Number

2.1.1
Subject
Microsectioning, Manual and Semi or Automatic
3000 Lakeside Drive, Suite 105N
Bannockburn, IL 60015-1249
Method
Date Revision
6/15 F
IPC-TM-650 Originating Task Group

TEST METHODS MANUAL Microsection Subcommittee (7-12)

1 Scope This method is to be used as a guideline for pre- 4.2 Personal Protective Equipment (e.g., eye protection,
paring a metallographic specimen of printed boards. The fin- gloves)
ished microsection is used for evaluating the quality of the
laminate system and plated structures (plated-through holes, 4.3 Ventilation system (Fume Hood) in compliance with
solder joints, vias, etc.). The plated structures can be evalu- material SDS (as required)
ated for characteristics of the copper foils, plating, and/or
coatings to determine compliance with applicable perfor- 4.4 Mount molds.
mance specification requirements.
Metallographic sample preparation is regarded by many as 4.5 Smooth, flat mounting surface.
essentially a highly developed skill; this method describes
those techniques that have been found to be generally 4.6 Release agent (optional).
acceptable. It does not attempt to be so specific as to not
allow acceptable variations that can differentiate metallogra- 4.7 Sample supports (optional for Method A).
phers. Furthermore, the success of these techniques remains
highly dependent upon the skill of the individual metallogra- 4.8 Sample alignment tools (Method B).
pher.
4.9 Metallographic wet grinding/polishing system or equip-
Note: These microsection techniques are processes and are
ment (as applicable).
intended as guidelines and thus variations are allowed.
Note: The use of the materials listed in Section 4 may be lim- 4.10 Low magnification visual aid (reticle optional)
ited or forbidden in some environments. Please review the
Safety Data Sheet (SDS) for the materials being used. 4.11 Metallographic microscope capable of minimum con-
struction integrity magnifications as specified in procurement
1.1 Method A (Manual) Description Manual metallo- documentation.
graphic preparation of sample(s).
4.12 Vacuum pump and desiccator or pressure pot
1.2 Method B (Semi or Automatic) Description Semi or (optional).
automatic metallographic preparation utilizing dedicated
microsection equipment to prepare multiple samples. 4.13 Potting material (maximum cure temperature 93 °C
[200 °F]). (For discussion on selection of potting material refer
2 Applicable Documents
to IPC-MS-810.)
IPC-MS-810 Guidelines for High Volume Microsectioning
4.14 Sandpaper. Federation of European Producers of
ASTM E 3 Standard Methods of Preparation of Metallo-
graphic Specimens Abrasives (FEPA)(ISO 6344) paper backed Silicon Carbide P
(coated) abrasive medium P80-P4000 (United States CAMI
3 Test Specimens A test coupon or printed board to be (Coated Abrasive Manufacturers Institute) grit range: 80-1200.
inspected per the applicable performance specification, which
includes the features to be evaluated (i.e., plated holes or 4.15 Polishing Cloths. A hard, low, or no nap cloth for rough
laminate). This may require multiple microsections. and intermediate polishing, and a soft, woven, or medium nap
cloth for final polishing.
4 Apparatus or Material
4.16 Oxide or colloidal silica polishing suspension (final pol-
4.1 Sample removal method (see IPC-MS-810 for the best
ish, 0.3 - 0.04 µm [11.8 - 1.57 µin]). (Optional).
method to meet your needs).

Material in this Test Methods Manual was voluntarily established by Technical Committees of IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this Page 1 of 8
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by IPC.
 IPC-TM-650
Number Subject Date
2.1.1 Microsectioning, Manual and Semi or Automatic Method 6/15

Revision
F

4.17 Diamond polishing abrasive (6.0 - 1.0 µm [236 - 39.4 approximately 1.27 mm [0.05 in] of final polish depth. Ensure
µin]). that the evaluation edge is parallel to the mounting surface
and the sample maintains perpendicularity as shown in Figure
4.18 Polishing lubricant. 5-1.

