曜凌光電股份有限公司

住址: 42878 台中市大雅区科雅路 25 號 5F WEB: http://www.Raystar-Optronics.com

5F., No.25, Keya Rd., Daya Dist., Taichung E-mail: [email protected]
City 428, Taiwan Tel:886-4-2565-0761 Fax：886-4-2565-0760

RG12864C-BIW-V

SPECIFICATION

CUSTOMER:

APPROVED BY

PCB VERSION

DATE
FOR CUSTOMER USE ONLY

SALES BY APPROVED BY CHECKED BY PREPARED BY

Release DATE:

Page 1 , Total 24 Pages

 RG12864C-BIW-V

Revision History

VERSION DATE REVISED PAGE NO. Note

0 2010/11/12 First issue

A 2012/10/16 Modify Backlight
Information
B 2014/10/30 Remove IC
information
C 2016/02/25 Modify Precautions in
use of LCD Modules
& Static electricity
test
D 2016/07/07 Modify Dots size

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 RG12864C-BIW-V

Contents
1.General Specification

2.Module Classification Information

3.Interface Pin Function

4.Contour Drawing &Block Diagram

5.Optical Characteristics

6.Absolute Maximum Ratings

7.Electrical Characteristics

8.Backlight Information

9.Reliability

10.Inspection specification

11.Precautions in use of LCD Modules

12.Material List of Components for RoHs

13.Recommendable Storage

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 RG12864C-BIW-V

1.General Specification

The Features is described as follow:

◼ Module dimension: 78.0 x 70.0 x 14.3 (max.) mm

◼ View area: 62.0 x 44.0 mm

◼ Active area: 56.28 x 38.36 mm

◼ Number of dots: 128 x 64

◼ Dot size: 0.40 x 0.56mm

◼ Dot pitch: 0.44 x 0.60 mm

◼ LCD type: STN Negative, Blue, Transmissive

◼ Duty: 1/64

◼ View direction: 6 o’clock

◼ Backlight Type: LED, White

◼ IC:NT7107，NT7108

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 RG12864C-BIW-V

2.Module Classification Information

R G 12864 C － B I W － V
    －    － 

Item Description
1 R：Raystar Optronics Inc.
C：Character Type, T:TAB Type
2 Display
G：Graphic Type X:COG Type
3 Display Font： 128 * 64 dot
4 Serials code：
P→TN Positive, Gray V→FSTN Negative, Blue
N→TN Negative, T→FSTN Negative, Black
L→VA Negative D→FSTN Negative (Double film)
H→ HTN Positive, Gray F→FSTN Positive
5 LCD I→HTN Negative, Black K→FSC Negative
U→HTN Negative, Blue S→FSC Positive
B→STN Negative, Blue E→ISTN Negative, Black
G→STN Positive, Gray C→CSTN Negative, Black
Y→STN Positive, Yellow Green A→ASTN Negative, Black
A：Reflective, N.T, 6:00 K：Transflective, W.T,12:00
Polarizer D：Reflective, N.T, 12:00 1：Transflective, U.T,6:00
Type, G：Reflective, W. T, 6:00 4：Transflective, U.T.12:00
J：Reflective, W. T, 12:00 C：Transmissive, N.T,6:00
Temperature
6 0：Reflective, U. T, 6:00 F：Transmissive, N.T,12:00
range,
3：Reflective, U. T, 12:00 I：Transmissive, W. T, 6:00
View B：Transflective, N.T,6:00 L：Transmissive, W.T,12:00
direction E：Transflective, N.T.12:00 2：Transmissive, U. T, 6:00
H：Transflective, W.T,6:00 5：Transmissive, U.T,12:00
N→ Without backlight W→LED, White H→LED, High light White
P→EL, Blue A→LED, Amber S→LED, Full color
T→EL, Green R→LED, Red J→DIP LED, Blue
D→EL, White O→LED, Orange K→DIP LED, White
7 Backlight
M→EL, Yellow Green B→LED, Blue E→DIP LED, Yellow
F→CCFL, White X→LED, Dual color Green
L→DIP LED, Amber
Y→LED, Yellow Green C→LED, Full color I→DIP LED, Red
G→LED, Green
8 Special code V: Build in Negative Voltage

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 RG12864C-BIW-V

3.Interface Pin Function

Pin
Symbol Level Description
No.

