ADM12864H
ADM12864H
AMOTEC
ADM12864H SPECIFICATIONS OF
LCD MODULE
Features
a) 128x64 dots graphic LCD module
b) Low power consumption
c) Built-in controller (S6B0108)
d) +5V power supply
e) 1/64 duty cycle
f) Easy interface with 8-bit MPU
g) LED backlight optional
h) Negative voltage optional
Mechanical Specifications
Temperature Characteristics
Parameter Symbol Rating Unit
Operating temperature Top 0 ~ +50 ℃
Storage temperature Tst -10 ~ +60 ℃
*Wide temperature range is available
(operating/storage temperature as –20~+70/-30~+80℃)
BLOCK DIAGRAM
LCD PANEL
Electro-Optical characteristics
STN TYPE (SUPER TWIS TED NEMATIC ) (TA=25℃, VDD=5.0V±0.25V)
ITEM SYMBOL CONDITION MIN. TYP. MAX. UNIT
θ2 -θ1 70
Viewing Angle Cr = 2.0 - +90 deg.
φ -90
ο
θ=20
Contrast Ratio Cr ο - 5 - -
φ= 0
ο
θ=20
Response Time (rise) tR ο - 200 250 ms
φ= 0
ο
θ=20
Response Time (fall) tF ο - 300 350 ms
φ= 0
CONTRAST ADJUST
DC Electrical Characteristics(S6B0107)
(VDD= 4.5 to 5.5V, VSS=0V,VDD -VEE=8~17V,Ta= -30 to +85℃)
Item Symbol Condition Min. Typ. Max. Unit Note
Operating voltage VDD - 4.5 - 5.5
VIH - 0.7VDD - VDD
Input voltage *1
VIL - VSS - 0.3VDD V
VOH IOH= -0.4mA VDD-0.4 - -
output voltage *2
VOL IOL= 0.4mA - - 0.4
Input leakage current ILKG VIN= VDD ~ VSS -1.0 - +1.0 A *1
fosc Rf=47kΩ±2%
OSC Frequency 315 450 585 kHz
Cf=20pF±5%
On Resistance RONS VDD-VEE=17V
- - 1.5 kΩ
(Vdiv-Ci) Load current±150 A
IDD1 Master mode
- - 1.0 *3
1/128 Duty
Operating current
IDD2 Master mode
- - 0.2 mA *4
1/128 Duty
IEE Master mode
Supply Current - - 0.1 *5
1/128 Duty
Operating fop1 Master mode -
50 600
External Duty kHz
Frequency fop2 Slave mode 0.5 - 1500
Notes
*1. Applies to input terminals FS, DS1, DS2, CR, SHL, MS and PCLK2 and I/O terminals DIO1, DIO2, M ,
and CL2 in the input state.
*2. Applies to output terminals CLK1, CLK2 and FRM and I/O terminals DIO1, DIO2, M , and CL2 in the
output state.
*3. This value is specified about current flowing through V SS.
Internal oscillation circuit: Rf=47k Ω, cf=20pF
Each terminals of DS1, DS2, FS, SHL, and MS is connected to V DD and out is no load.
*4. This value is specified about current flowing through V SS.
Each terminals is DS1, DS2, FS, SHL, PCLK2 and CR is connected to V DD,MS is connected to V SS
and CL2, M, DIO1 is external clock.
*5. This value is specified about current flowing through V EE, Don’t connect to V LCD (V1~V5).
Notes
*1. CL, FRM, M, RSTB, CLK1, CLK2
*2. CS1B, CS2B, CS3, E, R/W, RS, DB0~DB7
*3. DB0~DB7
*4. Except DB0~DB7
*5. DB0~DB7 at high impedance
*6. V0, V1, V3, V3, V4, V5
*7. 1/64 duty , FCLK=250KHZ, Frame Frequency=70HKZ, Output: No Load
*8. VDD-VEE=15.5V
V0L>V2L>= V DD-2/7(VDD-VEE)>V3L= V EE+2/7(V DD-VEE)>V5L
MPU Interface
Characteristic Symbol Min Typ Max Unit
E Cycle tC 1000 - -
E High Level Width tWH 450 - -
E Low Level Width tWL 450 - -
E Rise Time tR - - 25
E Fall Time tF - - 25
Address Set-Up Time tASU 140 - - ns
Address Hold Time tAH 10 - -
Data Set-Up Time tSU 200 - -
Data Delay Time tD - - 320
Data Hold Time (Write) tDHW 10 - -
Data Hold Time (Read) tDHR 20 - -
tC
tW L
E
tW H
tR tF
tA H
R /W tA S U
tA S U
tA H
C S 1 B ,C S 2 B
C S 3 ,R S
tD S U
tD H W
D B 0~D B 7
M P U W r ite tim in g
R /W
tA SU tA H
tA SU tA H
C S 1 B ,C S 2 B
C S 3 ,R S
tD tW H
D B 0~D B 7
M P U R e a d tim in g
1. I/O Buffer
Input buffer controls the status between the enable and disable of chip. Unless the CS1B to CS3 is in active mode,
Input or output of data and instr uction does not execute. Therefore internal state is not change. But RSTB and
ADC can operate regardless CS!B -CS3.
2. Input register
Input register is provided to interface with MPU which is different operating frequency. Input register stores the
data temporarily before writing it into display RAM.
When CS1B to CS3 are in the active mode, R/W and RS select the input register. The data from MPU is written
into input register. Then writing it into display RAM. Data latched for falling of the E signal and write
automatically into the display data RAM by internal operation.
