Ads 1115
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ADS1113
S111
5
ADS
1115
ADS1114
ADS1115
www.ti.com SBAS444B – MAY 2009 – REVISED OCTOBER 2009
1FEATURES DESCRIPTION
23 • ULTRA-SMALL QFN PACKAGE: The ADS1113, ADS1114, and ADS1115 are
2mm × 1,5mm × 0,4mm precision analog-to-digital converters (ADCs) with 16
• WIDE SUPPLY RANGE: 2.0V to 5.5V bits of resolution offered in an ultra-small, leadless
QFN-10 package or an MSOP-10 package. The
• LOW CURRENT CONSUMPTION:
ADS1113/4/5 are designed with precision, power, and
Continuous Mode: Only 150μA ease of implementation in mind. The ADS1113/4/5
Single-Shot Mode: Auto Shut-Down feature an onboard reference and oscillator. Data are
• PROGRAMMABLE DATA RATE: transferred via an I2C-compatible serial interface; four
8SPS to 860SPS I2C slave addresses can be selected. The
• INTERNAL LOW-DRIFT ADS1113/4/5 operate from a single power supply
ranging from 2.0V to 5.5V.
VOLTAGE REFERENCE
• INTERNAL OSCILLATOR The ADS1113/4/5 can perform conversions at rates
up to 860 samples per second (SPS). An onboard
• INTERNAL PGA
PGA is available on the ADS1114 and ADS1115 that
• I2C™ INTERFACE: Pin-Selectable Addresses offers input ranges from the supply to as low as
• FOUR SINGLE-ENDED OR TWO ±256mV, allowing both large and small signals to be
DIFFERENTIAL INPUTS (ADS1115) measured with high resolution. The ADS1115 also
features an input multiplexer (MUX) that provides two
• PROGRAMMABLE COMPARATOR differential or four single-ended inputs.
(ADS1114 and ADS1115)
The ADS1113/4/5 operate either in continuous
APPLICATIONS conversion mode or a single-shot mode that
automatically powers down after a conversion and
• PORTABLE INSTRUMENTATION
greatly reduces current consumption during idle
• CONSUMER GOODS periods. The ADS1113/4/5 are specified from –40°C
• BATTERY MONITORING to +125°C.
• TEMPERATURE MEASUREMENT
• FACTORY AUTOMATION AND PROCESS
CONTROLS
VDD VDD
ADS1115 Comparator
ADS1113 ADS1114
Voltage Voltage
Reference Reference ALERT/RDY
AIN0
ADDR AIN1
AIN0 ADDR
2 AIN2
16-Bit DS IC 16-Bit DS 2
SCL MUX PGA IC SCL
ADC Interface AIN3 ADC
AIN1 Interface
SDA ADS1115 SDA
Only
Oscillator Oscillator
GND GND
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2 I2C is a trademark of NXP Semiconductors.
3 All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2009, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
ADS1113
ADS1114
ADS1115
SBAS444B – MAY 2009 – REVISED OCTOBER 2009 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
For the most current package and ordering information, see the Package Option Addendum at the end of this
document, or see the TI web site at www.ti.com.
(1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.
PRODUCT FAMILY
PACKAGE INPUT CHANNELS
DESIGNATOR RESOLUTION MAXIMUM SAMPLE (Differential/
DEVICE MSOP/QFN (Bits) RATE (SPS) COMPARATOR PGA Single-Ended)
ADS1113 BROI/N6J 16 860 No No 1/1
ADS1114 BRNI/N5J 16 860 Yes Yes 1/1
ADS1115 BOGI/N4J 16 860 Yes Yes 2/4
ADS1013 BRMI/N9J 12 3300 No No 1/1
ADS1014 BRQI/N8J 12 3300 Yes Yes 1/1
ADS1015 BRPI/N7J 12 3300 Yes Yes 2/4
ELECTRICAL CHARACTERISTICS
All specifications at –40°C to +125°C, VDD = 3.3V, and Full-Scale (FS) = ±2.048V, unless otherwise noted.
Typical values are at +25°C.
