IPC-7351A Naming Convention for Standard SMT Land Patterns

Surface Mount Land Patterns

Component, Category Land Pattern Name

Ball Grid Array’s............................... BGA + Pin Qty + C or N + Pitch P + Ball Columns X Ball Rows _ Body Length X Body Width X Height
BGA w/Dual Pitch . BGA + Pin Qty + C or N + Col Pitch X Row Pitch P + Ball Columns X Ball Rows _ Body Length X Body Width X Height
BGA w/Staggered Pins..................BGAS + Pin Qty + C or N + Pitch P + Ball Columns X Ball Rows _ Body Length X Body Width X Height
BGA Note: The C or N = Collapsing or Non-collapsing Balls
Capacitors, Chip, Array, Concave ..........................................................CAPCAV + Pitch P + Body Length X Body Width X Height - Pin Qty
Capacitors, Chip, Array, Flat ..................................................................CAPCAF + Pitch P + Body Length X Body Width X Height - Pin Qty
Capacitors, Chip, Non-polarized.................................................................................................CAPC + Body Length + Body Width X Height
Capacitors, Chip, Polarized ..................................................................................................... CAPCP + Body Length + Body Width X Height
Capacitors, Chip, Wire Rectangle ........................................................................................CAPCWR + Body Length + Body Width X Height
Capacitors, Molded, Non-polarized ........................................................................................... CAPM + Body Length + Body Width X Height
Capacitors, Molded, Polarized.................................................................................................CAPMP + Body Length + Body Width X Height
Capacitors, Aluminum Electrolytic ............................................................................................................CAPAE + Base Body Size X Height
Ceramic Flat Packages..................................................................................................... CFP127P + Lead Span Nominal X Height - Pin Qty
Column Grid Array’s ..................................................... CGA + Pitch P + Number of Pin Columns X Number of Pin Rows X Height - Pin Qty
Crystals (2 leads)........................................................................................................................ XTAL + Body Length X Body Width X Height
Diodes, Chip ................................................................................................................................DIOC + Body Length + Body Width X Height
Diodes, Molded........................................................................................................................... DIOM + Body Length + Body Width X Height
Diodes, MELF ................................................................................................................................ DIOMELF + Body Length + Body Diameter
Fuses, Molded ............................................................................................................................FUSM + Body Length + Body Width X Height
Inductors, Chip............................................................................................................................. INDC + Body Length + Body Width X Height
Inductors, Molded ........................................................................................................................INDM + Body Length + Body Width X Height
Inductors, Precision Wire Wound ................................................................................................ INDP + Body Length + Body Width X Height
Inductors, Chip, Array, Concave.............................................................. INDCAV + Pitch P + Body Length X Body Width X Height - Pin Qty
Inductors, Chip, Array, Flat...................................................................... INDCAF + Pitch P + Body Length X Body Width X Height - Pin Qty
Land Grid Array ............................................... LGA + Pin Qty - Pitch P + Ball Columns X Ball Rows _ Body Length X Body Width X Height
Oscillators, Side Concave ........................................................................ OSCSC + Pitch P + Body Length X Body Width X Height - Pin Qty
Oscillators, J-Lead ....................................................................................... OSCJ + Pitch P + Body Length X Body Width X Height - Pin Qty
Oscillators, L-Bend Lead .............................................................................OSCL + Pitch P + Body Length X Body Width X Height - Pin Qty
Oscillators, Corner Concave....................................................................................................OSCCC + Body Length X Body Width X Height
Plastic Leaded Chip Carriers.................................................. PLCC + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height - Pin Qty
Plastic Leaded Chip Carrier Sockets Square ....................... PLCCS + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height - Pin Qty
Quad Flat Packages ..................................................................QFP + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height - Pin Qty
Ceramic Quad Flat Packages................................................. CQFP + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height - Pin Qty
Quad Flat No-lead ................................................................ QFN + Pitch P + Body Width X Body Length X Height - Pin Qty + Thermal Pad
Pull-back Quad Flat No-lead ..............................................PQFN + Pitch P + Body Width X Body Length X Height - Pin Qty + Thermal Pad
Quad Leadless Ceramic Chip Carriers.......................................................... LCC + Pitch P + Body Width X Body Length X Height - Pin Qty
Quad Leadless Ceramic Chip Carriers (Pin 1 on Side)............................... LCCS + Pitch P + Body Width X Body Length X Height - Pin Qty
Resistors, Chip ........................................................................................................................... RESC + Body Length + Body Width X Height
Resistors, Molded ...................................................................................................................... RESM + Body Length + Body Width X Height
Resistors, MELF ........................................................................................................................... RESMELF + Body Length + Body Diameter
Resistors, Chip, Array, Concave ............................................................RESCAV + Pitch P + Body Length X Body Width X Height - Pin Qty
Resistors, Chip, Array, Convex, E-Version (Even Pin Size) ............... RESCAXE + Pitch P + Body Length X Body Width X Height - Pin Qty
Resistors, Chip, Array, Convex, S-Version (Side Pins Diff) ................ RESCAXS + Pitch P + Body Length X Body Width X Height - Pin Qty
Resistors, Chip, Array, Flat.....................................................................RESCAF + Pitch P + Body Length X Body Width X Height - Pin Qty
Small Outline IC, J-Leaded........................................................................................ SOJ + Pitch P + Lead Span Nominal X Height - Pin Qty
Small Outline Integrated Circuit, (50 mil Pitch SOIC)......................................................SOIC127P + Lead Span Nominal X Height - Pin Qty
Small Outline Packages ............................................................................................SOP + Pitch P + Lead Span Nominal X Height - Pin Qty
Small Outline No-lead........................................................... SON + Pitch P + Body Width X Body Length X Height - Pin Qty + Thermal Pad
Pull-back Small Outline No-lead.........................................PSON + Pitch P + Body Width X Body Length X Height - Pin Qty + Thermal Pad
SOD (Example: SOD3717X135 = JEDEC SOD123) ........................................................SOD + Lead Span Nominal + Body Width X Height
SOT89 (JEDEC Standard Package) .......................................................................................................................................................SOT89
SOT143 & SOT343 (JEDEC Standard Package) .............................................................................................................. SOT143 & SOT343
SOT143 & SOT343 Reverse (JEDEC Standard Package)........................................................................................... SOT143R & SOT343R
SOT23 & SOT223 Packages (Example: SOT230P700X180-4) ............................... SOT + Pitch P + Lead Span Nominal X Height - Pin Qty
TO (Generic DPAK - Example: TO228P970X238-3) .................................................................TO + Pitch P + Lead Span X Height - Pin Qty

