Ultra Low Power Stereo Audio Codec With Embedded Minidsp: Features

TLV320AIC3254
www.ti.com SLAS549C – SEPTEMBER 2008 – REVISED OCTOBER 2013
Ultra Low Power Stereo Audio Codec With Embedded miniDSP

Check for Samples: TLV320AIC3254
1FEATURES • Integrated LDO

•
2 Stereo Audio DAC with 100dB SNR • 5 mm x 5 mm 32-pin QFN Package
• 4.1mW Stereo 48ksps DAC Playback
APPLICATIONS
• Stereo Audio ADC with 93dB SNR
• 6.1mW Stereo 48ksps ADC Record • Portable Navigation Devices (PND)
• PowerTune™ • Portable Media Player (PMP)
• Extensive Signal Processing Options • Mobile Handsets
• Embedded miniDSP • Communication
• Six Single-Ended or Three Fully-Differential • Portable Computing
Analog Inputs • Advanced DSP algorithms
• Stereo Analog and Digital Microphone Inputs
DESCRIPTION
• Stereo Headphone Outputs
The TLV320AIC3254 (sometimes referred to as the
• Stereo Line Outputs AIC3254) is a flexible, low-power, low-voltage stereo
• Very Low-Noise PGA audio codec with programmable inputs and outputs,
• Low Power Analog Bypass Mode PowerTune capabilities, fully-programmable miniDSP,
fixed predefined and parameterizable signal
• Programmable Microphone Bias processing blocks, integrated PLL, integrated LDOs
• Programmable PLL and flexible digital interfaces.
IN1_L
-72...0dB
IN2_L AGC DRC Vol . Ctrl -6...+29dB
IN3_L + 0…+47.5 dB
ADC DAC + HPL
Left Left
ADC
tpl ´ Signal Signal ´ DAC
Proc. Proc.
+ Gain Adj.
1dB steps
0.5 dB
steps -30...0 dB -6...+29dB
+ LOL
Data 1dB steps

miniDSP miniDSP
Interface
-30...0 dB -6...+29dB
+ LOR
0… 1dB steps
+ +47.5 dB Gain Adj.
ADC DAC -6...+29dB
Right Right
ADC
tpr ´ Signal Signal ´ DAC + HPR
IN3_R
Proc. Proc.
+
0.5 dB steps
IN2_R AGC DRC Vol . Ctrl -72...0dB 1dB steps
IN1_R
SPI_Select
SPI / I2C Digital Interrupt Secondary Primary
PLL
Reset Control Block Mic. Ctrl I2S IF I2S Interface
HPVdd
MicBias Mic ALDO

Bias Supplies Pin Muxing/ Clock Routing
Ref Ref DLDO
LDO in
LDO Select
AVdd
DVdd
IOVdd
AVss
DVss
IOVss
SCL/SSZ
SDA/MOSI
MISO
SCLK
MCLK
GPIO
DOUT
DIN
BCLK
WCLK
Figure 1. Simplified Block Diagram
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2 PowerTune is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date. Copyright © 2008–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TLV320AIC3254
SLAS549C – SEPTEMBER 2008 – REVISED OCTOBER 2013 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
DESCRIPTION (CONTINUED)
The TLV320AIC3254 features two fully-programmable miniDSP cores that support application-specific algorithms
in the record and-or the playback path of the device. The miniDSP cores are fully software controlled with
advanced DSP filtering loaded into the device after power-up.
Extensive register-based control of power, IO channel configuration, gains, effects, pin-multiplexing and clocks is
included, allowing the device to be precisely targeted to its application. Combined with the advanced PowerTune
technology, the device can cover operations from 8kHz mono voice playback to audio stereo 192kHz DAC
playback, making it ideal for portable battery-powered audio and telephony applications.
The record path of the TLV320AIC3254 covers operations from 8kHz mono to 192kHz stereo recording, and
contains programmable input channel configurations covering single-ended and differential setups, as well as
floating or mixing input signals. It also includes a digitally-controlled stereo microphone preamplifier and
integrated microphone bias. Digital signal processing blocks can remove audible noise that may be introduced by
mechanical coupling, such as optical zooming in a digital camera.
The playback path offers signal-processing blocks for filtering and effects, and supports flexible mixing of DAC
and analog input signals as well as programmable volume controls. The playback path contains two high-power
output drivers as well as two fully-differential outputs. The high-power outputs can be configured in multiple ways,
including stereo and mono BTL.
The integrated PowerTune technology allows the device to be tuned to an optimum power-performance trade-off.
Mobile applications frequently have multiple use cases requiring very low power operation while being used in a
mobile environment. When used in a docked environment power consumption typically is less of a concern, while
minimizing noise is important. With PowerTune, the TLV320AIC3254 addresses both cases.
The voltage supply range for the TLV320AIC3254 for analog is 1.5V–1.95V, and for digital it is 1.26V–1.95V. To
ease system-level design, LDOs are integrated to generate the appropriate analog or digital supply from input
voltages ranging from 1.8V to 3.6V. Digital IO voltages are supported in the range of 1.1V–3.6V.
The required internal clock of the TLV320AIC3254 can be derived from multiple sources, including the MCLK pin,
the BCLK pin, the GPIO pin or the output of the internal PLL, where the input to the PLL again can be derived
from the MCLK pin, the BCLK or GPIO pins. Although using the PLL ensures the availability of a suitable clock
signal, it is not recommended for the lowest power settings. The PLL is highly programmable and can accept
available input clocks in the range of 512kHz to 50MHz.
The device is available in the 5-mm × 5-mm, 32-pin QFN package.
2 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated
Product Folder Links: TLV320AIC3254

TLV320AIC3254
Package and Signal Descriptions
Packaging Information
For the most-current package and ordering information, see the Package Option Addendum at the end of this
document, or see the TI Web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
Pin Assignments
This document describes signals that take on different names depending on how they are configured. In such
cases, the different names are placed together and separated by slash (/) characters. For example, "SCL/SS".
Active low signals are represented by overbars.
DOUT/MFP2
SCLK/MFP3
DIN/MFP1
WCLK
IOVDD
MCLK
IOVSS
BCLK
1 8
GPIO/MFP5 32 9 SCL/SS
RESET SDA/MOSI
LDO_SELECT MISO/MFP4
DVDD SPI_SELECT
DVSS IN1_L
HPR IN1_R
LDOIN IN2_L
HPL 25 16 IN2_R
24 17
MICBIAS
REF
AVDD
AVSS
LOL
IN3_L
LOR
IN3_R
Figure 2. QFN (RHB) Package, Bottom View
Copyright © 2008–2013, Texas Instruments Incorporated Submit Documentation Feedback 3

TLV320AIC3254
Table 1. Terminal Functions

TERMINAL NAME TYPE DESCRIPTION
1 MCLK I Master Clock Input
2 BCLK IO Audio serial data bus (primary) bit clock
3 WCLK IO Audio serial data bus (primary) word clock
4 DIN I Primary function:
Audio serial data bus data input
MFP1 Secondary function:
Digital Microphone Input
General Purpose Clock Input
General Purpose Input
5 DOUT O Primary function:
Audio serial data bus data output
General Purpose Output
Clock Output
INT1 Output
INT2 Output
Audio serial data bus (secondary) bit clock output
Audio serial data bus (secondary) word clock output
6 IOVDD Power IO voltage supply 1.1V – 3.6V
7 IOVSS Ground IO ground supply
8 SCLK I Primary function: (SPI_Select = 1)
/ SPI serial clock
MFP3 Secondary function: (SPI_Select = 0)
Headphone-detect input
Digital microphone input
Audio serial data bus (secondary) bit clock input
Audio serial data bus (secondary) DAC or common word clock input
Audio serial data bus (secondary) ADC word clock input
Audio serial data bus (secondary) data input
General Purpose Input
9 SCL/SS I I2C interface serial clock (SPI_Select = 0)
SPI interface mode chip-select signal (SPI_Select = 1)
10 SDA/MOSI I I2C interface mode serial data input (SPI_Select = 0)
SPI interface mode serial data input (SPI_Select = 1)
11 MISO O Primary function: (SPI_Select = 1)
/ Serial data output
MFP4 Secondary function: (SPI_Select = 0)
General purpose output
CLKOUT output
INT1 output
INT2 output
Audio serial data bus (primary) ADC word clock output
Digital microphone clock output
Audio serial data bus (secondary) data output
12 SPI_ SELECT I Control mode select pin ( 1 = SPI, 0 = I2C )

TLV320AIC3254
Table 1. Terminal Functions (continued)

TERMINAL NAME TYPE DESCRIPTION
13 IN1_L I Multifunction Analog Input,
or Single-ended configuration: MIC 1 or Line 1 left
or Differential configuration: MIC or Line right, negative
14 IN1_R I Multifunction Analog Input,
or Single-ended configuration: MIC 1 or Line 1 right
or Differential configuration: MIC or Line right, positive
or Single-ended configuration: MIC 2 or Line 2 left
or Differential configuration: MIC or Line left, positive
or Single-ended configuration: MIC 2 or Line 2 right
or Differential configuration: MIC or Line left, negative
17 AVSS Ground Analog ground supply
18 REF O Reference voltage output for filtering
19 MICBIAS O Microphone bias voltage output
or Single-ended configuration: MIC3 or Line 3 left,
or Differential configuration: MIC or Line left, positive,
or Differential configuration: MIC or Line right, negative
or Single-ended configuration: MIC3 or Line 3 right,
or Differential configuration: MIC or Line left, negative,
or Differential configuration: MIC or Line right, positive
22 LOL O Left line output
23 LOR O Right line output
24 AVDD Power Analog voltage supply 1.5V–1.95V
Input when A-LDO disabled,
Filtering output when A-LDO enabled
25 HPL O Left high power output driver
26 LDOIN/HPVDD Power LDO Input supply and Headphone Power supply 1.9V– 3.6V
27 HPR O Right high power output driver
28 DVSS Ground Digital Ground and Chip-substrate
29 DVDD Power If LDO_SELECT Pin = 0 (D-LDO disabled)
Digital voltage supply 1.26V – 1.95V
If LDO_SELECT Pin = 1 (D-LDO enabled)
Digital voltage supply filtering output
30 LDO_ SELECT I connect to DVss.
31 RESET I Reset (active low)
32 GPIO I Primary function:
General Purpose digital IO
CLKOUT Output
INT1 Output
INT2 Output
Audio serial data bus ADC word clock output
Digital microphone clock output