ADS1113, ADS1114, ADS1115
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ANALOG INPUT
Full-scale input voltage (1) VIN = (AINP) – (AINN) ±4.096/PGA V
Analog input voltage AINP or AINN to GND GND VDD V
Differential input impedance See Table 2
FS = ±6.144V (1) 10 MΩ
(1)
FS = ±4.096V , ±2.048V 6 MΩ
Common-mode input impedance
FS = ±1.024V 3 MΩ
FS = ±0.512V, ±0.256V 100 MΩ
SYSTEM PERFORMANCE
Resolution No missing codes 16 Bits
8, 16, 32,
64, 128,
Data rate (DR) SPS
250, 475,
860
Data rate variation All data rates –10 10 %
Output noise See Typical Characteristics
Integral nonlinearity DR = 8SPS, FS = ±2.048V, best fit (2) 1 LSB
FS = ±2.048V, differential inputs ±1 ±3 LSB
Offset error
FS = ±2.048V, single-ended inputs ±3 LSB
Offset drift FS = ±2.048V 0.005 LSB/°C
Offset power-supply rejection FS = ±2.048V 1 LSB/V
Gain error (3) FS = ±2.048V at 25°C 0.01 0.15 %
FS = ±0.256V 7 ppm/°C
Gain drift (3) FS = ±2.048V 5 40 ppm/°C
FS = ±6.144V (1) 5 ppm/°C
Gain power-supply rejection 80 ppm/V
PGA gain match (3) Match between any two PGA gains 0.02 0.1 %
Gain match Match between any two inputs 0.05 0.1 %
Offset match Match between any two inputs 3 LSB
At dc and FS = ±0.256V 105 dB
At dc and FS = ±2.048V 100 dB
Common-mode rejection At dc and FS = ±6.144V (1) 90 dB
fCM = 60Hz, DR = 8SPS 105 dB
fCM = 50Hz, DR = 8SPS 105 dB
DIGITAL INPUT/OUTPUT
Logic level
VIH 0.7VDD 5.5 V
VIL GND – 0.5 0.3VDD V
VOL IOL = 3mA GND 0.15 0.4 V
Input leakage
IH VIH = 5.5V 10 μA
IL VIL = GND 10 μA
(1) This parameter expresses the full-scale range of the ADC scaling. In no event should more than VDD + 0.3V be applied to this device.
(2) 99% of full-scale.
(3) Includes all errors from onboard PGA and reference.
PIN CONFIGURATIONS
RUG PACKAGE
QFN-10 DGS PACKAGE
(TOP VIEW) MSOP-10
SCL (TOP VIEW)
10
ADDR 1 10 SCL
ADDR 1 9 SDA
ALERT/RDY (ADS1114/5 Only) 2 9 SDA
ALERT/RDY (ADS1114/5 Only) 2 ADS1113 8 VDD ADS1113
ADS1114 GND 3 ADS1114 8 VDD
GND 3 ADS1115 7 AIN3 (ADS1115 Only) ADS1115
AIN0 4 7 AIN3 (ADS1115 Only)
AIN0 4 6 AIN2 (ADS1115 Only)
AIN1 5 6 AIN2 (ADS1115 Only)
5
AIN1
PIN DESCRIPTIONS
DEVICE ANALOG/
DIGITAL
INPUT/
PIN # ADS1113 ADS1114 ADS1115 OUTPUT DESCRIPTION
1 ADDR ADDR ADDR Digital Input I2C slave address select
2 NC (1) ALERT/RDY ALERT/RDY Digital Output Digital comparator output or conversion ready (NC for ADS1113)
3 GND GND GND Analog Ground
4 AIN0 AIN0 AIN0 Analog Input Differential channel 1: Positive input or single-ended channel 1 input
5 AIN1 AIN1 AIN1 Analog Input Differential channel 1: Negative input or single-ended channel 2 input
6 NC NC AIN2 Analog Input Differential channel 2: Positive input or single-ended channel 3 input (NC for ADS1113/4)
Differential channel 2: Negative input or single-ended channel 4 input
7 NC NC AIN3 Analog Input
(NC for ADS1113/4)
8 VDD VDD VDD Analog Power supply: 2.0V to 5.5V
9 SDA SDA SDA Digital I/O Serial data: Transmits and receives data
10 SCL SCL SCL Digital Input Serial clock input: Clocks data on SDA
TIMING REQUIREMENTS
tLOW
tR tF tHDSTA
SCL
SDA
tBUF
P S S P
TYPICAL CHARACTERISTICS
At TA = +25°C and VDD = 3.3V, unless otherwise noted.
