TS118

Multifunction Telecom Switch

INTEGRATED CIRCUITS DIVISION

Parameter Rating Units Description

Blocking Voltage 350 VP The TS118 integrated circuit device combines a 350V
Load Current 120 mArms / mADC normally closed (1-Form-B) relay with an optocoupler
On-Resistance (max) 35  in a single package. The relay uses optically coupled
MOSFET technology to provide 3750Vrms of input to
output isolation.
Its optically coupled outputs, which use the patented
Features OptoMOS architecture, are controlled by a highly
• 3750Vrms Input/Output Isolation efficient GaAIAs infrared LED.
• Low Drive Power Requirements (TTL/CMOS
Compatible) The TS118 enables telecom circuit designers to
• FCC Compatible combine two discrete functions in a single component
• VDE Compatible that uses less space than traditional discrete
• No EMI/RFI Generation component solutions.
• No Moving Parts
• High Reliability Approvals
• Arc-Free With No Snubbing Circuits
• Small 8-Pin Package • UL Recognized Component: File E76270
• Machine Insertable, Wave Solderable • CSA Certified Component: Certificate 1175739
• Surface Mount and Tape & Reel Versions Available • EN/IEC 60950 Certified Component:
TUV Certificate: B 10 05 49410 006

Applications Ordering Information

• Telecommunications
• Telecom Switching Part # Description
• Tip/Ring Circuits TS118 8-Pin DIP (50/Tube)
• Modem Switching (Laptop, Notebook, Pocket Size) TS118P 8-Pin Flatpack (50/Tube)
• Hook Switch TS118PTR 8-Pin Flatpack (1000/Reel)
• Dial Pulsing TS118S 8-Pin Surface Mount (50/Tube)
• Ground Start TS118STR 8-Pin Surface Mount (1000/Reel)
• Ringing Injection
• Instrumentation
• Multiplexers Pin Configuration
• Data Acquisition
1 8
• Electronic Switching + LED - Relay Load - Relay (MOSFET Output)
• I/O Subsystems 2 7
– LED - Relay Load - Relay (MOSFET Output)
• Meters (Watt-Hour, Water, Gas) 3 6
Collector - Phototransistor LED - Phototransistor –/+
• Medical Equipment-Patient/Equipment Isolation
4 5
• Security Emitter - Phototransistor LED - Phototransistor +/–
• Aerospace
• Industrial Controls
Switching Characteristics of
Normally Closed Devices

Form-B

IF
ILOAD
90%

10%
toff ton

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INTEGRATED CIRCUITS DIVISION TS118

Absolute Maximum Ratings @ 25ºC

Parameter Ratings Units Absolute Maximum Ratings are stress ratings. Stresses in
Blocking Voltage 350 VP excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
Input Power Dissipation 1 150 mW
beyond those indicated in the operational sections of this
Input Control Current, Relay 50 mA data sheet is not implied.
Peak (10ms) 1 A
Input Control Current, Detector 100 mA
Reverse Input Voltage 5 V
Total Power Dissipation 2 800 mW
Isolation Voltage, Input to Output 3750 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate linearly 1.33 mW / ºC
2 Derate linearly 6.67 mW / ºC

Electrical Characteristics @25ºC: Relay Section

Parameter Conditions Symbol Min Typ Max Units
Output Characteristics
Load Current
Continuous - IL - - 120 mArms / mADC
Peak t=10ms ILPK - - ±350 mAP
On-Resistance IL=120mA RON - 25 35 
Off-State Leakage Current VL=350V ILEAK - - 1 A
Switching Speeds
Turn-On ton - - 3 ms
IF=5mA, VL=10V
Turn-Off toff - - 3 ms
Output Capacitance VL=50V, f=1MHz COUT - 25 - pF
Input Characteristics
Input Control Current to Activate IL=120mA IF - - 5 mA
Input Control Current to Deactivate - IF 0.4 0.7 - mA
Input Voltage Drop IF=5mA VF 0.9 1.2 1.4 V
Reverse Input Current VR=5V IR - - 10 A
Common Characteristics
Input to Output Capacitance - CI/O - 3 - pF

Electrical Characteristics @25ºC: Detector Section

Parameter Conditions Symbol Min Typ Max Units
Output Characteristics
Phototransistor Blocking Voltage IC=10A BVCEO 20 50 - V
Phototransistor Dark Current VCE=5V, IF=0mA ICEO - 50 500 nA
Saturation Voltage IC=2mA, IF=16mA VSAT - 0.3 0.5 V
Current Transfer Ratio IF=6mA, VCE=0.5V CTR 33 100 - %
Input Characteristics
Input Control Current IC=2mA, VCE=0.5V IF - 2 6 mA
Input Voltage Drop IF=5mA VF 0.9 1.2 1.4 V
Input Current (Detector Must be Off) IC=1A, VCE=5V IF 5 25 - A
Input to Output Capacitance - - - 3 - pF
Isolation, Input to Output - VI/O 3750 - - Vrms