TLV320AIC3254
Electrical Characteristics
Absolute Maximum Ratings

(1)
over operating free-air temperature range (unless otherwise noted)
VALUE UNIT
AVDD to AVSS –0.3 to 2.2 V
DVDD to DVSS –0.3 to 2.2 V
IOVDD to IOVSS –0.3 to 3.9 V
LDOIN to AVSS –0.3 to 3.9 V
Digital Input voltage to ground –0.3 to IOVDD + 0.3 V
Analog input voltage to ground –0.3 to AVDD + 0.3 V
Operating temperature range –40 to 85 °C
Storage temperature range –55 to 125 °C
Junction temperature (TJ Max) 105 °C
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Recommended Operating Conditions

MIN NOM MAX UNIT
(1)
LDOIN Power Supply Voltage Range Referenced to AVSS 1.9 3.6 V
AVDD 1.5 1.8 1.95
IOVDD Referenced to IOVSS (1) 1.1 3.6
DVDD (2) Referenced to DVSS (1) 1.26 1.8 1.95
PLL Input Frequency Clock divider uses fractional divide 10 20 MHz
(D > 0), P = 1, DVDD ≥ 1.65V (See table in SLAA408,
Maximum TLV320AIC3254 Clock Frequencies)
Clock divider uses integer divide 0.512 20 MHz
(D = 0), P = 1, DVDD ≥ 1.65V (See table in SLAA408,
Maximum TLV320AIC3254 Clock Frequencies)
MCLK Master Clock Frequency MCLK; Master Clock Frequency; DVDD ≥ 1.65V 50 MHz
MCLK; Master Clock Frequency; DVDD ≥ 1.26V 25
SCL SCL Clock Frequency 400 kHz
LOL, Stereo line output load resistance 0.6 10 kΩ
LOR
HPL, Stereo headphone output load Single-ended configuration 14.4 16 Ω
HPR resistance
Headphone output load resistance Differential configuration 24.4 32 Ω
CLout Digital output load capacitance 10 pF
TOPR Operating Temperature Range –40 85 °C
(1) All grounds on board are tied together to prevent voltage differences of more than 0.2V maximum for any combination of ground signals.
(2) At DVDD values lower than 1.65V, the PLL does not function. Please see the Maximum TLV320AIC3254 Clock Frequencies table in the
TLV320AIC3254 Application Reference Guide (SLAA408) for details on maximum clock frequencies.

TLV320AIC3254
THERMAL INFORMATION
TLV320AIC3254
THERMAL METRIC (1) UNIT
RHB (32 PINS)
θJA Junction-to-ambient thermal resistance 31.4
θJCtop Junction-to-case (top) thermal resistance 21.4
θJB Junction-to-board thermal resistance 5.4
°C/W
ψJT Junction-to-top characterization parameter 0.2
ψJB Junction-to-board characterization parameter 5.4
θJCbot Junction-to-case (bottom) thermal resistance 0.9
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

TLV320AIC3254
Electrical Characteristics, ADC

At 25°C, AVDD, DVDD, IOVDD = 1.8V, LDOIN = 3.3V, AVDD and DVDD LDO disabled, fs (Audio) = 48kHz, Cref = 10µF on REF
pin, PLL disabled unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
(1) (2)
AUDIO ADC
Input signal level (0dB) Single-ended, CM = 0.9V 0.5 VRMS
1kHz sine wave input
Single-ended Configuration
IN1R to Right ADC and IN1L to Left ADC,
Rin = 20K, fs = 48kHz,
Device Setup AOSR = 128, MCLK = 256 * fs,
PLL Disabled; AGC = OFF,
Channel Gain = 0dB,
Processing Block = PRB_R1,
Power Tune = PTM_R4
Inputs ac-shorted to ground 80 93
Signal-to-noise ratio, A-
SNR IN2R, IN3R routed to Right ADC and ac-shorted to ground 93 dB
weighted (1) (2)
IN2L, IN3L routed to Left ADC and ac-shorted to ground
DR Dynamic range A-weighted (1) (2) –60dB full-scale, 1-kHz input signal 92 dB
–3 dB full-scale, 1-kHz input signal –85 –70 dB
Total Harmonic Distortion plus IN2R,IN3R routed to Right ADC –85
THD+N
Noise IN2L, IN3L routed to Left ADC
–3dB full-scale, 1-kHz input signal
AUDIO ADC
Input signal level (0dB) Single-ended, CM = 0.75V, AVDD = 1.5V 0.375 VRMS
Single-ended Configuration
IN1R, IN2R, IN3R routed to Right ADC
IN1L, IN2L, IN3L routed to Left ADC
Rin = 20kΩ, fs = 48kHz,
Device Setup
AOSR = 128, MCLK = 256* fs,
PLL Disabled, AGC = OFF,
Channel Gain = 0dB,
Processing Block = PRB_R1
Power Tune = PTM_R4
SNR Signal-to-noise ratio, A-weighted Inputs ac-shorted to ground 91 dB
(1) (2)
DR Dynamic range A-weighted (1) (2) –60dB full-scale, 1-kHz input signal 90 dB
THD+N Total Harmonic Distortion plus –3dB full-scale, 1-kHz input signal –80 dB
Noise
(1) Ratio of output level with 1kHz full-scale sine wave input, to the output level with the inputs short circuited, measured A-weighted over a
20Hz to 20kHz bandwidth using an audio analyzer.
(2) All performance measured with 20kHz low-pass filter and, where noted, A-weighted filter. Failure to use such a filter may result in higher
THD+N and lower SNR and dynamic range readings than shown in the Electrical Characteristics. The low-pass filter removes out-of-
band noise, which, although not audible, may affect dynamic specification values.

TLV320AIC3254
Electrical Characteristics, ADC (continued)

AUDIO ADC
Input signal level (0dB) Differential Input, CM = 0.9V 10 mV
Differential configuration
IN1L and IN1R routed to Right ADC
IN2L and IN2R routed to Left ADC
Device Setup Rin = 10K, fs = 48kHz, AOSR = 128
MCLK = 256* fs PLL Disabled
AGC = OFF, Channel Gain = 40dB Processing Block =
PRB_R1,
Power Tune = PTM_R4
ICN Idle-Channel Noise, A- Inputs ac-shorted to ground, input referred noise 2 μVRMS
weighted (3) (4)
AUDIO ADC
1kHz sine wave input –0.05 dB
Single-ended configuration
Rin = 20kΩ fs = 48kHz, AOSR = 128,
Gain Error MCLK = 256 * fs, PLL Disabled
AGC = OFF, Channel Gain = 0dB
Processing Block = PRB_R1,
Power Tune = PTM_R4, CM = 0.9V
1kHz sine wave input at -3dBFS 108 dB
Single-ended configuration
IN1L routed to Left ADC
Input Channel Separation
IN1R routed to Right ADC, Rin = 20kΩ
AGC = OFF, AOSR = 128,
Channel Gain = 0dB, CM = 0.9V
1kHz sine wave input at –3dBFS on IN2L, IN2L internally 115 dB
not routed.
Input Pin Crosstalk
IN1L routed to Left ADC
ac-coupled to ground
1kHz sine wave input at –3dBFS on IN2R,
IN2R internally not routed.
IN1R routed to Right ADC
ac-coupled to ground
Single-ended configuration Rin = 20kΩ,
AOSR = 128 Channel, Gain = 0dB, CM = 0.9V
217Hz, 100mVpp signal on AVDD, 55 dB
PSRR Single-ended configuration, Rin = 20kΩ,
Channel Gain = 0dB; CM = 0.9V
Single-Ended, Rin = 10kΩ, PGA gain set to 0dB 0 dB
Single-Ended, Rin = 10kΩ, PGA gain set to 47.5dB 47.5 dB
ADC programmable gain Single-Ended, Rin = 20kΩ, PGA gain set to 0dB –6 dB
amplifier gain Single-Ended, Rin = 20kΩ, PGA gain set to 47.5dB 41.5 dB
Single-Ended, Rin = 40kΩ, PGA gain set to 0dB –12 dB
Single-Ended, Rin = 40kΩ, PGA gain set to 47.5dB 35.5 dB
ADC programmable gain 1-kHz tone 0.5 dB
amplifier step size
(4) All performance measured with 20kHz low-pass filter and, where noted, A-weighted filter. Failure to use such a filter may result in higher
THD+N and lower SNR and dynamic range readings than shown in the Electrical Characteristics. The low-pass filter removes out-of-
band noise, which, although not audible, may affect dynamic specification values.

