CS4617 Computer Architecture: Lecture 2a
CS4617 Computer Architecture: Lecture 2a
Lecture 2a
Dr J Vaughan
1/13
Die yield
2/13
Yield
I Example
I Find the number of dies per 300mm wafer for a die that is 1.5
cm square.
I Solution
Die area = 1.5 × 1.5 = 2.25cm2
π × (30/2)2 π × 30
Dies per wafer = −√
2.25 2 × 2.25
= 270
3/13
Yield
I Example
I Assuming the wafer yield is 100%, find the die yield for a die
that is 1.5 cm square
I The defect density is 0.031 per cm2 and the process
complexity factor is 13.5
I Solution
1
Die yield =
(1 + 0.031 × 2.25)13.5
= 0.4
I Note
I Defect density per chip = 0.031 × 2.25 = .06975 ≈ 7%
I Why is yield not 93%?
4/13
Other costs
5/13
Problem
6/13
Problem
7/13
Approach to solution
8/13
Solution
Exectimenew 1
= (1 − Fenhanced ) + Fenhanced ×
Exectimeold speedupenhanced
= (1 − Fenhanced ) + 0.1 × Fenhanced
= 1 − 0.9 × Fenhanced
Exectimeold 1
= (1 − Fdehanced ) + Fdehanced ×
Exectimenew speedupdehanced
0.5
= 0.5 +
0.1
= 5.5
1
5.5 =
1 − 0.9 × Fenhanced
5.5 − 4.95 × Fenhanced = 1
4.5
Fenhanced =
4.95
= 0.91
9/13
Check
1
Speedup = 1
(1 − 0.91) + 0.91 × 10
1
=
0.09 + 0.091
1
=
0.181
= 5.52
10/13
Problem
Exectimeold 1
= 1
Exectimenew (1 − Fenhanced ) + Fenhanced × speedupenhanced
1
= 0.8
0.2 + N
11/13
Problem
12/13
Problem
I What is the speedup with 8 processors if, for every time the
number of processors is doubled, the communication overhead
is increased by 0.5% of the original execution time?
I N=8
Exectimeold 1
= 0.8
Exectimenew 0.2 + 8 + 0.005 × 3
1
=
0.315
= 3.17
13/13