MW8209 Datasheet

MW8209
USB 2.0 FLASH DISK CONTROLLER

Data Sheet

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 MW8209 Datasheet

KEY FEATURS

– USB 2.0 clock sources using an external

12 MHz crystal


■ Development support
– Complete reference design including
schematics, BOM and Gerber files
■ Supports Windows XP, Windows 2K,
Windows ME, Linux and MacOS. Drivers
■ USB 2.0 Interface compatible with available for Windows 98 SE
Mass Storage Device Class
■ Abundance GPIO for Application Usage
- Integrated USB 2.0 PHY
- Up to 28 GPIOs
- Supports USB High Speed and Full Speed
- Integrated I2C Logic
- Suspend and Resume operations
- Integrated UART Logic
■ Most Widely FLASH Support
■ Flexible Boot Mode Select
- Supports all type of NAND Flash devices
- Configurable Boot from I2C Logic,
ST, Hynix, Samsung, Toshiba, Micron,
IO Logic
Infineon and Renesas
■ 64BIT Chip ID support
- Supports AND, AG-AND, SuperAND
- The 64bit Chip ID is unique and can be read
Flash from Renesas
out by user for any application purpose
- Reed-Solomon Encoder/Decoder
■ Multi-partition support
on-the-fly correction
- Each partition can be defined as one of
(5 bytes of a 528-byte block)
CDROM, HDD, ZIP or Secure-Disk
- Flash identification support
■ Data Protection
- Up to 16MB/s for read and 9MB/s for
– Write protect switch control
write operations with single channel
– Public/Private partitions support
■ Supply Management
■ Design For downgrade FLASH support
- Single 5.0V operation
- Optimized hardware unit for fast and
- Integrated 5.0V-3.3V voltage regulator
efficiency disk scanning
- Integrated 3.3V-1.8V voltage regulator
- Up to 5bits per 528bytes block ECC of
■ Embedded 8-bit Single Cycle MCU
random error
- 80C51 compatible 8-bit Microprocessor
- Up to 5bytes per 528bytes block ECC of total
■ USB 2.0 low-power device compliant
error
- Less than 80mA during write operation
■ Sectors Management
- Less than 500µA in suspend mode
-
■ Clock Management
- Integrated PLL for generating core and

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■ Support wear-level arithmetic

■ Support bad block dynamic exclusion arithmetic
■ Dual-Channel Support for High Speed Application and up to 8 banks FLASH
- Up to 18MB/s write and 29MB/s read
- Up to 12 FLASH chips in series
■ Support Serial-EEPROM
■ Bootability support
– Support HDD mode and ZIP mode
■ Device configurable Parameters :
– USB Vendor ID/Product ID (VID/PID), Serial Number and USB strings with
foreign language support
– SCSI strings
– LED outputs Mode
– Adjustable Flash bus frequency to
reach highest performance
■ Code update in the Flash or E2PROM
■LQFP48 7mmx7mm Lead-Free package
■Fabricated in 0.18um CMOS process

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Table of Contents1
1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...5
2 PIN DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3 APPLICATION SCHEMATICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4 ELECTRICAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . 11
4.1 PARAMETER CONDITIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.1.1 Minimum and Maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.1.2 Typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.1.3 Typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.1.4 Loading capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.1.5 Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.2 ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.2.1 Voltage Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.2.2 Current Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.2.3 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.3 OPERATING CONDITIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4.3.1 General Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4.4 SUPPLY CURRENT CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4.4.1 RUN and SUSPEND Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4.5 CLOCK AND TIMING CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.5.1 Crystal Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.6 I/O PORT PIN CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.6.1 General Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.6.2 USB (Universal Bus Interface) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
5 PACKAGE MECHANICAL DATA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
6 DEVICE ORDERING INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

