EC 14 603 VLSI Design, April 2017

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SD(TH SEMESTER B.TECH. (ENGINEERING) DEGRDE
HGIVIINATION, APRIL 2OI7
Electronics and Communieation Engineering
EC 14 603_VLSI DESIGN
Time: firree Hours Ma-imum: 100 Marks

Answer any eight questinns.


Each questipn canics 5 marks.
1. (a) Give the principle of constant field scaling and its effect on device characteristics.
(b) Discuss the operation of CMOS ring oscillator. Estimate its frequency.
(c) Explain the problem of charge sharing and how it is overcome.
(d) Discuss the operation of differential sense amplifier.
(e) Explain the operation of ROM using pseudo NMOS logic.
(f) Explain the logic behind carry look ahead adder.
(S) Discuss the process of molecular beam epitaxy.
(h) Outline the various types of photoresists.
(i) Write short notes on multi-level metallization.
0) Explain the layout process using cell hierarchy.
(8x5=40marks)
2. (a) (i) obtain the d.c. transfer characteristics of pseudo NMos inverter. (8 marks)
(ii) Outline the reason for power dissipation andvarious sounces tha! lead to powerdissipation.
(7 marks)
Or
(b) (i) Discuss the various factors that account to robustness of CMOS inverter. (8 marks)
(ii) Explain channel length modulation and body effect. (T marks)
3. (a) (i) Draw and explain the architecture of Carry Select Adder. Outline how it does increase
the speed ofoperation.
(10 marks)
(ii) Explain the structure of 6T SRAM cell. (5 marks)
Or

Turn over
c 2P6g2
&) (i) Expla{n the architecturc of 4 x 4 aray multiplier with neat diagram. (10
marks)
(ii) Draw and explain the structure of 4 : l Multiplexer using transmission gate. (E
marks)
(a) (r) Erplain in detail the Deal - Gnove model of oxidation process. (10 marks)
(ii) Writ€ short notes about ion implantation: (U ;;";;
'Or
(b) Define etching. Explain the principles of wet and ion etching. Differentiate
the key points
between them.

(5 marks)
(a) (i) Explain the steps involved in hrin tub process of CMOS fabrication. (10 marks)
Iii) Discuss the lambda based desrsn nrles.
(5 marks)
Or
(b) (i) Draw the stick diagram of NAITID gate. (6 marks)
(ii) the principle of silicon on insulatorisolation. (10 marks)
T*
[4 x l5 = 60 marks]

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