OPERATING CURRENT vs TEMPERATURE SHUTDOWN CURRENT vs TEMPERATURE
300 5.0
4.5
250
4.0
VDD = 5V
3.5
200
3.0
150 2.5
VDD = 3.3V
VDD = 2V 2.0
100 VDD = 5V
1.5
VDD = 3.3V
50 1.0
0.5
VDD = 2V
0 0
-40 -20 0 20 40 60 80 100 120 140 -40 -20 0 20 40 60 80 100 120 140
Temperature (°C) Temperature (°C)
Figure 2. Figure 3.
0
30
-50 VDD = 4V
20
-100 VDD = 3V
10
-150
0
-200 VDD = 2V
VDD = 5V
-250 -10
-300 -20
-40 -20 0 20 40 60 80 100 120 140 -40 -20 0 20 40 60 80 100 120 140
Temperature (°C) Temperature (°C)
Figure 4. Figure 5.
FS = ±256mV
0.01
FS = ±1.024V, ±2.048V, 0
0 (1) (1) FS = ±2.048V
±4.096V , and ±6.144V
-0.01 -0.05
-0.02
-0.10
-0.03
-0.04 -0.15
-40 -20 0 20 40 60 80 100 120 140 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Temperature (°C) Supply Voltage (V)
Figure 6. Figure 7.
(1) This parameter expresses the full-scale range of the ADC scaling. In no event should more than VDD + 0.3V be applied to this device.
0 -60
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 -2.0 -1.5 -1.0 -0.5 0 0.5 1.0 1.5 2.0
Supply Voltage (V) Input Signal (V)
Figure 8. Figure 9.
0 0
+25°C TA = +125°C TA = +25°C
-20 -20
-40 -40
-60 -60
-0.5 -0.375 -0.250 -0.125 0 0.125 0.250 0.375 0.5 -2.0 -1.5 -1.0 -0.5 0 0.5 1.0 1.5 2.0
Input Signal (V) Input Voltage (V)
-40 20
VDD = 3.3V
-60 0
-0.5 -0.4 -0.3 -0.2 -0.1 0 0.1 0.2 0.3 0.4 0.5 -60 -40 -20 0 20 40 60 80 100 120 140
Input Voltage (V) Temperature (°C)
(2) This parameter expresses the full-scale range of the ADC scaling. In no event should more than VDD + 0.3V be applied to this device.
2
5
8SPS
0 0
-0.5 -0.4 -0.3 -0.2 -0.1 0 0.1 0.2 0.3 0.4 0.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Input Voltage (V) Supply Voltage (V)
7
RMS Noise (mV)
20
6
5 15
4
10
3
2 5
FS = ±2.048V
1 Data Rate = 8SPS
0 0
0
0.020
0.040
-0.010
-0.005
0.005
0.010
0.015
0.025
0.030
0.035
0.045
0.050
0.055
0.060
0.065
0.070
0.075
0.080
0.085
0.090
-40 -20 0 20 40 60 80 100 120 140
Temperature (°C)
Gain Error (%)
Figure 16. Figure 17.
120 2
Total Error (mV)
100 1
80 0
60 -1
40 -2
FS = ±2.048V
20 -3 Data Rate = 860SPS
Differential Inputs
0 -4
-3 -2 -1 0 1 2 3 -2.048 -1.024 0 1.024 2.048
Offset (LSBs) Input Signal (V)
1 -30
Gain (dB)
VDD = 3.3V
0 -40
-1 -50
-2 -60
VDD = 2V
-3 -70
-4 -80
-40 -20 0 20 40 60 80 100 120 140 1 10 100 1k 10k
Temperature (°C) Input Frequency (Hz)
OVERVIEW
of a differential, switched-capacitor ΔΣ modulator
The ADS1113/4/5 are very small, low-power, 16-bit, followed by a digital filter. Input signals are compared
delta-sigma (ΔΣ) analog-to-digital converters (ADCs). to the internal voltage reference. The digital filter
The ADS1113/4/5 are extremely easy to configure receives a high-speed bitstream from the modulator
and design into a wide variety of applications, and and outputs a code proportional to the input voltage.