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 MW8209 Datasheet

1 INTRODUCTION
The MW8209 is a USB 2.0 high-speed Flash Drive controller. The USB 2.0 high-speed interface
including PHY and function supports USB 2.0 Mass Storage Device Class.
The Mass Storage Controller Interface combined with the Reed-Solomon Encoder/Decoder
on-the- fly correction (5-byte on 528-byte data blocks) provides a flexible, high transfer rate
solution for interfacing a wide of range Flash memory device types. The internal 60 MHz PLL
driven by the 12MHz Oscillator is used to generate the 480MHz frequency for the USB 2.0
PHY.
The Integrated 80C51 MCU runs the application program from the internal ROM and RAM.
USB data and patch code are stored in internal RAM.
I/O ports provide functions for EEPROM, LED and write protect switch control. The internal
5.0V to 3.3V and 3.3V to 1.8V voltage regulator provides the 3.3V and 1.8V supply voltage to
the digital part of the circuit.
MW8209 has optimized internal structure and techniques designed special for MLC
process. With dual-channel and up to 5bytes ECC support, make MLC present excellence
performance as SLC NAND Flash.
MW8209 supports all the FLASH on the today’s market. Include normal SLC/MLC
NAND flash, AND/AG-AND and Super-AND flash produced by Renesas, Or-NAND
flash produce by Micron. It supports 8bit/16bit bus spec, with big/small or large page type of
all kinks of FLASH. With advanced I/O pad process, the controller can support wide I/O
voltage range from 1.8V to 3.3V LVCMOS logic.
MW8209 has a very flexible and configurable interface and internal resource for future
FLASH compatible.
MW8209 supports boot from NAND flash, I2C bus or GPIO logic. Which make support
for future flash process be possible. The firmware can be downloaded to NAND flash
or E2PROM via on chip bus logic. The boot-loader resided in the inner ROM will load the
outer codes if necessary.
The code in the NAND or E2PROM can be used for multi-purpose. For example,
implement user-defined functions such as USB finger-scanner, USB-Key and USB-Ad
Disk. In such application, mounting E2PROM via On-Chip I2C bus prefer to a NAND
flash device.
MW8209 has a UID generating unit implemented by especial process. Which can generate
a Unique Identify Code for each die. The UID is 64bits long and can be read out by
private command. The ID can be used for the application that requires high security.
For example, finance market, personal identify, high security data storage, protecting
your Intellectual Property and so on.
MW8209 has consider this impenetrate its design cycle. Now our controller has optimized
hardware unit for fast and efficiency disk scanning. It provides scan patterns like
memory BIST algorithm. And there are several scan pattern can be configured by user.
With our special hardware support, the disk scanning will achieved the fastest speed and
highest efficiency.

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The Controller supports on-chip I2C and UART logic. Together with the C51 compatible
MCU core, make it very suitable for value-extended produce. The I2C bus and UART can
be interface to many miscellaneous peripherals. The controller also provide up to 28
GPIO . All the GPIO can be programmed to input or output pins respectively, support to
interface more I/O devices or user-defined control logic.

Figure 1. Device Block Diagram

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2 PIN DESCRIPTION
Figure 2. 48-Pin TQFP Package Pin-out

RESETN
VDD33R

VDD18
FWPN
DGND
XOUT
FCLE
FD00
FD01

FD02
FD03
XIN
48
47
46
45
44
43
42
41
40
39
38
37
FALE 1 36 FD04
FW EN 2 35 FD05
GPIO 3 34 FD06
FRB2 4 33 FD07
TEST 5 32 VDD33R
AGND 6 31 FD10
DP 7 30 FD11
DM 8 29 DGND
VDDA 9 28 FD12
VREG18 10 27 FD13
VREG33 11 26 FD14
VCCA5V 12 25 FD15
13
14
15
16
17
18
19
20
21
22
23
24
VDD18
FRB

