21484D

Download as pdf or txt
Download as pdf or txt
You are on page 1of 14

TC962

High Current Charge Pump DC-to-DC Converter


Features: General Description:
• Pin Compatible With TC7662/ICL7662/SI7661 The TC962 is an advanced version of the industry
• High Output Current 80 mA standard TC7662 high voltage DC-to-DC converter.
• No External Diodes Required Using improved design techniques and CMOS
construction, the TC962 can source as much as 80 mA
• Wide Operating Range 3V to 18V
versus the 7662’s 20 mA capability.
• Low Output Impedance 28 Typ.
As an inverter, the TC962 can put out voltages as high
• No Low Voltage Terminal Required
as 18V and as low as 3V without the need for external
• Application Zener On-Chip diodes. The output impedance of the device is a low
• OSC Frequency Doubling Pin Option for Smaller 28 (with the proper capacitors), voltage conversion
Output Capacitors efficiency is 99.9%, and power conversion efficiency is
97%.
Applications: The low voltage terminal (pin 6) required in some
• Laptop Computers TC7662 applications has been eliminated. Grounding
this terminal will double the oscillator frequency from 12
• Disk Drives
kHz to 24 kHz. This will allow the use of smaller
• Process Instrumentation capacitors for the same output current and ripple, in
• P-Based Controllers most applications. Only two external capacitors are
required for inverter applications. In the event an
Device Selection Table external clock is needed to drive the TC962 (such as
paralleling), driving this pin directly will cause the
Operating
Part internal oscillator to sync to the external clock.
Package Temp.
Number Pin 1, which is used as a test pin on the 7662, is a
Range
voltage reference Zener on the TC962. This Zener (6.4V
TC962COE 16-Pin SOIC Wide 0°C to +70°C at 5 mA) has a dynamic impedance of 12 and is
TC962CPA 8-Pin Plastic DIP 0°C to +70°C intended for use where the TC962 is supplying current to
TC962EPA 8-Pin Plastic DIP -40°C to +85°C external regulator circuitry and a reference is needed for
the regulator circuit. (See Section 3.0 “Applications
TC962IJA 8-Pin CERDIP -25°C to +85°C
Information” Applications Information).
TC962MJA 8-Pin CERDIP -55°C to +125°C
The TC962 is compatible with the LTC1044, SI7661
and ICL7662. It should be used in designs that require
greater power and/or less input to output voltage drop.
It offers superior performance over the ICL7660S.

Package Type
16-Pin SOIC Wide
Zener
8-Pin DIP Cathode 1 16 VDD
8-Pin CERDIP NC 2 15 NC
Zener C+ 3 14 COSC
Cathode 1 • 8 VDD
NC 4 13 NC
C+ 2 TC962CPA 7 COSC
TC962EPA GND 5 TC962COE 12 FREQ x 2
GND 3 6 FREQ x 2
TC962IJA
C– 4 TC962MJA 5 VOUT NC 6 11 NC
C– 7 10 VOUT

NC 8 9 NC

 2001-2012 Microchip Technology Inc. DS21484D-page 1


TC962
Functional Block Diagram
8 VDD
6 I I
FREQ x 2 TC962
– 7
OSC/C
Timing
Level P SW1
Shift
Q
2
+ F/F CAP +
C
– Q
Level N SW4 +
Shift CP
Comparator
with Hysteresis External
3 GND

1
Zener
Cathode VREF
6.4V
+
OUT CR
Level N SW2
Shift EXT

4
CAP – RL

Level
N SW3
Shift

5
VOUT

DS21484D-page 2  2001-2012 Microchip Technology Inc.