TLV320AIC3254
Electrical Characteristics, Bypass Outputs

ANALOG BYPASS TO HEADPHONE AMPLIFIER, DIRECT MODE
Load = 16Ω (single-ended), 50pF;
Input and Output CM = 0.9V;
Device Setup Headphone Output on LDOIN Supply;
IN1L routed to HPL and IN1R routed to HPR;
Channel Gain = 0dB
Gain Error –0.8 dB
Noise, A-weighted (1) Idle Channel, IN1L and IN1R ac-shorted to 3 μVRMS
ground
THD Total Harmonic Distortion 446mVrms, 1kHz input signal –89 dB
ANALOG BYPASS TO LINE-OUT AMPLIFIER, PGA MODE
Load = 10kΩ (single-ended), 56pF;
Input and Output CM = 0.9V;
LINE Output on LDOIN Supply;
Device Setup IN1L routed to ADCPGA_L and IN1R routed
to ADCPGA_R; Rin = 20kΩ
ADCPGA_L routed to LOL and ADCPGA_R
routed to LOR; Channel Gain = 0dB
Gain Error 0.6 dB
Idle Channel, 7 μVRMS
IN1L and IN1R ac-shorted to ground
Noise, A-weighted (1) Channel Gain = 40dB, 3.4 μVRMS
Input Signal (0dB) = 5mVrms
Inputs ac-shorted to ground, Input Referred
(1) All performance measured with 20kHz low-pass filter and, where noted, A-weighted filter. Testing without such a filter may result in
higher THD+N and lower SNR and dynamic range readings than shown in the Electrical Characteristics. The low-pass filter removes
out-of-band noise, which, although not audible, may affect dynamic specification values.

TLV320AIC3254
Electrical Characteristics, Microphone Interface

MICROPHONE BIAS
Bias voltage Bias voltage CM = 0.9V, LDOIN = 3.3V
Micbias Mode 0, Connect to AVDD or LDOIN 1.25 V
Micbias Mode 1, Connect to LDOIN 1.7 V
Micbias Mode 3, Connect to AVDD AVDD V
Micbias Mode 3, Connect to LDOIN LDOIN V
CM = 0.75V, LDOIN = 3.3V
Micbias Mode 3, Connect to AVDD AVDD V
Micbias Mode 3, Connect to LDOIN LDOIN V
Output Noise CM = 0.9V, Micbias Mode 2, A-weighted, 10
20Hz to 20kHz bandwidth, μVRMS
Current load = 0mA.
Current Sourcing Micbias Mode 2, Connect to LDOIN 3 mA
Micbias Mode 3, Connect to AVDD 140
Inline Resistance Ω
Micbias Mode 3, Connect to LDOIN 87

TLV320AIC3254
Electrical Characteristics, Audio DAC Outputs

AUDIO DAC – STEREO SINGLE-ENDED LINE OUTPUT
Load = 10kΩ (single-ended), 56pF
Line Output on AVDD Supply
Input and Output CM = 0.9V
Device Setup DOSR = 128, MCLK = 256 * fs,
Channel Gain = 0dB, word length = 16 bits,
Processing Block = PRB_P1,
Power Tune = PTM_P3
Full scale output voltage (0dB) 0.5 VRMS
SNR Signal-to-noise ratio A-weighted (1) (2) All zeros fed to DAC input 87 100 dB
(1) (2)
DR Dynamic range, A-weighted –60dB 1kHz input full-scale signal, Word 100 dB
length = 20 bits
THD+N Total Harmonic Distortion plus Noise –3dB full-scale, 1kHz input signal –83 –70 dB
DAC Gain Error 0 dB, 1kHz input full scale signal 0.3 dB
DAC Mute Attenuation Mute 119 dB
DAC channel separation –1 dB, 1kHz signal, between left and right HP 113 dB
out
100mVpp, 1kHz signal applied to AVDD 73 dB
DAC PSRR
100mVpp, 217Hz signal applied to AVDD 77 dB
AUDIO DAC – STEREO SINGLE-ENDED LINE OUTPUT
Load = 10kΩ (single-ended), 56pF
Line Output on AVDD Supply
Input and Output CM = 0.75V; AVDD = 1.5V
DOSR = 128
Device Setup MCLK = 256 * fs
Channel Gain = –2dB
word length = 20 bits
Processing Block = PRB_P1
Power Tune = PTM_P4
SNR Signal-to-noise ratio, A-weighted (1) (2) All zeros fed to DAC input 99 dB
(1) (2)
DR Dynamic range, A-weighted –60dB 1 kHz input full-scale signal 97 dB
THD+N Total Harmonic Distortion plus Noise –1 dB full-scale, 1-kHz input signal –85 dB
AUDIO DAC – STEREO SINGLE-ENDED HEADPHONE OUTPUT
Load = 16Ω (single-ended), 50pF
Headphone Output on AVDD Supply,
Input and Output CM = 0.9V, DOSR = 128,
Device Setup MCLK = 256 * fs, Channel Gain = 0dB
word length = 16 bits;
Processing Block = PRB_P1
Power Tune = PTM_P3
SNR Signal-to-noise ratio, A-weighted (1) (2) All zeros fed to DAC input 87 100 dB
(1) (2)
DR Dynamic range, A-weighted –60dB 1kHz input full-scale signal, Word 99 dB
Length = 20 bits, Power Tune = PTM_P4
THD+N Total Harmonic Distortion plus Noise –3dB full-scale, 1kHz input signal –83 –70 dB
DAC Gain Error 0dB, 1kHz input full scale signal –0.3 dB
DAC Mute Attenuation Mute 122 dB
out-of-band noise, which, although not audible, may affect dynamic specification values

TLV320AIC3254
Electrical Characteristics, Audio DAC Outputs (continued)

DAC channel separation –1dB, 1kHz signal, between left and right HP 110 dB
out
100mVpp, 1kHz signal applied to AVDD 73 dB
DAC PSRR
100mVpp, 217Hz signal applied to AVDD 78 dB
RL = 16Ω, Output Stage on AVDD = 1.8V 15
THDN < 1%, Input CM = 0.9V,
Output CM = 0.9V
Power Delivered mW
RL = 16Ω Output Stage on LDOIN = 3.3V, 64
THDN < 1% Input CM = 0.9V,
Output CM = 1.65V
AUDIO DAC – STEREO SINGLE-ENDED HEADPHONE OUTPUT
Load = 16Ω (single-ended), 50pF,
Headphone Output on AVDD Supply,
Input and Output CM = 0.75V; AVDD = 1.5V,
Device Setup DOSR = 128, MCLK = 256 * fs,
Channel Gain = –2dB, word length = 20-bits;
Power Tune = PTM_P4
(3) (4)
DR Dynamic range, A-weighted -60dB 1kHz input full-scale signal 98 dB
THD+N Total Harmonic Distortion plus Noise –1dB full-scale, 1kHz input signal –83 dB
AUDIO DAC – MONO DIFFERENTIAL HEADPHONE OUTPUT
Load = 32Ω (differential), 50pF,
Headphone Output on LDOIN Supply
Input CM = 0.75V, Output CM = 1.5V,
AVDD = 1.8V, LDOIN = 3.0V, DOSR = 128
Device Setup MCLK = 256 * fs, Channel (headphone driver)
Gain = 5dB for full scale output signal,
word length = 16 bits,
Power Tune = PTM_P3
Full scale output voltage (0dB) 1778 mVRMS
(3) (4)
DR Dynamic range, A-weighted –60dB 1kHz input full-scale signal 96 dB
THD Total Harmonic Distortion –3dB full-scale, 1kHz input signal –82 dB
RL = 32Ω, Output Stage on LDOIN = 3.3V, 136 mW
THDN < 1%, Input CM = 0.9V,
Output CM = 1.65V
Power Delivered
RL = 32Ω Output Stage on LDOIN = 3.0V, 114 mW
THDN < 1% Input CM = 0.9V,
Output CM = 1.5V
out-of-band noise, which, although not audible, may affect dynamic specification values

TLV320AIC3254
Electrical Characteristics, LDO

over operating free-air temperature range (unless otherwise noted)
LOW DROPOUT REGULATOR (AVdd)
LDOMode = 1, LDOIN > 1.95V 1.67
Output Voltage LDOMode = 0, LDOIN > 2.0V 1.72 V
Output Voltage Accuracy ±2 %
Load Regulation Load current range 0 to 50mA 15 mV
Line Regulation Input Supply Range 1.9V to 3.6V 5 mV
Decoupling Capacitor 1 μF
Bias Current 60 μA
LOW DROPOUT REGULATOR (DVdd)
LDOMode = 1, LDOIN > 1.95V 1.67 V
Output Voltage LDOMode = 0, LDOIN > 2.0V 1.72
Output Voltage Accuracy ±2 %
Load Regulation Load current range 0 to 50mA 15 mV
Line Regulation Input Supply Range 1.9V to 3.6V 5 mV
Decoupling Capacitor 1 μF
Bias Current 60 μA

TLV320AIC3254
Electrical Characteristics, Misc.

REFERENCE
CMMode = 0 (0.9V) 0.9
Reference Voltage Settings V
CMMode = 1 (0.75V) 0.75
Reference Noise CM = 0.9V, A-weighted, 20Hz to 20kHz bandwidth, 1 μVRfcMS
Cref = 10μF
Decoupling Capacitor 1 10 μF
miniDSP (1)
Maximum miniDSP clock frequency - ADC DVDD = 1.65V 55.3 MHz
Maximum miniDSP clock frequency - DAC DVDD = 1.65V 55.3 MHz
Shutdown Current
Coarse AVDD supply turned off, LDO_select held at
Device Setup
ground, No external digital input is toggled
I(DVDD) 0.9 μA
I(AVDD) <0.9 μA
I(LDOIN) <0.9 μA
I(IOVDD) 13 nA
(1) miniDSP clock speed is specified by design and not tested in production.