4.19 Specimen etching solution (see 5.5.2.1).

NOT PERPENDICULAR PERPENDICULAR
4.20 Cotton balls and swabs for cleaning and etchant appli-
cation.

4.21 Isopropyl alcohol, 25% methanol aqueous solution, or

other suitable solvent (check for reaction with the encapsula-
tion media and marking system).
90º
4.22 Permanent identification marking method (e.g., laser
IPC-221-5-1
scribing, permanent marker, embedded label, etc.) to provide
traceability. Figure 5-1 Maintaining Perpendicularity throughout the
Microsection Process
4.23 Ultrasonic cleaner (optional).
5.2.2 Method B Remove the specimen from the printed
5 Procedure The procedure steps of this section are board or panel such that the tooling pin holes or target PTHs
applicable to both Method A and Method B unless otherwise are not damaged.
indicated.
5.2.2.1 Inspect Tooling Pin System Inspect the tooling
5.1 Removal of Specimen Remove the required speci- pin holes or slots to verify they are not plugged or damaged.
men(s) from the product to be tested. Allow sufficient clear- Clear plugged tooling pin holes with a tool that will not change
ance to prevent damage to the area to be examined. Some its dimensional location or enlarge the hole. A drill bit of the
commonly used methods include sawing using a jewelers same hole diameter is recommended.
saw, miniature band saw, diamond saw or abrasive cut-off
wheel; routing using a small milling machine; or punching Inspect the tooling pins for foreign material adhering to them.
using a sharp, hollow die (not recommended for thick or brittle Clean the pin surface as required. Discard any pins that are
materials, i.e., polyimide and some modified epoxy resin sys- bent or the surface scarred.
tems) (see IPC-MS-810). All samples must maintain required
traceability. 5.3 Mounting Metallographic Sample

5.2 Preparation of Specimen 5.3.1 Clean mount molds and mounting surface and dry
thoroughly. Apply release agent (Optional).
Note: Complete any required preconditioning and/or stress
testing prior to mounting.
5.3.2 Thoroughly clean the sample using a suitable solvent
Note: To determine correct plane of grind for plated struc- such as isopropyl or ethyl alcohol. This is especially important
tures with a length of 0.010 inch or less, the diameter of the when flux or oil is present as it may result in poor adhesion of
structure shall be required for the assessment. For microvias the potting material causing gaps between the specimen and
the diameter of the structure at the capture land layer shall be the material. These gaps make proper metallographic sample
provided. For stacked structures where both structures do not preparation extremely difficult, if not impossible.
meet center of hole tolerance at the same time, refer to the
performance specification for guidance or AABUS. 5.3.3 Loading the Specimen

5.2.1 Method A Deburr all edges prior to mounting using 5.3.3.1 Method A Stand specimen in mount mold, perpen-
rough grind grit in accordance with Table 5-1 to within dicular to the base using sample supports, clips, or with the

Page 2 of 8
 IPC-TM-650
Number Subject Date
2.1.1 Microsectioning, Manual and Semi or Automatic Method 6/15