allow precise measurements to be obtained with very
little effort. Both experienced and novice users of The ADS1113/4/5 have two available conversion
data converters find designing with the ADS1113/4/5 modes: single-shot mode and continuous conversion
family to be intuitive and problem-free. mode. In single-shot mode, the ADC performs one
conversion of the input signal upon request and
The ADS1113/4/5 consist of a ΔΣ analog-to-digital stores the value to an internal result register. The
(A/D) core with adjustable gain (excludes the device then enters a low-power shutdown mode. This
ADS1113), an internal voltage reference, a clock mode is intended to provide significant power savings
oscillator, and an I2C interface. An additional feature in systems that only require periodic conversions or
available on the ADS1114/5 is a programmable digital when there are long idle periods between
comparator that provides an alert on a dedicated pin. conversions. In continuous conversion mode, the
All of these features are intended to reduce required ADC automatically begins a conversion of the input
external circuitry and improve performance. Figure 22 signal as soon as the previous conversion is
shows the ADS1115 functional block diagram. completed. The rate of continuous conversion is
The ADS1113/4/5 A/D core measures a differential equal to the programmed data rate. Data can be read
signal, VIN, that is the difference of AINP and AINN. A at any time and always reflect the most recent
MUX is available on the ADS1115. This architecture completed conversion.
results in a very strong attenuation in any
common-mode signals. The converter core consists
VDD
ADS1115 Comparator
Voltage
MUX Reference ALERT/RDY
Gain = 2/3, 1,
AIN0 2, 4, 8, or 16
ADDR
2
16-Bit DS IC
AIN1 PGA SCL
ADC Interface
SDA
AIN2
Oscillator
AIN3
GND
The first byte sent by the master should be the Second byte: 0b00000000 (points to Conversion
ADS1113/4/5 address followed by a bit that instructs register)
the ADS1113/4/5 to listen for a subsequent byte. The Read Conversion register:
second byte is the register pointer. Refer to Table 9
for a register map. The third and fourth bytes sent First byte: 0b10010001 (first 7-bit I2C address
from the master are written to the register indicated in followed by a high read/write bit)
the second byte. Refer to Figure 30 and Figure 31 for Second byte: the ADS1113/4/5 response with the
read and write operation timing diagrams, MSB of the Conversion register
respectively. All read and write transactions with the
ADS1113/4/5 must be preceded by a start condition Third byte: the ADS1113/4/5 response with the LSB
and followed by a stop condition. of the Conversion register
+3.3V
VDD
100nF +3.3V
GND 2
I C-Capable Master
AIN0 (MSP430F2002)
AIN1 +3.3V
ADDR 10kW 10kW
AIN2 (ADS1115 Only)
SCL SCL (P1.6) VDD
AIN3 (ADS1115 Only) SDA SDA (P1.7) 100nF
GND
ALERT
(ADS1114/5 Only)
0.7V
CA1
ZCM
AINP 0.7V Equivalent
S1 S2 AINP
Circuit
CB ZDIFF
S1 S2
AINN
AINN 0.7V
ZCM
CA2
fCLK = 250kHz
0.7V
The common-mode input impedance is measured by The typical value of the input impedance cannot be
applying a common-mode signal to shorted AINP and neglected. Unless the input source has a low
AINN inputs and measuring the average current impedance, the ADS1113/4/5 input impedance may
consumed by each pin. The common-mode input affect the measurement accuracy. For sources with
impedance changes depending on the PGA gain high output impedance, buffering may be necessary.
setting, but is approximately 6MΩ for the default PGA Active buffers introduce noise, and also introduce
gain setting. In Figure 26, the common-mode input offset and gain errors. All of these factors should be
impedance is ZCM. considered in high-accuracy applications.