TC962
1.0 ELECTRICAL *Stresses above those listed under “Absolute
Maximum Ratings” may cause permanent damage to
CHARACTERISTICS
the device. These are stress ratings only and functional
operation of the device at these or any other conditions
Absolute Maximum Ratings* above those indicated in the operation sections of the
Supply Voltage (VDD to GND) ..............................+18V specifications is not implied. Exposure to Absolute
Maximum Rating conditions for extended periods may
Input Voltage Any Pin
affect device reliability.
......................... (VDD +0.3) to (VSS -0.3) (Note 1)
Current Into Any Pin........................................... 10 mA
ESD Protection ................................................ ±2000V
Output Short Circuit ........... Continuous (at 5.5V Input)
Package Power Dissipation (TA 70°C)
SOIC ....................................................... 760 mW
PDIP........................................................ 730 mW
CERDIP .................................................. 800 mW
Package Thermal Resistance
CERDIP, RJ-A ......................................... 90°C/W
PDIP, RJ-A ............................................ 140°C/W
Operating Temperature Range
CPA, COE ....................................... 0°C to +70°C
IJA ................................................ -25°C to +85°C
EPA .............................................. -40°C to +85°C
MJA ............................................ -55°C to +125°C
Storage Temperature Range ............. -65°C to +150°C

TC962 ELECTRICAL SPECIFICATIONS


Electrical Characteristics: VDD = 15V, TA = 25°C (See Figure ) unless otherwise noted.
Symbol Parameter Min Typ Max Units Test Conditions
VDD Supply Voltage 3 — 18 V
IS Supply Current — — — A RL = 
VDD = 15V — 510 700 TA = +25°C
— 560 — 0 TA 70°C
— 650 — -55°C TA 125°C
VDD = 5V — 190 — TA = +25°C
— 210 — 0 TA 70°C
— 210 — -55°C TA 125°C
RO Output Source — 32 37  IL = 20 mA, VDD = 15V
Resistance — 35 40 IL = 80 mA, VDD = 15V
— — 50 IL = 3 mA, VDD = 5V
FOSC Oscillator Frequency — 12 — kHz Pin 6 Open
— 24 — Pin 6 GND
PEFF Power Efficiency 93 97 — % RL = 2 k
— — —
VDEF Voltage Efficiency 99 99.9 — % RL = 
— — — Over temperature range
96 — —
VZ Zener Voltage 6.0 6.2 6.4 V IZ = 5 mA
ZZT Zener Impedance — 12 —  IL = 2.5 mA to 7.5 mA
Note 1: Connecting any input terminal to voltages greater than V+ or less than GND may cause destructive latch-up. It is recommended that no
inputs from sources operating from external supplies be applied prior to “power-up” of the TC962.

 2001-2012 Microchip Technology Inc. DS21484D-page 3


TC962
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.

TABLE 2-1: PIN FUNCTION TABLE


Pin No.
(8-Pin DIP) Symbol Description
(8-Pin CERDIP)
1 Zener Cathode Cathode of internal Zener diode.
2 C+ Positive side of external CP capacitor (pump cap).
3 GND Ground terminal.
4 C- Negative side of external CP capacitor (pump cap).
5 VOUT Output voltage.
6 FREQ x 2 If grounded, frequency doubles.
7 COSC Capacitor to GND will decrease frequency.
8 VDD Input voltage.

Pin No.
Symbol Description
(16-Pin SOIC)
1 Zener Cathode Cathode of internal Zener diode.
2 NC No connect.
3 C+ Positive side of external CP capacitor (pump cap).
4 NC No connect.
5 GND Ground terminal.
6 NC No connect.
7 C- Negative side of external CP capacitor (pump cap).
8 NC No connect.
9 NC No connect.
10 VOUT Output voltage.
11 NC No connect.
12 FREQ x 2 If grounded, frequency doubles.
13 NC No connect.
14 COSC Capacitor to GND will decrease frequency.
15 NC No connect.
16 VDD Input voltage.

DS21484D-page 4  2001-2012 Microchip Technology Inc.