TLV320AIC3254
Electrical Characteristics, Logic Levels

At 25°C, AVDD, DVDD, IOVDD = 1.8V
LOGIC FAMILY CMOS
VIH Logic Level IIH = 5 μA, IOVDD > 1.6V 0.7 × IOVDD V
IIH = 5μA, 1.2V ≤ IOVDD < 1.6V 0.9 × IOVDD V
IIH = 5μA, IOVDD < 1.2V IOVDD V
VIL IIL = 5 μA, IOVDD > 1.6V –0.3 0.3 × IOVDD V
IIL = 5μA, 1.2V ≤ IOVDD < 1.6V 0.1 × IOVDD V
IIL = 5μA, IOVDD < 1.2V 0 V
VOH IOH = 2 TTL loads 0.8 × IOVDD V
VOL IOL = 2 TTL loads 0.1 × IOVDD V
Capacitive Load 10 pF

TLV320AIC3254
Interface Timing
Typical Timing Characteristics — Audio Data Serial Interface Timing (I2S)

All specifications at 25°C, DVdd = 1.8V
WCLK
td(WS)
BCLK
td(DO-WS) td(DO-BCLK)
DOUT
tS(DI) th(DI)
DIN
Figure 3. I2S LJF and RJF Timing in Master Mode
Table 2. I2S LJF and RJF Timing in Master Mode (see Figure 3)
PARAMETER IOVDD=1.8V IOVDD=3.3V UNITS
MIN MAX MIN MAX
td(WS) WCLK delay 30 20 ns
td(DO-WS) WCLK to DOUT delay (For LJF Mode only) 20 20 ns
td(DO-BCLK) BCLK to DOUT delay 22 20 ns
ts(DI) DIN setup 8 8 ns
th(DI) DIN hold 8 8 ns
tr Rise time 24 12 ns
tf Fall time 24 12 ns

TLV320AIC3254
WCLK
th(WS)
ts(WS)
tL(BCLK) tH(BCLK) td(DO-WS) td(DO-BCLK)
BCLK
DOUT
ts(DI) th(DI)
DIN
Figure 4. I2S LJF and RJF Timing in Slave Mode
Table 3. I2S LJF and RJF Timing in Slave Mode (see Figure 4)
MIN MAX MIN MAX
tH(BCLK) BCLK high period 35 35 ns
tL(BCLK) BCLK low period 35 35
ts(WS) WCLK setup 8 8
th(WS) WCLK hold 8 8
td(DO-WS) WCLK to DOUT delay (For LJF mode only) 20 20
td(DO-BCLK) BCLK to DOUT delay 22 22
ts(DI) DIN setup 8 8
th(DI) DIN hold 8 8
tr Rise time 4 4
tf Fall time 4 4

TLV320AIC3254
Typical DSP Timing Characteristics

All specifications at 25°C, DVdd = 1.8V
WCLK
td(WS) td(WS)
BCLK
td(DO-BCLK)
DOUT
ts(DI) th(DI)
DIN
Figure 5. DSP Timing in Master Mode
Table 4. DSP Timing in Master Mode (see Figure 5)

MIN MAX MIN MAX
td(WS) WCLK delay 30 20 ns
tr Rise time 24 12 ns
tf Fall time 24 12 ns
WCLK
th(ws) ts(ws) th(ws)
th(ws)
BCLK tH(BCLK) tL(BCLK)
td(DO-BCLK)
DOUT
ts(DI) th(DI)
DIN
Figure 6. DSP Timing in Slave Mode
Table 5. DSP Timing in Slave Mode (see Figure 6)

MIN MAX MIN MAX
tH(BCLK) BCLK high period 35 35 ns
tL(BCLK) BCLK low period 35 35 ns
ts(WS) WCLK setup 8 8 ns
th(WS) WCLK hold 8 8 ns
tr Rise time 4 4 ns
tf Fall time 4 4 ns

TLV320AIC3254
I2C Interface Timing
Figure 7. I2C Interface Timing
Table 6. I2C Interface Timing

PARAMETER TEST CONDITION Standard-Mode Fast-Mode UNITS
MIN TYP MAX MIN TYP MAX
fSCL SCL clock frequency 0 100 0 400 kHz
tHD;STA Hold time (repeated) START 4.0 0.8 μs
condition. After this period, the first
clock pulse is generated.
tLOW LOW period of the SCL clock 4.7 1.3 μs
tHIGH HIGH period of the SCL clock 4.0 0.6 μs
tSU;STA Setup time for a repeated START 4.7 0.8 μs
condition
tHD;DAT Data hold time: For I2C bus 0 3.45 0 0.9 μs
devices
tSU;DAT Data set-up time 250 100 ns
tr SDA and SCL Rise Time 1000 20+0.1Cb 300 ns
tf SDA and SCL Fall Time 300 20+0.1Cb 300 ns
tSU;STO Set-up time for STOP condition 4.0 0.8 μs
tBUF Bus free time between a STOP 4.7 1.3 μs
and START condition
Cb Capacitive load for each bus line 400 400 pF

TLV320AIC3254
SPI Interface Timing
SS t
S t Lag td
t Lead t
sck
tf tr
SCLK t sckl
t sckh
t v(DOUT)
MISO t dis
MSB OUT BIT 6 . . . 1 LSB OUT

ta
t su t h(DIN)
MOSI
MSB IN BIT 6 . . . 1 LSB IN
Figure 8. SPI Interface Timing Diagram
Timing Requirements
At 25°C, DVdd = 1.8V
Table 7. SPI Interface Timing (See Figure 8)

PARAMETER TEST CONDITION IOVDD=1.8V IOVDD=3.3V UNITS
MIN TYP MAX MIN TYP MAX
tsck SCLK Period (1) 100 50 ns
tsckh SCLK Pulse width High 50 25 ns
tsckl SCLK Pulse width Low 50 25 ns
tlead Enable Lead Time 30 20 ns
ttrail Enable Trail Time 30 20 ns
td;seqxfr Sequential Transfer Delay 40 20 ns
ta Slave DOUT access time 40 20 ns
tdis Slave DOUT disable time 40 20 ns
tsu DIN data setup time 15 10 ns
th(DIN) DIN data hold time 15 10 ns
tv(DOUT) DOUT data valid time 25 18 ns
tr SCLK Rise Time 4 4 ns
tf SCLK Fall Time 4 4 ns
(1) These parameters are based on characterization and are not tested in production.

TLV320AIC3254
Typical Characteristics
Device Power Consumption

Device power consumption largely depends on PowerTune configuration. For information on device power
consumption, see the TLV320AIC3254 Application Reference Guide, literature number SLAA408.
Typical Performance
ADC SNR TOTAL HARMONIC DISTORTION

vs vs
CHANNEL GAIN HEADPHONE OUTPUT POWER
100 0
CM=0.9 V, CM=0.9 V, CM=1.65 V,
95 RIN = 10 kW, Differential
-10 RL = 32 W RL = 16 W RL = 32 W
THD - Total Harmonic Distortion - dB

90
SNR - Signal-to-Noise Ratio - dB
-20
RIN = 20 kW, Differential
85 -30 CM=1.65 V,
RL = 16 W
80 -40
75 RIN = 10 kW, Single Ended -50
70 -60
65 RIN = 20 kW, Single Ended -70

60 -80
55 -90
50 -100
-20 0 20 40 60 0 20 40 60 80 100
Channel Gain - dB Headphone Output Power - mW
Figure 9. Figure 10.
TOTAL HARMONIC DISTORTION HEADPHONE SNR AND OUTPUT POWER

vs vs
HEADPHONE OUTPUT POWER OUTPUT COMMON MODE SETTING
0 105 70
Load = 32 W BTL
-10 100
60
THD - Total Harmonic Distortion - dB
-20 SNR
SNR - Signal-to-Noise Ratio - dB
95
-30 50
CM=1.5 V 90
-40
CM=1.65 V 85 40
-50
80 OUTPUT POWER 30
-60
75
-70
20
-80 70
-90 65 10
-100 60 0
0 50 100 150 200 0.75 0.9 1.25 1.5 1.65
Headphone output Power - mW
Output Common Mode Setting - V

TLV320AIC3254
LDO DROPOUT VOLTAGE

vs
LOAD CURRENT LDO LOAD RESPONSE
350 20
DVDD LDO
300 15
Change In Output Voltage - mV

10
250 AVDD LDO
Dropout Voltage - mV
5
200
AVDD LDO
0
150 DVDD LDO
-5
100
-10
50
-15
0 -20
0 10 20 30 40 50 0 10 20 30 40 50
Load - mA Load - mA

MICBIAS MODE 2, CM = 0.9V, LDOIN OP STAGE
vs
MICBIAS LOAD CURRENT
2.6
2.55
MicBIAS Voltage - mV
2.5
2.45
2.4
0 0.5 1 1.5 2 2.5 3
MicBIAS Load - mA
Figure 15.

TLV320AIC3254
FFT
SINGLE ENDED LINE INPUT TO ADC FFT at -1dBr vs DAC PLAYBACK TO HEADPHONE FFT at -1dBFS vs
FREQUENCY FREQUENCY
0 0
ADC DAC
-20 -20
-40
-40
Power - dBFs
Power - dBr
-60
-60
-80
-80
-100
-100
-120
-140 -120
0 5000 10000 15000 20000 0 5000 10000 15000 20000
f - Frequency - Hz f - Frequency - Hz
DAC PLAYBACK TO LINE-OUT FFT at -1dBFS vs LINE INPUT TO HEADPHONE FFT at 446mVrms vs
FREQUENCY FREQUENCY
0 0
DAC
-20
-20
-40
-40
Power - dBr
Power - dBr
-60
-60
-80
-80
-100
-100
-120
-120 -140
0 5000 10000 15000 20000 0 5000 10000 15000 20000
f - Frequency - Hz f - Frequency - Hz

LINE INPUT TO LINE-OUT FFT at 446mVrms vs
FREQUENCY
0
-20
-40
Power - dBr
-60
-80
-100
-120
-140
0 5000 10000 15000 20000
f - Frequency - Hz
Figure 20.

