CF260 BGA

Rework Station
Operation Manual
CF260 工作参数：
型号 model 迅维 CF260
适合锡球类型 Solder Type 有铅/无铅 3 g" {%Normal Solder/Lead free
适用元件种类 SMD Micro bga、BGA、CSP、QFP
PCB 高度 Thickness 0.5～4mm
PCB 尺寸 3 R-PCB Size W50×D50～W440×D310mm
上部加热方式及功率 热风 Hot flow /700W
Heating/Consumption(Upper)
下部加热方式及功率 热风 Hot flow /700W
Heating/Consumption(Bottom)
预热方式及功率 Preheat mode power 暗红外 IR 2400w
PCB 定位方式 Positioning PCB 外形或治具 Shape or Tongs
传动方式 Driver 齿轮、齿条 Gear、rack
控制方式 control 温控仪表控制
温度范围 Temperature range 室温 Room temperature ~400 摄氏度
总功率 Max Consumption 3.8KW
电源 Power 110v~220v
机身尺寸 Dimension 720mmL X 620mmW X 410mmH
机体重量 Weight 28KG(volume weight:42kg)

What is 3 independent heating area BGA rework station?

 Upper heating
Area

bottom heating
Area

IR heating Area

CF-260 owns 3 independent heating area，incl. Upper, bottom, ir heating area,

controlled by 。when heating，Upper/Bottom Nozzle will heat the BGA chip and IR heat
the whole PCBA to avoid deform. The ideal IR heating temperature is 80to 110 degrees.

Feature：
1、Fine design Jig，which making hold laptop Motherboard easier.
2、Bottom Nozzle come with 4 adjustable screw that enable PCB held stable

For PCB with many components, the middle pole will take effect

2、Enlarge bottom heating pad. We have the largest one within similar
products.
4、Upper Nozzle was designed with small hole. The holes became larger when
spreading to edge. It makes heat dispersed uniformly on the BGA chip.

5、Air volume button can adjust the temperature. Air volume button come with
5 gear, Max. 5 and Min. 0 风量调节 5 档位最大，0 档位最小。
 Air volume button

Menu
一、Install rework station
二、Control Panel introduction
三、Temperature setup
四、Dismantle chip set demo
五、Recommended temperature setup
六、BGA soldering Q&A
七、Miscellaneous
一、Install rework station
Horizontal bracket installation:

Upper heating gun holder installation：

Caution：
1、 Please make sure space is in calm wind conditon
2、 Install on solid& stable surface. Table should be flat.
3、 Maintain good ventilation in the room
4、 Please ensure the electricity wire can support power of 3.6kw.
Otherwise, it may happen fire with potential risk.
5、 Keep the room clean with less dust

二、Control Panel introduction

Power on：when power on，the rework station will heat using parameter shown in PTN
Power off：Hold power off button 0.5S，rework station shut down
Lighting：Front/back lighting
Fan：Put “0”, rework station will cool down itself for 60s. When put”1”, cooling down
permenant.
Temperature test line：Test the BGA temperature
Air Volume button：Adjust upper heating air volume
三、Temperature setup
Turn on switch, 2s later, ok to solder.
Button introduction：
PTN： Choose temperature profile. Save up to 10 profiles, 0 to 9. PTN shows
current temperature profile
DISP： Push twice, Time led light. SV shows the temperature of Temperature test
line

PC410 panel：

1、Current temp.
2、Target temp.
3、SET temperature。.
4、Choose temperature profile。
5、Turn up 。
6、Turn down。
7、Switch to next option。

Demo

Material Lead Intel South Bridge

Segment 1 2 3 4 5
Upper L1 70 L2 165 L3 185 L4 220 L5 225
heating
Upper r1 3 r2 3 r3 3 r4 3 r5 3
heating
slope
Upper D1 40 D2 40 D3 40 D4 40 D5 40
heating
time
Bottom L1 100 L2 175 L3 195 L4 235 L5 245
heating
Bottom r1 3 r2 3 r3 3 r4 3 r5 3
heating
slope
Bottom D1 40 D2 40 D3 40 D4 40 D5 40
heating
time
IR Heating Target temp. 100 degree(summer), 150 degree(winter)