© 2003 - 2007 IPC & PCB Libraries, Inc. 04/05/07

 IPC-7351A Land Pattern Naming Convention Notes
• All dimensions are in Metric Units
• All Lead Span and Height numbers go two places past the decimal point and “include” trailing Zeros
• All Lead Span and Body Sizes go two place before the decimal point and “remove” leading Zeros
• All Chip Component Body Sizes are one place to each side of the decimal point
• Pitch Values are two places to the right & left of decimal point with no leading Zeros but include trailing zeros

Naming Convention Special Character Use for Land Patterns

The _ (underscore) is the separator between pin Qty in Hidden & Deleted pin components
The – (dash) is used to separate the pin qty.
The X (capital letter X) is used instead of the word “by” to separate two numbers such as height X width like “Quad Packages”.

PCB Libraries Suffix Naming Convention for Land Patterns

Common SMT Land Pattern to Describe Environment Use (This is the last character in every name)
Note: This excludes the BGA component family as they only come in the Nominal Environment Condition
• M ................. Most Material Condition (Level A)
• N.................. Nominal Material Condition (Level B)
• L.................Least Material Condition (Level C)

Alternate Components that do not follow the JEDEC, EIA or IEC Standard
• A.................. Alternate Component (used primarily for SOP & QFP when Component Tolerance or Height is different)
• B.................. Second Alternate Component

Reverse Pin Order

• -20RN.......... 20 pin part, Reverse Pin Order, Nominal Environment

Hidden Pins
• -20_24N ...... 20 pin part in a 24 pin package. The pins are numbered 1 – 24 the hidden pins are skipped. The schematic
symbol displays up to 24 pins.

Deleted Pins
• -24_20N ...... 20 pin part in a 24 pin package. The pins are numbered 1 – 20. The schematic symbol displays 20 pins.