Revision
F

use of double-sided adhesive tape. Keep sample in center of 5.3.8 Marking of Specimen Identify the specimen by a
mount mold. permanent method (see 4.22). The selected marking system
should remain unaffected by subsequent processing.
5.3.3.2 Method B Load specimen on tooling pins. The pins
align the target PTHs on a common plane. This common 5.3.9 Mount Preparation
plane assures all the PTHs will grind to the center of the hole
at the same instance. 5.3.9.1 Method A Remove sharp edges and flatten top
Push the tooling pins into the tooling holes or slots. The pins with low grit (240) sand paper.
must fit snugly.
5.3.9.2 Method B Remove the excess mounting material
5.3.4 Preparing Potting Material Personal protection is from the exposed ends of pins.
recommended to prevent skin sensitization. Prepare potting
material to ensure cure temperature does not exceed 93 °C 5.4 Grinding and Polishing The following is a description
[200 °F]. Mix by folding the potting material in such a way so of the basic grinding and polishing steps. Other methods may
as to minimize air bubbles. be required by contract. See Table 5-1 for examples of 2, 3,
4, and 5-step methods for Method A and Table 5-2 and Table
5.3.5 Pouring Potting Material Fill the mount mold care- 5-3 for Method B.
fully with potting material, by pouring from one side to ensure
The minimum qualities the mount shall exhibit are:
adhesion to all sample surfaces.
1) The grinding and polishing accuracy of the microsection
5.3.5.1 Method A The sample must remain upright while shall be such that the viewing area of each of the PTHs is
pouring. within 10% of the drilled diameter of the hole as shown in
Figure 5-2.
5.3.5.2 Method B Assure the tooling pins do not shift 2) Only fine grind scratches apparent on the mount when
position or rise up while pouring and/or curing of the potting viewed at 100X magnification.
material.
3) Little or no gap between the potting material and the
5.3.6 Removal of Vacuum or Pressure for Potting Mate- specimen(s).
rials While in a liquid state, potting materials may require 4) No residual abrasive paper grit material on the mount
vacuum or pressure in order to achieve proper encapsulation. surface.
Remove vacuum or pressure prior to cure to prevent undue 5) The ground surface has only one plane of material removal.
stress on the specimen. If the mount has several planes of material removal, por-
tions of the sample will not polish since the odd surface
5.3.7 Cure and Mount Removal Allow specimen to cure
never touches the polishing cloth.
and cool to room temperature before removing hardened
mount from mount mold. The minimum qualities the mount Note: Ultrasonic cleaning is highly recommended, especially
should exhibit are: between the finer grinding steps, prior to rough polishing and
between all polishing steps. It is the nature of printed board
• The potting material is hard and not tacky. specimens, especially those with epoxy base material follow-
• Minimal bubbles in the potting material. ing thermal exposures, to contain voids that can trap grinding
and polishing residues that are not removed during simple
• No gaps between the potting material and the sample.
rinsing. Care needs to be exercised not to damage the speci-
• All gaps in structure to be evaluated should be filled with men surface with excessive ultrasonic cleaning. Specimen
potting material. sample can be placed with the polished surface perpendicu-
The presence of these deficiencies will result in sample prepa- lar to the bottom of the vessel. Ultrasonic cleaning for as little
ration difficulties, as noted in 5.3.2. as one minute can damage a polished surface.

Page 3 of 8
 IPC-TM-650
Number Subject Date
2.1.1 Microsectioning, Manual and Semi or Automatic Method 6/15

Revision
F

5.4.2 Grinding Method B

1 2

3 5.4.2.1 Tooling Stops The mount holder has tooling stops

3 to allow the equipment to grind a set distance. These stops
must be calibrated for each abrasive paper grit to assure that
any scratches from the previous step are removed. See IPC-
MS-810 for a detailed discussion and examples.

5.4.2.2 Grind Pressure The equipment’s pressure setting

IPC-211-5-2.eps
is the direct force on a load cell. To determine the pressure on
Figure 5-2 Plated Hole Microsection (Grinding/Polishing) each mount, divide the pressure setting by the surface area of
Tolerance the mounts being processed. See IPC-MS-810 for a detailed
Note 1. Measurement Example with a Negative Etchback
discussion and examples.
Process
Note 2. Measurement Example with an Etchback/Desmear The recommended pressure setting for six mounts at 38.1
Process mm [1.5 in] diameter is 351.5 g/sq. cm (5.0 psi) with the wheel
Note 3. Center of Hole Measurement Location
rotation between 300 - 600 RPM.
Note 4. Minimum Viewing Area Length = Drill Diameter x 0.9
Note 5. Maximum Viewing Area Length = Drill Diameter
5.4.2.3 Other Variables Recommended variables to be
5.4.1 Grinding Method A familiar with are length of time the abrasive paper removes
material efficiently, scratch size the abrasive paper causes on
5.4.1.1 Rough Grinding Rough grind the mount prior to the specimen(s) surface, and water quality (undissolved par-
the feature intended to be evaluated with abrasive medium. ticles that can cause scratches; i.e., calcium deposits).