FD17
FD16
LED
DGND

FREN
GPIO
GPIO
GPIO
GPIO

VDD33R

PIN DESCRIPTION (Cont’d) – MW8209 Compatible

Legend / Abbreviations for tables:
Type: I = input, O = output, S = supply
Input level: A = Dedicated analog input
In/Output level: CT = CMOS 0.3VDD/0.7VDD with input trigger
TT= TTL 0.8V / 2V with Schmitt trigger
Output level:
D8 = 8mA drive
D4 = 4mA drive
D2 = 2mA drive

Table 1. Power Supply

LQFP48 Pin Name Type Description

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 MW8209 Datasheet
Pin
6 AGND S Analog GND for USB PLUG
10 VREG18 S Internal LDO 1.8V output
9 VDDA S Analog Voltage Input 3.3V
11 VREG33 S Internal LDO 3.3V output
12 VCCA5V S Power Supply Input 5.0V (VBUS)
14 DGND S Digital Ground
15 VDD18 S Core Voltage Input 1.8V
24 VDD33R S I/O Voltage Input 3.3V
29 DGND S Digital Ground
32 VDD33R S I/O Voltage Input 3.3V
38 VDD18 S Core Voltage Input 1.8V
39 DGND S Digital Ground
45 VDD33R S I/O Voltage Input 3.3V

Table 2. Control & System

LQFP48 Pin Name Type Description
Pin
40 RESETN I Controller Reset , Low Level Active
5 TEST I Test Mode Select
42 XIN I 12MHz OSC Input
41 XOUT O 12MHz OSC Output
Table 3. USB 2.0 Interface
LQFP48 Pin Name Type Description
Pin
7 DP I/O USB2 DATA +
8 DM I/O USB2 DATA -

Table 4. General Purpose IO Ports / Mass Storage IOs

LQFP48 Pin Name Type Main Function Alternate
Pin Function
13 LED O Bus Transmit LED Driver
47 FD00 I/O FLASH Data Bus 0 (Chan.1) GPIO
46 FD01 I/O FLASH Data Bus 1 (Chan.1) GPIO
44 FD02 I/O FLASH Data Bus 2 (Chan.1) GPIO
43 FD03 I/O FLASH Data Bus 3 (Chan.1) GPIO
36 FD04 I/O FLASH Data Bus 4 (Chan.1) GPIO
35 FD05 I/O FLASH Data Bus 5 (Chan.1) GPIO
34 FD06 I/O FLASH Data Bus 6 (Chan.1) GPIO
33 FD07 I/O FLASH Data Bus 7 (Chan.1) GPIO
37 FWPN O FLASH Write Protect enable，Active GPIO
Low
2 FWEN O FLASH Write Enable GPIO

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1 FALE O FLASH Address Latch GPIO
48 FCLE O FLASH Command Latch GPIO
17 FREN O FLASH Read Enable GPIO
16 FRB I FLASH Read/Busy (Chan.1) GPIO
31 FD10 I/O FLASH Data Bus 0 (Chan.2) GPIO
30 FD11 I/O FLASH Data Bus 1 (Chan.2) GPIO
28 FD12 I/O FLASH Data Bus 2 (Chan.2) GPIO
27 FD13 I/O FLASH Data Bus 3 (Chan.2) GPIO
26 FD14 I/O FLASH Data Bus 4 (Chan.2) GPIO
25 FD15 I/O FLASH Data Bus 5 (Chan.2) GPIO
23 FD16 I/O FLASH Data Bus 6 (Chan.2) GPIO
22 FD17 I/O FLASH Data Bus 7 (Chan.2) GPIO
4 FRB2 I FLASH Read/Busy (Chan.2) GPIO
3 GPIO I/O GPIO
18 GPIO I/O GPIO
19 GPIO I/O GPIO
20 GPIO I/O GPIO
21 GPIO I/O GPIO

3 APPLICATION SCHEMATICS

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Figure 3. Application Schematic Sheet