3. Output register
Output register stores the data temporarily from display data RAM when CS1B, CS2B and CS3 are in active
mode and R/W and RS=H, stored data in display data RAM is latched in out put register. When CS1B to CS3 is in
active mode and R/W=H , RS=L, status data (busy check) can read out.
To read the contents of display data RAM, twice access of read instruction is needed. In first access, data in
display data RAM is latched into output register. In second access, MPU can read data which is latched. That is to
read the data in display data RAM, it needs dummy read. But status read is not needed dummy read.
RS R/W Function
L Instruction
L
H Status read (busy check)
L Data write (from input register to display data RAM )
H
H Data read (from display data RAM to output register)
4. Reset
The system can be initialized by setting RSTB terminal at low level when turning power on, receiving instruction
from MPU. When RSTB becomes low, followi ng procedure is occurred.
4.5[V]
VDD
tRS
tR
RSTB 0.7VDD
0.3VDD
5. Busy flag
Busy flag indicates that S6B0108 is operating or no operating. When busy flag is high, S6B0108 is in internal
operating .
When busy flag is low, S6B0108 can accept the data or instruction.
DB7indicates busy flag of the S6B0108.
Busy Flag
7. X Page Register
X page register designates pages of the internal display data RAM.
Count function is not available. An address is set by instruction.
Instruction RS RW DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Function
Reads data (DB[7:0]) from
Read Display
1 1 Read data display data RAM to the
Date
data bus.
Writes data (DB[7:0]) into
the DDRAM. After writing
Write Display
1 0 Write data instruction, Y address is
Date
incriminated by 1
automatically
Reads the internal status
BUSY
0: Ready
1: In operation
ON/ Re- ON/OFF
Status Read 0 1 Busy 0 0 0 0 0
OFF set 0: Display ON
1: Display OFF
RESET
0: Normal
1: Reset
Set Address Sets the Y address at the
0 0 0 1 Y address (0~63)
(Y address) column address counter
Indicates the Display Data
Set Display
0 0 1 1 Display start line (0~63) RAM displayed at the top
Start Line
of the screen.
Set Address Sets the X address at the X
0 0 1 0 1 1 1 Page (0~7)
(X address) address register.
Controls the display ON or
OFF. The internal status
Display On/off 0 0 0 0 1 1 1 1 1 0/1 and the DDRAM data is not
affected.
0: OFF, 1: ON
Y address (AC0~AC5) of the display data RAM is set in the Y address counter.
An address is set by instruction and increased by 1 automatically by read or write operations of display data.
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
0 0 0 1 AC5 AC4 AC3 AC2 AC1 AC0
5. Status Read
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
1 0 BUSY 0 ON/OFF RESET 0 0 0 0
BUSY
When BUSY is 1, the Chip is executing internal operation and no instructions are accepted.
When BUSY is 0, the Chip is ready to accept any instructions.
ON/OFF
When ON/OFF is 1, the display is on.
When ON/OFF is 0, the display is off.
RESET
When RESET is 1, the system is being initialized.
In this condition, no instructions except status read can be accepted.
When RESET is 0, initializing has finished and the system is in the usual operation condition.
(8) The backlight must be operated within the condition of specification. The overload current or too high voltage
will reduce the life time or destroy the backlight.
Handing Precautions
(1) The display panel is made of glass. Do not subject it to a mechanical shock by dropping it or impact.
(2) If the display panel is damaged and the liquid crystal substance leaks out, be sure not to get any in your mouth.
If the substance contacts your skin or clothes, wash it off using soap and water.
(3) Do not apply excessive force to the display surface or the adjoining areas since this may cause the color tone
to vary.
(4) The polarizer covering the display surface of the LCD module is soft and easily scratched. Please handle the
polarizer carefully.
(5) If the display surface becomes contaminated, breathe on the surface and gently wipe it with a soft dry cloth. If it
Installing Precautions
The hole in the printed circuit board is used to fix LCM as shown in the picture below. Attend to the following items
when installing the LCM.
(1) Cover the surface with a transparent protective plate to protect the polarizer and LC cell.
(2) When assembling the LCM into other equipment, the spacer to the bit between the LCM and the fitting plate
should have enough height to avoid causing stress to the module surface, r efer to the individual specifications for
measurements. The measurement tolerance should be 0.1mm.
Storage Precautions
In case of storing for a long period of time for the purpose of replacement use, the following ways are
recommended.
(1) Storage in a polyethylene bag with the opening sealed so as not to enter fresh air outside in it, and with no
desiccant.
(2) Placing in a dark place where neither exposure to direct sunlight nor light is, keeping temperature in the range
from -30°C to 80°C
(3) Storing with no touch on polarizer surface by anything else. (It is recommended to store them as they have
been contained in the inner container at the time of delivery from us.)
Safety
(1) It is recommended to crush damaged or unnecessary LCDs into pieces and wa sh them off with solvents such
as acetone and ethanol, which should later be burned.
(2) If any liquid leaks out of a damaged glass cell and comes in contact with the hands, wash off thoroughly with
soap and water.
Others
Liquid crystals solidify under low temperature (below the storage temperature range) leading to defective orientation or
the generation of air bubbles (black or white). Air bubbles may also be generated if the module is subject to a low
temperature. If the LCD modules have been operating for a long time showing the same display patterns, the
display patterns may remain on the screen as ghost images and a slight contrast irregularity may also appear. A
normal operating status can be regained by suspending use for some time. It should be no ted that this
phenomenon does not adversely affect performance reliability. To minimize the performance degradation of the
LCD modules resulting from destruction caused by static electricity
etc., exercise care to avoid holding the following sections when handling the modules.
- Exposed area of the printed circuit board.
- Terminal electrode sections.