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353ND T

This document provides technical data and information about EPO-TEK® 353ND-T, a two component, highly thixotropic epoxy. The epoxy has non-flowing properties, high temperature resistance up to 300°C, and is suitable for applications like circuit assembly, medical devices, and bonding various materials. Physical and electrical properties of the epoxy are listed.

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Cothuru Santosh Kumar
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149 views1 page

353ND T

This document provides technical data and information about EPO-TEK® 353ND-T, a two component, highly thixotropic epoxy. The epoxy has non-flowing properties, high temperature resistance up to 300°C, and is suitable for applications like circuit assembly, medical devices, and bonding various materials. Physical and electrical properties of the epoxy are listed.

Uploaded by

Cothuru Santosh Kumar
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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EPO-TEK® 353ND-T

Technical Data Sheet


For Reference Only
High Temperature Thixotropic Epoxy

Number of Components: Two Minimum Bond Line Cure Schedule*:


Mix Ratio By Weight: 10:1 150°C 1 Minute
Specific Gravity: 120°C 5 Minutes
Part A 1.12 100°C 10 Minutes
Part B 1.02 80°C 30 Minutes
Pot Life: 3 Hours
Shelf Life: One year at room temperature.
Note: Container(s) should be kept closed when not in use. *Please see Applications Note available on our website.
– TOTAL MASS SHOULD NOT EXCEED 25 GRAMS -

Product Description:
®
EPO TEK 353ND-T is a two component, highly thixotropic epoxy with non-flowing properties and high temperature
resistance.
®
EPO-TEK 353ND-T Advantages & Application Notes:
 Suitable for fiber optic, medical grade, circuit assembly applications.
 Recommended for bonding metals, glass, ceramics and many types of plastic.
 High temperature adhesive for hybrids and medical devices; it can resist within the 300°C range for long periods of
time.
 Circuit assembly applications; staking SMDs to PCB, bonding ferrite cores together in copper coil windings and
inductor coils and power devices; suitable for COB glob top DAM material.
 Alternative product versions available with distinct viscosity ranges - contact Technical Services at
[email protected] for best recommendation.
 EPO TEK 353ND-T can be applied by screen printing, spatula, hand held or automatic dispensing equipment.
®

 Amber color change when properly cured for easy visual ID and inspection.

Typical Properties: To be used as a guide only, not as a specification. Different batches, conditions & applications yield differing results.
Cure condition: 150°C/1 hour * denotes test on lot acceptance basis Data below is not guaranteed.
Physical Properties:
*Color: Part A: Tan Part B: Amber Weight Loss:
*Consistency: Smooth, thixotropic paste @ 200°C: 0.53%
*Viscosity (@ 20 RPM/23°C): 9,000 – 15,000 cPs @ 250°C: 1.22%
Thixotropic Index: 3.8 @ 300°C: 2.37%
*Glass Transition Temp.(Tg): ≥ 90°C (Dynamic Cure Operating Temp:
20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min) Continuous: - 55°C to 225°C
Coefficient of Thermal Expansion (CTE): Intermittent: - 55°C to 325°C
-6
Below Tg: 43 x 10 in/in/°C Storage Modulus @ 23°C: 559,120 psi
-6 -
Above Tg: 231 x 10 in/in/°C Ions: Cl 471 ppm
+
Shore D Hardness: 80 Na 143 ppm
+
Lap Shear Strength @ 23°C: 1,953 psi NH4 400 ppm
+
Die Shear Strength @ 23°C: ≥ 15 Kg / 5,100 psi K 15 ppm
Degradation Temp. (TGA): 409°C *Particle Size: D99 < 20 microns
Electrical & Thermal Properties:
12
Thermal Conductivity: N/A Volume Resistivity: ≥ 4x10 Ohm-cm
Dielectric Constant (1 KHz): 3.21 Dissipation Factor (1 KHz): 0.003

EPOXY TECHNOLOGY, INC.


14 Fortune Drive, Billerica, MA 01821-3972 Phone: 978.667.3805 Fax: 978.663.9782
www.EPOTEK.com

Epoxies and Adhesives for Demanding Applications™


This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties
(expressed or implied) as to its accuracy and assumes no liability in connection with any use of this product.
Rev. IV
Apr 2012

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