4 ELECTRICAL CHARACTERISTICS
4.1 PARAMETER CONDITIONS
Figure 4. Pin loading conditions

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Unless otherwise specified, all voltages are

referred to VSS (Digital Ground).
4.1.1 Minimum and Maximum values
Unless otherwise specified the minimum and
maximum values are guaranteed in the worst
conditions of ambient temperature, supply
voltage and frequencies by tests in
production on 100% of the Devices with an
ambient temperature at TA=25°C
and TA=TAmax (given by the selected
temperature range).
Data based on characterization results,
design simulation and/or technology
characteristics are indicated in the table
footnotes and are not tested in production.
Based on characterization, the minimum and
maximum values refer to sample tests and
represent the mean value plus or minus three
times the standard deviation (mean±3Σ).
4.1.2 Typical values
Unless otherwise specified, typical data are
based on TA=25°C, VCCA5 = 5.0V or
VDD33A=3.3V with internal LDO bypass.
They are given only as design guidelines and
are not tested.
4.1.3 Typical curves
Unless otherwise specified, all typical curves
are given only as design guidelines and are
not tested.
4.1.4 Loading capacitor
The loading conditions used for pin
parameter measurement are shown in
Figure 4.

4.2 ABSOLUTE MAXIMUM RATINGS

Stresses above those listed as “absolute maximum ratings” may cause permanent
damage
4.2.1 to theCharacteristics
Voltage Device. This is a stressinternal
without rating only
LDOand functional
(VCC = VDD33A operation of the
= 3.3V supply)
Device under these conditions is not implied. Exposure to maximum rating conditions
for extended periods may affect device reliability.

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 MW8209 Datasheet
Table 5

Symbol Ratings Max. Value Unit

VDD33A Supply Voltage 3.6 V
DP 、DM Input Voltage On Pin 5.5 V
VIN Input Voltage On other Pin 3.6 V
VESD(HBM) ESD for Human Body Mode 2000 V
VESD(MM) ESD for Machine Mode 200 V

4.2.1 Voltage Characteristics with internal LDO (VCC = VCCA5 = 5.0V supply)
Table 6
Symbol Ratings Max. Value Unit
VCCA5 Supply Voltage 5.5 V
DP 、DM Input Voltage On Pin 5.5 V
VIN Input Voltage On other Pin 3.6 V
VESD(HBM) ESD for Human Body Mode 2000 V
VESD(MM) ESD for Machine Mode 200 V

4.2.2 Current Characteristics (Digital Parts)

Table 7
Symbol Ratings Max. Value Unit
IVDD33 Total Current into VDD33 lines (source) 65 mA
IVSS Total Current out of VSS ground lines (sink) 65 mA

4.2.3 Thermal Characteristics

Table 8
Symbol Ratings Min. Value Max. Value Unit
TSTG Storage temperature range -40 125 ℃
ToT Operating temperature 0 70 ℃

4.3 OPERATING CONDITIONS

4.3.1 General Operating Conditions without internal LDO
Table 9
Symbol Parameter Conditions Min Max Unit
VDD33 Power Supply 3.0 3.6 V
Ta Ambient temperature range 0 70 ℃

4.3.1 General Operating Conditions with internal LDO

Table 10
Symbol Parameter Conditions Min Max Unit
VCCA5 Power Supply 4.5 5.5 V

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 MW8209 Datasheet
Ta Ambient temperature range 0 70 ℃

4.4 SUPPLY CURRENT CHARACTERISTICS

4.4.1 RUN and SUSPEND Modes
Table 11
Symbol Parameter Conditions Min Typ Max Unit

IDD Supply current in RUN mode fosc = 12M 55 mA

IDD Supply current in SUSPEND mode Vreg33=3.3V 250 μA
Ta = +25℃

4.5 CLOCK AND TIMING CHARACTERISTICS

Subject to general operating conditions for VDD33, fOSC, and TA.
4.5.1 Crystal Oscillator
The Device internal clock is supplied from a crystal oscillator. All the information given in
this paragraph are based on characterization results with specified typical external
components. In the application the load capacitors have to be placed as close as possible to
the oscillator pins in order to minimize output distortion and start-up stabilization time. Refer
to the crystal manufacturer for more details (frequency, package, accuracy...).