Wheel speeds of 200 to 300 rpm are generally used during 5.4.2.4 Grind the Mounts Be liberal with the amount of
grinding. water used to promote efficient removal of material by the
Rotate the specimen 90° between each successive grit size abrasive paper. The hardness of the specimen will dictate the
and grind for two to three times the time it takes to remove number of rough and fine grind steps needed to reach near
the scratches from the previous step. The scratch removal the center of the hole. The rough grind grits ANSI 180-240
can be verified by microscopic inspection between steps. It is (P180 - P240 FEPA) are used to enter the edge of the PTH,
of great importance that the ground surface of the microsec- and the fine grind grits ANSI 400-600 (P800-P1200 FEPA) are
tion is in a single plane. The purpose of rotating the microsec- used to grind near the center of the hole. The distance to stop
tion 90° between successive grit sizes is to facilitate short of the center is determined by the scratch size of the last
inspection. If scratches are observed to be perpendicular to grind step used.
those made during the last step performed, it is a good indi-
A recommended grinding process from which to start devel-
cation that the surface is not flat and the microsection requires
opment is provided in Table 5-2.
additional grinding. If the surface of the microsection is not flat
upon completion of the grinding operations, it may not be
5.4.2.5 Clean the Mounts Clean the mount surface with a
possible to remove all of the grinding scratches during fine
mild hand soap to remove the abrasive grit. This is especially
grinding.
important when the same mount holder is used for grinding
Caution: Copious water flow must be used to prevent over- and polishing. Be careful not to scratch the surfaces to be
heating, damage to the specimen, and removal of grinding evaluated while cleaning.
debris on all grinding steps.
5.4.3 Polish The diamond polish media is preferred for
5.4.1.2 Fine Grinding The final abrasive medium (ANSI printed boards. Diamond media substantially reduces the risk
600 grit/P1200 FEPA) should finish at the axial centerline of of metal smear and rounding. Diamonds provide a sharper
the intended feature to be evaluated, such as the plated definition of copper surfaces to evaluate for separation of con-
structure. ductive surfaces.

Page 4 of 8
 IPC-TM-650
Number Subject Date
2.1.1 Microsectioning, Manual and Semi or Automatic Method 6/15

Revision
F

Table 5-1 Suggested Grinding/Polishing Steps – Method A1,2

2 Step3 3 Step 4 Step 5 Step Grit ANSI (FEPA)
60 (P60)
80 (P80)
120 (P120)
180 (P180)
Rough Grinding
220 (P220)
240 (P280)
280 (P320)
320 (P320)
400 (P800)
600 (P1200)
Fine Grinding
800 (P2000)
1200 (P4000)
5 micron
3 micron
Polish
1 micron
0.25 Micron
Note 1. The metallographer should recognize the fact that the coarser grit sizes (180, 240, and 320) induce a larger depth of deformed and fragmented material.
Since the depth of deformation decreases sharply below a particle size of about 30.0 µm [1181 µin] (400 grit), it is better practice to spend longer times on
400 grit and especially 600 grit to achieve the final plane sectioning, rather than on the coarser grit sizes.
Note 2. The multiple step method represent ranges that can be used and any one grit size can be used per step.
Note 3. The 2 step process may be used for in-process checks but is not recommended for final acceptance of product.

