XT V 130 X-ray inspection

Micro-focus X-ray inspection

at your fingertips
Best value for top performance
 Compact, versatile and easy-to-use workhorse

XT V 130: X-ray inspection made easy

Today there is a growing demand for flexible, high-resolution and
cost-effective inspection systems to cope with the demands of
ever-smaller electrical components and increasing quality. With the
XT V 130, you can get the inside view of printed circuit boards, in
a smooth, non-destructive process.

The Nikon Metrology XT V130 X-ray inspection system is a

high-precision, flexible solution that facilitates defect analysis
in loaded PCB boards. Designed for 100% BGA and µBGA
inspection, multi-layer board inspection and PCB solder joint
inspection, it is a compact, easy-to-use, and most of all, cost-
effective inspection system that is an indispensable workhorse
in any electronics production area.

In a nutshell
• Highly flexible system
• Interactive visualization
• Fully automatic inspection and
reporting
• High magnification at all angles
• High, 16-bit resolution imaging reveals
all defects
• Fast operation with intuitive joystick
navigation
• Low cost of ownership and maintenance
with open-tube technology
• Inherently safe system, does not require
special precautions or badges
• Small footprint and low weight for easy
installation


X-ray insight into the inside

Tracing hidden defects and internal imperfections

With the advent of many newer type components, optical
inspection is no longer an option because the majority of
connections remain hidden for the eye. This means that the
ability to generate premium-quality real-time X-ray images is
more important than ever before. Today, any OEM and subsystem Image intensifier
supplier in electronics, consumer, automotive, aerospace and
medical can take advantage of X-ray inspection technology to get
the job done! (Z-a
xis)
X-ray source
An enabling X-ray imaging concept
A micro-focus X-ray source providing a small source of X-rays
acquires information regarding the internal structure of the Moving the sample closer to the x-ray sources increase the magnification of the
resulting image
specimen. An image intensifier and digital camera are used
to capture patterns of X-rays that pass through the specimen,
showing different shades of gray depending on material and
geometry. Thicker or denser material – such as iron, copper and
lead – represent darker areas than areas highlighting thin or light
materials – such as plastic, paper or air. By moving the position of
the sample relative to the source and the detector, the preferred
magnification (and field of view) is obtained for optimized viewing
of components.

Automation increases throughput rates

Automated inspection functions and automatic board identification
ensure high inspection throughput rates. Inspection reports
compliant with MRP systems facilitate tight integration into
customers’ manufacturing processes.


 XT V130: Fast inspection of today’s miniaturized electronics

Answering the need for a compact, versatile and high-resolution X-ray Intuitive control software and automated inspection functions allows
inspection system, the XT V 130 was designed by combining over 20-years operators to manually or automatically trace defects in multi-layer boards,
experience in X-ray technology and intensive cooperation with customers PCB solder joints, Ball Grid Arrays (BGA) and μBGAs. As a result, samples
active in electronics, automotive, aerospace and telecommunications are inspected and assigned pass/fail status based on user-definable criteria.
industries. This resulted in an affordable, compact and lightweight X-ray
system for QA automation and execution on serial-produced electronic
samples.

Large horizontal,
Measurememt volume
Real-time collision-free tray
of 40x35 cm
25fps imager

Dual display for combined

measurement and real-
time analysis

Intuitive joystick navigation

drives real-time X-ray
image generation

True 60° manipulator tilt axis

Vertical 30-130kV micro-

focus with 3-micron spot size Low-cost maintenance
open-tube technology Compact and lightweight
design for easy installation


High quality images 5.3x

• In-house micro-focus source with 3-micron focal spot size

• Change position, angle and zoom as desired
• 4-inch image intensifier, optically coupled to a high-resolution
digital CCD camera
• Large set of 16-bit image processing tools
• True 60° tilting angle for easy inspection of internal features 16.7x

Intuitive to use
• Short learning curve – operational within 1 day
• Intuitive joystick navigation
• Large TFT screen for combined measurement and real-time
150x
analysis
• Bar code reader to read board SN (optional)
• Local language support

Focus on productivity
320x image magnification
• Large tray to load multiple boards enables users to zoom in on
• Fast automated component inspection any specific item of interest
• Large door with automatic interlocked X-ray off function

Safety as a design criterion

• Full protective enclosure requires no special badges or protective 0°
clothing
• Lead-lined cabinet fully complies to DIN 54113 radiation safety
standards and CE regulation
• Continuous fail-to-safe monitoring
• Designed for collision-free manipulation

45°

Low cost of ownership

• Open X-ray tube design allows for easy maintenance of internal
tube components and replacement of low-cost filaments
• No high-voltage cable required
• Low system weight (1150kg) avoids special floor treatment
• Compact design easily fits double-door entries 60°
• Easily maneuverable through 3-wheel transportation
• Serviceable components installed in an easily accessible drawer

Tilt angle up to 60° offers

sufficient flexibility to trace
connectivity issues quickly


 Inspect-X application software

Interactive and user-friendly software is essential in evaluating

the complex internal structure of samples and performing accurate
inspection. Inspect-X provides all the means to guide you in
retrieving the required information, using the most advanced
visualization and analysis capabilities. Developed to streamline
the process of inspection and measurement, it runs first-article
inspection in minutes, instead of hours or days.

Real time X-ray inspection

• Intuitive joystick control for interactive part positioning
• Lock in on BGA or region of interest (ROI)
• Ultra-fast acquisition of X-ray scans
• Integrated display and analysis tools
• Measure on screen and annotate data

Image analysis / enhancement

• User-configurable multi-point tone adjust
• Image processing filters (sharpen, smooth, edge detect,
emboss, background subtract, etc.)
• Image histogram
• Electronics inspection tools (e.g BGA void recognition)
as standard
Minuscule solder dendrites and voids

Bridging/Shorts due to surplus solder

Automatic report generation


The versatile software for all applications

Maximum productivity
• Component-specific automated pass/fail analysis
• Redo analysis on off-line visualization station
• Parameter locking organizes operator and supervisor rights
• Macro-based automation requires no programming skills
• Automatic HTML report generation
• Ready to automate complex tasks with Visual Basic for
Applications (VBA)

Wide range of applications

Electronic and electrical components

Inspection/Detection of broken wedge bonds, lifted ball bonds, wire
sweep, die attach, dry joints, bridging/shorts, voiding, etc.

Populated and unpopulated PCBs

• View surface mount defects i.e. misaligned devices, solder joint
porosity, bridging
• Detailed inspection of vias, through-hole plating and multi-layer
alignment
• Wafer-level chip scale packages (WLCSP)
• BGA and CSP inspection.
• Non-lead solder inspection.

Micro-electro-mechanical systems (MEMS, MOEMS)

Cables, harnesses, plastics and many more

Voiding at board level


 XTV130_ENG _1109 - Copyright Nikon Metrology NV 2009. All rights reserved. The materials presented here are summary in nature, subject to change and intended for general information only.

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