The differential input impedance is measured by Because the clock oscillator frequency drifts slightly
applying a differential signal to AINP and AINN inputs with temperature, the input impedances also drift. For
where one input is held at 0.7V. The current that many applications, this input impedance drift can be
flows through the pin connected to 0.7V is the ignored, and the values given in Table 2 for typical
differential current and scales with the PGA gain input impedance are valid.
setting. In Figure 26, the differential input impedance
is ZDIFF. Table 2 describes the typical differential input FULL-SCALE INPUT
impedance.
A programmable gain amplifier (PGA) is implemented
Table 2. Differential Input Impedance before the ΔΣ core of the ADS1114/5. The PGA can
be set to gains of 2/3, 1, 2, 4, 8, and 16. Table 3
FS (V) DIFFERENTIAL INPUT IMPEDANCE shows the corresponding full-scale (FS) ranges. The
(1)
±6.144V 22MΩ PGA is configured by three bits in the Config register.
±4.096V(1) 15MΩ The ADS1113 has a fixed full-scale input range of
±2.048V 4.9MΩ ±2.048V. The PGA = 2/3 setting allows input
measurement to extend up to the supply voltage
±1.024V 2.4MΩ
when VDD is larger than 4V. Note though that in this
±0.512V 710kΩ case (as well as for PGA = 1 and VDD < 4V), it is not
±0.256V 710kΩ possible to reach a full-scale output code on the
ADC. Analog input voltages may never exceed the
1. This parameter expresses the full-scale range of
analog input voltage limits given in the Electrical
the ADC scaling. In no event should more than
Characteristics table.
VDD + 0.3V be applied to this device.
Table 3. PGA Gain Full-Scale Range
PGA SETTING FS (V)
2/3 ±6.144V(1)
1 ±4.096V(1)
2 ±2.048V
4 ±1.024V
8 ±0.512V
16 ±0.256V
SMBus ALERT RESPONSE An I2C bus consists of two lines, SDA and SCL. SDA
carries data; SCL provides the clock. All data are
When configured in latching mode (COMP_LAT = '1' transmitted across the I2C bus in groups of eight bits.
in the Config register), the ALERT/RDY pin can be To send a bit on the I2C bus, the SDA line is driven to
implemented with an SMBus alert. The pin asserts if the appropriate level while SCL is low (a low on SDA
the comparator detects a conversion that exceeds an indicates the bit is zero; a high indicates the bit is
upper or lower threshold. This interrupt is latched and one). Once the SDA line settles, the SCL line is
can be cleared only by reading conversion data, or by brought high, then low. This pulse on SCL clocks the
issuing a successful SMBus alert response and SDA bit into the receiver shift register. If the I2C bus
reading the asserting device I2C address. If is held idle for more than 25ms, the bus times out.
conversion data exceed the upper or lower thresholds
after being cleared, the pin reasserts. This assertion The I2C bus is bidirectional: the SDA line is used for
does not affect conversions that are already in both transmitting and receiving data. When the
progress. The ALERT/RDY pin, as with the SDA pin, master reads from a slave, the slave drives the data
is an open-drain pin. This architecture allows several line; when the master sends to a slave, the master
devices to share the same interface bus. When drives the data line. The master always drives the
disabled, the pin holds a high state so that it does not clock line. The ADS1113/4/5 never drive SCL,
interfere with other devices on the same bus line. because they cannot act as a master. On the
ADS1113/4/5, SCL is an input only.
When the master senses that the ALERT/RDY pin
has latched, it issues an SMBus alert command Most of the time the bus is idle; no communication
(00011001) to the I2C bus. Any ADS1114/5 data occurs, and both lines are high. When communication
converters on the I2C bus with the ALERT/RDY pins is taking place, the bus is active. Only master devices
asserted respond to the command with the slave can start a communication and initiate a START
address. In the event that two or more ADS1114/5 condition on the bus. Normally, the data line is only
data converters present on the bus assert the latched allowed to change state while the clock line is low. If
ALERT/RDY pin, arbitration during the address the data line changes state while the clock line is
response portion of the SMBus alert decides which high, it is either a START condition or a STOP
device clears its assertion. The device with the lowest condition. A START condition occurs when the clock
I2C address always wins arbitration. If a device loses line is high and the data line goes from high to low. A
arbitration, it does not clear the comparator output pin STOP condition occurs when the clock line is high
assertion. The master then repeats the SMBus alert and the data line goes from low to high.