TC962
3.0 APPLICATIONS INFORMATION current source and double the frequency. This will
double the charge current going into the internal
capacitor, as well as any capacitor added to pin 7.
3.1 Theory of Operation
A Zener diode has been added to the TC962 for use as
The TC962 is a capacitive pump (sometimes called a a reference in building external regulators. This Zener
switched capacitor circuit), where four MOSFET runs from pin 1 to ground.
switches control the charge and discharge of a
capacitor.
3.2 Latch-Up
The functional block diagram shows how the switching
action works. SW1 and SW2 are turned on simultane- All CMOS structures contain a parasitic SCR. Care
ously, charging CP to the supply voltage, VIN. This must be taken to prevent any input from going above or
assumes that the on resistance of the MOSFETs in below the supply rail, or latch-up will occur. The result
series with the capacitor results in a charging time of latch-up is an effective short between VDD and VSS.
(3 time constants) that is less than the on time provided Unless the power supply input has a current limit, this
by the oscillator frequency as shown: latch-up phenomena will result in damage to the
device. (See AN763, Latch-up Protection for MOSFET
3 (RDS(ON) CP) < CP/(0.5 fOSC) Drivers.)
In the next cycle, SW1 and SW2 are turned off and after
a very short interval of all switches being off (this
prevents large currents from occurring due to cross 690
conduction), SW3 and SW4 are turned on. The charge
IS
in CP is then transferred to CR, but with the polarity 1 8 V+
NC (+5V)
inverted. In this way, a negative voltage is now derived. 2 7 IL
An oscillator supplies pulses to a flip-flop that is then + 10 μF 3 TC962 COSC RL
CP
fed to a set of level shifters. These level shifters then
4 5 VOUT
drive each set of switches at one-half the oscillator
(–5V)
frequency.
The oscillator has two pins that control the frequency of CR 10 μF
+
oscillation. Pin 7 can have a capacitor added that is
returned to ground. This will lower the frequency of the
oscillator by adding capacitance to the timing capacitor FIGURE 3-1: Test Circuit
internal to the TC962. Grounding pin 6 will turn on a

Combined Negative Converter and Positive Multiplier Split V+ In Half

V+ V+

1 8 1 8
VD1
2 7 2 7
+ 10 μF 3 VD2 VOUT = + 10 μF
CP2 TC962 6 CP 3 TC962 6
VOUT = –V + 2V + –2V
4 5 + D 4 5
C R1 10 μF

+
10 μF V+
CP1 VOUT =
+ + 2
CR 10 μF

Lowering Output Resistance by Paralleling Devices Positive Voltage Multiplier


V+
V+

1 8 1 8 1 8
VD1
2 7 2 7 2 7
+ 10 μF + 10 μF VD2 VOUT =
CP1 3 TC962 6 CP2 3 TC962 6 3 TC962 6
2V +–2V D
4 5 4 5 4 5 + 10 μF +
CP CP 10 μF
VOUT
CR 10 μF
+

FIGURE 3-2: Typical Applications

 2001-2012 Microchip Technology Inc. DS21484D-page 5


TC962
4.0 TYPICAL CHARACTERISTICS
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Circuit of Figure , CP = CR = 10 F, CPESR  CRESR  1.

Supply Current vs. Temperature Oscillator Frequency vs. C OSC Frequency vs. Temperature
700 20
TA = +25°C COSC = FREQ x 2 = OPEN
600 10k 18
SUPPLY CURRENT (μA)

500 16

FREQUENCY (kHz)
FREQUENCY (Hz)

400 V + = 15V 1k 14

300 12

100 10
200
V + = 15V
100 8

0 10 6
-60 -40 -20 0 20 40 60 80 100 120 140 1 10 100 1000 10,000 -60 -40 -20 0 20 40 60 80 100 120 140
TEMPERATURE (°C) CAPACITANCE (pF) TEMPERATURE (°C)

Output Resistance vs. Temperature Current vs. Zener Voltage Power Conversion Efficiency vs. I LOAD
80
POWER CONVERSION EFFICIENCY (%)

50 TA = +25°C 100 TA = +25°C 150


70
OUTPUT RESISTANCE ( Ω)

90 135

SUPPLY CURRENT (mA)


60 40 EFFICIENCY 120
80
CURRENT (mA)

