AT9900063

Active metal brazing of different metals to aluminium

nitride ceramics

B. Loeser and D. Brunner

ANCeram GmbH & Co.KG, Bindlach, Germany

During recent years aluminium nitride ceramics for substrates, coolers and components have
found more applications in micro- and power electronics.
Aluminium nitride ceramic with high thermal conductivity, small CTE and good thermal
shock resistance is used in aeronautical equipment as well as in drive systems of
undergrounds and high speed trains.
Different metals and alloys can be bonded to A1N by the so-called "AMB-process". The
bonding mechanism is based on the use of so-called active metals like Ti, Zr, Hf.
Copper conductor lines can be brazed onto AlN-jubstrates and components, resistor sheets
can be applied on ceramic water coolers and a couple of other metals and alloys like
Tantalium, Titanium, KOVAR and steel can be attached to AIN-ceramics by active brazing.
Processing, analytical aspects and some special applications will be discussed.

167
Active Metal Braang of Different Metals to AIN Vienna, 06/05/97

Historical Background of the AMB-Process Active Metal Brazing of

Aluminium Nitride Different Metals

Active Metal Brazing of AIN to Aluminium Nitride Ceramics

Analytical Aspects

Special Applications

Summary

Dr. D. Brunner, B. Lflser, ANCeram GmbH & Co. KG, Bindlach,

Germany

Aluminium Nitride Ceramics GmbH & Co KG, Esbachgraben 21, Bindlach, Germany
 Active Metal Brazing of Different Metals to AIN Vienna. 06/05/97

Historical Background

W.D. Kingery and M. llumenik, 1954 :

Surface tension and wettability of metal-ceramic systems

Y. Naidich, 1981 : Wetting induced by Titanium

Historical Background of the AMB-Process

Joints of Silicon Nitride and Carbide with Metals by
Active Brazing ( 1982 ); Degussa, llanau
Aluminium Nitride
Joints of AIN with Kovar® by Active Brazing ( 1984 );
lleraeus, llanau
Active Metal Brazing of AIN
Joints of AIN with Copper by Active Brazing ( 1984 );
Toshiba
Analytical Aspects

II. Krappitz, H. Thiemann, W. Weise, 1989 :

Reactive brazed Ceraniic-Metal-Joints for Special Applications
Automotive Applications

Joining AIN with Tantalum and Titanium ( 1993 ); Summary

ANCeram

Aluminium Nitride Ceramics GmbH & Co. KG, Esbachgraben 21, Bindlach, Germany
 Thermal conductivity of conventional ceramic substrate
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 Active Metal Brazing of Diffefent Metals to AIN Vienna. 06/05/97

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Active Metal Brizing of Different Metals to A1N Vienna. 06/05/97

Historical Background of the AMB-Process

Aluminium Nitride

Active Metal Brazing of AIN

Analytical Aspects

Special Applications

Summary

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Soldering Metal

Alloy Junction

OFHC-Cu

Alloy junction

Alumina

174
Active Metal Brazing of Difl'erenl Metals to AlN Vienna. 06/05/97

Historical Background of the AMB-Process

Aluminium Nitride

Active Metal Brazing of AlN

Analytical Aspects *-"'

Special Applications

• Summary

Aluminium Nitride Ceramics GmbH & Co. KG, Rsbachgraben 21, Bindlach, Germany
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 Active Brazing Process
\cii\e Bra/ing Process

AIN Substrate ] L Copper Foil

AIN Subsiraic ( tipper ( 'oil

Rinsing Punching

| Screen Printing of Metal Paste Cleaning

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Adjusting of Copper Foils in Solder Fixture

Reactive Brazing

Screen Printing of Etch Resist

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Etching
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 AIN/AMB Fa.ANCeram
Gefugeausbildung

Kante 5

Faust
Kante 6
111"!
Department
Fraunhoftr MECHANICAL RELIABILITY
tnstitut AND MICRO MATERIALS
Zuvariflssigkeit und Head: Prof. Dr. Bemd Michel
Mkrointegration

Aluminium Nitride Substrates for Power Electronics

Active Brazed Copper (ABC)

Substrates developed by
ANCeram

R . H a h l l , ANCERAM2DOC. 21.ll.1996. HahitTUB. Tel. 030 314 72833. Fax. 030 314 72 835

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Water-cooled inverter tor
underground trains, equipped
with ANCeram modules
Active Metal Brazing of Different Metals to AIN Vienna. 06/05/97

Summary

AIN is wettable to different alloys activated by Ti, Zr, Hf,

Ni, and Cr

AIN is attachable to KOVAR, Titanium, Tantalum, stainless

Steel and Copper

AIN-Metal-Joints show high peel strength and sufficient

thermal and electrical behavior

AIN active brazed with Copper may become an alternative

to the DCB-Process on Alumina for high power application

Aluminium Nitride Ceramics GmbH & Co. KG. Esbachgraben 21. Bindlach. Germany

180