1 /CS1 L Select Segment 1 ~ Segment 64

2 /CS2 L Select Segment 65 ~ Segment128

3 Vss 0V Ground

4 VDD 5.0V Supply voltage for logic

5 VO (Variable) Operating voltage for LCD

6 D/I H/L H: Data , L: Instruction

7 R/W H/L H: Read (Module --> MPU) L: Write(MPU --> Module)

8 E H Enable signal

9 DB0 H/L Data bus line

Data bus line
10 DB1 H/L
Data bus line
11 DB2 H/L
Data bus line
12 DB3 H/L
Data bus line
13 DB4 H/L
Data bus line
14 DB5 H/L
Data bus line
15 DB6 H/L
Data bus line
16 DB7 H/L

17 RST L Reset the LCM

18 VEE — Negative Voltage Output

19 A — Power supply for B/L (+)

20 K — Power supply for B/L (-)

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 RG12864C-BIW-V

4.Contour Drawing &Block Diagram

78.0 0.5
2.0 74.0
8.0 62.0(VA)
10.86 56.28(AA) 1 CS1
13.0 P2.54*19=48.26 2 CS2
14.3Max

2.54

2.54
1.8 20- 1.0 PTH 9.7
3 VSS
20- 2.0 PAD 4 VDD
5 V0
7.4
13.0
15.82

1 20
6 D/I
7 R/W
8 E
9 DB0
38.36(AA)
70.0 0.5

44.0(VA)

128X64 Dots
64.92
10 DB1
55.2

11 DB2
12 DB3
13 DB4
14 DB5
15 DB6
16 DB7
4- 2.5 PTH 1.6
17 RST
5.0 68.0 4- 5.0 PAD
LED B/L 18 VEE
19 A
0.44
0.56

20
0.6

0.4 K

DOT SIZE The non-specified tolerance of dimension is ±0.3 mm .

SCALE 10/1
NT7107

Com Driver
Com1~64

128X64 DOT
FR,M,CL,CLK1,CLK2

NT7108 NT7108
Seg1~64 Seg65~128
Seg Driver Seg Driver
Power Circuit

Vdd
Bias and

E VO VR
MPU Vss 10K or 20K
D/I
R/W
80 series
or DB0~DB7
68 series Vee
Generator

CS1
N.V.

CS2
RST
Power on
Optional
reset circuit

External contrast adjustment.

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 RG12864C-BIW-V

5.Optical Characteristics

Item Symbol Condition Min Typ Max Unit

θ 0 － 20 ψ= 180°
CR≧2

θ 0 － 40 ψ= 0°
CR≧2
View Angle
θ 0 － 30 ψ= 90°
CR≧2

θ 0 － 30 ψ= 270°
CR≧2

Contrast Ratio CR － － 3 － －

T rise － － 200 300 ms

Response Time
T fall － － 250 350 ms

Definition of Operation Voltage (Vop) Definition of Response Time ( Tr , Tf )

Non-selected Non-selected
Condition Condition
Intensity Selected Wave Selected Condition
100％ Non-selected Wave Intensity

10%

Cr Max
Cr = Lon / Loff 90%
100%

Vop
Driving Voltage(V) Tr Tf
[positive type] 【Positive type】

Conditions :
Operating Voltage : Vop Viewing Angle(θ，φ) : 0°， 0°
Frame Frequency : 64 HZ Driving Waveform : 1/N duty , 1/a bias

Definition of viewing angle(CR≧2)

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 RG12864C-BIW-V

θb
θf
φ= 180°
θl
θr

φ= 270° φ= 90°

φ= 0°

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 RG12864C-BIW-V

6.Absolute Maximum Ratings

Item Symbol Min Typ Max Unit

Operating Temperature TOP -20 － +70 ℃

Storage Temperature TST -30 － +80 ℃

Supply Voltage For Logic VDD-VSS -0.3 － 7.0 V

Driver Supply Voltage VLCD VEE-0.3 － VDD+0.3 V

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 RG12864C-BIW-V

7.Electrical Characteristics

ITEM SYMBOL CONDITION MIN. TYP. MAX. UNIT

Supply Voltage For

VDD-VSS － 4.5 5.0 5.5 V
Logic

Ta=-20℃
Supply Voltage For － － 9.6 V
LCD VDD-VO Ta=25℃ 8.2 8.5 8.8 V
*Note 8.2 － － V
Ta=70℃

Input High Volt. VIH － 0.7 VDD － VDD V

Input Low Volt. VIL － 0 － 0.8 V

Output High Volt. VOH － 2.4 － － V

Output Low Volt. VOL － － － 0.4 V

2.0 2.5 4.0
Supply Current IDD VDD=5.0V mA
* Note: Please design the VOP adjustment circuit on customer's main board

Vdd
LCM
VR Vo
10K~20K Module
Vee

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 RG12864C-BIW-V

8.Backlight Information

Specification

PARAMETER SYMBOL MIN TYP MAX UNIT TEST CONDITION

Supply Current ILED － 64 80 mA V=3.5V

Supply Voltage V 3.4 3.5 3.6 V －

Reverse Voltage VR － － 5 V －

Luminance
IV 460 580 － CD/M2 ILED=64mA
(Without LCD)

LED Life Time ILED=64mA

(For Reference － － 50K － Hr. 25℃,50-60%RH,

only) (Note 1)

Color White

Note: The LED of B/L is drive by current only, drive voltage is for reference only.
drive voltage can make driving current under safety area (current between
minimum and maximum).
Note 1:50K hours is only an estimate for reference.