Table 5-2 Recommended Grinding Process – Method B polishing. The reason for this is that the polish process
Step 1 Step 2 Step 3 removes a negligible amount of material and will not change
Abrasive grit size P180 P 400(opt) P1000 the flatness of the surface. The number of polish steps is
determined by the hardness of the specimen(s), distance to
RPM 200-300 200-300 200-300
the center of the hole, and scratch size of the last fine grind
Pressure (g/sq.cm) 351.5 351.5 351.5
step. There may be multiple intermediate polish steps but only
Time 15 seconds after the stops touch
one final polish step.

5.4.3.1 Rough Polish Rough polish (6 - 3 µm [236 -118 5.4.3.4 Method B – Intermediate Polish Steps The inter-
µin]) the specimen using a hard, low, or no nap cloth. mediate steps must remove the fine grind scratches and pre-
Reduced wheel speeds are generally used during final polish- pare the surface for the final polish step. The recommended
ing due to the increased drag on the microsection. Utilize rec- process settings for six mounts at 38.1 mm [1.5 in] diameter
ommended lubricant for each polishing medium. Following is less than 351.5 g/sq. cm [5.0 PSI], a medium to hard pol-
rough polishing, microscopically examine the specimen to ish cloth, short nap surface, and low wheel RPM (100-200).
verify removal of all previous grit scratches. Ultrasonically
Additional variables that must be considered are volume of
clean the specimen, if desired.
lubricant, lubricant types, abrasive size, abrasive type (dia-
5.4.3.2 Fine Polish Continue polishing with 1.0 - 0.25 µm mond or oxide), and process time.
[39.4 - 118 µin] using a hard, low, or no nap cloth and micro-
scopically examine the specimen to verify the removal of all 5.4.3.5 Method B – Final Polish the Mounts The final
the previous scratches. polish step removes the scratches from intermediate polishing
and prepares the surface for evaluation. The recommended
5.4.3.3 Method B – Polish Process Setup The tooling process setting for the same surface areas as 5.4.3.4 are a
stops are recessed or removed from the mount holder during medium to soft polish cloth, low wheel RPM (100 - 200), and

Page 5 of 8
 IPC-TM-650
Number Subject Date
2.1.1 Microsectioning, Manual and Semi or Automatic Method 6/15

Revision
F

low pressure setting 351.5 g/sq. cm [5.0 PSI] or less. Addi- depth is insufficient, additional grinding and repolishing
tional variables that must be considered are volume of lubri- may be required.
cant, type of nap surface on polish cloth, and process times. 5) There is little, if any, visible preparation induced damage to
The type of abrasive used must be diamond (maximum rated the glass fibers of the base material.
size: 1.0 µm [39.4 µin]) or colloidal silica.
See IPC-MS-810 for photomicrographs illustrating some of
WARNING: If a high nap polish cloth is used too long in the the above qualities.
final polish, the inspectors ability to see defects can be ham-
pered. This step must be engineered for short process times 5.5 Examination of Microsections
(30 seconds or less) with a careful balance of lubricant to pre-
vent copper rounding. 5.5.1 ‘‘As-Polished’’ Condition When specified, examine
A recommended polish process from which to start develop- the microsection of multilayer printed boards in the ‘‘as-
ment is provided in Table 5-3. polished’’ condition to assess attributes such as internal layer
separation (which may appear as dark lines or partial dark
Table 5-3 Recommended Polishing Process - Method B lines). These areas should be documented prior to microetch-
ing and verified after metallographic etching. There may not be
Intermediate Final Optional1
a one-to-one correlation of all separations noted ‘‘as-
Type of cloth Napless Napless Nap
polished’’ versus those noted after etching, when examined at
Type of polish
Diamond Diamond Diamond the specified magnifications.
abrasive
Polish 3.0 µm 1.0 µm 1.0 µm It is recommended to microetch immediately after the ‘‘as-
abrasive size [118 µin] [39.4 µin] [39.4 µin] polished’’ evaluation to avoid oxidation.
Time — — 30 sec max.
Pressure 351.5 351.5 351.5 5.5.2 Microetched Condition
(g/sq. cm) [5.0 psi] or [5.0 psi] or [5.0 psi] or Caution: Over etching may totally obscure the demarcation
[PSI] less less less line between the copper foil and electroplated copper, pre-
Note 1. When inspecting for innerlayer separations, the optional polish step venting accurate inspection.
shall not be used (see 6.2).
Note 2. Generally, polishing using medium pressure during the above steps is
sufficient if the microsection has been ground correctly. This final 5.5.2.1 Prepare a small volume of copper etch solution
step is only performed for 10 - 20 seconds using light to medium such that:
pressure when using oxide or silica polishing compounds. When
using diamond compounds on soft woven cloths, final polishing may a) (no more than 10ml) containing 50/50 v/v of ammonium
extend several minutes (see 6.3).
hydroxide (nominally 28%; grade is not defined) and stabi-
lized hydrogen peroxide (nominally 3%; grade is not
5.4.3.6 Rinse in mild soap and warm water or IPA and blow
defined). This is the most active concentration and will last
dry.
about one hour.
Caution: Do not touch or wipe surface with anything that Note: Hydrogen peroxide solution is light sensitive and
might cause scratches to the polished surface. should be stored in an opaque container.
5.4.3.7 Examine and repolish, beginning with 6.0 µm [236 b) The addition of 25 ml of water (distilled or reverse osmosis)
µin] diamond, if necessary, until: will dilute the solution, resulting in longer etching times,
1) There are no scratches larger than those induced by the which may be desirable in certain situations. This concen-
final polishing abrasive. tration will have to be remade with each batch.