1) Press PTN,PTN show 4, setting profile 4

2) Press SET to adjust profile 4。r1, heating slope。3.00， 3 degree/sec。Press

PAR，to the next parameter

3) L1，target temperature。Set 165。Then press PAR。

4) D1，keeping time when temperature reach 165 degree，here，set 40

seconds
5) set segment r2, set 3.00, same as r1

6) L2 set 195。Press PAR

7) Set D2 stay 40s at 195 degree then press PAR

8) Set segment r 3 , 3.00 as well then PAR。

9) L3 ,215 degree then press PAR。

10) Set d3 40 at 215 degree then press PAR。

11) Set r4 3.00。

12) Set L4 245 degree then press PAR

13) Set D4 40s then press PAR

14) Set r5 at 3.00 then press PAR。

15) Set L5 at 260。Press PAR

16) Set d5 as 50 at 260 degree Press PAR

16) Set r6 to end to close the heating process

17) Keep HB at 500，Don’t change

Bottom temperature please refer the same

IR heating setup：

PV shows actual temperature，SV show target temperature，

There are 6 pieces heating block in total
Switch off left button，the first one on the left didn’t heat
Switch off left button，the first one on the right didn’t heat
Switch off mid button，all heating block didn’t heat

Left Mid right

四、Dismantle process：
1、 Using Jig to fix PCB， making it stable

Adjust the bottom nozzle to touch the pcba。

To make sure PCBA is flat. No deform

2、 Here we show desolder IBM T60
3、Insert temperature test line to bottom of BGA

4、Power on
5、Press DISP twice，when TIME light，SV shows current temperature
6、 到最后一段的时候，如果发现温度无法达到熔点
Melting point：
Lead ball 200degree, lead free ball 230 degree

When temperature(using test line) reach melting point(through our practice), it

is the time to remove the chip with IC forceps
7、 Special highlight, in normal practice, we don’t use vacuum pen because
most chip now is glue on the bottom or dispensing

Notice:

When soldering chip, please put temperature test line to the corner of chip, while not the
bottom of chip to avoid ball adhesion.
五、CF 260 Useful profiles
slope=3.00 home temperature 18～20 degree
Material Lead ball profile（Intel south bridge）
Segment 1 2 3 4 5
Upper L1 70 L2 165 L3 185 L4 220 L5 225
heating
slope r1 3 r2 3 r3 3 r4 3 r5 3
Time D1 40 D2 40 D3 40 D4 40 D5 40
Bottom L1 100 L2 175 L3 195 L4 235 L5 245
heating
Slope r1 3 r2 3 r3 3 r4 3 r5 3
Time D1 40 D2 40 D3 40 D4 40 D5 40
IR heating 100 in summer, 150 in winter
预热温区 建议值 100（夏季） 150（冬季） 室温对曲线有极大影响，需灵活调节

适用物料 Lead free ball profile（Intel south bridge）

阶段 1 2 3 4 5
上加热温区 L1 165 L2 185 L3 215 L4 235 L5 245
上温区斜率 r1 3 r2 3 r3 3 r4 3 r5 3
上温区时间 D1 40 D2 40 D3 40 D4 40 D5 40
下加热温区 L1 165 L2 195 L3 225 L4 245 L5 260
下温区斜率 r1 3 r2 3 r3 3 r4 3 r5 3
下温区时间 D1 40 D2 40 D3 40 D4 40 D5 40
预热温区 设定目标值为 100 度即可
预热温区 建议值 100（夏季） 150（冬季） 室温对曲线有极大影响，需灵活调节
 下面使用简化的曲线表(simplified table)：