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INTEGRATED CIRCUITS DIVISION TS118

RELAY PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*

Typical LED Forward Voltage Drop Typical Turn-On Time Typical Turn-Off Time
(N=50, IF=5mA) (N=50, IF=5mA, IL=120mADC) (N=50, IF=5mA, IL=120mADC)
35 25 25

30
20 20

Device Count (N)

Device Count (N)

Device Count (N)

25

20 15 15

15 10 10
10
5 5
5

0 0 0
1.17 1.19 1.21 1.23 1.25 0.09 0.27 0.45 0.63 0.81 0.99 1.17 0.27 0.45 0.63 0.81 0.99 1.17 1.35
LED Forward Voltage Drop (V) Turn-On Time (ms) Turn-Off Time (ms)

Typical IF for Switch Operation Typical IF for Switch Dropout Typical On-Resistance Distribution
(N=50, IL=120mADC) (N=50, IL=120mADC) (N=50, IF=5mA, IL=120mADC)
25 25 35

30
20 20

Device Count (N)

Device Count (N)
Device Count (N)

25
15 15 20

10 10 15

10
5 5
5

0 0 0
0.33 0.55 0.77 0.99 1.21 1.43 1.65 0.11 0.33 0.55 0.77 0.99 1.21 1.43 25.5 26.5 27.5 28.5 29.5 30.5 31.5
LED Current (mA) LED Current (mA) On-Resistance (:)

Typical Blocking Voltage Distribution

(N=50)
35

30
Device Count (N)

25

20

15

10

0
357.5 372.5 387.5 402.5 417.5 432.5 447.5
Blocking Voltage (VP)

Typical Turn-On Time Typical Turn-Off Time

Typical LED Forward Voltage Drop vs. LED Forward Current vs. LED Forward Current
vs. Temperature (IL=120mADC) (IL=120mADC)
1.8 0.30 0.7
LED Forward Voltage Drop (V)

0.25 0.6
1.6
Turn-On Time (ms)

Turn-Off Time (ms)

0.5
0.20
1.4 0.4
0.15
IF=50mA
1.2 IF=30mA 0.3
IF=20mA 0.10
IF=10mA 0.2
1.0 IF=5mA 0.05 0.1
0.8 0 0
-40 -20 0 20 40 60 80 100 120 0 5 10 15 20 25 30 35 40 45 50 0 5 10 15 20 25 30 35 40 45 50
Temperature (ºC) LED Forward Current (mA) LED Forward Current

* The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.

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INTEGRATED CIRCUITS DIVISION TS118

RELAY PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*

Typical Turn-On Time Typical Turn-Off Time Typical On-Resistance
vs. Temperature vs. Temperature vs. Temperature
(IF=5mA, IL=120mADC) (IL=120mADC) (IF=5mA, IL=120mADC)
0.6 1.0 60
0.9
0.5 IF=5mA 50
0.8

Turn-Off Time (ms)

On-Resistance (:)
Turn-On Time (ms)

0.7 40
0.4
0.6
IF=10mA
0.3 0.5 30
0.4
0.2 IF=20mA 20
0.3
0.2 10
0.1
0.1
0 0 0
-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100
Temperature (ºC) Temperature (ºC) Temperature (ºC)

Typical IF for Switch Operation Typical IF for Switch Dropout Maximum Load Current
vs. Temperature vs. Temperature vs. Temperature
(IL=120mADC) (IL=120mADC) (IF=5mA)
3.0 3.0 180
160
2.5 2.5
140

Load Current (mA)

LED Current (mA)

LED Current (mA)

2.0 2.0 120

100
1.5 1.5
80
1.0 1.0 60
40
0.5 0.5
20
0 0 0
-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 120
Temperature (ºC) Temperature (ºC) Temperature (ºC)

Typical Load Current

vs. Load Voltage Typical Blocking Voltage Typical Leakage vs. Temperature
(IF=5mA) vs. Temperature Measured across Pins 7&8
150 410 0.045

405 0.040
100
Blocking Voltage (VP)
Load Current (mA)

400 0.035
Leakage (PA)

50
0.030
395
0 0.025
390
0.020
-50
385
0.015
-100 380 0.010
-150 375 0.005
-4 -3 -2 -1 0 1 2 3 4 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100
Load Voltage (V) Temperature (ºC) Temperature (ºC)

Energy Rating Curve

1.0
0.9
0.8
Load Current (A)

0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
10Ps 100Ps 1ms 10ms 100ms 1s 10s 100s
Time

* The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.

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INTEGRATED CIRCUITS DIVISION TS118

DETECTOR PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*

Typical Normalized CTR Typical Normalized CTR Typical Collector Current
vs. Forward Current vs. Temperature vs. Forward Current
(VCE=0.5V) (VCE=0.5V) (VCE=0.5V)
4.5 8 12
4.0 7

Collector Current (mA)

10
Normalized CTR (%)

Normalized CTR (%)

3.5 6
3.0 8
5
2.5
4 6
2.0
1.5 3 IF=1mA
IF=2mA 4
1.0 2 IF=5mA
IF=10mA 2
0.5 1 IF=15mA
IF=20mA
0 0 0
0 2 4 6 8 10 12 14 16 18 20 -40 -20 0 20 40 60 80 100 120 0 2 4 6 8 10 12 14 16 18 20
Forward Current (mA) Temperature (ºC) Forward Current (mA)

* The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.