TLV320AIC3254
TYPICAL CIRCUIT CONFIGURATION
Host Processor
Reset MCLK SCL SDA BCLK WCLK DIN DOUT
SPI_Select
1k 1k 2.7k 1k 0.1uF
MICBIAS LOL
4700pF 0.1uF
TPA2012
0.1uF 0.1uF Class D Amp
1k
IN1_R LOR
4700pF 0.1uF
0.1uF
IN1_L
0.1uF
1.9...3.6V
IN2_L
LDOIN 0.1uF 1.0uF 10uF
0.1uF
IN2_R
1.1...3.6V
1k 1k
MFP3/SCLK IOVDD
0.1uF
IN3_R LDO_SELECT
Headset_Mic HPR HPL AVSS DVSS IOVSS AVDD DVDD REF
Earjack Headset_Spkr_R 47uF

microphone
10 uF 10 uF 10 uF
and headset Headset_Spkr_L
speakers
Headset_Gnd 47uF
Figure 21. Typical Circuit Configuration
Application Overview
The TLV320AIC3254 offers a wide range of configuration options. Figure 1 shows the basic functional blocks of
the device.
Device Connections
Digital Pins
Only a small number of digital pins are dedicated to a single function; whenever possible, the digital pins have a
default function, and also can be reprogrammed to cover alternative functions for various applications.
The fixed-function pins are Reset, LDO_Select and the SPI_Select pin, which are HW control pins. Depending on
the state of SPI_Select, the two control-bus pins SCL/SS and SDA/MOSI are configured for either I2C or SPI
protocol.
Other digital IO pins can be configured for various functions via register control. An overview of available
functionality is given in Multifunction Pins.
Multifunction Pins
Table 8 shows the possible allocation of pins for specific functions. The PLL input, for example, can be
programmed to be any of 4 pins (MCLK, BCLK, DIN, GPIO).
TLV320AIC3254
Table 8. Multifunction Pin Assignments

1 2 3 4 5 6 7 8
Pin Function MCLK BCLK WCLK DIN DOUT DMDIN/ DMCLK/ GPIO
MFP1 MFP2 MFP3/ MFP4/ MFP5
SCLK MISO
A PLL Input S (1) S (2) E S (3)
(1) (4) (2)
B Codec Clock Input S ,D S S (3)
2
C I S BCLK input S,D
2
D I S BCLK output E (5)
2
E I S WCLK input E, D
F I2S WCLK output E
G I2S ADC word clock input E E
2
H I S ADC WCLK out E E
I I2S DIN E, D
J I2S DOUT E, D
K General Purpose Output I E
K General Purpose Output II E
K General Purpose Output III E
L General Purpose Input I E
L General Purpose Input II E
L General Purpose Input III E
M INT1 output E E E
N INT2 output E E E
O Digital Microphone Data Input E E E
P Digital Microphone Clock Output E E
2
Q Secondary I S BCLK input E E
R Secondary I2S WCLK in E E
S Secondary I2S DIN E E
2
T Secondary I S DOUT E
U Secondary I2S BCLK OUT E E E
V Secondary I2S WCLK OUT E E E
W Headphone Detect Input E
X Aux Clock Output E E E
(1) S(1):The MCLK pin can drive the PLL and Codec Clock inputs simultaneously.
(2) S(2):The BCLK pin can drive the PLL and Codec Clock and audio interface bit clock inputs simultaneously.
(3)
(3) S : The GPIO/MFP5 pin can drive the PLL and Codec Clock inputs simultaneously.
(4) D: Default Function
(5) E: The pin is exclusively used for this function, no other function can be implemented with the same pin. (If GPIO/MFP5 has been
allocated for General Purpose Output, it cannot be used as the INT1 output at the same time.)
Analog Pins
Analog functions can also be configured to a large degree. For minimum power consumption, analog blocks are
powered down by default. The blocks can be powered up with fine granularity according to the application needs.
Analog Audio IO
The analog IO path of the TLV320AIC3254 features a large set of options for signal conditioning as well as signal
routing:
• 6 analog inputs which can be mixed and-or multiplexed in single-ended and-or differential configuration
• 2 programmable gain amplifiers (PGA) with a range of 0 to +47.5dB
• 2 mixer amplifiers for analog bypass
• 2 low power analog bypass channels

TLV320AIC3254
• Mute function
• Automatic gain control (AGC)
• Built in microphone bias
• Stereo digital microphone interface
• Channel-to-channel phase adjustment
• Fast charge of ac-coupling capacitors
• Anti thump
Analog Low Power Bypass

The TLV320AIC3254 offers two analog-bypass modes. In either of the modes, an analog input signal can be
routed from an analog input pin to an amplifier driving an analog output pin. Neither the ADC nor the DAC
resources are required for such operation; this configuration supports low-power operation during analog-bypass
mode.
In analog low-power bypass mode, line-level signals can be routed directly from the analog inputs IN1_L to the
left headphone amplifier (HPL) and IN1_R to HPR.
ADC Bypass Using Mixer Amplifiers

In addition to the analog low-power bypass mode, another bypass mode uses the programmable gain amplifiers
of the input stage in conjunction with a mixer amplifier. With this mode, microphone-level signals can be amplified
and routed to the line or headphone outputs, fully bypassing the ADC and DAC.
To enable this mode, the mixer amplifiers are powered on via software command.
Headphone Outputs
The stereo headphone drivers on pins HPL and HPR can drive loads with impedances down to 16Ω in single-
ended AC-coupled headphone configurations, or loads down to 32Ω in differential mode, where a speaker is
connected between HPL and HPR. In single-ended drive configuration these drivers can drive up to 15mW
power into each headphone channel while operating from 1.8V analog supplies. While running from the AVDD
supply, the output common-mode of the headphone driver is set by the common-mode setting of analog inputs in
Page 1, Register 10, Bit D6, to allow maximum utilization of the analog supply range while simultaneously
providing a higher output-voltage swing. In cases when higher output-voltage swing is required, the headphone
amplifiers can run directly from the higher supply voltage on LDOIN input (up to 3.6V). To use the higher supply
voltage for higher output signal swing, the output common-mode can be adjusted to either 1.25V, 1.5V or 1.65V
by configuring Page 1, Register 10, Bits D5-D4. When the common-mode voltage is configured at 1.65V and
LDOIN supply is 3.3V, the headphones can each deliver up to 40mW power into a 16Ω load.
The headphone drivers are capable of driving a mixed combination of DAC signal, left and right ADC PGA signal
and line-bypass from analog input IN1L and IN1R by configuring Page 1, Register 12 and Page 1, Register 13
respectively. The ADC PGA signals can be attenuated up to 30dB before routing to headphone drivers by
configuring Page 1, Register 24 and Page 1, Register 25. The analog line-input signals can be attenuated up to
72dB before routing by configuring Page 1, Register 22 and 23. The level of the DAC signal can be controlled
using the digital volume control of the DAC in Page 0, Reg 65 and 66. To control the output-voltage swing of
headphone drivers, the digital volume control provides a range of –6.0dB to +29.0dB (6) in steps of 1dB. These
can be configured by programming Page 1, Register 16 and 17. These level controls are not meant to be used
as dynamic volume control, but to set output levels during initial device configuration. Refer to for
recommendations for using headphone volume control for achieving 0dB gain through the DAC channel with
various configurations.
Line Outputs
The stereo line level drivers on LOL and LOR pins can drive a wide range of line level resistive impedances in
the range of 600Ω to 10kΩ. The output common modes of line level drivers can be configured to equal either the
analog input common-mode setting or to 1.65V. With output common-mode setting of 1.65V and DRVdd_HP
supply at 3.3V the line-level drivers can drive up to 1Vrms output signal. The line-level drivers can drive out a
mixed combination of DAC signal and attenuated ADC PGA signal. Signal mixing is register-programmable.
(6) If the device must be placed into 'mute' from the –6.0dB setting, set the device at a gain of –5.0dB first, then place the device into mute.
TLV320AIC3254
ADC
The TLV320AIC3254 includes a stereo audio ADC, which uses a delta-sigma modulator with a programmable
oversampling ratio, followed by a digital decimation filter. The ADC supports sampling rates from 8kHz to
192kHz. In order to provide optimal system power management, the stereo recording path can be powered up
one channel at a time, to support the case where only mono record capability is required.
The ADC path of the TLV320AIC3254 features a large set of options for signal conditioning as well as signal
routing:
• Two ADCs
• Six analog inputs which can be mixed and-or multiplexed in single-ended and-or differential configuration
• Two programmable gain amplifiers (PGA) with a range of 0 to +47.5dB
• Two mixer amplifiers for analog bypass
• Two low power analog bypass channels
• Fine gain adjustment of digital channels with 0.1dB step size
• Digital volume control with a range of -12 to +20dB
• Mute function
• Automatic gain control (AGC)
In addition to the standard set of ADC features the TLV320AIC3254 also offers the following special functions:
• Built in microphone bias
• Stereo digital microphone interface
• Channel-to-channel phase adjustment
• Fast charge of ac-coupling capacitors
• Anti thump
• Adaptive filter mode
ADC Processing
The TLV320AIC3254 ADC channel includes a built-in digital decimation filter to process the oversampled data
from the sigma-delta modulator to generate digital data at Nyquist sampling rate with high dynamic range. The
decimation filter can be chosen from three different types, depending on the required frequency response, group
delay and sampling rate.
ADC Processing Blocks

The TLV320AIC3254 offers a range of processing blocks which implement various signal processing capabilities
along with decimation filtering. These processing blocks give users the choice of how much and what type of
signal processing they may use and which decimation filter is applied.
The choice between these processing blocks is part of the PowerTune strategy to balance power conservation
and signal-processing flexibility. Less signal-processing capability reduces the power consumed by the device.
Table 9 gives an overview of the available processing blocks and their properties. The Resource Class Column
(RC) gives an approximate indication of power consumption.
The signal processing blocks available are:
• First-order IIR
• Scalable number of biquad filters
• Variable-tap FIR filter
• AGC
The processing blocks are tuned for common cases and can achieve high anti-alias filtering or low group delay in
combination with various signal processing effects such as audio effects and frequency shaping. The available
first order IIR, BiQuad and FIR filters have fully user-programmable coefficients. The Resource Class Column
(RC) gives an approximate indication of power consumption.