response until all devices have had the respective
After the master issues a START condition, it sends a
assertions cleared. In window comparator mode, the
byte that indicates which slave device it wants to
SMBus alert status bit indicates a '1' if signals exceed
communicate with. This byte is called the address
the high threshold and a '0' if signals exceed the low
byte. Each device on an I2C bus has a unique 7-bit
threshold.
address to which it responds. The master sends an
address in the address byte, together with a bit that
I2C INTERFACE indicates whether it wishes to read from or write to
The ADS1113/4/5 communicate through an I2C the slave device.
interface. I2C is a two-wire open-drain interface that Every byte transmitted on the I2C bus, whether it is
supports multiple devices and masters on a single address or data, is acknowledged with an
bus. Devices on the I2C bus only drive the bus lines acknowledge bit. When the master has finished
low by connecting them to ground; they never drive sending a byte (eight data bits) to a slave, it stops
the bus lines high. Instead, the bus wires are pulled driving SDA and waits for the slave to acknowledge
high by pull-up resistors, so the bus wires are high the byte. The slave acknowledges the byte by pulling
when no device is driving them low. This way, two SDA low. The master then sends a clock pulse to
devices cannot conflict; if two devices drive the bus clock the acknowledge bit. Similarly, when the master
simultaneously, there is no driver contention. has finished reading a byte, it pulls SDA low to
Communication on the I2C bus always takes place acknowledge this to the slave. It then sends a clock
between two devices, one acting as the master and pulse to clock the bit. (The master always drives the
the other as the slave. Both masters and slaves can clock line.)
read and write, but slaves can only do so under the A not-acknowledge is performed by simply leaving
direction of the master. Some I2C devices can act as SDA high during an acknowledge cycle. If a device is
masters or slaves, but the ADS1113/4/5 can only act not present on the bus, and the master attempts to
as slave devices. address it, it receives a not-acknowledge because no
device is present at that address to pull the line low.
When the master has finished communicating with a byte; the I2C specification prohibits acknowledgment
slave, it may issue a STOP condition. When a STOP of the Hs master code. Upon receiving a master
condition is issued, the bus becomes idle again. The code, the ADS1113/4/5 switch on Hs mode filters,
master may also issue another START condition. and communicate at up to 3.4MHz. The ADS1113/4/5
When a START condition is issued while the bus is switch out of Hs mode with the next STOP condition.
active, it is called a repeated START condition.
For more information on high-speed mode, consult
See the Timing Requirements section for a timing the I2C specification.
diagram showing the ADS1113/4/5 I2C transaction.
SLAVE MODE OPERATIONS
I2C ADDRESS SELECTION
The ADS1113/4/5 can act as either slave receivers or
The ADS1113/4/5 have one address pin, ADDR, that slave transmitters. As a slave device, the
sets the I2C address. This pin can be connected to ADS1113/4/5 cannot drive the SCL line.
ground, VDD, SDA, or SCL, allowing four addresses
to be selected with one pin as shown in Table 5. The Receive Mode:
state of the address pin ADDR is sampled
In slave receive mode the first byte transmitted from
continuously.
the master to the slave is the address with the R/W
Table 5. ADDR Pin Connection and bit low. This byte allows the slave to be written to.
Corresponding Slave Address The next byte transmitted by the master is the
register pointer byte. The ADS1113/4/5 then
ADDR PIN SLAVE ADDRESS acknowledge receipt of the register pointer byte. The
Ground 1001000 next two bytes are written to the address given by the
VDD 1001001 register pointer. The ADS1113/4/5 acknowledge each
SDA 1001010 byte sent. Register bytes are sent with the most
significant byte first, followed by the least significant
SCL 1001011
byte.
Default = 8583h.
(1) This parameter expresses the full-scale range of the ADC scaling. In no event should more than VDD + 0.3V be applied to this device.