JEDEC and EIA Standard parts that have several alternate packages
• AA, AB, AC. JEDEC or EIA Component Identifier

GENERAL SUFFIXES

_HS.........................HS = Land Pattern with Heat Sink attachment requiring additional holes or pads
Example: TO254P1055X160_HS-6N

_BEC ......................BEC = Base, Emitter and Collector (Pin assignments used for three pin Transistors)
Example: SOT95P280X160_BEC-3N

_SGD ......................SGD = Source, Gate and Drain (Pin assignments used for three pin Transistors)
Example: SOT95P280X160_SGD-3N

_213........................213 = Alternate pin assignments used for three pin Transistors

Example: SOT95P280X160_213-3N

© 2003 - 2007 IPC & PCB Libraries, Inc. 04/05/07

 PCB Libraries Naming Convention for Non-Standard SMT Land Patterns
Surface Mount Land Patterns
Component, Category Land Pattern Name
Amplifiers.................................................................................................................................................... AMP_ Mfr.’s Part Number
Batteries ......................................................................................................................................................BAT_ Mfr.’s Part Number
Capacitors, Variable .................................................................................................................................. CAPV_Mfr.’s Part Number
Capacitors, Chip, Array, Concave (Pins on 2 or 4 sides).............................................................. CAPCAV_Mfr Series No. - Pin Qty
Capacitors, Chip, Array, Flat (Pins on 2 sides) ..............................................................................CAPCAF_Mfr Series No. - Pin Qty
Capacitors, Miscellaneous............................................................................................................................CAP_Mfr.’s Part Number
Crystals ......................................................................................................................................................XTAL_Mfr.’s Part Number
Diodes, Miscellaneous...................................................................................................................................DIO_Mfr.’s Part Number
Diodes, Bridge Rectifiers ............................................................................................................................ DIOB_Mfr.’s Part Number
Ferrite Beads .................................................................................................................................................. FB_Mfr.’s Part Number
Fiducials ......................................................................................................................................FID + Pad Size X Solder Mask Size
Filters..............................................................................................................................................................FIL_Mfr.’s Part Number
Fuses..........................................................................................................................................................FUSE_Mfr.’s Part Number
Fuse, Resettable ..................................................................................................................................... FUSER_Mfr.’s Part Number
Inductors, Miscellaneous ............................................................................................................................... IND_Mfr.’s Part Number
Inductors, Chip, Array, Concave (Pins on 2 or 4 sides) ..................................................................INDCAV_Mfr Series No. - Pin Qty
Inductors, Chip, Array, Flat (Pins on 2 sides) ................................................................................. INDCAF_Mfr Series No. - Pin Qty
Keypad ................................................................................................................................................. KEYPAD_Mfr.’s Part Number
LEDS ............................................................................................................................................................ LED_Mfr.’s Part Number
LEDS, Chip................................................................................................................................................... LED_Mfr.’s Part Number
Liquid Crystal Display ...................................................................................................................................LCD_Mfr.’s Part Number
Microphones ..................................................................................................................................................MIC_Mfr.’s Part Number
Opto Isolators ............................................................................................................................................ OPTO_Mfr.’s Part Number
Oscillators......................................................................................................................................OSC_Mfr.’s Part Number - Pin Qty
Quad Flat Packages w/Bumper Corners, Pin 1 Side ............. BQFP + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height - Pin Qty
Quad Flat Packages w/Bumper Corners, 1 Center ..............BQFPC + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height - Pin Qty
Resistors, Chip, Array, Concave (Pins on 2 or 4 sides).................................................................RESCAV_Mfr Series No. - Pin Qty
Resistors, Chip, Array, Convex Type E (Pins on 2 sides)........................................................... RESCAXE_Mfr Series No. - Pin Qty
Resistors, Chip, Array, Convex Type S (Pins on 2 sides)........................................................... RESCAXS_Mfr Series No. - Pin Qty
Resistors, Chip, Array, Flat (Pins on 2 sides) ................................................................................RESCAF_Mfr Series No. - Pin Qty
Relays ..................................................................................................................................................... RELAY_Mfr.’s Part Number
Speakers .................................................................................................................................................... SPKR_Mfr’s Part Number
Switches ........................................................................................................................................................ SW_Mfr.’s Part Number
Test Points, Round ...................... TP + Pad Size (1 place left of decimal and 2 places right of decimal, Example TP100 = 1.00mm)
Test Points, Square ............................................................... TPS + Pad Size (1 place left of decimal and 2 places right of decimal)
Test Points, Rectangle .................................... TP + Pad Length X Pad Width (1 place left of decimal and 2 places right of decimal)
Thermistors............................................................................................................................................. THERM_Mfr.’s Part Number
Transducers (IRDA’s) ................................................................................................................................ XDCR_Mfr.’s Part Number
Transient Voltage Suppressors .................................................................................................................... TVS_Mfr.’s Part Number
Transient Voltage Suppressors, Polarized .................................................................................................TVSP_Mfr.’s Part Number
Transistor Outlines, Custom ....................................................................................................................TRANS_Mfr.’s Part Number
Transformers ............................................................................................................................................. XFMR_Mfr.’s Part Number
Trimmers & Potentiometers ........................................................................................................................ TRIM_Mfr.’s Part Number
Tuners .....................................................................................................................................................TUNER_Mfr.’s Part Number
Varistors .......................................................................................................................................................VAR_Mfr.’s Part Number
Voltage Controlled Oscillators ..................................................................................................................... VCO_Mfr.’s Part Number
Voltage Regulators, Custom...................................................................................................................... VREG_Mfr.’s Part Number