Table 12
Symbol Parameter Conditions Min Typ Max Unit

FOSC Oscillator frequency 12 Mhz

CKACC Total crystal oscillator accuracy abs. value + temp + ag ±60 Ppm
Аosc Crystal oscillator duty cycle 45 50 55 %

Figure 6. Typical Application with a Crystal

Note
1. The crystal oscillator duty cycle has to be adjusted through the two CL capacitors. Refer to the crystal
manufacturer for more details. Typically, CL = 12pF

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 MW8209 Datasheet
2. RL = 1MΩ for matching internal PLL (Opt.)
3. Depending on the crystal power dissipation, a serial resistor RsOscout may be added.
Refer to the crystal manufacturer for more details. (Opt.)

4.6 I/O PORT PIN CHARACTERISTICS

4.6.1 General Characteristics
Subject to general operating conditions for VDD33, fOSC, and TA unless otherwise specified.
Table 13
Symbol Parameter Conditions Min Typ Max Unit
VIL Input low level voltage 0.4 V
VIH Input high level voltage TTL ports 1.5 V
Vhys Schmitt trigger voltage mV
hysteresis1)
IL Input leakage current VSS≤VIN≤VDD33, 1 μA
standard I/Os
RPU Weak pull-up equivalent VIN=VSS 4.7 60 kΩ
resistor 2) VDD33=3.3V

Notes:
1. Hysteresis voltage between Schmitt trigger switching levels. Based on characterization
results, not tested in production.
2. The RPU pull-up equivalent resistor is based on a resistive transistor. This data is based on
characterization results, tested in production at VDD33 max.

Figure 7. Two typical Applications with unused I/O Pin

4.6.2 USB (Universal Bus Interface)

Table 14. USB Interface: DC Characteristics
USB DC Electrical Characteristics
Symbol Parameter Conditions Min. Typ. Max. Unit

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IDDsuspend Suspend Current VDD33=3.3V, regulator 0.2 1) 0.25 1) mA
ON and PHY OFF
RPU Pull-up Resistor 1) 4.7 60 KΩ
Full Speed Mode (DP / DM)
VOH High Level Output 3 V
Voltage

VOL Low Level Output 0.2 V

Voltage

VCRS Crossover Voltage 1.4 1.9 V

High Speed Mode (DP / DM)

VHSOH HS Data Signalling High 400 mV

VHSOL HS Data Signalling Low 10 mV

Notes:
1. Not tested in production, guaranteed by characterization.
2. In order to reach this value, the software must force the regulator into power down mode
and the I/Os compensation cell off.

Table 15. USB Interface: Timing

USB DC Electrical Characteristics
Symbol Parameter Conditions Min. Max. Unit
Full Speed Mode (DP / DM)
TFR Rise Time CL=50pF 10 15 ns
TFF Fall Time CL=50pF 10 15 ns
High Speed Mode (DP / DM)

THSR Rise Time RL=45Ω 500 1) ps

THSF Fall Time RL=45Ω 500 1) ps
THSDRAT HS Data Rate 480 Mb/s

Notes:
1. Not tested in production, guaranteed by characterization.

5 PACKAGE MECHANICAL DATA

Figure 8. 48-Pin Thin Quad Flat Package

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6 DEVICE ORDERING INFORMATION

Table 16. Feature comparison table (sample)
Part Number Package Operation Voltage Temperature Range
MW8209 LQFP\LQFP48 7mmx7mm 3.0V ~ 3.6V 0℃ ~ 70℃

Part Number Product Info. Memo

MW8209 USB2.0 Disk Controller USB2.0 Mass Storage Disk Controller

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