V+ = 5V IL = 3 mA 70 105
50
30 60 SUPPLY 90
CURRENT
40 50 75
20 40 60
30 V+ = 15V IL = 20 mA 30 45
20 10 20 30
10 15
10 0 0 0
-60 -40 -20 0 20 40 60 80 100 120 140 4.5 4.0 5.5 6.0 6.5 7.0 8 16 24 32 40 48 56 64 72 80
TEMPERATURE (°C) ZENER VOLTAGE (V) LOAD CURRENT (mA)

Output Resistance vs. Input Voltage


110
100 TA = +25°C
OUTPUT RESISTANCE (Ω)

90
80
70
60 3 μA
20 μA
50
40
30
20
10

0 2 4 6 8 10 12 14 16 18 20
INPUT VOLTAGE (V)

DS21484D-page 6  2001-2012 Microchip Technology Inc.


TC962
5.0 PACKAGING INFORMATION
5.1 Package Marking Information
Package marking data not available at this time.

5.2 Taping Form


Component Taping Orientation for 16-Pin SOIC (Wide) Devices

User Direction of Feed


Pin 1

P
Standard Reel Component Orientation
for 713 Suffix Device

Carrier Tape, Number of Components Per Reel and Reel Size


Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size
16-Pin SOIC (W) 16 mm 12 mm 1000 13 in

5.3 Package Dimensions

Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging

8-Pin CDIP (Narrow)


.110 (2.79)
.090 (2.29)
Pin 1

.300 (7.62)
.230 (5.84)

.055 (1.40) Max. .020 (0.51) Min.

.400 (10.16) .320 (8.13)


.370 (9.40) .290 (7.37)
.040 (1.02)
.200 (5.08) .020 (0.51)
.160 (4.06)

.015 (0.38) 3° Min.


.200 (5.08) .150 (3.81)
Min. .008 (0.20)
.125 (3.18)

.400 (10.16)
.320 (8.13)
.065 (1.65) .020 (0.51)
.045 (1.14) .016 (0.41)

Dimensions: inches (mm)

 2001-2012 Microchip Technology Inc. DS21484D-page 7


TC962
Package Dimensions (Continued)

Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging

8-Pin Plastic DIP


Pin 1

.260 (6.60)
.240 (6.10)

.045 (1.14) .070 (1.78)


.030 (0.76) .040 (1.02) .310 (7.87)
.400 (10.16) .290 (7.37)
.348 (8.84)

.200 (5.08)
.140 (3.56) .040 (1.02)
.020 (0.51) .015 (0.38) 3° Min.
.150 (3.81) .008 (0.20)
.115 (2.92)

.400 (10.16)
.310 (7.87)
.110 (2.79) .022 (0.56)
.090 (2.29) .015 (0.38)

Dimensions: inches (mm)

Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging

16-Pin SOIC (Wide)


Pin 1

.299 (7.59) .419 (10.65)


.291 (7.40) .398 (10.10)

.413 (10.49)
.398 (10.10)

.104 (2.64)
.097 (2.46) 8° .013 (0.33)
Max. .009 (0.23)
.012 (0.30)
.050 (1.27) Typ. .019 (0.48) .004 (0.10) .050 (1.27)
.014 (0.36) .016 (0.40)

Dimensions: inches (mm)

DS21484D-page 8  2001-2012 Microchip Technology Inc.


TC962
6.0 REVISION HISTORY
Revision D (December 2012)
Added a note to each package outline drawing.

 2001-2012 Microchip Technology Inc. DS21484D-page 9


TC962
NOTES:

DS21484D-page 10  2001-2012 Microchip Technology Inc.