适用物料 Lead free ball profile（Intel south bridge）

阶段 1 2 3 4 5
上加热温区 165 185 215 235 245
下加热温区 165 195 225 245 260
时间 40 40 40 45 45
预热温区 建议值 100（夏季） 150（冬季） 室温对曲线有极大影响，需灵活调节

适用物料 Lead free ball profile（775 CPU socket）

阶段 1 2 3 4 5
上加热温区 165 195 215 245 260
下加热温区 165 195 235 245 270
时间 40 40 40 50 50
预热温区 建议值 100（夏季） 150（冬季） 室温对曲线有极大影响，需灵活调节

适用物料 Lead ball profile（775 CPU socket, 478 socket）

阶段 1 2 3 4 5
上加热温区 100 165 215 235 245
下加热温区 100 195 225 235 260
时间 40 40 50 50 50
预热温区 建议值 100（夏季） 150（冬季） 室温对曲线有极大影响，需灵活调节

适用物料 Lead free ball profile（AMD, ATI chipset）

Lead free ball profile（Nvidia chipset）
阶段 1 2 3 4 5
上加热温区 70 110 165 205 225
下加热温区 110 165 215 260 270
时间 40 70 70 50 50
预热温区 建议值 100（夏季） 150（冬季） 室温对曲线有极大影响，需灵活调节
For ATI\NV chipset，PCB is thin/slim，Please using upper heating temperature low and
bottom temperature high. Upper heating temperature don’t higher than 260 degree
适用物料 Lead free ball profile（Nvidia VGA chipset on laptop）
阶段 1 2 3 4 5
上加热温区 165 195 215 235 245
下加热温区 165 195 215 260 270
时间 40 70 70 50 50
预热温区 建议值 100（夏季） 150（冬季） 室温对曲线有极大影响，需灵活调节

六、BGA soldering Q&A

1、How to find suitable profiles for BGA

BGA soldering/desoldering is impacted by temperature, humidity, wind, PCB thickness,

PCB design. There is no perfect profile works in all situation.
 Suggest to use laptop/desktop north bridge to fine turn profiles. Check the temperature of
segment 4 finished. The ideal melting point for lead free ball is 217 degree and 183 for lead
ball. But, in practice, the ball don’t melt in the temperature. The temperature need to reach
235 for lead free and 200 for lead.
2、If the 4 screw can’t touch motherboard in the same time, how to do?
a. adjust the screw hight to fit with mother board.
b. Use mid pole to hold PCB
c. fine turn the position of pcb
3、How to use air volume button?
We offer 28mm to 46mm 5 pieces nozzle to address different size of chipset. When using
small nozzle, we use less air volume to control the temperature.

1、 Caution on 775 CPU socket solder/desoldering

Desoldering 775 socket，Put temperature test line between PCB and 775 socket，from direction of 必
power supply.
775scoket，Use flux with direct soldering, but remove 775 socket cover
Soldering 775 socket，Make sure the pcb is flat
2、 Flux
Please choose BGA flux and keep good condition. Don’t put under sunlight
3、 Cleaning job in BGA soldering
Stencils are suggested to be cleaned by ultrosonic cleaner. Solder ball was not suggested
to be recycle.
4、 Why chipset explode?
a. Air volume is too high and not uniform.
b. Chipset is wet
We suggest to dry chipset under 165 degree for 10 mins. If can using dry box to dry it at 100
degree for 10hrs, it would be better.
5、How to remove chip with glue？
Under temperature of 230 degree, solder ball melt. Pull the chip with forceps heavily. Don’t
worry!

七、Attantion：
1、Make sure wind blow less than 2M/s
3 、 When use large nozzle, choose large air volume with more distance. Eg.
Using34mmx34mm Nozzle. Keep nozzle 2to 3mm distance to chip
4、Soler 775and 478 CPU socket，suggest to use same size of nozzle as 775 and 478
CPU.

八、 Warranty
One year warranty.