Tarang Mini Document
Tarang Mini Document
Tarang Mini Document
Contents
1. Module Interface Details .............................................................................................................. 3
2. Pin Definition ............................................................................................................................... 4
3. Technical Specification ................................................................................................................. 4
4. Electrical Specifications ................................................................................................................ 5
5. LoRaWAN™ Power Spectrum........................................................................................................ 5
6. Input Voltage vs. Transmit Current with Max Power Level ............................................................ 6
7. Helical Antenna ............................................................................................................................ 7
8. Helical Antenna Placement & Orientations ................................................................................... 8
9. TarangMini™ SM20LR03 interface with a Microcontroller ............................................................ 9
10. TarangMini™ SM20LR03 interface with a PC ............................................................................... 10
11. Module Pin Configuration........................................................................................................... 10
12. Mechanical Dimensions and Footprint........................................................................................ 11
a. TarangMini™ SM20LR03 – Module Dimensions .................................................................... 11
b. Recommended PCB Footprint – SMD Mounting ................................................................... 12
c. Recommended PCB Footprint – Through-Hole Mounting ...................................................... 13
13. Module Firmware and Code loading .......................................................................................... 14
a. Pre-requisites ....................................................................................................................... 14
b. Code Loading Process ........................................................................................................... 14
TarangMini™ module has 18-pin (3 X 6) 2mm pitch Castellated Pads / Through- Hole Pins
distributed in three rows at the module edges. This connector / pads are used for interfacing
the module with a microcontroller / RS232 level converter / USB to serial base board
2. Pin Definition
3. Technical Specification
Note: Power supply = 3.3 V to 3.6 V, Frequency of operation as specified in above table,
Bandwidth = 125 KHz, Spreading Factor =8, Packet length = 40 Bytes, Modulation = LoRa
4. Electrical Specifications
3 18 122 123.5
3.3 18.2 123.5 126
3.6 18.5 124 128
* +/-0.5 dB due to the output power variations from the base transceiver.
** Current measurement results with on-board antenna are concluded based on the tests
conducted on 5 modules. Tested modules are used latest LoRaWAN™ firmware with MAX
power and different input voltage levels. The Helical Antenna is mounted in its standard
configuration (vertically on the module). Standard TarangMini™ interface card is used for the
measurements.
7. Helical Antenna
TarangMini™ SM20LR03 on-board antenna is Omni directional antenna with 0dBi gain.
The VSWR and Return loss plots of the antenna are given below.
The following pictures illustrate different antenna orientations and recommended keep-out area
for the host PCB and enclosures.
Note: Antenna radiation pattern may get affected by obstructions (especially metallic) present
in the RF path, variation is depended on the size and position of the obstruction.
Below placement guideline does not guarantee 18.5 dBm EIRP and same radiation pattern in all
the direction when the module is placed in an enclosure/PCB with materials that obstruct the
RF path (even if the obstruction is farther than the recommended keep-out area). It also has
dependency on the receiver antenna polarization
VDD_3.3
VDD_3.3
C J
10uF
Host Controller Module
1 18
2 VDD NC 17
RXD DOUT NC
3 16
TXD 4 DIN NC 15
RST RST 5 BOOT NC 14
RST 6 RST NC 13
R GND SLEEP
1K
NCNCNCNCNCNC
7 8 9 101112
CONN PLUG 6x3
VDD_3.3
VDD_5V
C J
10uF
Host Controller Module
1 18
RXD R 100E 2 VDD NC 17
R 100E 3 DOUT NC 16
TXD 4 DIN NC 15
RST RST 5 BOOT NC 14
RST 6 RST NC 13
D
3.3V R GND SLEEP
1K
NCNCNCNCNCNC
7 8 9 101112
CONN PLUG 6x3
VDD_3.3
C J
P1 10uF
1 Module
6 U MAX3232 1 18
2 14 11 2 VDD NC 17
7 13 T1OUT T1IN 12 3 DOUT NC 16
3 R1IN R1OUT 4 DIN NC 15
8 7 10 5 BOOT NC 14
4 8 T2OUT T2IN 9 VDD_3.3 6 RST NC 13
9 C 0.1uF R2IN R2OUT R4 GND SLEEP
5 1 C 1K
3 C+ 2 0.1uF NC NC NCNC NCNC
C C1- V+ 16
DB9_F 0.1uF 4 VCC 6 C 0.1uF C C
C2+ V- 7 8 9 10 11 12
5 15 0.1uF 0.1uF CONN PLUG 6x3
C2- GND
SERIAL INTERFACE
Figure-1
Note: Above pin configuration illustrates the module pin-out and capabilities. All other pin functions
except UART and Sleep are not supported in the standard module firmware. Please contact Melange
Systems for customized firmware requirements
Module PCB is 1.6mm thick with castellated mouting pads on the edge along with through hole
provision. Figure 3(a &b ) is the recommended host PCB Foootprint.
DO NOT SCALE
Figure-2
Figure-3a
Note: Do not extend the host PCB top copper ground plane under the module for best
RF performance.
Figure – 3b
Note: Do not extend the host PCB top copper ground plane below the module keep out
area for best RF Performance.
a. Pre-requisites