2) The specimen is not higher or lower than the mounting

5.5.2.2 Expose the surface of the microsection to the etch
material (rounding of metal surfaces).
solution by using one of the following methods:
3) There is no smearing of the copper plating into the PTH or
a) Swab
base material.
1) Apply etchant to a swab (outcome based control: no
4) The plane of microsectioning is at the centerline of the hole
nonconforming scratches caused by swab).
as defined by the governing specification. If the grinding

Page 6 of 8
 IPC-TM-650
Number Subject Date
2.1.1 Microsectioning, Manual and Semi or Automatic Method 6/15

Revision
F

2) Activate the etchant with a copper solid (i.e., plated 5 µm [0.0002 in]. This process is optional and is not for stan-
copper/copper foil). Use a cotton swab to lightly rub a dard evaluation purposes.
piece of copper and return swab to solution.
3) Gently swab the surface of the microsection (outcome 6.2 Plating Separation Evaluation For a more accurate
based control: grain structure and plating interfaces are evaluation of possible internal plating separations (e.g., inner
slightly exposed). layer interconnect and via to target land separation), the fol-
lowing procedure is recommended to remove the etch demar-
4) Rinse with running tap or deionized water (quality is not
cation line and return a micro-etched sample to an
defined).
as-polished condition:
5) Rinse in suitable solvent (optional).
1) With the wheel in a stationary position, gently and manually
6) Blot dry with cloth or blow dry (outcome based control:
regrind the specimen using copious amounts of water and
no nonconforming scratches caused by cloth, no oil or
600 grit abrasive medium. Six to eight double strokes
debris from gas source).
should be sufficient. This action will remove any copper
b) Submersion metal smear that may have occurred over the plating sepa-
1) Activate the etchant with a copper solid (Using appro- ration during rotary polishing.
priate method). 2) Rinse and dry specimen and repolish per 5.4.3.1 and
2) Submerse microsection surface in etchant. 5.4.3.2, then reexamine to determine if any internal plating
3) Provide a means to refresh the etchant at the surface separation exists.
where the reaction is taking place (nominally 3 to 5 sec-
onds, outcome based control: grain structure and plat- 6.3 Polishing Considerations
ing interfaces are slightly exposed). • The use of napped cloths can result in poor edge retention
4) Rinse with running tap or deionized water (quality is not (rounding) and relief between constituents since it exacer-
defined). bates the varying rates of material removal (i.e., tin-lead alloy
5) Rinse in suitable solvent (optional). and the softer encapsulation media are removed at a faster
6) Blot dry with cloth or blow dry (outcome based control: rate than the copper or glass fibers in the base material); the
no nonconforming scratches caused by cloth, no oil or higher the nap, the more the effect. The user needs to mini-
debris from gas source). mize the polishing time and use ample lubricant and light
pressure during final polishing. When using diamond com-
5.6 Evaluation pounds on soft woven cloths, final polishing may extend
several minutes.
5.6.1 Refer to the appropriate printed board performance
• Reduced wheel speeds of 100 to 150 rpm are generally
specification for magnification and evaluation requirements of
used during final polishing due to increased drag on the
completed microsection.
microsection.