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INTEGRATED CIRCUITS DIVISION TS118

Manufacturing Information

Moisture Sensitivity

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.

This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.

Device Moisture Sensitivity Level (MSL) Rating

TS118 / TS118P / TS118S MSL 1

ESD Sensitivity

This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.

Reflow Profile

This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.

Device Maximum Temperature x Time

TS118 / TS118S 250ºC for 30 seconds
TS118P 260ºC for 30 seconds

Board Wash

IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an
optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a
wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.

Pb e3

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INTEGRATED CIRCUITS DIVISION TS118

Mechanical Dimensions
TS118
9.652 ± 0.381 7.620 ± 0.254 PCB Hole Pattern
2.540 ± 0.127 (0.380 ± 0.015) (0.300 ± 0.010)
(0.100 ± 0.005) 8-0.800 DIA. 2.540 ± 0.127
(8-0.031 DIA.) (0.100 ± 0.005)
9.144 ± 0.508
6.350 ± 0.127 (0.360 ± 0.020)
(0.250 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1 3.302 ± 0.051
0.457 ± 0.076 (0.130 ± 0.002)
(0.018 ± 0.003) 7.239 TYP. 7.620 ± 0.127
(0.285) (0.300 ± 0.005)
7.620 ± 0.127
4.064 TYP (0.300 ± 0.005)
(0.160) 0.254 ± 0.0127
(0.010 ± 0.0005)

Dimensions
0.813 ± 0.102 mm
(0.032 ± 0.004) (inches)

TS118P
2.286 MAX. PCB Land Pattern
(0.090 MAX.)
2.540 ± 0.127 0 MIN / 0.102 MAX
(0.100 ± 0.005) (0 MIN / 0.004 MAX) 2.54
(0.10)
7.620 ± 0.254 0.635 ± 0.127
6.350 ± 0.127 9.398 ± 0.127 (0.025 ± 0.005)
(0.250 ± 0.005) (0.370 ± 0.005) (0.300 ± 0.010)
8.70
1.55 (0.3425)
Pin 1 (0.0610)
0.203 ± 0.013
9.652 ± 0.381 (0.008 ± 0.0005)
(0.380 ± 0.015)
0.65
2.159 ± 0.025 (0.0255)
(0.085 ± 0.001)

0.457 ± 0.076
(0.018 ± 0.003) Dimensions
0.864 ± 0.120 mm
(0.034 ± 0.004) (inches)

TS118S
9.652 ± 0.381 PCB Land Pattern
(0.380 ± 0.015) 0.635 ± 0.127
2.540 ± 0.127 3.302 ± 0.051 (0.025 ± 0.005) 2.54
(0.100 ± 0.005) (0.10)
(0.130 ± 0.002)

6.350 ± 0.127 9.525 ± 0.254

(0.250 ± 0.005) (0.375 ± 0.010) 8.90
1.65
(0.0649) (0.3503)
7.620 ± 0.254
Pin 1 (0.300 ± 0.010)
0.457 ± 0.076 0.254 ± 0.0127
(0.018 ± 0.003) (0.010 ± 0.0005) 0.65
(0.0255)
4.445 ± 0.127
(0.175 ± 0.005)

Dimensions
0.813 ± 0.102 mm
(0.032 ± 0.004) (inches)

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INTEGRATED CIRCUITS DIVISION TS118

TS118STR Tape & Reel

330.2 DIA.
(13.00 DIA.)

Top Cover W=16.00

Tape Thickness Bo=10.30 (0.63)
0.102 MAX. (0.406)
(0.004 MAX.)

Ao=10.30 P=12.00
K0 =4.90 (0.406) (0.472)
(0.193)
K1 =4.20
User Direction of Feed
(0.165)
Embossed Carrier Dimensions
mm
(inches)
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
Embossment 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2

TS118PTR Tape & Reel

2.00 4.00
330.2 DIA. (0.079) (0.157)
(13.00 DIA.)

7.50 W = 16.00
(0.295) (0.63)
Top Cover
Tape Thickness
0.102 MAX. Bo = 10.30
(0.004 MAX.) (0.406)

P = 12.00 Ao = 10.30
K0 = 2.70 (0.472) (0.406)
(0.106)
Dimensions
K1 = 2.00
User Direction of Feed mm
Embossed Carrier (0.079)
(inches)

NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
Embossment 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2

For additional information please visit our website at: www.ixysic.com

IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.

The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.

Specification: DS-TS118-R05
©Copyright 2012, IXYS Integrated Circuits Division

All rights reserved. Printed in USA.

8 12/22/2012