Drive from pin19,pin20

pin19 R R
A
B/L
K
pin20
LCM

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 RG12864C-BIW-V

9.Reliability

Environmental Test
Test Item Content of Test Test Condition Note
High Temperature Endurance test applying the high storage temperature 80℃
2
storage for a long time. 200hrs
Low Temperature Endurance test applying the low storage temperature -30℃
1,2
storage for a long time. 200hrs
Endurance test applying the electric stress (Voltage &
High Temperature 70℃
Current) and the thermal stress to the element for a ——
Operation 200hrs
long time.
Low Temperature Endurance test applying the electric stress under low -20℃
1
Operation temperature for a long time. 200hrs
The module should be allowed to stand at
60℃,90%RH max
High Temperature/ 60℃,90%RH
For 96hrs under no-load condition excluding the 1,2
Humidity storage 96hrs
polarizer,
Then taking it out and drying it at normal temperature.
The sample should be allowed stand the following 10
cycles of operation
-20℃ 25℃ 70℃
Thermal shock -20℃/70℃
——
resistance 10 cycles
30min 5min 30min
1 cycle
Total fixed
amplitude : 1.5mm
Vibration Frequency :
Endurance test applying the vibration during
Vibration test 10~55Hz 3
transportation and using.
One cycle 60
seconds to 3
directions of X,Y,Z for
Each 15 minutes
VS=±600V(contact),
±800v(air),
Endurance test applying the electric stress to the
Static electricity test RS=330Ω ——
terminal.
CS=150pF
10 times

Content of Reliability Test (Wide temperature, -20℃~70℃)

Note1: No dew condensation to be observed.

Note2: The function test shall be conducted after 4 hours storage at the normal
Temperature and humidity after remove from the test chamber.
Note3: The packing have to including into the vibration testing.

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 RG12864C-BIW-V

10.Inspection specification
NO Item Criterion AQL
1.1 Missing vertical, horizontal segment, segment contrast
defect.
1.2 Missing character , dot or icon.
1.3 Display malfunction.
Electrical
01 1.4 No function or no display. 0.65
Testing
1.5 Current consumption exceeds product specifications.
1.6 LCD viewing angle defect.
1.7 Mixed product types.
1.8 Contrast defect.
2.1 White and black spots on display ≦0.25mm, no more than
Black or white
three white or black spots present.
02 spots on LCD 2.5
2.2 Densely spaced: No more than two spots or lines within
(display only)
3mm
3.1 Round type : As following drawing
Φ=( x + y ) / 2 SIZE Acceptable Q TY
Φ≦0.10 Accept no dense
0.10＜Φ≦0.20 2
0.20＜Φ≦0.25 1
2.5
0.25＜Φ 0

LCD black
spots, white
03 spots,
contamination
(non-display) 3.2 Line type : (As following drawing)
Length Width Acceptable Q TY
--- W≦0.02 Accept no dense
L≦3.0 0.02＜W≦0.03
2 2.5
L≦2.5 0.03＜W≦0.05
--- 0.05＜W As round type

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 RG12864C-BIW-V

If bubbles are visible, Size Φ Acceptable Q TY

judge using black spot Φ≦0.20 Accept no dense

Polarizer 0.20＜Φ≦0.50 3
04 specifications, not easy 2.5
bubbles 0.50＜Φ≦1.00 2
to find, must check in
specify direction. 1.00＜Φ 0
Total Q TY 3

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 RG12864C-BIW-V

NO Item Criterion AQL

05 Scratches Follow NO.3 LCD black spots, white spots, contamination
Symbols Define:
x: Chip length y: Chip width z: Chip thickness
k: Seal width t: Glass thickness a: LCD side length
L: Electrode pad length:

6.1 General glass chip :

6.1.1 Chip on panel surface and crack between panels:

z: Chip thickness y: Chip width x: Chip length

Z≦1/2t Not over viewing x≦1/8a
Chipped area
06 2.5
glass 1/2t＜z≦2t Not exceed 1/3k x≦1/8a
☉If there are 2 or more chips, x is total length of each chip.

