Achieving Increased Functionality and Efficiency in Vacuum Robots
Achieving Increased Functionality and Efficiency in Vacuum Robots
Achieving Increased Functionality and Efficiency in Vacuum Robots
functionality
and efficiency in
vacuum robots
RJ Hall
Product marketing engineer
Siva Kothamasu
System engineer
Texas Instruments
Introduction
Several critical factors and requirements are more Fast charging is also critical, since cleaning more
or less common to all vacuum robots pertaining to than three rooms will require one or more returns to
power and operation. the base unit for charging, adding nontrivial time to
the overall operation.
Since this is a portable application, battery
efficiency is important. Cleaning performance The final element of the power vs. runtime equation
(agitator, dirt sensors and suction power) and is the effectiveness of the mapping operation and
environmental sensing and mapping requirements return-to-base operation. Consumers expect their
place challenging demands on the battery. As a robots to clean each room with 100% coverage,
result, you must consider all of these subsystems but this is not possible if there are redundant and
and related operational factors in your battery inefficient coverage algorithms.
design. Considerations include factors such as A number of environmental factors impact effective
the size and weight of the battery itself. A larger- cleaning, including the density of furniture and other
sized rechargeable nickel-metal hydride (NiMH) objects present as well as the variety of surface
battery will extend operational time but will also add areas—along with the commensurate smooth
weight and place an additional load on the frame, floor-to-carpet transitions. An excessive density of
wheels and wheel motors. You must balance these objects will cause the vacuum robot to invoke its
factors in order to arrive at an optimal runtime object-avoidance mechanism excessively, while
between charges. a higher carpet-to-floor-area ratio will put greater
A typical battery pack is rated at 3 Ah. When fully strain on the actuator and vacuum motors, thereby
charged, an 18-V battery will provide around two reducing the duration of cleaning time between
hours of cleaning time (three medium-sized rooms) charges. Dirt, spills and other high concentrations
before needing to recharge. Earlier-generation of debris require additional attention above
vacuum robots required up to seven hours to fully the standard cleaning process and associated
charge the battery, while newer units can fully travel paths.
charge in two hours or less. Finally, the avoidance of an operationally fatal event
The number of motors, including their efficiency and like falling down stairs, off of balconies or off of
motor switching, is an important factor as well. A “step-downs,” must be incorporated into to the
typical vacuum robot may contain as many as five vacuum robot design, to ensure that the cleaning
(or more) motors: process is not interrupted or aborted. Also included
• One motor driving each wheel (two total). in the avoidance category are low-height “wedge”
environments within which the vacuum robot
• One driving the vacuum.
could become caught. Further, wet or flooded
• One driving a spinning side brush, if present.
environments could disable the cleaning mechanism
• One driving the agitator assembly. or electrically damage the unit.
As a result, both effective mapping (discussed
below) and efficient motor-control processing are
– SPI
• 3-D ToF/optical sensing. TI products enable processors also integrate security features
ToF-based sensing to go beyond proximity including secure boot and runtime security,
detection to next-generation machine vision. which are useful to enable secure connectivity.
Improving vacuum robot vision via 3-D ToF • Voice recognition. TI Sitara processors
technology enables the robot to accurately offer voice recognition with integrated DSPs.
detect and recognize objects at a distance, as The DSPs offer excellent voice processing
well as being able to map their environment. capabilities to extract clear speech and audio
The establishment of optimal vacuuming amidst noise and other clutter.
paths optimizes both surface coverage and • Efficient power-supply solutions. TI offers a
vacuuming times, while also avoiding collisions, wide variety of power-management integrated
falls and wedge environments. circuit (PMIC) solutions for various devices,
including low-power options (Table 2 lists
TI’s 3-D ToF chipsets enable maximum flexibility
several) for vacuum robot and other mobile and
to customize designs for robot vision and other
portable applications.
applications. TI tools related to 3-D ToF include
an EVM and a highly configurable camera
Device PMIC
development kit (CDK); the latter provides
TPS65910, TPS65217, TPS650250,
AM335x
3-D locations of each pixel for accurate depth TPS65218
and distance maps that aid customization for AM437x,
TPS65218
AM438x
efficient vacuum robot “terrain” coverage. Sitara
AM572x TPS659037x
(AMxxxx)
• Connectivity solutions. TI offers solutions
AM571x TPS659037x, TPS65916
for integrating communication capabilities
AM570x LP8733, LP8732, TPS65916
for its processors. The TI WiLink™ 8 combo
Table 2. Power solutions for Sitara devices.
Important Notice: The products and services of Texas Instruments Incorporated and its subsidiaries described herein are sold subject to TI’s standard
terms and conditions of sale. Customers are advised to obtain the most current and complete information about TI products and services before placing
orders. TI assumes no liability for applications assistance, customer’s applications or product designs, software performance, or infringement of patents.
The publication of information regarding any other company’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Sitara and WiLink are trademarks of Texas Instruments Incorporated. All other trademarks are the property of their respective owners.
Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to,
reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are
developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you
(individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of
this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources.
You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your
applications and that you have full and exclusive responsibility to assure the safety of your applications and compliance of your applications
(and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. You
represent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1)
anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that
might cause harm and take appropriate actions. You agree that prior to using or distributing any applications that include TI products, you
will thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted any
testing other than that specifically described in the published documentation for a particular TI Resource.
You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include
the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO
ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY
RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING TI RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS.
TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY YOU AGAINST ANY CLAIM, INCLUDING BUT NOT
LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF
DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL,
COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR
ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES.
You agree to fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of your non-
compliance with the terms and provisions of this Notice.
This Notice applies to TI Resources. Additional terms apply to the use and purchase of certain types of materials, TI products and services.
These include; without limitation, TI’s standard terms for semiconductor products http://www.ti.com/sc/docs/stdterms.htm), evaluation
modules, and samples (http://www.ti.com/sc/docs/sampterms.htm).
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2018, Texas Instruments Incorporated