TC962
THE MICROCHIP WEB SITE CUSTOMER SUPPORT
Microchip provides online support via our WWW site at Users of Microchip products can receive assistance
www.microchip.com. This web site is used as a means through several channels:
to make files and information easily available to • Distributor or Representative
customers. Accessible by using your favorite Internet
• Local Sales Office
browser, the web site contains the following
information: • Field Application Engineer (FAE)
• Technical Support
• Product Support – Data sheets and errata,
application notes and sample programs, design Customers should contact their distributor,
resources, user’s guides and hardware support representative or field application engineer (FAE) for
documents, latest software releases and archived support. Local sales offices are also available to help
software customers. A listing of sales offices and locations is
• General Technical Support – Frequently Asked included in the back of this document.
Questions (FAQ), technical support requests, Technical support is available through the web site
online discussion groups, Microchip consultant at: http://microchip.com/support
program member listing
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives

CUSTOMER CHANGE NOTIFICATION


SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.

 2001-2012 Microchip Technology Inc. DS21484D-page 11


TC962
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip
product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our
documentation can better serve you, please FAX your comments to the Technical Publications Manager at
(480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.

TO: Technical Publications Manager Total Pages Sent ________


RE: Reader Response

From: Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________ FAX: (______) _________ - _________
Application (optional):
Would you like a reply? Y N

Device: TC962 Literature Number: DS21484D

Questions:

1. What are the best features of this document?

2. How does this document meet your hardware and software development needs?

3. Do you find the organization of this document easy to follow? If not, why?

4. What additions to the document do you think would enhance the structure and subject?

5. What deletions from the document could be made without affecting the overall usefulness?

6. Is there any incorrect or misleading information (what and where)?

7. How would you improve this document?

DS21484D-page 12  2001-2012 Microchip Technology Inc.


Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device Trademarks


applications and the like is provided only for your convenience The Microchip name and logo, the Microchip logo, dsPIC,
and may be superseded by updates. It is your responsibility to
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
ensure that your application meets with your specifications.
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
MICROCHIP MAKES NO REPRESENTATIONS OR and UNI/O are registered trademarks of Microchip Technology
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
Incorporated in the U.S.A. and other countries.
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION, FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
INCLUDING BUT NOT LIMITED TO ITS CONDITION, MTP, SEEVAL and The Embedded Control Solutions
QUALITY, PERFORMANCE, MERCHANTABILITY OR Company are registered trademarks of Microchip Technology
FITNESS FOR PURPOSE. Microchip disclaims all liability Incorporated in the U.S.A.
arising from this information and its use. Use of Microchip Silicon Storage Technology is a registered trademark of
devices in life support and/or safety applications is entirely at Microchip Technology Inc. in other countries.
the buyer’s risk, and the buyer agrees to defend, indemnify and
Analog-for-the-Digital Age, Application Maestro, BodyCom,
hold harmless Microchip from any and all damages, claims,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
suits, or expenses resulting from such use. No licenses are
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
conveyed, implicitly or otherwise, under any Microchip
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
intellectual property rights.
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2001-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620768808

QUALITY MANAGEMENT SYSTEM Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
CERTIFIED BY DNV Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures

== ISO/TS 16949 ==
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.