1 9 1 9
SCL ¼
(1) (1)
SDA 1 0 0 1 0 A1 A0 R/W 0 0 0 0 0 0 P1 P0
1 9 1 9
SCL ¼
(Continued)
Frame 3 Two-Wire Slave Address Byte Frame 4 Data Byte 1 Read Register
1 9
SCL
(Continued)
SDA
D7 D6 D5 D4 D3 D2 D1 D0
(Continued)
From ACK By Stop By
ADS1113/4/5 Master
(3) Master
Frame 5 Data Byte 2 Read Register
1 9 1 9
SCL ¼
1 9 1 9
SCL
(Continued)
SDA
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
(Continued)
ACK By ACK By Stop By
ADS1113/4/5 ADS1113/4/5 Master
ALERT
1 9 1 9
SCL
APPLICATION INFORMATION
The following sections give example circuits and The ADS1113/4/5 interface directly to standard mode,
suggestions for using the ADS1113/4/5 in various fast mode, and high-speed mode I2C controllers. Any
situations. microcontroller I2C peripheral, including master-only
and non-multiple-master I2C peripherals, can operate
BASIC CONNECTIONS with the ADS1113/4/5. The ADS1113/4/5 do not
perform clock-stretching (that is, they never pull the
For many applications, connecting the ADS1113/4/5 clock line low), so it is not necessary to provide for
is simple. A basic connection diagram for the this function unless other clock-stretching devices are
ADS1115 is shown in Figure 33. on the same I2C bus.
The fully differential voltage input of the ADS1113/4/5 Pull-up resistors are required on both the SDA and
is ideal for connection to differential sources with SCL lines because I2C bus drivers are open-drain.
moderately low source impedance, such as The size of these resistors depends on the bus
thermocouples and thermistors. Although the operating speed and capacitance of the bus lines.
ADS1113/4/5 can read bipolar differential signals, Higher-value resistors consume less power, but
they cannot accept negative voltages on either input. increase the transition times on the bus, limiting the
It may be helpful to think of the ADS1113/4/5 positive bus speed. Lower-value resistors allow higher speed
voltage input as noninverting, and of the negative at the expense of higher power consumption. Long
input as inverting. bus lines have higher capacitance and require
When the ADS1113/4/5 are converting data, they smaller pull-up resistors to compensate. The resistors
draw current in short spikes. The 0.1μF bypass should not be too small; if they are, the bus drivers
capacitor supplies the momentary bursts of extra may not be able to pull the bus lines low.
current needed from the supply.
ADS1115 10
VDD
SCL
1 ADDR SDA 9
VDD
Pull-Up Resistors 2 ALERT/RDY VDD 8
1kW to 10kW (typ)
3 GND AIN3 7 0.1mF (typ)
SCL
SDA
CONNECTING MULTIPLE DEVICES states. To drive the line low, the pin is set to output
'0'; to let the line go high, the pin is set to input. When
Connecting multiple ADS1113/4/5s to a single bus is the pin is set to input, the state of the pin can be
simple. Using the address pin, the ADS1113/4/5 can read; if another device is pulling the line low, this
be set to one of four different I2C addresses. An configuration reads as a '0' in the port input register.
example showing three ADS1113/4/5 devices is given
in Figure 35. Up to four ADS1113/4/5s (using Note that no pull-up resistor is shown on the SCL
different address pin configurations) can be line. In this simple case, the resistor is not needed;
connected to a single bus. the microcontroller can simply leave the line on
output, and set it to '1' or '0' as appropriate. This
Note that only one set of pull-up resistors is needed action is possible because the ADS1113/4/5 never
per bus. The pull-up resistor values may need to be drive the clock line low. This technique can also be
lowered slightly to compensate for the additional bus used with multiple devices, and has the advantage of
capacitance presented by multiple devices and lower current consumption as a result of the absence
increased line length. of a resistive pull-up.
The TMP421 and DAC8574 devices detect the If there are any devices on the bus that may drive the
respective I2C bus addresses based on the states of clock lines low, this method should not be used; the
pins. In the example, the TMP421 has the address SCL line should be high-Z or '0' and a pull-up resistor
0101010, and the DAC8574 has the address provided as usual.