© 2003 - 2007 IPC & PCB Libraries, Inc. 04/05/07

Note: All dimensions are in Metric Units and all numbers go two places past the decimal point

PCB Libraries Naming Convention for Through-Hole Land Patterns

Through Hole Land Patterns
Component, Category Land Pattern Name
Amplifiers......................................................................................................................................................AMP_Mfr.’s Part Number
Batteries ....................................................................................................................................................... BAT_Mfr.’s Part Number
Bridge Rectifiers ..........................................................................................................................................DIOB_Mfr.’s Part Number
Capacitors, Non Polarized Axial ...................................................................... CAPA + Pin Spacing - Body Length X Body Diameter
Capacitors, Non Polarized Radial, Round ............................................. CAPR + Pin Spacing - Body Diameter X Component Height
Capacitors, Non Polarized Radial, Oval ............................. CAPR + Pin Spacing - Body Width X Body Length X Component Height
Capacitors, Polarized Axial............................................................................CAPPA + Pin Spacing - Body Length X Body Diameter
Capacitor, Polarized Radial .................................................................CAPPR + Pin Spacing - Body Diameter X Component Height
Converters ................................................................................................................................................. CONV_Mfr.’s Part Number
Crystals ...................................................................................................................................................... XTAL_Mfr.’s Part Number
Diodes (JEDEC Standard Package)............................................................................................................ DO- JEDEC Part Number
Diodes, Miscellaneous................................................................................................................................... DIO_Mfr.’s Part Number
Dual-In-Line Packages (JEDEC Standard Package)...................................................................... DIP + Pin Qty + Pin Span in MILS
Dual-In-Line Sockets ....................................................................................................................DIPS + Pin Qty + Pin Span in MILS
Ferrite Beads ...................................................................................................................................................FB_Mfr.’s Part Number
Filters............................................................................................................................................................... FIL_Mfr’s Part Number
Fuses.......................................................................................................................................................... FUSE_Mfr.’s Part Number
Fuses, Resettable.................................................................................................................................... FUSER_Mfr.’s Part Number
Headers, .100” Pin Centers ................................................................................ HDR + Number of Rows X Number of pins per Row
Heat Sinks ................................................................................................................................................ HSINK_Mfr.’s Part Number
Inductors........................................................................................................................................................ IND_Mfr.’s Part Number
Jumpers, Wire ..................................................................................................................................JUMP + Distance between Pads
LED’s ............................................................................................................................................................ LED_Mfr.’s Part Number
Liquid Crystal Display ................................................................................................................................... LCD_Mfr.’s Part Number
Microphones .................................................................................................................................................. MIC_Mfr.’s Part Number
Mounting Holes Nonplated ....................................................................................................................................... MTG + Hole Size
Mounting Holes Plated .............................................................................................................................MTG + Hole Size_Pad Size
Mounting Holes Plated with 8 Vias .................................................................................................MTG + Hole Size_Pad Size - VIA
MOV ............................................................................................................................................................ MOV_Mfr.’s Part Number
Opto Isolators ............................................................................................................................................ OPTO_Mfr.’s Part Number
Oscillators.....................................................................................................................................................OSC_Mfr.’s Part Number
PAD ................................................................................................................................................. PAD + Pad Size X Hole Size + H
Photo Detectors.....................................................................................................................................PHODET_Mfr.’s Part Number
Pin Grid Array’s ..............................................................................PGA + Number of Pin Rows X Number of Pin Columns - Pin Qty
Regulators ....................................................................................................................................................REG_Mfr.’s Part Number
Relays ..................................................................................................................................................... RELAY_Mfr.’s Part Number
Resistors, Axial Leads .......................................................................................RES + Pad Spacing - Body Length X Body Diameter
Resistor Networks ..........................................................................................................................................................SIP + Pin Qty
Shield, off the shelf ................................................................................................................................. SHIELD_Mfr.’s Part Number
Shield, Custom .........................................................................................................................SHIELD + Body Length X Body Width
Speakers .....................................................................................................................................................SPKR_Mfr’s Part Number
Stiffners .........................................................................................................................................................STIF_Mfr’s Part Number
Switches .........................................................................................................................................................SW_Mfr.’s Part Number
Test Points, Round ..................................................................................................TP + Pad Size + P + Hole Size + D + Height + H
Test Points, Square ...............................................................................................TPS + Pad Size + P + Hole Size + D + Height + H
Test Points, Top & Bottom Pad Different Size ...................................TP + Top Pad X Bottom Pad + P + Hole Size + D + Height + H
Thermistors..............................................................................................................................................THERM_Mfr.’s Part Number
Transducers (IRDA’s) ................................................................................................................................ XDCR_Mfr.’s Part Number
Transient Voltage Suppressors .................................................................................................................. TVS + Mfr.’s Part Number
Transient Voltage Suppressors, Polarized ...............................................................................................TVSP + Mfr.’s Part Number
Transistor Outlines (JEDEC Standard Package) ................................................................................................ TO- JEDEC Number
Transistor Outlines, Custom .................................................................................................................... TRANS_Mfr.’s Part Number
Transformers ............................................................................................................................................. XFMR_Mfr.’s Part Number
Trimmers & Potentiometers .........................................................................................................................TRIM_Mfr.’s Part Number
Tuners ..................................................................................................................................................... TUNER_Mfr.’s Part Number
Varistors ....................................................................................................................................................... VAR_Mfr.’s Part Number
Voltage Controlled Oscillator ........................................................................................................................VCO_Mfr.’s Part Number
Voltage Regulators (JEDEC Standard Package).................................................................................................TO- JEDEC Number