 2001-2012 Microchip Technology Inc. DS21484D-page 13


Worldwide Sales and Service
AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE
Corporate Office Asia Pacific Office India - Bangalore Austria - Wels
2355 West Chandler Blvd. Suites 3707-14, 37th Floor Tel: 91-80-3090-4444 Tel: 43-7242-2244-39
Chandler, AZ 85224-6199 Tower 6, The Gateway Fax: 91-80-3090-4123 Fax: 43-7242-2244-393
Tel: 480-792-7200 Harbour City, Kowloon Denmark - Copenhagen
India - New Delhi
Fax: 480-792-7277 Hong Kong Tel: 45-4450-2828
Tel: 91-11-4160-8631
Technical Support: Tel: 852-2401-1200 Fax: 45-4485-2829
Fax: 91-11-4160-8632
http://www.microchip.com/ Fax: 852-2401-3431
India - Pune France - Paris
support
Australia - Sydney Tel: 91-20-2566-1512 Tel: 33-1-69-53-63-20
Web Address:
Tel: 61-2-9868-6733 Fax: 91-20-2566-1513 Fax: 33-1-69-30-90-79
www.microchip.com
Fax: 61-2-9868-6755 Germany - Munich
Atlanta Japan - Osaka
China - Beijing Tel: 49-89-627-144-0
Duluth, GA Tel: 81-6-6152-7160
Tel: 86-10-8569-7000 Fax: 49-89-627-144-44
Tel: 678-957-9614 Fax: 81-6-6152-9310
Fax: 86-10-8528-2104 Italy - Milan
Fax: 678-957-1455 Japan - Tokyo
China - Chengdu Tel: 39-0331-742611
Boston Tel: 81-3-6880- 3770
Tel: 86-28-8665-5511 Fax: 39-0331-466781
Westborough, MA Fax: 81-3-6880-3771
Fax: 86-28-8665-7889 Netherlands - Drunen
Tel: 774-760-0087 Korea - Daegu
Fax: 774-760-0088 China - Chongqing Tel: 82-53-744-4301 Tel: 31-416-690399
Tel: 86-23-8980-9588 Fax: 82-53-744-4302 Fax: 31-416-690340
Chicago
Itasca, IL Fax: 86-23-8980-9500 Spain - Madrid
Korea - Seoul
Tel: 630-285-0071 China - Hangzhou Tel: 34-91-708-08-90
Tel: 82-2-554-7200
Fax: 630-285-0075 Tel: 86-571-2819-3187 Fax: 82-2-558-5932 or Fax: 34-91-708-08-91
Cleveland Fax: 86-571-2819-3189 82-2-558-5934 UK - Wokingham
Independence, OH China - Hong Kong SAR Tel: 44-118-921-5869
Malaysia - Kuala Lumpur
Tel: 216-447-0464 Tel: 852-2943-5100 Fax: 44-118-921-5820
Tel: 60-3-6201-9857
Fax: 216-447-0643 Fax: 852-2401-3431 Fax: 60-3-6201-9859
Dallas China - Nanjing Malaysia - Penang
Addison, TX Tel: 86-25-8473-2460 Tel: 60-4-227-8870
Tel: 972-818-7423 Fax: 86-25-8473-2470 Fax: 60-4-227-4068
Fax: 972-818-2924
China - Qingdao Philippines - Manila
Detroit Tel: 86-532-8502-7355 Tel: 63-2-634-9065
Farmington Hills, MI
Fax: 86-532-8502-7205 Fax: 63-2-634-9069
Tel: 248-538-2250
Fax: 248-538-2260 China - Shanghai Singapore
Tel: 86-21-5407-5533 Tel: 65-6334-8870
Indianapolis Fax: 86-21-5407-5066 Fax: 65-6334-8850
Noblesville, IN
Tel: 317-773-8323 China - Shenyang Taiwan - Hsin Chu
Fax: 317-773-5453 Tel: 86-24-2334-2829 Tel: 886-3-5778-366
Fax: 86-24-2334-2393 Fax: 886-3-5770-955
Los Angeles
Mission Viejo, CA China - Shenzhen Taiwan - Kaohsiung
Tel: 949-462-9523 Tel: 86-755-8864-2200 Tel: 886-7-213-7828
Fax: 949-462-9608 Fax: 86-755-8203-1760 Fax: 886-7-330-9305
Santa Clara China - Wuhan Taiwan - Taipei
Santa Clara, CA Tel: 86-27-5980-5300 Tel: 886-2-2508-8600
Tel: 408-961-6444 Fax: 86-27-5980-5118 Fax: 886-2-2508-0102
Fax: 408-961-6445 China - Xian Thailand - Bangkok
Toronto Tel: 86-29-8833-7252 Tel: 66-2-694-1351
Mississauga, Ontario, Fax: 86-29-8833-7256 Fax: 66-2-694-1350
Canada China - Xiamen
Tel: 905-673-0699 Tel: 86-592-2388138
Fax: 905-673-6509 Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
11/29/12
Fax: 86-756-3210049

DS21484D-page 14  2001-2012 Microchip Technology Inc.

You might also like