TLV320AIC3254
Table 9. ADC Processing Blocks

Processing Channel Decimation 1st Order Number FIR Required Resource
Blocks Filter IIR Available BiQuads AOSR Value Class
PRB_R1 (1) Stereo A Yes 0 No 128,64 6
PRB_R2 Stereo A Yes 5 No 128,64 8
PRB_R3 Stereo A Yes 0 25-Tap 128,64 8
PRB_R4 Right A Yes 0 No 128,64 3
PRB_R5 Right A Yes 5 No 128,64 4
PRB_R6 Right A Yes 0 25-Tap 128,64 4
PRB_R7 Stereo B Yes 0 No 64 3
PRB_R8 Stereo B Yes 3 No 64 4
PRB_R9 Stereo B Yes 0 20-Tap 64 4
PRB_R10 Right B Yes 0 No 64 2
PRB_R11 Right B Yes 3 No 64 2
PRB_R12 Right B Yes 0 20-Tap 64 2
PRB_R13 Stereo C Yes 0 No 32 3
PRB_R14 Stereo C Yes 5 No 32 4
PRB_R15 Stereo C Yes 0 25-Tap 32 4
PRB_R16 Right C Yes 0 No 32 2
PRB_R17 Right C Yes 5 No 32 2
PRB_R18 Right C Yes 0 25-Tap 32 2
(1) Default
For more detailed information see the TLV320AIC3254 Application Reference Guide, SLAA408.

TLV320AIC3254
DAC
The TLV320AIC3254 includes a stereo audio DAC supporting data rates from 8kHz to 192kHz. Each channel of
the stereo audio DAC consists of a signal-processing engine with fixed processing blocks, a programmable
miniDSP, a digital interpolation filter, multi-bit digital delta-sigma modulator, and an analog reconstruction filter.
The DAC is designed to provide enhanced performance at low sampling rates through increased oversampling
and image filtering, thereby keeping quantization noise generated within the delta-sigma modulator and signal
images strongly suppressed within the audio band to beyond 20kHz. To handle multiple input rates and optimize
power dissipation and performance, the TLV320AIC3254 allows the system designer to program the
oversampling rates over a wide range from 1 to 1024. The system designer can choose higher oversampling
ratios for lower input data rates and lower oversampling ratios for higher input data rates.
The TLV320AIC3254 DAC channel includes a built-in digital interpolation filter to generate oversampled data for
the sigma-delta modulator. The interpolation filter can be chosen from three different types depending on
required frequency response, group delay and sampling rate.
The DAC path of the TLV320AIC3254 features many options for signal conditioning and signal routing:
• 2 headphone amplifiers
– Usable in single-ended or differential mode
– Analog volume setting with a range of -6 to +29dB
– Class-D mode
• 2 line-out amplifiers
– Usable in single-ended or differential mode
– Analog volume setting with a range of -6 to +29dB
• Digital volume control with a range of -63.5 to +24dB
• Mute function
• Dynamic range compression (DRC)
In addition to the standard set of DAC features the TLV320AIC3254 also offers the following special features:
• Built in sine wave generation (beep generator)
• Digital auto mute
• Adaptive filter mode
DAC Processing Blocks — Overview

The TLV320AIC3254 implements signal processing capabilities and interpolation filtering via processing blocks.
These fixed processing blocks give users the choice of how much and what type of signal processing they may
use and which interpolation filter is applied.
The choice between these processing blocks is part of the PowerTune strategy balancing power conservation
and signal processing flexibility. Less signal processing capability will result in less power consumed by the
device. Table 10 gives an overview over all available processing blocks of the DAC channel and their properties.
The Resource Class Column (RC) gives an approximate indication of power consumption.
The signal processing blocks available are:
• First-order IIR
• Scalable number of biquad filters
• 3D – Effect
• Beep Generator
The processing blocks are tuned for typical cases and can achieve high image rejection or low group delay in
combination with various signal processing effects such as audio effects and frequency shaping. The available
first-order IIR and biquad filters have fully user-programmable coefficients. The Resource Class Column (RC)
gives an approximate indication of power consumption.

TLV320AIC3254
Table 10. Overview – DAC Predefined Processing Blocks

Processing Interpolation Channel 1st Order Num. of DRC 3D Beep Resource
Block No. Filter IIR Available Biquads Generator Class
PRB_P1 (1) A Stereo No 3 No No No 8
PRB_P2 A Stereo Yes 6 Yes No No 12
PRB_P3 A Stereo Yes 6 No No No 10
PRB_P4 A Left No 3 No No No 4
PRB_P5 A Left Yes 6 Yes No No 6
PRB_P6 A Left Yes 6 No No No 6
PRB_P7 B Stereo Yes 0 No No No 6
PRB_P8 B Stereo No 4 Yes No No 8
PRB_P9 B Stereo No 4 No No No 8
PRB_P10 B Stereo Yes 6 Yes No No 10
PRB_P11 B Stereo Yes 6 No No No 8
PRB_P12 B Left Yes 0 No No No 3
PRB_P13 B Left No 4 Yes No No 4
PRB_P14 B Left No 4 No No No 4
PRB_P15 B Left Yes 6 Yes No No 6
PRB_P16 B Left Yes 6 No No No 4
PRB_P17 C Stereo Yes 0 No No No 3
PRB_P18 C Stereo Yes 4 Yes No No 6
PRB_P19 C Stereo Yes 4 No No No 4
PRB_P20 C Left Yes 0 No No No 2
PRB_P21 C Left Yes 4 Yes No No 3
PRB_P22 C Left Yes 4 No No No 2
PRB_P23 A Stereo No 2 No Yes No 8
PRB_P24 A Stereo Yes 5 Yes Yes No 12
PRB_P25 A Stereo Yes 5 Yes Yes Yes 12
(1) Default
Powertune
The TLV320AIC3254 features PowerTune, a mechanism to balance power-versus-performance trade-offs at the
time of device configuration. The device can be tuned to minimize power dissipation, to maximize performance,
or to an operating point between the two extremes to best fit the application. The TLV320AIC3254 PowerTune
modes are called PTM_R1 to PTM_R4 for the recording (ADC) path and PTM_P1 to PTM_P4 for the playback
(DAC) path.
Digital Audio IO Interface

Audio data flows between the host processor and the TLV320AIC3254 on the digital audio data serial interface,
or audio bus. This very flexible bus includes left or right-justified data options, support for I2S or PCM protocols,
programmable data length options, a TDM mode for multichannel operation, very flexible master-slave
configurability for each bus clock line, and the ability to communicate with multiple devices within a system
directly.

TLV320AIC3254
The audio bus of the TLV320AIC3254 can be configured for left or right-justified, I2S, DSP, or TDM modes of
operation, where communication with standard telephony PCM interfaces is supported within the TDM mode.
These modes are all MSB-first, with data width programmable as 16, 20, 24, or 32 bits by configuring Page 0,
Register 27, D(5:4). In addition, the word clock and bit clock can be independently configured in either Master or
Slave mode, for flexible connectivity to a wide variety of processors. The word clock is used to define the
beginning of a frame, and may be programmed as either a pulse or a square-wave signal. The frequency of this
clock corresponds to the maximum of the selected ADC and DAC sampling frequencies.
The bit clock is used to clock in and clock out the digital audio data across the serial bus. When in Master mode,
this signal can be programmed to generate variable clock pulses by controlling the bit-clock divider in Page 0,
Register 30. The number of bit-clock pulses in a frame may need adjustment to accommodate various word
lengths, and to support the case when multiple TLV320AIC3254s may share the same audio bus.
The TLV320AIC3254 also includes a feature to offset the position of start of data transfer with respect to the
word-clock. Control the offset in terms of number of bit-clocks by programming Page 0, Register 28.
The TLV320AIC3254 also has the feature to invert the polarity of the bit-clock used to transfer the audio data as
compared to the default clock polarity used. This feature can be used independently of the mode of audio
interface chosen. Page 0, Register 29, D(3) configures bit clock polarity.
The TLV320AIC3254 further includes programmability (Page 0, Register 27, D(0)) to place the DOUT line into a
hi-Z (3-state) condition during all bit clocks when valid data is not being sent. By combining this capability with
the ability to program at what bit clock in a frame the audio data begins, time-division multiplexing (TDM) can be
accomplished, enabling the use of multiple codecs on a single audio serial data bus. When the audio serial data
bus is powered down while configured in master mode, the pins associated with the interface are put into a hi-Z
output condition.
By default when the word-clocks and bit-clocks are generated by the TLV320AIC3254, these clocks are active
only when the codec (ADC, DAC or both) are powered up within the device. This intermittent clock operation
reduces power consumption. However, it also supports a feature when both the word clocks and bit-clocks can
be active even when the codec in the device is powered down. This continuous clock feature is useful when
using the TDM mode with multiple codecs on the same bus, or when word-clock or bit-clocks are used in the
system as general-purpose clocks.
Clock Generation and PLL