6.1.2 Corner crack:

z: Chip thickness y: Chip width x: Chip length

Z≦1/2t Not over viewing x≦1/8a
area
1/2t＜z≦2t Not exceed 1/3k x≦1/8a
☉If there are 2 or more chips, x is the total length of each chip.

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 RG12864C-BIW-V

NO Item Criterion AQL

Symbols :
x: Chip length y: Chip width z: Chip thickness
k: Seal width t: Glass thickness a: LCD side length
L: Electrode pad length
6.2 Protrusion over terminal :
6.2.1 Chip on electrode pad :

y: Chip width x: Chip length z: Chip thickness

y≦0.5mm x≦1/8a 0 ＜ z≦t
6.2.2 Non-conductive portion:

Glass
06 2.5
crack

y: Chip width x: Chip length z: Chip thickness

y≦ L x≦1/8a 0 ＜ z≦t
☉If the chipped area touches the ITO terminal, over 2/3 of the ITO
must remain and be inspected according to electrode terminal
specifications.
☉If the product will be heat sealed by the customer, the alignment
mark not be damaged.
6.2.3 Substrate protuberance and internal crack.

y: width x: length
y≦1/3L x≦a

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 RG12864C-BIW-V

NO Item Criterion AQL

07 Cracked glass The LCD with extensive crack is not acceptable. 2.5

8.1 Illumination source flickers when lit. 0.65

Backlight 8.2 Spots or scratched that appear when lit must be judged. 2.5
08
elements Using LCD spot, lines and contamination standards.
8.3 Backlight doesn’t light or color wrong. 0.65
9.1 Bezel may not have rust, be deformed or have fingerprints,
2.5
09 Bezel stains or other contamination.
0.65
9.2 Bezel must comply with job specifications.

10.1 COB seal may not have pinholes larger than 0.2mm or
contamination. 2.5
10.2 COB seal surface may not have pinholes through to the
IC. 2.5
10.3 The height of the COB should not exceed the height 0.65
indicated in the assembly diagram.
10.4 There may not be more than 2mm of sealant outside the 2.5
seal area on the PCB. And there should be no more than
three places.
10.5 No oxidation or contamination PCB terminals.
2.5
10 PCB、COB 10.6 Parts on PCB must be the same as on the production
0.65
characteristic chart. There should be no wrong parts,
missing parts or excess parts.
10.7 The jumper on the PCB should conform to the product
characteristic chart. 0.65

10.8 If solder gets on bezel tab pads, LED pad, zebra pad or
screw hold pad, make sure it is smoothed down. 2.5

10.9 The Scraping testing standard for Copper Coating of PCB

2.5
X
Y
X * Y<=2mm2

11.1 No un-melted solder paste may be present on the PCB. 2.5

11.2 No cold solder joints, missing solder connections, 2.5
11 Soldering oxidation or icicle.
11.3 No residue or solder balls on PCB. 2.5
11.4 No short circuits in components on PCB. 0.65

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 RG12864C-BIW-V

NO Item Criterion AQL

12.1 No oxidation, contamination, curves or, bends on interface 2.5

Pin (OLB) of TCP.
12.2 No cracks on interface pin (OLB) of TCP. 0.65
12.3 No contamination, solder residue or solder balls on product. 2.5
12.4 The IC on the TCP may not be damaged, circuits. 2.5
12.5 The uppermost edge of the protective strip on the interface 2.5
pin must be present or look as if it cause the interface pin to
sever. 2.5
General 12.6 The residual rosin or tin oil of soldering (component or chip
12
appearance component) is not burned into brown or black color.
2.5
12.7 Sealant on top of the ITO circuit has not hardened.
0.65
12.8 Pin type must match type in specification sheet.
0.65
12.9 LCD pin loose or missing pins.
0.65
12.10 Product packaging must the same as specified on
packaging specification sheet.
0.65
12.11 Product dimension and structure must conform to product
specification sheet.
12.12 Visual defect outside of VA is not considered to be
rejection.

