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Memory Module - Wikipedia

Memory modules are printed circuit boards that memory chips are mounted on to allow for easy installation and replacement in electronic devices like computers. There are different types of memory modules including SIMMs, DIMMs, and SO-DIMMs. Memory modules come in various forms and capacities and contain either dynamic RAM (DRAM) or static RAM (SRAM). Common memory module formats include DIP, SIPP, SIMM, DIMM, and SO-DIMM.

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0% found this document useful (0 votes)
242 views

Memory Module - Wikipedia

Memory modules are printed circuit boards that memory chips are mounted on to allow for easy installation and replacement in electronic devices like computers. There are different types of memory modules including SIMMs, DIMMs, and SO-DIMMs. Memory modules come in various forms and capacities and contain either dynamic RAM (DRAM) or static RAM (SRAM). Common memory module formats include DIP, SIPP, SIMM, DIMM, and SO-DIMM.

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Josh V
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21/12/2019 Memory module - Wikipedia

Two types of DIMMs (dual in-line memory modules): a 168-


pin SDRAM module (top) and a 184-pin DDR SDRAM
module (bottom).
In computing, a memory module is a printed circuit board on which memory
integrated circuits are mounted.[1] Memory modules permit easy installation and
replacement in electronic systems, especially computers such as personal
computers, workstations, and servers. The first memory modules were
proprietary designs that were specific to a model of computer from a specific
manufacturer. Later, memory modules were standardized by organizations such
as JEDEC and could be used in any system designed to use them.
Types of memory module include:
TransFlash Memory Module
SIMM, a single in-line memory module
DIMM, dual in-line memory module
Rambus memory modules are a subset of DIMMs, but are usually
referred to as RIMMs
SO-DIMM, small outline DIMM, a smaller version of the DIMM, used in
laptops
Distinguishing characteristics of computer memory modules include voltage,
capacity, speed (i.e., bit rate), and form factor. For economic reasons, the large
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(main) memories found in personal computers, workstations, and non-handheld


game-consoles (such as PlayStation and Xbox) normally consist of dynamic
RAM (DRAM). Other parts of the computer, such as cache memories normally
use static RAM (SRAM). Small amounts of SRAM are sometimes used in the
same package as DRAM.[2] However, since SRAM has high leakage power and
low density, die-stacked DRAM has recently been used for designing multi-
megabyte sized processor caches.[3]
Physically, most DRAM is packaged in black epoxy resin.
General DRAM formats

A 256 k x 4 bit 20-pin DIP


DRAM on an early PC memory
card (k = 1024), usually
Industry Standard
Architecture

Common DRAM packages.


From top to bottom: DIP, SIPP,
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SIMM (30-pin), SIMM


(72-pin), DIMM (168-pin),
DDR DIMM (184-pin).

8 GB DDR4-2133 288-pin


ECC 1.2 V RDIMMs
Dynamic random access memory is produced as integrated circuits (ICs)
bonded and mounted into plastic packages with metal pins for connection to
control signals and buses. In early use individual DRAM ICs were usually either
installed directly to the motherboard or on ISA expansion cards; later they were
assembled into multi-chip plug-in modules (DIMMs, SIMMs, etc.). Some
standard module types are:
DRAM chip (Integrated Circuit or IC)
Dual in-line Package (DIP/DIL)
Zig-zag in-line package (ZIP)
DRAM (memory) modules
Single In-line Pin Package (SIPP)
Single In-line Memory Module (SIMM)
Dual In-line Memory Module (DIMM)
Rambus In-line Memory Module (RIMM), technically DIMMs but called
RIMMs due to their proprietary slot.
Small outline DIMM (SO-DIMM), about half the size of regular DIMMs,
are mostly used in notebooks, small footprint PCs (such as Mini-ITX
motherboards), upgradable office printers and networking hardware like
routers.
Small outline RIMM (SO-RIMM). Smaller version of the RIMM, used in
laptops. Technically SO-DIMMs but called SO-RIMMs due to their
proprietary slot.
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Stacked vs. non-stacked RAM modules


Stacked RAM modules contain two or more RAM chips stacked on top of
each other. This allows large modules to be manufactured using cheaper
low density wafers. Stacked chip modules draw more power, and tend to
run hotter than non-stacked modules. Stacked modules can be
packaged using the older TSOP or the newer BGA style IC chips. Silicon
dies connected with older wire bonding or newer TSV.
Several proposed stacked RAM approaches exist, with TSV and much
wider interfaces, including Wide I/O, Wide I/O 2, Hybrid Memory Cube
and High Bandwidth Memory.
Common DRAM modules

Common DRAM packages as illustrated to the right, from top to bottom (last
three types are not present in the group picture, and the last type is available in
a separate picture):
DIP 16-pin (DRAM chip, usually pre-fast page mode DRAM (FPRAM))
SIPP 30-pin (usually FPRAM)
SIMM 30-pin (usually FPRAM)
SIMM 72-pin (often extended data out DRAM (EDO DRAM) but FPRAM is not
uncommon)
DIMM 168-pin (most SDRAM but some were extended data out DRAM (EDO
DRAM))
DIMM 184-pin (DDR SDRAM)
RIMM 184-pin (RDRAM)
DIMM 240-pin (DDR2 SDRAM and DDR3 SDRAM)
DIMM 288-pin (DDR4 SDRAM)
Common SO-DIMM DRAM modules:
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72-pin (32-bit)
144-pin (64-bit) used for SO-DIMM SDRAM
200-pin (72-bit) used for SO-DIMM DDR SDRAM and SO-DIMM DDR2
SDRAM
204-pin (64-bit) used for SO-DIMM DDR3 SDRAM
260-pin used for SO-DIMM DDR4 SDRAM
Memory size of a DRAM module

The exact number of bytes in a DRAM module is always an integral power of


two.
A 512 MB (as marked on a module) SDRAM DIMM, actually contains 512 MiB
(mebibytes)[4][5] (512 × 220 bytes = 29 × 220 bytes = 229 bytes = 536,870,912
bytes exactly), and might be made of 8 or 9 SDRAM chips: each chip
containing exactly 512 Mib (mebibits) of storage, and each contributing 8 bits
to the DIMM's 64- or 72-bit width.
For comparison, a 2 GB SDRAM module contains 2 GiB[4][5] (2 × 230 bytes =
231 bytes = 2,147,483,648 bytes of memory). This module would usually has
8 SDRAM chips of 256 MiB each.
References

1. Bruce Jacob, Spencer W. Ng, David T. Wang (2008). Memory Systems:


Cache, DRAM, Disk. Morgan Kaufmann Publishers. pp. 417–418.
2. "Mitsubishi's 3D-RAM And Cache DRAM incorporate high performance,
on-board SRAM cache" . Business Wire. 21 July 1998. Archived from the
original on 24 December 2008.

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3. S. Mittal et al., "A Survey Of Techniques for Architecting DRAM Caches ",
IEEE TPDS, 2015
4. IEC prefixes
5. binary prefixes

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