Note: All dimensions are in Metric Units and all numbers go two places past the decimal point
© 2003 - 2007 IPC & PCB Libraries, Inc. 04/05/07
 PCB Libraries Naming Convention for Connector Land Patterns
Library Name Land Pattern Name
AMP™........................................................................................................................................................... Series Number – Pin Qty
MOLEX™...................................................................................................................................................... Series Number – Pin Qty
SAMTEC™ ................................................................................................................................................... Series Number – Pin Qty
CONNECTORS (Miscellaneous Connector Libraries)
3M™ ........................................................................................................................................................... 3M_Part Number
AGILENT™ ....................................................................................................................................... AGILENT_Part Number
AIRBORNE™.................................................................................................................................AIRBORNE_Part Number
AMPHENOL™ ............................................................................................................................. AMPHENOL_Part Number
AVX™ ....................................................................................................................................................... AVX_Part Number
BERG™ ................................................................................................................................................. BERG_Part Number
BLOCKMASTER ELECTRONICS™ ..................................................................................... BLOCKMASTER_Part Number
CUI-STACK™ ...............................................................................................................................CUI-STACK_Part Number
E.F. JOHNSON™ ...........................................................................................................................JOHNSON_Part Number
FCI ELECTRONICS™ ............................................................................................................................... FCI_Part Number
FUJITSU™........................................................................................................................................ FUJITSU_Part Numner
HIROSE™.......................................................................................................................................... HIROSE_Part Number
ITT CANNON™ ..........................................................................................................................................ITT_Part Number
JALCO™...............................................................................................................................................JALCO_Part Number
JWT™ .......................................................................................................................................................JWT_Part Number
JST™ .........................................................................................................................................................JST_Part Number
KEYSTONE™...............................................................................................................................KEYSTONE_Part Number
KYCON™............................................................................................................................................ KYCON_Part Number
LEMO™ ................................................................................................................................................. LEMO_Part Number
MILL-MAX™ ................................................................................................................................... MILL-MAX_Part Number
NEUTRIK™...................................................................................................................................... NEUTRIK_Part Number
PHOENIX™ ..................................................................................................................................... PHOENIX_Part Number
PULSE™.............................................................................................................................................. PULSE_Part Number
RIA™ ......................................................................................................................................................... RIA_Part Number
SIEMENS™ ..................................................................................................................................... SIEMENS_Part Number
SPEEDTECH™ ......................................................................................................................... SPEEDTECH_Part Number
STEWART™...................................................................................................................................STEWART_Part Number
SULLINS™ ....................................................................................................................................... SULLINS_Part Number
SWITCHCRAFT™ ................................................................................................................. SWITCHCRAFT_Part Number
TYCO™ ................................................................................................................................................. TYCO_Part Number
YAMAICHI™ ................................................................................................................................... YAMAICHI_Part Number