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 RG12864C-BIW-V

11.Precautions in use of LCD Modules

(1)Avoid applying excessive shocks to the module or making any alterations or modifications
to it.
(2)Don’t make extra holes on the printed circuit board, modify its shape or change the
components of LCD module.
(3)Don’t disassemble the LCM.
(4)Don’t operate it above the absolute maximum rating.
(5)Don’t drop, bend or twist LCM.
(6)Soldering: only to the I/O terminals.
(7)Storage: please storage in anti-static electricity container and clean environment.
(8) Raystar have the right to change the passive components, including R3,R6 & backlight
adjust resistors. (Resistors,capacitors and other passive components will have different
appearance and color caused by the different supplier.)
(9)Raystar have the right to change the PCB Rev. (In order to satisfy the supplying stability,
management optimization and the best product performance...etc, under the premise of not
affecting the electrical characteristics and external dimensions, Raystar have the right to
modify the version.)
(10) To ensure the stability of the display screen, please apply screen saver after showing 30
mins of fixed display content.

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 RG12864C-BIW-V

12.Material List of Components for RoHs

1. RAYSTAR Optronics. Inc. hereby declares that all of or part of products (with the mark

“#”in code), including, but not limited to, the LCM, accessories or packages, manufactured

and/or delivered to your company (including your subsidiaries and affiliated company)

directly or indirectly by our company (including our subsidiaries or affiliated companies) do

not intentionally contain any of the substances listed in all applicable EU directives and

regulations, including the following substances.

Exhibit A：The Harmful Material List

Material (Cd) (Pb) (Hg) (Cr6+) PBBs PBDEs

Limited 100 1000 1000 1000 1000 1000

Value ppm ppm ppm ppm ppm ppm

Above limited value is set up according to RoHS.

2.Process for RoHS requirement：(only for RoHS inspection)

(1) Use the Sn/Ag/Cu soldering surface；the surface of Pb-free solder is rougher than we
used before.
(2) Heat-resistance temp.：

Reflow：250℃,30 seconds Max.；

Connector soldering wave or hand soldering：320℃, 10 seconds max.

(3) Temp. curve of reflow, max. Temp.：235±5℃；

Recommended customer’s soldering temp. of connector：280℃, 3 seconds.

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 RG12864C-BIW-V

13.Recommendable Storage
1. Place the panel or module in the temperature 25°C±5°C and the humidity below 65% RH
2. Do not place the module near organics solvents or corrosive gases.
3. Do not crush, shake, or jolt the module.

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 RG12864C-BIW-V

Page: 1
LCM Sample Estimate Feedback Sheet
Module Number：
1、Panel Specification：
1. Panel Type： □ Pass □ NG ,
2. View Direction： □ Pass □ NG ,
3. Numbers of Dots： □ Pass □ NG ,
4. View Area： □ Pass □ NG ,
5. Active Area： □ Pass □ NG ,
6.Operating Temperature： □ Pass □ NG ,
7.Storage Temperature： □ Pass □ NG ,
8.Others：
2、Mechanical Specification：
1. PCB Size： □ Pass □ NG ,
2.Frame Size： □ Pass □ NG ,
3.Materal of Frame： □ Pass □ NG ,
4.Connector Position： □ Pass □ NG ,
5.Fix Hole Position： □ Pass □ NG ,
6.Backlight Position： □ Pass □ NG ,
7. Thickness of PCB： □ Pass □ NG ,
8. Height of Frame to PCB： □ Pass □ NG ,
9.Height of Module： □ Pass □ NG ,
10.Others： □ Pass □ NG ,
3、Relative Hole Size：
1.Pitch of Connector： □ Pass □ NG ,
2.Hole size of Connector： □ Pass □ NG ,
3.Mounting Hole size： □ Pass □ NG ,
4.Mounting Hole Type： □ Pass □ NG ,
5.Others： □ Pass □ NG ,
4、Backlight Specification：
1.B/L Type： □ Pass □ NG ,
2.B/L Color： □ Pass □ NG ,
3.B/L Driving Voltage (Reference for LED Type)：□ Pass □ NG ,
4.B/L Driving Current： □ Pass □ NG ,
5.Brightness of B/L： □ Pass □ NG ,
6.B/L Solder Method： □ Pass □ NG ,
7.Others： □ Pass □ NG ,
＞＞ Go to page 2 ＜＜

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 RG12864C-BIW-V

Page: 2
Module Number：
5、Electronic Characteristics of Module：
1.Input Voltage： □ Pass □ NG ,
2.Supply Current： □ Pass □ NG ,
3.Driving Voltage for LCD： □ Pass □ NG ,
4.Contrast for LCD： □ Pass □ NG ,
5.B/L Driving Method： □ Pass □ NG ,
6.Negative Voltage Output： □ Pass □ NG ,
7.Interface Function： □ Pass □ NG ,
8.LCD Uniformity： □ Pass □ NG ,
9.ESD test： □ Pass □ NG ,
10.Others： □ Pass □ NG ,
6、Summary：

Sales signature：
Customer Signature： Date： / /

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