The TLV320AIC3254 supports a wide range of options for generating clocks for the ADC and DAC sections as
well as interface and other control blocks. The clocks for ADC and DAC require a source reference clock. This
clock can be provided on variety of device pins such as MCLK, BCLK or GPI pins. The CODEC_CLKIN can then
be routed through highly-flexible clock dividers to generate the various clocks required for ADC, DAC and the
miniDSP sections. In the event that the desired audio or miniDSP clocks cannot be generated from the reference
clocks on MCLK BCLK or GPIO, the TLV320AIC3254 also provides the option of using the on-chip PLL which
supports a wide range of fractional multiplication values to generate the required clocks. Starting from
CODEC_CLKIN the TLV320AIC3254 provides several programmable clock dividers to help achieve a variety of
sampling rates for ADC, DAC and clocks for the miniDSP.
To minimize power consumption, the system ideally provides a master clock that is a suitable integer multiple of
the desired sampling frequencies. In such cases, internal dividers can be programmed to set up the required
internal clock signals at very low power consumption. For cases where such master clocks are not available, the
built-in PLL can be used to generate a clock signal that serves as an internal master clock. In fact, this master
clock can also be routed to an output pin and may be used elsewhere in the system. The clock system is flexible
enough that it even allows the internal clocks to be derived directly from an external clock source, while the PLL
is used to generate some other clock that is only used outside the TLV320AIC3254.
Control Interfaces
The TLV320AIC3254 control interface supports SPI or I2C communication protocols, with the protocol selectable
using the SPI_SELECT pin. For SPI, SPI_SELECT should be tied high; for I2C, SPI_SELECT should be tied low.
Changing the state of SPI_SELECT during device operation is not recommended.

TLV320AIC3254
I2C Control
The TLV320AIC3254 supports the I2C control protocol, and will respond to the I2C address of 0011000. I2C is a
two-wire, open-drain interface supporting multiple devices and masters on a single bus. Devices on the I2C bus
only drive the bus lines LOW by connecting them to ground; they never drive the bus lines HIGH. Instead, the
bus wires are pulled HIGH by pullup resistors, so the bus wires are HIGH when no device is driving them LOW.
This circuit prevents two devices from conflicting; if two devices drive the bus simultaneously, there is no driver
contention.
SPI Control
In the SPI control mode, the TLV320AIC3254 uses the pins SCL/SS as SS, SCLK as SCLK, MISO as MISO,
SDA/MOSI as MOSI; a standard SPI port with clock polarity setting of 0 (typical microprocessor SPI control bit
CPOL = 0). The SPI port allows full-duplex, synchronous, serial communication between a host processor (the
master) and peripheral devices (slaves). The SPI master (in this case, the host processor) generates the
synchronizing clock (driven onto SCLK) and initiates transmissions. The SPI slave devices (such as the
TLV320AIC3254) depend on a master to start and synchronize transmissions. A transmission begins when
initiated by an SPI master. The byte from the SPI master begins shifting in on the slave MOSI pin under the
control of the master serial clock (driven onto SCLK). As the byte shifts in on the MOSI pin, a byte shifts out on
the MISO pin to the master shift register.
Power Supply
To power up the device, a 3.3V system rail (1.9V to 3.6V) can be used. The IOVDD voltage can be in the range of
1.1V - 3.6V. Internal LDOs can generate the appropriate digital and analog core voltages when configured to do
so. For maximum flexibility, the respective voltages can also be supplied externally, bypassing the built-in LDOs.
To support high-output drive capabilities, the output stages of the output amplifiers can be driven from the analog
core voltage or the 1.9…3.6V rail used for the LDO inputs (LDO_in).
Device Special Functions

The following special functions are available to support advanced system requirements:
• Headset detection
• Interrupt generation
• Flexible pin multiplexing
The TLV320AIC3254 features two miniDSP cores. The first miniDSP core is tightly coupled to the ADC, the
second miniDSP core is tightly coupled to the DAC. The fully programmable algorithms for the miniDSP must be
loaded into the device after power up. The miniDSPs have direct access to the digital stereo audio stream on the
ADC and on the DAC side, offering the possibility for advanced, very-low group delay DSP algorithms. Each
miniDSP can run up to 1152 instructions on every audio sample at a 48kHz sample rate. The two cores can run
fully synchronized and can exchange data.
Software
Software development for the TLV320AIC3254 is supported through TI's comprehensive PurePath Studio
Development Environment; a powerful, easy-to-use tool designed specifically to simplify software development
on the TLV320AIC3254 miniDSP audio platform. The Graphical Development Environment consists of a library of
common audio functions that can be dragged-and-dropped into an audio signal flow and graphically connected
together. The DSP code can then be assembled from the graphical signal flow with the click of a mouse.
Please visit the TLV320AIC3254 product folder on www.ti.com to learn more about PurePath Studio and the
latest status on available, ready-to-use DSP algorithms.

TLV320AIC3254
Register Map Summary
Table 11. Summary of Register Map

Decimal Hex DESCRIPTION
PAGE NO. REG. NO. PAGE NO. REG. NO.
0 0 0x00 0x00 Page Select Register
0 1 0x00 0x01 Software Reset Register
0 2 0x00 0x02 Reserved Register
0 4 0x00 0x04 Clock Setting Register 1, Multiplexers
0 5 0x00 0x05 Clock Setting Register 2, PLL P and R Values
0 6 0x00 0x06 Clock Setting Register 3, PLL J Values
0 7 0x00 0x07 Clock Setting Register 4, PLL D Values (MSB)
0 8 0x00 0x08 Clock Setting Register 5, PLL D Values (LSB)
0 9-10 0x00 0x09-0x0A Reserved Register
0 11 0x00 0x0B Clock Setting Register 6, NDAC Values
0 12 0x00 0x0C Clock Setting Register 7, MDAC Values
0 13 0x00 0x0D DAC OSR Setting Register 1, MSB Value
0 14 0x00 0x0E DAC OSR Setting Register 2, LSB Value
0 15 0x00 0x0F miniDSP_D Instruction Control Register 1
0 16 0x00 0x10 miniDSP_D Instruction Control Register 2
0 17 0x00 0x11 miniDSP_D Interpolation Factor Setting Register
0 18 0x00 0x12 Clock Setting Register 8, NADC Values
0 19 0x00 0x13 Clock Setting Register 9, MADC Values
0 20 0x00 0x14 ADC Oversampling (AOSR) Register
0 21 0x00 0x15 miniDSP_A Instruction Control Register 1
0 22 0x00 0x16 miniDSP_A Instruction Control Register 2
0 23 0x00 0x17 miniDSP_A Decimation Factor Setting Register
0 25 0x00 0x19 Clock Setting Register 10, Multiplexers
0 26 0x00 0x1A Clock Setting Register 11, CLKOUT M divider value
0 27 0x00 0x1B Audio Interface Setting Register 1
0 28 0x00 0x1C Audio Interface Setting Register 2, Data offset setting
0 29 0x00 0x1D Audio Interface Setting Register 3
0 30 0x00 0x1E Clock Setting Register 12, BCLK N Divider
0 31 0x00 0x1F Audio Interface Setting Register 4, Secondary Audio Interface
0 32 0x00 0x20 Audio Interface Setting Register 5
0 33 0x00 0x21 Audio Interface Setting Register 6
0 34 0x00 0x22 Digital Interface Misc. Setting Register
0 36 0x00 0x24 ADC Flag Register
0 37 0x00 0x25 DAC Flag Register 1
0 38 0x00 0x26 DAC Flag Register 2
0 39-41 0x00 0x27-0x29 Reserved Register
0 42 0x00 0x2A Sticky Flag Register 1
0 43 0x00 0x2B Interrupt Flag Register 1
0 44 0x00 0x2C Sticky Flag Register 2
0 45 0x00 0x2D Sticky Flag Register 3
0 46 0x00 0x2E Interrupt Flag Register 2
0 47 0x00 0x2F Interrupt Flag Register 3

TLV320AIC3254
Table 11. Summary of Register Map (continued)

0 48 0x00 0x30 INT1 Interrupt Control Register
0 49 0x00 0x31 INT2 Interrupt Control Register
0 52 0x00 0x34 GPIO/MFP5 Control Register
0 53 0x00 0x35 DOUT/MFP2 Function Control Register
0 54 0x00 0x36 DIN/MFP1 Function Control Register
0 55 0x00 0x37 MISO/MFP4 Function Control Register
0 56 0x00 0x38 SCLK/MFP3 Function Control Register
0 57-59 0x00 0x39-0x3B Reserved Registers
0 60 0x00 0x3C DAC Signal Processing Block Control Register
0 61 0x00 0x3D ADC Signal Processing Block Control Register
0 62 0x00 0x3E miniDSP_A and miniDSP_D Configuration Register
0 63 0x00 0x3F DAC Channel Setup Register 1
0 64 0x00 0x40 DAC Channel Setup Register 2
0 65 0x00 0x41 Left DAC Channel Digital Volume Control Register
0 66 0x00 0x42 Right DAC Channel Digital Volume Control Register
0 67 0x00 0x43 Headset Detection Configuration Register
0 68 0x00 0x44 DRC Control Register 1
0 71 0x00 0x47 Beep Generator Register 1
0 74 0x00 0x4A Beep Generator Register 4
0 75 0x00 0x4B Beep Generator Register 5
0 76 0x00 0x4C Beep Generator Register 6
0 77 0x00 0x4D Beep Generator Register 7
0 78 0x00 0x4E Beep Generator Register 8
0 79 0x00 0x4F Beep Generator Register 9
0 81 0x00 0x51 ADC Channel Setup Register
0 82 0x00 0x52 ADC Fine Gain Adjust Register
0 83 0x00 0x53 Left ADC Channel Volume Control Register
0 84 0x00 0x54 Right ADC Channel Volume Control Register
0 85 0x00 0x55 ADC Phase Adjust Register
0 86 0x00 0x56 Left Channel AGC Control Register 1
0 90 0x00 0x5A Left Channel AGC Control Register 5
0 91 0x00 0x5B Left Channel AGC Control Register 6
0 92 0x00 0x5C Left Channel AGC Control Register 7
0 93 0x00 0x5D Left Channel AGC Control Register 8
0 94 0x00 0x5E Right Channel AGC Control Register 1
0 95 0x00 0x5F Right Channel AGC Control Register 2
0 96 0x00 0x60 Right Channel AGC Control Register 3