1001100. Consult the DAC8574 and TMP421 data
sheets, available at www.ti.com, for further details. Some microcontrollers have selectable strong pull-up
circuits built in to the GPIO ports. In some cases,
USING GPIO PORTS FOR COMMUNICATION these circuits can be switched on and used in place
of an external pull-up resistor. Weak pull-ups are also
Most microcontrollers have programmable provided on some microcontrollers, but usually these
input/output (I/O) pins that can be set in software to are too weak for I2C communication. If there is any
act as inputs or outputs. If an I2C controller is not doubt about the matter, test the circuit before
available, the ADS1113/4/5 can be connected to committing it to production.
GPIO pins and the I2C bus protocol simulated, or
bit-banged, in software. An example of this
configuration for a single ADS1113/4/5 is shown in
Figure 34.
Bit-banging I2C with GPIO pins can be done by
setting the GPIO line to '0' and toggling it between
input and output modes to apply the proper bus
ADS1115 10
VDD
SCL
1 ADDR SDA 9
4 AIN0 AIN2 6
GPIO_1 AIN1
5
GPIO_0
GND VDD
GND VDD
ADS1115 10
SCL 10
ADS1115
1 ADDR SDA 9 SCL
SDA
SCL
SDA
ADS1115 10
ADS1115 10
SCL SCL
1 ADDR SDA 9 1 ADDR SDA 9
TMP421
ADS1115 10 1 DXP V+ 8
SCL Leave
2 DXN SCL 7
Floating
1 ADDR SDA 9
3 A1 SDA 6
2 ALERT/RDY VDD 8
4 A0 GND 5
3 GND AIN3 7
4 AIN0 AIN2 6
AIN1 DAC8574
5 1 VOUTA A3 16
2 VOUTB A2 15
3 VREFH A1 14
ADS1115 10 4 VDD A0 13
SCL
5 VREFL IOVDD 12
1 ADDR SDA 9
6 GND SDA 11
2 ALERT/RDY VDD 8
7 VOUTC SCL 10
3 GND AIN3 7
8 VOUTD LDAC 9
4 AIN0 AIN2 6
AIN1
5
NOTE: ADS1113/4/5 power and input connections omitted for
clarity. ADDR, A3, A2, A1, and A0 select the I2C addresses.
NOTE: ADS1113/4/5 power and input connections omitted for
clarity. The ADDR pin selects the I2C address. Figure 36. Connecting Multiple Device Types
Figure 35. Connecting Multiple ADS1113/4/5s
VDD
Output Codes
ADS1115 10 0-32767
SCL
1 ADDR SDA 9
2 ALERT/RDY VDD 8
Inputs Selected
from Configuration
Register
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
www.ti.com 11-Apr-2013
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Top-Side Markings Samples
(1) Drawing Qty (2) (3) (4)
ADS1113IDGSR ACTIVE VSSOP DGS 10 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 BROI
& no Sb/Br)
ADS1113IDGST ACTIVE VSSOP DGS 10 250 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 BROI
& no Sb/Br)
ADS1113IRUGR ACTIVE X2QFN RUG 10 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 N6J
& no Sb/Br)
ADS1113IRUGT ACTIVE X2QFN RUG 10 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 N6J
& no Sb/Br)
ADS1114IDGSR ACTIVE VSSOP DGS 10 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 BRNI
& no Sb/Br)
ADS1114IDGST ACTIVE VSSOP DGS 10 250 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 BRNI
& no Sb/Br)
ADS1114IRUGR ACTIVE X2QFN RUG 10 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 N5J
& no Sb/Br)
ADS1114IRUGT ACTIVE X2QFN RUG 10 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 N5J
& no Sb/Br)
ADS1115IDGSR ACTIVE VSSOP DGS 10 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 BOGI
& no Sb/Br)
ADS1115IDGST ACTIVE VSSOP DGS 10 250 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 BOGI
& no Sb/Br)
ADS1115IRUGR ACTIVE X2QFN RUG 10 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 N4J
& no Sb/Br)
ADS1115IRUGT ACTIVE X2QFN RUG 10 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 N4J
& no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 11-Apr-2013
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
• Automotive: ADS1115-Q1
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 19-Nov-2012
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 19-Nov-2012
Pack Materials-Page 2
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