6 Notes • Typically, 6.0 µm [236 µin] followed by 1.0 µm [39.4 µin]

diamond and a 0.04 µm [1.57 µin] colloidal silica or 0.05 µm
6.1 Overplating Overplating the specimen per ASTM E 3 [1.97 µin] alumina have been used successfully. However,
with a layer of copper or other plating with a hardness similar other variations such as 6.0 µm [236 µin], 3.0 µm [118 µin],
to the specimen, prior to encapsulation, provides better edge and 0.25 µm [9.84 µin] diamond have also been used suc-
retention, thereby providing more accurate final finish thick- cessfully. Some have even used 1.0 µm and 0.3 µm [39.4
ness measurements. Plating can be done electrolytically or µin and 11.8 µin] alumina on napless cloths followed by 0.05
with electroless solutions. Thoroughly clean the specimen sur- µm [1.97 µin] alumina on a soft, medium napped cloth.
face prior to plating to ensure good adhesion of the plating.
Milder cleaning treatments that involve detergents, solvents, NOTE: Alumina and napped cloths can be used successfully,
mild alkaline, or acidic solutions are recommended. Copper depending upon the skill of the metallographer, but will gener-
and nickel are predominantly used in metallographic laborato- ally result in poorer edge retention and more relief effects than
ries. It is recommended that the plating thickness be at least the diamond compounds (see Section 7, Reference 1).

Page 7 of 8
 IPC-TM-650
Number Subject Date
2.1.1 Microsectioning, Manual and Semi or Automatic Method 6/15

Revision
F

6.4 Horizontal Microsection A performance standard

may require, for referee inspections (such as smear, breakout,
interconnect separations, etc.), a horizontal grind (perpendicu-
lar to the original vertical plane) on a vertical microsection. This
method has a low success rate when the separation affects
less than 50% of the internal layer thickness (as noted on the
vertical microsection).

6.5 Etchants There are other etchant solutions that have

been used or that may be developed for etching copper. Care
must be exercised in their selection and use because of the
sensitive nature of the electrolytic, electroless, and foil etching
characteristics as well as possible galvanic effects in the pres-
ence of tin-lead (see Section 7, Reference 2, and IPC-MS-
810).
When studying tin-lead solders, it is sometimes helpful to use
etchants specifically designed to reveal those alloy’s micro-
structures (see Section 7, Reference 2).

7 References
Additional references on metallographic laboratory practice
include the following:
1) Metallographic Polishing by Mechanical Means, L.E.
Samuels, American Society for Metals, 1982, ISBN:
0-87170- 135-9.
2) Metallographic Etching, Gunter Petzow, American Society
for Metals, 1978, ISBN 0-87170-002-9.
3) Metallography Principles and Practice, George F. Vander
Voort, McGraw-Hill, 1984, ISBN: 0-07-0669780-8.
4) Metals Handbook Desk Edition, Edited by Howard E.
Boyer and Timothy L. Gall, American Society for Metals,
1985, ISBN: 0-87170-188-X.

Page 8 of 8