TLV320AIC3254

0 102 0x00 0x66 DC Measurement Register 1
0 103 0x00 0x67 DC Measurement Register 2
0 104 0x00 0x68 Left Channel DC Measurement Output Register 1
0 105 0x00 0x69 Left Channel DC Measurement Output Register 2
0 106 0x00 0x6A Left Channel DC Measurement Output Register 3
0 107 0x00 0x6B Right Channel DC Measurement Output Register 1
0 108 0x00 0x6C Right Channel DC Measurement Output Register 2
0 109 0x00 0x6D Right Channel DC Measurement Output Register 3
0 110-127 0x00 0x6E-0x7F Reserved Register
1 1 0x01 0x01 Power Configuration Register
1 2 0x01 0x02 LDO Control Register
1 3 0x01 0x03 Playback Configuration Register 1
1 4 0x01 0x04 Playback Configuration Register 2
1 9 0x01 0x09 Output Driver Power Control Register
1 10 0x01 0x0A Common Mode Control Register
1 11 0x01 0x0B Over Current Protection Configuration Register
1 12 0x01 0x0C HPL Routing Selection Register
1 13 0x01 0x0D HPR Routing Selection Register
1 14 0x01 0x0E LOL Routing Selection Register
1 15 0x01 0x0F LOR Routing Selection Register
1 16 0x01 0x10 HPL Driver Gain Setting Register
1 17 0x01 0x11 HPR Driver Gain Setting Register
1 18 0x01 0x12 LOL Driver Gain Setting Register
1 19 0x01 0x13 LOR Driver Gain Setting Register
1 20 0x01 0x14 Headphone Driver Startup Control Register
1 22 0x01 0x16 IN1L to HPL Volume Control Register
1 23 0x01 0x17 IN1R to HPR Volume Control Register
1 24 0x01 0x18 Mixer Amplifier Left Volume Control Register
1 25 0x01 0x19 Mixer Amplifier Right Volume Control Register
1 26-50 0x01 0x1A-0x32 Reserved Register
1 51 0x01 0x33 MICBIAS Configuration Register
1 52 0x01 0x34 Left MICPGA Positive Terminal Input Routing Configuration Register
1 54 0x01 0x36 Left MICPGA Negative Terminal Input Routing Configuration Register
1 55 0x01 0x37 Right MICPGA Positive Terminal Input Routing Configuration Register
1 57 0x01 0x39 Right MICPGA Negative Terminal Input Routing Configuration Register
1 58 0x01 0x3A Floating Input Configuration Register

TLV320AIC3254

1 59 0x01 0x3B Left MICPGA Volume Control Register
1 60 0x01 0x3C Right MICPGA Volume Control Register
1 61 0x01 0x3D ADC Power Tune Configuration Register
1 62 0x01 0x3E ADC Analog Volume Control Flag Register
1 63 0x01 0x3F DAC Analog Gain Control Flag Register
1 71 0x01 0x47 Analog Input Quick Charging Configuration Register
1 72-122 0x01 0x48-0x7A Reserved Register
1 123 0x01 0x7B Reference Power-up Configuration Register
1 124-127 0x01 0x7C-0x7F Reserved Register
8 1 0x08 0x01 ADC Adaptive Filter Configuration Register
8 2-7 0x08 0x02-0x07 Reserved
8 8-127 0x08 0x08-0x7F ADC Coefficients Buffer-A C(0:29)
9-16 0 0x09-0x10 0x00 Page Select Register
9-16 1-7 0x09-0x10 0x01-0x07 Reserved
9-16 8-127 0x09-0x10 0x08-0x7F ADC Coefficients Buffer-A C(30:255)
26-34 0 0x1A-0x22 0x00 Page Select Register
26-34 1-7 0x1A-0x22 0x01-0x07 Reserved.
26-34 8-127 0x1A-0x22 0x08-0x7F ADC Coefficients Buffer-B C(0:255)
44 0 0x2C 0x00 Page Select Register
44 1 0x2C 0x01 DAC Adaptive Filter Configuration Register
44 2-7 0x2C 0x02-0x07 Reserved
44 8-127 0x2C 0x08-0x7F DAC Coefficients Buffer-A C(0:29)
45-52 0 0x2D-0x34 0x00 Page Select Register
45-52 1-7 0x2D-0x34 0x01-0x07 Reserved.
45-52 8-127 0x2D-0x34 0x08-0x7F DAC Coefficients Buffer-A C(30:255)
62-70 0 0x3E-0x46 0x00 Page Select Register
62-70 1-7 0x3E-0x46 0x01-0x07 Reserved.
62-70 8-127 0x3E-0x46 0x08-0x7F DAC Coefficients Buffer-B C(0:255)
80-114 0 0x50-0x72 0x00 Page Select Register
80-114 1-7 0x50-0x72 0x01-0x07 Reserved.
80-114 8-127 0x50-0x72 0x08-0x7F miniDSP_A Instructions
152-186 0 0x98-0xBA 0x00 Page Select Register
152-186 1-7 0x98-0xBA 0x01-0x07 Reserved.
152-186 8-127 0x98-0xBA 0x08-0x7F miniDSP_D Instructions

TLV320AIC3254
REVISION HISTORY
Changes from Revision B (August 2012) to Revision C Page
• Deleted "Acoustic Echo Cancellation (AEC)" and "Active Noise Cancellation (ANC)" from applications list ....................... 1
• Deleted redundant ordering information table from Packaging Information ......................................................................... 3
• Added "DVDD" to LDOs disabled in operating conditions statement ................................................................................... 6
• Corrected thi to th(DIN) ........................................................................................................................................................... 21

PACKAGE OPTION ADDENDUM
www.ti.com 19-Aug-2014
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
HPA02151IRHBR ACTIVE VQFN RHB 32 3000 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 AIC
& no Sb/Br) 3254
TLV320A3254IRHBRG4 ACTIVE VQFN RHB 32 3000 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 AIC
& no Sb/Br) 3254
TLV320AIC3254IRHBR ACTIVE VQFN RHB 32 3000 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 AIC
& no Sb/Br) 3254
TLV320AIC3254IRHBT ACTIVE VQFN RHB 32 250 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 AIC
& no Sb/Br) 3254
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 19-Aug-2014
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TLV320AIC3254 :
• Automotive: TLV320AIC3254-Q1
NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 1-Sep-2014
TAPE AND REEL INFORMATION
*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TLV320AIC3254IRHBR VQFN RHB 32 3000 330.0 12.4 5.3 5.3 1.1 8.0 12.0 Q2
TLV320AIC3254IRHBT VQFN RHB 32 250 180.0 12.4 5.3 5.3 1.5 8.0 12.0 Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 1-Sep-2014
*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TLV320AIC3254IRHBR VQFN RHB 32 3000 367.0 367.0 35.0
TLV320AIC3254IRHBT VQFN RHB 32 250 210.0 185.0 35.0
Pack Materials-Page 2
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TLV320AIC3254

www.ti.com SLAS549C – SEPTEMBER 2008 – REVISED OCTOBER 2013

Ultra Low Power Stereo Audio Codec With Embedded miniDSP

1FEATURES • Integrated LDO

Data 1dB steps

MicBias Mic ALDO

Figure 1. Simplified Block Diagram

2 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated

Product Folder Links: TLV320AIC3254

Package and Signal Descriptions

Figure 2. QFN (RHB) Package, Bottom View

Copyright © 2008–2013, Texas Instruments Incorporated Submit Documentation Feedback 3

Table 1. Terminal Functions

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Product Folder Links: TLV320AIC3254

Table 1. Terminal Functions (continued)

Copyright © 2008–2013, Texas Instruments Incorporated Submit Documentation Feedback 5

Absolute Maximum Ratings

Recommended Operating Conditions

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Product Folder Links: TLV320AIC3254

Copyright © 2008–2013, Texas Instruments Incorporated Submit Documentation Feedback 7

Electrical Characteristics, ADC

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Product Folder Links: TLV320AIC3254

Electrical Characteristics, ADC (continued)

Copyright © 2008–2013, Texas Instruments Incorporated Submit Documentation Feedback 9

Electrical Characteristics, Bypass Outputs

10 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated

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Electrical Characteristics, Microphone Interface

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Electrical Characteristics, Audio DAC Outputs

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Electrical Characteristics, Audio DAC Outputs (continued)

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Electrical Characteristics, LDO

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Electrical Characteristics, Misc.

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Electrical Characteristics, Logic Levels

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Typical Timing Characteristics — Audio Data Serial Interface Timing (I2S)

Figure 3. I2S LJF and RJF Timing in Master Mode

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Figure 4. I2S LJF and RJF Timing in Slave Mode

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Typical DSP Timing Characteristics

Figure 5. DSP Timing in Master Mode

Table 4. DSP Timing in Master Mode (see Figure 5)

BCLK tH(BCLK) tL(BCLK)

Figure 6. DSP Timing in Slave Mode

Table 5. DSP Timing in Slave Mode (see Figure 6)

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