF_W_8_26_4_52 1 R [208] 0x00
26MHz, for 4bit at 52MHz
Minimum Read Performance for 8bit at
MIN_PERF_R_8_26_4_52 1 R [207] 0x00
26MHz, for 4bit at 52MHz
Minimum Write Performance
MIN_PERF_W_4_26 1 R [206] 0x00
for 4bit at 26MHz
Minimum Read Performance
MIN_PERF_R_4_26 1 R [205] 0x00
for 4bit at 26MHz
Reserved1 1 - [204] -
Power class for 26MHz at 3.6V 1 R PWR_CL_26_360 1 R [203] 0x00
Power class for 52MHz at 3.6V 1 R PWR_CL_52_360 1 R [202] 0x00
Power class for 26MHz at 1.95V 1 R PWR_CL_26_195 1 R [201] 0x00
Reserved1 1 - [190] -
Command set revision CMD_SET_REV 1 R [189] 0x00
1 1 - [188] -
Reserved
R/W/
Power class POWER_CLASS 1 [187] 0x00
E_P
Reserved1 1 - [186] -
R/W/
High-speed interface timing HS_TIMING 1 [185] 0x00
E_P
Strobe Support STROBE_SUPPORT 1 R [184] 0x01
Bus width mode BUS_WIDTH 1 W/E_P [183] 0x00
1 1 - [182] -
Reserved
Erased memory content ERASED_MEM_CONT 1 R [181] 0x00
Reserved1 1 - [180] -
R/W/E
&
Partition configuration PARTITION_CONFIG 1 [179] 0x00
R/W/
E_P
R/W &
Boot config protection BOOT_CONFIG_PROT 1 R/W/ [178] 0x00
C_P
Boot bus Conditions BOOT_BUS_CONDITIONS 1 R/W/E [177] 0x00
Reserved1 1 - [176] -
R/W/
High-density erase group definition ERASE_GROUP_DEF 1 [175] 0x00
E_P
Boot write protection status registers BOOT_WP_STATUS 1 R [174] 0x00
R/W &
Boot area write protection register BOOT_WP 1 R/W/ [173] 0x00
C_P
Reserved1 1 - [172] -
R/W,
R/W/
User area write protection register USER_WP 1 C_P [171] 0x00
&R/W/
E_P
Reserved1 1 - [170] -
FW configuration FW_CONFIG 1 R/W [169] 0x00
RPMB Size RPMB_SIZE_MULT 1 R [168] 0x04 0x20
Write reliability setting register WR_REL_SET 1 R/W [167] 0x1F
Write reliability parameter register WR_REL_PARAM 1 R [166] 0x14
Start Sanitize operation SANITIZE_START 1 W/E_P [165] 0x00
Manually start background operations BKOPS_START 1 W/E_P [164] 0x00
Reserved1 1 - [135] -
Bad Block Management mode SEC_BAD_BLK_MGMNT 1 R/W [134] 0x00
PRODUC-
Production state awareness 1 W/E_P [133] 0x00
TION_STATE_AWARENESS
Package Case Temperature is
TCASE_SUPPORT 1 W/E_P [132] 0x00
controlled
Periodic Wake-up PERIODIC_WAKEUP 1 R/W/E [131] 0x00
PROGRAM_CID_CSD_DDR_-
Program CID/CSD in DDR mode support 1 R [130] 0x01
SUPPORT
Reserved1 66 - [129:64] -
Native sector size NATIVE_SECTOR_SIZE 1 R [63] 0x00
Sector size emulation USE_NATIVE_SECTOR 1 R/W [62] 0x00
Sector size DATA_SECTOR_SIZE 1 R [61] 0x00
1st initialization after disabling sector size emula-
INI_TIMEOUT_EMU 1 R [60] 0x00
tion
R/W/
Class 6 commands control CLASS_6_CTRL 1 [59] 0x00
E_P
Number of addressed group to be Released DYNCAP_NEEDED 1 R [58] 0x00
R/W/
Exception events control EXCEPTION_EVENTS_CTRL 2 [57:56] 0x00
E_P
EXCEPTION_EVENTS_STA-
Exception events status 2 R [55:54] 0x00
TUS
EXT_PARTITIONS_ATTRI-
Extended Partitions Attribute 2 R/W [53:52] 0x00
BUTE
R/W/
Context configuration CONTEXT_CONF 15 [51:37] 0x00
E_P
Packed command status PACKED_COMMAND_STATUS 1 R [36] 0x00
Packed command failure index PACKED_FAILURE_INDEX 1 R [35] 0x00
R/W/
Power Off Notification POWER_OFF_NOTIFICATION 1 [34] 0x00
E_P
R/W/
Control to turn the Cache ON/OFF CACHE_CTRL 1 [33] 0x00
E_P
Flushing of the cache FLUSH_CACHE 1 W/E_P [32] 0x00
Reserved1 1 - [31] -
R/W/
Mode config MODE_CONFIG 1 [30] 0x00
E_P
W/E_P
Mode operation codes MODE_OPERATION_CODES 1 [29] 0x00
Reserved1 2 - [28:27] -
FFU status FFU_STATUS 1 R [26] 0x00
Reserved1 16 - [15:0] -
NOTE :
1) Reserved bits should read as “0.”
7.2 Previous Bus Timing Parameters for DDR52 and HS200 mode are defined by JEDEC standard
tPERIOD
VCCQ
tCKDCD
CLOCK VT tCKMPW tCKMPW
INPUT
tCKDCD
VSS
VIH VIH
DAT[7-0] VALID VALID
INPUT WINDOW WINDOW
VIL VIL
VSS
NOTE :
1) It is being discussed in JEDEC and is not confirmed yet. It can be modified according to JEDEC standard in the future.
tPERIOD
VCCQ
tDSDCD
Data tDSMPW tDSMPW
VT
Strobe
tDSDCD
VSS
tRQ tRQH
VCCQ
VOH VOH
DAT[7-0] VALID VALID
OUTPUT VOL WINDOW VOLWINDOW
NOTE:
VOH denotes VOH(min.) and VOL denotes VOL(max.).
NOTE :
1) It is being discussed in JEDEC and is not confirmed yet. It can be modified according to JEDEC standard in the future.
V
VDD
output
input
VOH high level
high level
VIH
undefined
VIL
NOTE:
1) Because Voh depends on external resistance value (including outside the package), this value does not apply as device specification.
Host is responsible to choose the external pull-up and open drain resistance value to meet Voh Min value.
NOTE:
1) 0.7*VCCQ for MMC4.3 and older revisions.
2) 0.3*VCCQ for MMC4.3 and older revisions.
8.2 Standby Power Consumption in auto power saving mode and standby state.
[Table 28] Standby Power Consumption in auto power saving mode and standby state
CTRL NAND
Density NAND Type Unit
25C(Typ) 85C 25C(Typ) 85C
8 GB 64 Gb MLC x1 40 85
16 GB 64 Gb MLC x2 50 135
120 400 uA
32 GB 64 Gb MLC x4 70 235
64 GB 64 Gb MLC x8 130 435
NOTE:
Power Measurement conditions: Bus configuration =x8, No CLK
*Typical value is measured at Vcc=3.3V, TA=25°C. Not 100% tested.