© 2003 - 2007 IPC & PCB Libraries, Inc. 04/05/07

 IPC-7351 Surface Mount Land Patterns Sectional Breakdown

IPC-735* Component Family Breakdown:

IPC-7351 = IEC 61188-5-1, Generic requirements - Attachment (land/joint) considerations – General Description
IPC-7352 = IEC 61188-5-2, Sectional requirements - Attachment (land/joint) considerations – Discrete Components
IPC-7353 = IEC 61188-5-3, Sectional requirements - Attachment (land/joint) considerations – Gull-Wing leads, two sides (SOP)
IPC-7354 = IEC 61188-5-4, Sectional requirements - Attachment (land/joint) considerations – J leads, two sides (SOJ)
IPC-7355 = IEC 61188-5-5, Sectional requirements - Attachment (land/joint) considerations – Gull-Wing leads, four sides (QFP)
IPC-7356 = IEC 61188-5-6, Sectional requirements - Attachment (land/joint) considerations – J leads, four sides (PLCC)
IPC-7357 = IEC 61188-5-7, Sectional requirements - Attachment (land/joint) considerations – Post leads, two sides (DIP)
IPC-7358 = IEC 61188-5-8, Sectional requirements - Attachment (land/joint) considerations – Area Array Components (BGA)
IPC-7359 = NO IEC Document, Sectional requirements - Attachment (land/joint) considerations – No Lead Components (LCC)

IPC-7351 Surface Mount Land Pattern Zero Orientation

1) Chip Capacitors, Resistors and Inductors (RES, CAP and IND) – Pin 1 (Positive) on Left
2) Molded Inductors (INDM), Resistors (RESM), Molded Polarized Capacitors (CAPMP) – Pin 1 (Positive) on Left
3) Precision Wire-wound Inductors – Pin 1 (Positive) on Left
4) MELF Diode – Pin 1 (Cathode) on Left
5) SOD Diodes – Pin 1 (Cathode) on Left
6) Aluminum Electrolytic Capacitors – Pin 1 (Positive) on Left
7) SOT Devices (SOT23, SOT23-5, SOT223, SOT89, SOT143, etc.) – Pin 1 Upper Left
8) TO252 & TO263 (DPAK Type) Devices – Pin 1 Upper Left
9) Small Outline Gullwing ICs (SOIC, SOP, TSOP, SSOP, TSSOP) – Pin 1 Upper Left
10) Ceramic Flat Packs (CFP) – Pin 1 Upper Left
11) Small Outline J Lead ICs (SOJ) – Pin 1 Upper Left
12) Quad Flat Pack ICs (PQFP, SQFP) – Pin 1 Upper Left
13) Ceramic Quad Flat Packs (CQFP) – Pin 1 Upper Left
14) Bumper and Plastic Quad Flat Pack ICs (BQFPC, PQFPC Pin 1 Center) – Pin 1 Top Center
15) Plastic Leaded Chip Carriers (PLCC) – Pin 1 Top Center
16) Leadless Chip Carriers (LCC) – Pin 1 Top Center
17) Leadless Chip Carriers (LCCS Pin 1 on Side) – Pin 1 Upper Left
18) Quad Flat No-Lead ICs (QFN) QFNS & QFNRV, QFNRH – Pin 1 Upper Left
19) Ball Grid Arrays (BGA) – Pin A1 Upper Left

© 2003 - 2007 IPC & PCB Libraries, Inc. 04/05/07